SSG4435 [SECOS]

P-Channel Enhancement Mode Power Mos.FET; P沟道增强模式电源Mos.FET
SSG4435
型号: SSG4435
厂家: SECOS HALBLEITERTECHNOLOGIE GMBH    SECOS HALBLEITERTECHNOLOGIE GMBH
描述:

P-Channel Enhancement Mode Power Mos.FET
P沟道增强模式电源Mos.FET

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中文:  中文翻译
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SSG4435  
-8A, -30V,RDS(ON) 20m  
Ω
Elektronische Bauelemente  
P-Channel Enhancement Mode Power Mos.FET  
RoHS Compliant Product  
SOP-8  
Description  
0.19  
0.25  
0.40  
0.90  
o
The SSG4435 provide the designer with the best Combination of fast switching,  
ruggedized device design, Ultra low on-resistance and cost-effectiveness.  
The SOP-8 is universally preferred for all commercial  
0.375 REF  
6.20  
5.80  
0.25  
3.80  
4.00  
industrial surface mount application and suited for low  
voltage applications such as DC/DC converters.  
1.27Typ.  
0.35  
0.49  
0.100.25  
4.80  
5.00  
1.35  
1.75  
o
8 o  
Features  
Dimensions in millimeters  
* Low on-resistance  
D
D
D
D
D
8
6
5
7
* Simple drive requirement  
* Fast switching Characteristic  
4435SC  
Date Code  
G
2
1
3
4
S
S
S
S
G
Absolute Maximum Ratings  
Parameter  
Drain-Source Voltage  
Symbol  
VDS  
Ratings  
Unit  
V
V
A
-30  
±20  
-8  
Gate-Source Voltage  
VGS  
oC  
Continuous Drain Current  
Continuous Drain Current  
Pulsed Drain Current 1  
ID@TA=25  
oC  
-6  
ID@TA=70  
IDM  
A
A
-50  
Total Power Dissipation  
PD@TA=25o  
C
2.5  
0.02  
W
W/oC  
oC  
Linear Derating Factor  
-55~+150  
Tj, Tstg  
Operating Junction and Storage Temperature Range  
Thermal Data  
Parameter  
Symbol  
Ratings  
Unit  
oC /W  
Rthj-a  
Thermal Resistance Junction-ambient (Max)  
50  
http://www.SeCoSGmbH.com/  
Any changing of specification will not be informed individual  
01-Jun-2002 Rev. A  
Page 1 of 5  
SSG4435  
Ω
-8A, -30V,RDS(ON) 20m  
Elektronische Bauelemente  
P-Channel Enhancement Mode Power Mos.FET  
Electrical Characteristics( Tj=25oC Unless otherwise specified)  
Parameter  
Symbol  
Max.  
Min.  
Typ.  
Unit  
Test Condition  
_
_
V
VGS=0V, ID=-250uA  
-30  
_
BVDSS  
Drain-Source Breakdown Voltage  
Breakdown Voltage Temp. Coefficient  
Gate Threshold Voltage  
oC  
V/oC  
V
_
Reference to 25 ,ID=-1mA  
BVDS/ Tj  
-0.037  
_
VGS(th)  
-1.0  
_
VDS=VGS, ID=-250uA  
-3.0  
_
_
±
±
VGS= 20V  
100  
nA  
uA  
uA  
IGSS  
IDSS  
Gate-Source Leakage Current  
Drain-Source Leakage Current (Tj=25o )  
C
_
VDS=-30V,VGS=0  
VDS=-24V,VGS=0  
-1  
Drain-Source Leakage Current (Tj=70o )  
C
_
_
_
_
_
-5  
20  
VGS=-10V, ID=-8A  
VGS=-4.5V, ID=-5A  
Static Drain-Source On-Resistance2  
mΩ  
RDS(ON)  
_
_
35  
_
Total Gate Charge2  
Qg  
47  
ID=-4.6A  
VDS=-15V  
VGS=-10V  
_
_
_
_
nC  
Gate-Source Charge  
Gate-Drain ("Miller") Charge  
Qgs  
9.5  
8
_
Qgd  
Td(ON)  
Tr  
_
_
Turn-on Delay Time2  
Rise Time  
30  
20  
VDD=-15V  
ID=-1A  
_
_
VGS=-10V  
nS  
_
Ω
RG=6  
Td(Off)  
Turn-off Delay Time  
Fall Time  
120  
80  
Ω
RD=15  
_
_
_
_
_
T
f
_
Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
2800  
1400  
Ciss  
Coss  
Crss  
VGS=0V  
VDS=-15V  
f=1.0MHz  
_
_
pF  
S
350  
_
_
VDS=-10V, ID=-8A  
Gfs  
Forward Transconductance  
20  
Source-Drain Diode  
Typ.  
Parameter  
Symbol  
VDS  
Is  
Max.  
-1.2  
-2.1  
-50  
Min.  
Unit  
Test Condition  
_
Forward On Voltage2  
IS=-2.1A, VGS=0V.  
V
-0.75  
_
_
_
A
A
Continuous Source Current (Body Diode)  
Pulsed Source Current (Body Diode)  
VD=VG=0V, VS=-1.2V  
_
ISM  
Notes: 1.Pulse width limited by safe operating area.  
2.Pulse width 300us, dutycycle 2%.  
http://www.SeCoSGmbH.com/  
Any changing of specification will not be informed individual  
01-Jun-2002 Rev. A  
Page 2 of 5  
SSG4435  
Ω
-8A, -30V,RDS(ON) 20m  
Elektronische Bauelemente  
Characteristics Curve  
P-Channel Enhancement Mode Power Mos.FET  
Fig 1. Typical Output Characteristics  
Fig 2. Typical Output Characteristics  
Fig 3. On-Resistance v.s. Gate Voltage  
Fig 4. Normalized On-Resistance  
v.s. Junction Temperature  
Fig 6. Type Power Dissipation  
Fig 5. Maximum Drain Current  
v.s. Case Temperature  
http://www.SeCoSGmbH.com/  
Any changing of specification will not be informed individual  
01-Jun-2002 Rev. A  
Page 3 of 5  
SSG4435  
Ω
-8A, -30V,RDS(ON) 20m  
Elektronische Bauelemente  
P-Channel Enhancement Mode Power Mos.FET  
Fig 7. Maximum Safe Operating Area Fig 8. Effective Transient Thermal Impedance  
Fig 10. Typical Capacitance Characteristics  
Fig 9. Gate Charge Characteristics  
Fig 11. Forward Characteristics of  
Reverse Diode  
Fig 12. Gate Threshold Voltage v.s.  
Junction Temperature  
http://www.SeCoSGmbH.com/  
Any changing of specification will not be informed individual  
01-Jun-2002 Rev. A  
Page 4 of 5  
SSG4435  
Ω
-8A, -30V,RDS(ON) 20m  
Elektronische Bauelemente  
P-Channel Enhancement Mode Power Mos.FET  
Fig 13. Switching Time Circuit  
Fig 14. Switching Time Waveform  
Fig 15. Gate Charge Circuit  
Fig 16. Gate Charge Waveform  
http://www.SeCoSGmbH.com/  
Any changing of specification will not be informed individual  
01-Jun-2002 Rev. A  
Page 5 of 5  

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