UCLAMP1211Z [SEMTECH]
Ultra Small UClamp 1-Line ESD Protection;
| 型号： | UCLAMP1211Z |
| 厂家： | 
SEMTECH CORPORATION |
| 描述： | Ultra Small UClamp 1-Line ESD Protection |
| 文件： | 总7页 (文件大小：163K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
uClamp1211Z
Ultra Small μClamp®
1-Line ESD Protection
PROTECTION PRODUCTS - Z-PakTM
Features
Description
μClamp® TVS diodes are designed to protect sensitive
electronics from damage or latch-up due to ESD. They
are designed to replace 0201 size multilayer varistors
(MLVs) in portable applications such as cell phones, note-
book computers, and other portable electronics. They
features large cross-sectional area junctions for conduct-
ing high transient currents. These devices offer desir-
able characteristics for board level protection including
fast response time, low operating and clamping voltage,
and no device degradation.
High ESD withstand Voltage: +/-30kV (Contact/Air)
per IEC 61000-4-2
Able to withstand over 1000 ESD strikes per IEC
61000-4-2 Level 4
Ultra-small 0201 package
Protects one data or power line
Low reverse current: <50nA (VR=12V)
Working voltage: +/- 12V
Low capacitance: 25pF maximum
Solid-state silicon-avalanche technology
The μClamp®1211Z is in a 2-pin SLP0603P2X3 pack-
age. It measures 0.6 x 0.3 mm with a nominal height
of only 0.25mm. The leads are finished with lead-free
NiPdAu. Each device will protect one line operating at
12 volts. It gives the designer the flexibility to protect
single lines in applications where arrays are not practi-
cal. The combination of small size and high ESD surge
capability makes them ideal for use in portable applica-
tions such as cellular phones, digital cameras, and
tablet PC’s.
Mechanical Characteristics
SLP0603P2X3 package
Pb-Free, Halogen Free, RoHS/WEEE Compliant
Nominal Dimensions: 0.6 x 0.3 x 0.25 mm
Lead Finish: NiPdAu
Marking : Marking code + dot matrix date code
Packaging : Tape and Reel
Applications
Cellular Handsets & Accessories
Portable Instrumentation
12V Power Protection
Tablet PC
Nominal Dimensions
Schematic
0.62
0.22
0.32
1
0.16
0.355 BSC
2
0.25
SLP0603P2X3 (Bottom View)
Nominal Dimensions (mm)
www.semtech.com
Revision 03/7/2013
1
uClamp1211Z
PROTECTION PRODUCTS
Absolute Maximum Rating
Rating
Symbol
Ppk
Value
Units
Watts
Amps
kV
Peak Pulse Power (tp = 8/20μs)
125
5
Maximum Peak Pulse Current (tp = 8/20μs)
Ipp
ESD per IEC 61000-4-2 (Air)1
VESD
+/- 30
+/- 30
ESD per IEC 61000-4-2 (Contact)1
Operating Temperature
Storage Temperature
TJ
-55 to +125
-55 to +150
°C
°C
TSTG
Electrical Characteristics (T=25oC)
Parameter
Symbol
VRWM
Conditions
Minimum
Typical
Maximum
Units
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Pin 1 to 2 or 2 to 1
12
19
V
V
VBR
It = 1mA
13.3
16
Pin 1 to 2 or 2 to 1
Reverse Leakage Current
Clamping Voltage
IR
VRWM = 12V, T=25°C
Pin 1 to 2 or 2 to 1
<10
50
20
25
nA
V
VC
VC
IPP = 1A, tp = 8/20μs
Pin 1 to 2 or 2 to 1
Clamping Voltage
IPP = 5A, tp = 8/20μs
V
Pin 1 to 2 or 2 to 1
Dynamic Resistance2, 3
Junction Capacitance
Notes
RDYN
Cj
tlp = 0.2 / 100ns
VR = 0V, f = 1MHz
0.30
19
Ohms
pF
25
1)ESD gun return path connected to ESD ground reference plane.
2)Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to
t2 = 90ns.
