SP8J5 [ROHM]

4V Drive Pch+Pch MOS FET; 4V驱动P沟道+ P沟道MOS FET
SP8J5
型号: SP8J5
厂家: ROHM    ROHM
描述:

4V Drive Pch+Pch MOS FET
4V驱动P沟道+ P沟道MOS FET

驱动
文件: 总5页 (文件大小:110K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SP8J5  
Transistors  
4V Drive Pch+Pch MOS FET  
SP8J5  
zStructure  
zExternal dimensions (Unit : mm)  
Silicon P-channel MOS FET  
SOP8  
5.0  
1.75  
0.4  
)
( )  
5
(
8
zFeatures  
1) Low On-resistance. (25mat 4.5V)  
2) High Power Package. (PD=2.0W)  
3) High speed switching.  
( )  
1
( )  
4
4) Low voltage drive. (4V)  
0.2  
1.27  
1pin mark  
Each lead has same dimensions  
zApplications  
Power switching, DC-DC converter  
zPackaging specifications  
zInner circuit  
(8)  
(7)  
(6)  
(5)  
Package  
Taping  
Type  
Code  
TB  
Basic ordering unit (pieces)  
2500  
SP8J5  
2  
2  
(1) Tr1 Source  
(2) Tr1 Gate  
(3) Tr2 Source  
(4) Tr2 Gate  
(5) Tr2 Drain  
(6) Tr2 Drain  
(7) Tr1 Drain  
(8) Tr1 Drain  
1  
1  
(1)  
(2)  
(3)  
(4)  
1 ESD PROTECTION DIODE  
2 BODY DIODE  
zAbsolute maximum ratings (Ta=25°C)  
<It is the same ratings for Tr1 and Tr2.>  
Parameter  
Drain-source voltage  
Gate-source voltage  
Symbol  
VDSS  
VGSS  
ID  
Limits  
30  
20  
Unit  
V
V
Continuous  
7.0  
A
Drain current  
Pulsed  
1  
IDP  
28  
A
Source current  
(Body diode)  
Continuous  
IS  
1.6  
28  
2.0  
A
1  
2  
Pulsed  
ISP  
A
Total power dissipation  
Channel temperature  
PD  
W
°C  
°C  
Tch  
Tstg  
150  
Range of Storage temperature  
1 Pw10µs, Duty cycle1%  
2 Mounted on a ceramic board  
55 to +150  
zThermal resistance  
Parameter  
Symbol  
Rth(ch-a) ∗  
Limits  
62.5  
Unit  
Channel to ambient  
Mounted on a ceramic board.  
°C / W  
Rev.A  
1/4  
SP8J5  
Transistors  
zElectrical characteristics (Ta=25°C)  
<It is the same characteristics for Tr1 and Tr2.>  
Parameter  
Symbol Min. Typ. Max.  
Conditions  
µA VGS= 20V, VDS=0V  
ID= −1mA, VGS=0V  
µA VDS= −30V, VGS=0V  
VDS= −10V, ID= −1mA  
mID= −7A, VGS= −10V  
mID= −3.5A, VGS= −4.5V  
mID= −3.5A, VGS= −4.0V  
Unit  
Gate-source leakage  
IGSS  
10  
Drain-source breakdown voltage V(BR) DSS 30  
Zero gate voltage drain current  
V
IDSS  
20  
25  
30  
2600  
450  
350  
20  
50  
110  
70  
25  
5.5  
10  
1  
2.5  
28  
35  
42  
Gate threshold voltage  
VGS (th) 1.0  
V
Static drain-source on-state  
resistance  
RDS (on)  
Forward transfer admittance  
Input capacitance  
Output capacitance  
Reverse transfer capacitance  
Turn-on delay time  
Rise time  
Yfs  
Ciss  
6.0  
S
VDS= −10V, ID= −3.5A  
VDS= −10V  
VGS=0V  
pF  
pF  
pF  
ns  
ns  
ns  
ns  
Coss  
Crss  
td (on)  
f=1MHz  
I
V
V
R
R
D
= −3.5A  
DD 15  
V
t
r
GS= −10V  
Turn-off delay time  
Fall time  
td (off)  
tf  
L
=4.3Ω  
=10Ω  
G
Total gate charge  
Gate-source charge  
Qg  
nC VDD 15V  
nC VGS= −5V  
nC ID= −7A  
Qgs  
Qgd  
Gate-drain charge  
Pulsed  
zBody diode characteristics (Source-drain) (Ta=25°C)  
<It is the same characteristics for Tr1 and Tr2.>  
Parameter  
Forward voltage  
Symbol Min. Typ. Max.  
1.2  
Conditions  
IS= −1.6A, VGS=0V  
Unit  
V
V
SD  
Rev.A  
2/4  
SP8J5  
Transistors  
zElectrical characteristic curves  
10  
1000  
100  
10  
100  
10  
1
VDS= −10V  
Ta=25°C  
Pulsed  
VGS= −10V  
Pulsed  
Pulsed  
1
0.1  
Ta=125°C  
Ta=75°C  
Ta=25°C  
Ta= −25°C  
VGS= −4V  
VGS= −4.5V  
VGS= −10V  
Ta=125°C  
Ta=75°C  
Ta=25°C  
Ta= −25°C  
0.01  
0.001  
1
1.0  
1.5  
2.0  
2.5  
3.0  
0.1  
1
10  
0.1  
1
10  
GATE-SOURCE VOLTAGE : VGS (V)  
Fig.1 Typical Transfer Characteristics  
DRAIN CURRENT : ID (A)  
DRAIN CURRENT : ID (A)  
Fig.2 Static Drain-Source On-State  
Resistance vs. Drain Current  
Fig.3 Static Drain-Source On-State  
Resistance vs. Drain Current  
1000  
100  
10  
1000  
10  
VGS  
Pulsed  
=
4.5V  
VGS  
Pulsed  
=
4V  
VGS=0V  
Pulsed  
Ta=125°C  
Ta=75°C  
Ta=25°C  
Ta= −25°C  
1
Ta=125°C  
Ta=75°C  
Ta=25°C  
Ta= −25°C  
Ta=125°C  
Ta=75°C  
Ta=25°C  
