SL28541BZC-2 [SILICON]
Processor Specific Clock Generator, 400MHz, CMOS, PDSO56, HALOGEN FREE AND ROHS COMPLIANT, MO-153EE, TSSOP-56;
| 型号： | SL28541BZC-2 |
| 厂家： | 
SILICON |
| 描述： | Processor Specific Clock Generator, 400MHz, CMOS, PDSO56, HALOGEN FREE AND ROHS COMPLIANT, MO-153EE, TSSOP-56 时钟 光电二极管 外围集成电路 晶体 |
| 文件： | 总28页 (文件大小：234K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SL28541-2
Clock Generator for Intel®Mobile Chipset
• 33 MHz PCI clocks
Features
• 27 MHz Video clocks
• Intel® CK505 Rev. 1.0 Compliant
• Buffered Reference Clock 14.318 MHz
• Low power push-pull type differential output buffers
• Integrated voltage regulator
• 14.318 MHz Crystal Input or Clock Input
• Low-voltage frequency select input
• I2C support with readback capabilities
• Integrated resistors on differential clocks
• Scalable low voltage VDD_IO (1.05V to 3.3V)
• Ideal Lexmark Spread Spectrum profile for maximum
electromagnetic interference (EMI) reduction
• 8-step programmable drive strength for single-ended
clocks
• Industrial Temperature -40°C to 85°C
• 3.3V Power supply
• Differential CPU clocks with selectable frequency
• 100 MHz Differential SRC clocks
• 100 MHz Differential LCD clock
• 96 MHz Differential DOT clock
• 48 MHz USB clock
• 56-pin TSSOP packages
CPU SRC PCI REF DOT96 USB_48 LCD 27M
x2 / x3 x5/9
x6
x 1
x 1
x 1
x1
x2
Pin Configurations
Block Diagram
1
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
PCI0/OE#_0/2_A
VDD_PCI
SCLK
2
SDATA
3
PCI1/OE#_0/2_A
PCI2/TME
REF0/FSC/TEST_SEL
VDD_REF
XIN/CLKIN
XOUT
4
5
PCI3
6
PCI4/GCLK_SEL
PCIF0/ITP_EN
VSS_PCI
7
VSS_REF
8
FSB/TEST_MODE
CKPWRGD/PD#
VDD_CPU
CPU0
9
VDD_48
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
USB_48/ FSA
VSS_48
VDD_IO
CPU#0
SRC0/DOT96
SRC0#/DOT96#
VSS_IO
VSS_CPU
CPU1
CPU1#
VDD_PLL3
VDD_CPU_IO
NC
SRC1/LCD100/27M_NSS
SRC1#/LCD100#/27M_SS
VSS_PLL3
SRC8/ CPU2_ITP
SRC8#/ CPU2_ITP#
VDD_SRC_IO
SRC7/OE#_8
SRC7#/OE#_6
VSS_SRC
VDD_PLL3_IO
SRC2/SATA
SRC2#/SATA#
VSS_SRC
SRC3/OE#_0/2_B
SRC3#/OE#_1/4_B
VDD_SRC_IO
SRC4
SRC6
SRC#
VDD_SRC
PCI_STP#
CPU_STP#
SRC4#
........................ DOC #: SP-AP-0064 (Rev. AB) Page 1 of 28
400 West Cesar Chavez, Austin, TX 78701
1+(512) 416-8500 1+(512) 416-9669
www.silabs.com
SL28541-2
56 TSSOP Pin Definition
Pin No.
Name
Type
Description
1
PCI0/OE#_0/2_A
I/O, SE 3.3V, 33MHz clock/3.3V OE# Input mappable via I2C to control either SRC0 or
SRC2. (Default PCI0, 33MHz clock)
2
3
VDD_PCI
PWR 3.3V Power supply for PCI PLL.
PCI1/OE#_1/4_A
I/O, SE 3.3V, 33MHz clock/3.3V OE# Input mappable via I2C to control either SRC1 or
SRC4. (Default PCI1, 33MHz clock)
4
PCI2/TME
I/O, SE 3.3V tolerance input for overclocking enable pin/3.3V, 33MHz clock.
(Refer to DC Electrical Specifications table for Vil_FS and Vih_FS specifications)
5
6
PCI3
O, SE, 33 MHz clock.
PCI4 / GCLK_SEL
I/O, SE 33 MHz clock output/3.3V-tolerant input for selecting graphic clock source on pin
13, 14, 17and 18
Sampled on CKPWRGD assertion
GCLK_SEL
Pin13
DOT96T DOT96C SRC1T/LCD_100T SRC1C/LCD_100C
SRCT0 SRCC0 27M_NSS 27M_SS
Pin14
Pin17
Pin 18
0
1
7
PCIF_0/ITP_EN
I/O, SE 3.3V LVTTL input to enable SRC8 or CPU2_ITP/33 MHz clock output. (sampled
on the CK_PWRGD assertion)
1 = CPU2_ITP, 0 = SRC8
8
VSS_PCI
GND Ground for outputs.
9
VDD_48
PWR 3.3V Power supply for outputs and PLL.
10
USB_48/FSA
I/O
3.3V tolerant input for CPU frequency selection/fixed 3.3V, 48MHz clock output.
(Refer to DC Electrical Specifications table for Vil_FS and Vih_FS specifications)
11
12
13
VSS_48
GND Ground for outputs.
VDD_IO
PWR 0.7V Power supply for outputs.
SRC0/DOT96
O, DIF 100MHz Differential serial reference clocks/Fixed 96MHz clock output.
(Selected via I2C default is SRC0)
14
SRC0#/DOT96#
O, DIF 100MHz Differential serial reference clocks/Fixed 96MHz clock output.
(Selected via I2C default is SRC0)
15
16
17
VSS_IO
GND Ground for PLL2.
VDD_PLL3
PWR 3.3V Power supply for PLL3
SRC1/LCD100/27_NSS O, DIF, True 100 MHz differential serial reference clock output/True 100 MHz LCD video
SE
clock output / Non-spread 27-MHz video clock output.
Selected via GCLK_SEL at CKPWRGD assertion.
18
SRC1#/LCD100#/27_SS O, DIF, Complementary 100 MHz differential serial reference clock output/Complementary
SE
100 MHz LCD video clock output /Spread 27 MHz video clock output.
Selected via GCLK_SEL at CKPWRGD assertion.
19
20
21
22
23
24
VSS_PLL3
GND Ground for PLL3.
VDD_PLL3_IO
SRC2/SATA
PWR IO Power supply for PLL3 outputs.
O, DIF 100MHz Differential serial reference clocks.
O, DIF 100MHz Differential serial reference clocks.
GND Ground for outputs.
SRC2#/SATA#
VSS_SRC
SRC3/OE#_0/2_B
I/O, 100MHz Differential serial reference clocks / 3.3V OE#_0/2_B, input, mappable via
Dif
I/O, 100MHz Differential serial reference clocks / 3.3V OE#_1/4_B input, mappable via
Dif I2C to control either SRC1 or SRC4. (Default SRC3, 100MHz clock)
PWR IO power supply for SRC outputs.
I2C to control either SRC0 or SRC2. (Default SRC3, 100MHz clock)
25
26
SRC3#OE#_1/4_B
VDD_SRC_IO
........................ DOC #: SP-AP-0064 (Rev. AB) Page 2 of 28
SL28541-2
56 TSSOP Pin Definition (continued)
Pin No.
27
Name
Type
Description
SRC4
O, DIF 100MHz Differential serial reference clocks.
O, DIF 100MHz Differential serial reference clocks.
28
SRC4#
29
CPU_STP#
PCI_STP#
VDD_SRC
SRC6#
I
I
3.3V tolerant input for stopping CPU outputs
30
3.3V tolerant input for stopping PCI and SRC outputs
31
PWR 3.3V Power supply for SRC PLL.
O, DIF 100MHz Differential serial reference clocks.
O, DIF 100MHz Differential serial reference clocks.
GND Ground for outputs.
32
33
SRC6
34
VSS_SRC
SRC7#/OE#_6
35
I/O, 100MHz Differential serial reference clocks/3.3V OE#6 Input controlling SRC6.
Dif (Default SRC7, 100MHz clock).
36
SRC7/OE#_8
I/O, 100MHz Differential serial reference clocks/3.3V OE#8 Input controlling SRC8.
Dif (Default SRC7, 100MHz clock).
37
38
VDD_SRC_IO
PWR 0.7V power supply for SRC outputs.
