SPM6G140-060D-B [SENSITRON]

Insulated Gate Bipolar Transistor;
SPM6G140-060D-B
型号: SPM6G140-060D-B
厂家: SENSITRON    SENSITRON
描述:

Insulated Gate Bipolar Transistor

文件: 总12页 (文件大小:204K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SENSITRON  
SPM6G140-060D  
SEMICONDUCTOR  
TECHNICAL DATA  
DATASHEET 4977, Rev. B  
Three-Phase IGBT BRIDGE, With Gate Driver and Magnetic  
Isolation  
DESCRIPTION: A 600 VOLT, 140 AMP, THREE PHASE IGBT BRIDGE  
ELECTRICAL CHARACTERISTICS PER IGBT DEVICE  
PARAMETER  
(Tj=250C UNLESS OTHERWISE SPECIFIED)  
SYMBOL  
MIN  
TYP  
MAX  
UNIT  
IGBT SPECIFICATIONS  
Collector to Emitter Breakdown Voltage  
IC = 500uA, VGE = 0V  
BVCES  
600  
-
-
-
V
A
Continuous Collector Current  
TC = 25 OC  
TC = 80 OC  
Zero Gate Voltage Collector Current (For the module)  
CE = 600 V, VGE=0V Ti=25oC  
CE = 480 V, VGE=0V Ti=125oC  
IC  
-
140  
140  
ICES  
-
-
V
2
mA  
mA  
V
15  
Collector to Emitter Saturation Voltage,  
IC = 90A, VGE = 15V,  
Tj = 25 OC  
Tj = 125 OC  
VCE(SAT)  
-
1.5  
1.8  
8.2  
1.8  
V
IGBT Internal Turn On Gate Resistance  
IGBT Internal Turn Off Gate Resistance  
-
-
-
-
-
-
-
-
Ohm  
Ohm  
Ohm  
mJ  
6.2  
100  
1.5  
IGBT Internal Soft Shutdown Turn Off Gate Resistance  
IGBT turn-on switching loss  
V
CE = 300 V, IC = 50A Tj=25oC  
IGBT turn-off switching loss  
-
-
2.1  
5
-
-
mJ  
VCE = 300 V, IC = 50A Tj=25oC  
Short Circuit Withstand Time, Conditions 300V DC link,  
VGE=15V, Tjstart < 150 OC  
usec  
DC Bus Voltage Rate of Rise With 15V Supply Removed,  
dv/dt  
-
-
-
-
20  
V/usec  
oC/W  
Junction To Case Thermal Resistance  
0.22  
RθJC  
MODULE TOTAL WEIGHT  
Total Weight  
-
-
13  
OZ  
©2004 Sensitron Semiconductor 221 West Industry Court Deer Park, NY 11729  
(631) 586 7600 FAX (631) 242 9798 www.sensitron.com sales@sensitron.com Page 1  
SENSITRON  
SPM6G140-060D  
SEMICONDUCTOR  
TECHNICAL DATA  
DATASHEET 4977, Rev. B  
Brake IGBT SPECIFICATIONS  
Continuous Collector Current  
TC = 25 OC  
TC = 90 OC  
IC  
-
-
80  
80  
A
(Limited by Terminals)  
Pulsed Collector Current, 0.5mS  
ICM  
-
-
200  
A
IGBT Internal Gate Resistance  
-
-
-
10  
10  
-
-
-
Ohm  
K Ohm  
IGBT Internal Gate Shunt Resistance  
Junction To Case Thermal Resistance  
0.28  
oC/W  
RθJC  
ULTRAFAST DIODES RATING AND CHARACTERISTICS  
Diode Peak Inverse Voltage  
Continuous Forward Current, TC = 90 OC  
PIV  
IF  
600  
-
-
-
V
A
-
-
-
140  
1.6  
300  
Diode Forward Voltage,  
IF = 90A  
VF  
trr  
1.4  
200  
V
Diode Reverse Recovery Time  
nsec  
(IF=80A, VRR=300V , di/dt = 1500 A/μs)  
Diode switching loss  
-
-
0.3  
-
-
mJ  
VCE = 300 V, IF = 50A Tj=25oC  
Junction To Case Thermal Resistance  
0.35  
oC/W  
RθJC  
MODULE STORAGE AND OPERATING CONDITIONS  
Operating Junction Temperature  
Storage Ambient Temperature  
Operating Case Temperature  
Operating Ambient Temperature  
Operating Altitude  
Tj  
-40  
-55  
-40  
-40  
-
-
150  
150  
85  
oC  
oC  
oC  
oC  
Ft  
TStorage  
Tc  
-
-
-
TA  
105  
-
50000  
Vibration and shock requirements (1)  
©2004 Sensitron Semiconductor 221 West Industry Court Deer Park, NY 11729  
(631) 586 7600 FAX (631) 242 9798 www.sensitron.com sales@sensitron.com Page 2  
SENSITRON  
SPM6G140-060D  
SEMICONDUCTOR  
TECHNICAL DATA  
DATASHEET 4977, Rev. B  
Gate Driver  
Supply Voltage, limits apply to Vcc  
Vcc  
14  
15  
0.3VDD  
0.7VDD  
12.2  
11.8  
