STP22NF03L [STMICROELECTRONICS]

N-CHANNEL 30V - 0.038ohm - 22A TO-220 STripFET⑩ POWER MOSFET; N沟道30V - 0.038ohm - 22A TO- 220 STripFET⑩功率MOSFET
STP22NF03L
型号: STP22NF03L
厂家: ST    ST
描述:

N-CHANNEL 30V - 0.038ohm - 22A TO-220 STripFET⑩ POWER MOSFET
N沟道30V - 0.038ohm - 22A TO- 220 STripFET⑩功率MOSFET

晶体 晶体管 功率场效应晶体管 开关 脉冲 局域网
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STP22NF03L  
N-CHANNEL 30V - 0.038- 22A TO-220  
STripFET™ POWER MOSFET  
TYPE  
V
DSS  
R
I
D
DS(on)  
STP22NF03L  
30V  
<0.05Ω  
22A  
TYPICAL R (on) = 0.038Ω  
DS  
EXCEPTIONAL dv/dt CAPABILITY  
LOW GATE CHARGE AT 100°C  
APPLICATION ORIENTED CHARACTERIZATION  
3
2
1
TO-220  
DESCRIPTION  
This Power Mosfet is the latest development of STMi-  
croelectronics unique “Single Feature Size™” strip-  
based process. The resulting transistor shows ex-  
tremely high packing density for low on-resistance,  
rugged avalance characteristics and less critical align-  
ment steps therefore a remarkable manufacturing re-  
producibility.  
INTERNAL SCHEMATIC DIAGRAM  
APPLICATIONS  
DC-DC & DC-AC CONVERTERS  
MOTOR CONTROL, AUDIO AMPLIFIERS  
HIGH CURRENT, HIGH SPEED SWITCHING  
SOLENOID AND RELAY DRIVERS  
AUTOMOTIVE ENVIRONMENT  
ABSOLUTE MAXIMUM RATINGS  
Symbol  
Parameter  
Value  
Unit  
V
Drain-source Voltage (V = 0)  
30  
30  
V
V
DS  
GS  
V
Drain-gate Voltage (R = 20 k)  
DGR  
GS  
V
Gate- source Voltage  
±15  
22  
V
GS  
I
Drain Current (continuos) at T = 25°C  
A
D
C
I
Drain Current (continuos) at T = 100°C  
16  
A
D
C
I
()  
Drain Current (pulsed)  
88  
A
DM  
P
TOT  
Total Dissipation at T = 25°C  
45  
W
C
Derating Factor  
0.3  
W/°C  
V/ns  
mJ  
°C  
°C  
dv/dt (1)  
Peak Diode Recovery voltage slope  
Single Pulse Avalanche Energy  
Storage Temperature  
6
E
AS  
(2)  
200  
–65 to 175  
175  
T
stg  
T
Max. Operating Junction Temperature  
j
() Pulse width limited by safe operating area  
(1) I 10A, di/dt 300A/µs, V V  
, T T  
j JMAX.  
SD  
DD  
(BR)DSS  
(2) Starting T =25°C, I =11A, V =15V  
j
D
DD  
Aug 2000  
1/8  
STP22NF03L  
THERMAL DATA  
Rthj-case  
Thermal Resistance Junction-case Max  
3.33  
62.5  
300  
°C/W  
°C/W  
°C  
Rthj-amb  
Thermal Resistance Junction-ambient Max  
T
Maximum Lead Temperature For Soldering Purpose  
l
ELECTRICAL CHARACTERISTICS (TCASE = 25 °C UNLESS OTHERWISE SPECIFIED)  
OFF  
Symbol  
Parameter  
Drain-source  
Breakdown Voltage  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
V
I
D
= 250 µA, V = 0  
30  
V
(BR)DSS  
GS  
V
V
= Max Rating  
1
µA  
µA  
DS  
Zero Gate Voltage  
I
I
DSS  
Drain Current (V = 0)  
GS  
= Max Rating, T = 125 °C  
10  
DS  
GS  
C
Gate-body Leakage  
V
= ±20V  
±100  
nA  
GSS  
Current (V = 0)  
DS  
ON (1)  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
V
V
GS(th)  
V
V
V
= V , I = 250µA  
Gate Threshold Voltage  
1
DS  
GS  
GS  
GS  
D
= 10V, I = 11 A  
0.038  
0.045  
0.05  
0.06  
D
Static Drain-source On  
Resistance  
R
DS(on)  
D(on)  
= 5 V, I = 11 A  
D
V
V
> I  
x R  
DS  
D(on) DS(on)max,  
I
On State Drain Current  
22  
A
= 10V  
GS  
DYNAMIC  
Symbol  
Parameter  
Test Conditions  
> I x R  
D(on)  
=11A  
Min.  
Typ.  
Max.  
Unit  
V
DS  
DS(on)max,  
g
fs  
(1)  
Forward Transconductance  
7
S
I
D
C
C
Input Capacitance  
Output Capacitance  
330  
90  
pF  
pF  
iss  
oss  
V
DS  
= 25V, f = 1 MHz, V = 0  
GS  
Reverse Transfer  
Capacitance  
C
rss  
40  
pF  
2/8  
STP22NF03L  
ELECTRICAL CHARACTERISTICS (CONTINUED)  