SRC8#/CPU2#_ITP#
O, DIF Selectable differential CPU or SRC clock output. ITP_EN = 0 at CKPWRGD
assertion = SRC8
ITP_EN = 1 @ CKPWRGD assertion = CPU2
(Note: CPU2 is an iAMT clock in iAMT mode depending on the configuration set in Byte 11
Bit3:2)
39
SRC8/CPU2_ITP
O, DIF Selectable differential CPU or SRC clock output. ITP_EN = 0 at CKPWRGD
assertion = SRC8
ITP_EN = 1 @ CKPWRGD assertion = CPU2
(Note: CPU2 is an iAMT clock in iAMT mode depending on the configuration set in Byte 11
Bit3:2)
40
41
42
NC
NC
No Connect
VDD_CPU_IO
CPU1#
PWR IO Power supply for CPU outputs.
O, DIF Differential CPU clock outputs. (Note: CPU1 is an iAMT clock in iAMT mode depending
on the configuration set in Byte 11 Bit3:2)
43
CPU1
O, DIF Differential CPU clock outputs. (Note: CPU1 is an iAMT clock in iAMT mode depending
on the configuration set in Byte 11 Bit3:2)
44
45
46
47
48
VSS_CPU
CPU#0
GND Ground for outputs.
O, DIF Differential CPU clock outputs.
O, DIF Differential CPU clock outputs.
PWR 3.3V Power supply for CPU PLL.
CPU0
VDD_CPU
CKPWRGD/PD#
I
3.3V LVTTL input. This pin is a level sensitive strobe used to latch the FS_A, FS_B,
FS_C, FS_D, SRC5_SEL, and ITP_EN.
After CKPWRGD (active HIGH) assertion, this pin becomes a real-time input for
asserting power down (active LOW).
49
FSB/TEST_MODE
I
3.3V tolerant input for CPU frequency selection.
Selects Ref/N or Tri-state when in test mode
0 = Tri-state, 1 = Ref/N.
Refer to DC Electrical Specifications table for Vil_FS and Vih_FS specifications.
50
51
52
53
VSS_REF
XOUT
GND Ground for outputs.
O, SE 14.318MHz Crystal output. (Float XOUT if using CLKIN)
XIN/CLKIN
VDD_REF
I
14.318MHz Crystal input or 3.3V, 14.318MHz input clock signal.
PWR 3.3V Power supply for outputs and also maintains SMBUS registers during
power-down.
54
55
REF0/FSC/TEST_SEL
SMB_DATA
I/O
3.3V tolerant input for CPU frequency selection/fixed 14.318MHz clock output.
Selects test mode if pulled to VIHFS_C when CKPWRGD is asserted HIGH. Refer
to DC Electrical Specifications table for VILFS_C, VIMFS_C, VIHFS_C specifications.
I/O
SMBus compatible SDATA.
........................ DOC #: SP-AP-0064 (Rev. AB) Page 3 of 28
SL28541-2
56 TSSOP Pin Definition (continued)
Pin No.
Name
SMB_CLK
Type
Description
56
I
SMBus compatible SCLOCK.
Table 1. Frequency Select Pin (FSA, FSB and FSC)
FSC
0
FSB
0
FSA
0
CPU
SRC
PCIF/PCI
27MHz
REF
DOT96
USB
266 MHz
133 MHz
200 MHz
166 MHz
333 MHz
100 MHz
400 MHz
0
0
1
0
1
0
0
1
1
100 MHz
33 MHz
27 MHz
14.318 MHz
Reserved
96 MHz
48 MHz
1
0
0
1
0
1
1
1
0
1
1
1
Reserved Reserved Reserved Reserved
Reserved Reserved
their default setting at power-up. The use of this interface is
optional. Clock device register changes are normally made at
system initialization, if any are required. The interface cannot
be used during system operation for power management
functions.
Frequency Select Pin (FSA, FSB and FSC)
Apply the appropriate logic levels to FSA, FSB, and FSC
inputs before CKPWRGD assertion to achieve host clock
frequency selection. When the clock chip sampled HIGH on
CKPWRGD and indicates that VTT voltage is stable then FSA,
FSB, and FSC input values are sampled. This process
employs a one-shot functionality and once the CKPWRGD
sampled a valid HIGH, all other FSA, FSB, FSC, and
CKPWRGD transitions are ignored except in test mode.
Data Protocol
The clock driver serial protocol accepts byte write, byte read,
block write, and block read operations from the controller. For
block write/read operation, access the bytes in sequential
order from lowest to highest (most significant bit first) with the
ability to stop after any complete byte is transferred. For byte
write and byte read operations, the system controller can
access individually indexed bytes. The offset of the indexed
byte is encoded in the command code described in Table 2.
Serial Data Interface
To enhance the flexibility and function of the clock synthesizer,
a two-signal serial interface is provided. Through the Serial
Data Interface, various device functions, such as individual
clock output buffers are individually enabled or disabled. The
registers associated with the Serial Data Interface initialize to
The block write and block read protocol is outlined in Table 3
while Table 4 outlines byte write and byte read protocol. The
slave receiver address is 11010010 (D2h).
.
Table 2. Command Code Definition
Bit
Description
0 = Block read or block write operation, 1 = Byte read or byte write operation
7
(6:0) Byte offset for byte read or byte write operation. For block read or block write operations, these bits should be '0000000'
Table 3. Block Read and Block Write Protocol
Block Write Protocol
Description
Block Read Protocol
Description
Bit
1
Bit
1
Start
Start
8:2
9
Slave address–7 bits
Write
8:2
9
Slave address–7 bits
Write
10
Acknowledge from slave
Command Code–8 bits
Acknowledge from slave
Byte Count–8 bits
10
Acknowledge from slave
Command Code–8 bits
Acknowledge from slave
Repeat start
18:11
19
18:11
19
27:20
28
20
Acknowledge from slave
27:21
Slave address–7 bits
........................ DOC #: SP-AP-0064 (Rev. AB) Page 4 of 28
SL28541-2
Table 3. Block Read and Block Write Protocol (continued)
Block Write Protocol
Block Read Protocol
Description
Bit
36:29
37
Description
Bit
28
Data byte 1–8 bits
Read = 1
Acknowledge from slave
Data byte 2–8 bits
29
Acknowledge from slave
Byte Count from slave–8 bits
Acknowledge
45:38
46
37:30
38
Acknowledge from slave
Data Byte /Slave Acknowledges
Data Byte N–8 bits
....
46:39
47
Data byte 1 from slave–8 bits
Acknowledge
....
....
Acknowledge from slave
Stop
55:48
56
Data byte 2 from slave–8 bits
Acknowledge
....
....
Data bytes from slave / Acknowledge
Data Byte N from slave–8 bits
NOT Acknowledge
....
....
....