12  
16  
V
V
Magnetic -Isolator Logic Low Input Threshold  
ViL  
-
-
Magnetic -Isolator Logic High Input Threshold  
Under Voltage Lockout, positive going threshold Vcc,  
Under Voltage Lockout, negative going threshold Vcc  
Internal Bootstrap Capacitor Value  
ViH  
-
-
V
VCCUV  
VCCUV  
11.8  
12.7  
V
11.3  
12.2  
V
-
-
-
-
-
-
uF  
V
Desaturation Detection, High Input Threshold Voltage  
Desaturation Detection, Low Input Threshold Voltage  
8.0  
7.0  
V
tond  
tr  
toffd  
tf  
-
-
-
-
650  
100  
800  
200  
nsec  
Logic Input to Phase Output Turn On Delay  
Output Turn On Rise Time  
Logic Input to Phase Output Turn Off Delay  
Output Turn Off Fall Time  
800  
150  
1200  
200  
at VCC=600V, IC=50A, TC = 25  
Dead Time Requirement, for Shoot Through Prevention  
Magnetic -Isolator Operating Input Common Mode Voltage  
Magnetic -Isolator Operating Input Common Mode Transient  
750  
1000  
-
nsec  
V
-
-
-
-
1000  
15  
KV/usec  
Module Isolation  
Gnd2 Isolation To Phase Lines, and to Gnd1  
-
2500  
2500  
-
-
-
-
VDC  
VDC  
(Device will be tested at 3000V for 10 seconds), leakage less  
than 10uA  
Pin-To-Case Isolation Voltage, DC Voltage  
(Device will be tested at 3000V for 10 seconds), leakage less  
than 10uA  
4.75  
5
-
5.25  
30  
V
+5V output, power supply  
Referenced to Gnd1  
-
mA  
Maximum load current  
+5V Input, Isolated power supply (2)  
VDD  
4.75  
5
5.25  
V
Referenced to Gnd2  
©2004 Sensitron Semiconductor 221 West Industry Court Deer Park, NY 11729  
(631) 586 7600 FAX (631) 242 9798 www.sensitron.com sales@sensitron.com Page 3  
SENSITRON  
SPM6G140-060D  
SEMICONDUCTOR  
TECHNICAL DATA  
DATASHEET 4977, Rev. B  
Base Plate Temperature (2)  
Base Plate Temperature Sensor Output Gain  
Referenced to Gnd2  
Tco  
-
-
-
6.25  
424  
-
-
-
mV/oC  
Temperature Sensor Output DC Offset, at TC=25oC  
Referenced to Gnd2  
mV  
oC  
Accuracy, at temperature range from - 40 oC to 125oC  
+/-4.0  
DC Bus Current Sensor (Bi-directional Output)  
Shunt Resistor Value  
-
-
0.50  
-
mOhm  
V/A  
Current Amplifier Gain, measured at Pin 22 and  
Referenced to Gnd1 (Non-isolated output)  
0.0023  
0.0026  
0.0030  
10  
Current Amplifier DC Offset (Zero DC Bus Current),  
measured at Pin 22  
-10  
0
mV  
Over-Current Set Point  
75  
85  
120  
A
Isolated PWM fixed frequency output at Pin 17  
100  
130  
180  
KHz  
Isolated PWM output Duty cycle at Pin 17  
-
-
-
-
91%  
9%  
, AT + 82 A  
, AT - 82 A  
Phase A, Phase B, and Phase C Current Sensors (Bi-directional Output) (2)  
Current Amplifier Gain  
+/-  
0.0160  
+/-0.0175  
+/-  
0.0195  
V/A  
V
Referenced to Gnd2  
Output DC Reference at Pins 1, 3, 5  
VDD/2  
- 0.04  
- 0.02  
VDD/2  
VDD/2  
+0.04  
+0.02  
Current Amplifier DC Offset (Zero Phase Current)  
Measured between Pins (1,2), (3,4), (5,6)  
0
V
Offset temperature Drift mV/oC, Ta = -40oC to 125oC  
-0.3  
-
0
+0.3  
-
mV/oC  
A
Maximum Current Measurement Range  
+/-110  
(1) Unit is designed to meet Vibration and Shock requirements, Mil-STD-810F shall be used. (514.5 and 516.5  
methods respectively).  
(2) Phase current sensors and base plate temperature sensor are floating sensors referenced to Gnd2. An isolated  
5V power supply shall be used to power these sensors.  
©2004 Sensitron Semiconductor 221 West Industry Court Deer Park, NY 11729  
