ADS1602IPFBR [TI]

16 位 2.5MSPS 模数转换器 | PFB | 48 | -40 to 85;
ADS1602IPFBR
型号: ADS1602IPFBR
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

16 位 2.5MSPS 模数转换器 | PFB | 48 | -40 to 85

转换器 模数转换器
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ADS1602  
www.ti.com  
SBAS341E DECEMBER 2004REVISED OCTOBER 2011  
16-Bit, 2.5MSPS Analog-to-Digital Converter  
Check for Samples: ADS1602  
1
FEATURES  
DESCRIPTION  
The ADS1602 is  
a high-speed, high-precision,  
2
High Speed:  
delta-sigma (ΔΣ) analog-to-digital converter (ADC)  
manufactured on an advanced CMOS process. The  
ADS1602 oversampling topology reduces clock jitter  
sensitivity during the sampling of high-frequency,  
large amplitude signals by a factor of four over that  
achieved by Nyquist-rate ADCs. Consequently,  
signal-to-noise ratio (SNR) is particularly improved.  
Total harmonic distortion (THD) is 101dB, and the  
spurious-free dynamic range (SFDR) is 103dB.  
Data Rate: 2.5MSPS  
Bandwidth: 1.23MHz  
Outstanding Performance:  
SNR: 91dB at fIN = 100kHz, 1dBFS  
THD: 101dB at fIN = 100kHz, 6dBFS  
SFDR: 103dB at fIN = 100kHz, 6dBFS  
Ease-of-Use:  
Optimized for power and performance, the ADS1602  
dissipates only 530mW while providing a full-scale  
differential input range of ±3V. Having such a wide  
input range makes out-of-range signals unlikely. The  
OTR pin indicates if an analog input out-of-range  
condition does occur. The differential input signal is  
measured against the differential reference, which  
can be generated internally or supplied externally on  
the ADS1602.  
High-Speed 3-Wire Serial Interface  
Directly Connects to TMS320 DSPs  
On-Chip Digital Filter Simplifies Antialias  
Requirements  
Simple Pin-Driven ControlNo On-Chip  
Registers to Program  
Selectable On-Chip Voltage Reference  
Simultaneous Sampling with Multiple  
ADS1602s  
The ADS1602 uses an inherently stable advanced  
modulator with an on-chip decimation filter. The filter  
stop band extends to 38.6MHz, which greatly  
simplifies the antialiasing circuitry. The modulator  
samples the input signal up to 40MSPS, depending  
on fCLK, while the 16x decimation filter uses a series  
of four half-band FIR filter stages to provide 75dB of  
stop band attenuation and 0.001dB of passband  
ripple.  
Low Power:  
530mW at 2.5MSPS  
Power-Down Mode  
APPLICATIONS  
Sonar  
Vibration Analysis  
Data Acquisition  
VREFP VREFN VMID RBIAS VCAP AVDD  
Output data is provided over a simple 3-wire serial  
interface at rates up to 2.5MSPS, with a 3dB  
bandwidth of 1.23MHz. The output data or its  
complementary format directly connects to DSPs  
such as TIs TMS320 family, FPGAs, or ASICs. A  
dedicated synchronization pin enables simultaneous  
sampling with multiple ADS1602s in multi-channel  
systems. Power dissipation is set by an external  
resistor that allows a reduction in dissipation when  
operating at slower speeds. All of the ADS1602  
features are controlled by dedicated I/O pins, which  
simplify operation by eliminating the need for on-chip  
registers.  
DVDD  
IOVDD  
CLK  
SYNC  
FSO  
FSO  
Reference and Bias Circuits  
SCLK  
SCLK  
Serial  
AINP  
AINN  
DS  
Linear Phase  
Interface  
Modulator  
FIR Digital Filter  
DOUT  
DOUT  
OTR  
PD  
ADS1602  
REFEN  
The high performing, easy-to-use ADS1602 is  
especially suitable for demanding measurement  
applications in sonar, vibration analysis, and data  
acquisition. The ADS1602 is offered in a small, 7mm  
AGND  
DGND  
×
7mm TQFP-48 package and is specified  
from 40°C to +85°C.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
All trademarks are the property of their respective owners.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 20042011, Texas Instruments Incorporated  
ADS1602  
SBAS341E DECEMBER 2004REVISED OCTOBER 2011  
www.ti.com  
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with  
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.  
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more  
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.  
PACKAGE/ORDERING INFORMATION  
For the most current package and ordering information, see the Package Option Addendum at the end of this  
document, or visit the device product folder at www.ti.com.  
ABSOLUTE MAXIMUM RATINGS(1)  
Over operating free-air temperature range, unless otherwise noted.  
ADS1602  
0.3 to +6  
UNIT  
V
AVDD to AGND  
DVDD to DGND  
0.3 to +3.6  
V
IOVDD to DGND  
0.3 to +6  
V
AGND to DGND  
0.3 to +0.3  
V
Input current  
100, momentary  
10, continuous  
0.3 to AVDD + 0.3  
0.3 to IOVDD + 0.3  
+150  
mA  
mA  
V
Input current  
Analog I/O to AGND  
Digital I/O to DGND  
Maximum junction temperature  
Operating temperature range  
Storage temperature range  
V
°C  
°C  
°C  
40 to +105  
60 to +150  
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may  
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond  
those specified is not implied.  
2
Copyright © 20042011, Texas Instruments Incorporated  
ADS1602  
www.ti.com  
SBAS341E DECEMBER 2004REVISED OCTOBER 2011  
ELECTRICAL CHARACTERISTICS  
All specifications at TA = 40°C to +85°C, AVDD = 5V, DVDD = IOVDD = 3V, fCLK = 40MHz, external VREF = +3V, VCM  
=
+1.45V, and RBIAS = 37k, unless otherwise noted.  
ADS1602  
TYP  
PARAMETER  
Analog Input  
TEST CONDITIONS  
MIN  
MAX  
UNIT  
Differential input voltage (VIN) (AINP AINN)  
Common-mode input voltage (VCM) (AINP + AINN) / 2  
0dBFS  
±VREF  
V
V
1.45  
Absolute input voltage  
(AINP or AINN with respect to AGND)  
0.1  
4.6  
V
Dynamic Specifications  
fCLK  
2.5  
Data rate  
MSPS  
(
)
40MHz  
fIN = 10kHz, 1dBFS  
fIN = 10kHz, 3dBFS  
fIN = 10kHz, 6dBFS  
fIN = 100kHz, 1dBFS  
fIN = 100kHz, 3dBFS  
fIN = 100kHz, 6dBFS  
fIN = 800kHz, 1dBFS  
fIN = 800kHz, 3dBFS  
fIN = 800kHz, 6dBFS  
fIN = 10kHz, 1dBFS  
fIN = 10kHz, 3dBFS  
fIN = 10kHz, 6dBFS  
fIN = 100kHz, 1dBFS  
fIN = 100kHz, 3dBFS  
fIN = 100kHz, 6dBFS  
fIN = 800kHz, 1dBFS  
fIN = 800kHz, 3dBFS  
fIN = 800kHz, 6dBFS  
fIN = 10kHz, 1dBFS  
fIN = 10kHz, 3dBFS  
fIN = 10kHz, 6dBFS  
fIN = 100kHz, 1dBFS  
fIN = 100kHz, 3dBFS  
fIN = 100kHz, 6dBFS  
fIN = 800kHz, 1dBFS  
fIN = 800kHz, 3dBFS  
fIN = 800kHz, 6dBFS  
fIN = 10kHz, 1dBFS  
fIN = 10kHz, 3dBFS  
fIN = 10kHz, 6dBFS  
fIN = 100kHz, 1dBFS  
fIN = 100kHz, 3dBFS  
fIN = 100kHz, 6dBFS  
fIN = 800kHz, 1dBFS  
fIN = 800kHz, 3dBFS  
fIN = 800kHz, 6dBFS  
92  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
87  
84  
90  
87  
91  
Signal-to-noise ratio (SNR)  
87  
84  
89  
86  
91  
89  
86  
94  
106  
108  
90  
96  
101  
116  
114  
110  
89  
92  
93  
Total harmonic distortion (THD)  
Signal-to-noise + distortion (SINAD)  
Spurious-free dynamic range (SFDR)  
90  
92  
85  
82  
90  
87  
87  
85  
82  
88  
86  
91  
89  
86  
95  
90  
93  
107  
112  
91  
90  
93  
96  
103  
120  
119  
114  
f1 = 995kHz, 6dBFS  
f2 = 1005kHz, 6dBFS  
Intermodulation distortion (IMD)  
Aperture delay  
94  
4
dB  
ns  
Copyright © 20042011, Texas Instruments Incorporated  
3
 
