CXM3531XR [SONY]

SP4T Antenna Switch for CDMA/UMTS; SP4T天线开关的CDMA / UMTS
CXM3531XR
型号: CXM3531XR
厂家: SONY CORPORATION    SONY CORPORATION
描述:

SP4T Antenna Switch for CDMA/UMTS
SP4T天线开关的CDMA / UMTS

开关 CD
文件: 总10页 (文件大小:216K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SP4T Antenna Switch for CDMA/UMTS  
CXM3531XR  
Description  
The CXM3531XR is a high power SP4T antenna switch for CDMA/UMTS applications.  
The antenna port can be routed to either of the 4TRx ports.  
The low insertion loss on transmit means increased talk time as the Tx power amplifier can be operated at a  
lower output level.  
Built-in decoder reduces component count and simplifies PCB layout by allowing direct connection of the  
switch to digital base band control lines with the 1.8V CMOS logic levels.  
The Sony GaAs JPHEMT MMIC Process is used for low insertion loss and high linearity.  
(Applications: CDMA/UMTS handsets)  
Features  
‹ Low insertion Loss (Tx): 0.28dB (Typ.) @27dBm (450MHz)  
0.30dB (Typ.) @27dBm (Cellular)  
0.36dB (Typ.) @27dBm (PCS)  
0.38dB (Typ.) @27dBm (IMT2000)  
0.45dB (Typ.) @27dBm (2.6GHz)  
‹ High linearity: IIP3 = 70dBm  
‹ No DC Blocking Capacitors required on RF ports.  
‹ Lead-Free and RoHS Compliant  
Package  
Small package: 20pin XQFN (2.7mm × 2.7mm × 0.35mm Typ.)  
Structure  
GaAs JPHEMT MMIC  
This IC is ESD sensitive device. Special handling precautions are required.  
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license  
by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating  
the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.  
E08909-PS  
- 1 -  
CXM3531XR  
Absolute Maximum Ratings  
‹ Bias voltage  
VDD  
4V (Ta = 25°C)  
4V (Ta = 25°C)  
‹ Control voltage  
Vctl  
‹ Input power Max. [Ant, RF1, RF2, RF3, RF4] 32dBm (410 to 2690MHz, Ta = 25°C)  
‹ Operating temperature  
‹ Storage temperature  
–35 to +85°C  
–65 to +150°C  
500mW *1  
‹ Maximum power dissipation  
PD  
*1  
25mm × 25mm × t:0.8mm Mounted on standard board (FR-4)  
- 2 -  
CXM3531XR  
Block Diagram  
Ant  
RF1  
RF2  
RF3  
RF4  
F1  
F2  
F3  
F4  
F5  
F6  
F7  
F8  
Pin Configuration  
10  
9
8
7
6
11  
12  
13  
14  
15  
5
4
3
2
1
VDD  
GND  
GND  
CTLA  
CTLB  
GND  
RF3  
GND  
RF4  
GND  
XQFN-20P PKG  
(2.7mm × 2.7mm × 0.35mm Typ.)  
Top View  
16  
17  
18  
19  
20  
- 3 -  
CXM3531XR  
Truth Table  
ON Path  
CTLA  
CTLB  
F1  
F2  
F3  
F4  
F5  
OFF  
ON  
ON  
ON  
F6  
ON  
OFF  
ON  
ON  
F7  
F8  
ANT – RF1  
ANT – RF2  
ANT – RF3  
ANT – RF4  
L
H
L
L
L
ON  
OFF  
ON  
OFF  
OFF  
ON  
OFF  
OFF  
OFF  
ON  
ON  
ON  
ON  
ON  
OFF  
OFF  
OFF  
H
H
OFF  
OFF  
OFF  
ON  
ON  
H
OFF  
OFF  
DC Bias Condition  
(Ta = 25°C)  
Item  
Vctl (H)  
Vctl (L)  
VDD  
Min.  
Typ.  
Max.  
3.2  
Unit  
V
1.3  
0
1.8  
0.3  
2.5  
2.8  
3.2  
- 4 -  
CXM3531XR  
Electrical Characteristics  
Electrical Characteristics 1  
(Ta = +25°C, VDD = 2.8V, Vctl = 0/1.8V)  
Item  
Symbol  
Path  
Condition  
Min.  
