CXM3531XR [SONY]
SP4T Antenna Switch for CDMA/UMTS; SP4T天线开关的CDMA / UMTS![CXM3531XR](http://pdffile.icpdf.com/pdf1/p00134/img/icpdf/CXM35_738442_icpdf.jpg)
型号: | CXM3531XR |
厂家: | ![]() |
描述: | SP4T Antenna Switch for CDMA/UMTS |
文件: | 总10页 (文件大小:216K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
![](http://public.icpdf.com/style/img/ads.jpg)
SP4T Antenna Switch for CDMA/UMTS
CXM3531XR
Description
The CXM3531XR is a high power SP4T antenna switch for CDMA/UMTS applications.
The antenna port can be routed to either of the 4TRx ports.
The low insertion loss on transmit means increased talk time as the Tx power amplifier can be operated at a
lower output level.
Built-in decoder reduces component count and simplifies PCB layout by allowing direct connection of the
switch to digital base band control lines with the 1.8V CMOS logic levels.
The Sony GaAs JPHEMT MMIC Process is used for low insertion loss and high linearity.
(Applications: CDMA/UMTS handsets)
Features
Low insertion Loss (Tx): 0.28dB (Typ.) @27dBm (450MHz)
0.30dB (Typ.) @27dBm (Cellular)
0.36dB (Typ.) @27dBm (PCS)
0.38dB (Typ.) @27dBm (IMT2000)
0.45dB (Typ.) @27dBm (2.6GHz)
High linearity: IIP3 = 70dBm
No DC Blocking Capacitors required on RF ports.
Lead-Free and RoHS Compliant
Package
Small package: 20pin XQFN (2.7mm × 2.7mm × 0.35mm Typ.)
Structure
GaAs JPHEMT MMIC
This IC is ESD sensitive device. Special handling precautions are required.
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license
by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating
the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
E08909-PS
- 1 -
CXM3531XR
Absolute Maximum Ratings
Bias voltage
VDD
4V (Ta = 25°C)
4V (Ta = 25°C)
Control voltage
Vctl
Input power Max. [Ant, RF1, RF2, RF3, RF4] 32dBm (410 to 2690MHz, Ta = 25°C)
Operating temperature
Storage temperature
–35 to +85°C
–65 to +150°C
500mW *1
Maximum power dissipation
PD
*1
25mm × 25mm × t:0.8mm Mounted on standard board (FR-4)
- 2 -
CXM3531XR
Block Diagram
Ant
RF1
RF2
RF3
RF4
F1
F2
F3
F4
F5
F6
F7
F8
Pin Configuration
10
9
8
7
6
11
12
13
14
15
5
4
3
2
1
VDD
GND
GND
CTLA
CTLB
GND
RF3
GND
RF4
GND
XQFN-20P PKG
(2.7mm × 2.7mm × 0.35mm Typ.)
Top View
16
17
18
19
20
- 3 -
CXM3531XR
Truth Table
ON Path
CTLA
CTLB
F1
F2
F3
F4
F5
OFF
ON
ON
ON
F6
ON
OFF
ON
ON
F7
F8
ANT – RF1
ANT – RF2
ANT – RF3
ANT – RF4
L
H
L
L
L
ON
OFF
ON
OFF
OFF
ON
OFF
OFF
OFF
ON
ON
ON
ON
ON
OFF
OFF
OFF
H
H
OFF
OFF
OFF
ON
ON
H
OFF
OFF
DC Bias Condition
(Ta = 25°C)
Item
Vctl (H)
Vctl (L)
VDD
Min.
Typ.
Max.
3.2
Unit
V
1.3
0
1.8
—
0.3
2.5
2.8
3.2
- 4 -
CXM3531XR
Electrical Characteristics
Electrical Characteristics 1
(Ta = +25°C, VDD = 2.8V, Vctl = 0/1.8V)
Item
Symbol
Path
Condition
Min.