(631) 586 7600 FAX (631) 242 9798 www.sensitron.com sales@sensitron.com Page 4  
SENSITRON  
SPM6G140-060D  
SEMICONDUCTOR  
TECHNICAL DATA  
DATASHEET 4977, Rev. B  
Pinout  
Pin  
#
Function  
Pin #  
Function  
1
ICd  
18  
VDD  
DC offset of VDD/2 +/- 0.040V for Differential  
Output Reading of Output at Pin 2  
+5V Input  
2
3
ICo, Phase C Current Sensor output  
19  
20  
Return for all Input/outputs at Pins 1 to 18  
(Signal Ground, Gnd2)  
IBd  
Isolated SD Input  
DC offset of VDD/2 +/- 0.040V for Differential  
Output Reading of Output at Pin 4  
4
5
IBo, Phase B Current Sensor output  
IAd  
21  
Itrip-Ref 1  
DC offset of VDD/2 +/- 0.040V for Differential  
Output Reading of Output at Pin 6  
Adjustable Reference for over-Current Shutdown  
6
7
IAo, Phase A Current Sensor output  
22  
23  
Itrip-Ref 2  
Adjustable Reference for over-Current Shutdown  
+5V Output  
TCo  
Case Temperature Output with a gain of 6.25  
mV/oC  
8
9
Isolated Input for Low-side IGBT of Phase A  
Isolated Input for High-side IGBT of Phase A  
Isolated Input for Low -side IGBT of Phase B  
24  
25  
+15V Rtn (Signal Ground, Gnd1)  
+15V Input  
10  
26,27  
Brake Terminal. Brake Resistor Shall be Connected  
Between These Terminals and +VDC  
11  
Isolated Input for High-side IGBT of Phase B  
28  
Brake IGBT Gate Input  
Brake IGBT Emitter input is internally connected to  
DC Bus return  
12  
13  
14  
15  
16  
17  
Isolated Input for Low-side IGBT of Phase C  
Isolated Input for High-side IGBT of Phase C  
Isolated Flt Clear Input  
29 to 32  
33 to 36  
37 to 39  
40 to 42  
43 to 45  
DC Bus return  
DC Bus “+VDC” input  
Phase C output  
Isolated SD output  
Phase B output  
Isolated Flt output  
Phase A output  
Isolated Idco output  
Case  
Isolated  
©2004 Sensitron Semiconductor 221 West Industry Court Deer Park, NY 11729  
(631) 586 7600 FAX (631) 242 9798 www.sensitron.com sales@sensitron.com Page 5  
SENSITRON  
SPM6G140-060D  
SEMICONDUCTOR  
TECHNICAL DATA  
DATASHEET 4977, Rev. B  
+15V  
+15V-Rtn  
Signal Ground  
Gnd1  
+VDC  
LIN-A  
HIN-A  
LIN-B  
Lin-A  
Gnd2  
+5V-in  
Hin-A  
Magnetic  
PH-A  
Lin-B  
Hin-B  
Lin-C  
Isiolation  
IAo = 2.5V  
+/- 0.0175 IA  
IAd = 2.5V  
HIN-B  
LIN-C  
HIN-C  
Flt-CLr  
Flt  
Encoder/  
Decoder  
Hin-C  
+5V-in Gnd2  
Flt-CLr  
PH-B  
SD Out  
Flt  
IBo = 2.5V  
+/- 0.0175  
SD  
IBd = 2.5V  
Idco  
Gnd2  
+5V-in  
+5V-in  
Gnd2  
PH-C  
ICo = 2.5V  
+/- 0.0175 IC  
ICd = 2.5V  
SD Input  
+5V-out  
Analog to PWM  
130KHz  
BRK  
G-Brk  
10Ω  
10KΩ  
To-SD  
R1  
1KΩ  
G=6.32  
0.0005Ω  
E-Brk  
I trip-Ref 1  
I trip-Ref 2  
+VDC  
Rtn  
1nF  
R2  
5KΩ  
5KΩ  
Heat-Sink  
Temperature  
Sensor  
TCo  
10nF  
Gnd2  
Fig. 1. Block Diagram  
©2004 Sensitron Semiconductor 221 West Industry Court Deer Park, NY 11729  
(631) 586 7600 FAX (631) 242 9798 www.sensitron.com sales@sensitron.com Page 6  
SENSITRON  
SPM6G140-060D  
SEMICONDUCTOR  
TECHNICAL DATA  
DATASHEET 4977, Rev. B  
Figure 2. Mechanical Outline  
Figure 3. Device Pinout and Marking  
©2004 Sensitron Semiconductor 221 West Industry Court Deer Park, NY 11729  
(631) 586 7600 FAX (631) 242 9798 www.sensitron.com sales@sensitron.com Page 7  
SENSITRON  
SPM6G140-060D  
SEMICONDUCTOR  
TECHNICAL DATA  
DATASHEET 4977, Rev. B  
Normalized Thermal Impedance Curves for Both IGBTs and Diodes  
D = 0.50  
D = 0.20  
D = 0.10  
D = 0.05  
SINGLE PULSE  
(THERMAL RESPONSE)  
