STP11N52K3 [STMICROELECTRONICS]

N-channel 525 V, 0.41 ohm, 10 A SuperMESH3 Power MOSFET; N沟道525 V, 0.41欧姆, 10 A SuperMESH3功率MOSFET
STP11N52K3
型号: STP11N52K3
厂家: ST    ST
描述:

N-channel 525 V, 0.41 ohm, 10 A SuperMESH3 Power MOSFET
N沟道525 V, 0.41欧姆, 10 A SuperMESH3功率MOSFET

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STB11N52K3, STF11N52K3  
STP11N52K3  
N-channel 525 V, 0.41 Ω, 10 A SuperMESH3™ Power MOSFET  
in D²PAK,TO-220FP and TO-220 packages  
Datasheet — production data  
Features  
TAB  
RDS(on)  
max.  
Order codes  
VDSS  
ID  
Pw  
3
3
STB11N52K3  
125 W  
2
2
1
1
STF11N52K3 525 V  
STP11N52K3  
< 0.51 Ω  
10 A 30 W  
125 W  
TO-220  
TO-220FP  
TAB  
100% avalanche tested  
Extremely high dv/dt capability  
Gate charge minimized  
3
1
PAK  
Very low intrinsic capacitance  
Improved diode reverse recovery  
characteristics  
Zener-protected  
Figure 1.  
Internal schematic diagram  
D(2,TAB)  
Applications  
Switching applications  
Description  
G(1)  
These devices are N-channel Power MOSFETs  
made using the SuperMESH3™ technology that  
is obtained via improvements applied to  
STMicroelectronics’ SuperMESH™ technology  
combined with a new optimized vertical structure.  
The resulting transistor has an extremely low on  
resistance, superior dynamic performance and  
high avalanche capability, making it especially  
suitable for the most demanding applications.  
S(3)  
AM01476v1  
Table 1.  
Device summary  
Order codes  
Marking  
Packages  
Packaging  
STB11N52K3  
STF11N52K3  
STP11N52K3  
PAK  
TO-220FP  
TO-220  
Tape and reel  
Tube  
11N52K3  
Tube  
March 2012  
Doc ID 018868 Rev 2  
1/20  
This is information on a product in full production.  
www.st.com  
20  
Contents  
STB11N52K3, STF11N52K3, STP11N52K3  
Contents  
1
2
Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
2.1  
Electrical characteristics (curves)  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
3
4
5
6
Test circuits  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
2/20  
Doc ID 018868 Rev 2  
STB11N52K3, STF11N52K3, STP11N52K3  
Electrical ratings  
1
Electrical ratings  
Table 2.  
Symbol  
Absolute maximum ratings  
Parameter  
Value  
Unit  
TO-220, D²PAK  
525  
30  
TO-220FP  
VDS  
VGS  
ID  
Drain- source voltage  
V
V
Gate- source voltage  
Drain current (continuous) at TC = 25 °C  
Drain current (continuous) at TC = 100 °C  
Drain current (pulsed)  
10  
6
10 (1)  
6 (1)  
40 (1)  
30  
A
A
ID  
(2)  
IDM  
40  
125  
A
PTOT  
IAR  
Total dissipation at TC = 25 °C  
W
Avalanche current, repetitive or not-  
repetitive (pulse width limited by TJ max)  
5
A
Single pulse avalanche energy  
EAS  
170  
mJ  
(starting TJ = 25 °C, ID = IAR, VDD = 50 V)  
Gate source ESD(HBM-C = 100 pF,  
R = 1.5 kΩ)  
dv/dt(3) Peak diode recovery voltage slope  
VESD(G-S)  
2500  
12  
V
V/ns  
Insulation withstand voltage (RMS) from all  
VISO  
three leads to external heat sink  
(t = 1 s; TC = 25 °C)  
2500  
TJ  
Operating junction temperature  
Storage temperature  
- 55 to 150  
°C  
Tstg  
1. Limited only by maximum temperature allowed  
2. Pulse width limited by safe operating area  
3.  
I
10 A, di/dt 400 A/µs, V = 80% V  
DD (BR)DSS  
SD  
Table 3.  