ADS1602  
SBAS341E DECEMBER 2004REVISED OCTOBER 2011  
www.ti.com  
ELECTRICAL CHARACTERISTICS (continued)  
All specifications at TA = 40°C to +85°C, AVDD = 5V, DVDD = IOVDD = 3V, fCLK = 40MHz, external VREF = +3V, VCM  
=
+1.45V, and RBIAS = 37k, unless otherwise noted.  
ADS1602  
PARAMETER  
Digital Filter Characteristics  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
fCLK  
1.1  
Passband  
0
MHz  
dB  
(
)
40MHz  
Passband ripple  
±0.001  
fCLK  
1.15  
0.1dB attenuation  
3dB attentuation  
MHz  
(
)
40MHz  
Passband transition  
fCLK  
1.23  
MHz  
(
)
40MHz  
fCLK  
fCLK  
38.6  
1.4  
(
)
Stop band  
(
)
MHz  
dB  
40MHz  
40MHz  
Stop band attenuation  
75  
40MHz  
fCLK  
10.4  
Group delay  
Settling time  
μs  
μs  
(
)
40MHz  
fCLK  
20.4  
Complete settling  
(
)
Static Specifications  
Resolution  
16  
Bits  
Bits  
No missing codes  
Input-referred noise  
Integral nonlinearity  
Differential nonlinearity  
Offset error  
16  
0.5  
0.85  
LSB, rms  
LSB  
1dBFS signal  
0.75  
0.25  
0.1  
0.1  
LSB  
%FSR  
ppmFSR/°C  
%
Offset error drift  
Gain error  
0.25(1)  
Gain error drift  
Excluding reference drift  
10  
ppm/°C  
dB  
Common-mode rejection  
Power-supply rejection  
Internal Voltage Reference  
VREF = (VREFP VREFN)  
VREFP  
At dc  
At dc  
75  
65  
dB  
REFEN = low  
2.75  
3.5  
0.5  
2.3  
3
4
3.25  
4.3  
1.3  
2.7  
V
V
V
VREFN  
1
VMID  
2.5  
50  
15  
V
VREF drift  
ppm/°C  
ms  
Startup time  
External Voltage Reference  
VREF = (VREFP VREFN)  
VREFP  
REFEN = high  
2
3
4
3.25  
4.25  
1.5  
V
V
V
V
3.5  
0.5  
2.3  
VREFN  
1
VMID  
2.5  
2.6  
(1) There is a constant gain error of 2.5% in addition to the variable gain error of ±0.25%. Therefore, the gain error is 2.5 ± 0.25%.  
4
Copyright © 20042011, Texas Instruments Incorporated  
 
