ECLAMP2378P.TCT [SEMTECH]
ESD/EMI Protection for Color LCD Interfaces; ESD / EMI保护彩色液晶显示器接口
| 型号： | ECLAMP2378P.TCT |
| 厂家： | 
SEMTECH CORPORATION |
| 描述： | ESD/EMI Protection for Color LCD Interfaces |
| 文件： | 总8页 (文件大小：218K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
EClamp2378P
ESD/EMI Protection
for Color LCD Interfaces
PROTECTION PRODUCTS - EMIClampTM
Features
Description
The EClampTM2378P is a low pass filter array with
integrated TVS diodes. It is designed to suppress
unwanted EMI/RFI signals and provide electrostatic
discharge (ESD) protection in portable electronic
equipment. This state-of-the-art device utilizes solid-
state silicon-avalanche technology for superior clamp-
ing performance and DC electrical characteristics.
They have been optimized for protection of color
LCD panels in cellular phones and other portable
electronics.
Bidirectional EMI/RFI filter with integrated TVS
for ESD protection
ESD protection to IEC 61000-4-2 (ESD) Level 4,
±15kV (air), ±8kV (contact)
Filter performance: 30dB minimum attenuation
1.8GHz to 2.5GHz
TVS working voltage: 5V
Resistor: 100Ω +/− 15%
Typical Capacitance: 20pF (VR = 0V)
Protection and filtering for eight lines
Solid-state technology
The device consists of eight identical circuits comprised
of TVS diodes for ESD protection, and a resistor -
capacitor network for EMI/RFI filtering. A series
resistor value of 100Ω and a capacitance value of
10pF are used to achieve 30dB minimum attenuation
from 1.8GHz to 2.5GHz. The TVS diodes provide
effective suppression of ESD voltages in excess of
±15kV (air discharge) and ±8kV (contact discharge) per
IEC 61000-4-2, level 4.
Mechanical Characteristics
SLP4016P16 16-pin package
RoHS/WEEE Compliant
Nominal Dimensions: 4.0 x 1.6 x 0.58 mm
Lead Pitch: 0.5mm
Lead finish: NiPd
Marking : Marking Code
Packaging : Tape and Reel per EIA 481
The EClamp2378P is in a 16-pin, RoHS/WEEE compli-
ant, SLP4016P16 package. It measures 4.0 x 1.6 x
0.58mm. The leads are spaced at a pitch of 0.5mm
and are finished with lead-free NiPd. The small pack-
age makes it ideal for use in portable electronics such
as cell phones, digital still cameras, and PDAs.
Applications
Color LCD Protection
Cell Phone CCD Camera Lines
Clamshell Cell Phones
Package Configuration
Circuit Diagram (Each Line)
4.00
1
2
100 Ω
IN
OUT
1.60
10pF 10pF
0.50 BSC
GND
0.58
Device Schematic (8X)
16 Pin SLP package (Bottom Side View)
Nominal Dimensions in mm
www.semtech.com
Revision 12/6/2005
1
EClamp2378P
PROTECTION PRODUCTS
Maximum Ratings
Rating
Symbol
Value
Units
kV
ESD per IEC 61000-4-2 (Air)
ESD per IEC 61000-4-2 (Contact)
+/- 17
+/- 12
VESD
Junction Temperature
Operating Temperature
Storage Temperature
TJ
125
oC
Top
-40 to +85
oC
oC
TSTG
-55 to +150
Electrical Characteristics (T = 25oC)
Parameter
Symbol
VRWM
VBR
Conditions
Minimum
6
Typical
8
Maximum
Units
TVS Reverse Stand-Off Voltage
TVS Reverse Breakdown Voltage
TVS Reverse Leakage Current
Total Series Resistance
5
V
V
It = 1mA
VRWM = 3.0V
Each Line
10
IR
0.5
115
24
µA
R
85
16
100
20
Ohms
pF
Total Capacitance
Cin
Input to Gnd,
Each Line
VR = 0V, f = 1MHz
Total Capacitance
Cin
Input to Gnd,
Each Line
9
11
13
pF
VR = 2.5V, f = 1MHz
www.semtech.com
2005 Semtech Corp.
2
EClamp2378P
PROTECTION PRODUCTS
Typical Characteristics
Typical Insertion Loss S21 (Each Line)
Analog Crosstalk (Each Line)
CH1S21 LOG
6 dB / REF 0 dB
CH1S21 LOG
20 dB /REF 0 dB
1: -9.1473 dB
297.671 MHz
2: -19.559 dB
900 MHz
0 dB
3: -30.645 dB
1.8 GHz
-6 dB
1
-12 dB
-18 dB
4: -34.705 dB
2.5 GHz
2
-24 dB
-30 dB
-36 dB
-42 dB
-48 dB
4
3
1
10
100
1
3
3
.
