U2794B-FS [TEMIC]
Demodulator, Quadraphase, SSO-20;
| 型号： | U2794B-FS |
| 厂家： | 
TEMIC SEMICONDUCTORS |
| 描述： | Demodulator, Quadraphase, SSO-20 |
| 文件： | 总11页 (文件大小：259K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
U2794B
TELEFUNKEN Semiconductors
1000 MHz Quadrature Demodulator
Description
U2794B silicon monolithic integrated circuit is a quadra- gain, power down mode and is adjustment free. The IC is
ture demodulator that is manufactured using suitable for direct conversion and image rejection
TELEFUNKEN’s advanced UHF technology. This applications in digital radio systems up to 1 GHz such as
demodulator features
a
frequency range from cellular radio, cordless telephone, cable TV and satellite
70 – 1000 MHz, low current consumption, selectable TV systems.
Features
Supply voltage 5 V (typ.)
Low LO input level –10 dBm (typ.)
Very low power consumption 125 mW (typ.)
LO – frequency from 70 MHz to 1 GHz
Power down mode
Very good image rejection by means of phase control
loop for precise 90° phase shifting
25 dB gain control
Duty cycle regeneration for single ended LO input
signal
Very low I/Q output dc offset voltage typ. < 5 mV
Block Diagram
V
IIX
4
II
S
PD
5,6
14
3
IX
1
Power
down
OUTPUT
I
2
7
15
0°
90°
90°Control
Frequency
doubler
Duty cycle
regenerator
17 LO
RFin
loop
13
PC
8
12
PCX
Q
19
20
OUTPUT
QX
11
16,18
10
9
95 9778
GC
GND
QQ
QQX
Ordering Information
Extended Type Number
U2794B-AFS
Package
SSO 20
SSO 20
Remarks
Rail, MOQ 830 pcs.
Tape and reel, MOQ 4000 pcs.
U2794B-AFSG3
Rev. A3: 23.08.1995
1 (11)
U2794B
TELEFUNKEN Semiconductors
Pin Description
Pin
1
2
3
4
5
6
7
8
Symbol
Function
1
2
20
19
18
17
16
15
14
13
12
11
IX
QX
Q
IX
I
II
IX output
I output
I
II low pass filter I
IIX low pass filter I
Supply voltage
Supply voltage
RF input
IIX
II
3
GND
V
S
V
S
4
IIX
LO
RF
in
in
RFX
RFX input
in
V
S
5
9
QQ
QQX
GC
PCX
PC
QQ low pass filter Q
QQX low pass filter Q
GC gain control
PCX phase control
PC phase control
PD power down
LOX input
GND
LOX
10
11
12
13
14
15
16
17
18
19
20
6
V
S
in
RF
7
in
PD
PD
8
LOX
RFX
PC
in
in
GND
Ground
LO input
Ground
Q output
9
LO
PCX
GC
in
QQ
QQX
GND
Q
QX
10
QX output
95 10711
Electrostatic sensitive device, observe precautions for handling!
Absolute Maximum Ratings
Parameters
Pins 5 and 6
Pins 7, 8 and 17
Symbol
Value
6
Unit
V
Supply voltage
V
S
Input voltage
V
i
0 to V
125
V
S
Junction temperature
Storage temperature range
T
°C
°C
j
T
stg
–40 to 125
Operating Range
Parameters
Pins 5 and 6
Ambient temperature range
Symbol
Value
4.75 to 5.25
–40 to 85
Unit
V
°C
Supply voltage range
V
S
T
amb
Thermal Resistance
Parameters
SSO 20
Symbol
R
thJA
Value
140
Unit
K/W
Junction ambient
2 (11)
Rev. A3: 23.08.1995
U2794B
TELEFUNKEN Semiconductors
Electrical Characteristics
Test conditions (unless otherwise specified); V = 5 V, T
= 25°C, referred to test circuit
S
amb
System impedance Z = 50 , fiLO = 950 MHz, PiLO = –10 dBm
O
Parameters
Supply voltage range
Supply current
Test Conditions / Pins
Pins 5 and 6
Symbol
Min.
4.75
Typ.
30
Max.
