SGM61013 [SGMICRO]

10MHz, 1A Micro-Point-of-Load Buck Converter;
SGM61013
型号: SGM61013
厂家: Shengbang Microelectronics Co, Ltd    Shengbang Microelectronics Co, Ltd
描述:

10MHz, 1A Micro-Point-of-Load Buck Converter

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中文:  中文翻译
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SGM61013  
10MHz, 1A Micro-Point-of-Load Buck Converter  
GENERAL DESCRIPTION  
FEATURES  
The Micro-Point-of-Load (µPOL) SGM61013 is a family  
of high-efficient and high-frequency Buck DC/DC  
converter. Operating with a switching frequency up to  
10MHz, it allows the use of small external components  
in both value and footprint. Different versions are  
available with fixed output voltages of 1.2V, 1.8V and  
3.3V, delivered from an input voltage supply of 2.3V to  
5.5V. A low quiescent current of only 20µA (TYP)  
enables high efficiency even with very light loads.  
2.3V to 5.5V Input Voltage Range  
SGM61013A: 1.8V Fixed Output Voltage  
SGM61013B: 1.2V/3.3V Fixed Output Voltages  
1A Output Current  
20μA (TYP) Quiescent Current  
Up to 95% Efficiency  
Selectable PFM Light Load Operation  
Fast Load Transient Response  
100% Duty Cycle  
Logic Enable Input  
Soft-Start  
Input Under-Voltage Lockout  
Over-Current Protection  
Thermal Shutdown  
At light current load condition, the converter will  
automatically enter pulse frequency modulation (PFM)  
mode for best possible efficiency over the entire range  
of load currents. If PFM mode is not desired, the MODE  
pin can be set high to forced pulse width modulation  
(FPWM) operation.  
Active Output Discharge  
Available in a Green WLCSP-0.9×1.2-6B Package  
The SGM61013 is  
available in  
a
Green  
WLCSP-0.9×1.2-6B package.  
Embedded Power Supply  
Wearables  
APPLICATIONS  
Optical Modules  
Cellular Phones  
Tablets  
IoT  
Security and Surveillance  
Wireless Data Cards  
TYPICAL APPLICATION  
Typical Efficiency, Mode = Low  
VIN  
LOUT  
VIN  
VOUT  
SW  
4.7μF  
SGM61013  
VOUT = 3.3V  
EN  
FB  
4.7μF  
EN  
MODE  
MODE  
GND  
Figure 1. Typical Application Circuit  
SG Micro Corp  
DECEMBER2022REV. A.1  
www.sg-micro.com  
SGM61013  
10MHz, 1A Micro-Point-of-Load Buck Converter  
PACKAGE/ORDERING INFORMATION  
SPECIFIED  
TEMPERATURE  
RANGE  
PACKAGE  
DESCRIPTION  
ORDERING  
NUMBER  
PACKAGE  
MARKING  
PACKING  
OPTION  
MODEL  
VOUT (V)  
SGM61013A  
(10MHz)  
XXX  
G9S  
1.8  
1.2  
3.3  
WLCSP-0.9×1.2-6B  
SGM61013A-1.8YG/TR  
SGM61013B-1.2YG/TR  
SGM61013B-3.3YG/TR  
Tape and Reel, 3000  
Tape and Reel, 3000  
Tape and Reel, 3000  
-40to +85℃  
-40to +85℃  
-40to +85℃  
SGM61013B  
(6.5MHz)  
XXX  
G9U  
WLCSP-0.9×1.2-6B  
WLCSP-0.9×1.2-6B  
SGM61013B  
(8MHz)  
XXX  
GAH  
MARKING INFORMATION  
NOTE: XXX = Date Code and Trace Code.  
Date Code - Year  
Trace Code  
X X X  
Y Y Y  
Serial Number  
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If  
you have additional comments or questions, please contact your SGMICRO representative directly.  
OVERSTRESS CAUTION  
ABSOLUTE MAXIMUM RATINGS  
Stresses beyond those listed in Absolute Maximum Ratings  
may cause permanent damage to the device. Exposure to  
absolute maximum rating conditions for extended periods  
may affect reliability. Functional operation of the device at any  
conditions beyond those indicated in the Recommended  
Operating Conditions section is not implied.  
