UCLAMP1201P [SEMTECH]

μClampTM 1-Line ESD protection; μClampTM 1线ESD保护
UCLAMP1201P
型号: UCLAMP1201P
厂家: SEMTECH CORPORATION    SEMTECH CORPORATION
描述:

μClampTM 1-Line ESD protection
μClampTM 1线ESD保护

文件: 总7页 (文件大小:165K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
uClamp1201P  
µClampTM  
1-Line ESD protection  
PROTECTION PRODUCTS - MicroClampTM  
Features  
Description  
The µClampTM series of TVS arrays are designed to pro-  
tect sensitive electronics from damage or latch-up due  
to ESD. It is designed to replace multilayer varistors  
(MLVs) in portable applications such as cell phones, note-  
book computers, and PDAs. It features large cross-sec-  
tional area junctions for conducting high transient cur-  
rents. It offers superior electrical characteristics such  
as lower clamping voltage and no device degradation  
when compared to MLVs. They offer desirable charac-  
teristics for board level protection including fast response  
time, low operating and clamping voltage, and no device  
degradation.  
‹ Transient protection for data lines to  
IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)  
IEC 61000-4-4 (EFT) 40A (tp = 5/50ns)  
Cable Discharge Event (CDE)  
‹ Ultra-small package (1.0 x 0.6 x 0.5mm)  
‹ Protects one I/O or power line  
‹ Low clamping voltage  
‹ Working voltage: 12V  
‹ Low leakage current  
‹ Solid-state silicon-avalanche technology  
Mechanical Characteristics  
‹ SLP1006P2 package  
‹ RoHS/WEEE Compliant  
‹ Nominal Dimensions: 1.0 x 0.6 x 0.50 mm  
‹ Lead Finish: NiPdAu  
‹ Molding compound flammability rating: UL 94V-0  
‹ Marking: Marking code, cathode band  
‹ Packaging: Tape and Reel  
The µClampTM1201P is in a 2-pin, RoHS/WEEE compli-  
ant, SLP1006P2 package. It measures 1.0 x 0.6 x  
0.50mm. The leads are spaced at a pitch of 0.65mm  
and are finished with lead-free NiPdAu. Each device will  
protect one line operating at 12 volts. It gives the  
designer the flexibility to protect single lines in applica-  
tions where arrays are not practical. They may be used  
to meet the ESD immunity requirements of IEC 61000-  
4-2, Level 4 (±15kV air, ±8kV contact discharge). The  
combination of small size and high ESD surge capability Applications  
makes them ideal for use in portable applications such  
as cellular phones, digital cameras, and MP3 players.  
‹ Cellular Handsets & Accessories  
‹ Personal Digital Assistants (PDAs)  
‹ Notebooks & Handhelds  
‹ Portable Instrumentation  
‹ Digital Cameras  
‹ Peripherals  
‹ MP3 Players  
Dimensions  
Schematic & PIN Configuration  
1.0  
0.60  
0.65  
0.50  
Nominal Dimensions (mm)  
SLP1006P2 (Bottom View)  
www.semtech.com  
Revision 07/31/2007  
1
uClamp1201P  
PROTECTION PRODUCTS  
Absolute Maximum Rating  
Rating  
Peak Pulse Power (tp = 8/20µs)  
Symbol  
Ppk  
Value  
Units  
Watts  
Amps  
kV  
200  
8
Maximum Peak Pulse Current (tp = 8/20µs)  
Ipp  
ESD per IEC 61000-4-2 (Air)  
ESD per IEC 61000-4-2 (Contact)  
VPP  
+/- 20  
+/- 15  
Operating Temperature  
Storage Temperature  
TJ  
-55 to +125  
-55 to +150  
°C  
°C  
TSTG  
Electrical Characteristics (T=25oC)  
Parameter  
Reverse Stand-Off Voltage  
Reverse Breakdown Voltage  
Reverse Leakage Current  
Forward Voltage  
Symbol  
VRWM  
VBR  
IR  
Conditions  
Minimum  
Typical  
Maximum  
Units  
12  
17.5  
1
V
V
It = 1mA  
13.3  
15.5  
0.100  
0.8  
VRWM = 12V, T=25°C  
IF = 10mA  
µA  
V
VF  
Clamping Voltage  
VC  
IPP = 1A, tp = 8/20µs  
IPP = 8A, tp = 8/20µs  
VR = 0V, f = 1MHz  
19  
25  
60  
V
Clamping Voltage  
VC  
V
Junction Capacitance  
Cj  
pF  
www.semtech.com  
2007 Semtech Corp.  
2
uClamp1201P  
PROTECTION PRODUCTS  
Typical Characteristics  
Non-Repetitive Peak Pulse Power vs. Pulse Time  
10  
Power Derating Curve  
110  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
1
0.1  
0.01  
0
25  
50  
75  
100  
125  
150  
0.1  
1
10  
100  
1000  
Pulse Duration - tp (us)  
Ambient Temperature - TA (oC)  
Forward Voltage vs. Forward Current  
Clamping Voltage vs. Peak Pulse Current  
25  
20  
15  
10  
5
3
2.5  
2
1.5  
1
Waveform  