SWITCHING ON  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
t
V
R
= 15V, I = 11A  
Turn-on Delay Time  
11  
ns  
d(on)  
DD  
D
= 4.7V = 4.5V  
G
GS  
t
Rise Time  
100  
6.5  
ns  
r
(see test circuit, Figure 3)  
V
V
= 24V, I = 22A,  
DD  
D
Q
Total Gate Charge  
9
nC  
g
= 10V  
GS  
Q
Gate-Source Charge  
Gate-Drain Charge  
3.6  
2
nC  
nC  
gs  
Q
gd  
SWITCHING OFF  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
V
DD  
= 15V, I = 11A,  
D
t
Turn-off-Delay Time  
R
G
= 4.7Ω, V = 4.5V  
25  
ns  
d(off)  
GS  
(see test circuit, Figure 3)  
t
Fall Time  
22  
22  
ns  
ns  
f
Vclamp =24V, I =22A  
D
t
Off-voltage Rise Time  
r(off)  
R
G
= 4.7Ω, V = 4.5V  
GS  
t
Fall Time  
(see test circuit, Figure 5)  
55  
75  
ns  
ns  
f
t
Cross-over Time  
c
SOURCE DRAIN DIODE  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
22  
Unit  
A
I
Source-drain Current  
SD  
I
(1)  
(2)  
Source-drain Current (pulsed)  
Forward On Voltage  
88  
A
SDM  
V
I
I
= 22A, V = 0  
1.5  
V
SD  
SD  
GS  
= 22A, di/dt = 100A/µs,  
= 15V, T = 150°C  
SD  
t
rr  
Reverse Recovery Time  
V
30  
ns  
DD  
j
(see test circuit, Figure 5)  
Q
Reverse Recovery Charge  
Reverse Recovery Current  
18  
nC  
A
rr  
I
1.2  
RRM  
Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.  
2. Pulse width limited by safe operating area.  
Safe Operating Area  
Thermal Impedence  
3/8  
STP22NF03L  
Output Characteristics  
Transfer Characteristics  
Transconductance  
Static Drain-source On Resistance  
Gate Charge vs Gate-source Voltage  
Capacitance Variations  
4/8  
STP22NF03L  
Normalized Gate Thereshold Voltage vs Temp. Normalized On Resistance vs Temperature  
Source-drain Diode Forward Characteristics  
5/8  
STP22NF03L  
Fig. 1: Unclamped Inductive Load Test Circuit  
Fig. 2: Unclamped Inductive Waveform  
Fig. 3: Switching Times Test Circuit For  
Fig. 4: Gate Charge test Circuit  
Resistive Load  
Fig. 5: Test Circuit For Inductive Load Switching  
And Diode Recovery Times  
6/8  
STP22NF03L  
TO-220 MECHANICAL DATA  
mm  
inch  
TYP.  
DIM.  
MIN.  
4.40  
1.23  
2.40  
TYP.  
MAX.  
4.60  
1.32  
2.72  
MIN.  
0.173  
0.048  
0.094  
MAX.  
0.181  
0.051  
0.107  
A
C
D
D1  
E
1.27  
0.050  
0.49  
0.61  
1.14  
1.14  
4.95  
2.4  
0.70  
0.88  
1.70  
1.70  
5.15  
2.7  
0.019  
0.024  
0.044  
0.044  
0.194  
0.094  
0.393  
0.027  
0.034  
0.067  
0.067  
0.203  
0.106  
0.409  
F
F1  
F2  
G
G1  
H2  
L2  
L4  
L5  
L6  
L7  
L9  
DIA.  
10.0  
10.40  
16.4  
0.645  
13.0  
2.65  
15.25  
6.2  
14.0  
2.95  
15.75  
6.6  
0.511  
0.104  
0.600  
0.244  
0.137  
0.147  
0.551  
0.116  
0.620  
0.260  
0.154  
0.151  
3.5  
3.93  
3.85  
3.75  
L2  
Dia.  
L5  
L9  
L7  
L6  
L4  
P011C  
7/8  
STP22NF03L  
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences  
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is  
granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are  
subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products  
are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.  
The ST logo is a trademark of STMicroelectronics  
© 2000 STMicroelectronics – Printed in Italy – All Rights Reserved  
STMicroelectronics GROUP OF COMPANIES  
Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia - Malta - Morocco -  
Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A.  
http://www.st.com  
8/8  

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