Ta= −25°C  
100  
0.1  
10  
0.1  
0.01  
0.1  
1
10  
1
10  
0.0  
0.5  
1.0  
1.5  
DRAIN CURRENT : ID (A)  
DRAIN CURRENT : ID (A)  
SOURCE-DRAIN VOLTAGE : VSD (V)  
Fig.4 Static Drain-Source On-State  
vs. Drain Current  
Fig.5 Static Drain-Source On-State  
vs. Drain Current  
Fig.6 Reverse Drain Current  
Source-Drain Current  
10000  
8
7
6
5
4
3
2
1
10000  
Ta=25°C  
VDD= −15V  
VGS= −10V  
RG=10Ω  
Ta=25°C  
VDD= −15V  
ID= −7A  
RG=10Ω  
Pulsed  
Ta=25°C  
f=1MHz  
VGS=0V  
1000  
100  
10  
Pulsed  
t
f
Ciss  
t
d (off)  
1000  
t
r
t
d (on)  
C
oss  
Crss  
1
0
0
100  
0.01  
0.01  
0.1  
1
10  
5
10  
15  
20  
25  
30  
0.1  
1
10  
100  
DRAIN CURRENT : ID (A)  
TOTAL GATE CHARGE : Qg (nC)  
DRAIN-SOURCE VOLTAGE : VDS (V)  
Fig.8 Switching Characteristics  
Fig.9 Dynamic Input Characteristics  
Fig.7 Typical Capacitance  
vs. Drain-Source Voltage  
Rev.A  
3/4  
SP8J5  
Transistors  
zMeasurement circuits  
V
GS  
ID  
VGS  
10%  
V
DS  
90%  
RL  
D.U.T.  
90%  
10%  
90%  
10%  
RG  
V
DD  
V
DS td(on)  
td(off)  
t
r
tr  
t
on  
toff  
Fig.10 Switching Time Test Circuit  
Fig.11 Switching Time Waveforms  
V
G
V
GS  
ID  
V
DS  
Q
g
RL  
V
GS  
I
G(Const.)  
D.U.T.  
Q
gs  
Qgd  
RG  
V
DD  
Charge  
Fig.12 Gate Charge Test Circuit  
Fig.13 Gate Charge Waveform  
Rev.A  
4/4  
Appendix  
Notes  
No technical content pages of this document may be reproduced in any form or transmitted by any  
means without prior permission of ROHM CO.,LTD.  
The contents described herein are subject to change without notice. The specifications for the  
product described in this document are for reference only. Upon actual use, therefore, please request  
that specifications to be separately delivered.  
Application circuit diagrams and circuit constants contained herein are shown as examples of standard  
use and operation. Please pay careful attention to the peripheral conditions when designing circuits  
and deciding upon circuit constants in the set.  
Any data, including, but not limited to application circuit diagrams information, described herein  
are intended only as illustrations of such devices and not as the specifications for such devices. ROHM  
CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any  
third party's intellectual property rights or other proprietary rights, and further, assumes no liability of  
whatsoever nature in the event of any such infringement, or arising from or connected with or related  
to the use of such devices.  
Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or  
otherwise dispose of the same, no express or implied right or license to practice or commercially  
exploit any intellectual property rights or other proprietary rights owned or controlled by  
ROHM CO., LTD. is granted to any such buyer.  
Products listed in this document are no antiradiation design.  
The products listed in this document are designed to be used with ordinary electronic equipment or devices  
(such as audio visual equipment, office-automation equipment, communications devices, electrical  
appliances and electronic toys).  
Should you intend to use these products with equipment or devices which require an extremely high level of  
reliability and the malfunction of with would directly endanger human life (such as medical instruments,  
transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers and other  
safety devices), please be sure to consult with our sales representative in advance.  
About Export Control Order in Japan  
Products described herein are the objects of controlled goods in Annex 1 (Item 16) of Export Trade Control  
Order in Japan.  
In case of export from Japan, please confirm if it applies to "objective" criteria or an "informed" (by MITI clause)  
on the basis of "catch all controls for Non-Proliferation of Weapons of Mass Destruction.  
Appendix1-Rev1.1  

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