SGM7222 [SGMICRO]

High Speed USB 2.0 (480Mbps) DPDT Analog Switch;
SGM7222
型号: SGM7222
厂家: Shengbang Microelectronics Co, Ltd    Shengbang Microelectronics Co, Ltd
描述:

High Speed USB 2.0 (480Mbps) DPDT Analog Switch

光电二极管
文件: 总15页 (文件大小:1221K)
中文:  中文翻译
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SGM7222  
High Speed USB 2.0 (480Mbps)  
DPDT Analog Switch  
GENERAL DESCRIPTION  
FEATURES  
The SGM7222 is a DPDT (double-pole/double-throw)  
analog switch. It operates from a 1.8V to 4.3V single  
power supply. Each switch of the SGM7222 is  
bidirectional, which can ensure that the high speed  
signals have little or no attenuation at the outputs.  
Supply Voltage Range: 1.8V to 4.3V  
On-Resistance: 4.(TYP) at 3V  
High Off-Isolation: -35dB (RL = 50Ω, f = 250MHz)  
Low Crosstalk: -41dB (RL = 50Ω, f = 250MHz)  
Low Bit-to-Bit Skew: 50ps (TYP)  
-3dB Bandwidth: 550MHz  
The SGM7222 features high speed, low bit-to-bit skew  
and wide bandwidth. The high performances make it  
very suitable for multiple applications, such as cellular  
phones and computer peripherals, etc.  
Fast Switching Times:  
tON: 10ns (TYP)  
tOFF: 22ns (TYP)  
Break-Before-Make Switching  
The SGM7222 has a power-off protection. It can  
prevent accidental signal leakage and ensure system  
reliability under power-down and over-voltage  
conditions. In addition, the device is capable of  
withstanding a VBUS short to D+ or D- when the device  
is either powered on or powered off because of the  
special circuitry on the D+/D- pins.  
Rail-to-Rail Input and Output Operation  
Power-Off and Power-On Protections  
-40to +85Operating Temperature Range  
Available in Green MSOP-10, TQFN-1.8×1.4-10L  
and UTQFN-1.8×1.4-10L Packages  
The SGM7222 is available in Green TQFN-1.8×1.4-10L,  
MSOP-10 and UTQFN-1.8 × 1.4-10L packages. It  
operates over an ambient temperature range of -40℃  
to +85.  
APPLICATIONS  
Cellular Phones  
Digital Cameras  
Portable Equipment  
Computer Peripherals  
Battery-Powered Systems  
Routes Signals for USB 2.0 Full-Speed  
SG Micro Corp  
JUNE 2021 – REV. B. 4  
www.sg-micro.com  
High Speed USB 2.0 (480Mbps)  
DPDT Analog Switch  
SGM7222  
PACKAGE/ORDERING INFORMATION  
SPECIFIED  
TEMPERATURE  
RANGE  
PACKAGE  
DESCRIPTION  
ORDERING  
NUMBER  
PACKAGE  
MARKING  
PACKING  
OPTION  
MODEL  
SGM7222  
YMS10  
XXXXX  
MSOP-10  
SGM7222YMS10/TR  
Tape and Reel, 3000  
Tape and Reel, 3000  
Tape and Reel, 3000  
-40to +85℃  
-40to +85℃  
-40to +85℃  
SGM7222  
TQFN-1.8×1.4-10L  
UTQFN-1.8×1.4-10L  
SGM7222YWQ10/TR  
SGM7222YUWQ10/TR  
7222  
CAA  
XXX  
MARKING INFORMATION  
NOTE: XXX = Date Code and Trace Code. XXXXX = Date Code and Vendor Code.  
MSOP-10  
UTQFN-1.8×1.4-10L  
Serial Number  
Y Y Y  
X X X  
X X X X X  
Vendor Code  
Date Code - Week  
Date Code - Year  
Trace Code  
Date Code - Year  
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If  
you have additional comments or questions, please contact your SGMICRO representative directly.  