3) Dynamic resistance calculated from ITLP = 4A to ITLP = 16A
www.semtech.com
© 2013 Semtech Corporation
2
uClamp1211Z
PROTECTION PRODUCTS
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
Clamping Voltage vs. Peak Pulse Current (tp=8/20us)
25
10
TA = 25OC
20
15
10
5
1
0.1
DR040412-125
0
0.01
0
1
2
3
4
5
6
0.1
1
10
100
1000
Peak Pulse Current - Ipp (A)
Pulse Duration - tp (µs)
Junction Capacitance vs. Reverse Voltage
TLP Characteristic
25
20
15
10
5
30
25
20
15
10
5
f = 1 MHz
0
0
0
2
4
6
8
10
12
14
0
5
10
15
20
25
30
Reverse Voltage - VR (V)
TLP Voltage (V)
ESD Clamping (+8kV Contact per IEC 61000-4-2)
ESD Clamping (-8kV Contact per IEC 61000-4-2)
45
40
35
30
25
20
15
0
-5
-10
-15
-20
-25
-30
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth. Corrected for
50 Ohm, 20dB attenuator. ESD gun return
10
-35
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth. Corrected for
50 Ohm, 20dB attenuator. ESD gun return
path connected to ESD ground plane
5
-40
path connected to ESD ground plane
0
-45
-10
0
10
20
30
40
50
60
70
80
-10
0
10
20
30
40
50
60
70
80
Time (ns)
Time (ns)
www.semtech.com
© 2013 Semtech Corporation
3
uClamp1211Z
PROTECTION PRODUCTS
Applications Information
Assembly Guidelines
Stencil Aperture
Mounting Pad
Package
The small size of this device means that some care
must be taken during the mounting process to insure
reliable solder joint. The table below provides
Semtech's recommended assembly guidelines for
mounting this device. The figure at the right details
Semtech’s recommended aperture based on the
below recommendations. Note that these are only
recommendations and should serve only as a starting
point for design since there are many factors that
affect the assembly process. The exact manufactur-
ing parameters will require some experimentation to
get the desired solder application.
0.175
0.250
0.272
0.298
0.270
Assembly Parameter
Recommendation
Solder Stencil Design
Laser cut, Electro-polished
Rectangular with rounded
corners
Recommended Mounting Pattern
Aperture shape
Solder Stencil Thickness
Solder Paste Type
0.100 mm (0.004")
Type 4 size sphere or smaller
Per JEDEC J-STD-020
Non-Solder mask defined
OSP OR NiAu
Solder Reflow Profile
PCB Solder Pad Design
PCB Pad Finish
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© 2013 Semtech Corporation
4
uClamp1211Z
PROTECTION PRODUCTS
Outline Drawing - SLP0603P2X3
B
E
A
D
DIMENSIONS
MILLIMETERS
MIN NOM MAX
0.235 0.25 0.265
0.000 0.02 0.025
DIM
A
A1
b
0.20
0.22 0.24
D
E
0.62
0.32
0.585
0.285
0.655
0.355
e
0.355 BSC
TOP VIEW
L
0.14
0.16 0.18
2
0.08
0.10
N
aaa
bbb
A
SEATING
PLANE
aaa
C
C
A1
e/2
bxN
A
bbb
C
B
2xL
e
BOTTOM VIEW
NOTES:
1.
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
Land Pattern - SLP0603P2X3
DIMENSIONS
DIM MILLIMETERS
(0.425)
0.175
0.270
0.250
0.675
C
G
X
Y
Z
Z
(C)
G
Y
X
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
www.semtech.com
© 2013 Semtech Corporation
5
uClamp1211Z
PROTECTION PRODUCTS
Marking Code
Ordering Information
Qty per
Part Number
Reel
Size
Reel
uClamp1211Z.TNT
Notes:
MicroClamp, uClamp and μClamp are trademarks of Semtech
Corporation
10,000
7 Inch
S
Notes:
Marking will also include dot matrix date code
Carrier Tape Specification
Device Orientation in Tape
A0
B0
K0
0.37 +/-0.03 mm
0.67 +/-0.03 mm
0.32 +/-0.02 mm
Note: All dimensions in mm unless otherwise specified
Date Code Location
(Towards Sprocket Holes)
www.semtech.com
© 2013 Semtech Corporation
6
uClamp1211Z
PROTECTION PRODUCTS
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Rd., Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
www.semtech.com
© 2013 Semtech Corporation
7
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