DC Supply Voltage............................................... -0.3V to 6V  
Voltage on Other Pins, MODE, SW, FB, EN  
..................................................................-0.3V to VIN + 0.3V  
Package Thermal Resistance  
WLCSP-0.9×1.2-6B, θJA .......................................... 130/W  
Junction Temperature.................................................+150℃  
Storage Temperature Range.......................-65to +150℃  
Lead Temperature (Soldering, 10s)............................+260℃  
ESD Susceptibility  
ESD SENSITIVITY CAUTION  
This integrated circuit can be damaged if ESD protections are  
not considered carefully. SGMICRO recommends that all  
integrated circuits be handled with appropriate precautions.  
Failureto observe proper handlingand installation procedures  
can cause damage. ESD damage can range from subtle  
performance degradation tocomplete device failure. Precision  
integrated circuits may be more susceptible to damage  
because even small parametric changes could cause the  
device not to meet the published specifications.  
HBM...........................................................................±4000V  
CDM ..........................................................................±2000V  
RECOMMENDED OPERATING CONDITIONS  
Supply Voltage................................................2.3V to 5.5V (1)  
Output Current.......................................................0A to 1.0A  
Output Inductor................... 220nH to 2200nH, 470nH (TYP)  
Input Capacitor .....................................2.2µF to 4.7µF (TYP)  
Output Capacitor...................................2.2µF to 4.7µF (TYP)  
Operating Ambient Temperature Range........-40to +85℃  
Operating Junction Temperature Range......-40to +125℃  
DISCLAIMER  
SG Micro Corp reserves the right to make any change in  
circuit design, or specifications without prior notice.  
NOTE:  
1. VIN above 5.5V over extended periods may affect device  
reliability.  
SG Micro Corp  
www.sg-micro.com  
DECEMBER 2022  
2
SGM61013  
10MHz, 1A Micro-Point-of-Load Buck Converter  
PIN CONFIGURATION  
(TOP VIEW)  
A
B
1
2
3
MODE  
VIN  
SW  
FB  
EN  
GND  
WLCSP-0.9×1.2-6B  
PIN DESCRIPTION  
PIN  
NAME  
DESCRIPTION  
Mode Selection. MODE pin = Low allows the converter to automatically switch between pulse frequency  
A1  
MODE modulation (PFM) at light current loads and pulse width modulation (PWM) at heavy current loads. MODE  
pin = High forces the converter to stay in PWM mode.  
B1  
A2  
B2  
A3  
B3  
VIN  
SW  
EN  
Power Supply Input. Connect to power source with a minimum 2.2μF ceramic capacitor.  
Switching Node. Connect to the output inductor.  
Enable Logic Input. Logic high level (VEN > 1.2V) enables the device. Logic low level (VEN < 1.07V)  
disables the device and turns it into shutdown mode. Do not leave this pin floating.  
FB  
Feedback Input. Connect to output voltage.  
Ground Pin.  
GND  
SG Micro Corp  
www.sg-micro.com  
DECEMBER 2022  
3
SGM61013  
10MHz, 1A Micro-Point-of-Load Buck Converter  
ELECTRICAL CHARACTERISTICS  
(Typical values are at VIN = 3.6V, VOUT = 1.8V, MODE = 0V, TA = +25, maximum and minimum values are at VIN = VEN = 2.3V to  
5.5V, TA = -40to +85, unless otherwise noted.)  