OVERSTRESS CAUTION  
ABSOLUTE MAXIMUM RATINGS  
Stresses beyond those listed in Absolute Maximum Ratings  
may cause permanent damage to the device. Exposure to  
absolute maximum rating conditions for extended periods  
may affect reliability. Functional operation of the device at any  
conditions beyond those indicated in the Recommended  
Operating Conditions section is not implied.  
V+ to GND ..............................................................0V to 4.6V  
Analog, Digital Voltage Range................ -0.3V to (V+) + 0.3V  
Continuous Current HSDn or Dn ..............................±100mA  
Peak Current HSDn or Dn ........................................±150mA  
Junction Temperature.................................................+150℃  
Storage Temperature Range .......................-65to +150℃  
Lead Temperature (Soldering, 10s)............................+260℃  
ESD Susceptibility  
ESD SENSITIVITY CAUTION  
HBM.............................................................................8000V  
MM.................................................................................400V  
This integrated circuit can be damaged if ESD protections are  
not considered carefully. SGMICRO recommends that all  
integrated circuits be handled with appropriate precautions.  
Failure to observe proper handling and installation procedures  
can cause damage. ESD damage can range from subtle  
performance degradation tocomplete device failure. Precision  
integrated circuits may be more susceptible to damage  
because even small parametric changes could cause the  
device not to meet the published specifications.  
RECOMMENDED OPERATING CONDITIONS  
Operating Temperature Range.......................-40to +85℃  
DISCLAIMER  
SG Micro Corp reserves the right to make any change in  
circuit design, or specifications without prior notice.  
SG Micro Corp  
www.sg-micro.com  
JUNE 2021  
2
High Speed USB 2.0 (480Mbps)  
DPDT Analog Switch  
SGM7222  
PIN CONFIGURATIONS  
(TOP VIEW)  
(TOP VIEW)  
HSD1- HSD2-  
1
2
3
4
5
10  
9
S
HSD1+  
HSD2+  
D+  
V+  
6
7
OE  
D-  
5
4
3
OE  
V+  
S
8
9
GND  
D+  
8
HSD1-  
HSD2-  
D-  
10  
7
1
HSD1+ HSD2+  
2
6
GND  
TQFN-1.8×1.4-10L/UTQFN-1.8×1.4-10L  
MSOP-10  
PIN DESCRIPTION  
PIN  
NAME  
FUNCTION  
TQFN-1.8×1.4-10L/  
UTQFN-1.8×1.4-10L  
MSOP-10  
1, 2  
3, 5  
7, 6  
4
2, 3  
4, 6  
8, 7  
5
HSD1+, HSD2+  
D+, D-  
Data Ports.  
Ground.  
HSD1-, HSD2-  
GND  
8
9
Enable Control Pin.  
Positive Power Supply.  
Select Input Pin.  
OE  
V+  
S
9
10  
1
10  
FUNCTION TABLE  
HSD1+  
HSD1-  
HSD2+  
HSD2-  
S
OE  
0
0
1
0
1
×
ON  
OFF  
ON  
OFF  
OFF  
OFF  
NOTE: Switches shown for logic "0" input.  
SG Micro Corp  
JUNE 2021  
www.sg-micro.com  
3
High Speed USB 2.0 (480Mbps)  
DPDT Analog Switch  
SGM7222  
ELECTRICAL CHARACTERISTICS  
(V+ = 1.8V to 4.3V, GND = 0V, VIH = 1.6V, VIL = 0.5V, Full = -40to +85. Typical values are at V+ = 3.3V, TA = +25, unless  
otherwise noted.)  