STOP 000000000 MHz
START. 030MHz
MHz
START 030MHz
MHz
MHz
GHz GHz
3
.
STOP 000 000000MHz
.
ESD Clamping (+8kV Contact)
ESD Clamping (-8kV Contact)
Capacitance vs. Reverse Voltage
(Normalized to 0 volts)
1.1
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
f = 1 MHz
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
Reverse Voltage - VR (V)
www.semtech.com
2005 Semtech Corp.
3
EClamp2378P
PROTECTION PRODUCTS
Applications Information
Device Connection
Figure 1 - Pin Identification and Configuration
(Top Side View)
The EClamp2378P is comprised of eight identical
circuits each consisting of a low pass filter for EMI/RFI
suppression and dual TVS diodes for ESD protection.
The device is in a 16-pin SLP package. Electrical
connection is made to the 16 pins located at the
bottom of the device. A center tab serves as the
ground connection. The device has a flow through
design for easy layout. Pin connections are noted in
Figure 1. All path lengths should be kept as short as
possible to minimize the effects of parasitic inductance
in the board traces. Recommendations for the ground
connection are given below.
1
16
In 1
In 2
In 3
In 4
In 5
In 6
In 7
In 8
Out 1
Out 2
Out 3
Out 4
Out 5
Out 6
Out 7
Out 8
Gnd
8
9
Ground Connection Recommendation
Pin
Identification
Input Lines
Output Lines
Ground
Parasitic inductance present in the board layout will
affect the filtering performance of the device. As
frequency increases, the effect of the inductance
becomes more dominant. This effect is given by
Equation 1.
1 - 8
9 - 16
Center Tab
Equation 1: The Impedance of an Inductor at
Frequency XLF
Figure 2 - Inductance of Rectangular Wire Loops
XLF(L,f ) = 2*π*f *L
Ground
Via 1
Ground
Via 2
Where:
L= Inductance (H)
f = Frequency (Hz)
d
Signal Layer
x
Via connections to the ground plane form rectangular
wire loops or ground loop inductance as shown in
Figure 2. Ground loop inductance can be reduced by
using multiple vias to make the connection to the
ground plane. Bringing the ground plane closer to the
signal layer (preferably the next layer) also reduces
ground loop inductance. Multiple vias in the device
ground pad will result in a lower inductive ground loop
over two exterior vias. Vias with a diameter d are
separated by a distance y run between layers sepa-
rated by a distance x. The inductance of the loop path
is given by Equation 2. Thus, decreasing distance x
and y will reduce the loop inductance and result in
better high frequency filter characteristics.
Ground Layer
Layer
y
Equation 2: Inductance of Rectangular Wire Loop
2*y
−9
2*x
d
LRECT(d,x, y) = 10.16*10 *
x *lnd + y*ln
[
]
Where:
d = Diameter of the wire (in)
x = Length of wire loop (in)
y = Breath of wire loop (in)
www.semtech.com
2005 Semtech Corp.
4
EClamp2378P
PROTECTION PRODUCTS
Applications Information
Figure 3 shows the recommended device layout. The
ground pad vias have a diameter of 0.008 inches
(0.20 mm) while the two external vias have a diameter
of 0.010 inches (0.250mm). The internal vias are
spaced approximately evenly from the center of the
pad. The designer may choose to use more vias with a
smaller diameter (such as 0.005 inches or 0.125mm)
since changing the diameter of the via will result in
little change in inductance (i.e. the log function in
Equation 2 in highly insensitive to parameter d) .
Figure 4 shows a typical insertion loss (S21) plot for
the device using Semtech’s filter evaluation board with
50 Ohm traces and the recommended via configura-
tion. Figure 5 shows a typical insertion loss (S21) plot
using a similar board without the internal ground pad
vias. The result is a more inductive ground loop. Note
the “hump” at a frequency of 2.5GHz. This is the
resonant frequency of the higher ground loop induc-
tance.
Figure 4 - Filter Characteristics Using Recommended
Layout with Internal Vias
CH1 S21 LOG
6 dB / REF 0 dB
1: -9.1473 dB
297.671 MHz
2: -19.559 dB
900 MHz
0 dB
3: -30.645 dB
1.8 GHz
-6 dB
-12 dB
-18 dB
-24 dB
-30 dB
-36 dB
-42 dB
-48 dB
1
4: -34.705 dB
2.5 GHz
2
4
3
1
10
MHz
100
3
1
MHz
START 030 MHz
MHz
GHz
GHz
3
.