PARAMETER  
DC Characteristics  
SYMBOL  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
Supply Voltage  
VIN  
IQ  
2.3  
5.5  
V
mA  
µA  
µA  
V
PWM mode  
6.5  
20  
Quiescent Current  
No load, not switching  
EN = GND  
Shutdown Current  
ISHDN  
VUVLO  
VUVLOHYST  
TTSD  
0.1  
2.0  
150  
135  
15  
1
Under-Voltage Lockout Threshold  
Under-Voltage Lockout Hysteresis  
Thermal Shutdown  
Rising VIN  
2.25  
mV  
Thermal Shutdown Hysteresis  
Output Characteristics  
THYST  
SGM61013B-1.2  
6.5  
8
Switching Frequency  
FSW  
SGM61013B-3.3  
MHz  
SGM61013A-1.8  
10  
ILOAD = 0A to 1A, VIN = 5.5V (MAX)  
PWM Mode, VIN = 5.5V (MAX)  
-2%  
VOUT  
VOUT  
280  
100  
148  
77  
+2%  
Output Voltage Accuracy  
VOUT  
-1.5%  
+1.5%  
Soft-Start Time  
tSS  
tEN  
µs  
µs  
Enable Turn-on Delay  
PMOS On-Resistance  
NMOS On-Resistance  
PMOS Peak Current Limit  
Output Discharge Resistance  
Logic Inputs: EN and Mode  
Logic High Voltage  
RDSON_P  
RDSON_N  
ILIM  
VIN = VGS = 3.6V  
VIN = VGS = 3.6V  
VIN = 3.6V, open loop  
VEN = 0V  
mΩ  
mΩ  
mA  
1600  
17  
RDIS  
VIH  
VIL  
1.2  
VIN  
1.07  
1
V
V
Logic Low Voltage  
Logic Pin Leakage Current  
Logic Input Hysteresis  
ILPIN  
µA  
mV  
VLHYST  
130  
SG Micro Corp  
www.sg-micro.com  
DECEMBER 2022  
4
SGM61013  
10MHz, 1A Micro-Point-of-Load Buck Converter  
TYPICAL PERFORMANCE CHARACTERISTICS  
VIN = 3.6V, VOUT = 1.8V. MODE = 0V, TA = +25. FSW = 10MHz for 1.8V device, FSW = 6.5MHz for 1.2V and FSW = 8MHz for 3.3V  
devices, unless otherwise noted.  
Efficiency, Mode = Low  
Efficiency, Mode = High  
VOUT = 1.2V  
VOUT = 1.2V  
Efficiency, Mode = Low  
Efficiency, Mode = High  
VOUT = 1.8V  
VOUT = 1.8V  
Efficiency, Mode = Low  
Efficiency, Mode = High  
VOUT = 3.3V  
VOUT = 3.3V  
SG Micro Corp  
www.sg-micro.com  
DECEMBER 2022  
5
SGM61013  
10MHz, 1A Micro-Point-of-Load Buck Converter  
TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
VIN = 3.6V, VOUT = 1.8V. MODE = 0V, TA = +25. FSW = 10MHz for 1.8V device, FSW = 6.5MHz for 1.2V and FSW = 8MHz for 3.3V  
devices, unless otherwise noted.  
Load Regulation, Mode = Low  
Load Regulation, Mode = High  
VOUT = 1.2V  
VOUT = 1.2V  
Load Regulation, Mode = Low  
Load Regulation, Mode = High  
VOUT = 1.8V  
VOUT = 1.8V  
Load Regulation, Mode = Low  
Load Regulation, Mode = High  
VOUT = 3.3V  
VOUT = 3.3V  
SG Micro Corp  
www.sg-micro.com  
DECEMBER 2022  
6
SGM61013  
10MHz, 1A Micro-Point-of-Load Buck Converter  
TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
VIN = 3.6V, VOUT = 1.8V. MODE = 0V, TA = +25. FSW = 10MHz for 1.8V device, FSW = 6.5MHz for 1.2V and FSW = 8MHz for 3.3V  
devices, unless otherwise noted.  
IQ vs. VIN over Temperature, Mode = Low  
IQ vs. VIN over Temperature, Mode = High  
VOUT = 1.8V  
VOUT = 1.8V  
PFM/PWM Boundaries, Mode = Low  
PFM/PWM Boundaries, Mode = Low  
VOUT = 1.2V  
VOUT = 3.3V  
Switching Frequency, Mode = Low  
VOUT = 1.2V  
Switching Frequency, Mode = High  
VOUT = 1.2V  
IOUT = 0.15A  
OUT = 0.30A  
OUT = 0.40A  
OUT = 0.50A  
VIN = 2.7V, Load Down  
I
I
I
V
V
IN = 3.6V, Load Down  
IN = 5V, Load Down  
IOUT (A)  
VIN (V)  
SG Micro Corp  
DECEMBER 2022  
www.sg-micro.com  
7
SGM61013  
10MHz, 1A Micro-Point-of-Load Buck Converter  
TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
VIN = 3.6V, VOUT = 1.8V. MODE = 0V, TA = +25. FSW = 10MHz for 1.8V device, FSW = 6.5MHz for 1.2V and FSW = 8MHz for 3.3V  
devices, unless otherwise noted.  