PARAMETER  
SYMBOL  
CONDITIONS  
TEMP  
MIN  
TYP  
MAX UNITS  
Analog Switch  
Analog I/O Voltage  
(HSD1+, HSD1-, HSD2+, HSD2-)  
VIS  
Full  
0
V+  
V
4.5  
0.15  
1.5  
8.5  
9
+25  
Full  
V+ = 3V, VIS = 0V to 0.4V, ID = 8mA,  
Test Circuit 1  
On-Resistance  
RON  
Ω
0.6  
1.6  
2.0  
2.6  
+25℃  
Full  
On-Resistance Match Between  
Channels  
V+ = 3V, VIS = 0V to 0.4V, ID = 8mA,  
Test Circuit 1  
Ω
Ω
RON  
+25℃  
Full  
V+ = 3V, VIS = 0V to 1V, ID = 8mA,  
Test Circuit 1  
On-Resistance Flatness  
RFLAT(ON)  
V+ = 0V, VD = 0V to 3.6V,  
VS , VOE = 0V or 3.6V  
Power Off Leakage Current (D+, D-)  
Increase in I+ per Control Voltage  
Source Off Leakage Current  
IOFF  
ICCT  
Full  
Full  
Full  
1
5
1
μA  
μA  
μA  
V+ = 3.6V, VS or VOE = 2.6V  
V+ = 3.6V, VIS = 3.3V/0.3V,  
VD = 0.3V/ 3.3V  
IHSD2(OFF) IHSD1(OFF)  
V+ = 3.6V, VIS = 3.3V/0.3V,  
VD = 3.3V/0.3V or floating  
Channel On Leakage Current  
IHSD2(ON), IHSD1(ON)  
Full  
1
μA  
Digital Inputs  
Input High Voltage  
Input Low Voltage  
Input Leakage Current  
Dynamic Characteristics  
Turn-On Time  
VIH  
VIL  
IIN  
Full  
Full  
Full  
1.6  
V
V
0.5  
1
V+ = 3V, VS , VOE = 0V or V+  
μA  
tON  
10  
22  
ns  
ns  
+25℃  
+25℃  
VIS = 0.8V, RL = 50Ω, CL = 10pF,  
Test Circuit 2  
Turn-Off Time  
tOFF  
V
IS = 0.8V, RL = 50Ω, CL = 10pF,  
Break-Before-Make Time Delay  
Propagation Delay  
tD  
4
ns  
ns  
dB  
+25℃  
+25℃  
+25℃  
Test Circuit 3  
tPD  
RL = 50Ω, CL = 10pF  
0.3  
-35  
Signal = 0dBm, RL = 50Ω,  
f = 250MHz, Test Circuit 4  
Off Isolation  
OISO  
Signal = 0dBm, RL = 50Ω,  
f = 250MHz, Test Circuit 5  
Channel-to-Channel Crosstalk  
XTALK  
-41  
dB  
+25℃  
Signal = 0dBm, RL = 50Ω, CL = 5pF,  
Test Circuit 6  
-3dB Bandwidth  
BW  
tSKEW  
Q
550  
0.05  
11  
MHz  
ns  
+25℃  
+25℃  
+25℃  
Channel-to-Channel Skew  
RL = 50Ω, CL = 10pF  
Charge Injection Select Input to  
Common I/O  
VG = GND, CL = 1nF, RG = 0Ω,  
Q = CL × VOUT, Test Circuit 7  
pC  
HSD+, HSD-, D+, D-  
On Capacitance  
CON  
6.5  
pF  
+25℃  
Power Requirements  
Power Supply Range  
Power Supply Current  
V+  
I+  
Full  
Full  
1.8  
4.3  
1
V
V+ = 3V, VS , VOE = 0V or V+  
μA  
SG Micro Corp  
www.sg-micro.com  
JUNE 2021  
4
High Speed USB 2.0 (480Mbps)  
DPDT Analog Switch  
SGM7222  
TYPICAL PERFORMANCE CHARACTERISTICS  
Crosstalk vs. Frequency  
Off-Isolation vs. Frequency  
20  
0
20  
0
-20  
-20  
-40  
-40  
OFF-ISOLATION  
CROSSTALK  
-60  
-60  
-80  
-80  
-100  
-120  
-140  
-100  
-120  
-140  
V+ = +3V  
V+ = +3V  
TA = +25℃  
TA = +25℃  
0.1  
1
10  
Frequency (MHz)  
100  
1000  
0.1  
1
10  
100  
1000  
Frequency (MHz)  
SG Micro Corp  
www.sg-micro.com  