ADS1602  
www.ti.com  
SBAS341E DECEMBER 2004REVISED OCTOBER 2011  
ELECTRICAL CHARACTERISTICS (continued)  
All specifications at TA = 40°C to +85°C, AVDD = 5V, DVDD = IOVDD = 3V, fCLK = 40MHz, external VREF = +3V, VCM  
=
+1.45V, and RBIAS = 37k, unless otherwise noted.  
ADS1602  
TYP  
PARAMETER  
Clock Input  
TEST CONDITIONS  
MIN  
MAX  
UNIT  
Frequency (fCLK  
)
40  
55  
MHz  
%
Duty cycle  
fCLK = 40MHz  
45  
Digital Input/Output  
VIH  
0.7 × IOVDD  
DGND  
IOVDD  
V
V
VIL  
0.3 × IOVDD  
VOH  
IOH = 50μA  
IOL = 50μA  
IOVDD 0.5  
V
VOL  
DGND + 0.5  
V
Input leakage  
DGND < VDIGIN < IOVDD  
±10  
μA  
Power-Supply Requirements  
AVDD  
DVDD  
IOVDD  
4.75  
2.7  
5.25  
3.3  
5.25  
125  
98  
V
V
IOH = 50μA  
REFEN = low  
REFEN = high  
IOVDD = 3V  
IOVDD = 3V  
2.7  
V
110  
88  
25  
8
mA  
mA  
mA  
mA  
AVDD current (IAVDD  
)
DVDD current (IDVDD  
)
30  
IOVDD current (IIOVDD  
)
10  
AVDD = 5V, DVDD = 3V, IOVDD = 3V,  
REFEN = high  
530  
10  
610  
mW  
mW  
Power dissipation  
PD = low, CLK disabled  
Temperature Range  
Specified  
40  
40  
60  
+85  
+105  
+150  
°C  
°C  
°C  
Operating  
Storage  
Copyright © 20042011, Texas Instruments Incorporated  
5
ADS1602  
SBAS341E DECEMBER 2004REVISED OCTOBER 2011  
www.ti.com  
DEFINITIONS  
Intermodulation Distortion (IMD)  
Absolute Input Voltage  
Absolute input voltage, given in volts, is the voltage of  
each analog input (AINN or AINP) with respect to  
AGND.  
IMD, given in dB, is measured while applying two  
input signals of the same magnitude, but with slightly  
different frequencies. It is calculated as the difference  
between the rms amplitude of the input signal to the  
rms amplitude of the peak spurious signal.  
Aperture Delay  
Aperture delay is the delay between the rising edge  
of CLK and the sampling of the input signal.  
Offset Error  
Offset Error, given in % of FSR, is the output reading  
when the differential input is zero.  
Common-Mode Input Voltage  
Common-mode input voltage (VCM) is the average  
voltage of the analog inputs:  
Offset Error Drift  
Offset error drift, given in ppm of FSR/°C, is the drift  
over temperature of the offset error. The offset error  
is specified as the larger of the drift from ambient  
(T = +25°C) to the minimum or maximum operating  
temperatures.  
(AINP + AINN)  
2
Differential Input Voltage  
Differential input voltage (VIN) is the voltage  
difference between the analog inputs (AINP AINN).  
Signal-to-Noise Ratio (SNR)  
SNR, given in dB, is the ratio of the rms value of the  
input signal to the sum of all the frequency  
components below fCLK/2 (the Nyquist frequency)  
excluding the first six harmonics of the input signal  
and the dc component.  
Differential Nonlinearity (DNL)  
DNL, given in least-significant bits of the output code  
(LSB), is the maximum deviation of the output code  
step sizes from the ideal value of 1LSB.  
Signal-to-Noise and Distortion (SINAD)  
Full-Scale Range (FSR)  
SINAD, given in dB, is the ratio of the rms value of  
the input signal to the sum of all the frequency  
components below fCLK/2 (the Nyquist frequency)  
including the harmonics of the input signal but  
excluding the dc component.  
FSR is the difference between the maximum and  
minimum measurable input signals (FSR = 2VREF).  
Gain Error  
Gain error, given in %, is the error of the full-scale  
input signal with respect to the ideal value.  
Spurious-Free Dynamic Range (SFDR)  
SFDR, given in dB, is the difference between the rms  
amplitude of the input signal to the rms amplitude of  
the peak spurious signal.  
Gain Error Drift  
Gain error drift, given in ppm/°C, is the drift over  
temperature of the gain error. The gain error is  
specified as the larger of the drift from ambient  
(T = +25°C) to the minimum or maximum operating  
temperatures.  
Total Harmonic Distortion (THD)  
THD, given in dB, is the ratio of the sum of the rms  
value of the first six harmonics of the input signal to  
the rms value of the input signal.  
Integral Nonlinearity (INL)  
INL, given in least-significant bits of the output code  
(LSB), is the maximum deviation of the output codes  
from a best fit line.  
6
Copyright © 20042011, Texas Instruments Incorporated  
ADS1602  
www.ti.com  
SBAS341E DECEMBER 2004REVISED OCTOBER 2011  
PIN ASSIGNMENTS  
48 47 46 45 44 43 42 41 40 39 38 37  
AGND  
1
2
3
4
5
6
7
8
9
36 DGND  
35 NC  
AVDD  
AGND  
AINN  
34 DVDD  
33 DGND  
32 FSO  
31 FSO  
30 DOUT  
29 DOUT  
28 SCLK  
27 SCLK  
26 NC  
AINP  
AGND  
AVDD  
RBIAS  
AGND  
TQFP PACKAGE  
(TOP VIEW)  
ADS1602  
AVDD 10  
AGND 11  
AVDD 12  
25 NC  
13 14 15 16 17 18 19 20 21 22 23 24  
TERMINAL FUNCTIONS  
TERMINAL  
FUNCTION  
DESCRIPTION  
NAME  
AGND  
AVDD  
AINN  
NO.  
1, 3, 6, 9, 11, 39, 41  
Analog  
Analog  
Analog ground  
2, 7, 10, 12, 42  
Analog supply  
4
Analog input  
Analog input  
Analog  
Negative analog input  
Positive analog input  
AINP  
5
RBIAS  
REFEN  
NC  
8
Terminal for external analog bias setting resistor.  
Internal reference enable. Internal pull-down resistor of 170kto DGND.  
These terminals must be left unconnected.  
Pull-up to DVDD with 10kresistor (see Figure 53).  
Power-down all circuitry. Internal pull-up resistor of 170kto DGND.  
Digital supply  
13  
Digital input: active low  
Do not connect  
Digital input  
Digital input: active low  
Digital  
14, 16, 2426, 35  
RPULLUP  
PD  
15  
17  
DVDD  
DGND  
SYNC  
OTR  
18, 23, 34  
19, 22, 33, 36, 38  
Digital  
Digital ground  
20  
21  
Digital input  
Digital output  
Digital output  
Digital output  
Digital output  
Digital output  
Digital output  
Digital output  
Digital  
Synchronization control input  
Indicates analog input signal is out of range.  
Serial clock output  
SCLK  
SCLK  
DOUT  
DOUT  
FSO  
28  
27  
Serial clock output, complementary signal.  
Data output  
30  
29  
Data output, complementary signal.  
Frame synchronization output  
32  
FSO  
31  
Frame synchronization output, complementary signal.  
Digital I/O supply  
IOVDD  
CLK  
37  
40  
Digital input  
Analog  
Clock input  
VCAP  
VREFN  
VMID  
VREFP  
43  
Terminal for external bypass capacitor connection to internal bias voltage.  
Negative reference voltage  
44, 45  
46  
Analog  
Analog  
Midpoint voltage  
47, 48  
Analog  
Positive reference voltage  
Copyright © 20042011, Texas Instruments Incorporated  
7
ADS1602  
SBAS341E DECEMBER 2004REVISED OCTOBER 2011  
www.ti.com  
TIMING DIAGRAMS  
tC  
CLK  
tHSC  
tSSC  
SYNC  
FSO  
tSYPW  
tSTL  
Figure 1. Initialization Timing  
TIMING REQUIREMENTS  
For TA = 40°C to +85°C, DVDD = 2.7V to 3.6V, and IOVDD = 2.7V to 5.25V.  
SYMBOL  
tSYPW  
tC  
DESCRIPTION  
MIN  
1
TYP  
MAX  
UNIT  
CLK period  
ns  
SYNC positive pulse width  
Clock period (CLK)  
25  
tSSC  
Setup time; SYNC rising edge to CLK rising edge  
Hold time; CLK rising edge to SYNC falling edge  
0.5  
0.5  
CLK period  
CLK period  
tHSC  
Settling time of the ADS1602; FSO falling edge to next  
FSO rising edge  
tSTL  
833  
CLK periods  
tCPW  
CLK  
tCS  
tCPW  
SCLK  
tCF  
tFPW  
tDH  
FSO  
tDS  
BIT  
14  
BIT  
DOUT  
MSB  
LSB  
1
New Data  
Figure 2. Data Retrieval Timing  
TIMING REQUIREMENTS  
For TA = 40°C to +85°C, DVDD = 2.7V to 3.6V, and IOVDD = 2.7V to 5.25V.  
SYMBOL  
tCS  
DESCRIPTION  
MIN  
11.25  
6
TYP  
MAX  
15  
UNIT  
Rising edge of CLK to rising edge of SCLK  
Rising edge of SCLK to rising edge of FSO  
CLK positive or negative pulse width  
Frame sync output high pulse width  
SCLK rising edge to new DOUT valid  
SCLK falling edge to DOUT invalid  
ns  
tCF  
5
ns  
tCPW  
tFPW  
tDS  
ns  
CLK period  
ns  
1
5
tDH  
ns  
8
Copyright © 20042011, Texas Instruments Incorporated  
 
 
 
 
 
