SMG2339P [SECOS]

P-Channel Enhancement MOSFET; P沟道增强型MOSFET
SMG2339P
型号: SMG2339P
厂家: SECOS HALBLEITERTECHNOLOGIE GMBH    SECOS HALBLEITERTECHNOLOGIE GMBH
描述:

P-Channel Enhancement MOSFET
P沟道增强型MOSFET

文件: 总2页 (文件大小:114K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SMG2339P  
-3.6 A, -30 V, RDS(ON) 0.057  
P-Channel Enhancement MOSFET  
Elektronische Bauelemente  
RoHS Compliant Product  
A suffix of “-C” specifies halogen & lead-free  
SC-59  
DESCRIPTION  
The miniature surface mount MOSFETs utilize a high cell density process  
Low RDS(on) assures minimal power loss and conserves energy, making this  
device ideal for use in power management circuitry.  
Typical applications are lower voltage application, power management in  
portable and battery-powered products such as computers, printers, PCMCIA  
cards, cellular and cordless telephones.  
A
L
3
3
Top View  
C B  
1
1
2
2
K
F
E
FEATURES  
Low RDS(on) provides higher efficiency and extends battery life.  
Fast Switch.  
Low Gate Charge.  
D
H
J
G
Miniature SC-59 surface mount package saves board space.  
Millimeter  
Min. Max.  
Millimeter  
REF.  
REF.  
Min.  
0.10 REF.  
0.40 REF.  
Max.  
A
B
C
D
2.70  
2.25  
1.30  
1.00  
3.10  
3.00  
1.70  
1.40  
G
H
J
PRODUCT SUMMARY  
PRODUCT SUMMARY  
0.10  
0.45  
0.20  
0.55  
K
E
F
1.70  
0.35  
2.30  
0.50  
L
0.85  
1.15  
ID(A)  
-3.6  
-2.8  
VDS(V)  
RDS(on) (  
  
Drain  
0.057@VGS= -4.5V  
0.089@VGS= -2.5V  
-30  
  
Gate  
  
Source  
ABSOLUTE MAXIMUM RATINGS AND THERMAL DATA(TA = 25°C unless otherwise specified)  
PARAMETER  
Drain-Source Voltage  
SYMBOL  
VDS  
RATING  
-30  
UNIT  
V
Gate-Source Voltage  
VGS  
±12  
V
TA=25°C  
TA=70°C  
±3.6  
Continuous Drain Current A  
ID  
A
±2.9  
Pulsed Drain Current B  
Continuous Source Current (Diode Conduction) A  
IDM  
IS  
±10  
A
A
0.4  
TA=25°C  
TA=70°C  
1.25  
Power Dissipation A  
PD  
W
0.8  
Operating Junction and Storage Temperature Range  
TJ, TSTG  
-55 ~ 150  
°C  
THERMAL RESISTANCE DATA  
t5 sec  
RθJA  
100  
150  
Maximum Junction to Ambient A  
°C/W  
Steady-State  
Notes  
a. Surface Mounted on 1” x 1” FR4 Board.  
b. Pulse width limited by maximum junction temperature.  
http://www.SeCoSGmbH.com/  
Any changes of specification will not be informed individually.  
07-Jul-2010 Rev. A  
Page 1 of 2  
SMG2339P  
-3.6 A, -30 V, RDS(ON) 0.057   
P-Channel Enhancement MOSFET  
Elektronische Bauelemente  
ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise specified)  
SYMBO  
PARAMETER  
MIN TYP MAX UNIT TEST CONDITIONS  
Static  
Gate-Threshold Voltage  
Gate-Body Leakage  
VGS(th)  
IGSS  
-0.80  
-
-
±100  
-1  
V
VDS = VGS, ID = -250μA  
-
-
-
nA VDS = 0V, VGS= ±12V  
-
VDS = -24V, VGS= 0V  
μA  
Zero Gate Voltage Drain Current  
On-State Drain Current A  
IDSS  
-
-
-10  
-
VDS = -24V, VGS= 0V, TJ=55°C  
ID(ON)  
-2  
-
-
A
VDS = -5V, VGS= -4.5V  
VGS= -4.5V, ID = -3.6A  
VGS= -2.5V, ID = -2.8A  
VDS= -5V,,ID = -3.6A  
IS= -0.4A, VGS= 0V  
-
57  
89  
-
Drain-Source On-Resistance A  
RDS(ON)  
mΩ  
-
-
2
Forward Transconductance A  
Diode Forward Voltage  
gFS  
-
S
V
VSD  
-
-0.70  
-
Dynamic b  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
Turn-On Delay Time  
Rise Time  
Qg  
Qgs  
-
-
-
-
-
-
-
25  
-
-
-
-
-
-
-
ID= -3.6A  
2.4  
3.9  
nC VDS= -10V  
VGS= -5V  
Qgd  
Td(ON)  
Tr  
7.6  
VDS= -15V  
6.8  
ID= -1A  
nS  
VGEN= -10V  
Turn-Off Delay Time  
Fall Time  
Td(OFF)  
Tf  
33.6  
23.2  
RG= 50Ω  
Notes  
a. Pulse testPW 300 us duty cycle 2%.  
b. Guaranteed by design, not subject to production testing.  
http://www.SeCoSGmbH.com/  
Any changes of specification will not be informed individually.  
07-Jul-2010 Rev. A  
Page 2 of 2  

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