Figure 4. Normalized Transient Thermal Impedance, Junction-to-Case (IGBT)  
D = 0.50  
D = 0.20  
D = 0.10  
D = 0.05  
SINGLE PULSE  
(THERMAL RESPONSE)  
Figure 5. Normalized Transient Thermal Impedance, Junction-to-Case (Diode)  
©2004 Sensitron Semiconductor 221 West Industry Court Deer Park, NY 11729  
(631) 586 7600 FAX (631) 242 9798 www.sensitron.com sales@sensitron.com Page 8  
SENSITRON  
SPM6G140-060D  
SEMICONDUCTOR  
TECHNICAL DATA  
DATASHEET 4977, Rev. B  
Pin Descriptions  
ICd (Pin 1 ) : A +2.5V DC offset used for differential output reading of ICo.  
ICo (Pin 2): Hall current sensor output for phase C. The output can be measured between Pin2 and Pin 1  
differentially. Zero current corresponds to zero output, current entering Phase C pins will produce positive output  
voltage at Pin2, and current out of Phase C pins will produce negative output voltage at Pin2. Also, the output can  
be measured as single ended between Pin2 and Pin19. In this case zero current will correspond to 2.5V output,  
current entering Phase C pins will produce positive output voltage above 2.5V, and current out of Phase C pins will  
produce positive output voltage below 2.5V.The sensitivity of this sensor is 0.018V/A.  
IBd (Pin 3): A +2.5V DC offset used for differential output reading of IBo.  
IBo (Pin 4): Hall current sensor output for phase B. The output can be measured between Pin4 and Pin 3  
differentially. Zero current corresponds to zero output, current entering Phase B pins will produce positive output  
voltage at Pin4, and current out of Phase B pins will produce negative output voltage at Pin4. Also, the output can  
be measured as single ended between Pin4 and Pin19. In this case zero current will correspond to 2.5V output,  
current entering Phase B pins will produce positive output voltage above 2.5V, and current out of Phase B pins will  
produce positive output voltage below 2.5V. The sensitivity of this sensor is 0.018V/A.  
IAd (Pin 5): A +2.5V DC offset used for differential output reading of IAo.  
IAo (Pin 6 ): Phase A hall current sensor output. The output can be measured between Pin6 and Pin 5 differentially.  
Zero current corresponds to zero output, current entering Phase A pins will produce positive output voltage at Pin6,  
and current out of Phase A pins will produce negative output voltage at Pin6. Also, the output can be measured as  
single ended between Pin6 and Pin19. In this case zero current will correspond to 2.5V output, current entering  
Phase A pins will produce positive output voltage above 2.5V, and current out of Phase A pins will produce positive  
output voltage below 2.5V. The sensitivity of this sensor is 0.018V/A.  
TCo (Pin 7 ): An analog output of case temperature sensor. The sensor output gain is 6.25mV/oC, with 424 mV DC  
offset. This sensor can measure both positive and negative oC. The internal impedance of this output is 4.99KΩ. The  
internal block diagram of the temperature sensor is shown in Fig. 6.  
4.99KΩ  
Pin 7  
Vo= (+6.25mV/oC )*ToC + 424 mV  
10nF  
Pin 19  
Gnd2  
Fig. 6 Temperature Sensor Internal Block Diagram  
The output voltage reading vs temperature will be:  
TCo = + 0.58V at Tc= +25oC  
TCo = + 1.205V at Tc= +125oC  
TCo = + 0.174V at Tc= -40oC  
LinA (Pin 8) : An isolated drive input for Low-side IGBT of Phase A.  