ADS1602  
www.ti.com  
SBAS341E DECEMBER 2004REVISED OCTOBER 2011  
TYPICAL CHARACTERISTICS  
All specifications at TA = +25°C, AVDD = 5V, DVDD = IOVDD = 3V, fCLK = 40MHz, External VREF = +3V, VCM = +1.45V, and  
RBIAS = 37k, unless otherwise noted.  
SPECTRAL RESPONSE  
SPECTRAL RESPONSE  
0
-20  
0
-20  
fIN = 10kHz, -1dBFS  
fIN = 10kHz, -6dBFS  
SNR = 92dB  
THD = -94dB  
SFDR = 95dB  
SNR = 87dB  
THD = -108dB  
SFDR = 112dB  
-40  
-40  
-60  
-60  
-80  
-80  
-100  
-120  
-140  
-160  
-100  
-120  
-140  
-160  
0
0
0
200  
200  
200  
400  
600  
800  
1000  
1200  
0
200  
200  
200  
400  
600  
800  
1000  
1200  
Frequency (kHz)  
Frequency (kHz)  
Figure 3.  
Figure 4.  
SPECTRAL RESPONSE  
SPECTRAL RESPONSE  
0
-20  
0
fIN = 10kHz, -10dBFS  
fIN = 100kHz, -1dBFS  
-20  
-40  
SNR = 83dB  
THD = -105dB  
SFDR = 110dB  
SNR = 90dB  
THD = -90dB  
SFDR = 91dB  
-40  
-60  
-60  
-80  
-80  
-100  
-120  
-140  
-160  
-100  
-120  
-140  
-160  
400  
600  
800  
1000  
1200  
0
400  
600  
800  
1000  
1200  
Frequency (kHz)  
Frequency (kHz)  
Figure 5.  
Figure 6.  
SPECTRAL RESPONSE  
SPECTRAL RESPONSE  
0
-20  
0
-20  
fIN = 100kHz, -6dBFS  
fIN = 100kHz, -10dBFS  
SNR = 86dB  
THD = -101dB  
SFDR = 103dB  
SNR = 82dB  
THD = -100dB  
SFDR = 102dB  
-40  
-40  
-60  
-60  
-80  
-80  
-100  
-120  
-140  
-160  
-100  
-120  
-140  
-160  
400  
600  
800  
1000  
1200  
0
400  
600  
800  
1000  
1200  
Frequency (kHz)  
Frequency (kHz)  
Figure 7.  
Figure 8.  
Copyright © 20042011, Texas Instruments Incorporated  
9
ADS1602  
SBAS341E DECEMBER 2004REVISED OCTOBER 2011  
www.ti.com  
TYPICAL CHARACTERISTICS (continued)  
All specifications at TA = +25°C, AVDD = 5V, DVDD = IOVDD = 3V, fCLK = 40MHz, External VREF = +3V, VCM = +1.45V, and  
RBIAS = 37k, unless otherwise noted.  
SPECTRAL RESPONSE  
SPECTRAL RESPONSE  
0
-20  
0
-20  
fIN = 504kHz, -1dBFS  
fIN = 504kHz, -6dBFS  
SNR = 91dB  
THD = -119dB  
SFDR = 119dB  
SNR = 86dB  
THD = -103dB  
SFDR = 103dB  
-40  
-40  
-60  
-60  
-80  
-80  
-100  
-120  
-140  
-160  
-100  
-120  
-140  
-160  
0
0
0
200  
400  
600  
800  
1000  
1200  
0
0
0
200  
400  
600  
800  
1000  
1000  
1000  
1200  
Frequency (kHz)  
Frequency (kHz)  
Figure 9.  
Figure 10.  
SPECTRAL RESPONSE  
SPECTRAL RESPONSE  
0
-20  
0
-20  
fIN = 504kHz, -10dBFS  
fIN = 799kHz, -1dBFS  
SNR = 82dB  
THD = -96dB  
SFDR = 96dB  
SNR = 91dB  
THD = -116dB  
SFDR = 120dB  
-40  
-40  
-60  
-60  
-80  
-80  
-100  
-120  
-140  
-160  
-100  
-120  
-140  
-160  
200  
400  
600  
800  
1000  
1200  
200  
400  
600  
800  
1200  
Frequency (kHz)  
Frequency (kHz)  
Figure 11.  
Figure 12.  
SPECTRAL RESPONSE  
SPECTRAL RESPONSE  
0
-20  
0
-20  
fIN = 799kHz, -6dBFS  
fIN = 799kHz, -10dBFS  
SNR = 86dB  
THD = -110dB  
SFDR = 114dB  
SNR = 82dB  
THD = -107dB  
SFDR = 112dB  
-40  
-40  
-60  
-60  
-80  
-80  
-100  
-120  
-140  
-160  
-100  
-120  
-140  
-160  
200  
400  
600  
800  
1000  
1200  
200  
400  
600  
800  
1200  
Frequency (kHz)  
Frequency (kHz)  
Figure 13.  
Figure 14.  
10  
Copyright © 20042011, Texas Instruments Incorporated  
ADS1602  
www.ti.com  
SBAS341E DECEMBER 2004REVISED OCTOBER 2011  
TYPICAL CHARACTERISTICS (continued)  
All specifications at TA = +25°C, AVDD = 5V, DVDD = IOVDD = 3V, fCLK = 40MHz, External VREF = +3V, VCM = +1.45V, and  
RBIAS = 37k, unless otherwise noted.  
SNR, THD, AND SFDR  
SNR, THD, AND SFDR  
vs INPUT SIGNAL AMPLITUDE  
vs INPUT SIGNAL AMPLITUDE  
140  
120  
100  
80  
120  
110  
100  
90  
SFDR  
THD  
SFDR  
THD  
80  
SNR  
70  
SNR  
60  
60  
50  
40  
40  
30  
fIN = 10kHz  
fIN = 50kHz  
20  
20  
-80  
-80  
-80  
-70  
-60  
-50  
-40  
-30  
-20  
-10  
0
0
0
-80  
-70  
-60  
-50  
-40  
-30  
-20  
-10  
0
Input Signal Amplitude, VIN (dB)  
Input Signal Amplitude, VIN (dB)  
Figure 15.  
Figure 16.  
SNR, THD, AND SFDR  
SNR, THD, AND SFDR  
vs INPUT SIGNAL AMPLITUDE  
vs INPUT SIGNAL AMPLITUDE  
140  
120  
100  
80  
140  
120  
100  
80  
SFDR  
THD  
SFDR  
THD  
SNR  
60  
60  
SNR  
40  
40  
fIN = 100kHz  
fIN = 500kHz  
20  
20  
-70  
-60  
-50  
-40  
-30  
-20  
-10  
-80  
-70  
-60  
-50  
-40  
-30  
-20  
-10  
0
Input Signal Amplitude, VIN (dB)  
Input Signal Amplitude, VIN (dB)  
Figure 17.  
Figure 18.  
SNR, THD, AND SFDR  
vs INPUT SIGNAL AMPLITUDE  
SNR vs INPUT FREQUENCY  
140  
120  
100  
80  
95  
VIN = -1dB  
90  
85  
80  
75  
70  
VIN = -6dB  
SFDR  
THD  
VIN = -10dB  
60  
SNR  
40  
fIN = 800kHz  
20  
-70  
-60  
-50  
-40  
-30  
-20  
-10  
10k  
100k  
1M  
Input Signal Amplitude, VIN (dB)  
Input Frequency, fIN (Hz)  
Figure 19.  
Figure 20.  
Copyright © 20042011, Texas Instruments Incorporated  
11  
ADS1602  
SBAS341E DECEMBER 2004REVISED OCTOBER 2011  
www.ti.com  
TYPICAL CHARACTERISTICS (continued)  
All specifications at TA = +25°C, AVDD = 5V, DVDD = IOVDD = 3V, fCLK = 40MHz, External VREF = +3V, VCM = +1.45V, and  
RBIAS = 37k, unless otherwise noted.  
THD vs INPUT FREQUENCY  
SFDR vs INPUT FREQUENCY  
130  
120  
110  
100  
90  
-80  
-85  
VIN = -10dB  
-90  
VIN = -10dB  
-95  
VIN = -6dB  
-100  
-105  
-110  
-115  
-120  
VIN = -1dB  
VIN = -6dB  
80  
VIN = -1dB  
70  
10k  
100k  
1M  
10k  
100k  
1M  
Input Frequency, fIN (Hz)  
Input Frequency, fIN (Hz)  
Figure 21.  
Figure 22.  
SNR vs INPUT COMMON-MODE VOLTAGE  
THD vs INPUT COMMON-MODE VOLTAGE  
93  
92  
91  
90  
89  
88  
87  
86  
85  
-70  
-80  
fIN = 10kHz, VIN = -1dB  
fIN = 100kHz, VIN = -1dB  
fIN = 100kHz, VIN = -1dB  
fIN = 10kHz, VIN = -1dB  
-90  
-100  
-110  
fIN = 100kHz, VIN = -6dB  
fIN = 10kHz, VIN = -6dB  
fIN = 100kHz, VIN = -6dB  
1.4 1.8  
fIN = 10kHz, VIN = -6dB  
2.6 3.4  
1
1.4  
1.8  
2.2  
2.6  
3
3.4  
1
2.2  
3
Input Common-Mode Voltage, VCM (V)  
Input Common-Mode Voltage, VCM (V)  
Figure 23.  
Figure 24.  
SFDR vs INPUT COMMON-MODE VOLTAGE  
fIN = 10kHz, VIN = -6dB  
OFFSET DRIFT OVER TIME  
110  
105  
100  
95  
3
2
fIN = 100kHz, VIN = -6dB  
1
fIN = 10kHz  
0
VIN = -1dB  
90  
-1  
-2  
-3  
85  
fIN = 100kHz, VIN = -1dB  
80  
0
100 200 300 400 500 600 700 800 900 1000  
Time Interval (s)  
1
1.4  
1.8  
2.2  
2.6  
3
3.4  
Input Common-Mode Voltage, VCM (V)  
Figure 25.  
Figure 26.  
12  
Copyright © 20042011, Texas Instruments Incorporated  
ADS1602  
www.ti.com  
SBAS341E DECEMBER 2004REVISED OCTOBER 2011  
TYPICAL CHARACTERISTICS (continued)  
All specifications at TA = +25°C, AVDD = 5V, DVDD = IOVDD = 3V, fCLK = 40MHz, External VREF = +3V, VCM = +1.45V, and  
RBIAS = 37k, unless otherwise noted.  
SNR vs CLOCK FREQUENCY  
THD vs CLOCK FREQUENCY  
110  
100  
90  
80  
70  
60  
50  
40  
30  
20  
100  
90  
80  
70  
60  
50  
40  
30  
RBIAS = 37kW  
VIN = -6dBFS, fIN = 10kHz  
RBIAS = 30kW  
RBIAS = 37kW  
RBIAS  
RBIAS  
= 60kW  
= 30kW  
RBIAS = 267kW  
RBIAS  
RBIAS  
RBIAS  
RBIAS = 210kW  
= 60kW  
RBIAS  
RBIAS = 210kW  
= 140kW = 100kW  
= 100kW  
RBIAS = 140kW  
RBIAS = 267kW  
VIN = -6dBFS, fIN = 10kHz  
5
10  
15  
20  
25  
30  
35  
40  
45  
50  
5
10  
15  
20  
25  
30  
35  
40  
45  
50  
Clock Frequency, fCLK (MHz)  
Clock Frequency, fCLK (MHz)  
Figure 27.  
Figure 28.  
SFDR vs CLOCK FREQUENCY  
NOISE vs DC INPUT VOLTAGE  
110  
100  
90  
80  
70  
60  
50  
40  
30  
20  
1000  
100  
10  
RBIAS = 37kW  
RBIAS  
= 60kW  
RBIAS  
RBIAS = 267kW  
RBIAS = 210kW  
= 30kW  
RBIAS  
= 100kW  
RBIAS = 140kW  
1
VIN = -6dBFS, fIN = 10kHz  
0.1  
-3  
-2  
-1  
0
1
2
3
5
10  
15  
20  
25  
30  
35  
40  
45  
50  
Clock Frequency, fCLK (MHz)  
Input DC Voltage (V)  
Figure 29.  
Figure 30.  
NOISE HISTOGRAM  
POWER-SUPPLY CURRENT vs TEMPERATURE  
120  
100  
80  
60  
40  
20  
0
1540  
1400  
1300  
1200  
1100  
1000  
900  
800  
700  
600  
500  
400  
300  
200  
100  
0
VIN = 0  
IAVDD (REFEN = low)  
IAVDD (REFEN = high)  
IDVDD + IIOVDD  
RBIAS = 37kW, fCLK = 40MHz  
-4  
-3  
-2  
-1  
0
1
2
3
4
-40  
-15  
10  
35  
60  
85  
Output Code (LSB)  
Temperature (°C)  
Figure 31.  
Figure 32.  
Copyright © 20042011, Texas Instruments Incorporated  
13  
ADS1602  
SBAS341E DECEMBER 2004REVISED OCTOBER 2011  
www.ti.com  
TYPICAL CHARACTERISTICS (continued)  
All specifications at TA = +25°C, AVDD = 5V, DVDD = IOVDD = 3V, fCLK = 40MHz, External VREF = +3V, VCM = +1.45V, and  
RBIAS = 37k, unless otherwise noted.  
SUPPLY CURRENT vs CLOCK FREQUENCY  
ANALOG SUPPLY CURRENT vs RBIAS  
140  
120  
100  
80  
130  
110  
90  
VIN = -6dBFS  
VIN = -6dBFS  
fIN = 10kHz  
fIN = 10kHz  
IAVDD (REFEN = low)  
RBIAS = 37kW  
fCLK = 40MHz  
70  
IAVDD (REFEN = high)  
60  
IAVDD (REFEN = low)  
IAVDD (REFEN = high)  
50  
40  
IIOVDD + IDVDD  
30  
20  
0
10  
0
5
10  
15  
20  
25  
30  
35  
40  
0
50  
100  
150  
200  
250  
300  
Clock Frequency, fCLK (MHz)  
RBIAS (kW)  
Figure 33.  
Figure 34.  
SNR vs TEMPERATURE  
THD vs TEMPERATURE  
100  
-80  
-85  
95  
90  
85  
80  
75  
70  
VIN = -1dB  
VIN = -6dB  
VIN = -1dB  
VIN = -6dB  
-90  
VIN = -10dB  
-95  
VIN = -10dB  
-100  
-105  
fIN = 100kHz  
-40  
-15  
10  
35  
60  
85  
-40  
-15  
10  
35  
60  
85  
Temperature (°C)  
Temperature (°C)  
Figure 35.  
Figure 36.  
SFDR vs TEMPERATURE  
120  
115  
110  
105  
100  
95  
VIN = -10dB  
VIN = -6dB  
90  
VIN = -1dB  
85  
80  
-40  
-15  
10  
35  
60  
85  
Temperature (°C)  
Figure 37.  
14  
Copyright © 20042011, Texas Instruments Incorporated  
ADS1602  
www.ti.com  
SBAS341E DECEMBER 2004REVISED OCTOBER 2011  
OVERVIEW  
The ADS1602 is a high-performance delta-sigma  
(ΔΣ) analog-to-digital converter (ADC). The modulator  
uses an inherently stable 2-1-1 multi-stage  
architecture incorporating proprietary circuitry that  
allows for very linear high-speed operation. The  
modulator samples the input signal at 40MSPS (when  
fCLK = 40MHz). A low-ripple linear phase digital filter  
decimates the modulator output by 16 to provide high  
resolution 16-bit output data.  
The ADS1602 supports a very wide range of input  
signals. For VREF = 3V, the full-scale input voltages  
are ±3V. Having such a wide input range makes  
out-of-range signals unlikely. However, should an  
out-of-range signal occur, the digital output OTR goes  
high.  
The analog inputs must be driven with a differential  
signal to achieve optimum performance. For the input  
signal:  
Conceptually, the modulator and digital filter measure  
the differential input signal, VIN = (AINP AINN),  
AINP + AINN  
2
VCM  
=
against  
the  
scaled  
differential  
reference,  
VREF = (VREFP VREFN), as shown in Figure 38.  
The voltage reference can either be generated  
internally or supplied externally. A three-wire serial  
interface, designed for direct connection to DSPs,  
outputs the data. A separate power supply for the I/O  
allows flexibility for interfacing to different logic  
families. Out-of-range conditions are indicated with a  
dedicated digital output pin. Analog power dissipation  
is controlled using an external resistor. This control  
allows reduced dissipation when operating at slower  
speeds. When not in use, power consumption can be  
dramatically reduced by setting the PD pin low to  
enter Power-Down mode.  
the recommended common-mode voltage is 1.5V. In  
addition to the differential and common-mode input  
voltages, the absolute input voltage is also important.  
This is the voltage on either input (AINP or AINN)  
with respect to AGND. The range for this voltage is:  
0.1V < (AINN or AINP) < 4.6V  
If either input is taken below 0.1V, ESD protection  
diodes on the inputs will turn on. Exceeding 4.6V on  
either input results in degradation in the linearity  
performance. ESD protection diodes will also turn on  
if the inputs are taken above AVDD (+5V).  
The recommended absolute input voltage is:  
ANALOG INPUTS (AINP, AINN)  
0.1V < (AINN or AINP) < 4.2V  
The ADS1602 measures the differential signal,  
Keeping the inputs within this range provides for  
optimum performance.  
VIN  
= (AINP AINN), against the differential  
reference, VREF = (VREFP VREFN). The most  
positive measurable differential input is VREF, which  
produces the most positive digital output code of  
7FFFh. Likewise, the most negative measurable  
differential input is VREF, which produces the most  
negative digital output code of 8000h.  
VREFP VREFN  
IOVDD  
CLK  
S
VREF  
FSO  
FSO  
SCLK  
VIN  
AINP  
SD  
Digital  
Filter  
Serial  
Interface  
S
Modulator  
AINN  
SCLK  
DOUT  
DOUT  
Figure 38. Conceptual Block Diagram  
Copyright © 20042011, Texas Instruments Incorporated  
15  
 
