SM3116NSUC [SINOPWER]

N-Channel Enhancement Mode MOSFET;
SM3116NSUC
型号: SM3116NSUC
厂家: Sinopower Semiconductor Inc    Sinopower Semiconductor Inc
描述:

N-Channel Enhancement Mode MOSFET

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SM3116NSUC  
®
N-Channel Enhancement Mode MOSFET  
Features  
Pin Description  
·
30V/60A,  
RDS(ON)=5.7mW (Max.) @ VGS=10V  
RDS(ON)=8mW (Max.) @ VGS=4.5V  
S
D
G
·
·
Reliable and Rugged  
Lead Free and GreenDevices Available  
(RoHS Compliant)  
Top View of TO-251S  
D
·
100% UIS + Rg Tested  
G
Applications  
·
Power Management in Desktop Computer or  
DC/DC Converters.  
S
N-ChannelMOSFET  
Ordering and Marking Information  
SM3116NS  
Package Code  
UC : TO-251S  
Assembly Material  
Handling Code  
Operating Junction Temperature Range  
C : -55 to 150 oC  
Handling Code  
TU : Tube  
Assembly Material  
Temperature Range  
Package Code  
G : Halogen and Lead Free Device  
SM3116NS UC :  
SM3116N  
XXXXX  
XXXXX - Lot Code  
Note : SINOPOWER lead-free products contain molding compounds/die attach materials and 100% matte tin plate  
termination finish; which are fully compliant with RoHS. SINOPOWER lead-free products meet or exceed the lead-  
free requirements of IPC/JEDEC J-STD-020D for MSL classification at lead-free peak reflow temperature. SINOPOWER  
defines Greento mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight  
in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight).  
SINOPOWER reserves the right to make changes to improve reliability or manufacturability without notice, and  
advise customers to obtain the latest version of relevant information to verify before placing orders.  
1
www.sinopowersemi.com  
Copyright ã Sinopower Semiconductor, Inc.  
Rev. A.4 - July, 2015  
SM3116NSUC  
®
Absolute Maximum Ratings  
Symbol  
Parameter  
Rating  
Unit  
Common Ratings (TA=25°C Unless Otherwise Noted)  
30  
±20  
150  
-55 to 150  
20  
VDSS  
VGSS  
TJ  
Drain-Source Voltage  
V
Gate-Source Voltage  
°C  
°C  
A
Maximum Junction Temperature  
TSTG  
IS  
Storage Temperature Range  
Diode Continuous Forward Current  
TC=25°C  
140  
90  
IDP  
300μs Pulse Drain Current Tested  
A
A
TC=100°C  
TC=25°C  
60*  
48  
a
ID  
Continuous Drain Current  
TC=100°C  
TC=25°C  
50  
PD  
Maximum Power Dissipation  
W
TC=100°C  
Steady State  
t £ 10s  
20  
RqJC  
RqJA  
Thermal Resistance-Junction to Case  
Thermal Resistance-Junction to Ambient  
2.5  
°C/W  
°C/W  
15  
Steady State  
45  
b
IAS  
Avalanche Current, Single pulse (L=0.5mH)  
Avalanche Energy, Single pulse (L=0.5mH)  
20  
A
b
EAS  
100  
mJ  
Note a* Current limited by bond wire.  
Note bUIS tested and pulse width limited by maximum junction temperature 150oC (initial temperature Tj=25oC).  
Electrical Characteristics (TA = 25°C unless otherwise noted)  
Symbol  
Parameter  
Test Conditions  
Min. Typ. Max. Unit  
Static Characteristics  
BVDSS Drain-Source Breakdown Voltage  
30  
-
-
-
1
V
VGS=0V, IDS=250mA  
VDS=24V, VGS=0V  
-
IDSS Zero Gate Voltage Drain Current  
mA  
TJ=85°C  
-
-
30  
2.5  
±100  
5.7  
-
VGS(th) Gate Threshold Voltage  
IGSS Gate Leakage Current  
1.5  
1.8  
-
V
VDS=VGS, IDS=250mA  
VGS=±20V, VDS=0V  
VGS=10V, IDS=40A  
-
-
-
-
-
nA  
4.7  
6.9  
6
c
RDS(ON) Drain-Source On-state Resistance  
TJ=125°C  
mW  
VGS=4.5V, IDS=20A  
VDS=5V, IDS=40A  
8
Gfs  
Forward Transconductance  
95  
-
S
2
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Copyright ã Sinopower Semiconductor, Inc.  
