SGM6611 [SGMICRO]
12.6V, 7A Fully-Integrated Synchronous Boost Converter;
| 型号： | SGM6611 |
| 厂家： | 
Shengbang Microelectronics Co, Ltd |
| 描述： | 12.6V, 7A Fully-Integrated Synchronous Boost Converter |
| 文件： | 总19页 (文件大小：1093K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SGM6611
12.6V, 7A Fully-Integrated
Synchronous Boost Converter
GENERAL DESCRIPTION
FEATURES
The SGM6611 family includes the SGM6611A and the
● 2.7V to 12V Input Voltage Range
● 4.5V to 12.6V Output Voltage Range
● Up to 90% Efficiency
SGM6611B. The SGM6611 is
a
fully-integrated
synchronous Boost converter. The 2.7V to 12V
operating input voltage is suitable for single-cell or
two-cell Li-Ion/Polymer batteries. This device is capable
of providing 7A continuous switch current and an output
voltage range of 4.5V to 12.6V. It also has an
adjustable switching frequency ranging from 200kHz to
2.2MHz.
(VIN = 3.3V, VOUT = 9V, IOUT = 2A)
● Adjustable Peak Current Limit up to 9.5A for
High Pulse Current
● Adjustable Switching Frequency: 200kHz to 2.2MHz
● 4ms Built-in Soft-Start Time
● PFM Mode at Light Load (SGM6611A)
● Forced PWM Mode at Light Load (SGM6611B)
● 13.2V Internal Output Over-Voltage Protection
● Over-Current Protection
● Thermal Shutdown
● Available in a Green TQFN-2×2.5-11L Package
The SGM6611 family has two operation modes, the
pulse width modulation (PWM) mode and pulse
frequency modulation (PFM). The SGM6611 family
adopts the PWM mode at moderate to heavy load. The
PFM mode is applied at light load by SGM6611A to
improve the efficiency. However, the SGM6611B still
adopts the PWM mode to prevent the device from low
switching frequency faults. The protection features
include output over-voltage protection at 13.2V,
cycle-by-cycle over-current protection and thermal
shutdown. The device also involves the functions of
4ms built-in soft-start and adjustable switch peak
current limit.
APPLICATIONS
Portable POS Machine
Bluetooth Speaker
E-Cigarette
Fast-Charging Power Bank
The SGM6611A and SGM6611B are both available in a
Green TQFN-2×2.5-11L package.
YPICAL APPLICATION
C4
L
BOOT
VIN
SW
R3
(RFREQ
C1
(CIN)
VOUT
VOUT
GND
)
FSW
VIN
C2
(COUT
)
R1
R2
SGM6611
ON
EN
OFF
C6
FB
COMP
VCC
ILIM
R5
C5
R4
(RILIM
C3
)
Figure 1. Typical Application Circuit
SG Micro Corp
www.sg-micro.com
DECEMBER2022–REV. B
12.6V, 7A Fully-Integrated
SGM6611
Synchronous Boost Converter
PACKAGE/ORDERING INFORMATION
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
DESCRIPTION
ORDERING
NUMBER
PACKAGE
MARKING
PACKING
OPTION
MODEL
6611A
XXXXX
SGM6611A
SGM6611B
TQFN-2×2.5-11L
TQFN-2×2.5-11L
SGM6611AYTQV11G/TR
SGM6611BYTQV11G/TR
Tape and Reel, 3000
Tape and Reel, 3000
-40℃ to +85℃
-40℃ to +85℃
6611B
XXXXX
MARKING INFORMATION
NOTE: XXXXX = Date Code and Vendor Code.
X X X X X
Vendor Code
Date Code - Week
Date Code - Year
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If
you have additional comments or questions, please contact your SGMICRO representative directly.
OVERSTRESS CAUTION
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed in Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to
absolute maximum rating conditions for extended periods
may affect reliability. Functional operation of the device at any
conditions beyond those indicated in the Recommended
Operating Conditions section is not implied.
BOOT Voltage ........................................... -0.3V to VSW + 6V
VIN, SW, FSW, VOUT Voltages...................... -0.3V to 14.5V
EN, VCC, COMP, ILIM, FB Voltages.................... -0.3V to 6V
SW Node (Transient: 10ns) ............................... -2V to 16.5V
Package Thermal Resistance
TQFN-2×2.5-11L, θJA ................................................. 60℃/W
Junction Temperature .................................................+150℃
Storage Temperature Range........................-65℃ to +150℃
Lead Temperature (Soldering, 10s) ............................+260℃
ESD Susceptibility
ESD SENSITIVITY CAUTION
This integrated circuit can be damaged if ESD protections are
not considered carefully. SGMICRO recommends that all
integrated circuits be handled with appropriate precautions.