Symbol  
Thermal data  
Parameter  
Value  
TO-220FP  
4.17  
Unit  
TO-220  
PAK  
Rthj-case Thermal resistance junction-case max  
Rthj-amb Thermal resistance junction-amb max  
Rthj-pcb Thermal resistance junction-pcb max  
1
1
°C/W  
°C/W  
°C/W  
62.50  
30  
Maximum lead temperature for soldering  
purpose  
TJ  
300  
°C/W  
Doc ID 018868 Rev 2  
3/20  
Electrical characteristics  
STB11N52K3, STF11N52K3, STP11N52K3  
2
Electrical characteristics  
(Tcase =25 °C unless otherwise specified)  
Table 4.  
Symbol  
On /off states  
Parameter  
Test conditions  
ID = 1 mA, VGS = 0  
VDS = 525 V  
Min.  
Typ.  
Max. Unit  
Drain-source  
breakdown voltage  
V(BR)DSS  
525  
V
Zero gate voltage  
1
µA  
µA  
IDSS  
drain current (VGS = 0) VDS = 525 V, TC=125 °C  
50  
Gate-body leakage  
IGSS  
VGS  
=
20 V; VDS=0  
10  
µA  
V
current (VDS = 0)  
VGS(th)  
RDS(on)  
Gate threshold voltage VDS = VGS, ID = 50 µA  
Static drain-source on  
3
3.75  
0.41  
4.5  
VGS = 10 V, ID = 5 A  
0.51  
Ω
resistance  
Table 5.  
Symbol  
Dynamic  
Parameter  
Test conditions  
Min.  
Typ.  
Max. Unit  
Input capacitance  
Output capacitance  
Ciss  
Coss  
Crss  
1400  
110  
22  
pF  
V
V
DS = 50 V, f = 1 MHz,  
GS = 0  
-
-
pF  
pF  
Reverse transfer  
capacitance  
Equivalent output  
capacitance  
(1)  
Coss eq.  
VDS = 0 to 420 V, VGS = 0  
-
83  
3
-
pF  
Rg  
Gate input resistance f=1 MHz open drain  
1
7
Ω
Qg  
Qgs  
Qgd  
Total gate charge  
Gate-source charge  
Gate-drain charge  
VDD = 420 V, ID = 10 A,  
GS = 10 V  
(see Figure 18)  
51  
8
nC  
nC  
nC  
V
-
-
32  
1.  
C
is defined as a constant equivalent capacitance giving the same charging time as C  
when V  
DS  
oss eq.  
oss  
increases from 0 to 80% V  
DS  
Table 6.  
Symbol  
Switching times  
Parameter  
Test conditions  
Min. Typ. Max Unit  
td(on)  
tr  
td(off)  
tf  
Turn-on delay time  
Rise time  
7
ns  
ns  
ns  
ns  
VDD = 210 V, ID = 5 A,  
RG = 4.7 Ω, VGS = 10 V  
(see Figure 17)  
18  
-
-
Turn-off-delay time  
Fall time  
281  
42  
4/20  
Doc ID 018868 Rev 2  
 
STB11N52K3, STF11N52K3, STP11N52K3  
Electrical characteristics  
Min. Typ. Max Unit  
Table 7.  
Symbol  
Source drain diode  
Parameter  
Test conditions  
ISD  
Source-drain current  
10  
40  
A
A
-
-
(1)  
ISDM  
Source-drain current (pulsed)  
(2)  
VSD  
Forward on voltage  
ISD = 10 A, VGS = 0  
1.5  
V
trr  
Reverse recovery time  
Reverse recovery charge  
Reverse recovery current  
ISD = 10 A, di/dt = 100 A/µs  
VDD= 60 V  
270  
2700  
20  
ns  
nC  
A
Qrr  
-
-
IRRM  
(see Figure 19)  
trr  
Reverse recovery time  
Reverse recovery charge  
Reverse recovery current  
ISD = 10 A, di/dt = 100 A/µs  
VDD= 60 V TJ = 150 °C  
(see Figure 19)  
320  
3400  
22  
ns  
nC  
A
Qrr  
IRRM  
1. Pulse width limited by safe operating area  
2. Pulsed: pulse duration = 300 µs, duty cycle 1.5%  
Table 8.  