Stop
Table 4. Byte Read and Byte Write Protocol
Byte Write Protocol
Byte Read Protocol
Description
Bit
1
Description
Bit
1
Start
Start
8:2
9
Slave address–7 bits
Write
8:2
9
Slave address–7 bits
Write
10
Acknowledge from slave
Command Code–8 bits
Acknowledge from slave
Data byte–8 bits
10
Acknowledge from slave
Command Code–8 bits
Acknowledge from slave
Repeated start
18:11
19
18:11
19
27:20
28
20
Acknowledge from slave
Stop
27:21
28
Slave address–7 bits
Read
29
29
Acknowledge from slave
Data from slave–8 bits
NOT Acknowledge
Stop
37:30
38
39
........................ DOC #: SP-AP-0064 (Rev. AB) Page 5 of 28
SL28541-2
Control Registers
Byte 0: Control Register 0
Bit
7
@Pup
HW
HW
HW
0
Name
FS_C
Description
CPU Frequency Select Bit, set by HW
6
FS_B
CPU Frequency Select Bit, set by HW
CPU Frequency Select Bit, set by HW
5
FS_A
4
iAMT_EN
Set via SMBus or by combination of PWRDWN, CPU_STP, and PCI_STP
0 = Legacy Mode, 1 = iAMT Enabled
3
2
0
0
RESERVED
RESERVED
SRC_Main_SEL
Select source for SRC clock
0 = SRC_MAIN = PLL1, PLL3_CFG Table applies
1 = SRC_MAIN = PLL3, PLL3_CFG Table does not apply
1
0
0
1
SATA_SEL
Select source of SATA clock
0 = SATA = SRC_MAIN, 1= SATA = PLL2
PD_Restore
Save configuration when PD# is asserted
0 = Config. cleared, 1 = Config. saved
Byte 1: Control Register 1
Bit
@Pup
Name
Description
7
0
SRC0_SEL
Select for SRC0 or DOT96
0 = SRC0, 1 = DOT96
When GCLK_SEL=0, this bit is 1. When GCLK_SEL=1, this bit is 0
6
5
0
0
PLL1_SS_DC
PLL3_SS_DC
Select for down or center SS
0 = Down spread, 1 = Center spread
Select for down or center SS
0 = Down spread, 1 = Center spread
4
3
2
1
0
0
0
1
0
1
PLL3_CFB3
PLL3_CFB2
PLL3_CFB1
PLL3_CFB0
RESERVED
Bit 4:1 only applies when SRC_Main_SEL = 0
SeeTable 8: PLL3 / SE configuration table
RESERVED
Byte 2: Control Register 2
Bit
@Pup
Name
Description
7
1
REF
Output enable for REF
0 = Output Disabled, 1 = Output Enabled
6
5
4
3
2
1
0
1
1
1
1
1
1
1
USB
PCIF0
PCI4
PCI3
PCI2
PCI1
PCI0
Output enable for USB
0 = Output Disabled, 1 = Output Enabled
Output enable for PCIF0
0 = Output Disabled, 1 = Output Enabled
Output enable for PCI4
0 = Output Disabled, 1 = Output Enabled
Output enable for PCI3
0 = Output Disabled, 1 = Output Enabled
Output enable for PCI2
0 = Output Disabled, 1 = Output Enabled
Output enable for PCI1
0 = Output Disabled, 1 = Output Enabled
Output enable for PCI0
0 = Output Disabled, 1 = Output Enabled
........................ DOC #: SP-AP-0064 (Rev. AB) Page 6 of 28
SL28541-2
Byte 3: Control Register 3
Bit
7
@Pup
Name
RESERVED
Description
1
1
1
1
RESERVED
RESERVED
RESERVED
6
RESERVED
5
RESERVED
4
SRC[T/C]8/CPU2_ITP
Output enable for SRC8 or CPU2_ITP
0 = Output Disabled, 1 = Output Enabled
3
2
1
1
SRC[T/C]7
SRC[T/C]6
Output enable for SRC7
0 = Output Disabled, 1 = Output Enabled
Output enable for SRC6
0 = Output Disabled, 1 = Output Enabled
1
0
1
1
RESERVED
SRC[T/C]4
RESERVED
Output enable for SRC4
0 = Output Disabled, 1 = Output Enabled
Byte 4: Control Register 4
Bit
@Pup
Name
Description
7
1
SRC[T/C]3
Output enable for SRC3
0 = Output Disabled, 1 = Output Enabled
6
5
4
3
2
1
0
1
1
1
1
1
1
1
SRC[T/C]2/SATA
Output enable for SRC2/SATA
0 = Output Disabled, 1 = Output Enabled
SRC[T/C]1/LCD_100M[T/C] Output enable for SRC1/LCD_100M
0 = Output Disabled, 1 = Output Enabled
SRC[T/C]0/DOT96[T/C]
Output enable for SRC0/DOT96
0 = Output Disabled, 1 = Output Enabled
CPU[T/C]1
Output enable for CPU1
0 = Output Disabled, 1 = Output Enabled
CPU[T/C]0
Output enable for CPU0
0 = Output Disabled, 1 = Output Enabled
PLL1_SS_EN
PLL3_SS_EN
Enable PLL1s spread modulation,
0 = Spread Disabled, 1 = Spread Enabled
Enable PLL3s spread modulation
0 = Spread Disabled, 1 = Spread Enabled
Byte 5: Control Register 5
Bit
@Pup
Name
Description
7
0
CR#_A_EN
Enable CR#_A (clk req)
0 = Disabled, 1 = Enabled,
6
5
4
3
2
1
0
0
0
0
0
0
CR#_A_SEL
CR#_B_EN
CR#_B_SEL
CR#_C_EN
CR#_C_SEL
CR#_D_EN
Set CR#_A SRC0 or SRC2
0 = CR#_ASRC0, 1 = CR#_ASRC2
Enable CR#_B(clk req)
0 = Disabled, 1 = Enabled,
Set CR#_B SRC1 or SRC4
0 = CR#_BSRC1, 1 = CR#_BSRC4
Enable CR#_C (clk req)
0 = Disabled, 1 = Enabled
Set CR#_C SRC0 or SRC2
0 = CR#_CSRC0, 1 = CR#_CSRC2
Enable CR#_D (clk req)
0 = Disabled, 1 = Enabled
........................ DOC #: SP-AP-0064 (Rev. AB) Page 7 of 28
SL28541-2
Byte 5: Control Register 5 (continued)
Bit
@Pup
Name
Description
0
0
CR#_D_SEL
Set CR#_D SRC1 or SRC4
0 = CR#_DSRC1, 1 = CR#_DSRC4
Byte 6: Control Register 6
Bit
@Pup
Name
Description
7
0
CR#_E_EN
Enable CR#_E (clk req) SRC6
0 = Disabled, 1 = Enabled
6
0
CR#_F_EN
Enable CR#_F (clk req) SRC8
0 = Disabled, 1 = Enabled
5
4
3
2
1
0
0
0
0
0
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
LCD_100_STP_CTRL
If set, LCD_100 stop with PCI_STP#
0 = Free running, 1 = PCI_STP# stoppable
0
0
SRC_STP_CTRL
If set, SRCs stop with PCI_STP#
0 = Free running, 1 = PCI_STP# stoppable
Byte 7: Vendor ID
Bit
7
@Pup
Name
Description
Revision Code Bit 3
Revision Code Bit 2
Revision Code Bit 1
Revision Code Bit 0
Vendor ID Bit 3
0
0
0
1
1
0
0
0
Rev Code Bit 3
Rev Code Bit 2
Rev Code Bit 1
Rev Code Bit 0
Vendor ID bit 3
Vendor ID bit 2
Vendor ID bit 1
Vendor ID bit 0
6
5
4
3
2
Vendor ID Bit 2
1
Vendor ID Bit 1
0
Vendor ID Bit 0
Byte 8: Control Register 8
Bit
7
@Pup
Name
Description
0
0
0
0
Device_ID3
Device_ID2
Device_ID1
Device_ID0
0000 = CK505 Yellow Cover Device, 56-pin TSSOP
0001 = CK505 Yellow Cover Device, 64-pin TSSOP
6
0010 = CK505 Yellow Cover Device, 48-pin QFN (Reserved)
0011 = CK505 Yellow Cover Device, 56-pin QFN (Reserved)
0100 = CK505 Yellow Cover Device, 64-pin QFN
0101 = CK505 Yellow Cover Device, 72-pin QFN (Reserved)
0110 = CK505 Yellow Cover Device, 48-pin SSOP (Reserved)
0111 = CK505 Yellow Cover Device, 48-pin SSOP (Reserved)
1000 = Reserved
5
4
1001 = CY28548
1010 = Reserved
1011 = Reserved
1100 = Reserved
1101 = Reserved
1110 = Reserved
1111 = Reserved
3
2
0
0
Reserved
Reserved
Reserved
Reserved
........................ DOC #: SP-AP-0064 (Rev. AB) Page 8 of 28
SL28541-2
Byte 8: Control Register 8 (continued)
Bit
@Pup
Name
Description
1
1
27M_NSS_OE
Output enable for 27M_NSS
0 = Output Disabled, 1 = Output Enabled
0
1
27M_SS_OE
Output enable for 27M_SS
0 = Output Disabled, 1 = Output Enabled
Byte 9: Control Register 9
Bit
@Pup
Name
Description
7
0
PCIF_0_with PCI_STP# Allows control of PCIF_0 with assertion of PCI_STP#
0 = Free running PCIF, 1 = Stopped with PCI_STP#
6
5
4
3
HW
1
TME_STRAP
Trusted mode enable strap status
0 = Normal, 1 = No overclocking
REF_DSC1
REF drive strength 1 of 2 (See Byte 17 and 18 for more setting)
0 = Low, 1 = High
0
TEST_MODE_SEL
TEST_MODE_ENTRY
Mode select either REF/N or tri-state
0 = All output tri-state, 1 = All output REF/N
0
Allow entry into test mode
0 = Normal operation, 1 = Enter test mode
2
1
0
1
0
1
I2C_VOUT<2>
I2C_VOUT<1>
I2C_VOUT<0>
Differential Amplitude Configuration
I2C_VOUT[2,1,0]
000 = 0.63V
001 = 0.71V
010 = 0.77V
011 = 082V
100 = 0.86V
101 = 0.90V (default)
110 = 0.93V
111 = unused
Byte 10: Control Register 10
Bit
@Pup
Name
Description
7
HW
GCLK_SEL latch
Readback of GCLK_SEL latch
0 = DOT96/LCD_100, 1 = SRC0/27 MHz
6
5
4
3
2
1
0
1
1
1
1
1
1
1
PLL3_EN
PLL2_EN
PLL3 power down
0 = Power down, 1 = Power up
PLL2 power down
0 = Power down, 1 = Power up
SRC_DIV_EN
PCI_DIV_EN
SRC divider disable
0 = Disabled, 1 = Enabled
PCI divider disable
0 = Disabled, 1 = Enabled
CPU_DIV_EN
CPU1 Stop Enable
CPU0 Stop Enable
CPU divider disable
0 = Disabled, 1 = Enabled
Enable CPU_STP# control of CPU1
0 = Free running, 1= Stoppable
Enable CPU_STP# control of CPU0
0 = Free running, 1= Stoppable
Byte 11: Control Register 11
Bit
@Pup
Name
Description
7
0
Reserved
Reserved
........................ DOC #: SP-AP-0064 (Rev. AB) Page 9 of 28
SL28541-2
Byte 11: Control Register 11 (continued)
6
5
4
3
2
1
0
0
0
0
0
0
0
0
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Byte 12: Byte Count
Bit
7
@Pup
Name
Reserved
Reserved
BC5
Description
0
0
0
1
0
0
1
1
Reserved
Reserved
6
5
Byte count register for block read operation.