ADS1602  
SBAS341E DECEMBER 2004REVISED OCTOBER 2011  
www.ti.com  
INPUT CIRCUITRY  
drivers close to the inputs and use good capacitor  
bypass techniques on the supplies, such as a smaller  
high-quality ceramic capacitor in parallel with a larger  
capacitor. Keep the resistances used in the driver  
circuits lowthermal noise in the driver circuits  
degrades the overall noise performance. When the  
signal can be ac-coupled to the ADS1602 inputs, a  
simple RC filter can set the input common-mode  
The ADS1602 uses switched-capacitor circuitry to  
measure the input voltage. Internal capacitors are  
charged by the inputs and then discharged internally  
with this cycle repeating at the frequency of CLK.  
Figure 39 shows a conceptual diagram of these  
circuits. Switches S2 represent the net effect of the  
modulator circuitry in discharging the sampling  
capacitors; the actual implementation is different. The  
timing for switches S1 and S2 is shown in Figure 40.  
voltage.  
The  
ADS1602  
is  
a
high-speed,  
high-performance ADC. Special care must be taken  
when selecting the test equipment and setup used  
with this device. Pay particular attention to the signal  
sources to ensure they do not limit performance when  
measuring the ADS1602.  
ADS1602  
S1  
AINP  
S2  
392W  
10pF  
8pF  
40pF  
392W  
VIN  
2
-
VMID  
0.01mF  
S1  
49.9W  
AINP  
AINN  
OPA2822  
392W  
392W  
(2)  
(1)  
VCM  
S2  
100pF  
10pF  
8pF  
1kW  
1mF  
(2)  
392W  
(1)  
VCM  
100pF(3)  
ADS1602  
VMID  
AGND  
(2)  
40pF  
392W  
VIN  
1kW  
2
0.01mF  
49.9W  
Figure 39. Conceptual Diagram of Internal  
Circuitry Connected to the Analog Inputs  
AINN  
OPA2822  
392W  
392W  
(2)  
(1)  
VCM  
100pF  
1mF  
AGND  
tSAMPLE = 1/fCLK  
(1) Recommended VCM = 1.5V.  
On  
Off  
S1  
(2) Optional ac-coupling circuit provides common-mode input  
voltage.  
(3) Increase to 390pF when fIN 100kHz for improved SNR and  
THD.  
On  
Off  
S2  
Figure 41. Recommended Driver Circuit Using  
the OPA2822  
Figure 40. Timing for the Switches in Figure 39  
DRIVING THE INPUTS  
22pF  
24.9W  
The external circuits driving the ADS1602 inputs must  
be able to handle the load presented by the switching  
capacitors within the ADS1602. The input switches S1  
in Figure 39 are closed for approximately one-half of  
the sampling period, tSAMPLE, allowing only 11ns for  
the internal capacitors to be charged by the inputs  
when fCLK = 40MHz.  
AINP  
392W  
100pF  
100pF  
392W  
392W  
-VIN  
VCM  
THS4503  
ADS1602  
+VIN  
392W  
24.9W  
AINN  
Figure 41 and Figure 42 show the recommended  
circuits when using single-ended or differential op  
amps, respectively. The analog inputs must be driven  
differentially to achieve optimum performance. The  
external capacitors, between the inputs and from  
each input to AGND, improve linearity and should be  
placed as close to the pins as possible. Place the  
100pF  
22pF  
Figure 42. Recommended Driver Circuit Using  
the THS4503 Differential Amplifier  
16  
Copyright © 20042011, Texas Instruments Incorporated  
 