Switching Frequency, Mode = Low  
Switching Frequency, Mode = High  
VOUT = 1.8V  
VOUT = 1.8V  
IOUT = 0.15A  
OUT = 0.30A  
OUT = 0.40A  
OUT = 0.50A  
VIN = 2.7V, Load Down  
I
I
I
V
V
IN = 3.6V, Load Down  
IN = 5V, Load Down  
VIN (V)  
IOUT (A)  
Switching Frequency, Mode = Low  
VOUT = 3.3V  
Switching Frequency, Mode = High  
VOUT = 3.3V  
IOUT = 0.15A  
OUT = 0.30A  
OUT = 0.40A  
OUT = 0.50A  
VIN = 4V, Load Down  
I
I
I
V
V
IN = 4.5V, Load Down  
IN = 5V, Load Down  
VIN (V)  
IOUT (A)  
Output Voltage Ripple, Mode = High  
Output Voltage Ripple, Mode = High  
VOUT = 1.8V, ILOAD = 500mA  
VOUT = 1.8V, ILOAD = 0A  
SG Micro Corp  
www.sg-micro.com  
DECEMBER 2022  
8
SGM61013  
10MHz, 1A Micro-Point-of-Load Buck Converter  
TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
VIN = 3.6V, VOUT = 1.8V. MODE = 0V, TA = +25. FSW = 10MHz for 1.8V device, FSW = 6.5MHz for 1.2V and FSW = 8MHz for 3.3V  
devices, unless otherwise noted.  
Output Voltage Ripple, Mode = High  
Output Voltage Ripple, Mode = Low  
VOUT = 1.8V, ILOAD = 0A  
VOUT = 1.8V, ILOAD = 1A  
Load Transient, Mode = High  
Load Transient, Mode = High  
VOUT = 1.8V, ILOAD = 0A to 250mA  
VOUT = 1.8V, ILOAD = 500mA to 750mA  
Load Transient, Mode = Low  
Load Transient, Mode = Low  
VOUT = 1.8V, ILOAD = 500mA to 750mA  
VOUT = 1.8V, ILOAD = 0A to 250mA  
SG Micro Corp  
www.sg-micro.com  
DECEMBER 2022  
9
SGM61013  
10MHz, 1A Micro-Point-of-Load Buck Converter  
TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
VIN = 3.6V, VOUT = 1.8V. MODE = 0V, TA = +25. FSW = 10MHz for 1.8V device, FSW = 6.5MHz for 1.2V and FSW = 8MHz for 3.3V  
devices, unless otherwise noted.  
Combined Line/Load Transient  
Combined Line/Load Transient  
VIN = 3.3V to 3.9V, ILOAD = 30mA to 300mA  
VIN = 2.7V to 3.3V, ILOAD = 30mA to 300mA  
OCP Hiccup  
OCP Hiccup  
VIN = 3.6V, VOUT = 1.8V  
VIN = 5.5V, VOUT = 1.8V  
PFM Mode Operation  
PWM Mode Operation  
VIN = 3.6V, VOUT = 1.8V, ILOAD = 40mA  
VIN = 3.6V, VOUT = 1.8V, ILOAD = 300mA  
SG Micro Corp  
www.sg-micro.com  
DECEMBER 2022  
10  
SGM61013  
10MHz, 1A Micro-Point-of-Load Buck Converter  
TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
VIN = 3.6V, VOUT = 1.8V. MODE = 0V, TA = +25. FSW = 10MHz for 1.8V device, FSW = 6.5MHz for 1.2V and FSW = 8MHz for 3.3V  
devices, unless otherwise noted.  
Start-up, Mode = High  
Shutdown, Mode = High  
VIN = 3.6V, VOUT = 1.8V, No load  
VIN = 3.6V, VOUT = 1.8V, No load  
SG Micro Corp  
www.sg-micro.com  
DECEMBER 2022  
11  
SGM61013  
10MHz, 1A Micro-Point-of-Load Buck Converter  
FUNCTIONAL BLOCK DIAGRAM  
VIN  
CONTROL  
- UVLO  
OCP  
- Soft-Start  
EN  
- OCP Hiccup  
- Output Discharge  
SW  
+
-
- PWM Control  
FB  
- Over-Current Protection  
- Power-Save Mode  
(Enable/Disable by Mode Pin)  
MODE  
Negative  
Current  
Detection  
GND  
Figure 2. Block Diagram  
SG Micro Corp  
www.sg-micro.com  
DECEMBER 2022  
12  
SGM61013  
10MHz, 1A Micro-Point-of-Load Buck Converter  
DETAILED DESCRIPTION  
The SGM61013 family is synchronous Buck DC/DC  
converters with switching frequency up to 10MHz.  