The default value for Byte count is 19.
In order to read beyond Byte 19, the user should change the byte count
limit.to or beyond the byte that is desired to be read.
4
BC4
3
BC3
2
BC2
1
BC1
0
BC0
Byte 13: Control Register 13
Bit
@Pup
Name
Description
7
1
USB_BIT1
USB drive strength 1 of 3(See Byte 17 for more setting)
0 = Low, 1= High
6
5
4
3
2
1
0
1
1
1
PCI/ PCIF_BIT1
PLL1_Spread
SATA_SS_EN
CPU[T/C]2
PCI drive strength 1 of 3(See Byte 17 & 18 for more setting)
0 = Low, 1 = High
Select percentage of spread for PLL1
0 = 0.5%, 1=1%
Enable SATA spread modulation,
0 = Spread Disabled, 1 = Spread Enabled
Allow control of CPU2 with assertion of CPU_STP#
0 = Free running, 1 = Stopped with CPU_STP#
SE1/SE2_BIT_1
SE1 and SE2 Drive Strength Setting 1 of 3 (See Byte 17 and 18 for more setting)
0 = Low, 1= High
1
0
1
1
Reserved
SW_PCI
Reserved
SW PCI_STP# Function
0 = SW PCI_STP assert, 1 = SW PCI_STP deassert
When this bit is set to 0, all STOPPABLE PCI, PCIF and SRC outputs are
stopped in a synchronous manner with no short pulses.
When this bit is set to 1, all STOPPED PCI, PCIF and SRC outputs are
resumed in a synchronous manner with no short pulses.
Byte 14: Control Register 14
Bit @Pup
Name
Description
...................... DOC #: SP-AP-0064 (Rev. AB) Page 10 of 28
SL28541-2
Byte 14: Control Register 14
7
6
5
4
3
2
1
0
0
0
0
0
0
0
0
0
CPU_DAF_N7
CPU_DAF_N6
CPU_DAF_N5
CPU_DAF_N4
CPU_DAF_N3
CPU_DAF_N2
CPU_DAF_N1
CPU_DAF_N0
If Prog_CPU_EN is set, the values programmed in CPU_DAF_N[8:0] and
CPU_DAF_M[6:0] are used to determine the CPU output frequency.
Byte 15: Control Register 15
Bit
7
@Pup
Name
Description
0
0
0
0
0
0
0
0
CPU_DAF_N8
CPU_DAF_M6
CPU_DAF_M5
CPU_DAF_M4
CPU_DAF_M3
CPU_DAF_M2
CPU_DAF_M1
CPU_DAF_M0
See Byte 14 for description
6
If Prog_CPU_EN is set, the values programmed in CPU_DAF_N[8:0] and
CPU_DAF_M[6:0] are used to determine the CPU output frequency.
5
4
3
2
1
0
Byte 16: Control Register 16
Bit
7
@Pup
Name
Description
PCI-E Dial-A-Frequency® Bit N7
PCI-E Dial-A-Frequency Bit N6
PCI-E Dial-A-Frequency Bit N5
PCI-E Dial-A-Frequency Bit N4
PCI-E Dial-A-Frequency Bit N3
PCI-E Dial-A-Frequency Bit N2
PCI-E Dial-A-Frequency Bit N1
PCI-E Dial-A-Frequency Bit N0
0
0
0
0
0
0
0
0
PCI-E_N7
PCI-E_N6
PCI-E_N5
PCI-E_N4
PCI-E_N3
PCI-E_N2
PCI-E_N1
PCI-E_N0
6
5
4
3
2
1
0
...................... DOC #: SP-AP-0064 (Rev. AB) Page 11 of 28
SL28541-2
Byte 17: Control Register 17
Bit
@Pup
Name
Description
7
0
SMSW_EN
Enable Smooth Switching
0 = Disabled, 1= Enabled
6
5
4
3
2
1
0
0
0
0
0
0
0
0
SMSW_SEL
SE1/SE2_BIT0
Prog_PCI-E_EN
Prog_CPU_EN
REF_BIT0
Smooth switch select
0 = CPU_PLL, 1 = SRC_PLL
SE1 and SE2 drive strength Setting 2 of 3(see Byte 18 for more setting)
0 = Low, 1= High
Programmable PCI-E frequency enable
0 = Disabled, 1= Enabled
Programmable CPU frequency enable
0 = Disabled, 1= Enabled
REFdrive strength strength Setting 2 of 3(see Byte 18 for more setting)
0 = Low, 1= High
USB_BIT0
USB drive strength strength Setting 2 of 3(see Byte 18 for more setting)
0 = Low, 1= High
PCI/ PCIF_BIT0
PCI drive strength strength Setting 2 of 3(see Byte 18 for more setting)
0 = Low, 1= High
Byte 18: Control Register 18
7
6
5
4
3
2
1
0
0
0
1
0
0
0
0
0
REF_BIT2
RESERVED
RESERVED
RESERVED
USB_BIT2
Drive Strength Control
BIT_2
(Byte18)
1
BIT_0
(Byte 17)
1
Buffer
Strength
Strongest
BIT_1
(Various B ytes)
1
1
0
0
1
1
0
PCI/PCIF_BIT2
SE1/SE2_BIT2
RESERVED
1
1
1
0
0
0
0
1
0
1
0
1
Default
Table 5. Output Driver Status during PCI-STP# and CPU-STP#
PCI_STP# Asserted
CPU_STP# Asserted
Running
SMBus OE Disabled
Single-ended Clocks Stoppable
Non stoppable
Stoppable
Driven low
Driven low
Running
Running
Differential Clocks
Clock driven high
Clock# driven low
Running
Clock driven high
Clock# driven low
Running
Clock driven Low or 20K
pulldown
Non stoppable
Table 6. Output Driver Status
All Differential Clocks except
CPU1
All Single-ended Clocks
w/o Strap w/ Strap
Low Hi-z
CPU1
Clock
Clock#
Clock
Low or 20K pulldown Low
Low or 20K pulldown Low
Running Running
Clock#
Latches Open State
Powerdown
M1
Low or 20K pulldown Low
Low or 20K pulldown Low
Low or 20K pulldown Low
Low
Low
Hi-z
Hi-z
...................... DOC #: SP-AP-0064 (Rev. AB) Page 12 of 28
SL28541-2
Table 7. PLL3/SE Configuration Table
GCLK_SEL
B1b4
0
B1b3
0
B1b2
0
B1b1
0
Pin 17 (MHz)
Pin 18 (MHz) Spread (%)
Comment
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
PLL3 Disabled
0
0
0
1
100
100
100
100
0.5
0.5
1
SRC1 from SRC_Main
0
0
1
0
LCD_100 from PLL3
0
0
1
1
100
100
LCD_100 from PLL3
0
1
0
0
100
100
1.5
2
LCD_100 from PLL3
0
1
0
1
100
100
LCD_100 from PLL3
0
1
1
0
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
none
N/A
N/A
N/A
N/A
0.5
0.5
1
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
0
1
1
1
N/A
N/A
1
0
0
0
N/A
N/A
1
0
0
1
N/A
N/A
1
0
1
0
N/A
N/A
1
0
1
1
N/A
N/A
1
1
0
0
N/A
N/A
1
1
0
1
N/A
N/A
1
1
1
0
N/A
N/A
1
1
1
1
N/A
N/A
0
0
0
0
N/A
N/A
0
0
0
1
27M_NSS
27M_NSS
27M_NSS
27M_NSS
27M_NSS
N/A
27M_SS
27M_SS
27M_SS
27M_SS
27M_SS
N/A
27M_SS from PLL3
27M_SS from PLL3
27M_SS from PLL3
27M_SS from PLL3
27M_SS from PLL3
0
0
1
0
0
0
1
1
0
1
0
0
1.5
2
0
1
0
1
0
1
1
0
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
0
1
1
1
N/A
N/A
1
0
0
0
N/A
N/A
1
0
0
1
N/A
N/A
1
0
1
0
N/A
N/A
1
0
1
1
N/A
N/A
1
1
0
0
N/A
N/A
1
1
0
1
N/A
N/A
Table 8. Crystal Recommendations
Frequency
Drive
(max.)
Shunt Cap Motional
Tolerance
(max.)
Stability
(max.)