Rev. A.4 - July, 2015  
SM3116NSUC  
®
Electrical Characteristics (Cont.) (TA = 25°C unless otherwise noted)  
Symbol  
Parameter  
Test Conditions  
Min. Typ. Max. Unit  
Diode Characteristics  
c
VSD  
trr  
Diode Forward Voltage  
Reverse Recovery Time  
Charge Time  
ISD=20A, VGS=0V  
-
-
-
-
-
0.8  
26  
15  
11  
9
1.1  
V
-
-
-
-
ta  
ns  
nC  
IDS=40A, dlSD/dt=100A/ms  
tb  
Discharge Time  
Qrr  
Reverse Recovery Charge  
Dynamic Characteristics d  
RG  
Ciss  
Coss  
Crss  
Gate Resistance  
VGS=0V,VDS=0V,F=1MHz  
-
-
-
-
-
-
-
-
2.5  
1700  
270  
175  
15  
-
-
W
Input Capacitance  
VGS=0V,  
VDS=15V,  
Frequency=1.0MHz  
Output Capacitance  
Reverse Transfer Capacitance  
-
pF  
-
td(ON) Turn-on Delay Time  
tr Turn-on Rise Time  
td(OFF) Turn-off Delay Time  
tf Turn-off Fall Time  
Gate Charge Characteristics d  
28  
24  
71  
32  
VDD=15V, RL=15W,  
IDS=1A, VGEN=10V,  
RG=6W  
13  
ns  
39  
10  
VDS=15V, VGS=4.5V,  
IDS=40A  
Qg  
Total Gate Charge  
-
14  
-
Qg  
Qgth  
Qgs  
Qgd  
Total Gate Charge  
-
-
-
-
28  
3
39  
-
nC  
Threshold Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
VDS=15V, VGS=10V,  
IDS=40A  
3.7  
7.9  
-
-
Note c Pulse test ; pulse width£300ms, duty cycle£2%.  
Note d Guaranteed by design, not subject to production testing.  
3
www.sinopowersemi.com  
Copyright ã Sinopower Semiconductor, Inc.  
Rev. A.4 - July, 2015  
SM3116NSUC  
®
Typical Operating Characteristics  
Power Dissipation  
Drain Current  
60  
70  
60  
50  
40  
30  
20  
10  
0
50  
40  
30  
20  
10  
TC=25oC  
0
TC=25oC,VG=10V  
0
20 40 60 80 100 120 140 160  
0
20 40 60 80 100 120 140 160  
Tj - Junction Temperature (°C)  
Tj - Junction Temperature  
Safe Operation Area  
Thermal Transient Impedance  
400  
100  
2
1
Duty = 0.5  
1ms  
0.2  
0.1  
10ms  
10  
1
100ms  
0.05  
1s  
0.1  
0.02  
0.01  
DC  
Mounted on 1in2 pad  
Single Pulse  
TC=25OC  
R
qJA :15oC/W  
0.01  
0.1  
0.01  
1E-4 1E-3 0.01  
0.1  
1
10  
100  
0.1  
1
10  
100  
VDS - Drain - Source Voltage (V)  
Square Wave PulseDuration (sec)  
4
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Copyright ã Sinopower Semiconductor, Inc.  
Rev. A.4 - July, 2015  
SM3116NSUC  
®
Typical Operating Characteristics (Cont.)  
Output Characteristics  
Drain-Source On Resistance  
140  
120  
100  
80  
9
8
7
6
5
4
3
VGS= 4.5,5,6,7,8,9,10V  
4V  
VGS=4.5V  
3.5V  
60  
VGS=10V  
40  
20  
3V  
0
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
0
20  
40  
60  
80 100 120 140  
VDS - Drain - Source Voltage (V)  
ID -Drain Current (A)  
Gate-Source On Resistance  
Gate Threshold Voltage  
25  
20  
15  
10  
5
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
IDS=40A  
IDS =250mA  
0
2
3
4
5
6
7
8
9
10  
-50 -25  
0
25 50 75 100 125 150  
VGS - Gate - Source Voltage (V)  
Tj - Junction Temperature (°C)  
5
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Copyright ã Sinopower Semiconductor, Inc.  
Rev. A.4 - July, 2015  
SM3116NSUC  
®
Typical Operating Characteristics (Cont.)  
Source-Drain Diode Forward  
Drain-Source On Resistance  
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
VGS = 10V  
IDS = 40A  
100  
10  
1
Tj=150oC  
Tj=25oC  
RON@Tj=25oC: 4.8mW  
0.1  
-50 -25  
0
25 50 75 100 125 150  
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4  
Tj - Junction Temperature (°C)  
VSD - Source - Drain Voltage (V)  
Capacitance  
Gate Charge  
2400  
2000  
1600  
1200  
800  
400  
0
10  
Frequency=1MHz  
VDS= 15V  
IDS= 40A  
9
8
7
6
5
4
3
2
1
0
Ciss  
Coss  
Crss  
0
5
10  
15  
20  
25  
30  
0
4
8
12  
16  
20  
24  
28  
VDS -Drain-Source Voltage (V)  
QG -Gate Charge (nC)  
6
www.sinopowersemi.com  
Copyright ã Sinopower Semiconductor, Inc.  
