MASW-002102-13580_V5 [TE]
HMIC Silicon PIN Diode Switches; HMIC硅PIN二极管开关
| 型号： | MASW-002102-13580_V5 |
| 厂家： | 
TE CONNECTIVITY |
| 描述： | HMIC Silicon PIN Diode Switches |
| 文件： | 总7页 (文件大小：147K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MASW-002102-13580
MASW-003102-13590
HMIC™ Silicon PIN Diode Switches
with Integrated Bias Network
Rev. V5
MASW-002102-13580
Features
Broad Bandwidth Specified up to 18 GHz
Usable up to 26 GHz
Integrated Bias Network
Low Insertion Loss / High Isolation
Rugged
Fully Monolithic
Glass Encapsulate Construction
RoHS Compliant* and 260°C Reflow Compatible
Description
The MASW-002102-13580 and MASW-003102-13590
devices are SP2T and SP3T broad band switches with
integrated bias networks utilizing M/A-COM Technology
Solutions HMICTM (Heterolithic Microwave Integrated
Circuit) process, US Patent 5,268,310. This process
allows the incorporation of silicon pedestals that form
series and shunt diodes or vias by imbedding them in
low loss, low dispersion glass. By using small spacing
between elements, this combination of silicon and glass
gives HMIC devices low loss and high isolation per-
formance with exceptional repeatability through low
millimeter frequencies. Large bond pads facilitate the
use of low inductance ribbon bonds, while gold back-
side metallization allows for manual or automatic chip
bonding via 80/20 - Au/Sn, 62/36/2 - Sn/Pb/Ag solders
or electrically conductive silver epoxy.
MASW-003102-13590
Parameter
Absolute Maximum
-65oC to +125oC
-65oC to +150oC
+175oC
Operating Temperature
Storage Temperature
Junction Temperature
Applied Reverse Voltage
50V
RF Incident Power
Bias Current +25°C
+33dBm C.W.
±20mA
Max. operating conditions for a combination
of RF power, D.C. bias and temperature:
Yellow areas denote wire bond pads
+33dBm CW @ 15mA (per diode) @+85°C
* Restrictions on Hazardous Substances, European Union Directive 2002/95/EC.
1
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MASW-002102-13580
MASW-003102-13590
HMIC™ Silicon PIN Diode Switches
with Integrated Bias Network
Rev. V5
MASW-002102-13580 (SPDT)
Electrical Specifications @ TAMB = +25oC, 20mA Bias current
Parameter
Frequency
Minimum
Nominal
Maximum
Units
2 GHz
6 GHz
12 GHz
18 GHz
2 GHz
6 GHz
12 GHz
18 GHz
2 GHz
6 GHz
1.5
0.70
0.90
1.2
60
1.8
1.0
1.2
1.8
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
Insertion Loss
55
47
40
36
50
Isolation
45
40
14
15
Input Return
Loss
12 GHz
18 GHz
-
15
13.0
50
dB
dB
ns
Switching Speed1
MASW-003102-13590 (SP3T)
Electrical Specifications @ TAMB = +25oC, 20mA Bias current
Parameter
Frequency
Minimum
Nominal
Maximum
Units
2 GHz
6 GHz
12 GHz
18 GHz
2 GHz
6 GHz
12 GHz
18 GHz
2 GHz
6 GHz
12 GHz
18 GHz
-
1.6
0.8
1.0
1.3
59
50
45
40
14
15
16
14
50
2.0
1.1
1.3
1.9
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
ns
Insertion Loss
54
47
40
36
Isolation
Input Return Loss
Switching Speed1
Note:
1. Typical switching speed measured from 10% to 90% of detected RF signal driven by TTL compatible drivers using RC
output spiking network, R = 50 – 200Ω , C = 390 – 560pF.
2
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MASW-002102-13580
MASW-003102-13590
HMIC™ Silicon PIN Diode Switches
with Integrated Bias Network
Rev. V5
Typical RF Performance at TA = +25°C, 20mA Bias Current
ISOLATION vs FREQUENCY
MASW-002102-13580
ISOLATION vs FREQUENCY
MASW-003102-13590
0
-10
-20
-30
-40
-50
-60
-70
0
-10
-20
-30
-40
-50
-60
-70
0
2
4
6
8
10 12 14 16 18 20 22 24 26
0
2
4 6 8 10 12 14 16 18 20 22 24 26
FREQUENCY, GHz
FREQUENCY, GHz
INSERTION LOSS vs FREQUENCY
MASW-003102-13590
INSERTION LOSS vs FREQUENCY
MASW-002102-13580
2
0
2
0
-2
-4
-6
-8
-2
-4
-6
-8
0
2
4
6
8 10 12 14 16 18 20 22 24 26
0
2 4 6 8 10 12 14 16 18 20 22 24 26
FREQUENCY, GHz
FREQUENCY, GHz
RETURN LOSS vs FREQUENCY
MASW-003102-13590
0
-5
-10
-15
-20
-25
-30
-35
-40
0
2
4
6
8 10 12 14 16 18 20 22 24 26
FREQUENCY, GHz
3
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MASW-002102-13580
MASW-003102-13590
HMIC™ Silicon PIN Diode Switches
with Integrated Bias Network
Rev. V5
MASW-002102-13580 Junction Temperature vs. Incident Power at 8 GHz
140
120
100
80
5 mA
Series Diode_5mA
Series Diode_10mA
Series Diode_20mA
Series Diode_40mA
10 mA
20 mA
60
40 mA
40
20
10.00
15.00
20.00
25.00
30.00
35.00
C.W. Incident Power ( dBm )
MASW-002102-13580 Compression Power vs. Incident Power at 8 GHz
0.80
0.70
0.60
0.50
0.40
0.30
0.20
0.10
0.00
Series Diode_5mA
Series Diode_10mA
Series Diode_20mA
Series Diode_40mA
5 mA
10 mA
20 mA
40 mA
10.00
15.00
20.00
25.00
30.00
35.00
C.W. Incident Power ( dBm )
Note:
The PIN diodes in the MASW-002102-13580 and the MASW-003102-13590 have the same electrical
characteristics and will have similar performance.