Failureto observe proper handlingand installation procedures
can cause damage. ESD damage can range from subtle
performance degradation tocomplete device failure. Precision
integrated circuits may be more susceptible to damage
because even small parametric changes could cause the
device not to meet the published specifications.
HBM.............................................................................1500V
MM.................................................................................300V
CDM ............................................................................1000V
RECOMMENDED OPERATING CONDITIONS
Input Voltage Range ............................................2.7V to 12V
Output Voltage Range ......................................4.5V to 12.6V
Inductance, Effective Value, L....................... 0.47μH to 10μH
Input Capacitance, Effective Value, CIN ............... 10μF (MIN)
Output Capacitance, Effective Value, COUT ...10μF to 1000μF
Operating Junction Temperature Range......-40℃ to +125℃
Operating Ambient Temperature Range.........-40℃ to +85℃
DISCLAIMER
SG Micro Corp reserves the right to make any change in
circuit design, or specifications without prior notice.
SG Micro Corp
www.sg-micro.com
DECEMBER 2022
2
12.6V, 7A Fully-Integrated
SGM6611
Synchronous Boost Converter
PIN CONFIGURATION
SGM6611A/SGM6611B (TOP VIEW)
SW
FSW
1
2
3
4
10
9
BOOT
VIN
11
VCC
FB
8
ILIM
EN
5
6
COMP
7
GND
VOUT
TQFN-2×2.5-11L
PIN DESCRIPTION
PIN
1
NAME
FSW
VCC
FB
I/O
I
FUNCTION
The switching frequency is programmed by a resistor between this pin and the GND pin.
Output. The VCC pin connects a ceramic capacitor (> 1.0μF) to ground.
Output Voltage Feedback.
2
O
I
3
Error Amplifier Output. Connect a loop compensation network between this pin and the GND
pin.
4
COMP
GND
VOUT
EN
O
-
5
Ground.
6
O
I
Boost Converter Output.
Enable Logic Input. Logic high makes the circuit enabled, logic low makes it disabled and the
device enters shutdown mode.
7
Adjustable Switch Peak Current Limit. Connect an external resistor between ILIM pin and the
GND pin.
8
ILIM
O
I
9
VIN
IC Power Supply Input.
Power Supply for High-side MOSFET Gate Driver. Connect a capacitor between the BOOT
pin and the SW pin.
10
11
BOOT
SW
O
I
Switching Node Pin. Drain connection of low-side power MOSFET and source connection of
the high-side power MOSFET.
NOTE: I = input, O = output.
SG Micro Corp
www.sg-micro.com
DECEMBER 2022
3
12.6V, 7A Fully-Integrated
SGM6611
Synchronous Boost Converter
ELECTRICAL CHARACTERISTICS
(VIN = 2.7V to 5.5V, VOUT = 9V. Full = -40℃ to +85℃, typical values are at TA = +25℃, unless otherwise noted.)
PARAMETER
SYMBOL
CONDITIONS
TEMP
MIN
TYP
MAX
UNITS
Power Supply
Input Voltage Range
VIN
Full
2.7
12
V
V
VIN rising
VIN falling
2.5
2.4
100
5
2.62
VIN Under-Voltage Lockout Threshold
VIN_UVLO
+25℃
VIN Under-Voltage Lockout Hysteresis
VCC Regulation
VIN_HYS
VCC
VCC_UVLO VCC falling
mV
V
+25℃
+25℃
+25℃
ICC = 2mA, VIN = 8V
VCC Under-Voltage Lockout Threshold
2.1
0.23
90
V
VIN Pin
VOUT Pin
0.4
130
1.1
IC enabled, no load, VFB = 1.3V,
OUT = 12V
Operating Quiescent Current
IQ
μA
μA
+25℃
+25℃
V
Shutdown Current into the VIN Pin
Output
ISHDN
IC disabled
0.6
Output Voltage Range
VOUT
VREF
Full
Full
4.5
12.6
V
V
PWM mode
PFM mode
VFB = 1.2V
VOUT rising
1.181
1.205
1.207
10
1.229
Reference Voltage at the FB Pin
+25℃
+25℃