Symbol  
Gate-source Zener diode  
Parameter  
Test conditions  
Min. Typ. Max. Unit  
30  
Gate-source breakdown  
voltage  
BVGSO  
Igs= 1 mA (open drain)  
-
-
V
The built-in back-to-back Zener diodes have specifically been designed to enhance not only  
the device’s ESD capability, but also to make them safely absorb possible voltage transients  
that may occasionally be applied from gate to source. In this respect the Zener voltage is  
appropriate to achieve an efficient and cost-effective intervention to protect the device’s  
integrity. These integrated Zener diodes thus avoid the usage of external components.  
Doc ID 018868 Rev 2  
5/20  
Electrical characteristics  
STB11N52K3, STF11N52K3, STP11N52K3  
2.1  
Electrical characteristics (curves)  
Figure 2.  
Safe operating area for TO-220,  
PAK  
Figure 3.  
Thermal impedance for TO-220,  
PAK  
AM09112v1  
I
D
(A)  
Tj=150°C  
Tc=25°C  
Single pulse  
10  
10µs  
100µs  
1ms  
1
10ms  
0.1  
10  
VDS(V)  
0.1  
1
100  
Figure 4.  
Safe operating area for TO-220FP  
Figure 5.  
Thermal impedance for TO-220FP  
AM09113v1  
I
D
(A)  
Tj=150°C  
Tc=25°C  
Single pulse  
10  
10µs  
100µs  
1ms  
1
10ms  
0.1  
0.01  
10  
VDS(V)  
0.1  
1
100  
Figure 6.  
Output characteristics  
Figure 7.  
Transfer characteristics  
AM09114v1  
AM09115v1  
I
D
(A)  
I
D
(A)  
VDS=15V  
VGS=10V  
20  
20  
15  
10  
7V  
15  
10  
5
6V  
5
0
5V  
0
0
9
VGS(V)  
8
6
7
1
3
4
5
5
2
20  
25  
V
DS(V)  
0
10  
15  
6/20  
Doc ID 018868 Rev 2  
STB11N52K3, STF11N52K3, STP11N52K3  
Electrical characteristics  
Figure 8.  
Gate charge vs gate-source voltage Figure 9.  
Static drain-source on resistance  
AM09116v1  
AM09117v1  
V
(V)  
GS  
DS(on) (Ω)  
0.54  
R
VDS  
V
GS=10V  
V
DD=420V  
400  
12  
10  
8
ID=10A  
0.52  
350  
0.50  
0.48  
0.46  
0.44  
0.42  
300  
250  
200  
6
150  
100  
4
2
0
0.40  
50  
0
0.38  
0.36  
4
6
10  
12  
2
8
20  
40  
60  
Qg  
(nC)  
ID(A)  
0
0
Figure 10. Capacitance variations  
Figure 11. Output capacitance stored energy  
AM09118v1  
AM09119v1  
C
(pF)  
Eoss (µJ)  
6
1000  
100  
5
4
3
2
Ciss  
Coss  
Crss  
10  
1
1
0
500  
0.1  
100  
200  
400  
1
10  
V
DS(V)  
0
100  
300  
VDS(V)  
Figure 12. Normalized gate threshold voltage Figure 13. Normalized on resistance vs  
vs temperature temperature  
AM09120v1  
AM09121v1  
V
GS(th)  
(norm)  
R
DS(on)  
(norm)  
ID=1.2A  
1.10  
1.00  
0.90  
2.5  
2.0  
1.5  
1.0  
0.80  
0.5  
0.0  
0.70  
-75  
-50  
-25  
-25  
25  
75  
T
J(°C)  
0
25 50 75  
TJ(°C)  
125  
100  
Doc ID 018868 Rev 2  
7/20  
Electrical characteristics  
STB11N52K3, STF11N52K3, STP11N52K3  