©2004 Sensitron Semiconductor 221 West Industry Court Deer Park, NY 11729  
(631) 586 7600 FAX (631) 242 9798 www.sensitron.com sales@sensitron.com Page 9  
SENSITRON  
SPM6G140-060D  
SEMICONDUCTOR  
TECHNICAL DATA  
DATASHEET 4977, Rev. B  
HinA (Pin 9): An isolated drive input for High-side IGBT of Phase A.  
LinB- (Pin 10): An isolated drive input for Low-side IGBT of Phase B.  
HinB (Pin 11): An isolated drive input for High-side IGBT of Phase B.  
LinC (Pin 12): An isolated drive input for Low-side IGBT of Phase C.  
HinC (Pin 13): An isolated drive input for High-side IGBT of Phase C.  
Flt-Clr(Pin 14): A fault clear input. It can be used to reset a latching fault condition, due to desaturation protection.  
Pin 14 an active high input. It is internally pulled down by 20.0KΩ. A latching fault due to desaturation can be cleared by  
pulling this input high to +5V. It is recommended to activate fault clear input for more than 500 μsec at startup. To  
charge boot-strap circuit at startup, it is recommended to turn on all low-side switches for 500 μsec while Flt-  
Clr is active.  
SD Out (Pin 15): Is internally activated due to desaturation protection, over-current shutdown, or under voltage  
lockout. Desaturation shutdown is a latching feature. SD Out can be used as a fault condition output. A continuous  
low output at SD out indicates a latching fault situation.  
Flt (Pin 16): Is internally pulled down by 20.0KΩ. Pin 16, reports desaturation protection activation. When  
desaturation protection is activated a low output for about 9 μsec is reported. If any other protection feature is  
activated, it will not be reported by Pin 16.  
Idco (Pin 17): Is DC bus bi-directional current sense output. The sensor output is isolated. It is a PWM signal with fixed  
frequency and variable duty cycle. The PWM frequency is 130 KHz. The maximum duty cycle is 91%,  
corresponding to 82 A. Minimum duty cycle is 9%, corresponding to –82A.  
VDD, +5V-in (Pin 18): The +5V input biasing supply connection for the phase current sensors, magnetic isolators,  
and temperature sensor. Pin 18 should be connected to an isolated 5V power supply, recommended limits are  
4.75V to 5.25V. The return of this input is pin 19. Recommended power supply capability for VDD is about  
50mA.  
Gnd2 (Pin 19): The signal ground for +5V-in,. This pin is internally floating for flexibility. The phase current sensors and  
temperature sensor are referenced to Gnd2. Gnd2 isolation from Gnd1 is over 2500V.  
SD Input (Pin 20): The SD input. A high input will disable all gate drive signals. This input is internally pulled high to  
+5V by 20 K ohms.  
Itrip-Ref1 (Pin 21): An adjustable voltage divider reference for over-current shutdown.  
Itrip-Ref2 (Pin 22): An adjustable voltage divider reference for over-current shutdown. The internal set point over-  
current shutdown is 82A. The re-start delay time is about 0.50 msec. +5V Output ( Pin 23 ), is a +5V output.  
Maximum output current is 30mA.  
Gnd1 (Pin 24) :The signal ground for +15V-in,. This pin is internally connected to DC Bus return. No external  
connection shall be established between Signal Gnd1 and +VDC Rtn. Gnd1 is isolated from Gnd2. Note that  
Pins 21 to 23 are referenced to Gnd1.  
+15V-in (Vcc) (Pin 25): The +15V input biasing supply connection for the controller. Under-voltage lockout keeps  