Aging
(max.)
(Fund)
Cut
Loading Load Cap
(max.)
(max.)
14.31818 MHz
AT
Parallel 20 pF
0.1 mW
5 pF
0.016 pF
35 ppm
30 ppm
5 ppm
Crystal Loading
Crystal loading plays a critical role in achieving low ppm perfor-
mance. To realize low ppm performance, use the total capac-
itance the crystal sees to calculate the appropriate capacitive
loading (CL).
The SL28541-2 requires a Parallel Resonance Crystal. Substi-
tuting a series resonance crystal causes the SL28541-2 to
operate at the wrong frequency and violates the ppm specifi-
cation. For most applications there is a 300-ppm frequency
shift between series and parallel crystals due to incorrect
loading.
Figure 1 shows a typical crystal configuration using the two
trim capacitors. It is important that the trim capacitors are in
series with the crystal. It is not true that load capacitors are in
parallel with the crystal and are approximately equal to the
load capacitance of the crystal.
...................... DOC #: SP-AP-0064 (Rev. AB) Page 13 of 28
SL28541-2
Dial-A-Frequency® (CPU and SRC Clocks)
This feature allows the user to over-clock their system by
slowly stepping up the CPU or SRC frequency. When the
programmable output frequency feature is enabled, the CPU
and SRC frequencies are determined by the following
equation:
Fcpu = G * N/M or Fcpu=G2 * N, where G2 = G / M.
• “N” and “M” are the values programmed in Programmable
Frequency Select N-Value Register and M-Value Register,
respectively.
Figure 1. Crystal Capacitive Clarification
• “G” stands for the PLL Gear Constant, which is determined
by the programmed value of FS[E:A]. See Table 1,
Frequency Select Table for the Gear Constant for each
Frequency selection. The PCI Express only allows user
control of the N register, the M value is fixed and
documented in Table 1, Frequency Select Table.
Calculating Load Capacitors
In addition to the standard external trim capacitors, consider
the trace capacitance and pin capacitance to calculate the
crystal loading correctly. Again, the capacitance on each side
is in series with the crystal. The total capacitance on both side
is twice the specified crystal load capacitance (CL). Trim
capacitors are calculated to provide equal capacitive loading
on both sides.
In this mode, the user writes the desired N and M values into
the DAF I2C registers. The user cannot change only the M
value and must change both the M and the N values at the
same time, if they require a change to the M value. The user
may change only the N value.
Associated Register Bits
• CPU_DAF Enable – This bit enables CPU DAF mode. By
default, it is not set. When set, the operating frequency is
determined by the values entered into the CPU_DAF_N
register. Note that the CPU_DAF_N and M register must
contain valid values before CPU_DAF is set. Default = 0,
(No DAF).
• CPU_DAF_N – There are nine bits (for 512 values) to
linearly change the CPU frequency (limited by VCO range).
Default = 0, (0000). The allowable values for N are detailed
in Table 1, Frequency Select Table.
• CPU DAF M – There are 7 bits (for 128 values) to linearly
change the CPU frequency (limited by VCO range). Default
= 0, the allowable values for M are detailed in Table 1,
Frequency Select Table
Figure 2. Crystal Loading Example
,
• SRC_DAF Enable – This bit enables SRC DAF mode. By
default, it is not set. When set, the operating frequency is
determined by the values entered into the SRC_DAF_N
register. Note that the SRC_DAF_N register must contain
valid values before SRC_DAF is set. Default = 0, (No DAF).
Use the following formulas to calculate the trim capacitor
values for Ce1 and Ce2.
Load Capacitance (each side)
Ce = 2 * CL – (Cs + Ci)
• SRC_DAF_N – There are nine bits (for 512 values) to
linearly change the CPU frequency (limited by VCO range).
Default = 0, (0000). The allowable values for N are detailed
in Table 1, Frequency Select Table.
Total Capacitance (as seen by the crystal)
1
CLe
=
1
1
(
)
+
Ce2 + Cs2 + Ci2
Ce1 + Cs1 + Ci1
Smooth Switching
CL ................................................... Crystal load capacitance
CLe .........................................Actual loading seen by crystal
using standard value trim capacitors
The device contains one smooth switch circuit that is shared
by the CPU PLL and SRC PLL. The smooth switch circuit
ensures that when the output frequency changes by
overclocking, the transition from the old frequency to the new
frequency is a slow, smooth transition containing no glitches.
The rate of change of output frequency when using the smooth
switch circuit is less than 1 MHz/0.667 s. The frequency
overshoot and undershoot is less than 2%.
Ce .....................................................External trim capacitors
Cs ............................................. Stray capacitance (terraced)
Ci .......................................................... Internal capacitance
(lead frame, bond wires, etc.)
The Smooth Switch circuit assigns auto or manual. In Auto
mode, clock generator assigns smooth switch automatically
when the PLL does overclocking. For manual mode, assign
...................... DOC #: SP-AP-0064 (Rev. AB) Page 14 of 28
SL28541-2
the smooth switch circuit to PLL via Smbus. By default the
smooth switch circuit is set to auto mode. PLL can be
over-clocked when it does not have control of the smooth
switch circuit but it is not guaranteed to transition to the new
frequency without large frequency glitches.
PD# (Power down) Assertion
When PD is sampled HIGH by two consecutive rising edges
of CPUC, all single-ended outputs will be held LOW on their
next HIGH-to-LOW transition and differential clocks must held
LOW. When PD mode is desired as the initial power on state,
PD must be asserted HIGH in less than 10 s after asserting
CKPWRGD.
Do not enable over-clocking and change the N values of both
PLLs in the same SMBUS block write and use smooth switch
mechanism on spread spectrum on/off.
PD# Deassertion
PD_RESTORE
The power up latency is less than 1.8 ms. This is the time from
the deassertion of the PD# pin or the ramping of the power
supply until the time that stable clocks are generated from the
clock chip. All differential outputs stopped in a three-state
condition, resulting from power down are driven high in less
than 300 s of PD# deassertion to a voltage greater than
200 mV. After the clock chip’s internal PLL is powered up and
locked, all outputs are enabled within a few clock cycles of
each clock. Figure 4 is an example showing the relationship of
clocks coming up.
If a ‘0’ is set for Byte 0 bit 0 then, upon assertion of PD# LOW,
the SL28541-2 initiates a full reset. The result of this is that the
clock chip emulates a cold power on start and goes to the
“Latches Open” state. If the PD_RESTORE bit is set to a ‘1’
then the configuration is stored upon PD# asserted LOW. Note
that if the iAMT bit, Byte 0 bit 3, is set to a ‘1’ then the
PD_RESTORE bit must be ignored. In other words, in Intel
iAMT mode, PD# reset is not allowed.
PD# (Power down) Clarification
The CKPWRGD/PD# pin is a dual-function pin. During initial
power up, the pin functions as CKPWRGD. Once CKPWRGD
has been sampled HIGH by the clock chip, the pin assumes
PD# functionality. The PD# pin is an asynchronous active
LOW input used to shut off all clocks cleanly before shutting
off power to the device. This signal is synchronized internally
to the device before powering down the clock synthesizer. PD#
is also an asynchronous input for powering up the system.
When PD# is asserted LOW, clocks are driven to a LOW value
and held before turning off the VCOs and the crystal oscillator.
PD#
CPUT, 133MHz
CPUC, 133MHz
SRCT 100MHz
SRCC 100MHz
USB, 48MHz
DOT96T
DOT96C
PCI, 33 MHz
REF
Figure 3. Power down Assertion Timing Waveform
...................... DOC #: SP-AP-0064 (Rev. AB) Page 15 of 28
SL28541-2
Ts table
<1.8 ms
PD#
CP UT , 133MHz
CP UC, 133MHz
S RCT 100MHz
S RCC 100MHz
US B , 48MHz
DOT 96T
DOT 96C
P CI, 33MHz
REF
Tdriv e_PW R D N #
<300 s , >200m V
Figure 4. Power down Deassertion Timing Waveform
FS_A, FS_B,FS_C,FS_D
CKPWRGD
PWRGD_VRM
0.2-0.3 ms
Delay
Wait for
VTT_PWRGD#
Device is not affected,
VTT_PWRGD# is ignored
Sample Sels
State 2
VDD Clock Gen
Clock State
State 0
Off
State 1
State 3
On
Clock Outputs
Clock VCO
On
Off
Figure 5. CKPWRGD Timing Diagram
...................... DOC #: SP-AP-0064 (Rev. AB) Page 16 of 28
SL28541-2
CPU_STP# Assertion
CPU_STP# Deassertion
The CPU_STP# signal is an active LOW input used for
synchronous stopping and starting the CPU output clocks
while the rest of the clock generator continues to function.