JUNE 2021  
5
High Speed USB 2.0 (480Mbps)  
DPDT Analog Switch  
SGM7222  
TEST CIRCUITS  
8mA  
V1  
HSDn  
Dn  
VIS  
GND  
R
ON = V1/8mA  
Test Circuit 1. On-Resistance  
V+  
V+  
tR < 5ns  
tF < 5ns  
0.1μF  
V+  
50%  
50%  
VS  
0V  
HSDn  
Dn  
VOUT  
90%  
90%  
RL  
CL  
VOUT  
0V  
VS  
GND  
tOFF  
tON  
Test Circuit 2. Switching Times (tON, tOFF  
)
V+  
V
tR < 5ns  
tF < 5ns  
+
0.1μF  
V+  
VS  
50%  
HSD1n  
HSD2n  
0V  
Dn  
VOUT  
90%  
VOUT  
0V  
RL  
CL  
VS  
GND  
tD  
Test Circuit 3. Break-Before-Make Time (tD)  
SG Micro Corp  
www.sg-micro.com  
JUNE 2021  
6
High Speed USB 2.0 (480Mbps)  
DPDT Analog Switch  
SGM7222  
TEST CIRCUITS (continued)  
V+  
0.1μF  
V+  
VIN  
50Ω  
HSDn  
S
Dn  
VOUT  
Network  
Analyzer  
50Ω  
GND  
CL  
Test Circuit 4. Off Isolation  
V+  
0.1μF  
V+  
Dn  
HSDn  
VIN  
50Ω  
CL  
RL  
HSDn  
S
Dn  
Network  
Analyzer  
VOUT  
50Ω  
RL  
CL  
GND  
Channel-to-Channel Crosstalk = -20 log (VHSDn/VOUT  
)
Test Circuit 5. Channel-to-Channel Crosstalk  
SG Micro Corp  
www.sg-micro.com  
JUNE 2021  
7
High Speed USB 2.0 (480Mbps)  
DPDT Analog Switch  
SGM7222  
TEST CIRCUITS (continued)  
V+  
0.1μF  
V+  
VIN  
50Ω  
HSDn  
Dn  
S
VOUT  
Network  
Analyzer  
50Ω  
GND  
CL  
Test Circuit 6. -3dB Bandwidth  
V+  
0.1μF  
V
+
V+  
VS  
tR < 5ns  
tF < 5ns  
RS  
0V  
HSDn  
S
Dn  
VOUT  
VOUT  
ΔVOUT  
CL  
GND  
VS  
Q = ΔVOUT × CL  
Test Circuit 7. Charge Injection (Q)  
SG Micro Corp  
www.sg-micro.com  
JUNE 2021  
8
High Speed USB 2.0 (480Mbps)  
DPDT Analog Switch  
SGM7222  
APPLICATION INFORMATION  
Meet the Short Requirements of USB 2.0  
VBUS  
According to Section 7.1.1 of the USB 2.0 specification,  
USB devices must be able to withstand a VBUS short to  
D+ or D- when powered on or off. The SGM7222 can  
fully meet these two requirements  
Power-On Protection  
The USB 2.0 specification requires USB device to  
ensure that the device will not be damaged even if VBUS  
short-circuit occurs during data transmission. Therefore,  
under over-voltage conditions, the SGM7222 will limit  
the current flowing back to the V+ track, and the current  
will not exceed the safe operating range.  
Power-Off Protection  
USB2.0 Signal Quality Compliance Test  
Results  
The results of USB eye map test are shown in Figure 1  
and Figure 2. Table 1 gives a summary of the USB  
tests.  
When D+ or D- is shorted to VBUS, there is a special  
protection circuit inside the SGM7222, so that the  
device will not be damaged within 24 hours. In case of  
power-down or over-voltage event, the protection  
circuit can prevent the leakage signal on D+/D- pins to  
ensure the reliability of the system.  
