RTL020P02TR [ROHM]

Small Signal Field-Effect Transistor, 2A I(D), 20V, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, TUMT6, 6 PIN;
RTL020P02TR
型号: RTL020P02TR
厂家: ROHM    ROHM
描述:

Small Signal Field-Effect Transistor, 2A I(D), 20V, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, TUMT6, 6 PIN

开关 光电二极管 晶体管
文件: 总5页 (文件大小:91K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
RTL020P02  
Transistors  
DC-DC Converter (20V, 2.0A)  
RTL020P02  
zExternal dimensions (Unit : mm)  
zFeatures  
1) Low on-resistance. (80mat 2.5V)  
2) High power package.  
3) High speed switching.  
4) Low voltage drive. (2.5V)  
TUMT6  
2.0±0.1  
0.85MAX  
+0.1  
0.3  
0.77±0.05  
0.05  
(6)  
(5)  
(4)  
0~0.1  
(1)  
(2)  
(3)  
(1) Drain  
(2) Drain  
(3) Gate  
(4) Source  
(5) Drain  
(6) Drain  
zApplications  
DC-DC converter  
0.65 0.65  
0.17±0.05  
Each lead has same dimensions  
1pin mark  
1.3±0.1  
Abbreviated symbol : WU  
zEquivalent circuit  
zStructure  
Silicon P-channel  
MOS FET  
(6)  
(5)  
(4)  
2
zPackaging specifications  
1
Package  
Taping  
Type  
Code  
TR  
(1) Drain  
(2) Drain  
(3) Gate  
(4) Source  
(5) Drain  
(6) Drain  
Basic ordering unit (pieces)  
3000  
(1)  
(2)  
(3)  
RTL020P02  
1 ESD PROTECTION DIODE  
2 BODY DIODE  
1/4  
RTL020P02  
Transistors  
zAbsolute maximum ratings (Ta=25°C)  
Parameter  
Drain-source voltage  
Gate-source voltage  
Symbol  
VDSS  
VGSS  
ID  
Limits  
Unit  
V
20  
±12  
V
Continuous  
±2  
±8  
A
Drain current  
Pulsed  
1
1
IDP  
A
Source current  
(Body diode)  
Continuous  
IS  
0.8  
A
Pulsed  
ISP  
3.2  
A
2
Total power dissipation  
Channel temperature  
PD  
1
W
°C  
°C  
Tch  
Tstg  
150  
Range of Storage temperature  
55 to +150  
1 Pw10µs, Duty cycle1%  
2 Mounted on a ceramic board  
zElectrical characteristics (Ta=25°C)  
Parameter  
Symbol Min. Typ. Max.  
Conditions  
µA VGS=±12V, VDS=0V  
Unit  
Gate-source leakage  
IGSS  
±10  
Drain-source breakdown voltage V(BR) DSS 20  
V
µA  
V
ID= 1mA, VGS=0V  
Zero gate voltage drain current  
Gate threshold voltage  
IDSS  
1  
2.0  
135  
150  
250  
VDS= 20V, VGS=0V  
DS= 10V, ID= 1mA  
VGS (th) 0.7  
V
100  
110  
180  
mID= 2A, VGS= 4.5V  
mID= 2A, VGS= 4V  
mID= 1A, VGS= 2.5V  
Static drain-source on-state  
resistance  
RDS (on)  
Forward transfer admittance  
Input capacitance  
Output capacitance  
Reverse transfer capacitance  
Turn-on delay time  
Rise time  
Yfs  
Ciss  
1.2  
S
V
V
V
DS= 10V, ID= 1A  
430  
80  
55  
11  
13  
38  
12  
4.9  
1.2  
1.3  
pF  
pF  
pF  
ns  
ns  
ns  
ns  
DS= 10V  
Coss  
Crss  
td (on)  
GS=0V  
f=1MHz  
I
D
= 1A  
DD 15V  
V
V
R
t
r
GS= 4.5V  
=15Ω  
GS=10Ω  
Turn-off delay time  
Fall time  
td (off)  
tf  
L
R
Total gate charge  
Gate-source charge  
Qg  
nC VDD 15V  
nC GS= 4.5V  
nC ID= 2A  
R
L
7.5Ω  
Qgs  
Qgd  
V
RGS=10Ω  
Gate-drain charge  
Pulsed  
Body diode characteristics (source-drain characteristics)  
Forward voltage VSD  
1.2  
V
IS= 0.8A, VGS=0V  
2/4  
RTL020P02  
Transistors  
zElectrical characteristic curves  
10  
1000  
100  
10  
1000  
100  
10  
V
DS= −10V  
VGS  
Pulsed  
= 4.5V  
Ta=25°C  
Pulsed  
Pulsed  
Ta=125°C  
Ta=75°C  
Ta=25°C  
Ta= −25°C  
V
V
V
GS= −2.5V  
GS= −4.0V  
GS= −4.5V  
1
0.1  
Ta=125°C  
Ta=75°C  
Ta=25°C  
Ta= −25°C  
0.01  
0.001  
0.1  
1
10  
0.01  
0.1  
1
10  
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0  
DRAIN CURRENT : ID (A)  
DRAIN CURRENT : ID (A)  
GATE-SOURCE VOLTAGE : VGS (V)  
Fig.3 Static Drain-Source On-State  
Resistance vs. Drain Current  
Fig.2 Static Drain-Source On-State  
Resistance vs. Drain Current  
Fig.1 Typical Transfer Characteristics  
1000  
100  
10  
1000  
100  
10  
10  
VGS  
Pulsed  
=
4V  
VGS  
Pulsed  
=
2.5V  
V
GS=0V  
Pulsed  
Ta=125°C  
Ta=75°C  
Ta=25°C  
Ta= −25°C  
Ta=125°C  
Ta=75°C  
Ta=25°C  
Ta= −25°C  
1
0.1  
Ta=125°C  
Ta=75°C  
Ta=25°C  
Ta= −25°C  
0.01  
0.1  
1
10  
0.1  
1
10  
0.0  
0.5  
1.0  
1.5  
