MASW-004100-1193 [TE]
HMIC™ Silicon PIN Diode Switch; HMIC ™硅PIN二极管开关
| 型号： | MASW-004100-1193 |
| 厂家： | 
TE CONNECTIVITY |
| 描述： | HMIC™ Silicon PIN Diode Switch |
| 文件： | 总7页 (文件大小：135K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MASW-004100-1193
HMIC™ Silicon PIN Diode Switch
RoHs Compliant
Rev. V3
Features
♦
♦
♦
♦
Ultra Broad Bandwidth: 50MHz to 26GHz
0.9 Insertion Loss , 34dB Isolation at 20GHz
50nS Switching Speed
Reliable, Fully Monolithic, Glass Encapsulated
Construction
♦
+33dBm Power Handling
Description
The MASW-004100-1193 is a SP4T series-shunt
broad band switch made with M/A-COM’s unique
HMICTM (Heterolithic Microwave Integrated Circuit)
process, US Patent 5,268,310. This process allows
the incorporation of silicon pedestals that form
series and shunt diodes or vias by imbedding them
in a low loss, low dispersion glass. This hybrid
combination of silicon and glass gives HMIC
switches exceptional low loss and remarkable high
isolation through low millimeter-wave frequencies.
Applications
J4
J3
These high performance switches are suitable for
use in multi-band ECM, radar, and instrumentation
control circuits where high isolation to insertion loss
ratios are required. With a standard +5V/-5V, TTL
controlled PIN diode driver, 50nS switching speeds
are achieved.
Absolute Maximum Ratings
TAMB = +25°C ( Unless Otherwise Specified )
J2
J5
Parameter
Operating Temperature
Storage Temperature
Value
-65°C to +125°C
-65°C to +150°C
RF C.W. Incident Power (±
20mA)
Bias Current ( Forward )
+33dBm
J1
± 20mA
Applied Voltage ( Reverse )
-25 Volts
Notes:
Exceeding these limits may cause permanent
damage.
1
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MASW-004100-1193
HMIC™ Silicon PIN Diode Switch
RoHs Compliant
Rev. V3
Typical Driver Connections
Condition
of
Condition
of
Condition
of
Condition
Control Level ( DC Current ) at Port
of
RF Output
RF Output
RF Output
RF Output
J2
J3
J4
J5
J1-J2
Low Loss
Isolation
Isolation
Isolation
J1-J3
Isolation
Low Loss
Isolation
Isolation
J1-J4
Isolation
Isolation
Low Loss
Isolation
J1-J5
Isolation
Isolation
Isolation
Low Loss
-20mA
+20mA
+20mA
+20mA
+20mA
-20mA
+20mA
+20mA
+20mA
+20mA
-20mA
+20mA
+20mA
+20mA
+20mA
-20mA
Electrical Specifications @ TAMB = +25oC, ± 20mA Bias Current (On-Wafer Measurements)
Parameter
Insertion Loss
Frequency
20 GHz
20 GHz
20 GHz
20 GHz
Minimum
Nominal
0.9
Maximum
Units
dB
1.3
Isolation
28
34
dB
Input Return Loss
Output Return Loss
15
dB
15
dB
Switching Speed1
10 GHz
50
nS
Notes:
Typical switching speed is measured from 10% to 90% of detected RF voltage driven by a TTL compatible driver. Driver
output parallel RC network uses a capacitor between 390pF – 560pF and a resistor between 150Ω – 220Ω to achieve 50nS
rise and fall times.
2
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
• North America Tel: 800.366.2266 / Fax: 978.366.2266
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MASW-004100-1193
HMIC™ Silicon PIN Diode Switch
RoHs Compliant
Rev. V3
Operation of the MASW-004100-1193 PIN Switch
Operation of the MASW-004100-1193 PIN switch is achieved by the simultaneous application of negative DC
current to the low loss port and positive DC current to the remaining isolated switching ports as shown in
Figure 1. The backside area of the die is the RF and DC return ground plane. The DC return is achieved on
the common port, J1. The DC control currents should be supplied by constant current source. The voltages
at these points will not exceed ±1.5 volts (1.2 volts typical) for supply currents up to ±20 mA. In the low loss
state, the series diode must be forward biased and the shunt diode reverse biased. For all the isolated ports,
the shunt diode is forward biased and the series diode is reverse biased. The bias network design should yield
> 30 dB RF to DC isolation.