 
 
 
ADS1602  
www.ti.com  
SBAS341E DECEMBER 2004REVISED OCTOBER 2011  
REFERENCE INPUTS (VREFN, VREFP, VMID)  
EXTERNAL REFERENCE (REFEN = HIGH)  
The ADS1602 can operate from an internal or  
external voltage reference. In either case, the  
reference voltage VREF is set by the differential  
To use an external reference, set the REFEN pin  
high. This deactivates the internal generators for  
VREFP,  
VREFN,  
and  
VMID,  
and  
saves  
voltage between VREFN and VREFP: VREF  
=
approximately 25mA of current on the analog supply  
(AVDD). The voltages applied to these pins must be  
within the values specified in the Electrical  
Characteristics table. Typically, VREFP = 4V, VMID =  
2.5V, and VREFN = 1V. The external circuitry must  
be capable of providing both a dc and a transient  
current. Figure 44 shows a simplified diagram of the  
internal circuitry of the reference when the internal  
reference is disabled. As with the input circuitry,  
switches S1 and S2 open and close as shown by the  
timing in Figure 40.  
(VREFP VREFN). VREFP and VREFN each use  
two pins, which should be shorted together. VMID  
equals approximately 2.5V and is used by the  
modulator. VCAP connects to an internal node and  
must also be bypassed with an external capacitor.  
INTERNAL REFERENCE (REFEN = LOW)  
To use the internal reference, set the REFEN pin low.  
This activates the internal circuitry that generates the  
reference voltages. The internal reference voltages  
are applied to the pins. Good bypassing of the  
reference pins is critical to achieve optimum  
performance and is done by placing the bypass  
capacitors as close to the pins as possible. Figure 43  
shows the recommended bypass capacitor values.  
Use high-quality ceramic capacitors for the smaller  
values. Avoid loading the internal reference with  
external circuitry. If the ADS1602 internal reference is  
to be used by other circuitry, buffer the reference  
voltages to prevent directly loading the reference  
pins.  
ADS1602  
S1  
VREFP  
VREFP  
S2  
300W  
50pF  
VREFN  
VREFN  
S1  
Figure 44. Conceptual Internal Circuitry for the  
Reference When REFEN = High  
ADS1602  
Figure 45 shows the recommended circuitry for  
driving these reference inputs. Keep the resistances  
used in the buffer circuits low to prevent excessive  
thermal noise from degrading performance. Layout of  
these circuits is critical; be sure to follow good  
high-speed layout practices. Place the buffers, and  
especially the bypass capacitors, as close to the pins  
as possible. VCAP is unaffected by the setting on  
REFEN and must be bypassed when using the  
internal or an external reference.  
VREFP  
VREFP  
10mF  
0.1mF  
VMID  
0.1mF  
10mF  
0.1mF  
VREFN  
VREFN  
10mF  
0.1mF  
0.1mF  
VCAP  
AGND  
Figure 43. Reference Bypassing When Using the  
Internal Reference  
Copyright © 20042011, Texas Instruments Incorporated  
17  
 