Parameters:  
tr = 8µs  
Waveform  
Parameters:  
tr = 8µs  
td = 20µs  
0.5  
0
td = 20µs  
0
0
1
2
3
4
5
6
7
8
9
0
2
4
6
8
10  
12  
14  
Peak Pulse Current - IPP (A)  
Forward Current - IF (A)  
Junction Capacitance vs. Reverse Voltage  
ESD Clamping  
(8kV Contact per IEC 61000-4-2)  
1.1  
f = 1 MHz  
1
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
0
1
2
3
4
5
Reverse Voltage - VR (V)  
Note: Data is taken with a 10x attenuator  
www.semtech.com  
2007 Semtech Corp.  
3
uClamp1201P  
PROTECTION PRODUCTS  
Applications Information  
Device Connection Options  
Circuit Diagram  
These TVS diodes are designed to protect one data,  
I/O, or power supply line. The device is unidirectional  
and may be used on lines where the signal polarity is  
above ground. The cathode band should be placed  
towards the line that is to be protected.  
Circuit Board Layout Recommendations for Suppres-  
sion of ESD.  
Good circuit board layout is critical for the suppression  
of ESD induced transients. The following guidelines are  
recommended:  
z
z
z
z
Place the TVS near the input terminals or connec-  
tors to restrict transient coupling.  
Minimize the path length between the TVS and the  
protected line.  
Minimize all conductive loops including power and  
ground loops.  
The ESD transient return path to ground should be  
kept as short as possible.  
z
z
Never run critical signals near board edges.  
Use ground planes whenever possible.  
www.semtech.com  
2007 Semtech Corp.  
4
uClamp1201P  
PROTECTION PRODUCTS  
Applications Information - Spice Model  
uClamp1201P Spice Model  
uClamp1201P Spice Parameters  
Parameter  
Unit  
Amp  
Volt  
Volt  
Ohm  
Amp  
Farad  
sec  
--  
D1 (TVS)  
1.48E-14  
15.33  
IS  
BV  
VJ  
0.723  
RS  
IBV  
CJO  
TT  
0.772  
1.0E-3  
52E-12  
2.541E-9  
0.268  
M
N
--  
1.1  
EG  
eV  
1.11  
www.semtech.com  
2007 Semtech Corp.  
5
uClamp1201P  
PROTECTION PRODUCTS  
Outline Drawing - SLP1006P2  
B
A
D
DIMENSIONS  
INCHES MILLIMETERS  
E
DIM  
A
MIN NOM MAX MIN NOM MAX  
.016  
.022 0.40 0.50 0.55  
.002 0.00 0.03 0.05  
.022 0.45 0.50 0.55  
.020  
.001  
.020  
A1 .000  
TOP VIEW  
b
D
E
e
.018  
1.00  
0.60  
.035 .039 .043 0.90  
.020 .024 .028 0.50  
1.10  
0.70  
.026 BSC  
0.65 BSC  
L
R
.008 .010 .012 0.20 0.25 0.30  
.002 .004 .006 0.05 0.10 0.15  
A
SEATING  
PLANE  
2
2
N
aaa C  
A1  
aaa  
.003  
.004  
0.08  
0.10  
bbb  
C
PIN 1 ID  
R
bxN  
bbb  
C A B  
2x L  
e
BOTTOM VIEW  
NOTES:  
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).  
Land Pattern - SLP1006P2  
DIMENSIONS  
Y
DIM  
INCHES  
MILLIMETERS  
Z
(.033)  
.012  
.024  
.022  
.055  
(0.85)  
0.30  
0.60  
0.55  
1.40  
(C)  
C
G
X
Y
Z
G
X
NOTES:  
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).  
2.  
THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.  
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR  
COMPANY'S MANUFACTURING GUIDELINES ARE MET.  
www.semtech.com  
2007 Semtech Corp.  
6
uClamp1201P  
PROTECTION PRODUCTS  
Marking Code  
Ordering Information  
Working Qty per Reel  
Part Number  
Voltage  
Reel  
Size  
uClamp1201P.TCT  
12V  
3,000 7 Inch  
Notes:  
1) This is a lead-free, RoHS/WEEE compliant product  
MicroClamp, uClamp and µClamp are marks of Semtech  
Corporation  
2P  
PIN 1 ID  
Tape and Reel Specification  
Cathode Bar  
User Direction of feed  
Device Orientation in Tape  
A0  
B0  
K0  
0.69 +/-0.10 mm  
1.19 +/-0.10 mm  
0.66 +/-0.10 mm  
Tape  
B, (Max)  
Width  
D
D1  
E
F
P
P0  
P2  
T
W
1.5 + 0.1 mm  
1.750±.10  
mm  
(.069±.004)  
4.0±0.10  
mm  
(.157±.00-  
4)  
4.0±0.1  
mm  
(.157±.00-  
4)  
8.0 mm  
+ 0.3 mm  
- 0.1 mm  
0.4 mm  
±0.25  
(.031)  
3.5±0.05  
mm  
(.138±.002)  
2.0±0.05  
mm  
(.079±.002)  
4.2 mm  
8 mm  
- 0.0 mm  
(0.59 +.005  
- .000)  
0.254±0.02  
mm (.016)  
(.165)  
(.312±.012)  
Contact Information  
Semtech Corporation  
Protection Products Division  
200 Flynn Rd., Camarillo, CA 93012  
Phone: (805)498-2111 FAX (805)498-3804  
www.semtech.com  
2007 Semtech Corp.  
7

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