Figure 2. High Speed Signal Quality Eye Diagram Test  
(V+ = 3.3V)  
Figure 1. Waveform Plot  
Table 1. Summary of the USB 2.0 Signal Quality Tests Results  
Measurement  
Standard  
Deviation  
MIN  
MAX  
Mean  
pk-pk  
RMS  
Population  
Status  
Pass  
Name  
Eye Diagram Test  
-
-
-
-
-
-
-
469.9358  
Mbps  
493.4413  
Mbps  
479.9700  
Mbps  
0.0000  
bps  
5.586580  
Mbps  
480.4200  
Mbps  
Signal Rate  
512  
Pass  
EOP Width  
-
-
-
-
16.58804ns  
7.961762  
-
-
-
-
-
-
1
1
Pass  
Pass  
EOP Width (Bits)  
1.064231  
kV/μs  
1.063269  
kV/μs  
1.228955  
kV/μs  
1.227966  
kV/μs  
1.143136  
kV/μs  
1.136558  
kV/μs  
164.7235  
V/μs  
164.6970  
V/μs  
35.43800  
V/μs  
31.49494  
V/μs  
1.143680  
kV/μs  
1.136990  
kV/μs  
Falling Edge Rate  
Rising Edge Rate  
107  
108  
Pass  
Pass  
Additional Information:  
Consecutive Jitter range: -82.97ps to 72.87ps RMS Jitter 35.08ps  
KJ Paired Jitter range: -25.05ps to 23.05ps RMS Jitter 9.259ps  
JK Paired Jitter range: -20.96ps to 30.12ps RMS Jitter 9.734ps  
Rising Edge Rate: 1.136558kV/μs (Equivalent Rise Time = 563.10ps)  
Falling Edge Rate: 1.143136kV/μs (Equivalent Fall Time = 559.86ps)  
SG Micro Corp  
www.sg-micro.com  
JUNE 2021  
9
 
 
High Speed USB 2.0 (480Mbps)  
DPDT Analog Switch  
SGM7222  
REVISION HISTORY  
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.  
JUNE 2021 ‒ REV.B.3 to REV.B.4  
Page  
Updated Package Outline Dimensions section.......................................................................................................................................................13  
APRIL 2019 ‒ REV.B.2 to REV.B.3  
Page  
Updated Package/Ordering Information section .......................................................................................................................................................2  
MAY 2014 ‒ REV.B.1 to REV.B.2  
Page  
Updated Absolute Maximum Ratings section ...........................................................................................................................................................2  
JANUARY 2013 ‒ REV.B to REV.B.1  
Page  
Added Recommended Land Pattern section ............................................................................................................................................. 12, 13, 14  
Added Tape and Reel Information section....................................................................................................................................................... 15, 16  
MAY 2011 ‒ REV.A.3 to REV.B  
Page  
Updated package option .........................................................................................................................................................................................All  
MARCH 2011 ‒ REV.A.2 to REV.A.3  
Page  
Updated Package Outline Dimensions section.......................................................................................................................................... 12, 13, 14  
FEBRUARY 2010 ‒ REV.A.1 to REV.A.2  
Page  
Updated Test Circuits section ...............................................................................................................................................................................6, 8  
SEPTEMBER 2009REV.A to REV.A.1  
Page  
Added new package................................................................................................................................................................................................All  
Updated Absolute Maximum Ratings section ...........................................................................................................................................................2  
Changes from Original (DECEMBER 2008) to REV.A  
Page  
Changed from product preview to production data .................................................................................................................................................All  
SG Micro Corp  
www.sg-micro.com  
JUNE 2021  
10  
PACKAGE INFORMATION  
PACKAGE OUTLINE DIMENSIONS  
TQFN-1.8×1.4-10L  
NOTE: All linear dimensions are in millimeters.  