 
ADS1602  
SBAS341E DECEMBER 2004REVISED OCTOBER 2011  
www.ti.com  
Table 1. Maximum Allowable Clock Source Jitter  
for Different Input Signal Frequencies and  
Amplitude  
392W  
0.001mF  
ADS1602  
INPUT SIGNAL  
MAXIMUM  
FREQUENCY AMPLITUDE  
MAXIMUM  
MAXIMUM ALLOWABLE  
CLOCK SOURCE JITTER  
VREFP  
VREFP  
OPA2822  
10mF  
4V  
2.5V  
1V  
0.1mF  
1MHz  
1MHz  
2dB  
20dB  
2dB  
3.8ps  
28ps  
7.6ps  
57ps  
38ps  
285ps  
392W  
0.1mF  
0.001mF  
500kHz  
500kHz  
100kHz  
100kHz  
20dB  
2dB  
VMID  
OPA2822  
10mF  
0.1mF  
20dB  
392W  
DATA FORMAT  
0.001mF  
The 16-bit output data are in binary twos  
complement format as shown in Table 2. When the  
input is positive out-of-range, exceeding the positive  
full-scale value of VREF, the output clips to all 7FFFh  
and the OTR output goes high.  
VREFN  
VREFN  
OPA2822  
10mF  
0.1mF  
0.1mF  
VCAP  
Likewise, when the input is negative out-of-range by  
going below the negative full-scale value of VREF  
,
AGND  
the output clips to 8000h and the OTR output goes  
high. The OTR remains high while the input signal is  
out-of-range.  
Figure 45. Recommended Buffer Circuit When  
Using an External Reference  
Table 2. Output Code versus Input Signal  
INPUT SIGNAL (INP –  
IDEAL OUTPUT  
CODE(1)  
CLOCK INPUT (CLK)  
INN)  
OTR  
The ADS1602 requires an external clock signal to be  
applied to the CLK input pin. The sampling of the  
modulator is controlled by this clock signal. As with  
any high-speed data converter, a high quality clock is  
essential for optimum performance. Crystal clock  
oscillators are the recommended CLK source; other  
sources, such as frequency synthesizers, are usually  
inadequate. Make sure to avoid excess ringing on the  
CLK input; keeping the trace as short as possible  
helps.  
+VREF (> 0dB)  
VREF (0dB)  
7FFFh  
7FFFh  
1
0
+VREF  
0001h  
0000h  
FFFFh  
0
0
0
15  
2
- 1  
0
-VREF  
15  
2
- 1  
15  
2
15  
-VREF  
(
)
8000h  
8000h  
0
1
Measuring high-frequency, large amplitude signals  
requires tight control of clock jitter. The uncertainty  
during sampling of the input from clock jitter limits the  
maximum achievable SNR. This effect becomes more  
pronounced with higher frequency and larger  
magnitude inputs. Fortunately, the ADS1602  
oversampling topology reduces clock jitter sensitivity  
over that of Nyquist rate converters such as pipeline  
and successive approximation converters by a factor  
of 16.  
2
- 1  
15  
2
15  
-VREF  
(
)
2
- 1  
(1) Excludes effects of noise, INL, offset, and gain errors.  
OUT-OF-RANGE INDICATION (OTR)  
If the output code exceeds the positive or negative  
full-scale, the out-of-range digital output OTR will go  
high on the falling edge of SCLK. When the output  
code returns within the full-scale range, OTR returns  
low on the falling edge of SCLK.  
In order to not limit the ADS1602 SNR performance,  
keep the jitter on the clock source below the values  
shown in Table 1. When measuring lower frequency  
and lower amplitude inputs, more CLK jitter can be  
tolerated. In determining the allowable clock source  
jitter, select the worst-case input (highest frequency,  
largest amplitude) that will be seen in the application.  
18  
Copyright © 20042011, Texas Instruments Incorporated  
 
 
 
ADS1602  
www.ti.com  
SBAS341E DECEMBER 2004REVISED OCTOBER 2011  
DATA RETRIEVAL  
STEP RESPONSE  
Data retrieval is controlled through a simple serial  
interface. The interface operates in a master fashion  
by outputting both a frame sync indicator (FSO) and a  
serial clock (SCLK). Complementary outputs are  
provided for the frame sync output (FSO), serial clock  
(SCLK), and data output (DOUT). When not needed,  
leave the complementary outputs unconnected.  
Figure 47 plots the normalized step response for an  
input applied at t = 0. The x-axis units of time are  
conversion cycles. It takes 51 cycles to fully settle; for  
fCLK = 40MHz, this corresponds to 20.4μs.  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0
INITIALIZING THE ADS1602  
After the power supplies have stabilized, you must  
initialize the ADS1602 by issuing a SYNC pulse as  
shown in Figure 1. This operation needs only to be  
done once after power-up and does not need to be  
performed when exiting the Power-Down mode. Note  
that the ADS1602 silicon was revised in June 2006.  
The digital interface timing specifications were  
modified slightly from the previous revision. This data  
sheet reflects behavior of the latest revision. Contact  
the factory for more information on the previous  
revision.  
-0.2  
0
10  
20  
30  
40  
50  
Time (Conversion Cycles)  
Figure 47. Step Response  
SYNCHRONIZING MULTIPLE ADS1602s  
The SYNC input can be used to synchronize multiple  
ADS1602s to provide simultaneous sampling. All  
devices to be synchronized must use a common CLK  
input. With the CLK inputs running, pulse SYNC on  
the falling edge of CLK, as shown in Figure 46.  
Afterwards, the converters will be converting  
synchronously with the FSO outputs updating  
simultaneously. After synchronization, FSO is held  
low until the digital filter has fully settled.  
FREQUENCY RESPONSE  
The linear phase FIR digital filter sets the overall  
frequency response. Figure 48 shows the frequency  
response from dc to 20MHz for fCLK = 40MHz. The  
frequency response of the ADS1602 filter scales  
directly with CLK frequency. For example, if the CLK  
frequency is decreased by half (to 20MHz), the  
values on the x-axis in Figure 48 would need to be  
scaled by half, with the span becoming dc to 10MHz.  
ADS16021  
Figure 49 shows the passband ripple from dc to  
1200kHz (fCLK = 40MHz). Figure 50 shows a closer  
view of the passband transition by plotting the  
response from 900kHz to 1300kHz (fCLK = 40MHz).  
FSO1  
SYNC  
CLK  
SYNC  
CLK  
FSO  
DOUT1  
DOUT  
20  
ADS16022  
fCLK = 40MHz  
0
-20  
FSO2  
SYNC  
CLK  
FSO  
DOUT2  
DOUT  
-40  
-60  
-80  
CLK  
-100  
-120  
-140  
SYNC  
tSTL  
0
2
4
6
8
10 12  
14  
16  
18  
20  
FSO1  
FSO2  
Frequency (MHz)  
Figure 48. Frequency Response  
Figure 46. Synchronizing Multiple Converters  
Copyright © 20042011, Texas Instruments Incorporated  
19  
 
 
 
ADS1602  
SBAS341E DECEMBER 2004REVISED OCTOBER 2011  
www.ti.com  
0.001  
0.0008  
0.0006  
0.0004  
0.0002  
0
20  
0
fCLK = 40MHz  
-20  
-40  
-60  
-80  
-100  
-120  
-140  
-0.0002  
-0.0004  
-0.0006  
-0.0008  
fCLK = 40MHz  
800 1000  
-0.001  
0
200  
400  
600  
1200  
0
20  
40  
60  
80  
100  
120  
Frequency (kHz)  
Frequency (MHz)  
Figure 49. Passband Ripple  
Figure 51. Frequency Response Out to 120MHz  
ANALOG POWER DISSIPATION  
0.5  
0
fCLK = 40MHz  
An external resistor connected between the RBIAS  
pin and the analog ground sets the analog current  
level, as shown in Figure 52. The current is inversely  
proportional to the resistor value. Table 3 shows the  
recommended values of RBIAS for different CLK  
frequencies. Notice that the analog current can be  
reduced when using a slower frequency CLK input  
because the modulator has more time to settle. Avoid  
adding any capacitance in parallel to RBIAS because  
this interferes with the internal circuitry used to set  
the biasing. Please note that changing the RBIAS  
resistor value changes all internally-generated bias  
voltages, including the internal reference; therefore,  
the recommendations in Table 3 are only for when  
using an external reference.  
-0.5  
-1  
-1.5  
-2  
-2.5  
-3  
-3.5  
800  
900  
1000  
1100  
1200  
1300  
Frequency (kHz)  
Figure 50. Passband Transition  
ADS1602  
ANTIALIAS REQUIREMENTS  
Higher frequency, out-of-band signals must be  
eliminated to prevent aliasing with ADCs. Fortunately,  
the ADS1602 on-chip digital filter greatly simplifies  
this filtering requirement. Figure 51 shows the  
ADS1602 response out to 120MHz (fCLK = 40MHz).  
Since the stop band extends out to 38.6MHz, the  
antialias filter in front of the ADS1602 only needs to  
be designed to remove higher frequency signals than  
this, which can usually be accomplished with a simple  
RC circuit on the input driver.  
RBIAS  
RBIAS  
AGND  
Figure 52. External Resistor Used to Set Analog  
Power Dissipation  
Table 3. Recommended RBIAS Resistor Values for  
Different CLK Frequencies  
TYPICAL POWER  
DATA  
RATE  
DISSIPATION  
WITH REFEN HIGH  
fCLK  
RBIAS  
140kΩ  
100kΩ  
60kΩ  
16MHz  
24MHz  
32MHz  
40MHz  
1MSPS  
1.5MSPS  
2MSPS  
200mW  
270mW  
390mW  
530mW  
2.5MSPS  
37kΩ  
20  
Copyright © 20042011, Texas Instruments Incorporated  
 