Full
Leakage Current into the FB Pin
IFB_LKG
VOVP
100
nA
V
Output Over-Voltage Protection Threshold
Output Over-Voltage Protection Hysteresis
Soft Startup Time
12.95
13.2
0.15
4
13.55
VOVP_HYS VOUT falling below VOVP
V
+25℃
+25℃
tSS
COUT (effective) = 47μF, IOUT = 0A
ms
Error Amplifier
COMP Pin Sink Current
ISINK
ISOURCE
VCCLPH
VCCLPL
GEA
VFB = VREF + 100mV, VCOMP = 1.2V
VFB = VREF - 100mV, VCOMP = 1.2V
VFB = 1.1V, RILIM = 127kΩ
VFB = 1.3V, RILIM = 127kΩ
VCOMP = 1.2V
120
15
μA
μA
V
+25℃
+25℃
+25℃
+25℃
+25℃
COMP Pin Source Current
High Clamp Voltage at the COMP Pin
Low Clamp Voltage at the COMP Pin
Error Amplifier Transconductance
Power Switch
2.0
0.4
135
V
μS
High-side MOSFET On-Resistance
Low-side MOSFET On-Resistance
Switching Frequency
VCC = 5V
VCC = 5V
27
15
34
20
mΩ
mΩ
+25℃
+25℃
RDS(ON)
RFREQ = 301kΩ
RFREQ = 46.4kΩ
VCC = 5V
440
470
2200
120
500
10.8
0.4
kHz
kHz
ns
+25℃
+25℃
+25℃
Switching Frequency
fSW
Minimum On-Time
tON_MIN
Current Limit
Switch Peak Current Limit (SGM6611A)
Reference Voltage at the ILIM Pin
EN Logic Input
ILIM
RILIM = 127kΩ
8.5
1.2
9.5
A
V
+25℃
+25℃
VILIM
1.205
EN Logic High Threshold
EN Logic Low Threshold
EN Pull-Down Resistor
Thermal Shutdown
VENH
VENL
REN
Full
Full
V
V
800
kΩ
+25℃
Thermal Shutdown Threshold
Thermal Shutdown Hysteresis
TSD
TA rising
160
20
℃
℃
TSD_HYS
TA falling below TSD
SG Micro Corp
www.sg-micro.com
DECEMBER 2022
4
12.6V, 7A Fully-Integrated
SGM6611
Synchronous Boost Converter
TYPICAL PERFORMANCE CHARACTERISTICS
At TA = +25℃, VIN = 3.6V, VOUT = 9V, unless otherwise noted.
Efficiency vs. Output Current
Efficiency vs. Output Current
VOUT = 9V
100
90
80
70
60
50
40
30
20
10
0
100
90
80
70
60
50
40
30
20
10
VIN = 3.6V
SGM6611A
SGM6611A
VIN = 3V
VOUT = 5V
V
V
IN = 3.6V
IN = 4.2V
V
V
OUT = 9V
OUT = 12V
0.0001
0.001
0.01
0.1
1
10
0.0001
0.001
0.01
0.1
1
10
Output Current (A)
Output Current (A)
Efficiency vs. Output Current
VIN = 3.6V
Efficiency vs. Output Current
VOUT = 9V
100
90
80
70
60
50
40
30
20
10
0
100
90
80
70
60
50
40
30
20
10
0
SGM6611B
SGM6611B
VOUT = 5V
VIN = 3V
V
V
OUT = 9V
OUT = 12V
V
V
IN = 3.6V
IN = 4.2V
0.0001
0.001
0.01
0.1
1
10
0.0001
0.001
0.01
0.1
1
10
Output Current (A)
Output Current (A)
Current Limit vs. Setting Resistance
Switching Frequency vs. Setting Resistance
12
10
8
2500
2000
1500
1000
500
6
4
2
0
120 160 200 240 280 320 360 400
0
100 200 300 400 500 600 700 800 900
Resistance (kΩ)
Resistance (kΩ)
SG Micro Corp
DECEMBER 2022
www.sg-micro.com
5
12.6V, 7A Fully-Integrated
SGM6611
Synchronous Boost Converter
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
At TA = +25℃, VIN = 3.6V, VOUT = 9V, unless otherwise noted.
Shutdown Current vs. Temperature
Quiescent Current vs. Temperature
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
160
140
120
100
80
60
40
20
0
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
Temperature (℃)
Temperature (℃)
Reference Voltage vs. Temperature
Switching Waveforms in PFM Mode
1.220
1.215
1.210
1.205
1.200
1.195
1.190
1.185
1.180
AC Coupled
VOUT
IL
VSW
VIN = 3.6V, VOUT = 9V, IOUT = 200mA
-40 -20
0
20 40 60 80 100 120 140
Time (1μs/div)
Temperature (℃)
SG Micro Corp
www.sg-micro.com
DECEMBER 2022
6
12.6V, 7A Fully-Integrated
SGM6611
Synchronous Boost Converter
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
At TA = +25℃, VIN = 3.6V, VOUT = 9V, unless otherwise noted.