Operating from an input voltage between 2.3V and 5.5V,  
the converter can deliver up to 1A load current at a  
fixed output voltage.  
operates in pulse width modulation (PWM) mode  
regardless of load current. The PWM mode is a  
continuous switching mode where the duty cycle is  
modulated to achieve the required output power.  
When connected to logic low, the converter  
automatically switches to pulse frequency modulation  
(PFM) mode at light current loads. In PFM mode the  
frequency of pulses is varied to deliver the best  
possible efficiency. The device switches between PFM  
and PWM as the load current changes and thus  
optimizes performance.  
Under-Voltage Lockout (UVLO)  
The under-voltage lockout feature prevents the device  
from turning on if VIN is below the UVLO level of 2.0V. If  
the device is enabled under UVLO conditions, the  
circuitry will not turn on until the input voltage is  
increased. Once it is active, the UVLO circuit has  
150mV of hysteresis and the device will turn off if VIN  
drops below 1.85V.  
If the input voltage ever gets too close to the target  
output voltage, such that regulation can no longer be  
maintained, the converter will enter 100% duty cycle  
mode. In this mode the high-side switch is on,  
connecting the input and output together to deliver a  
voltage as close to the target as possible.  
Enable  
Setting the EN voltage to logic high enables the device.  
Alternatively, the device is disabled when the EN  
voltage is set to logic low. In this state, the IC draws  
less than 1µA of current and the output is pulled down  
to ground through a resistive load (RDSON). VOUT starts  
to ramp up after 100µs delay.  
Over-Current Protection  
The device has an over-current protection to prevent  
damage to the device and inductor during over-current  
conditions.  
Soft-Start  
When the device is enabled, internal soft-start circuitry  
causes VOUT to ramp up over a period of 280µs to limit  
inrush current. This feature protects a high impedance  
source from being pulled to a lower voltage as the  
device turns on.  
Over-current protection occurs at 1.6A. After hitting 16  
consecutive cycles of peak current limit, the output will  
be disabled. After being disabled for 1.5ms, the device  
will be re-enabled, and a new soft-start cycle will begin.  
Thermal Shutdown  
Active Output Discharge  
The device thermal shutdown protection is enabled if  
the chip temperature exceeds +135 . Once the  
temperature drops below +120, the device will be  
re-enabled, and a new soft-start cycle will begin.  
When the device is disabled through the EN pin, a  
discharge path for the output capacitor is created  
between VOUT and ground through a 17Ω resistor (RDIS).  
Modes of Operation  
The MODE pin selects the device’s mode of operation.  
When connected to logic high, the converter always  
SG Micro Corp  
www.sg-micro.com  
DECEMBER 2022  
13  
SGM61013  
10MHz, 1A Micro-Point-of-Load Buck Converter  
APPLICATION INFORMATION  
VIN  
2.3V to 5.5V  
LOUT  
VIN  
VOUT  
CIN  
SW  
FB  
SGM61013  
EN  
COUT  
EN  
MODE  
MODE  
GND  
Figure 3. Application Circuit  
Table 1 .Recommended Components  
Part  
Value  
Package  
0402  
Manufacturer  
AVX  
Part Number  
4.7μF, 10V  
0402ZD475MATA2A  
0402ZD225MATA2A  
0402ZD475MATA2A  
0402ZD225MATA2A  
DFE18SANR47MG0L  
DFE201610ER47M  
MIPSZ2016DR47FR  
16010F100E  
CIN  
2.2μF, 10V  
0402  
AVX  
4.7μF, 10V  
0402  
AVX  
COUT  
2.2μF, 10V  
0402  
AVX  
470nH, DCR 54mΩ  
470nH, DCR 32mΩ  
470nH, DCR 40mΩ  
470nH, DCR 125mΩ  
470nH, DCR 80mΩ  
1.6mm × 1.0mm × 0.8mm  
2.0mm × 1.6mm × 1.0mm  
2.0mm × 1.6mm × 1.0mm  
1.6mm × 0.8mm × 0.6mm  
2.0mm × 1.2mm × 1.0mm  
Murata  
Murata  
FDK  
LOUT  
Cyntec  
Sunlord  
MPH201210QR47MT  
Place common and unbroken ground for CIN and  
COUT  
Reduce excessive thermal relief vias and keep them  
Layout Guidelines and Example  
.