STOP 000 000000 MHz
.
Figure 3 - Recommended Layout Using Ground Vias
Figure 5 - Filter Characteristics Using Layout without
Internal Ground Vias
CH1 S21 LOG
6 dB / REF 0 dB
1: -8.9400 dB
288.002 MHz
2: -20.032 dB
900 MHz
3: -23.761 dB
1.8 GHz
0 dB
4: -16.085 dB
2.5 GHz
-6 dB
1
-12 dB
-18 dB
-24 dB
-30 dB
-36 dB
4
2
3
1
10
MHz
100
3
1
MHz
START 030 MHz
MHz
GHz
GHz
3
.
STOP 000 000000 MHz
.
www.semtech.com
2005 Semtech Corp.
5
EClamp2378P
PROTECTION PRODUCTS
Applications Information - Spice Model
Line In
1.4nH
Line Out
1.4nH
Figure 1 - EClamp2378P Spice Model
Table 1 - EClamp2378P Spice Parameters
Parameter
Unit
Amp
Volt
Volt
Ohm
Amp
Farad
sec
--
D1 (TVS)
2E-15
7.42
D2 (TVS)
IS
BV
VJ
2E-15
7.42
0.775
1.00
0.775
1.00
RS
IBV
CJO
TT
1E-3
1E-3
9.8E-12
2.541E-9
0.246
1.1
9.8E-12
2.541E-9
0.246
1.1
M
N
--
EG
eV
1.11
1.11
www.semtech.com
2005 Semtech Corp.
6
EClamp2378P
PROTECTION PRODUCTS
Outline Drawing - SLP4016P16
B
E
A
D
DIMENSIONS
INCHES MILLIMETERS
MIN NOM MAX MIN NOM MAX
DIM
A
.020
0.50
0.58 0.65
.023 .026
PIN 1
INDICATOR
.003
0.05
A1 .000
A2
.002 0.00
.001
(.005)
(0.13)
(LASER MARK)
b
D
.007
.012 0.20 0.25 0.30
.010
.153 .157 .161 3.90 4.00 4.10
D1
E
3.20
3.30
.130 3.10
.122 .126
.059 .063 .067 1.50 1.60 1.70
A
SEATING
PLANE
E1 .010
e
0.40 0.50
.016 .020 0.25
.020 BSC
0.50 BSC
aaa C
A2
L
N
.011 .013 .015 0.28 0.33 0.38
C
16
16
A1
aaa
.003
.004
0.08
0.10
D1
bbb
1
2
LxN
E/2
E1
N
bxN
e
bbb
C A B
D/2
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.
2.
Land Pattern - SLP4016P16
P
X
DIMENSIONS
DIM
INCHES
MILLIMETERS
B
C
F
.130
.060
.018
.035
.020
.012
.025
.085
3.30
1.52
0.45
0.89
0.50
0.30
0.63
2.15
(C)
F
G
Z
G
P
X
Y
Z
Y
B
NOTES:
1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET
www.semtech.com
2005 Semtech Corp.
7
EClamp2378P
PROTECTION PRODUCTS
Marking
Ordering Information
Qty per
Reel
Part Number
Reel Size
EClamp2378P.TCT
3000
7 Inch
PIN 1
INDICATOR
2378P
EMIClamp and EClamp are marks of Semtech Corporation
(LASER MARK)
Tape and Reel Specification
Pin 1 Location
User Direction of feed
Device Orientation in Tape
A0
B0
K0
1.78 +/-0.10 mm
4.30 +/-0.10 mm
0.74 +/-0.10 mm
Tape
K
(MAX)
B, (Max)
Width
D
D1
E
F
P
P0
P2
T(MAX)
W
1.5 + 0.1 mm
- 0.0 mm
(0.59 +.005
- .000)
1.750±.10
mm
(.069±.004)
4.0±0.1
mm
(.157±.00-
4)
4.0±0.1
mm
(.157±.00-
4)
12.0 mm
+ 0.3 mm
- 0.1 mm
1.0 mm
±0.05
(.039)
5.5±0.05
mm
(.217±.002)
2.0±0.05m-
m
(.079±.002)
8.2 mm
12 mm
4.5 mm
(.177)
0.4 mm
(.016)
(.476)
(.472±.012)
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Rd., Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
www.semtech.com
2005 Semtech Corp.
8
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