all outputs off for Vcc below 11.5V. Vcc pin should be connected to an isolated 15V power supply. Vcc  
recommended limits are 14V to 16V , and shall not exceed 18V. The return of Vcc is pin 24. Recommended  
power supply capability is about 70mA.  
©2004 Sensitron Semiconductor 221 West Industry Court Deer Park, NY 11729  
(631) 586 7600 FAX (631) 242 9798 www.sensitron.com sales@sensitron.com Page 10  
SENSITRON  
SPM6G140-060D  
SEMICONDUCTOR  
TECHNICAL DATA  
DATASHEET 4977, Rev. B  
Brk ( Pins 26,27 ), is Brake Terminal. Brake Resistor shall be connected between these terminals and +VDC. If the  
brake resistor is inductive, a freewheeling diode shall be connected across this resistor.  
Gbrk ( Pin 28 ), is Brake IGBT Gate Input. Brake IGBT Emitter is internally connected to DC Bus return.  
+VDC Rtn ( Pins 29 to 32 ), is DC Bus return.  
+VDC (Pins 33 to 36 ), is +DC Bus input.  
PhC (Pins 37 to 39 ), is Phase C output.  
PhB (Pins 40 to 42 ), is Phase B output.  
PhA (Pins 43 to 45 ), is Phase A output.  
A- DC Bus Charging from 15V  
D1  
Vcc  
+15V  
D2  
R1  
DS  
DS  
+VDC  
100KΩ  
R2  
100KΩ  
Q1H  
Q1L  
700  
KΩ  
VB  
PhA  
D3  
700  
KΩ  
Gate  
Driver  
+15V Rtn  
Sgnl Gnd1  
+VDC Rtn  
Figure 7. Charging Path from 15V Supply to DC Bus when DC Bus is off  
Each IGBT is protected against desaturation.  
D2 is the desaturation sense diode for the high-side IGBT  
D3 is the desaturation sense diode for the low-side IGBT  
When the DC bus voltage is not applied or below 15V, there is a charging path from the 15V supply to  
the DC bus through D2 and D3 and the corresponding pull up 100K Ohm resistor. The charging current  
is 0.15mA per IGBT. Total charging current is about 1.5mA.  
Do not apply PWM signal if the DC bus voltage is below 20V.  
B- Bias For Desaturation Detection Circuit:  
The desaturation detection is done by diode D2 for the high side IGBT Q1H, and by diode D3 for the low side  
IGBT Q1L. The internal detection circuit, input DSH for the high-side and input DSL for the low-side, is  
biased by the local supply voltage VCC for the low side and VBS for the high side. When the IGBT is on the  
corresponding detection diode is on. The current flowing through the diode is determined by the internal pull  
resistor, R1 for the high side and R2 for the low side. To minimize the current drain from VCC and VBS, R1  
and R2 are set to be 100KΩ. Lower value of R1 will overload the bootstrap circuit and reduce the bootstrap  
capacitor holding time.  
©2004 Sensitron Semiconductor 221 West Industry Court Deer Park, NY 11729  
(631) 586 7600 FAX (631) 242 9798 www.sensitron.com sales@sensitron.com Page 11  
SENSITRON  
SPM6G140-060D  
SEMICONDUCTOR  
TECHNICAL DATA  
DATASHEET 4977, Rev. B  
Cleaning Process:  
Suggested precaution following cleaning procedure:  
If the parts are to be cleaned in an aqueous based cleaning solution, it is recommended that the parts be baked  
immediately after cleaning. This is to remove any moisture that may have permeated into the device during the  
cleaning process. For aqueous based solutions, the recommended process is to bake for at least 2 hours at 125oC.  
Do not use solvents based cleaners.  
Recommended Soldering Procedure:  
Signal pins 1-25: 210C for 10 seconds max  
Power pins 26-45: 260C for 10 seconds max. Pre-warm module to 125C to aid in power pins soldering.  
Ordering Information:  
