STD7NB20 [STMICROELECTRONICS]

N-CHANNEL 200V - 0.3ohm - 7A DPAK/IPAK PowerMESH⑩ MOSFET; N沟道200V - 0.3ohm - 7A的DPAK / IPAK PowerMESH⑩ MOSFET
STD7NB20
型号: STD7NB20
厂家: ST    ST
描述:

N-CHANNEL 200V - 0.3ohm - 7A DPAK/IPAK PowerMESH⑩ MOSFET
N沟道200V - 0.3ohm - 7A的DPAK / IPAK PowerMESH⑩ MOSFET

晶体 晶体管 功率场效应晶体管 开关 脉冲
文件: 总10页 (文件大小:489K)
中文:  中文翻译
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STD7NB20  
STD7NB20-1  
N-CHANNEL 200V - 0.3- 7A DPAK/IPAK  
PowerMESH™ MOSFET  
TYPE  
V
DSS  
R
I
D
DS(on)  
STD7NB20  
STD7NB20-1  
200 V  
200 V  
< 0.40 Ω  
< 0.40 Ω  
7 A  
7 A  
3
TYPICAL R (on) = 0.3 Ω  
DS  
EXTREMELY HIGH dv/dt CAPABILITY  
100% AVALANCHE TESTED  
VERY LOW INTRINSIC CAPACITANCES  
GATE CHARGE MINIMIZED  
ADD SUFFIX “T4” FOR ORDERING IN TAPE &  
REEL  
3
2
1
1
DPAK  
TO-252  
IPAK  
TO-251  
DESCRIPTION  
Using the latest high voltage MESH OVERLAY™  
process, STMicroelectronics has designed an ad-  
vanced family of power MOSFETs with outstanding  
performances. The new patent pending strip layout  
coupled with the Company’s proprieraty edge termi-  
INTERNAL SCHEMATIC DIAGRAM  
nation structure, gives the lowest R  
per area,  
DS(on)  
exceptional avalanche and dv/dt capabilities and  
unrivalled gate charge and switching characteris-  
tics.  
APPLICATIONS  
SWITH MODE POWER SUPPLIES (SMPS)  
DC-DC CONVERTERS FOR TELECOM,  
INDUSTRIAL, AND LIGHTING EQUIPMENT  
ABSOLUTE MAXIMUM RATINGS  
Symbol  
Parameter  
Value  
Unit  
V
V
DS  
Drain-source Voltage (V = 0)  
200  
GS  
V
Drain-gate Voltage (R = 20 k)  
200  
V
DGR  
GS  
V
GS  
Gate- source Voltage  
± 30  
V
I
Drain Current (continuos) at T = 25°C  
7
A
D
C
I
Drain Current (continuos) at T = 100°C  
5
28  
A
D
C
I
( )  
Drain Current (pulsed)  
A
DM  
P
TOT  
Total Dissipation at T = 25°C  
55  
W
C
Derating Factor  
0.44  
W/°C  
V/ns  
°C  
dv/dt (1)  
Peak Diode Recovery voltage slope  
Storage Temperature  
5.5  
T
stg  
– 65 to 150  
T
Max. Operating Junction Temperature  
150  
°C  
j
(1) I 7A, di/dt200 A/µs, V V  
, TjT  
(BR)DSS jMAX  
SD  
DD  
(•)Pulse width limited by safe operating area  
July 2002  
1/10  
STD7NB20 / STD7NB20-1  
THERMAL DATA  
Rthj-case  
Thermal Resistance Junction-case Max  
2.27  
100  
275  
°C/W  
°C/W  
°C  
Rthj-amb  
Thermal Resistance Junction-ambient Max  
T
Maximum Lead Temperature For Soldering Purpose  
l
AVALANCHE CHARACTERISTICS  
Symbol  
Parameter  
Max Value  
Unit  
I
Avalanche Current, Repetitive or Not-Repetitive  
7
A
AR  
(pulse width limited by T max)  
j
E
Single Pulse Avalanche Energy  
100  
mJ  
AS  
(starting T = 25 °C, I = I , V = 50 V)  
j
D
AR  
DD  
ELECTRICAL CHARACTERISTICS (TCASE = 25 °C UNLESS OTHERWISE SPECIFIED)  
OFF  
Symbol  
Parameter  
Drain-source  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
V
I
D
= 250 µA, V = 0  
200  
V
(BR)DSS  
GS  
Breakdown Voltage  
I
Zero Gate Voltage  
V
V
V
= Max Rating  
1
µA  
µA  
nA  
DSS  
DS  
Drain Current (V = 0)  
GS  
= Max Rating, T = 125 °C  
10  
DS  
GS  
C
I
Gate-body Leakage  
= ± 30V  
±100  
GSS  
Current (V = 0)  
DS  
ON (1)  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
4
Max.  