When the CPU_STP# pin is asserted, all CPU outputs that are
set with the SMBus configuration to be stoppable are stopped
within two to six CPU clock periods after sampled by two rising
edges of the internal CPUC clock. The final states of the
stopped CPU signals are CPUT = HIGH and CPUC = LOW.
The deassertion of the CPU_STP# signal causes all stopped
CPU outputs to resume normal operation in a synchronous
manner. No short or stretched clock pulses are produced when
the clock resumes. The maximum latency from the
deassertion to active outputs is no more than two CPU clock
cycles.
CPU_STP#
CPUT
CPUC
Figure 6. CPU_STP# Assertion Waveform
CPU_STP#
CPUT
CPUC
CPUT Internal
CPUC Internal
Tdrive_CPU_STP#,10 ns>200 mV
Figure 7. CPU_STP# Deassertion Waveform
.
PCI_STP# Assertion
The PCI_STP# signal is an active LOW input used for
synchronously stopping and starting the PCI outputs while the
rest of the clock generator continues to function. The set-up
time for capturing PCI_STP# going LOW is 10 ns (tSU). (See
Figure 8.) The PCIF clocks are affected by this pin if their
corresponding control bit in the SMBus register is set to allow
them to be free running.
Tsu
PCI_STP#
PCI_F
PCI
SRC 100MHz
Figure 8. PCI_STP# Assertion Waveform
...................... DOC #: SP-AP-0064 (Rev. AB) Page 17 of 28
SL28541-2
PCI_STP# Deassertion
.
The deassertion of the PCI_STP# signal causes all PCI and
stoppable PCIF clocks to resume running in a synchronous
manner within two PCI clock periods, after PCI_STP# transi-
tions to a HIGH level.
Tdrive_SRC
Tsu
PCI_STP#
PCI_F
PCI
SRC 100MHz
Figure 9. PCI_STP# Deassertion Waveform
.
.
Figure 10. Clock Generator Power up/Run State Diagram
...................... DOC #: SP-AP-0064 (Rev. AB) Page 18 of 28
SL28541-2
C l o c k O f f t o M 1
3.3V
Vcc
2.0V
T_delay t
FSC
FSB
FSA
CPU_STP#
PCI_STP#
CKPWRGD/PD#
CK505 SMBUS
CK505 State
Off
Latches Open
M1
Off
BSEL[0..2]
Off
CK505 Core Logic
PLL1
Locked
CPU1
PLL2 & PLL3
All Other Clocks
REF Oscillator
T_delay2
T_delay3
Figure 11. BSEL Serial Latching
...................... DOC #: SP-AP-0064 (Rev. AB) Page 19 of 28
SL28541-2
Absolute Maximum Conditions
Parameter
VDD_3.3V
VDD_IO
VIN
Description
Supply Voltage
Condition
Min.
Max. Unit
Functional
–
4.6
3.465
4.6
V
V
IO Supply Voltage
Input Voltage
Functional
Relative to VSS
Non-functional
Functional
–0.5
–65
0
VDC
°C
°C
TS
Temperature, Storage
150
85
TA
Commercial Temperature,
Operating Ambient
Industrial Temperature,
Operating Ambient
-40
+85
°C
TJ
Temperature, Junction
Functional
–
–
–
150
20
°C
°C/W
ØJC
ØJA
Dissipation, Junction to Case JEDEC (JESD 51)
Dissipation, Junction to Ambient JEDEC (JESD 51)
60
°C/
W
ESDHBM
ESD Protection (Human Body JEDEC (JESD 22-A114)
Model)
2000
–
V
UL-94
MSL
Flammability Rating
UL (CLASS)
V–0
Moisture Sensitivity Level
1
Multiple Supplies: The Voltage on any input or I/O pin cannot exceed the power pin during power-up. Power supply sequencing is NOT required.
DC Electrical Specifications
Parameter
VDD core
Description
Condition
Min.
Max.
3.465
VDD + 0.3
0.8
Unit
3.3V Operating Voltage
3.3V Input High Voltage (SE)
3.3V Input Low Voltage (SE)
Input High Voltage
3.3 ± 5%
3.135
V
V
VIH
2.0
VIL
VSS – 0.3
V
VIHI2C
VILI2C
VIH_FS
VIL_FS
VIHFS_C_TEST
SDATA, SCLK
SDATA, SCLK
2.2
–
V
Input Low Voltage
–
1.0
V
FS_[A,B] Input High Voltage
FS_[A,B] Input Low Voltage
FS_C Input High Voltage
0.7
1.5
V
VSS – 0.3
0.35
VDD + 0.3
1.5
V
2
V
VIMFS_C_NORMAL FS_C Input Middle Voltage
VILFS_C_NORMAL FS_C Input Low Voltage
0.7
V
VSS – 0.3
0.35
5
V
IIH
Input High Leakage Current
Input Low Leakage Current
Except internal pull-down resistors, 0 < VIN < VDD
Except internal pull-up resistors, 0 < VIN < VDD
–
–5
2.4
–
A
A
V
IIL
–
VOH
VOL
VDD IO
IOZ
3.3V Output High Voltage (SE) IOH = –1 mA
3.3V Output Low Voltage (SE) IOL = 1 mA
Low Voltage IO Supply Voltage
–
0.4
V
1
3.465
10
V
High-impedance Output
Current
–10
A
CIN
Input Pin Capacitance
Output Pin Capacitance
Pin Inductance
1.5
5
6
pF
pF
nH
V
COUT
LIN
–
0.7VDD
0
7
VXIH
Xin High Voltage
VDD
0.3VDD
1
VXIL
Xin Low Voltage
V
IDDPWRDWN
IDD
Power Down Current
Dynamic Supply Current
mA
mA
–
250
...................... DOC #: SP-AP-0064 (Rev. AB) Page 20 of 28
SL28541-2
AC Electrical Specifications
Parameter
Crystal
TDC
Description
Condition
Min.
Max.
Unit
XIN Duty Cycle
XIN Period
The device operates reliably with input
dutycyclesupto30/70buttheREFclock
duty cycle will not be within specification
47.5
52.5
%
TPERIOD
When XIN is driven from an external
clock source
69.841
71.0
ns
TR/TF
XIN Rise and Fall Times
XIN Cycle to Cycle Jitter
Long-term Accuracy
Measured between 0.3VDD and 0.7VDD
–
–
–
10.0
500
300
ns
ps
TCCJ
As an average over 1-s duration
LACC
ppm
Clock Input
TDC
CLKIN Duty Cycle
Measured at VDD/2
47
0.5
–
53
4.0
%
V/ns
ps
TR/TF
CLKIN Rise and Fall Times
CLKIN Cycle to Cycle Jitter
CLKIN Long Term Jitter
Input Low Voltage
Measured between 0.2VDD and 0.8VDD
Measured at VDD/2
TCCJ
250
TLTJ
Measured at VDD/2
–
350
ps
VIL
XIN / CLKIN pin
–
0.8
V
VIH
Input High Voltage
XIN / CLKIN pin
2
VDD+0.3
20
V
IIL
Input LowCurrent
XIN / CLKIN pin, 0 < VIN <0.8
XIN / CLKIN pin, VIN = VDD
–
uA
uA
IIH
Input HighCurrent
–
35
CPU at 0.7V
TDC
45
55
CPU Clock Duty Cycle
Measured at 0V differential at 0.1s
Measured at 0V differential at 0.1s
Measured at 0V differential at 0.1s
Measured at 0V differential at 0.1s
Measured at 0V differential at 0.1s
Measured at 0V differential at 0.1s
Measured at 0V differential at 0.1s
Measured at 0V differential at 0.1s
Measured at 0V differential at 0.1s
Measured at 0V differential at 0.1s
Measured at 0V differential at 0.1s
Measured at 0V differential at 0.1s
Measured at 0V differential at 0.1s
Measured at 0V differential at 0.1s
Measured at 0V differential at 0.1s
Measured at 0V differential at 1 clock
Measured at 0V differential at 1 clock
Measured at 0V differential at 1 clock
Measured at 0V differential at 1 clock
Measured at 0V differential at 1 clock
Measured at 0V differential at 1 clock
Measured at 0V differential at 1 clock
%
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
9.99900
7.49925
5.99940
4.99950
3.74963
2.99970
2.49975
10.00100
7.50075
6.00060
5.00050
3.75038
3.00030
2.50025
TPERIOD
TPERIOD
TPERIOD
TPERIOD
TPERIOD
TPERIOD
TPERIOD
TPERIODSS
TPERIODSS
TPERIODSS
TPERIODSS
TPERIODSS
TPERIODSS
TPERIODSS
TPERIODAbs
TPERIODAbs
TPERIODAbs
TPERIODAbs
TPERIODAbs
TPERIODAbs
TPERIODAbs
100 MHz CPU Clock Period
133 MHz CPU Clock Period
166 MHz CPU Clock Period
200 MHz CPU Clock Period
266 MHz CPU Clock Period
333 MHz CPU Clock Period
400 MHz CPU Clock Period
10.02406 10.02607
100 MHz CPU Clock Period, SSC
133 MHz CPU Clock Period, SSC
166 MHz CPU Clock Period, SSC
200 MHz CPU Clock Period, SSC
266 MHz CPU Clock Period, SSC
333 MHz CPU Clock Period, SSC
400 MHz CPU Clock Period, SSC
100 MHz CPU Clock Absolute period
133 MHz CPU Clock Absolute period
166 MHz CPU Clock Absolute period
200 MHz CPU Clock Absolute period
266 MHz CPU Clock Absolute period
333 MHz CPU Clock Absolute period
400 MHz CPU Clock Absolute period
7.51804
6.01444
5.01203
3.75902
3.00722
2.50601
9.91400
7.41425
5.91440
4.91450
3.66463
2.91470
2.41475
9.91406
7.51955
6.01564
5.01303
3.75978
3.00782
2.50652
10.0860
7.58575
6.08560
5.08550
3.83538
3.08530
2.58525
10.1362
TPERIODSSAbs 100 MHz CPU Clock Absolute period, Measured at 0V differential at 1 clock
SSC
7.41430
7.62340
TPERIODSSAbs 133 MHz CPU Clock Absolute period, Measured at 0V differential at 1 clock
SSC
ns
...................... DOC #: SP-AP-0064 (Rev. AB) Page 21 of 28
SL28541-2
AC Electrical Specifications (continued)
Parameter
Description
Condition
Min.
