STB75NF75L-1 [STMICROELECTRONICS]
N-CHANNEL 75V - 0.009 ohm - 75A D2PAK/I2PAK/TO-220 STripFET⑩ II POWER MOSFET; N沟道75V - 0.009欧姆 - 75A D2PAK / I2PAK / TO- 220 STripFET⑩ II功率MOSFET型号: | STB75NF75L-1 |
厂家: | ST |
描述: | N-CHANNEL 75V - 0.009 ohm - 75A D2PAK/I2PAK/TO-220 STripFET⑩ II POWER MOSFET |
文件: | 总11页 (文件大小:384K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
STP75NF75L
STB75NF75L STB75NF75L-1
2
2
N-CHANNEL 75V - 0.009 Ω - 75A D PAK/I PAK/TO-220
STripFET™ II POWER MOSFET
V
R
I
D
TYPE
DSS
DS(on)
STB75NF75L/-1
STP75NF75L
75 V
75 V
<0.011 Ω
<0.011 Ω
75 A
75 A
■
■
■
■
TYPICAL R (on) = 0.009Ω
DS
3
EXCEPTIONAL dv/dt CAPABILITY
100% AVALANCHE TESTED
LOW THRESHOLD DRIVE
3
1
2
1
2
I PAK
2
D PAK
TO-263
TO-262
DESCRIPTION
This MOSFET series realized with STMicroelectronics
unique STripFET process has specifically been designed
to minimize input capacitance and gate charge. It is
therefore suitable as primary switch in advanced high-
efficiency, high-frequency isolated DC-DC converters for
Telecom and Computer applications. It is also intended
for any applications with low gate drive requirements.
3
2
1
TO-220
INTERNAL SCHEMATIC DIAGRAM
APPLICATIONS
■
■
■
■
SOLENOID AND RELAY DRIVERS
DC MOTOR CONTROL
DC-DC CONVERTERS
AUTOMOTIVE ENVIRONMENT
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Value
75
Unit
V
V
Drain-source Voltage (V = 0)
DS
GS
V
Drain-gate Voltage (R = 20 kΩ)
75
V
DGR
GS
V
Gate- source Voltage
± 15
75
V
GS
I (•)
D
Drain Current (continuous) at T = 25°C
A
C
I
D
Drain Current (continuous) at T = 100°C
70
A
C
I
(••)
Drain Current (pulsed)
300
300
2
A
DM
P
Total Dissipation at T = 25°C
W
tot
C
Derating Factor
W/°C
V/ns
mJ
(1)
Peak Diode Recovery voltage slope
Single Pulse Avalanche Energy
Storage Temperature
20
dv/dt
(2)
E
680
AS
T
stg
-55 to 175
°C
T
Max. Operating Junction Temperature
j
(1) I ≤ 75A, di/dt ≤ 500A/µs, V ≤ V
, T ≤ T
j JMAX.
(•) Current limited by package
(••) Pulse width limited by safe operating area.
SD
DD
(BR)DSS
o
(2) Starting T = 25 C, I = 37.5A, V = 30V
j
D
DD
April 2002
1/11
.
STB75NF75L/-1 STP75NF75L
THERMAL DATA
Rthj-case
Rthj-amb
Thermal Resistance Junction-case
Thermal Resistance Junction-ambient
Maximum Lead Temperature For Soldering Purpose
Max
Max
Typ
0.5
62.5
300
°C/W
°C/W
°C
T
l
ELECTRICAL CHARACTERISTICS (T
= 25 °C unless otherwise specified)
case
OFF
Symbol
Parameter
Drain-source
Test Conditions
= 250 µA = 0
Min.
Typ.
Max.