Switching Waveforms in DCM
Switching Waveforms in CCM
AC Coupled
AC Coupled
VOUT
VOUT
IL
IL
VSW
VSW
VIN = 3.6V, VOUT = 9V, IOUT = 2A
VIN = 3.6V, VOUT = 9V, IOUT = 20mA
Time (1μs/div)
Time (1μs/div)
Load Transient Response
Line Transient Response
IOUT
VIN
AC Coupled
VOUT
AC Coupled
VOUT
VIN = 3.6V, VOUT = 9V, IOUT = 1A to 2A
VIN = 3.3V to 4V, VOUT = 9V, IOUT = 2A
Time (500μs/div)
Time (500μs/div)
Startup Waveforms
Shutdown Waveforms
VEN
VEN
VOUT
VOUT
IL
IL
Time (1ms/div)
Time (50μs/div)
SG Micro Corp
www.sg-micro.com
DECEMBER 2022
7
12.6V, 7A Fully-Integrated
SGM6611
Synchronous Boost Converter
FUNCTIONAL BLOCK DIAGRAM
L
CBOOT
SW
BST
VIN
VOUT
CIN
VREF
VIN
COUT
Gate
Drivers
VCC
VCC
CL
Regulator
VOUT
ILIM
CVCC
R4
(RILIM
)
CL
PWM
Control
R1
CLOCK
ON
Logic,
FB
Thermal Shutdown,
OCP, OVP
EN
OFF
R2
VREF
Soft-Start
COMP
RCOMP
CCOMP
GND
Figure 2. Block Diagram
SG Micro Corp
www.sg-micro.com
DECEMBER 2022
8
12.6V, 7A Fully-Integrated
SGM6611
Synchronous Boost Converter
DETAILED DESCRIPTION
The SGM6611 family is a synchronous Boost converter
with two integrated power FETs and is capable of
delivering up to 9.5A (TYP) switch current. The device
has adjustable switching frequency ranging from
200kHz to 2.2MHz. The SGM6611 automatically
operates in pulse frequency modulation (PFM) mode at
light load to improve the efficiency. In moderate to
heavy load conditions, SGM6611 works at a constant
frequency pulse width modulation (PWM) mode. In light
load condition, the SGM6611A works in pulse
frequency modulation (PFM) mode and the SGM6611B
works in forced PWM (FPWM) mode. The device
provides excellent line and load transient responses, in
addition, the compensation network is configured
externally which brings flexibility to applications with
different inductor and output capacitor selections. The
device also implements various protection features
such as cycle-by-cycle current limit for abnormal load
conditions, output over-voltage protection and thermal
shutdown.
Adjustable Peak Current Limit
The peak current mode control provides inherent
over-current protection as the device monitors the
changes of inductor current. As the peak current
reaches 9.5A (TYP), the device stops switching and
turning off the low-side FET to stop inductor current to
rise. The peak current limit threshold is programmable
via a resistor connected on ILIM pin to ground. Use
Equation below to calculate the desired current limit
threshold.
1.2×106
RILIM
(2)
ILIM
=
where RILIM is the resistor connected between the ILIM
pin and ground, and ILIM is the switch peak current limit.
When ILIM is 9.5A (TYP), the resistor value for
SGM6611A is 127kΩ.
Soft-Start
The SGM6611 implements internal soft-start function of
4ms (TYP). When enabled, the device slowly ramps the
reference voltage to prevent large inrush current during
startup.
Enable and Disable
The input voltage applied to SGM6611 needs to be
higher than the maximum UVLO threshold of 2.5V and
the EN pin voltage is higher than 1.2V to enable the
device. Pulling the EN pin below 0.4V disables the
device, where all internal blocks are turned off, and no
voltage is present on VCC pin. While disabled, the
device stops switching and enters shutdown mode,
which only consumes less than 1.1μA current. VIN and
VOUT are connected through the body diode of the
high-side rectifier FET in the shutdown mode.
Under-Voltage Lockout (UVLO)
An under-voltage lockout (UVLO) circuit prevents the
device from malfunctioning at low input voltage and the
battery from excessive discharge. The SGM6611 has
both VIN UVLO function and VCC UVLO function. It
disables the device from switching when the falling
voltage at the VIN pin trips the UVLO threshold VIN_UVLO
which is typically 2.4V. The input UVLO function
implements a 100mV hysteresis to prevent the false
turn-on due to line voltage variations, where the device
cannot be turned on until the input voltage increases to
2.5V or higher. When the falling voltage at the VCC pin
trips the UVLO threshold VCC_UVLO, typically 2.1V, the
device is also disabled.