30  
25  
22  
21  
18  
Typ.  
0.28  
0.30  
0.36  
0.38  
0.45  
0.28  
0.30  
0.36  
0.38  
0.46  
0.25  
0.27  
0.33  
0.35  
0.42  
0.25  
0.27  
0.33  
0.35  
0.42  
41  
Max.  
0.43  
0.45  
0.51  
0.53  
0.60  
0.43  
0.45  
0.51  
0.53  
0.61  
0.40  
0.42  
0.48  
0.50  
0.57  
0.40  
0.42  
0.48  
0.50  
0.57  
Unit  
*1  
*2  
*3  
*4  
*5  
*1  
*2  
*3  
*4  
*5  
*1  
*2  
*3  
*4  
*5  
*1  
*2  
*3  
*4  
*5  
*1  
*2  
*3  
*4  
*5  
ANT-RF1  
ANT-RF2  
Insertion Loss  
IL  
dB  
ANT-RF3  
ANT-RF4  
36  
Isolation  
ISO.  
ANT-RF1, 2, 3, 4  
27  
dB  
26  
23  
Electrical Characteristics are measured with all RF ports terminated in 50Ω.  
*1  
freq = 410 to 495MHz  
*2  
freq = 698 to 960MHz  
*3  
freq = 1710 to 1990MHz  
*4  
freq = 2110 to 2170MHz  
*5  
freq = 2500 to 2690MHz  
- 5 -  
CXM3531XR  
Electrical Characteristics 2  
(Ta = +25°C, VDD = 2.8V, Vctl = 0/1.8V)  
Item  
Symbol  
VSWR  
Path  
Condition  
Min.  
Typ.  
1.1  
Max.  
1.4  
Unit  
410 to 2170MHz  
2500 to 2690MHz  
VSWR  
1.3  
1.7  
2fo  
3fo  
2fo  
3fo  
2fo  
3fo  
2fo  
3fo  
2fo  
3fo  
–68  
–68  
–66  
–66  
–66  
–63  
–66  
–63  
–62  
–59  
–40  
–40  
–40  
–40  
–40  
–40  
–40  
–40  
–40  
–40  
*1  
*2  
*3  
*4  
Harmonics  
ANT-RF1, 2, 3, 4  
dBm  
*5  
P0.2dB compression  
input power  
*1, *2, *3, *4, *5  
P0.2dB  
ANT-RF1, 2, 3, 4  
ANT-RF1, 2, 3, 4  
31  
dBm  
dBm  
*6-*9, *17  
Inter modulation  
product power in  
Rx band  
IMD2  
IMD3  
–110  
–110  
–105  
–105  
*10-*13, *17  
*14, *17  
*15, *17  
*16, *17  
65  
65  
65  
70  
70  
10  
0.4  
5
Input IP3  
IIP3  
ANT-RF1, 2, 3, 4  
dBm  
70  
Control current  
Supply current  
Switching speed  
Ictl  
Vctl = 1.8V  
0.005  
0.2  
2
μA  
mA  
μs  
IDD  
Swt  
VDD = 2.8V  
RF1, 2, 3, 4  
50% Ctl to 90% RF  
Electrical Characteristics are measured with all RF ports terminated in 50Ω.  
