SP8J5 [ROHM]
4V Drive Pch+Pch MOS FET; 4V驱动P沟道+ P沟道MOS FET![SP8J5](http://pdffile.icpdf.com/pdf1/p00100/img/icpdf/SP8J5_535708_icpdf.jpg)
型号: | SP8J5 |
厂家: | ![]() |
描述: | 4V Drive Pch+Pch MOS FET |
文件: | 总5页 (文件大小:110K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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SP8J5
Transistors
4V Drive Pch+Pch MOS FET
SP8J5
zStructure
zExternal dimensions (Unit : mm)
Silicon P-channel MOS FET
SOP8
5.0
1.75
0.4
)
( )
5
(
8
zFeatures
1) Low On-resistance. (25mΩ at 4.5V)
2) High Power Package. (PD=2.0W)
3) High speed switching.
( )
1
( )
4
4) Low voltage drive. (4V)
0.2
1.27
1pin mark
Each lead has same dimensions
zApplications
Power switching, DC-DC converter
zPackaging specifications
zInner circuit
(8)
(7)
(6)
(5)
Package
Taping
Type
Code
TB
Basic ordering unit (pieces)
2500
SP8J5
∗2
∗2
(1) Tr1 Source
(2) Tr1 Gate
(3) Tr2 Source
(4) Tr2 Gate
(5) Tr2 Drain
(6) Tr2 Drain
(7) Tr1 Drain
(8) Tr1 Drain
∗1
∗1
(1)
(2)
(3)
(4)
∗1 ESD PROTECTION DIODE
∗2 BODY DIODE
zAbsolute maximum ratings (Ta=25°C)
<It is the same ratings for Tr1 and Tr2.>
Parameter
Drain-source voltage
Gate-source voltage
Symbol
VDSS
VGSS
ID
Limits
−30
20
Unit
V
V
Continuous
7.0
A
Drain current
Pulsed
∗1
IDP
28
A
Source current
(Body diode)
Continuous
IS
−1.6
−28
2.0
A
∗1
∗2
Pulsed
ISP
A
Total power dissipation
Channel temperature
PD
W
°C
°C
Tch
Tstg
150
Range of Storage temperature
∗1 Pw≤10µs, Duty cycle≤1%
∗2 Mounted on a ceramic board
−55 to +150
zThermal resistance
Parameter
Symbol
Rth(ch-a) ∗
Limits
62.5
Unit
Channel to ambient
∗ Mounted on a ceramic board.
°C / W
Rev.A
1/4
SP8J5
Transistors
zElectrical characteristics (Ta=25°C)
<It is the same characteristics for Tr1 and Tr2.>
Parameter
Symbol Min. Typ. Max.
Conditions
µA VGS= 20V, VDS=0V
ID= −1mA, VGS=0V
µA VDS= −30V, VGS=0V
VDS= −10V, ID= −1mA
mΩ ID= −7A, VGS= −10V
mΩ ID= −3.5A, VGS= −4.5V
mΩ ID= −3.5A, VGS= −4.0V
Unit
Gate-source leakage
IGSS
−
−
−
10
−
Drain-source breakdown voltage V(BR) DSS −30
Zero gate voltage drain current
V
IDSS
−
−
−
20
25
30
−
2600
450
350
20
50
110
70
25
5.5
10
−1
−2.5
28
35
42
−
−
−
−
−
−
−
−
−
−
−
Gate threshold voltage
VGS (th) −1.0
V
−
−
−
∗
Static drain-source on-state
resistance
RDS (on)
∗
Forward transfer admittance
Input capacitance
Output capacitance
Reverse transfer capacitance
Turn-on delay time
Rise time
Yfs
Ciss
6.0
S
VDS= −10V, ID= −3.5A
VDS= −10V
VGS=0V
−
−
−
−
−
−
−
−
pF
pF
pF
ns
ns
ns
ns
Coss
Crss
td (on)
f=1MHz
∗
∗
∗
∗
∗
I
V
V
R
R
D
= −3.5A
DD −15
V
t
r
GS= −10V
Turn-off delay time
Fall time
td (off)
tf
L
=4.3Ω
=10Ω
G
Total gate charge
Gate-source charge
Qg
nC VDD −15V
nC VGS= −5V
nC ID= −7A
∗
∗
Qgs
Qgd
−
−
Gate-drain charge
∗Pulsed
zBody diode characteristics (Source-drain) (Ta=25°C)
<It is the same characteristics for Tr1 and Tr2.>
Parameter
Forward voltage
Symbol Min. Typ. Max.