A well-designed and manufactured PCB is important for  
all switching power supplies, especially for those  
operate at high switching frequency.  
away from SW and inductor.  
Poor layout could result in system instability, EMI failure,  
and device damage. Hence, care must be taken in  
board layout to achieve the specified performance.  
Please use the following guidelines when designing  
PCBs:  
Keep components placement as compact as  
possible.  
Place a low-ESR input capacitor as close to VIN and  
GND as possible.  
Minimize the area between SW pin trace and inductor  
to limit high frequency radiation.  
Keep FB trace away from noisy components and  
traces (e.g. SW and inductor).  
Use wide and short traces for the main current paths.  
Ground pins of converter must be strongly  
connected to PCB ground with low inductance and  
impedance.  
Figure 4. Layout Top Layer  
SG Micro Corp  
www.sg-micro.com  
DECEMBER 2022  
14  
SGM61013  
10MHz, 1A Micro-Point-of-Load Buck Converter  
REVISION HISTORY  
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.  
DECEMBER 2022 ‒ REV.A to REV.A.1  
Page  
Updated fixed output voltage options...............................................................................................................................................................1, 2  
Changes from Original (NOVEMBER 2022) to REV.A  
Page  
Changed from product preview to production data.............................................................................................................................................All  
SG Micro Corp  
www.sg-micro.com  
DECEMBER 2022  
15  
PACKAGE INFORMATION  
PACKAGE OUTLINE DIMENSIONS  
WLCSP-0.9×1.2-6B  
0.40  
0.22  
6 × Φ  
0.20  
D
A1 CORNER  
E
0.40  
RECOMMENDED LAND PATTERN (Unit: mm)  
TOP VIEW  
B
A
6 × Φd  
1
2
3
e
A
A1  
SEATING PLANE  
ccc  
C
C
e
SIDE VIEW  
BOTTOM VIEW  
Dimensions In Millimeters  
Symbol  
MIN  
MOD  
0.582  
MAX  
A
A1  
D
0.536  
0.182  
0.860  
1.160  
0.223  
0.628  
0.222  
0.940  
1.240  
0.301  
0.202  
0.900  
E
1.200  
d
0.262  
e
0.400 BSC  
0.030  
ccc  
NOTE: This drawing is subject to change without notice.  
SG Micro Corp  
TX00279.000  
www.sg-micro.com  
PACKAGE INFORMATION  
TAPE AND REEL INFORMATION  
REEL DIMENSIONS  
TAPE DIMENSIONS  
P2  
P0  
W
Q2  
Q4  
Q2  
Q4  
Q2  
Q4  
Q1  
Q3  
Q1  
Q3  
Q1  
Q3  
B0  
Reel Diameter  
P1  
A0  
K0  
Reel Width (W1)  
DIRECTION OF FEED  
NOTE: The picture is only for reference. Please make the object as the standard.  
KEY PARAMETER LIST OF TAPE AND REEL  
Reel Width  
Reel  
Diameter  
A0  
B0  
K0  
P0  
P1  
P2  
W
Pin1  
Package Type  
W1  
(mm)  
(mm) (mm) (mm) (mm) (mm) (mm) (mm) Quadrant  
WLCSP-0.9×1.2-6B  
7''  
9.5  
0.99  
1.38  
0.69  
4.0  
4.0  
2.0  
8.0  
Q1  
SG Micro Corp  
TX10000.000  
www.sg-micro.com  
PACKAGE INFORMATION  
CARTON BOX DIMENSIONS  
NOTE: The picture is only for reference. Please make the object as the standard.  
KEY PARAMETER LIST OF CARTON BOX  
Length  
(mm)  
Width  
(mm)  
Height  
(mm)  
Reel Type  
Pizza/Carton  
7″ (Option)  
7″  
368  
442  
227  
410  
224  
224  
8
18  
SG Micro Corp  
www.sg-micro.com  
TX20000.000  

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