Max.
Unit
5.91444
6.11572
TPERIODSSAbs 166 MHz CPU Clock Absolute period, Measured at 0V differential at 1 clock
SSC
ns
4.91453
3.66465
2.91472
2.41477
5.11060
3.85420
3.10036
2.59780
TPERIODSSAbs 200 MHz CPU Clock Absolute period, Measured at 0V differential at 1 clock
SSC
ns
ns
ns
ns
TPERIODSSAbs 266 MHz CPU Clock Absolute period, Measured at 0V differential at 1 clock
SSC
TPERIODSSAbs 333 MHz CPU Clock Absolute period, Measured at 0V differential at 1 clock
SSC
TPERIODSSAbs 400 MHz CPU Clock Absolute period, Measured at 0V differential at 1 clock
SSC
TCCJ
CPU Cycle to Cycle Jitter
CPU2_ITP Cycle to Cycle Jitter
Long-term Accuracy
Measured at 0V differential
–
–
85
125
100
100
150
8
ps
ps
TCCJ2
LACC
TSKEW
TSKEW2
R / TF
Measured at 0V differential
Measured at 0V differential
–
ppm
ps
CPU0 to CPU1 Clock Skew
CPU2_ITP to CPU0 Clock Skew
CPU Rising/Falling Slew rate
Rise/Fall Matching
Measured at 0V differential
–
Measured at 0V differential
–
ps
T
Measured differentially from ±150 mV
Measured single-endedly from ±75 mV
2.5
–
V/ns
%
TRFM
20
VHIGH
Voltage High
1.15
–
V
VLOW
Voltage Low
–0.3
300
V
VOX
Crossing Point Voltage at 0.7V Swing
550
mV
SRC at 0.7V
TDC
SRC Duty Cycle
Measured at 0V differential
45
55
%
ns
ns
ns
ns
ns
9.99900
10.0010
TPERIOD
TPERIODSS
TPERIODAbs
100 MHz SRC Period
Measured at 0V differential at 0.1s
Measured at 0V differential at 0.1s
Measured at 0V differential at 1 clock
Measured at 0V differential at 1 clock
10.02406 10.02607
100 MHz SRC Period, SSC
100 MHz SRC Absolute Period
9.87400
9.87406
–
10.1260
10.1762
3.0
TPERIODSSAbs 100 MHz SRC Absolute Period, SSC
TSKEW(window) Any SRC Clock Skew from the earliest Measured at 0V differential
bank to the latest bank
TCCJ
LACC
SRC Cycle to Cycle Jitter
SRC Long Term Accuracy
SRC Rising/Falling Slew Rate
Rise/Fall Matching
Measured at 0V differential
–
–
125
100
8
ps
ppm
V/ns
%
Measured at 0V differential
T
R / TF
Measured differentially from ±150 mV
Measured single-endedly from ±75 mV
2.5
–
TRFM
20
VHIGH
VLOW
Voltage High
1.15
–
V
Voltage Low
–0.3
300
V
VOX
Crossing Point Voltage at 0.7V Swing
550
mV
DOT96 at 0.7V
TDC
DOT96 Duty Cycle
Measured at 0V differential
45
55
10.4177
10.6677
250
%
ns
10.4156
TPERIOD
TPERIODAbs
TCCJ
DOT96 Period
Measured at 0V differential at 0.1s
Measured at 0V differential at 0.1s
Measured at 0V differential at 1 clock
Measured at 0V differential at 1 clock
Measured differentially from ±150 mV
Measured single-endedly from ±75 mV
10.1656
DOT96 Absolute Period
DOT96 Cycle to Cycle Jitter
DOT96 Long Term Accuracy
DOT96 Rising/Falling Slew Rate
Rise/Fall Matching
ns
–
–
ps
LACC
100
ppm
V/ns
%
T
R / TF
2.5
–
8
TRFM
VHIGH
VLOW
20
Voltage High
1.15
–
V
Voltage Low
–0.3
V
...................... DOC #: SP-AP-0064 (Rev. AB) Page 22 of 28
SL28541-2
AC Electrical Specifications (continued)
Parameter
VOX
Description
Condition
Min.
300
Max.
550
Unit
Crossing Point Voltage at 0.7V Swing
mV
LCD_100_SSC at 0.7V
TDC
LCD_100 Duty Cycle
100 MHz LCD_100 Period
Measured at 0V differential
45
55
%
TPERIOD
TPERIODSS
TPERIODAbs
Measured at 0V differential at 0.1s
9.99900
10.0010
ns
100 MHz LCD_100 Period, SSC -0.5% Measured at 0V differential at 0.1s
10.02406 10.02607 ns
9.74900 10.25100 ns
100 MHz LCD_100 Absolute Period
Measured at 0V differential at 1 clock
Measured at 0V differential at 1 clock
TPERIODSSAbs 100 MHz LCD_100 Absolute Period,
SSC
9.74906
10.3012
ns
TCCJ
LACC
LCD_100 Cycle to Cycle Jitter
LCD_100 Long Term Accuracy
LCD_100 Rising/Falling Slew Rate
Rise/Fall Matching
Measured at 0V differential
–
–
250
100
8
ps
ppm
V/ns
%
Measured at 0V differential
T
R / TF
Measured differentially from ±150 mV
Measured single-endedly from ±75 mV
2.5
–
TRFM
VHIGH
VLOW
VOX
20
Voltage High
1.15
–
V
Voltage Low
–0.3
300
V
Crossing Point Voltage at 0.7V Swing
550
mV
PCI/PCIF at 3.3V
TDC
PCI Duty Cycle
Measurement at 1.5V
Measurement at 1.5V
Measurement at 1.5V
Measurement at 1.5V
Measurement at 1.5V
45
55
%
ns
ns
ns
ns
29.99700 30.00300
30.08421 30.23459
29.49700 30.50300
29.56617 30.58421
TPERIOD
TPERIODSS
TPERIODAbs
Spread Disabled PCIF/PCI Period
Spread Enabled PCIF/PCI Period
Spread Disabled PCIF/PCI Period
TPERIODSSAbs Spread Enabled PCIF/PCI Period
THIGH
TLOW
THIGH
Spread Enabled PCIF and PCI high time Measurement at 2V
Spread Enabled PCIF and PCI low time Measurement at 0.8V
12.27095 16.27995 ns
11.87095 16.07995 ns
12.27365 16.27665 ns
Spread Disabled PCIF and PCI high
time
Measurement at 2.V
TLOW
Spread Disabled PCIF and PCI low time Measurement at 0.8V
11.87365 16.07665 ns
T
R / TF
TSKEW
TCCJ
PCIF/PCI Rising/Falling Slew Rate
Measured between 0.8V and 2.0V
1.0
–
4.0
1000
500
V/ns
ps
Any PCI clock to Any PCI clock Skew Measurement at 1.5V
PCIF and PCI Cycle to Cycle Jitter
PCIF/PCI Long Term Accuracy
Measurement at 1.5V
Measurement at 1.5V
–
ps
LACC
–
100
ppm
48_M at 3.3V
TDC
Duty Cycle
Measurement at 1.5V
Measurement at 1.5V
Measurement at 1.5V
Measurement at 2V
45
55
%
ns
20.83125 20.83542
20.48125 21.18542
8.216563 11.15198
7.816563 10.95198
TPERIOD
TPERIODAbs
THIGH
Period
Absolute Period
48_M High time
ns
ns
TLOW
48_M Low time
Measurement at 0.8V
Measured between 0.8V and 2.0V
Measurement at 1.5V
Measurement at 1.5V
ns
T
R / TF
Rising and Falling Edge Rate
Cycle to Cycle Jitter
48M Long Term Accuracy
1.0
–
2.0
350
100
V/ns
ps
TCCJ
LACC
–
ppm
27M_NSS/27M_SS at 3.3V
TDC
Duty Cycle
Measurement at 1.5V
45
55
%
TPERIOD
Spread Disabled 27M Period
Spread Enabled 27M Period
Rising and Falling Edge Rate
Measurement at 1.5V
37.03594 37.03813 ns
37.01299 37.13172 ns
Measurement at 1.5V
T
R / TF
Measured between 0.8V and 2.0V
1.0
4.0
V/ns
...................... DOC #: SP-AP-0064 (Rev. AB) Page 23 of 28
SL28541-2
AC Electrical Specifications (continued)
Parameter
TCCJ
Description
Cycle to Cycle Jitter
Condition
Measurement at 1.5V
Min.