SPM6G140-060D is a standard product with all the features listed in the data sheet.  
A, is a standard product with all the features listed in the data sheet except Pins 26, 27,28 are removed. The  
associated circuits with these Pins are removed.  
B, is a standard product with all the features listed in the data sheet except Pins 17,21,22,26, 27,28 are  
removed or not connected. The associated circuits with these Pins are removed.  
DISCLAIMER:  
1- The information given herein, including the specifications and dimensions, is subject to change without prior notice to improve product  
characteristics. Before ordering, purchasers are advised to contact the Sensitron Semiconductor sales department for the latest version of the  
datasheet(s).  
2- In cases where extremely high reliability is required (such as use in nuclear power control, aerospace and aviation, traffic equipment, medical  
equipment , and safety equipment) , safety should be ensured by using semiconductor devices that feature assured safety or by means of users’  
fail-safe precautions or other arrangement .  
3- In no event shall Sensitron Semiconductor be liable for any damages that may result from an accident or any other cause during operation of  
the user’s units according to the datasheet(s). Sensitron Semiconductor assumes no responsibility for any intellectual property claims or any  
other problems that may result from applications of information, products or circuits described in the datasheets.  
4- In no event shall Sensitron Semiconductor be liable for any failure in a semiconductor device or any secondary damage resulting from use at  
a value exceeding the absolute maximum rating.  
5- No license is granted by the datasheet(s) under any patents or other rights of any third party or Sensitron Semiconductor.  
6- The datasheet(s) may not be reproduced or duplicated, in any form, in whole or part, without the expressed written permission of Sensitron  
Semiconductor.  
7- The products (technologies) described in the datasheet(s) are not to be provided to any party whose purpose in their application will hinder  
maintenance of international peace and safety nor are they to be applied to that purpose by their direct purchasers or any third party. When  
exporting these products (technologies), the necessary procedures are to be taken in accordance with related laws and regulations.  
©2004 Sensitron Semiconductor 221 West Industry Court Deer Park, NY 11729  
(631) 586 7600 FAX (631) 242 9798 www.sensitron.com sales@sensitron.com Page 12  

相关型号:

SPM6G140-060D_08

Three-Phase IGBT BRIDGE, With Gate Driver and Magnetic Isolation
SENSITRON

SPM6G140-120D

Half Bridge Based Peripheral Driver, 350A,
SENSITRON

SPM6G150-060D

Three-Phase IGBT BRIDGE With Gate Driver and Optical Isolation
SENSITRON

SPM6G180-060D

Half Bridge Based Peripheral Driver,
SENSITRON

SPM6G250-120D

Three-Phase IGBT BRIDGE With Gate Driver and Optical Isolation
SENSITRON

SPM6G48-60

暂无描述
SENSITRON

SPM6G50-60

Half Bridge Based Peripheral Driver, 130A,
SENSITRON

SPM6G65-60

Half Bridge Based Peripheral Driver
SENSITRON

SPM6M020-060D

Three-Phase MOSFET BRIDGE With Gate Driver and Optical Isolation 600 VOLT 20 AMP
SENSITRON

SPM6M040-020D

Micro Peripheral IC
SENSITRON

SPM6M050-010D

Three-Phase MOSFET BRIDGE 100 VOLT 50 AMP
SENSITRON

SPM6M050-015D

Micro Peripheral IC
SENSITRON