2.0  
DRAIN CURRENT : ID (A)  
DRAIN CURRENT : ID (A)  
SOURCE-DRAIN VOLTAGE : VSD (V)  
Fig.4 Static Drain-Source On-State  
Resistance vs. Drain Current  
Fig.5 Static Drain-Source On-State  
Resistance vs. Drain Current  
Fig.6 Reverse Drain Current vs.  
Source-Drain Voltage  
8
10000  
10000  
Ta=25°C  
Ta=25°C  
f=1MHz  
Ta=25°C  
V
V
DD= −15V  
GS= −4.5A  
V
DD= −15V  
ID= −2A  
G=10Ω  
Pulsed  
7
6
5
4
3
2
1
0
V
GS=0V  
RG=10Ω  
R
1000  
100  
10  
Pulsed  
1000  
100  
10  
t
f
Ciss  
t
d (off)  
t
d (on)  
C
oss  
rss  
C
t
r
1
0.01  
0.1  
1
10  
100  
0.01  
0.1  
1
10  
0
1
2
3
4
5
6
DRAIN-SOURCE VOLTAGE : VDS (V)  
DRAIN CURRENT : ID (A)  
TOTAL GATE CHARGE : Qg (nC)  
Fig.7 Typical Capacitance  
vs. Drain-Source Voltage  
Fig.8 Switching Characteristics  
Fig.9 Dynamic Input Characteristics  
3/4  
RTL020P02  
Transistors  
zMeasurement circuits  
Pulse Width  
V
GS  
ID  
VGS  
10%  
50%  
V
DS  
50%  
90%  
RL  
10%  
90%  
10%  
90%  
D.U.T.  
RG  
V
DD  
V
DS td(on)  
td(off)  
t
r
tf  
t
on  
toff  
Fig.11 Switching Waveforms  
Fig.10 Switching Time Measurement Circuit  
V
G
V
GS  
ID  
V
DS  
Qg  
RL  
V
GS  
I
G(Const)  
D.U.T.  
Qgs  
Qgd  
RG  
V
DD  
Charge  
Fig.12 Gate Charge Measurement Circuit  
Fig.13 Gate Charge Waveforms  
4/4  
Appendix  
Notes  
No technical content pages of this document may be reproduced in any form or transmitted by any  
means without prior permission of ROHM CO.,LTD.  
The contents described herein are subject to change without notice. The specifications for the  
product described in this document are for reference only. Upon actual use, therefore, please request  
that specifications to be separately delivered.  
Application circuit diagrams and circuit constants contained herein are shown as examples of standard  
use and operation. Please pay careful attention to the peripheral conditions when designing circuits  
and deciding upon circuit constants in the set.  
Any data, including, but not limited to application circuit diagrams information, described herein  
are intended only as illustrations of such devices and not as the specifications for such devices. ROHM  
CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any  
third party's intellectual property rights or other proprietary rights, and further, assumes no liability of  
whatsoever nature in the event of any such infringement, or arising from or connected with or related  
to the use of such devices.  
Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or  
otherwise dispose of the same, no express or implied right or license to practice or commercially  
exploit any intellectual property rights or other proprietary rights owned or controlled by  
ROHM CO., LTD. is granted to any such buyer.  
Products listed in this document use silicon as a basic material.  
Products listed in this document are no antiradiation design.  
The products listed in this document are designed to be used with ordinary electronic equipment or devices  
(such as audio visual equipment, office-automation equipment, communications devices, electrical  
appliances and electronic toys).  
Should you intend to use these products with equipment or devices which require an extremely high level of  
reliability and the malfunction of with would directly endanger human life (such as medical instruments,  
transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers and other  
safety devices), please be sure to consult with our sales representative in advance.  
About Export Control Order in Japan  
Products described herein are the objects of controlled goods in Annex 1 (Item 16) of Export Trade Control  
Order in Japan.  
In case of export from Japan, please confirm if it applies to "objective" criteria or an "informed" (by MITI clause)  
on the basis of "catch all controls for Non-Proliferation of Weapons of Mass Destruction.  
Appendix1-Rev1.0  

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