UCLAMP1201H [SEMTECH]

μClampTM 1-Line ESD Protection; μClampTM 1线ESD保护


型号：	UCLAMP1201H
厂家：	SEMTECH CORPORATION
描述：	μClampTM 1-Line ESD Protection μClampTM 1线ESD保护
文件：	总7页 (文件大小：163K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

uClamp1201H

µClamp^TM

1-Line ESD Protection

PROTECTION PRODUCTS - MicroClamp^TM

Features

Description

The µClamp^TMseries of TVS arrays are designed to protect

sensitive electronics from damage or latch-up due to ESD.

It is designed to replace multilayer varistors (MLVs) in por-

table applications such as cell phones, notebook comput-

ers, and PDAs. It features large cross-sectional area junc-

tions for conducting high transient currents. It offers

superior electrical characteristics such as lower clamp-

ing voltage and no device degradation when compared

to MLVs. They offer desirable characteristics for board

level protection including fast response time, low oper-

ating and clamping voltage, and no device degradation.

Transient protection for data lines to

IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)

IEC 61000-4-4 (EFT) 40A (tp = 5/50ns)

Cable Discharge Event (CDE)

Ultra-small SOD-523 package (1.7 x 0.9 x 0.7mm)

Protects one I/O or power line

Low clamping voltage

Working voltage: 12V

Low leakage current

Solid-state silicon-avalanche technology

The µClamp^TM1201H is in a 2-pin, RoHS compliant,

SOD-523 package. The leads are finished with lead-

free matte tin. Each device will protect one line oper-

ating at 12 volts. It gives the designer the flexibility to

protect single lines in applications where arrays are not

practical. They may be used to meet the ESD immunity

requirements of IEC 61000-4-2, Level 4 (15kV air, 8kV

contact discharge). The combination of small size and

high ESD surge capability makes them ideal for use in

portable applications such as cellular phones, digital

cameras, and MP3 players.

Mechanical Characteristics

EIAJ SOD-523 package

Molding compound flammability rating: UL 94V-0

Marking: Marking code, cathode band

Packaging: Tape and Reel per EIA 481

Lead Finish: Matte tin

RoHS Compliant

Applications

Cellular Handsets & Accessories

Personal Digital Assistants (PDAs)

Notebooks & Handhelds

Portable Instrumentation

Digital Cameras

Peripherals

MP3 Players

Dimensions

Schematic & PIN Configuration

1.70

1.30

0.35

0.9

0.70

Maximum Dimensions (mm)

SOD-523 (Top View)

www.semtech.com

Revision 03/08/2005

uClamp1201H

PROTECTION PRODUCTS

Absolute Maximum Rating

Rating

Peak Pulse Power (tp = 8/20µs)

Symbol

P_pk

Value

Units

Watts

Amps

200

Maximum Peak Pulse Current (tp = 8/20µs)

I_pp

ESD per IEC 61000-4-2 (Air)

ESD per IEC 61000-4-2 (Contact)

V_PP

+/- 20

+/- 15

Lead Soldering Temperature

Operating Temperature

Storage Temperature

T_L

T_J

260 (10 sec.)

-55 to +125

-55 to +150

°C

T_STG

Electrical Characteristics (T=25^oC)

Parameter

Reverse Stand-Off Voltage

Reverse Breakdown Voltage

Reverse Leakage Current

Forward Voltage

Symbol

V_RWM

V_BR

I_R

Conditions

Minimum

Typical

Maximum

Units

I_t= 1mA

13.3

V_RWM= 12V, T=25°C

I_F= 10mA

µA

V_F

0.8

Clamping Voltage

V_C

I_PP= 1A, t_p= 8/20µs

I_PP= 8A, t_p= 8/20µs

V_R= 0V, f = 1MHz

Clamping Voltage

V_C

Junction Capacitance

C_j

www.semtech.com

2005 Semtech Corp.

uClamp1201H

PROTECTION PRODUCTS

Typical Characteristics

Non-Repetitive Peak Pulse Power vs. Pulse Time

Power Derating Curve

110

100

0.1

0.01

100

125

150

0.1

100

1000

Pulse Duration - tp (us)

Ambient Temperature - T_A(^oC)