,
Adjustable Switching Frequency
SGM6611 also has an adjustable switching frequency
ranging from 200kHz to 2.2MHz. A resistor between the
FSW pin and the GND pin is used to set the switch
frequency. And do not leave the FSW pin open.
Equation 1 is used to calculate the resistor.
Over-Voltage Protection (OVP)
DELAY
The device implements over-voltage protection to
prevent the device from damage and protect the device
connected to the output of SGM6611. When the
voltage present on the VOUT pin exceeds 13.2V (TYP),
the device stops switching immediately to prevent the
output voltage from rising. As the output voltage drops
below 150mV (TYP) of hysteresis voltage that is lower
than the OVP threshold, the device resumes operation.
1
4×
- t
fSW
(1)
RFREQ
=
CFREQ
where RFREQ is the resistor connected between the
FSW pin and the GND pin, CFREQ = 30pF, tDELAY = 86ns,
and fSW is the desired switching frequency.
SG Micro Corp
www.sg-micro.com
DECEMBER 2022
9
12.6V, 7A Fully-Integrated
SGM6611
Synchronous Boost Converter
DETAILED DESCRIPTION (continued)
the current is zero, with only inductor current direction
changed. The efficiency is low in forced PWM mode.
However, no problems are caused by the low efficiency
in forced PWM mode, such as the audible noise.
Thermal Shutdown
A thermal shutdown function is implemented to prevent
damage caused by excessive heat and power
dissipation. Once a junction temperature of +160℃
(TYP) is exceeded, the device is shut down. The device
is released from shutdown automatically when the
PFM Mode
In order to improve the light load efficiency, the
SGM6611A implements PFM operation at light load. At
light load, the internal error amplifier’s output decreases
to lower the inductor current. As the current reaches
zero during the low-side off-time, the high-side FET
turns off till the next switching cycle starts. As the load
current decreases further, the output of the error
amplifier reaches a voltage that is corresponds to
junction temperature decreases by 20℃.
Device Functional Modes
Operation
The SGM6611 adopts the fixed frequency pulse width
modulation (PWM) mode in moderate to heavy load
condition. At the start of each clock cycle, the low-side
power FET is turned on to ramp up the inductor current
until the inductor current reaches the level determined
by the output of the internal error amplifier. When the
current is reached, LS FET is turned off, and a dead
time is issued which is used to prevent shoot-through.
During the dead time, the inductor current flows
through the body diode of the high-side FET. As the
dead time ends, the high-side FET is turned on to ramp
down the inductor current to replenish the output
capacitor and deliver current to the load.
I
LIM/10. The output of the error amplifier is clamped at
this value and no longer decreases. The SGM6611A
automatically adjusts the off-time in PFM mode to meet
the load demand, and lower load current results in
longer off-time. The output voltage is regulated to 0.2%
higher than the nominal programmed output voltage at
PFM mode. The SGM6611A is capable of achieving
above 70% efficiency when the load current is less than
1mA. Output voltage ripple is also lower in PFM mode
since the peak inductor current is lower.
The SGM6611A operates in PFM mode for applications
with high efficiency requirement at light load. And the
SGM6611B operates in forced PWM mode to avoid
switching noise for applications with fixed switching
frequency requirement.
VOUT
PFM Mode at Light Load
1.002 × VOUT_NOM
VOUT_NOM
Forced PWM Mode
For forced PWM mode, the switching frequency of
SGM6611B is fixed at light load. The internal error
amplifier output drops along with the load current.
When the output current further decreases, the current
of the inductor can be reduced to zero during turn-off.
The high-side N-MOSFET remains open even when
PWM Mode at Heavy Load
Figure 3. Output Voltage in PWM Mode and PFM Mode
SG Micro Corp
www.sg-micro.com
DECEMBER 2022
10
12.6V, 7A Fully-Integrated
SGM6611
Synchronous Boost Converter
APPLICATION INFORMATION
DELAY
The SGM6611 family is capable of supporting up to
12.6V output voltage, while providing 9.5A (TYP)
continuous switch current. At heavy load, the device
works in PWM mode. At light load, the SGM6611A
works in the PFM mode and the SGM6611B works in
the forced PWM mode. The peak current control
scheme provides excellent line and load transient
responses. The external loop compensation enables
design flexibility with various inductor and output
capacitor combinations. It also supports adjustable
switching frequency ranging from 200kHz to 2.2MHz.
1
4×
- t
fSW
(3)
RFREQ
=
CFREQ
where RFREQ is the resistor connected between the
FSW pin and the GND pin, CFREQ = 30pF, tDELAY = 86ns,
and fSW is the desired switching frequency.
