ES6U41_12 [ROHM]
2.5V Drive Nch+SBD MOSFET; 2.5V驱动N沟道+ SBD MOSFET![ES6U41_12](http://pdffile.icpdf.com/pdf1/p00174/img/icpdf/ES6U4_974113_icpdf.jpg)
型号: | ES6U41_12 |
厂家: | ![]() |
描述: | 2.5V Drive Nch+SBD MOSFET |
文件: | 总5页 (文件大小:192K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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2.5V Drive Nch+SBD MOSFET
ES6U41
Structure
Dimensions (Unit : mm)
Silicon N-channel MOSFET /
Schottky barrier diode
WEMT6
(6) (5) (4)
Features
1) Nch MOSFET and schottky barrier diode-
are put in WEMT6 package.
2) High-speed switching, Low On-resistance.
3) Low voltage drive (2.5V drive).
4) Built-in Low VF schottky barrier diode.
(1) (2) (3)
Abbreviated symbol : U41
Applications
Switching
Package specifications
Inner circuit
Package
Taping
T2R
(6)
(4)
(5)
Type
Code
Basic ordering unit (pieces)
8000
ES6U41
∗2
(1)Gate
(2)Source
(3)Anode
(4)Cathode
(5)Drain
∗1
(1)
(2)
(3)
Absolute maximum ratings (Ta=25C)
<MOSFET>
∗1 ESD protection diode
∗2 Body diode
(6)Drain
Parameter
Drain-source voltage
Symbol
Limits
30
12
Unit
VDSS
VGSS
ID
V
Gate-source voltage
V
Continuous
Pulsed
1.5
A
Drain current
∗1
∗1
IDP
6.0
A
Source current
(Body diode)
Continuous
Pulsed
IS
0.75
6.0
A
ISP
A
°C
Channel temperature
Power dissipation
Tch
PD
150
0.7
∗2
W / ELEMENT
∗1 Pw≤10μs, Duty cycle≤1%
∗2 Mounted on a ceramic board
<Di>
Parameter
Symbol
VRM
VR
Limits
25
Unit
Repetitive peak reverse voltage
Reverse voltage
V
20
V
0.5
2.0
IF
Forward current
A
∗1
IFSM
Forward current surge peak
Junction temperature
Power dissipation
A
°C
Tj
PD
150
0.5
∗2
W / ELEMENT
∗1 60Hz 1cycle
∗2 Mounted on ceramic board
<MOSFET and Di>
Parameter
Symbol
Limits
0.8
Unit
W / TOTAL
°C
∗
Power dissipation
PD
Range of storage temperature
∗ Mounted on a ceramic board
Tstg
−55 to +150
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2012.02 - Rev.B
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ES6U41
Data Sheet
Electrical characteristics
<MOSFET>
Parameter
Symbol Min. Typ. Max.
Conditions
μA VGS= 12V, VDS=0V
Unit
Gate-source leakage
IGSS
−
−
−
10
−
Drain-source breakdown voltage V(BR) DSS 30
V
μA
V
ID= 1mA, VGS=0V
Zero gate voltage drain current
Gate threshold voltage
IDSS
−
0.5
−
−
−
1.5
−
−
−
−
−
−
−
−
−
−
−
−
1
VDS= 30V, VGS=0V
DS= 10V, ID= 1mA
VGS (th)
1.5
240
250
340
−
−
−
−
−
−
−
−
2.2
−
V
170
180
240
−
80
14
12
7
mΩ ID= 1.5A, VGS= 4.5V
mΩ ID= 1.5A, VGS= 4V
mΩ ID= 1.5A, VGS= 2.5V
Static drain-source on-state
resistance
∗
RDS (on)
∗
Forward transfer admittance
Input capacitance
Output capacitance
Reverse transfer capacitance
Turn-on delay time
Rise time
Yfs
Ciss
S
V
DS= 10V, ID= 1.5A
DS= 10V
pF
pF
pF
ns
ns
ns
ns
nC
nC
nC
V
Coss
Crss
td (on)
VGS=0V
f=1MHz
∗
∗
∗
V
DD 15V
I
D
= 0.75A
t
r
9
V
GS= 4.5V
Turn-off delay time
Fall time
td (off)
15
6
R
R
L
20Ω
= 10Ω
∗
∗
tf
G
Total gate charge
Gate-source charge
Qg
1.6
0.5
0.3
VDD 15V, VGS= 4.5V
ID= 1.5A, RL 10Ω
RG= 10Ω
∗
∗
Qgs
Qgd
Gate-drain charge
−
∗Pulsed
<Body diode characteristics (Source-drain)>
Parameter Symbol Min. Typ. Max.
Forward voltage 1.2
Unit
V
Conditions
V
SD
−
−
IS= 0.75A, VGS=0V
<Di>
Parameter
Symbol Min. Typ. Max.
Conditions
IF= 0.1A
Unit
V
−
−
−
−
−
−
0.36
0.52
100
Forward voltage
Reverse current
V
F
V
IF= 0.5A
I
R
μA
V = 20V
R
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2012.02 - Rev.B
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○ 2012 ROHM Co., Ltd. All rights reserved.