Max.
250
50
Unit
ps
–
–
LACC
27_M Long Term Accuracy
Measured at crossing point VOX
ppm
REF
TDC
REF Duty Cycle
Measurement at 1.5V
Measurement at 1.5V
Measurement at 1.5V
Measurement at 2V
45
55
%
ns
69.82033 69.86224
68.83429 70.84826
29.97543 38.46654
29.57543 38.26654
TPERIOD
TPERIODAbs
THIGH
TLOW
REF Period
ns
REF Absolute Period
REF High time
ns
Measurement at 0.8V
Measured between 0.8V and 2.0V
Measurement at 1.5V
Measurement at 1.5V
Measurement at 1.5V
ns
REF Low time
TR / TF
TSKEW
TCCJ
REF Rising and Falling Edge Rate
REF Clock to REF Clock
REF Cycle to Cycle Jitter
Long Term Accuracy
1.0
–
4.0
500
V/ns
ps
–
1000
100
ps
LACC
–
ppm
ENABLE/DISABLE and SET-UP
TSTABLE Clock Stabilization from Power-up
TSS Stopclock Set-up Time
–
1.8
–
ms
ns
10.0
Test and Measurement Set-up
For PCI Single-ended Signals and Reference
The following diagram shows the test load configurations for
the single-ended PCI, USB, and REF output signals.
Measurement
Point
22
L1
L2
50
4 pF
4 pF
L1 = 0.5", L2 = 8"
22
PCI/USB
Measurement
Point
50
L2
L1
Figure 12. Single-ended PCI and USB Double Load Configuration
Measurement
15
L2
L1
Point
50
4 pF
Measurement
Point
4 pF
15
15
L1
L1
L2
REF
50
Measurement
Point
4 pF
L2
50
L1 = 0.5", L2 = 8"
Figure 13. Single-ended REF Triple Load Configuration
...................... DOC #: SP-AP-0064 (Rev. AB) Page 24 of 28
SL28541-2
Figure 14. Single-ended Output Signals (for AC Parameters Measurement)
For CPU, SRC, and DOT96 Signals and Reference
This diagram shows the test load configuration for the differential CPU and SRC outputs
M e asu rem e nt P oin t
L
O U T +
5 0 O h m
2p F
L= 8"
M e asure m e nt P o int
L
O U T -
5 0 O h m
2 p F
Figure 15. 0.7V Differential Load Configuration
Clock Period (Differential)
Positive Duty Cycle (Differential)
Negative Duty Cycle (Differential)
0.0V
0.0V
Clock-Clock#
Rise
Edge
Rate
Fall
Edge
Rate
VIH = +150mV
VIH = +150mV
0.0V
0.0V
VIL = -150mV
VIL = -150mV
Clock-Clock#
Figure 16. Differential Measurement for Differential Output Signals (for AC Parameters Measurement)
...................... DOC #: SP-AP-0064 (Rev. AB) Page 25 of 28
SL28541-2
VMAX = 1.15V
VMAX = 1.15V
CLK#
VcrossMAX = 550mV
VcrossMIN = 300mV
VcrossMAX = 550mV
VcrossMIN = 300mV
CLK
VMIN = 0.30V
VMIN = 0.30V
CLK#
Vcross delta = 140mV
Vcross delta = 140mV
CLK
CLK#
CLK#
Vcross median +75mV
Vcross median
Vcross median
Vcross median -75mV
CLK
CLK
Figure 17. Single-ended Measurement for Differential Output Signals (for AC Parameters Measurement)
Ordering Information
Part Number
Package Type
Product Flow
Lead-free
SL28541BZC-2
SL28541BZC-2T
SL28541BZI-2
SL28541BZI-2T
56-pin TSSOP
Commercial, 0 to 85C
Commercial, 0 to 85C
Industrial, -40 to 85C
Industrial, -40 to 85C
56-pin TSSOP–Tape and Reel
56-pin TSSOP
56-pin TSSOP–Tape and Reel
This device is Pb-free, Halogen-free and RoHS compliant.
...................... DOC #: SP-AP-0064 (Rev. AB) Page 26 of 28
SL28541-2
Package Diagrams
56-Lead Thin Shrunk Small Outline Package
...................... DOC #: SP-AP-0064 (Rev. AB) Page 27 of 28
SL28541-2
Document History Page
Document Title: SL28541-2 Clock Generator for Intel®Mobile Chipset
DOC #: SP-AP-0064 (Rev. AB)
Issue
Date
Orig. of
Change
REV. ECR#
Description of Change
1.0
1.1
1.2
1.3
1/01/07
6/15/07
9/18/07
10/31/07
JMA
BEN
BEN
BEN
New data sheet
Change ordering number to SL28541BQC
VDDIO range change from 1.25V to 1.05V
1. Added 64 TSSOP pin definitions
2. Added 64 TSSOP package dimension
3. Byte1[2] is changed from 0 to 1 and Byte1[1] is changed from 1 to 0 by power up
default
4. Changed Byte 13 bit 5 spread percentage from -1% to -0.45%
5. Updated revision ID
1.4
1.5
1.6
12/15/07
1/23/08
7/8/08
SLI
JMA
JMA
1. Updated Pin Definition table
2. Updated Table 7. PLL3/SE Configuration Table
1. Changed Byte 13 Bit 5 to replace 0.45% spread to 1% spread.
2. Changed 27MHz period spec to be reflect down spread.
3. Changed 27MHz CCJ spec from 200ps to 250ps.
1. Changed maximum operating temperature range from 85C to 70C
2. Added note on Pb-free, Halogen-free, and RoHS compliant
3. Added note on extended temperature
4. Added Mitsui package
1.7
1.8
2/23/09
3/31/09
JMA
JMA
1. Added 64-TSSOP package on page 1.
2. Change operating temperature back to 85C
1. Updated QFN packge information
2. Udpated Slew rate measurement for 27MHz clocks
3. Updated Tperiod for CPU clock at 100MHz
4. Corrected Byte 7 Revision ID
5. Corrected Byte 8 Device ID
6. Added PWRDWN IDD Spec
1.9
2.0
4/27/09
9/10/09
JMA
1. Corrected Reserved bit in Byte18
2. Corrected Reserved bit in Byte 20
3. Corrected wording for PD to PWRDWN
4. Added “F” in pF in Figure 2
5. Removed Cypress package marking
JMA
JMA
1. Updated QFN package information
AA
1454 04/09’/10
1. Added CLKIN feature.
2. Updated Absolut spec
3. Move location of Output Drive Satus & PLL3/SE Configue tables
4. Combined commercial and industrial temperature grade
5. Updated VDD_IO voltage
AB
1641 06/08/10
JMA
1. Updated VDDIO max spec
2. Updated block diagram.
The information in this document is believed to be accurate in all respects at the time of publication but is subject to change without notice. Sil-
icon Laboratories assumes no responsibility for errors and omissions, and disclaims responsibility for any consequences resulting from the
use of information included herein. Additionally, Silicon Laboratories assumes no responsibility for the functioning of undescribed features or
parameters. Silicon Laboratories reserves the right to make changes without further notice. Silicon Laboratories makes no warranty, represen-
tation or guarantee regarding the suitability of its products for any particular purpose, nor does Silicon Laboratories assume any liability arising
out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or
incidental damages. Silicon Laboratories products are not designed, intended, or authorized for use in applications intended to support or sus-
tain life, or for any other application in which the failure of the Silicon Laboratories product could create a situation where personal injury or
death may occur. Should Buyer purchase or use Silicon Laboratories products for any such unintended or unauthorized application, Buyer
shall indemnify and hold Silicon Laboratories harmless against all claims and damages.
...................... DOC #: SP-AP-0064 (Rev. AB) Page 28 of 28
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