4
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MASW-002102-13580
MASW-003102-13590
HMIC™ Silicon PIN Diode Switches
with Integrated Bias Network
Rev. V5
Operation of the MASW-002102-13580 and MASW-003102-13590
Operation of the MASW-002102-13580 and MASW-003102-13590 PIN diode switches is achieved by
simultaneous application of DC currents to the bias pads. The required levels for the different states are
shown in the tables below. The on-chip pull-up resistor @ J1, shown in the schematic below, has a value
of 40Ω - 60Ω and must be taken into consideration when defining drive circuitry.
Driver Connections MASW-002102-13580
Driver Connections MASW-003102-13590
Condition Condition Condition
Control Level
Condition
of
Condition
of
Control Level
IDC
of
of
of
IDC
@
@
RF Output RF Output RF Output
RF Output
RF Output
J5
J6
J7
J1 - J2
J1 - J3
J1 - J4
J4
J5
J1 - J2
Low Loss
Isolation
J1 - J3
Isolation
Low Loss
-20mA +20mA +20mA Low Loss Isolation
Isolation
-20mA
+20mA
+20mA
-20mA
+20 mA -20mA +20mA Isolation Low Loss Isolation
+20mA +20mA -20mA Isolation Isolation Low Loss
Equivalent Circuit MASW-003102-13590
Equivalent Circuit MASW-002102-13580
5
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MASW-002102-13580
MASW-003102-13590
HMIC™ Silicon PIN Diode Switches
with Integrated Bias Network
Rev. V5
Wire/Ribbon and Die Attachment Recommendations
Wire Bonding
Thermosonic wedge wire bonding using 0.00025” x 0.003” ribbon or 0.001” diameter gold wire is
recommended. A heat stage temperature of 150oC and a force of 18 to 22 grams should be used. Ultrasonic
energy should be adjusted to the minimum required to achieve a good bond. RF bond wires should be kept as
short and straight as possible.
Chip Mounting
The HMIC switches have Ti-Pt-Au back metal. They can be die mounted with a gold-tin eutectic solder
preform or conductive epoxy. Mounting surface must be clean and flat.
*Note: This device utilizes a process step designed to have minimal to non-existent burring around the
perimeter of the die.
Eutectic Die Attachment: An 80/20, gold-tin, eutectic solder preform is recommended with a work surface
temperature of 255oC and a tool tip temperature of 265oC. When hot gas is applied, the tool tip temperature
should be 290oC. The chip should not be exposed to temperatures greater than 320oC for more than
20 seconds. No more than three seconds should be required for attachment. Solders containing tin should not
be used.
Epoxy Die Attachment: A minimum amount of epoxy should be used. A thin epoxy fillet should be visible
around the perimeter of the chip after placement. Cure epoxy per manufacturer’s schedule (typically 125-
150oC).
,
MASW-002102-13580 Chip Outline Drawing1 2
INCHES
MAX
MILLIMETERS
DIM
MIN
MIN
MAX
1.780
1.330
0.150
0.140
0.317
0.760
0.791
0.757
REF.
REF.
A
B
C
D
E
F
0.066
0.048
0.004
0.004
0.012
0.029
0.030
0.029
0.005
0.005
0.070
0.052
0.006
0.006
0.013
0.030
0.031
0.030
REF.
1.680
1.230
0.100
0.090
0.292
0.735
0.766
0.732
0.129
0.129
G
H
J
K
REF.
Notes:
1. Topside and backside metallization is gold, 2.5um thick typical.
2. Yellow areas indicate wire bonding pads
6
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MASW-002102-13580
MASW-003102-13590
HMIC™ Silicon PIN Diode Switches
with Integrated Bias Network
Rev. V5
MASW-003102-13590 Chip Outline Drawing1,2
INCHES
MILLIMETERS
DIM
MIN
MAX
MIN
1.770
1.760
0.100
0.787
0.734
0.140
0.089
0.113
0.859
1.610
1.680
0.1290
0.1180
MAX
1.870
1.860
0.150
0.812
0.759
0.190
0.139
0.163
0.909
1.660
1.730
REF.
REF.
A
B
C
D
E
F
0.0697
0.0693
0.0039
0.0310
0.0289
0.0055
0.0035
0.0044
0.0338
0.0632
0.0660
0.0051
0.0046
0,0736
0.0732
0.0059
0.0319
0.0299
0.0075
0.0055
0.0064
0.0358
0.0652
0.0680
REF.
G
H
J
K
L
M
N
REF.
Notes:
1. Topside and backside metallization is gold , 2.5um thick typical.
2. Yellow areas indicate wire bonding pads
Ordering Information
Part Number
Package
MASW-002102-13580G
MASW-002102-13590W
MASW-003102-13590G
Gel Pack (25 per)
Waffle Pack (25 per)
Gel Pack (25 Per)
MASW-003102-13590W
Waffle Pack (25 Per)
7
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
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