−1.2
Conditions
IS= −1.6A, VGS=0V
Unit
V
V
SD
−
−
Rev.A
2/4
SP8J5
Transistors
zElectrical characteristic curves
10
1000
100
10
100
10
1
VDS= −10V
Ta=25°C
Pulsed
VGS= −10V
Pulsed
Pulsed
1
0.1
Ta=125°C
Ta=75°C
Ta=25°C
Ta= −25°C
VGS= −4V
VGS= −4.5V
VGS= −10V
Ta=125°C
Ta=75°C
Ta=25°C
Ta= −25°C
0.01
0.001
1
1.0
1.5
2.0
2.5
3.0
0.1
1
10
0.1
1
10
GATE-SOURCE VOLTAGE : −VGS (V)
Fig.1 Typical Transfer Characteristics
DRAIN CURRENT : −ID (A)
DRAIN CURRENT : −ID (A)
Fig.2 Static Drain-Source On-State
Resistance vs. Drain Current
Fig.3 Static Drain-Source On-State
Resistance vs. Drain Current
1000
100
10
1000
10
VGS
Pulsed
=
−
4.5V
VGS
Pulsed
=
−
4V
VGS=0V
Pulsed
Ta=125°C
Ta=75°C
Ta=25°C
Ta= −25°C
1
Ta=125°C
Ta=75°C
Ta=25°C
Ta= −25°C
Ta=125°C
Ta=75°C
Ta=25°C
Ta= −25°C
100
0.1
10
0.1
0.01
0.1
1
10
1
10
0.0
0.5
1.0
1.5
DRAIN CURRENT : −ID (A)
DRAIN CURRENT : −ID (A)
SOURCE-DRAIN VOLTAGE : −VSD (V)
Fig.4 Static Drain-Source On-State
vs. Drain Current
Fig.5 Static Drain-Source On-State
vs. Drain Current
Fig.6 Reverse Drain Current
Source-Drain Current
10000
8
7
6
5
4
3
2
1
10000
Ta=25°C
VDD= −15V
VGS= −10V
RG=10Ω
Ta=25°C
VDD= −15V
ID= −7A
RG=10Ω
Pulsed
Ta=25°C
f=1MHz
VGS=0V
1000
100
10
Pulsed
t
f
Ciss
t
d (off)
1000
t
r
t
d (on)
C
oss
Crss
1
0
0
100
0.01
0.01
0.1
1
10
5
10
15
20
25
30
0.1
1
10
100
DRAIN CURRENT : −ID (A)
TOTAL GATE CHARGE : Qg (nC)
DRAIN-SOURCE VOLTAGE : −VDS (V)
Fig.8 Switching Characteristics
Fig.9 Dynamic Input Characteristics
Fig.7 Typical Capacitance
vs. Drain-Source Voltage
Rev.A
3/4
SP8J5
Transistors
zMeasurement circuits
V
GS
ID
VGS
10%
V
DS
90%
RL
D.U.T.
90%
10%
90%
10%
RG
V
DD
V
DS td(on)
td(off)
t
r
tr
t
on
toff
Fig.10 Switching Time Test Circuit
Fig.11 Switching Time Waveforms
V
G
V
GS
ID
V
DS
Q
g
RL
V
GS
I
G(Const.)
D.U.T.
Q
gs
Qgd
RG
V
DD
Charge
Fig.12 Gate Charge Test Circuit
Fig.13 Gate Charge Waveform
Rev.A
4/4
Appendix
Notes
No technical content pages of this document may be reproduced in any form or transmitted by any
means without prior permission of ROHM CO.,LTD.
The contents described herein are subject to change without notice. The specifications for the
product described in this document are for reference only. Upon actual use, therefore, please request
that specifications to be separately delivered.
Application circuit diagrams and circuit constants contained herein are shown as examples of standard
use and operation. Please pay careful attention to the peripheral conditions when designing circuits
and deciding upon circuit constants in the set.
Any data, including, but not limited to application circuit diagrams information, described herein
are intended only as illustrations of such devices and not as the specifications for such devices. ROHM
CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any
third party's intellectual property rights or other proprietary rights, and further, assumes no liability of
whatsoever nature in the event of any such infringement, or arising from or connected with or related
to the use of such devices.
Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or
otherwise dispose of the same, no express or implied right or license to practice or commercially
exploit any intellectual property rights or other proprietary rights owned or controlled by
ROHM CO., LTD. is granted to any such buyer.
Products listed in this document are no antiradiation design.
The products listed in this document are designed to be used with ordinary electronic equipment or devices
(such as audio visual equipment, office-automation equipment, communications devices, electrical
appliances and electronic toys).
Should you intend to use these products with equipment or devices which require an extremely high level of
reliability and the malfunction of with would directly endanger human life (such as medical instruments,
transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers and other
safety devices), please be sure to consult with our sales representative in advance.
About Export Control Order in Japan
Products described herein are the objects of controlled goods in Annex 1 (Item 16) of Export Trade Control
Order in Japan.
In case of export from Japan, please confirm if it applies to "objective" criteria or an "informed" (by MITI clause)
on the basis of "catch all controls for Non-Proliferation of Weapons of Mass Destruction.
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