RCLAMP3324PQTCT [SEMTECH]
Trans Voltage Suppressor Diode,;
| 型号： | RCLAMP3324PQTCT |
| 厂家： | 
SEMTECH CORPORATION |
| 描述： | Trans Voltage Suppressor Diode, 二极管 |
| 文件： | 总8页 (文件大小：763K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
RClamp3324P
Low Capacitance RailClamp®
4-Line Surge and ESD Protection
PROTECTION PRODUCTS
Description
Features
•
Transient Protection to
RailClamp® 3324P provides ESD protection for high-
speed data interfaces. It features a high maximum ESD
withstand voltage of 17kV contact and 20kV air
discharge per IEC 61000-4-2. RClamp3324P is designed
to minimize both the ESD peak clamping and the TLP
clamping. Package inductance is reduced at each pin
resulting in lower peak ESD clamping voltage. The
dynamic resistance is among the industry’s lowest at
0.15 Ohms (typical). Maximum capacitance on each line
to ground is 0.65pF allowing the RClamp3324P to be
used in applications operating in excess of 5GHz without
signal attenuation. Each device will protect up to four
lines (two high-speed pairs).
IEC 61000-4-2 (ESD) 20kV (Air), 17kV (Contact)
IEC 61000-4-4 (EFT) 4kV (5/50ns)
IEC 61000-4-5 (Lightning) 4.5A (8/20µs)
•
•
•
•
•
•
Package design optimized for high speed layout
Protects four high-speed data lines
Working Voltage: 3.3V
Low Capacitance: 0.65 pF maximum (I/O to GND)
Dynamic Resistance: 0.15 Ohms (Typ)
Solid-State Silicon-Avalanche Technology
Mechanical Characteristics
•
•
•
•
•
•
•
SGP2510P8 Package
Pb-Free, Halogen Free, RoHS/WEEE Compliant
Nominal Dimensions: 2.5 x 1.0 x 0.60 mm
Lead Finish: NiPdAu
RClamp3324P is in a 10-pin SGP2510P8 package
measuring 2.5 x 1.0mm with a nominal height of
0.60mm. The leads have a nominal pin-to-pin pitch of
0.50mm. Flow- through package design simplifies PCB
layout and maintains signal integrity on high-speed lines.
Molding Compound Flammability Rating: UL 94V-0
Marking : Marking Code + Date Code
Packaging : Tape and Reel
Applications
•
•
•
•
•
USB 3.0
Industrial Equipment
Digital Visual Interface
LVDS Interfaces
eSATA
The combination of low peak ESD clamping, low
dynamic resistance, and innovative package design
enables this device to provide the highest level of ESD
protection for applications such as USB 3.0, eSATA, and
DisplayPort.
Nominal Dimension
Functional Schematic
2.50
1
2
1.00
0.50 BSC
0.60
Device Schematic
Nominal Dimensions in mm
RClamp3324P
Final Datasheet
Revision date
1 of 8
Semtech
www.semtech.com
Rev 6.1
October 4, 2016
Absolute Maximum Rating
Rating
Symbol
Value
Units
Peak Pulse Current (tp = 8/20µs)
IPP
4.5
A
ESD per IEC 61000-4-2 (Contact)(1)
17
20
VESD
kV
ESD per IEC 61000-4-2 (Air)(1)
Operating Temperature
Storage Temperature
TJ
-40 to +125
-55 to +150
OC
OC
TSTG
Electrical Characteristics (T=25OC unless otherwise specified)
Parameter
Symbol Conditions
Min. Typ.
Max. Units
-40OC to 125OC
Any I/O pin to GND
Reverse Stand-Off Voltage
VRWM
VTRIG
IR
3.3
V
V
tp = 0.2/100ns (TLP)
Any I/O pin to GND
Trigger Voltage
8
T = 25OC
T = 125OC
IPP = 1A, tp = 8/20µs,
0.01
0.05
μA
μA
Reverse Leakage Current
Clamping Voltage(2)
VRWM = 3.3V
0.150
VC
2.5
3.5
3.5
4.5
V
V
Any I/O pin to GND
IPP = 4.5A, tp = 8/20µs,
Any I/O pin to GND
Clamping Voltage(2)
VC
IPP = 4A, tp = 0.2/100ns (TLP)
Any I/O pin to GND
ESD Clamping Voltage(3)
ESD Clamping Voltage(3)
Dynamic Resistance(3), (4)
VC
3.5
V
IPP = 16A, tp = 0.2/100ns (TLP)
Any I/O pin to GND
VC
5.3
V
tp = 0.2/100ns (TLP)
Any I/O pin to GND
RDYN
0.15
0.60
0.30
Ohms
pF
pF
VR = 0V, f = 1MHz
Any I/O pin to GND
0.65
0.40
Junction Capacitance
CJ
VR = 0V, f = 1MHz
Between I/O Pins
Notes:
(1): ESD Gun return path to Ground Reference Plane (GRP)
(2): Measured using an 8/20us constant current source.
