STPS5H100UFN [STMICROELECTRONICS]

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型号：	STPS5H100UFN
厂家：	ST
描述：	暂无描述高压高电压电源
文件：	总5页 (文件大小：70K)
中文：	中文翻译
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STPS5H100

HIGH VOLTAGE POWER SCHOTTKY RECTIFIER

Table 1: Main Product Characteristics

I_F(AV)

V_RRM

T_j

5 A

100 V

175°C

0.61 V

V_F(max)

DPAK

FEATURES AND BENEFITS

■

Negligible switching losses

High junction temperature capability

Low leakage current

Good trade off between leakage current and

forward voltage drop

Avalanche specification

Table 2: Order Codes

Part Number

Marking

S5H100

STPS5H100B

STPS5H100B-TR

■

DESCRIPTION

High voltage Schottky barrier rectifier designed for

high frequency miniature Switched Mode Power

Supplies such as adaptators and on board DC to

DC converters.

Table 3: Absolute Maximum (limiting values)

Symbol

Parameter

Value

Unit

V_RRM

Repetitive peak reverse voltage

RMS forward voltage

100

I_F(RMS)

I_F(AV)

I_FSM

I_RRM

I_RSM

P_ARM

T_stg

Average forward current

T_c= 165°C δ = 0.5

t_p= 10ms sinusoidal

t_p= 2µs F = 1KHz

t_p= 100µs square

t_p= 1µs T_j= 25°C

Surge non repetitive forward current

Repetitive peak reverse current

Non repetitive peak reverse current

Repetitive peak avalanche power

Storage temperature range

7200

°C

V/µs

-65 to + 175

175

T_j

Maximum operating junction temperature

Critical rate of rise of reverse voltage

dV/dt

10000

dPtot

dTj

* : --------------- > ------------------------- thermal runaway condition for a diode on its own heatsink

Rth(j – a)

February 2006

REV. 8

1/5

STPS5H100

Table 4: Thermal Parameters

Symbol

Parameter

Value

Unit

R_th(j-c)Junction to case

2.5

°C/W

Table 5: Static Electrical Characteristics

Symbol

Parameter

Tests conditions

Min.

Typ

1.3

Max.

Unit

µA

T_j= 25°C

3.5

4.5

I_R*

V_R= V_RRM

I_F= 5A

Reverse leakage current

T_j= 125°C

T_j= 25°C

T_j= 125°C

T_j= 25°C

T_j= 125°C

0.73

0.61

0.85

0.71

0.57

0.66

V_F**

Forward voltage drop

I_F= 10A

Pulse test:

* tp = 5 ms, δ < 2%

^{** tp = 380 µs,}δ < 2%

To evaluate the conduction losses use the following equation: P = 0.51 x I

+ 0.02 I

F(AV)

F (RMS)

Figure 1: Average forward power dissipation

versus average forward current

Figure 2: Average forward current versus

ambient temperature (δ = 0.5)

IF(av)(A)

PF(av)(W)

4.0

δ = 0.2

Rth(j-a)=Rth(j-c)

δ = 0.5

δ = 0.1

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

δ = 0.05

δ = 1

Rth(j-a)=80°C/W

=tp/T

IF(av) (A)

Tamb(°C)

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0

80 100 120 140 160 180

Figure 3: Normalized avalanche power

derating versus pulse duration

Figure 4: Normalized avalanche power

derating versus junction temperature

(t )

(1µs)

ARM

(t )

(25°C)

ARM

1.2

0.1

0.8

0.6

0.4

0.2

0.01

T (°C)

t (µs)

0.001

100

125

150

0.01

0.1

100

1000

2/5

STPS5H100

Figure 5: Non repetitive surge peak forward

current versus overload duration (maximum

values)

Figure 6: Relative variation of thermal

impedance junction to case versus pulse

duration

IM(A)

Zth(j-c)/Rth(j-c)

120

110

100

1.0

0.8

δ = 0.5

0.6

Tc=50°C

δ = 0.2

0.4

Tc=75°C

δ = 0.1

Tc=125°C

0.2

Single pulse

t(s)

tp(s)

δ=0.5

=tp/T

0.0

1E-3

1E-2

1E-1

1E+0

1E-3

1E-2

1E-1

1E+0

Figure 7: Reverse leakage current versus

reverse voltage applied

Figure 8: Junction capacitance versus reverse

voltage applied (typical values)

IR(µA)

C(pF)

5E+3

1000

F=1MHz

Tj=25°C

1E+3

Tj=125°C

1E+2

1E+1

1E+0

100

Tj=25°C

1E-1

VR(V)

1E-2

100

10 20 30 40 50 60 70 80 90 100

Figure 9: Forward voltage drop versus forward

current (maximum values)

Figure 10: Thermal resistance junction to

ambient versus copper surface under tab

(Epoxy printed circuit board, copper

thickness: 35µm)

IFM(A)

Rth(j-a) (°C/W)

50.0

100

Tj=125°C

10.0

Tj=25°C

1.0

S(Cu) (cm²)

8 10 12 14 16 18 20

VFM(V)

0.1

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

3/5

STPS5H100

Figure 11: DPAK Package Mechanical Data

DIMENSIONS

Millimeters Inches

Min. Min.

REF.

Max

2.40

1.10

0.23

0.90

5.40

0.60

6.20

6.60

4.60

10.10

Max.

0.094

0.043

0.009

0.035

0.212

0.023

0.244

0.259

0.181

0.397

2.20

0.90

0.03

0.64

5.20

0.45

0.48

6.00

6.40

4.40

9.35

0.086

0.035

0.001

0.025

0.204

0.017

0.018

0.236

0.251

0.173

0.368

0.80 typ.

0.031 typ.

0.60 MIN.

0.60

0°

1.00

8°

0.023

0°

0.039

8°

Figure 12: Foot Print Dimensions (in millimeters)

1.6

6.7

2.3

6.7

1.6

In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These

packages have a Lead-free second level interconnect . The category of second level interconnect is

marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The

maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an

ST trademark. ECOPACK specifications are available at: www.st.com.

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STPS5H100

Table 6: Ordering Information

Ordering type

STPS5H100B

Marking

Package

Weight

Base qty

Delivery mode

Tube

S5H100

DPAK

0.30 g

STPS5H100B-TR

2500

Tape & reel

■

Cooling method: by conduction (C)

Table 7: Revision History

Date

Revision

Description of Changes

Jul-2003

Last issue.

03-Nov-2005

15-Feb-2006

DPAK Foot Print dimensions updated.

ECOPACK statement added.

Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences

of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted

by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject

to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not

authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.

The ST logo is a registered trademark of STMicroelectronics.

All other names are the property of their respective owners

STMicroelectronics group of companies

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www.st.com

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