SG Micro Corp  
TX00074.000  
www.sg-micro.com  
PACKAGE INFORMATION  
PACKAGE OUTLINE DIMENSIONS  
UTQFN-1.8×1.4-10L  
D
L
e
PIN 1# IDENTIFICATION  
CHAMFER 0.100  
× 45°  
E
e1  
L1  
N10  
N1  
b
DETAIL A  
PIN 1#  
TOP VIEW  
BOTTOM VIEW  
2.100  
0.563  
A
C
SEATING  
PLANE  
A2  
A1  
eee C  
1.700  
SIDE VIEW  
0.663  
L2  
0.225  
0.40  
0.20  
ALTERNATE A-1 ALTERNATE A-2  
DETAIL A  
ALTERNATE TERMINAL  
CONSTRUCTION  
RECOMMENDED LAND PATTERN (Unit: mm)  
Dimensions In Millimeters  
Symbol  
MIN  
MOD  
-
MAX  
0.600  
0.050  
A
A1  
A2  
b
0.450  
0.000  
-
0.152 REF  
0.200  
1.800  
1.400  
0.400 TYP  
0.800 REF  
0.400  
0.500  
-
0.150  
1.750  
1.350  
0.250  
1.850  
1.450  
D
E
e
e1  
L
0.350  
0.450  
0.000  
-
0.450  
0.550  
0.100  
-
L1  
L2  
eee  
0.080  
NOTE: This drawing is subject to change without notice.  
SG Micro Corp  
TX00091.001  
www.sg-micro.com  
PACKAGE INFORMATION  
PACKAGE OUTLINE DIMENSIONS  
MSOP-10  
b
E1  
E
4.8  
1.02  
0.3  
e
0.5  
RECOMMENDED LAND PATTERN (Unit: mm)  
D
L
A
A1  
c
θ
A2  
Dimensions  
In Millimeters  
Dimensions  
In Inches  
Symbol  
MIN  
MAX  
1.100  
0.150  
0.950  
0.280  
0.230  
3.100  
3.100  
5.050  
MIN  
MAX  
0.043  
0.006  
0.037  
0.011  
0.009  
0.122  
0.122  
0.199  
A
A1  
A2  
b
0.820  
0.020  
0.750  
0.180  
0.090  
2.900  
2.900  
4.750  
0.032  
0.001  
0.030  
0.007  
0.004  
0.114  
0.114  
0.187  
c
D
E
E1  
e
0.500 BSC  
0.020 BSC  
L
0.400  
0°  
0.800  
6°  
0.016  
0°  
0.031  
6°  
θ
SG Micro Corp  
www.sg-micro.com  
TX00015.000  
PACKAGE INFORMATION  
TAPE AND REEL INFORMATION  
REEL DIMENSIONS  
TAPE DIMENSIONS  
P2  
P0  
W
Q2  
Q4  
Q2  
Q4  
Q2  
Q4  
Q1  
Q3  
Q1  
Q3  
Q1  
Q3  
B0  
Reel Diameter  
P1  
A0  
K0  
Reel Width (W1)  
DIRECTION OF FEED  
NOTE: The picture is only for reference. Please make the object as the standard.  
KEY PARAMETER LIST OF TAPE AND REEL  
Reel Width  
Reel  
Diameter  
A0  
B0  
K0  
P0  
P1  
P2  
W
Pin1  
Package Type  
W1  
(mm)  
(mm) (mm) (mm) (mm) (mm) (mm) (mm) Quadrant  
TQFN-1.8×1.4-10L  
UTQFN-1.8×1.4-10L  
MSOP-10  
7″  
7″  
9.0  
9.0  
1.75  
1.75  
5.20  
2.10  
2.10  
3.30  
1.00  
0.70  
1.20  
4.0  
4.0  
4.0  
4.0  
4.0  
8.0  
2.0  
2.0  
2.0  
8.0  
8.0  
Q1  
Q1  
Q1  
13″  
12.4  
12.0  
SG Micro Corp  
TX10000.000  
www.sg-micro.com  
PACKAGE INFORMATION  
CARTON BOX DIMENSIONS  
NOTE: The picture is only for reference. Please make the object as the standard.  
KEY PARAMETER LIST OF CARTON BOX  
Length  
(mm)  
Width  
(mm)  
Height  
(mm)  
Reel Type  
Pizza/Carton  
7″ (Option)  
368  
442  
386  
227  
410  
280  
224  
224  
370  
8
18  
5
7″  
13″  
SG Micro Corp  
www.sg-micro.com  
TX20000.000  

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