Setting Peak Current Limit
The peak current limit is programmed via an external
resistor on ILIM pin. The resistor value can be
calculated by Equation 4:
Table 1. Design Parameters
1.2×106
RILIM
(4)
ILIM
=
Design Parameters
Input Voltage Range
Output Voltage
Example Values
3.0V to 4.35V
9V
where RILIM is the resistance connected between the
ILIM pin and ground, and ILIM is the switch peak current
limit.
Output Voltage Ripple
Output Current Rating
Operating Frequency
Operation Mode at Light Load
100mV peak-to-peak
2A
A standard 127kΩ provides the 9.5A typical current
limit. Considering variation due to tolerance and
temperature, the worst-case required peak current
should be lower than the minimal current limit rating to
ensure that the SGM6611 can regulate the output
voltage. For Boost converter, the worst case occurs at
the lowest VIN and the highest load current.
500kHz
PFM (SGM6611A)
Setting Switching Frequency
A resistor connected between the FSW pin and the GND
pin is used to set the switching frequency. Equation 3
can be used to calculate the resistor value.
C4
0.1μF
L
1.8μH
BOOT
SW
VIN = 3V to 4.35V
R3 (RFREQ
301kΩ
)
C1 (CIN)
22μF
VOUT
GND
FB
VOUT = 9V
FSW
VIN
C2 (COUT
3 × 22μF
)
R1
681kΩ
ON
SGM6611
EN
OFF
R2
107kΩ
COMP
VCC
R5
15kΩ
ILIM
C6
C5
4.7nF
C3
2.2μF
R4 (RILIM
127kΩ
)
Figure 4. SGM6611 Single-Cell Li-Ion Battery to 9V/2A Output Converter
SG Micro Corp
www.sg-micro.com
DECEMBER 2022
11
12.6V, 7A Fully-Integrated
SGM6611
Synchronous Boost Converter
APPLICATION INFORMATION (continued)
For Boost converter, the average inductor current is the
average input current, Equation 6 is used to calculate
the average inductor current:
Setting Output Voltage
The output voltage of SGM6611 is programmed by a
resistive divider connected to FB pin. Use Equation
below to program the output voltage. R1 is the top
feedback resistor and R2 is the bottom feedback
resistor. The recommended value for R2 should be less
than 120kΩ.
VOUT ×IOUT
(6)
IDC
=
V ×η
IN
where VOUT is the output voltage, VIN is the input
voltage, IOUT is the output current, and η is the power
conversion efficiency.
(VOUT - VREF )×R2
(5)
R1 =
VREF
Use Equation 7 below to calculate the inductor current
peak-to-peak ripple.
Inductor Selection
Inductor is an essential element for DC/DC switch
mode power supplies regardless of topology. Inductor
serves as the energy storage element for power
conversion. Inductance and inductor’s saturation
current are the two most important criterions for
inductor selection. For general rule of thumb, the
selected inductance should provide a peak-to-peak
ripple current that is around 30% of the average
inductor current at full load and nominal input voltage.
The average inductor current for a Boost converter is
the input current. The SGM6611 is optimized to work
with inductor values between 0.47μH and 10μH. Lower
inductance part generally has smaller size while
providing sufficient saturation current rating, and larger
inductance provides lower peak-to-peak ripple current,
which helps to maximize the output current delivery.
1
IPP
=
(7)
1
1
L×(
+
)× fSW
VOUT - V
V
IN
IN
where IPP is the inductor peak-to-peak ripple, L is the
inductor value, VOUT is the output voltage, and VIN is the
input voltage, fSW is the switching frequency.
The peak inductor current is the sum of average current
plus half of the peak-to-peak inductor current shown in
Equation 8:
IPP
(8)
ILPEAK = IDC
+
2
The selected inductor should have the saturation
current rating higher than the calculated peak current,
and the calculated peak current should be lower than
the peak current limit of SGM6611.
Equations 6 to 8 show the calculated key parameters
for selecting the inductor. The selected inductor should
meet the worst case that occurs at minimum input
voltage and maximal load current. Margin should be
added to cover inductance de-rating and conversion
efficiency.
Inductor’s DCR, material type, DC/DC’s power FET
resistance and switching speed affect the overall
efficiency of the converter, therefore, careful inductor
selection is critical to ensure good performance.
SG Micro Corp
www.sg-micro.com
DECEMBER 2022
12
12.6V, 7A Fully-Integrated
SGM6611
Synchronous Boost Converter
APPLICATION INFORMATION (continued)
Table 2 lists the recommended inductors for SGM6611.