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
30
25
22
21
18
Typ.
0.28
0.30
0.36
0.38
0.45
0.28
0.30
0.36
0.38
0.46
0.25
0.27
0.33
0.35
0.42
0.25
0.27
0.33
0.35
0.42
41
Max.
0.43
0.45
0.51
0.53
0.60
0.43
0.45
0.51
0.53
0.61
0.40
0.42
0.48
0.50
0.57
0.40
0.42
0.48
0.50
0.57
—
Unit
*1
*2
*3
*4
*5
*1
*2
*3
*4
*5
*1
*2
*3
*4
*5
*1
*2
*3
*4
*5
*1
*2
*3
*4
*5
ANT-RF1
ANT-RF2
Insertion Loss
IL
dB
ANT-RF3
ANT-RF4
36
—
Isolation
ISO.
ANT-RF1, 2, 3, 4
27
—
dB
26
—
23
—
Electrical Characteristics are measured with all RF ports terminated in 50Ω.
*1
freq = 410 to 495MHz
*2
freq = 698 to 960MHz
*3
freq = 1710 to 1990MHz
*4
freq = 2110 to 2170MHz
*5
freq = 2500 to 2690MHz
- 5 -
CXM3531XR
Electrical Characteristics 2
(Ta = +25°C, VDD = 2.8V, Vctl = 0/1.8V)
Item
Symbol
VSWR
Path
Condition
Min.
—
—
—
—
—
—
—
—
—
—
—
—
Typ.
1.1
Max.
1.4
Unit
—
410 to 2170MHz
2500 to 2690MHz
VSWR
1.3
1.7
2fo
3fo
2fo
3fo
2fo
3fo
2fo
3fo
2fo
3fo
–68
–68
–66
–66
–66
–63
–66
–63
–62
–59
–40
–40
–40
–40
–40
–40
–40
–40
–40
–40
*1
*2
*3
*4
Harmonics
ANT-RF1, 2, 3, 4
dBm
*5
P0.2dB compression
input power
*1, *2, *3, *4, *5
P0.2dB
ANT-RF1, 2, 3, 4
ANT-RF1, 2, 3, 4
31
—
—
dBm
dBm
*6-*9, *17
Inter modulation
product power in
Rx band
IMD2
IMD3
—
—
–110
–110
–105
–105
*10-*13, *17
*14, *17
*15, *17
*16, *17
65
65
65
—
—
—
70
70
—
—
—
10
0.4
5
Input IP3
IIP3
ANT-RF1, 2, 3, 4
dBm
70
Control current
Supply current
Switching speed
Ictl
Vctl = 1.8V
0.005
0.2
2
μA
mA
μs
IDD
Swt
VDD = 2.8V
RF1, 2, 3, 4
50% Ctl to 90% RF
Electrical Characteristics are measured with all RF ports terminated in 50Ω.