Forward Voltage vs. Forward Current

Clamping Voltage vs. Peak Pulse Current

3.5

2.5

1.5

Waveform

Parameters:

tr = 8µs

Parameters:

tr = 8µs

0.5

td = 20µs

Peak Pulse Current - I_PP(A)

Forward Current - I_F(A)

Junction Capacitance vs. Reverse Voltage

ESD Clamping

(8kV Contact per IEC 61000-4-2)

1.1

f = 1 MHz

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

Reverse Voltage - V_R(V)

www.semtech.com

2005 Semtech Corp.

uClamp1201H

PROTECTION PRODUCTS

Applications Information

Device Connection Options

Circuit Diagram

These TVS diodes are designed to protect one data,

I/O, or power supply line. The device is unidirectional

and may be used on lines where the signal polarity is

above ground. The cathode band should be placed

towards the line that is to be protected.

Circuit Board Layout Recommendations for Suppres-

sion of ESD.

Good circuit board layout is critical for the suppression

of ESD induced transients. The following guidelines are

recommended:

Place the TVS near the input terminals or connec-

tors to restrict transient coupling.

Minimize the path length between the TVS and the

protected line.

Minimize all conductive loops including power and

ground loops.

The ESD transient return path to ground should be

kept as short as possible.

Never run critical signals near board edges.

Use ground planes whenever possible.

Matte Tin Lead Finish

Matte tin has become the industry standard lead-free

replacement for SnPb lead finishes. A matte tin finish

is composed of 100% tin solder with large grains.

Since the solder volume on the leads is small com-

pared to the solder paste volume that is placed on the

land pattern of the PCB, the reflow profile will be

determined by the requirements of the solder paste.

Therefore, these devices are compatible with both

lead-free and SnPb assembly techniques. In addition,

unlike other lead-free compositions, matte tin does not

have any added alloys that can cause degradation of

the solder joint.

www.semtech.com

2005 Semtech Corp.

uClamp1201H

PROTECTION PRODUCTS

Applications Information - Spice Model

0.5 nH

Figure 1 - uClamp1201H Spice Model

Table 1 - uClamp1201H Spice Parameters

Parameter

Unit

Amp

Volt

Ohm

Amp

Farad

sec

D1 (TVS)

1.48E-14

15.33

0.723

IBV

CJO

0.772

1.0E-3

52E-12

2.541E-9

0.268

1.1

1.11

www.semtech.com

2005 Semtech Corp.

uClamp1201H

PROTECTION PRODUCTS

Outline Drawing - SOD-523

DIMENSIONS

INCHES

MILLIMETERS

DIM

MIN NOM MAX MIN NOM MAX

.019 .023 .027 0.50 0.60 0.70

.009

.003

.013 0.25

.008 0.10

0.35

0.20

.027 .031 .035 0.70 0.80 0.90

.059 .063 .067

1.70

1.50 1.60

E1 .043 .047 .051 1.10 1.20 1.30

.003 .008 .011 0.10 0.20 0.30

.003 .005

.008

.008 0.10 0.15 0.20

0.20

2X b

aaa

A B

SEATING

PLANE

NOTES:

1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).

DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS

OR GATE BURRS.

Land Pattern - SOD-523

DIMENSIONS

DIM

INCHES

(.057)

.024

MILLIMETERS

(1.45)

0.60

0.45

0.85

2.30

.018

.033

.090

NOTES:

1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY

CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR

COMPANY'S MANUFACTURING GUIDELINES ARE MET.

www.semtech.com

2005 Semtech Corp.

uClamp1201H

PROTECTION PRODUCTS

Marking Code

Ordering Information

Working

Device Qty per Reel

Part Number

Voltage Marking

12V 2H

Note: Devices are lead-free

Reel

Size

uClamp1201H.TCT

3,000 7 Inch

MicroClamp, uClamp and µClamp are marks of Semtech

Corporation

Tape and Reel Specification

Tape Specifications

Device Orientation in Tape

Contact Information

Semtech Corporation

Protection Products Division

200 Flynn Rd., Camarillo, CA 93012

Phone: (805)498-2111 FAX (805)498-3804

www.semtech.com

2005 Semtech Corp.

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