Best insertion loss, P1dB, IP3, and switching speed are achieved by using a voltage pull-up resistor in the DC
return path, J1. A minimum value of |-2V| is recommended at this return node, which is achievable with a
standard,
2 – 18 GHz Bias Network Schematic
J1
39 pF
22 pF
DC Bias
39 pF
22nH
100 Ω
22nH
HMIC Switch Die
J5
J2
22 pF
J4
J3
Fig. 1
3
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MASW-004100-1193
HMIC™ Silicon PIN Diode Switch
RoHs Compliant
Rev. V3
Typical Microwave Performance
MASW-004100-1193 INSERTION LOSS
0.0
-0.5
-1.0
-1.5
-2.0
J1-J2
J1-J3
J1-J4
J1-J5
0.0
5.0
10.0
15.0
20.0
25.0
30.0
Frequency (GHz)
MASW-004100-1193 INPUT RETURN LOSS
0
-10
-20
-30
-40
-50
-60
J1-J2
J1-J3
J1-J4
J1-J5
0
5
10
15
20
25
30
Frequency (GHz)
4
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MASW-004100-1193
HMIC™ Silicon PIN Diode Switch
RoHs Compliant
Rev. V3
Typical Microwave Performance
MASW-004100-1193 OUTPUT RETURN LOSS
0
-5
-10
-15
-20
-25
-30
-35
J2
J3
J4
J5
0
5
10
15
20
25
30
Frequency (GHz)
MASW-004100-1193 ISOLATION
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
J1-J2
J1-J3
J1-J4
J1-J5
0
5
10
15
20
25
30
Frequency (GHz)
5
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MASW-004100-1193
HMIC™ Silicon PIN Diode Switch
RoHs Compliant
Rev. V3
ASSEMBLY INSTRUCTIONS
Cleanliness
These chips should be handled in a clean environment free of organic contamination.
Electro-Static Sensitivity
The MASW-00 Series PIN switches are ESD, Class 1A sensitive (HBM). The proper ESD handling procedures
must be used.
Wire Bonding
Thermosonic wedge wire bonding using 0.003” x 0.00025” ribbon or 0.001” diameter gold wire is recommended.
A stage temperature of 150°C and a force of 18 to 22 grams should be used. Ultrasonic energy should be
adjusted to the minimum required to achieve a good bond. RF wire and ribbon bonds should be kept as short as
possible to minimize parasitic inductance.
Mounting
These chips have Ti-Pt-Au back metal. They can be die mounted with a 80Au/20Sn or electrically conductive Ag
epoxy. Mounting surface must be flat and clean of oils and contaminants.
Eutectic Die Attachment
An 80/20 gold-tin eutectic solder preform is recommended with a work surface temperature of 255°C and a tool
tip temperature of 265°C. When hot gas is applied, the tool tip temperature should be 290°C. The chip should
not be exposed to temperatures greater than 320°C for more than 10 seconds. No more than 3 seconds should
be required for the die attachment.
Silver Epoxy Die Attachment
Assembly should be preheated to 125°C-150°C. A Controlled thickness of 2 mils is recommended for best
electrical and thermal conductivity. A thin epoxy fillet should be visible around the perimeter of the chip after
placement to ensure complete coverage. Cure epoxy per manufacturer’s recommended schedule.
6
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
• North America Tel: 800.366.2266 / Fax: 978.366.2266
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MASW-004100-1193
HMIC™ Silicon PIN Diode Switch
RoHs Compliant
Rev. V3
MASW-004100-1193
Chip Dimensions
INCHES
MM
DIM
NOMINAL
NOMINAL
A
B
C
D
E
F
G
H
I
.066
.047
1.67
1.19
1.37
.054
.012
0.31
.043
1.08
.009
0.22
.004
0.11
.004
0.11
.033
0.84
J
.061
1.56
Thickness
Bond Pads
.005
.120
.005X.005
0.120X.0120
Notes:
1. Topside and backside metallization is gold , 2.5mm thick typical.
2. Yellow areas indicate wire bonding pads
Ordering Information
Part Number
Package
MASW-004100-11930W
MASW-004100-11930G
Waffle Pack
Gel Pack
7
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
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