5
Unit  
V
V
GS(th)  
V
V
= V , I = 250µA  
Gate Threshold Voltage  
3
DS  
GS  
D
R
Static Drain-source On  
Resistance  
= 10V, I = 3.5 A  
0.30  
0.40  
DS(on)  
GS  
D
DYNAMIC  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
g
fs  
(1)  
Forward Transconductance  
V
DS  
> I  
D(on)  
x R  
DS(on)max,  
2
3
S
I
D
= 3.5 A  
C
C
V = 25V, f = 1 MHz, V = 0  
DS GS  
Input Capacitance  
Output Capacitance  
470  
135  
22  
650  
190  
30  
pF  
pF  
pF  
iss  
oss  
C
rss  
Reverse Transfer  
Capacitance  
2/10  
STD7NB20 / STD7NB20-1  
ELECTRICAL CHARACTERISTICS (CONTINUED)  
SWITCHING ON  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
t
V
R
= 100 V, I = 5 A  
Turn-on Delay Time  
10  
14  
ns  
d(on)  
DD  
D
= 4.7V = 10 V  
G
GS  
t
Rise Time  
15  
20  
24  
ns  
r
(see test circuit, Figure 3)  
Q
V
V
= 160V, I = 10 A,  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
17  
7.5  
5.5  
nC  
nC  
nC  
g
DD  
D
= 10V  
GS  
Q
gs  
Q
gd  
SWITCHING OFF  
Symbol  
Parameter  
Test Conditions  
Min.  
Min.  
Typ.  
Max.  
Unit  
t
Off-Voltage Rise Time  
Fall Time  
Cross-over Time  
V
R
= 160V, I = 10 A,  
8
10  
20  
ns  
ns  
ns  
11  
14  
28  
r(Voff)  
DD  
D
t
f
= 4.7Ω, V = 10V  
GS  
(see test circuit, Figure 3)  
G
t
c
SOURCE DRAIN DIODE  
Symbol  
Parameter  
Test Conditions  
Typ.  
Max.  
7
Unit  
A
I
Source-drain Current  
SD  
I
(2)  
(1)  
Source-drain Current (pulsed)  
Forward On Voltage  
28  
A
SDM  
V
I
I
= 7 A, V = 0  
1.5  
V
SD  
SD  
GS  
t
rr  
= 10 A, di/dt = 100A/µs  
Reverse Recovery Time  
Reverse Recovery Charge  
Reverse Recovery Current  
170  
980  
11.5  
ns  
nC  
A
SD  
V
= 50V, T = 150°C  
j
DD  
Q
rr  
(see test circuit, Figure 5)  
I
RRM  
Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.  
2. Pulse width limited by safe operating area.  
Safe Operating Area  
Thermal Impedance  
3/10  
STD7NB20 / STD7NB20-1  
Output Characteristics  
Transfer Characteristics  
Transconductance  
Static Drain-source On Resistance  
Gate Charge vs Gate-source Voltage  
Capacitance Variations  
4/10  
STD7NB20 / STD7NB20-1  
Normalized Gate Threshold Voltage vs Temp.  
Normalized On Resistance vs Temperature  
Source-drain Diode Forward Characteristics  
5/10  
STD7NB20 / STD7NB20-1  
Fig. 1: Unclamped Inductive Load Test Circuit  
Fig. 2: Unclamped Inductive Waveform  
Fig. 3: Switching Times Test Circuit For  
Fig. 4: Gate Charge test Circuit  
Resistive Load  
Fig. 5: Test Circuit For Inductive Load Switching  
And Diode Recovery Times  
6/10  
STD7NB20 / STD7NB20-1  
D2PAK MECHANICAL DATA  
mm.  
inch  
DIM.  