ES6U41
Data Sheet
Electrical characteristics curves
<MOSFET>
2
2
1.5
1
10
1
VGS= 10V
Ta=25°C
Pulsed
VDS= 10V
Pulsed
VGS= 10V
VGS= 2.5V
VGS= 2.2V
VGS= 4.5V
VGS= 4.0V
VGS= 2.5V
1.5
1
VGS= 1.8V
Ta= 125°C
Ta= 75°C
Ta= 25°C
Ta= - 25°C
V
GS= 2.2V
VGS= 1.8V
VGS= 1.7V
VGS= 1.6V
0.1
VGS= 1.7V
VGS= 1.6V
0.5
0
0.5
0
0.01
0.001
Ta=25°C
Pulsed
VGS= 1.5V
8
0
0.2
0.4
0.6
0.8
1
0
2
4
6
10
0.5
1.0
GATE-SOURCE VOLTAGE : VGS[V]
Fig.3 Typical Transfer Characteristics
1.5
2.0
DRAIN-SOURCE VOLTAGE : VDS[V]
DRAIN-SOURCE VOLTAGE : VDS[V]
Fig.1 Typical Output Characteristics(
)
Ⅰ
Fig.2 Typical Output Characteristics( )
Ⅱ
1000
100
10
1000
100
10
1000
100
10
Ta=25°C
Pulsed
VGS= 4.0V
Pulsed
VGS= 4.5V
Pulsed
VGS= 2.5V
VGS= 4.0V
VGS= 4.5V
Ta=125°C
Ta=75°C
Ta=25°C
Ta= -25°C
Ta=125°C
Ta=75°C
Ta=25°C
Ta= -25°C
0.01
0.1
1
10
0.01
0.1
1
10
0.01
0.1
1
10
DRAIN-CURRENT : ID[A]
DRAIN-CURRENT : ID[A]
DRAIN-CURRENT : ID[A]
Fig.6 Static Drain-Source On-State
Resistance vs. Drain Current(
Fig.4 Static Drain-Source On-State
Resistance vs. Drain Current(
Fig.5 Static Drain-Source On-State
)
Ⅲ
)
Ⅰ
Resistance vs. Drain Current( )
Ⅱ
1000
100
10
10
1
10
VDS= 10V
Pulsed
VGS= 2.5V
Pulsed
VGS=0V
Pulsed
Ta=125°C
Ta=75°C
Ta=25°C
Ta=-25°C
1
Ta=125°C
Ta=75°C
Ta=25°C
Ta= -25°C
0.1
Ta= -25°C
Ta=25°C
Ta=75°C
Ta=125°C
0.1
0.01
0.01
0.1
1
10
0.01
0.1
1
10
0.2
0.4
0.6
0.8
1.0
1.2
DRAIN-CURRENT : ID[A]
DRAIN-CURRENT : ID[A]
SOURCE-DRAIN VOLTAGE : VSD [V]
Fig.7 Static Drain-Source On-State
Resistance vs. Drain Current(
Fig.8 Forward Transfer Admittance
vs. Drain Current
Fig.9 Reverse Drain Current
vs. Sourse-Drain Voltage
)
Ⅳ
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2012.02 - Rev.B
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○ 2012 ROHM Co., Ltd. All rights reserved.
ES6U41
Data Sheet
1000
1000
100
10
5
4
3
2
1
0
Ta=25°C
Pulsed
Ta=25°C
DD= 15V
V
800
600
400
200
0
VGS= 4.5V
RG=10Ω
Pulsed
td(off)
ID= 1.50A
ID= 0.75A
tf
Ta=25°C
V
DD= 15V
ID= 1.5A
RG=10Ω
Pulsed
tr
td(on)
1
0
2
4
6
8
10
0.01
0.1
1
10
0
0.5
1
1.5
2
GATE-SOURCE VOLTAGE : VGS[V]
Fig.10 Static Drain-Source On-State
TOTAL GATE CHARGE : Qg [nC]
Fig.12 Dynamic Input Characteristics
DRAIN-CURRENT : ID[A]
Fig.11 Switching Characteristics
Resistance vs. Gate Source Voltage
1000
100
10
Ciss
Crss
Coss
Ta=25°C
f=1MHz
V
GS=0V
1
0.01
0.1
1
10
100
DRAIN-SOURCE VOLTAGE : VDS[V]
Fig.13 Typical Capacitance
vs. Drain-Source Voltage
<Di>
100000
10000
1000
100
1
pulsed
pulsed
Ta = 75
Ta = 25
℃
℃
0.1
0.01
Ta = 75
Ta = 25
℃
℃
10
Ta= - 25
℃
Ta= - 25
℃
1
0.1
0.01
0.001
0
5
10
15
20
25
0
0.1 0.2 0.3 0.4 0.5 0.6
FORWARD VOLTAGE : V [V]
Fig.2 Forward Current vs. Forward Voltage
REVERSE VOLTAGE : V
R[V]
F
Fig.1 Reverse Current vs. Reverse Voltage
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2012.02 - Rev.B
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○ 2012 ROHM Co., Ltd. All rights reserved.
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The content specified herein is for the purpose of introducing ROHM's products (hereinafter
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illustrate the standard usage and operations of the Products. The peripheral conditions must
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However, should you incur any damage arising from any inaccuracy or misprint of such
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