Table 2. Recommended Inductors
L
(µH)
DCR MAX
(mΩ)
Saturation Current/
Heat Rating Current (A)
Size MAX
Part Number
Manufacturer
(L mm × W mm × H mm3)
CDMC8D28NP-1R8MC
744325180
1.8
1.8
1.5
2.2
2.2
2.2
12.6
3.5
9.4/9.3
9.5 × 8.7 × 3.0
10.5 × 10.2 × 4.7
7.3 × 7.2 × 4.0
7.3 × 7.2 × 4.0
11.2 × 10.3 × 3.0
7.4 × 6.8 × 5.0
Sumida
Wurth-Elektronik
Wurth-Elektronik
Wurth-Elektronik
Cyntec
18/14
14.0/11.0
13.0/9.0
16/13
744311150
7.2
744311220
12.5
9.0
PIMB103T-2R2MS
PIMB065T-2R2MS
12.5
12/10.5
Cyntec
output voltage ripple and load transient response.
Equation 9 is used to estimate the necessary
capacitance to achieve the desired output voltage
ripple, where ΔV is the maximum allowed ripple. Three
22μF ceramic output capacitors are recommended for
SGM6611. Due to the DC de-rating effect of the
ceramic capacitor, margin should be considered, where
higher capacitance improves the transient response.
Input Capacitor Selection
Boost converter’s input capacitor has continuous
current throughout the entire switching cycle. A 10µF
ceramic capacitor is recommended to place between
the VIN pin and GND pin of SGM6611 as close as
possible. For the applications where the SGM6611 is
located far away from the input source, a 47µF or
higher capacitance capacitor is recommended to damp
the wiring harness’s inductance.
(VOUT - VIN_MIN )×IOUT
VRIPPLE _DIS
=
(9)
The VCC pin is the output of the internal regulator, a
1µF ceramic capacitor is recommended to place on the
VCC pin.
VOUT × fSW ×COUT
ESR of the output capacitor affects the output ripple.
Use Equation 10 to calculate the output ripple caused by
ESR.
Output Capacitor Selection
The output capacitors of Boost converter dictate the
VRIPPLE _ESR = ILPEAK ×RESR
(10)
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DECEMBER 2022
13
12.6V, 7A Fully-Integrated
SGM6611
Synchronous Boost Converter
APPLICATION INFORMATION (continued)
S
Loop Stability
(1+
)
GEA ×REA × VREF
2× π× fCOMZ
(16)
The compensation network of SGM6611 is completed
externally to improve design flexibility. The SGM6611
implements a transconductance error amplifier, where
the COMP pin is the output of the internal error
amplifier. A Type-II compensation network consisting of
R5, C5 and C6 connected on COMP pin is used to
configure the loop response of SGM6611.
GC(S) =
×
S
S
VOUT
(1+
)(1+
)
2× π× fCOMP1
2× π× fCOMP2
where GEA is the amplifier’s transconductance, REA is
the amplifier’s output resistance, VREF is the reference
voltage at the FB pin, VOUT is the output voltage, fCOMP1
fCOMP2 are the pole's frequency of the compensation
network, and fCOMZ is the zero's frequency of the
compensation network.
,
The power stage small signal loop response of peak
current control can be modeled by Equation 11.
Once the error amplifier and power stage’s poles and
zeros are determined, the compensation network’s
component value can be designed. The designed loop
crossover frequency fC should be within 1/5 of the
RHPZ frequency (fRHPZ) or 1/10 of the switching
frequency. Higher crossover frequency could improve
the transient response. However, the crossover
frequency should be designed to avoid instability.
S
S
(1+
)(1-
S
)
RO ×(1- D)
2×RSENSE
2 × π× fESRZ
2× π× fRHPZ
GPS(S) =
×
(11)
1+
2× π× fP
where RO is the output load resistance, D is the
switching duty cycle, RSENSE is the equivalent internal
current sense resistor, which is 0.08Ω, fP is the pole's
frequency, fESRZ is the zero's frequency, and fRHPZ is the
right-half-plane-zero's frequency.
With a selected fC, use Equation 17 to calculate the
required R5.
The D, fP, fESRZ and fRHPZ can be calculated by following
equations.
2π× VOUT ×RSENSE × fC ×COUT
(17)
(18)
(19)
R5 =
(1- D)× VREF ×GEA
V ×η
VOUT
IN
(12)
D = 1-
Equation 18 is used to calculate the value of C5.
RO ×COUT
C5 =
where η is the power conversion efficiency.
2R5
2
(13)
fP =
Equation 19 is used to calculate the value of C6.
2π×RO ×COUT
RESR ×COUT
C6 =
where COUT is effective capacitance of the output
capacitor.
R5
For application with only ceramic capacitor, or if the
value of C6 is less than 10pF after calculation, C6 is not
needed.
1
fESRZ
=
(14)
2π×RESR ×COUT
where RESR is the equivalent series resistance of the
output capacitor.