Unit
I
V
GS
75
V
V
D
(BR)DSS
Breakdown Voltage
V
V
= Max Rating
= Max Rating T = 125°C
Zero Gate Voltage
1
10
µA
µA
I
DS
DSS
Drain Current (V = 0)
GS
DS
C
Gate-body Leakage
V
GS
= ± 15 V
±100
nA
I
GSS
Current (V = 0)
DS
(*)
ON
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
V
GS(th)
V
= V
I = 250 µA
D
Gate Threshold Voltage
1
2.5
V
DS
GS
V
V
= 10 V
= 5 V
I
I
= 37.5 A
= 37.5 A
Static Drain-source On
Resistance
0.009
0.010
0.011
0.013
Ω
Ω
R
GS
D
D
DS(on)
GS
DYNAMIC
Symbol
(*)
Parameter
Test Conditions
15 V = 37.5 A
Min.
Typ.
Max.
Unit
Forward Transconductance
120
S
g
fs
V
V
I
D
DS =
= 25V, f = 1 MHz, V = 0
C
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
4300
660
205
pF
pF
pF
DS
GS
iss
C
oss
C
rss
2/11
STB75NF75L/-1 STP75NF75L
ELECTRICAL CHARACTERISTICS (continued)
SWITCHING ON
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
V
R
= 40 V
= 4.7 Ω
I = 37.5 A
Turn-on Delay Time
Rise Time
35
150
ns
ns
t
DD
D
d(on)
V
= 4.5 V
t
r
G
GS
(Resistive Load, Figure 3)
Q
V
= 60V I = 75 A V = 5V
D GS
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
75
18
31
90
nC
nC
nC
g
DD
Q
gs
Q
gd
SWITCHING OFF
Symbol
Parameter
Test Conditions
Min.
Min.
Typ.
Max.
Unit
V
R
= 40 V
I = 37.5 A
D
Turn-off Delay Time
Fall Time
110
60
ns
ns
t
DD
d(off)
= 4.7Ω,
V
= 4.5 V
GS
t
G
f
(Resistive Load, Figure 3)
SOURCE DRAIN DIODE
Symbol
Parameter
Test Conditions
Typ.
Max.
Unit
I
Source-drain Current
Source-drain Current (pulsed)
75
300
A
A
SD
(•)
I
SDM
(*)
I
I
= 75 A
V
= 0
GS
V
Forward On Voltage
1.3
V
SD
SD
SD
t
rr
= 75 A
= 20 V
di/dt = 100A/µs
Reverse Recovery Time
Reverse Recovery Charge
Reverse Recovery Current
100
380
7.5
ns
nC
A
Q
V
T = 150°C
j
rr
DD
I
(see test circuit, Figure 5)
RRM
(*)
(
Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.
•)Pulse width limited by safe operating area.
Safe Operating Area
Thermal Impedance
3/11
STB75NF75L/-1 STP75NF75L
Output Characteristics
Transfer Characteristics
Transconductance
Static Drain-source On Resistance
Gate Charge vs Gate-source Voltage
Capacitance Variations
4/11
STB75NF75L/-1 STP75NF75L
Normalized Gate Threshold Voltage vs Temperature
Normalized on Resistance vs Temperature
Source-drain Diode Forward Characteristics
Normalized Breakdown Voltage vs Temperature.
.
.
5/11
STB75NF75L/-1 STP75NF75L
Fig. 1: Unclamped Inductive Load Test Circuit
Fig. 2: Unclamped Inductive Waveform
Fig. 3: Switching Times Test Circuits For Resistive
Fig. 4: Gate Charge test Circuit
Load
Fig. 5: Test Circuit For Inductive Load Switching
And Diode Recovery Times
6/11
STB75NF75L/-1 STP75NF75L
2
D PAK MECHANICAL DATA
mm.
inch.
DIM.
MIN.
4.4
TYP.
MAX.
4.6
MIN.
0.173
0.098
0.001
0.028
0.045
0.018
0.048
0.352
TYP.
TYP.