5.25
Unit
V
V
S
Pins 5 and 6
I
mA
S
Power down mode, PD
“OFF”mode supply
current
V
V
≤ 0.5 V
= 1.0 V
Pins 5 and 6
Pin 14
IsPD
≤ 1
20
PD
PD
Note 1
Switch voltage
“Power ON”
Pin 14
VPON
4
V
V
“Power DOWN”
VPOFF
1
LO input, LO
Pin 17
in
Frequency range
Input level
fiLO
PiLO
70
1000
–5
MHz
dBm
Note 2
–12
–10
50
Input impedance
See figure 6
See figure 2
ZiLO
Voltage standing wave
ratio
VSWRLO
1.2
2
Duty cycle range
LODCR
NF
0.4
0.6
RF input, RF
in
Noise figure (DSB)
symmetrical output
@ 950 MHz Note 3
12
10
dB
@ 100 MHz
Pins 7 and 8
Frequency range
Pins 7 and 8
Pins 7 and 8
fiRF
>fiLO
–1 dB input
compression point
High gain
Low gain
ICPHG
ICPLG
–8
+3.5
dBm
dBm
dBm
Second order IIP
Third order IIP
Note 4
Pins 7 and 8
Pins 7 and 8
IIP2HG
35
High gain
Low gain
IIP3HG
IIP3LG
+3
+13
LO leakage
Pins 7 and 8
LOL
Symmetric input
Asymmetric input
≤ –60
≤ –55
dBm
Input impedance
Pins 7 and 8
ZiRF
500
see figure 6
0.8pF
Note 1: During power down status a load circuitry with dc-isolation to GND is assumed otherwise a current of
(V –0.8 V) /RI has to be added to the above power down current for each output I, IX, Q, QX.
I
S
Note 2: The required LO-Level is a function of the LO-frequency (see figure 3).
Note 3: Measured with input matching. For 950 MHz the optional transmission line T3 at the RF input may be used
for this purpose. Noise figure measurements without using the differential output signal result in a worse noise
figure.
Note 4: Using Pins 7 and 8 as a symmetric RF input, the second order IIP can be improved.
Rev. A3: 23.08.1995
3 (11)
U2794B
TELEFUNKEN Semiconductors
Electrical Characteristics
Test conditions (unless otherwise specified); V = 5 V, T
= 25°C, referred to test circuit
S
amb
System impedance Z = 50 , fiLO = 950 MHz, PiLO = –10 dBm
O
Parameters
I/O outputs
Test Conditions / Pins
Symbol
Min.
Typ.
Max.
Unit
Emitter follower
I = 0.6 mA
I, IX / Q,
QX
3 dB-bandwidth
w/o external C
Note 5
Pins 1, 2, 19 and 20
BWI/Q
≥ 30
MHz
I/Q amplitude
imbalance
Pins 1, 2, 19 and 20
Pins 1, 2, 19 and 20
Pins 1, 2, 19 and 20
AII/Q
QEI/Q
≤ ±0.2
≤ ±1.5
dB
I/Q quadrature error
Deg
I/Q maximum output
swing
Max I/Q
2
V
PP
Symm. output R > 5 k
L
DC output voltage
Pins 1, 2, 19 and 20
VOUT
2.8
< 5
V
DC output offset voltage Note 6
VOFSI/Q
I/IX
Q/QX
mV
Pins 1, 2, 19 and 20
Pins 1, 2, 19 and 20
Output impedance
Zout
50
see figure 6
Gain control, GC
Control range power
Pin 11
GCR
25
dB
gain, gain high/gain low Note 7
PGH/GGL
23/–2
Switch voltage
“Gain high”
Pin 11
Pin 11
GCVHigh
GCVLow
1
V
V
“Gain low”
Note 8
Settling time, ST
Power “OFF” – “ON”
Power “ON” – “OFF”
STON
< 4
< 4
s
s
STOFF
Note 5: Due to test board parasitics this bandwidth is reduced and not equal for I, IX, Q, QX.
If symmetry and full bandwidth is required the lowpass Pins 3, 4 and 9, 10 should be isolated from the board.
The bandwidth of the I/Q outputs can be increased further by using a resistor between the Pins 3, 4, 9 and 10.
This resistors shunt the internal loads of RI 5.4 k The decrease in gain here has to be considered.
Note 6: Output emitter follower internal acurrent I = 0.6 mA allows only small voltage swing with a 50 load.
For low signal distortion the load impedance should be RI ≥ 5 k
2
I2
Q
Note 7: Referred to the level of the output vector
.
Note 8: The low gain status is achieved with an open or high ohmic Pin 11. A recommended application circuit for
switching between high and low gain status is shown in figure 1.
4 (11)
Rev. A3: 23.08.1995
U2794B
TELEFUNKEN Semiconductors
Test Circuit
95 9842
1n
*
optional for single ended tests (notice 3 dB bandwidth of AD620)
T1, T2 = transmission line Z = 50
.
O
If no GC function is required, connect pin 11 to GND.
For high and low gain status GC’ is to be switched to GND respectively to V .
S
Figure 1.