Rev. A.4 - July, 2015  
SM3116NSUC  
®
Avalanche Test Circuit and Waveforms  
VDS  
L
VDSX(SUS)  
tp  
DUT  
VDS  
IAS  
RG  
VDD  
VDD  
IL  
tp  
EAS  
0.01W  
tAV  
Switching Time Test Circuit and Waveforms  
VDS  
RD  
VDS  
90%  
DUT  
VGS  
RG  
VDD  
10%  
VGS  
tp  
td(on) tr  
td(off) tf  
7
www.sinopowersemi.com  
Copyright ã Sinopower Semiconductor, Inc.  
Rev. A.4 - July, 2015  
SM3116NSUC  
®
Disclaimer  
Sinopower Semiconductor, Inc. (hereinafter Sinopower) has been making  
great efforts to development high quality and better performance products to  
satisfy all customersneeds. However, a product may fail to meet customers  
expectation or malfunction for various situations.  
All information which is shown in the datasheet is based on Sinopowers  
research and development result, therefore, Sinopower shall reserve the right  
to adjust the content and monitor the production.  
In order to unify the quality and performance, Sinopower has been following  
JEDEC while defines assembly rule. Notwithstanding all the suppliers  
basically follow the rule for each product, different processes may cause  
slightly different results.  
The technical information specified herein is intended only to show the typical  
functions of and examples of application circuits for the products. Sinopower  
does not grant customers explicitly or implicitly, any license to use or exercise  
intellectual property or other rights held by Sinopower and other parties.  
Sinopower shall bear no responsible whatsoever for any dispute arising from  
the use of such technical information.  
The products are not designed or manufactured to be used with any  
equipment, device or system which requires an extremely high level of  
reliability, such as the failure or malfunction of which any may result in a direct  
threat to human life or a risk of human injury. Sinopower shall bear no  
responsibility in any way for use of any of the products for the above special  
purposes. If a product is intended to use for any such special purpose, such  
as vehicle, military, or medical controller relevant applications, please contact  
Sinopower sales representative before purchasing.  
8
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Copyright ã Sinopower Semiconductor, Inc.  
Rev. A.4 - July, 2015  
SM3116NSUC  
®
Classification Profile  
9
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Copyright ã Sinopower Semiconductor, Inc.  
Rev. A.4 - July, 2015  
SM3116NSUC  
®
Classification Reflow Profiles  
Profile Feature  
Sn-Pb Eutectic Assembly  
Pb-Free Assembly  
150 C  
Preheat & Soak  
100 C  
°
°
Temperature min (Tsmin  
)
Temperature max (Tsmax  
Time (Tsmin to Tsmax) (ts)  
150 C  
200 C  
°
°
)
60-120 seconds  
60-120 seconds  
Average ramp-up rate  
(Tsmax to TP)  
3 C/second max.  
°
3 C/second max.  
°
Liquidous temperature (TL)  
Time at liquidous (tL)  
183 C  
60-150 seconds  
217 C  
60-150 seconds  
°
°
Peak package body Temperature  
(Tp)*  
See Classification Temp in table 1  
See Classification Temp in table 2  
30** seconds  
Time (t )** within 5 C of the specified  
°
P
20** seconds  
classification temperature (Tc)  
Average ramp-down rate (Tp to Tsmax  
)
6 C/second max.  
°
6 C/second max.  
°
6 minutes max.  
8 minutes max.  
Time 25 C to peak temperature  
°
* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum.  
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.  
Table 1. SnPb Eutectic Process Classification Temperatures (Tc)  
Volume mm3  
350  
Package  
Volume mm3  
<350  
Thickness  
<2.5 mm  
235 °C  
220 °C  
220 °C  
220 °C  
³ 2.5 mm  
Table 2. Pb-free Process Classification Temperatures (Tc)  
Package  
Thickness  
<1.6 mm  
Volume mm3  
Volume mm3  
350-2000  
260 °C  
Volume mm3  
<350  
>2000  
260 °C  
245 °C  
245 °C  
260 °C  
260 °C  
250 °C  
1.6 mm 2.5 mm  
³ 2.5 mm  
250 °C  
245 °C  
Reliability Test Program  
Test item  
Method  
JESD-22, B102  
JESD-22, A108  
Description  
SOLDERABILITY  
HTRB  
5 Sec, 245°C  
1000 Hrs, 80% of VDS max @ Tjmax  
1000 Hrs, 100% of VGS max @ Tjmax  
HTGB  
JESD-22, A108  
JESD-22, A102  
JESD-22, A104  
PCT  
TCT  
168 Hrs, 100%RH, 2atm, 121°C  
500 Cycles, -65°C~150°C  
Customer Service  
Sinopower Semiconductor, Inc.  
5F, No. 6, Dusing 1St Rd., Hsinchu Science Park,  
Hsinchu, 30078, Taiwan  
TEL: 886-3-5635818 Fax: 886-3-5635080  
10  
www.sinopowersemi.com  
Copyright ã Sinopower Semiconductor, Inc.  
Rev. A.4 - July, 2015  

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