Figure 14. Source-drain diode forward  
characteristics  
Figure 15. Normalized BVDSS vs temperature  
AM09123v1  
AM09122v1  
BVDSS  
SD (V)  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
V
(norm)  
TJ=-50°C  
TJ=25°C  
1.10  
TJ=150°C  
1.05  
1.00  
0.95  
0.90  
0.1  
0
0
-75  
1
2
3
4
5
I
SD(A)  
-25  
25  
75  
TJ(°C)  
125  
Figure 16. Maximum avalanche energy vs  
starting Tj  
AM09124v1  
EAS  
(mJ)  
I
D
=5 A  
180  
160  
140  
120  
100  
80  
V
DD=50 V  
60  
40  
20  
0
0
20  
40  
60  
80 100  
120  
140 T  
J(°C)  
8/20  
Doc ID 018868 Rev 2  
STB11N52K3, STF11N52K3, STP11N52K3  
Test circuits  
3
Test circuits  
Figure 17. Switching times test circuit for  
resistive load  
Figure 18. Gate charge test circuit  
VDD  
12V  
47kΩ  
1kΩ  
100nF  
2200  
3.3  
μF  
RL  
μF  
IG=CONST  
VDD  
100Ω  
Vi=20V=VGMAX  
D.U.T.  
VG  
VD  
RG  
VGS  
2200  
μF  
D.U.T.  
2.7kΩ  
47kΩ  
PW  
1kΩ  
PW  
AM01468v1  
AM01469v1  
Figure 19. Test circuit for inductive load  
switching and diode recovery times  
Figure 20. Unclamped inductive load test  
circuit  
L
A
A
A
B
D
FAST  
DIODE  
L=100μH  
VD  
G
2200  
μF  
D.U.T.  
B
3.3  
μF  
VDD  
S
3.3  
μF  
1000  
μF  
B
VDD  
25  
Ω
ID  
D
G
RG  
S
Vi  
D.U.T.  
Pw  
AM01470v1  
AM01471v1  
Figure 21. Unclamped inductive waveform  
Figure 22. Switching time waveform  
ton  
tdon  
toff  
tdoff  
V(BR)DSS  
tr  
tf  
VD  
90%  
10%  
90%  
IDM  
10%  
VDS  
ID  
0
0
VDD  
VDD  
90%  
VGS  
10%  
AM01472v1  
AM01473v1  
Doc ID 018868 Rev 2  
9/20  
Package mechanical data  
STB11N52K3, STF11N52K3, STP11N52K3  
4
Package mechanical data  
In order to meet environmental requirements, ST offers these devices in different grades of  
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®  
specifications, grade definitions and product status are available at: www.st.com. ECOPACK  
is an ST trademark.  
10/20  
Doc ID 018868 Rev 2  
 
STB11N52K3, STF11N52K3, STP11N52K3  
Package mechanical data  
Table 9.  
Dim.  
TO-220FP mechanical data  
mm  
Min.  
Typ.  
Max.  
A
B
4.4  
2.5  
4.6  
2.7  
D
2.5  
2.75  
0.7  
E
0.45  
0.75  
1.15  
1.15  
4.95  
2.4  
F
1
F1  
F2  
G
1.70  
1.70  
5.2  
G1  
H
2.7  
10  
10.4  
L2  
L3  
L4  
L5  
L6  
L7  
Dia  
16  
28.6  
9.8  
2.9  
15.9  
9
30.6  
10.6  
3.6  
16.4  
9.3  
3
3.2  
Doc ID 018868 Rev 2  
11/20  
Package mechanical data  
Figure 23. TO-220FP drawing  
STB11N52K3, STF11N52K3, STP11N52K3  
7012510_Rev_K_B  
12/20  
Doc ID 018868 Rev 2  
STB11N52K3, STF11N52K3, STP11N52K3  
Package mechanical data  
Table 10. TO-220 type A mechanical data  
mm  
Dim.  
Min.  
Typ.  
Max.  