Rev. A3: 23.08.1995
5 (11)
U2794B
TELEFUNKEN Semiconductors
6
5
4
18
16
14
12
10
8
3
2
1
o
1050
50
250
450
650
850
0
200
400
600
800
1000
95 9856
LO frequency ( MHz )
95 9919
LO Frequency ( MHz )
Figure 4. Noise figure vs. LO frequency;
o: value at 950 MHz with RF input matching with T3
Figure 2. Typical VSWR frequency response
of the LO input
30
26
10
0
x
–10
–20
–30
–40
–50
22
18
14
10
0
200
400
600
800
1000
0
200
400
600
800
1000
95 10069
LO frequency ( MHz )
95 10070
LO frequency ( MHz )
Figure 3. Typical suitable LO power range vs. frequency
Figure 5. Gain vs. LO frequency;
x: value at 950 MHz with RF input matching with T3
6 (11)
Rev. A3: 23.08.1995
U2794B
TELEFUNKEN Semiconductors
j
0.5j
2j
0.2j
5j
c
a
0
0.2
0.5
1
2
5
b
–0.2j
–5j
95 9977
–0.5j
–2j
–j
Figure 6. Typical S11 frequency response of the
a: LO input, LO frequency from 100 MHz to 1100 MHz, marker: 950 MHz
b: RF input, RF frequency from 100 MHz to 1100 MHz, marker: 950 MHz
c: I/Q outputs, baseband frequency from 5 MHz to 55 MHz, marker: 25 MHz
Rev. A3: 23.08.1995
7 (11)
U2794B
TELEFUNKEN Semiconductors
Board Layout
95 9854
8 (11)
Rev. A3: 23.08.1995
U2794B
TELEFUNKEN Semiconductors
Board Layout
95 9853
External Components
Calibration Part
CUCC100 nF
CRFX 1 nF
CLO 100 pF
CNLO1 nF
CO, CS, CL 100 pF
RL
50
Conversion to Single Ended Output
CRF 100 pF
CII, CQQ
T3
optional external lowpass filters
transmission line for RF–input matching,
to connect optionally
optional for ac-coupling at
baseband outputs
OP1, OP2
AD620
RG1, RG2 prog. gain, see datasheet, for 5.6 k
a
gain of 1 at 50 is achieved together
with RD1 and RD2.
CI, CIX,
CQ, CQX
CPDN 100 pF
CGC 100 pF
CPC 100 pF
CNPC 100 pF
RD1, RD2 450
CS1, CS2 100 nF
CS3, CS4, 100 nF
GSW gain switch
Rev. A3: 23.08.1995
9 (11)
U2794B
TELEFUNKEN Semiconductors
Description of Evaluation Board
Board material:
epoxy; r = 4.8, thickness = 0.5 mm
transmission lines: Z = 50
–
–
The LO- and the RF-inputs are ac–coupled and
connected via SMB plugs. If transmission line T3 is
connected to the RF-input and ac-grounded at the
other end, gain and noise performance can be
improved (input matching to 50 ).
O
The board offers the following functions
The test circuit for the U2794B:
–
–
–
The supply voltage and the control inputs GC, PC and
PD are connected via a plug strip. The control input
voltages can be generated via external potentiome-
ters; then the inputs should be ac–grounded (time
requirements in burst–mode for power up have to be
considered).
The complementary RF-input is ac-coupled to GND
(CRFX = 1 nF), the same appears to the complemen-
tary LO-input (CNLO = 1 nF).
A calibration part, which allows to calibrate an
s-parameter analyzer directly to the in- and output-
signal ports of the U2794B.
The outputs I, IX, Q, QX are dc coupled via an plug
strip or can be ac-connected via SMB plugs for high
frequency tests e.g. noise figure or s-parameter mea-
surement. The pins II, IIX, QQ, QQX allow user
definable filtering with 2 external capacitors CII,
CQQ.
For single-ended measurements at the demodulator
outputs, two OP’s (e.g., AD620 or other) can be con-
figured with programmable gain; together with an
output-divider network RD = 450
to RL = 50 ,
Also the offsets of both channels can be adjusted with
two potis or resistors.
direct measurements with 50 load-impedances are
possible at frequencies 100 kHz.
Dimensions in mm
Package: SSO 20
94 8872
10 (11)
Rev. A3: 23.08.1995
U2794B
TELEFUNKEN Semiconductors
Ozone Depleting Substances Policy Statement
It is the policy of TEMIC TELEFUNKEN microelectronic GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems
with respect to their impact on the health and safety of our employees and the public, as well as their impact on
the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as
ozone depleting substances (ODSs).
The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and
forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban
on these substances.
TEMIC TELEFUNKEN microelectronic GmbH semiconductor division has been able to use its policy of
continuous improvements to eliminate the use of ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively
2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency (EPA) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.
TEMIC can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain
such substances.
We reserve the right to make changes to improve technical design and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each customer
application by the customer. Should the buyer use TEMIC products for any unintended or unauthorized
application, the buyer shall indemnify TEMIC against all claims, costs, damages, and expenses, arising out of,
directly or indirectly, any claim of personal damage, injury or death associated with such unintended or
unauthorized use.
TEMIC TELEFUNKEN microelectronic GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
Telephone: 49 (0)7131 67 2831, Fax number: 49 (0)7131 67 2423
Rev. A3: 23.08.1995
11 (11)
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