MIN.  
4.4  
TYP  
MAX.  
4.6  
MIN.  
0.173  
0.098  
0.001  
0.027  
0.044  
0.017  
0.048  
0.352  
TYP.  
MAX.  
0.181  
0.106  
0.009  
0.036  
0.067  
0.023  
0.053  
0.368  
A
A1  
A2  
B
2.49  
0.03  
0.7  
2.69  
0.23  
0.93  
1.7  
B2  
C
1.14  
0.45  
1.23  
8.95  
0.6  
C2  
D
1.36  
9.35  
D1  
E
8
0.315  
0.334  
10  
10.4  
0.393  
E1  
G
8.5  
4.88  
15  
5.28  
15.85  
1.4  
0.192  
0.590  
0.050  
0.055  
0.094  
0.208  
0.625  
0.055  
0.068  
0.126  
L
L2  
L3  
M
1.27  
1.4  
1.75  
3.2  
2.4  
R
0.4  
0.015  
V2  
0º  
8º  
3
7/10  
1
STD7NB20 / STD7NB20-1  
TO-251 (IPAK) MECHANICAL DATA  
mm  
inch  
TYP.  
DIM.  
MIN.  
TYP.  
MAX.  
2.4  
MIN.  
0.086  
0.035  
0.027  
0.025  
0.204  
MAX.  
0.094  
0.043  
0.051  
0.031  
0.212  
0.033  
A
A1  
A3  
B
2.2  
0.9  
1.1  
0.7  
1.3  
0.64  
5.2  
0.9  
B2  
B3  
B5  
B6  
C
5.4  
0.85  
0.3  
0.012  
0.95  
0.6  
0.6  
6.2  
6.6  
4.6  
16.3  
9.4  
1.2  
1
0.037  
0.023  
0.023  
0.244  
0.260  
0.181  
0.641  
0.370  
0.047  
0.039  
0.45  
0.48  
6
0.017  
0.019  
0.236  
0.252  
0.173  
0.626  
0.354  
0.031  
C2  
D
E
6.4  
4.4  
15.9  
9
G
H
L
L1  
L2  
0.8  
0.8  
0.031  
H
L
D
L2  
L1  
0068771-E  
8/10  
STD7NB20 / STD7NB20-1  
DPAK FOOTPRINT  
TUBE SHIPMENT (no suffix)*  
All dimensions  
are in millimeters  
All dimensions are in millimeters  
TAPE AND REEL SHIPMENT (suffix ”T4”)*  
REEL MECHANICAL DATA  
mm  
MIN. MAX. MIN. MAX.  
330 12.992  
inch  
DIM.  
A
B
C
D
G
N
T
1.5  
12.8  
20.2  
16.4  
50  
0.059  
13.2 0.504 0.520  
0.795  
18.4 0.645 0.724  
1.968  
22.4  
0.881  
BASE QTY  
BULK QTY  
2500  
TAPE MECHANICAL DATA  
2500  
mm  
MIN. MAX. MIN. MAX.  
6.8 0.267 0.275  
10.4 10.6 0.409 0.417  
12.1 0.476  
inch  
DIM.  
A0  
B0  
B1  
D
7
1.5  
1.5  
1.6 0.059 0.063  
0.059  
D1  
E
1.65 1.85 0.065 0.073  
7.4 7.6 0.291 0.299  
2.55 2.75 0.100 0.108  
F
K0  
P0  
P1  
P2  
R
3.9  
7.9  
1.9  
40  
4.1 0.153 0.161  
8.1 0.311 0.319  
2.1 0.075 0.082  
1.574  
W
15.7  
16.3 0.618 0.641  
* on sales type  
9/10  
STD7NB20 / STD7NB20-1  
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the  
consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from  
its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications  
mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information  
previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or  
systems without express written approval of STMicroelectronics.  
© The ST logo is a registered trademark of STMicroelectronics  
© 2002 STMicroelectronics - Printed in Italy - All Rights Reserved  
STMicroelectronics GROUP OF COMPANIES  
Australia - Brazil - Canada - China - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco  
Singapore - Spain - Sweden - Switzerland - United Kingdom - United States.  
© http://www.st.com  
10/10  

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