*1
Pin = 27dBm, freq = 410 to 484MHz
*2
Pin = 27dBm, freq = 698 to 915MHz
*3
Pin = 27dBm, freq = 1710 to 1910MHz
*4
Pin = 27dBm, freq = 1920 to 1980MHz
*5
Pin = 27dBm, freq = 2500 to 2570MHz
*6
Pin on RF: 20dBm, 1950MHz, Pin on ANT: –15dBm, 190MHz
*7
Pin on RF: 20dBm, 1745MHz, Pin on ANT: –15dBm, 95MHz
*8
Pin on RF: 20dBm, 1880MHz, Pin on ANT: –15dBm, 80MHz
*9
Pin on RF: 20dBm, 835MHz, Pin on ANT: –15dBm, 45MHz
*10
Pin on RF: 20dBm, 1950MHz, Pin on ANT: –15dBm, 1760MHz
*11
Pin on RF: 20dBm, 1745MHz, Pin on ANT: –15dBm, 1650MHz
*12
Pin on RF: 20dBm, 1880MHz, Pin on ANT: –15dBm, 1800MHz
*13
Pin on RF: 20dBm, 835MHz, Pin on ANT: –15dBm, 790MHz
*14
Pin = 27 + 27dBm, 450 + 451MHz, IIP3 = (3 × Pout – IM3) / 2 + Loss
*15
Pin = 27 + 27dBm, 835 + 836MHz, IIP3 = (3 × Pout – IM3) / 2 + Loss
*16
Pin = 27 + 27dBm, 1950 + 1951MHz, IIP3 = (3 × Pout – IM3) / 2 + Loss
*17
Measured with the recommended circuit
- 6 -
CXM3531XR
Electrical Characteristics 3
(Ta = +25°C, VDD = 2.8V, Vctl = 0/1.8V)
Item
Symbol
Path
Condition
Min. Typ. Max. Unit
PTx at RF*
Triple
beat
product
at RF*
[MHz]
Jammer
at Ant
–30dBm
[MHz]
Pin
PTx1 PTx2
[dBm] [MHz] [MHz]
Triple
beat
ratio
TBR
21.5
21.5
13.5
835.5 836.5
881.5
1960
2132
881.5 ± 1
1960 ± 1
2132 ± 1
81
81
81
—
—
—
—
—
—
ANT-
RF1,RF2,
RF3, RF4
1880
1732
1881
1733
dBc
Electrical Characteristics are measured with all RF ports terminated in 50Ω.
Measured with the recommended circuit
Electrical Characteristics 4
(Ta = +25°C, VDD = 2.8V, Vctl = 0/1.8V)
Item Symbol
Path
Condition
Min.
Typ. Max. Unit
PTx at RF* Jammer at ANT IM2product
24dBm
[MHz]
–20dBm
[MHz]
at RF*
[MHz]
836.61
836.61
1885
1718.61
45
881.61
881.61
1965
113.5
95.5
95.5
95.5
95.5
95.5
—
—
—
—
—
—
—
—
—
—
—
—
Input
IIP2
IP2
dBm
Ant-
RF1,RF2,
RF3, RF4
3850
80
1885
1965
1732.5
1732.5
3865
400
2132.5
2132.5
Electrical Characteristics are measured with all RF ports terminated in 50Ω.
Measured with the recommended circuit
- 7 -
CXM3531XR
Recommended Circuit
C1
L1
10
9
8
7
6
VDD
GND
CTLA
CTLB
GND
GND
RF3
11
12
13
14
15
5
4
3
2
1
XQFN-20P PKG
(2.7mm × 2.7mm × 0.35mm Typ.)
GND
RF4
Top View
GND
16
17
18
19
20
Note) 1. No DC blocking capacitors are required on all RF ports.
2. DC levels of all RF ports are GND.
3. L1 (27nH) and C1 (12pF) are recommended on Ant port for ESD protection.
- 8 -
CXM3531XR
PCB Layout Template
XQFN-20P-01 Macro (Reference)
PKG size:
2.7mm × t0.35mm
Terminal pitch: 0.4mm
Terminal length: 0.4mm
Mask thickness: 0.11mm
: Land area
: Mask open area (Solder printing area)
: Board resist open area
: Metal area in board (*1)
*1
This metal is for heat loss reduction in package and recommend to connect to GND.
3.1
2.7 (PKG Line)
[Detail A]
1.3 ( 1)
0.3
Land line
R0.05
0.2
R0.3
Resist line
Solder printing area
0.1
0.21
0.26
0.15
0.4
R0.05: Mask corner
A
- 9 -
CXM3531XR
Package Outline
(Unit: mm)
LEAD PLATING SPECIFICATIONS
ITEM
SPEC.
LEAD MATERIAL
COPPER ALLOY
Sn-Bi Bi:1-4wt%
5-18µm
SOLDER COMPOSITION
PLATING THICKNESS
Sony Corporation
- 10 -
相关型号:
©2020 ICPDF网 联系我们和版权申明