A
b
4.40  
0.61  
1.14  
0.48  
15.25  
4.60  
0.88  
1.70  
0.70  
15.75  
b1  
c
D
D1  
E
1.27  
10  
10.40  
2.70  
5.15  
1.32  
6.60  
2.72  
14  
e
2.40  
4.95  
1.23  
6.20  
2.40  
13  
e1  
F
H1  
J1  
L
L1  
L20  
L30  
P  
Q
3.50  
3.93  
16.40  
28.90  
3.75  
2.65  
3.85  
2.95  
Doc ID 018868 Rev 2  
13/20  
Package mechanical data  
Figure 24. TO-220 type A drawing  
STB11N52K3, STF11N52K3, STP11N52K3  
0015988_typeA_Rev_S  
14/20  
Doc ID 018868 Rev 2  
STB11N52K3, STF11N52K3, STP11N52K3  
Package mechanical data  
Table 11. PAK (TO-263) mechanical data  
mm  
Dim.  
Min.  
Typ.  
Max.  
A
A1  
b
4.40  
0.03  
0.70  
1.14  
0.45  
1.23  
8.95  
7.50  
10  
4.60  
0.23  
0.93  
1.70  
0.60  
1.36  
9.35  
b2  
c
c2  
D
D1  
E
10.40  
E1  
e
8.50  
2.54  
e1  
H
4.88  
15  
5.28  
15.85  
2.69  
2.79  
1.40  
1.75  
J1  
L
2.49  
2.29  
1.27  
1.30  
L1  
L2  
R
0.4  
V2  
0°  
8°  
Doc ID 018868 Rev 2  
15/20  
Package mechanical data  
Figure 25. PAK (TO-263) drawing  
STB11N52K3, STF11N52K3, STP11N52K3  
0079457_T  
Figure 26. PAK footprint(a)  
16.90  
12.20  
5.08  
1.60  
3.50  
9.75  
Footprint  
a. All dimension are in millimeters  
16/20  
Doc ID 018868 Rev 2  
STB11N52K3, STF11N52K3, STP11N52K3  
Package mechanical data  
5
Package mechanical data  
Table 12. PAK (TO-263) tape and reel mechanical data  
Tape  
Reel  
mm  
mm  
Dim.  
Dim.  
Min.  
Max.  
Min.  
Max.  
A0  
B0  
D
10.5  
15.7  
1.5  
10.7  
15.9  
1.6  
A
B
C
D
G
N
T
330  
1.5  
12.8  
20.2  
24.4  
100  
13.2  
26.4  
30.4  
D1  
E
1.59  
1.65  
11.4  
4.8  
1.61  
1.85  
11.6  
5.0  
F
K0  
P0  
P1  
P2  
R
3.9  
4.1  
11.9  
1.9  
12.1  
2.1  
Base qty  
Bulk qty  
1000  
1000  
50  
T
0.25  
23.7  
0.35  
24.3  
W
Doc ID 018868 Rev 2  
17/20  
Package mechanical data  
STB11N52K3, STF11N52K3, STP11N52K3  
Figure 27. Tape for D²PAK (TO-263)  
10 pitches cumulative  
tolerance on tape +/- 0.2 mm  
P0  
D
P2  
Top cover  
tape  
T
E
F
W
K0  
B0  
A0  
D1  
P1  
User direction of feed  
R
Bending radius  
User direction of feed  
AM08852v2  
Figure 28. Reel for D²PAK (TO-263)  
T
REEL DIMENSIONS  
40mm min.  
Access hole  
At sl ot location  
B
D
C
N
A
G measured at hub  
Full radius  
Tape slot  
in core for  
tape start 25 mm min.  
width  
AM08851v2  
18/20  
Doc ID 018868 Rev 2  
STB11N52K3, STF11N52K3, STP11N52K3  
Revision history  
6
Revision history  
Table 13. Document revision history  
Date  
Revision  
Changes  
20-May-2011  
1
First release.  
Inserted max and min. values for RG in Table 5.  
Updated Section 4: Package mechanical data.  
27-Mar-2012  
2
Doc ID 018868 Rev 2  
19/20  
STB11N52K3, STF11N52K3, STP11N52K3  
Please Read Carefully:  
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the  
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any  
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