(3): Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns.
(4): Dynamic resistance calculated from ITLP = 4A to ITLP = 16A
RClamp3324P
Final Datasheet
Revision Date
2 of 8
Semtech
www.semtech.com
Rev 6.1
October 4, 2016
Typical Characteristics
ESD Clamping (-8kV Contact per IEC 61000-4-2)
ESD Clamping (+8kV Contact per IEC 61000-4-2)
80
20
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth. Corrected
70
60
50
40
30
20
10
0
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground plane.
10
0
-10
-20
-30
-40
-50
-60
-70
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground plane.
-10
-10
0
10
20
30
40
50
60
70
80
90
-10
0
10
20
30
40
50
60
70
80
90
Time (ns)
Time (ns)
TLP Curve (Negative Pulse)
TLP Curve (Positive Pulse)
30
0
Transmission Line Pulse Test
(TLP) Settings:
Transmission Line Pulse Test
(TLP) Settings:
tp = 100ns, tr = 0.2ns,
25
20
15
10
5
tp = 100ns, tr = 0.2ns,
‐5
I
TLP and VTLP averaging
window:
I
TLP and VTLP averaging
window:
t
1 = 70ns to t2 = 90ns
t
1 = 70ns to t2 = 90ns
‐10
‐15
‐20
‐25
‐30
0
‐5
0
2
4
6
8
10
‐6
‐5
‐4
‐3
‐2
‐1
0
DUT Voltage (V)
DUT Voltage (V)
Clamping Voltage vs. Peak Pulse Current (tp=8/20us)
Reverse Leakage Current (IR) vs. Temperature
5.0
8
TA = 25OC
tp = 8x20us
VR = 3.3V
4.5
7
6
5
4
3
2
1
0
Any I/O to GND
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
RC3324P_AR_IR
RC3324P_AR_8_20 Surge
0.0
0
20
40
60
80
100
120
140
0
1
2
3
4
5
6
Temperature (OC)
Peak Pulse Current ‐ IPP (A)
RClamp3324P
Final Datasheet
Revision Date
3 of 8
Semtech
www.semtech.com
Rev 6.1
October 4, 2016
Typical Characteristics (Continued)
Capacitance vs. Reverse Voltage
Capacitance vs. Temperature
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
0.7
f = 1MHz
0.6
0.5
0.4
0.3
0.2
f = 1MHz
VR = 0V
Between any I/O and GND
CJ Line to GND
0.1
CJ Line to Line
RC3324P_AR_CJ
0.0
-75
-50
-25
0
25
50
75
100
125
150
0
0.5
1
1.5
Voltage (V)
2
2.5
3
3.5
Temperature (OC)
Insertion Loss - S21
Analog Crosstalk
0
-10
-20
-30
-40
-50
-60
-70
-80
10
100
1000
Frequency (MHz)
10000
RClamp3324P
Final Datasheet
Revision Date
4 of 8
Semtech
www.semtech.com
Rev 6.1
October 4, 2016
Application Information
USB Interface Protection
RClamp0512TQ is be used to protect D+ and D- lines.
These lines are routed through RClamp0512TQ at pin1
and pin 2. Pin 3 is connected to the ground plane.
RClamp0512TQ is qualified to AEC-Q100. Additional
information may be found on the device data sheet.
For USB 3.0 applications, RClamp3324P is recommended
for protecting the 5Gb/s SuperSpeed line pairs. Fig-
ure 1 below shows an example of protecting a USB 3.0
Type-A interfaces (host side shown). Lines are routed
through each device entering at pins 1, 2, 4, and 5 and
exiting at pins 10, 9, 7, and 6 respectively (Figure 2). Each
trace should run under the device and connect the pins
together. Ground connection is made at the center tabs
(pins 3, and 8 ). Traces should be kept the same length
to avoid impedance mismatch. The differential imped-
ance of each pair can be controlled for USB 3.0 (85 Ohms
+/-15%) while maintaining a minimum trace-to-trace and
trace-to-pad spacing. Individual PCB design constraints
may necessitate different spacing or trace width. Both
ground pads should be connected for optimal perfor-
mance. Ground connection is made using filled via-in-
pad.
Single line devices such as uClamp0571P are recom-
mended for surge and ESD protection of the VBus line.
This device features high surge and ESD capability and
may be used on 5V power rails. In power delivery (PD)
applications, higher working voltage TVS device may be
needed. Options exist for ESD and surge protection up
to 24V.
Device Placement
Placement of the protection component is a critical ele-
ment for effective ESD suppression. TVS diodes should
be placed as close to the connector as possible. This
helps reduce transient coupling to nearby traces.