To measure good loop compensation design, greater
than 45° of phase margin and greater than 10dB gain
margin could provide good loop stability and avoid
output voltage ringing during load and line transient.
RO ×(1- D)2
(15)
fRHPZ
=
2π×L
Equation 16 shows the small signal transfer function of
the compensation network.
SG Micro Corp
www.sg-micro.com
DECEMBER 2022
14
12.6V, 7A Fully-Integrated
SGM6611
Synchronous Boost Converter
APPLICATION INFORMATION (continued)
For Boost converter, the output capacitor’s current loop
from VOUT pin back to the GND pin of the device
should be as small as possible. Use small traces and
small copper area of all traces connected to the SW
node to minimize SW node vias and to prevent
radiation of high-frequency noise. It is also
recommended to place a ground plane below the
DC/DC to minimize inter plane coupling.
Layout Guidelines
In addition to component selection, layout is a critical
step to ensure the performance of any switch mode
power supplies. Poor layout could result in system
instability, EMI failure, and device damage. Thus, place
the inductor, input and output capacitors as close to the
IC as possible, and use wide and short traces for
current carrying traces to minimize PCB inductance.
Figure 5. Layout Example
SG Micro Corp
www.sg-micro.com
DECEMBER 2022
15
12.6V, 7A Fully-Integrated
SGM6611
Synchronous Boost Converter
REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
DECEMBER 2022 ‒ REV.A.4 to REV.B
Page
Updated Equations 1 and 3, CFREQ, tDELAY .......................................................................................................................................................9, 11
JULY 2022 ‒ REV.A.3 to REV.A.4
Page
Added SW Node in Absolute Maximum Ratings ................................................................................................................................................2
Updated Detailed Description and Application Information sections..............................................................................................9, 10, 11, 12, 13
OCTOBER 2021 ‒ REV.A.2 to REV.A.3
Page
Updated the Enable and Disable section .............................................................................................................................................................9
Added the Figure 5. Layout Example.................................................................................................................................................................15
APRIL 2021 ‒ REV.A.1 to REV.A.2
Page
Updated Loop Stability section ..........................................................................................................................................................................14
MARCH 2021 ‒ REV.A to REV.A.1
Page
Updated Package Outline Dimensions section ..................................................................................................................................................17
Changes from Original (JULY 2018) to REV.A
Changed from product preview to production data.............................................................................................................................................All
SG Micro Corp
www.sg-micro.com
DECEMBER 2022
16
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
TQFN-2×2.5-11L
E
L1
L1
N10
N7
L
N6
N5
e1
N11
b2
D
b1
b
(0.18)
N4
N1
PIN 1#
b
1/2 e
e
BOTTOM VIEW
TOP VIEW
2.40
0.40
1.00
1.00
2.90
0.38
A
1.00
0.25
0.70
1.80
0.35
A1
A2
0.55
SIDE VIEW
0.50
0.25
RECOMMENDED LAND PATTERN (Unit: mm)
Dimensions In Millimeters
Symbol
MIN
0.700
0.000
MOD
0.750
MAX
0.800
0.050
A
A1
A2
D
0.020
0.203 REF
2.500
2.400
1.900
2.600
2.100
E
2.000
e
0.500 BSC
0.700 BSC
0.250
e1
b
0.200
0.300
0.950
0.300
0.750
0.300
0.400
1.050
0.400
0.850
b1
b2
L
0.350
1.000
0.350
L1
0.800
NOTE: This drawing is subject to change without notice.
SG Micro Corp
TX00150.001
www.sg-micro.com
PACKAGE INFORMATION
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
P2
P0
W
Q2
Q4
Q2
Q4
Q2
Q4
Q1
Q3
Q1
Q3
Q1
Q3
B0
Reel Diameter
P1
A0
K0
Reel Width (W1)
DIRECTION OF FEED
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF TAPE AND REEL
Reel Width
Reel
Diameter
A0
B0
K0
P0
P1
P2
W
Pin1
Package Type
W1
(mm)
(mm) (mm) (mm) (mm) (mm) (mm) (mm) Quadrant
TQFN-2×2.5-11L
7″
9.5
2.20
2.70
0.95
4.0
4.0
2.0
8.0
Q2
SG Micro Corp
TX10000.000
www.sg-micro.com
PACKAGE INFORMATION
CARTON BOX DIMENSIONS
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF CARTON BOX
Length
(mm)
Width
(mm)
Height
(mm)
Reel Type
Pizza/Carton
7″ (Option)
7″
368
442
227
410
224
224
8
18
SG Micro Corp
www.sg-micro.com
TX20000.000
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