0.181
0.106
0.009
0.037
0.067
0.024
0.054
0.368
A
A1
A2
B
2.49
0.03
0.7
2.69
0.23
0.93
1.7
B2
C
1.14
0.45
1.21
8.95
0.6
C2
D
1.36
9.35
D1
E
8
0.315
0.334
10
8.5
4.88
15
10.4
0.394
0.409
E1
G
5.28
15.85
1.4
0.192
0.591
0.050
0.055
0.094
0.208
0.624
0.055
0.069
0.126
L
L2
L3
M
1.27
1.4
2.4
1.75
3.2
R
0.4
0.016
V2
0°
8°
0°
8°
7/11
STB75NF75L/-1 STP75NF75L
TO-262 (I2PAK) MECHANICAL DATA
mm
inch
TYP.
DIM.
MIN.
4.4
TYP.
MAX.
4.6
MIN.
0.173
0.098
0.027
0.044
0.017
0.048
0.352
0.094
0.393
0.515
0.137
0.050
MAX.
0.181
0.106
0.036
0.067
0.023
0.053
0.368
0.106
0.409
0.531
0.149
0.055
A
A1
B
2.49
0.7
2.69
0.93
1.7
B2
C
1.14
0.45
1.23
8.95
2.4
0.6
C2
D
1.36
9.35
2.7
e
E
10
10.4
13.6
3.78
1.4
L
13.1
3.48
1.27
L1
L2
L1
L2
D
L
P011P5/E
8/11
STB75NF75L/-1 STP75NF75L
TO-220 MECHANICAL DATA
mm
inch
DIM.
MIN.
4.40
1.23
2.40
TYP.
MAX.
4.60
1.32
2.72
MIN.
0.173
0.048
0.094
TYP.
MAX.
0.181
0.051
0.107
A
C
D
D1
E
1.27
0.050
0.49
0.61
1.14
1.14
4.95
2.4
0.70
0.88
1.70
1.70
5.15
2.7
0.019
0.024
0.044
0.044
0.194
0.094
0.393
0.027
0.034
0.067
0.067
0.203
0.106
0.409
F
F1
F2
G
G1
H2
L2
L4
L5
L6
L7
L9
DIA.
10.0
10.40
16.4
0.645
13.0
2.65
15.25
6.2
14.0
2.95
15.75
6.6
0.511
0.104
0.600
0.244
0.137
0.147
0.551
0.116
0.620
0.260
0.154
0.151
3.5
3.93
3.85
3.75
L2
Dia.
L5
L9
L7
L6
L4
P011C
9/11
STB75NF75L/-1 STP75NF75L
D2PAK FOOTPRINT
TUBE SHIPMENT (no suffix)*
TAPE AND REEL SHIPMENT (suffix ”T4”)*
REEL MECHANICAL DATA
mm
inch
MAX.
DIM.
MIN.
MAX.
MIN.
A
B
C
D
G
N
T
330
12.992
0.520
1.039
1.197
1.5
12.8
20.2
24.4
100
0.059
0.504
0.795
0.960
3.937
13.2
26.4
30.4
BASE QTY
BULK QTY
1000
1000
TAPE MECHANICAL DATA
mm
inch
DIM.
MIN.
10.5
15.7
1.5
MAX.
10.7
15.9
1.6
MIN.
0.413
0.618
0.059
0.062
0.065
0.449
0.189
0.153
0.468
0075
MAX.
0.421
0.626
0.063
0.063
0.073
0.456
0.197
0.161
0.476
0.082
A0
B0
D
D1
E
1.59
1.65
11.4
4.8
1.61
1.85
11.6
5.0
F
K0
P0
P1
P2
R
3.9
4.1
11.9
1.9
12.1
2.1
50
1.574
T
0.25
23.7
0.35
24.3
.0.0098 0.0137
0.933 0.956
W
* on sales type
10/11
STB75NF75L/-1 STP75NF75L
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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2002 STMicroelectronics - All Rights Reserved
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11/11
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