Ground connections should be made directly to the
ground plane using micro-vias. This reduces parasitic
inductance in the ground path and minimizes the clamp-
ing voltage seen by the protected device.
Figure 1 - USB 3.0 Type-A Protection Example
Figure 2 - Trace Routing
USB 3.0 - Type A
Host Connector
Line 1 In
Line 2 In
Line 1 Out to IC
Line 2 Out to IC
1
SSRX-
RClamp0512TQ
GND
D+
Via to Ground
Landing Pad
Device Outline
Trace
Ground
SSRX+
GND
SSTX-
Line 3 In
Line 4 In
Line 3 Out to IC
Line 4 Out to IC
D-
RClamp3324P
VBus
SSTX+
Trace
Device
Via
Land Pattern
uClamp0571P
RClamp3324P
Final Datasheet
Revision Date
5 of 8
Semtech
www.semtech.com
Rev 6.1
October 4, 2016
Outline Drawing - SGP2510P8
DIMENSIONS
MILLIMETERS
MIN NOM MAX
0.57 0.60 0.63
A
D
B
E
DIM
A
A1 0.00 0.03 0.05
PIN 1
INDICATOR
(LASER MARK)
b
0.15 0.20 0.25
0.40 0.45
b1 0.35
D
E
e
2.45 2.50 2.575
0.95 1.00 1.075
0.50 BSC
0.28 0.33 0.38
8
L
N
aaa
0.08
0.10
A
bbb
SEATING
PLANE
aaa C
C
A1
2xb1
bbb
C
A B
R0.125
1
2
LxN
E/2
(0.025-0.075)
N
2X 0.075
7 Places
bxN
e
bbb
C A B
D/2
NOTES:
1.
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
Land Pattern - SGP2510P8
P
DIMENSIONS
MILLIMETERS
DIM
(0.825)
0.20
0.50
C
G
P
(C)
G
Z
X
X1
Y
0.20
0.40
0.625
1.45
Y
Z
X
X1
NOTES:
1.
2.
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
RClamp3324P
Final Datasheet
Revision Date
6 of 8
Semtech
www.semtech.com
Rev 6.1
October 4, 2016
Marking Code
3324P
YYWW
Notes: Dot indicates pin 1 location
Tape and Reel Specification
Carrier Tape, 4mm Pitch Option
Pin 1 Location (Towards Sprocket Holes)
Carrier Tape, 2mm Pitch Option
Device Orientation in Tape
Ordering Information
Part Number
Qty per Reel Pocket Pitch
Reel Size
RClamp3324P.TCT
3,000
4mm
7”
RClamp3324P.TNT
10,000
2mm
7”
RailClamp and RClamp are registered trademarks of Semtech Corporation
RClamp3324P
Final Datasheet
Revision Date
7 of 8
Semtech
www.semtech.com
Rev 6.1
October 4, 2016
IMPORTANT NOTICE
Information relating to this product and the application or design described herein is believed to be reliable, however such information is provided as a
guide only and Semtech assumes no liability for any errors in this document, or for the application or design described herein. Semtech reserves the right
to make changes to the product or this document at any time without notice. Buyers should obtain the latest relevant information before placing orders
and should verify that such information is current and complete. Semtech warrants performance of its products to the specifications applicable at the time
of sale, and all sales are made in accordance with Semtech’s standard terms and conditions of sale.
SEMTECH PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES
OR SYSTEMS, OR IN NUCLEAR APPLICATIONS IN WHICH THE FAILURE COULD BE REASONABLY EXPECTED TO RESULT IN PERSONAL INJURY, LOSS OF LIFE
OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. INCLUSION OF SEMTECH PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE UNDERTAKEN
SOLELY AT THE CUSTOMER’S OWN RISK. Should a customer purchase or use Semtech products for any such unauthorized application, the customer shall
indemnify and hold Semtech and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs damages and attorney
fees which could arise.
The Semtech name and logo are registered trademarks of the Semtech Corporation. All other trademarks and trade names mentioned may be marks and
names of Semtech or their respective companies. Semtech reserves the right to make changes to, or discontinue any products described in this document
without further notice. Semtech makes no warranty, representation or guarantee, express or implied, regarding the suitability of its products for any
particular purpose. All rights reserved.
© Semtech 2015
Contact Information
Semtech Corporation
200 Flynn Road, Camarillo, CA 93012
Phone: (805) 498-2111, Fax: (805) 498-3804
www.semtech.com
RClamp3324P
Final Datasheet
Revision date
8 of 8
Semtech
6.1
October 4, 2016
相关型号：
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Trans Voltage Suppressor Diode, 75W, 3.3V V(RWM), Unidirectional, 1 Element, Silicon, SLP1710P4T, 6 PIN
SEMTECH
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