*1  
Pin = 27dBm, freq = 410 to 484MHz  
*2  
Pin = 27dBm, freq = 698 to 915MHz  
*3  
Pin = 27dBm, freq = 1710 to 1910MHz  
*4  
Pin = 27dBm, freq = 1920 to 1980MHz  
*5  
Pin = 27dBm, freq = 2500 to 2570MHz  
*6  
Pin on RF: 20dBm, 1950MHz, Pin on ANT: –15dBm, 190MHz  
*7  
Pin on RF: 20dBm, 1745MHz, Pin on ANT: –15dBm, 95MHz  
*8  
Pin on RF: 20dBm, 1880MHz, Pin on ANT: –15dBm, 80MHz  
*9  
Pin on RF: 20dBm, 835MHz, Pin on ANT: –15dBm, 45MHz  
*10  
Pin on RF: 20dBm, 1950MHz, Pin on ANT: –15dBm, 1760MHz  
*11  
Pin on RF: 20dBm, 1745MHz, Pin on ANT: –15dBm, 1650MHz  
*12  
Pin on RF: 20dBm, 1880MHz, Pin on ANT: –15dBm, 1800MHz  
*13  
Pin on RF: 20dBm, 835MHz, Pin on ANT: –15dBm, 790MHz  
*14  
Pin = 27 + 27dBm, 450 + 451MHz, IIP3 = (3 × Pout – IM3) / 2 + Loss  
*15  
Pin = 27 + 27dBm, 835 + 836MHz, IIP3 = (3 × Pout – IM3) / 2 + Loss  
*16  
Pin = 27 + 27dBm, 1950 + 1951MHz, IIP3 = (3 × Pout – IM3) / 2 + Loss  
*17  
Measured with the recommended circuit  
- 6 -  
CXM3531XR  
Electrical Characteristics 3  
(Ta = +25°C, VDD = 2.8V, Vctl = 0/1.8V)  
Item  
Symbol  
Path  
Condition  
Min. Typ. Max. Unit  
PTx at RF*  
Triple  
beat  
product  
at RF*  
[MHz]  
Jammer  
at Ant  
–30dBm  
[MHz]  
Pin  
PTx1 PTx2  
[dBm] [MHz] [MHz]  
Triple  
beat  
ratio  
TBR  
21.5  
21.5  
13.5  
835.5 836.5  
881.5  
1960  
2132  
881.5 ± 1  
1960 ± 1  
2132 ± 1  
81  
81  
81  
ANT-  
RF1,RF2,  
RF3, RF4  
1880  
1732  
1881  
1733  
dBc  
Electrical Characteristics are measured with all RF ports terminated in 50Ω.  
Measured with the recommended circuit  
Electrical Characteristics 4  
(Ta = +25°C, VDD = 2.8V, Vctl = 0/1.8V)  
Item Symbol  
Path  
Condition  
Min.  
Typ. Max. Unit  
PTx at RF* Jammer at ANT IM2product  
24dBm  
[MHz]  
–20dBm  
[MHz]  
at RF*  
[MHz]  
836.61  
836.61  
1885  
1718.61  
45  
881.61  
881.61  
1965  
113.5  
95.5  
95.5  
95.5  
95.5  
95.5  
Input  
IIP2  
IP2  
dBm  
Ant-  
RF1,RF2,  
RF3, RF4  
3850  
80  
1885  
1965  
1732.5  
1732.5  
3865  
400  
2132.5  
2132.5  
Electrical Characteristics are measured with all RF ports terminated in 50Ω.  
Measured with the recommended circuit  
- 7 -  
CXM3531XR  
Recommended Circuit  
C1  
L1  
10  
9
8
7
6
VDD  
GND  
CTLA  
CTLB  
GND  
GND  
RF3  
11  
12  
13  
14  
15  
5
4
3
2
1
XQFN-20P PKG  
(2.7mm × 2.7mm × 0.35mm Typ.)  
GND  
RF4  
Top View  
GND  
16  
17  
18  
19  
20  
Note) 1. No DC blocking capacitors are required on all RF ports.  
2. DC levels of all RF ports are GND.  
3. L1 (27nH) and C1 (12pF) are recommended on Ant port for ESD protection.  
- 8 -  
CXM3531XR  
PCB Layout Template  
XQFN-20P-01 Macro (Reference)  
‹ PKG size:  
2.7mm × t0.35mm  
‹ Terminal pitch: 0.4mm  
‹ Terminal length: 0.4mm  
‹ Mask thickness: 0.11mm  
: Land area  
: Mask open area (Solder printing area)  
: Board resist open area  
: Metal area in board (*1)  
*1  
This metal is for heat loss reduction in package and recommend to connect to GND.  
3.1  
2.7 (PKG Line)  
[Detail A]  
1.3 ( 1)  
0.3  
Land line  
R0.05  
0.2  
R0.3  
Resist line  
Solder printing area  
0.1  
0.21  
0.26  
0.15  
0.4  
R0.05: Mask corner  
A
- 9 -  
CXM3531XR  
Package Outline  
(Unit: mm)  
LEAD PLATING SPECIFICATIONS  
ITEM  
SPEC.  
LEAD MATERIAL  
COPPER ALLOY  
Sn-Bi Bi:1-4wt%  
5-18µm  
SOLDER COMPOSITION  
PLATING THICKNESS  
Sony Corporation  
- 10 -  

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