 
 
ADS1602  
www.ti.com  
SBAS341E DECEMBER 2004REVISED OCTOBER 2011  
POWER DOWN (PD)  
POWER SUPPLIES  
When not in use, the ADS1602 can be powered down  
by taking the PD pin low. All circuitry is shut down,  
including the voltage reference. To minimize the  
digital current during power down, stop the clock  
signal supplied to the CLK input. There is an internal  
pull-up resistor of 170kon the PD pin, but it is  
recommended that this pin be connected to IOVDD if  
not used. Make sure to allow time for the reference to  
start up after exiting power-down mode. The internal  
reference typically requires 15ms. After the reference  
has stabilized, allow at least 100 conversions for the  
modulator and digital filter to settle before retrieving  
data.  
Three supplies are used on the ADS1602: analog  
(AVDD), digital (DVDD), and digital I/O (IOVDD).  
Each supply must be suitably bypassed to achieve  
the best performance. It is recommended that a 1μF  
and 0.1μF ceramic capacitor be placed as close to  
each supply pin as possible. Connect each supply-pin  
bypass capacitor to the associated ground, as shown  
in Figure 53. Each main supply bus should also be  
bypassed with a bank of capacitors from 47μF to  
0.1μF, as shown. The I/O and digital supplies (IOVDD  
and DVDD) can be connected together when using  
the same voltage. In this case, only one bank of 47μF  
to 0.1μF capacitors is needed on the main supply  
bus, though each supply pin must still be bypassed  
with a 1μF and 0.1μF ceramic capacitor.  
DVDD  
47mF  
47mF  
47mF  
4.7mF  
1mF  
1mF  
1mF  
0.1mF  
IOVDD  
AVDD  
4.7mF  
4.7mF  
0.1mF  
0.1mF  
CP  
CP  
CP  
42  
41  
55  
38  
37  
34  
33  
1
DGND 36  
AGND  
AVDD  
CP  
2
If using separate analog and  
digital ground planes, connect  
together on the ADS1602 PCB.  
3
6
AGND  
CP  
AVDD  
AGND  
7
9
ADS1602  
DGND  
AGND  
CP  
AVDD  
AGND  
10  
11  
CP  
12  
AVDD  
15  
18  
19  
22  
23  
CP  
CP  
10kW  
NOTE: CP = 1µF || 0.1µF.  
Figure 53. Recommended Power-Supply Bypassing  
Copyright © 20042011, Texas Instruments Incorporated  
21  
 
ADS1602  
SBAS341E DECEMBER 2004REVISED OCTOBER 2011  
www.ti.com  
LAYOUT ISSUES AND COMPONENT  
SELECTION  
The McBSP provides a host of functions including:  
Full-duplex communication  
Double-buffered data registers  
Independent framing and clocking for reception  
and transmission of data  
The ADS1602 is a very high-speed, high-resolution  
data converter. In order to achieve maximum  
performance, the user must give very careful  
consideration to both the layout of the printed circuit  
board (PCB) in addition to the routing of the traces.  
Capacitors that are critical to achieve the best  
performance from the device should be placed as  
close to the pins of the device as possible. These  
include capacitors related to the analog inputs, the  
reference, and the power supplies.  
The sequence begins with a one-time synchronization  
of the serial port by the microprocessor. The  
ADS1602 recognizes the SYNC signal if it is high for  
at least one CLK period. Transfers are initiated by the  
ADS1602 after the SYNC signal is de-asserted by the  
microprocessor.  
The FSO signal from the ADS1602 indicates that  
data is available to be read, and is connected to the  
frame sync receive (FSR) pin of the DSP. The clock  
receiver (CLKR) is derived directly from the ADS1602  
For critical capacitors, it is recommended that Class II  
dielectrics such as Z5U be avoided. These dielectrics  
have  
a narrow operating temperature, a large  
tolerance on the capacitance, and lose up to 20% of  
the rated capacitance over 10,000 hours. Rather,  
select capacitors with a Class I dielectric. C0G (also  
known as NP0), for example, has a tight tolerance  
less than ±30ppm/°C and is very stable over time.  
Should Class II capacitors be chosen because of the  
size constraints, select an X7R or X5R dielectric to  
minimize the variations of the capacitors critical  
characteristics.  
serial  
clock  
output  
to  
ensure  
continued  
synchronization of data with the clock.  
ADS1602  
FSO  
TMS320  
FSR  
CLKR  
DR  
SCLK  
DOUT  
SYNC  
The resistors used in the circuits to drive the input  
and reference should be kept as low as possible to  
prevent excess thermal noise from degrading the  
system performance.  
FSX  
The digital outputs from the device should always be  
buffered. This has a number of benefits: it reduces  
the loading of the internal digital buffers, which  
decreases noise generated within the device, and it  
also reduces device power consumption.  
Figure 54. ADS1602TMS320 Interface  
Connection  
An evaluation module (EVM) is available from Texas  
Instruments. The module consists of the ADS1602  
and supporting circuits, allowing users to quickly  
assess the performance and characteristics of the  
ADS1602. The EVM easily connects to various  
microcontrollers and DSP systems. For more details,  
or to download a copy of the ADS1602EVM Users  
Guide, visit the Texas Instruments web site at  
www.ti.com.  
APPLICATIONS INFORMATION  
Interfacing the ADS1602 to the TMS320 DSP  
family  
Since the ADS1602 communicates with the host via a  
serial interface, the most suitable method to connect  
to any of the TMS320 DSPs is via the multi-channel  
buffered serial port (McBSP). A typical connection to  
the TMS320 DSP is shown in Figure 54.  
22  
Copyright © 20042011, Texas Instruments Incorporated  
 
ADS1602  
www.ti.com  
SBAS341E DECEMBER 2004REVISED OCTOBER 2011  
REVISION HISTORY  
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.  
Changes from Revision D (November 2010) to Revision E  
Page  
Added footnote to Electrical Characteristics table ................................................................................................................ 4  
Changes from Revision C (September 2010) to Revision D  
Page  
Changed tC minimum specification in Timing Requirements table for Figure 1 ................................................................... 8  
Changed tCPW minimum specification in Timing Requirements table for Figure 2 ............................................................... 8  
Changed tDH minimum specification in Timing Requirements table for Figure 2 .................................................................. 8  
Copyright © 20042011, Texas Instruments Incorporated  
23  
PACKAGE OPTION ADDENDUM  
www.ti.com  
10-Dec-2020  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead finish/  
Ball material  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
(6)  
ADS1602IPFBR  
ADS1602IPFBT  
ACTIVE  
ACTIVE  
TQFP  
TQFP  
PFB  
PFB  
48  
48  
1000 RoHS & Green  
250 RoHS & Green  
NIPDAU  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
-40 to 85  
-40 to 85  
ADS1602I  
ADS1602I  
NIPDAU  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance  
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may  
reference these types of products as "Pb-Free".  
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.  
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based  
flame retardants must also meet the <=1000ppm threshold requirement.  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6)  
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two  
lines if the finish value exceeds the maximum column width.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
10-Dec-2020  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
24-Feb-2023  
TAPE AND REEL INFORMATION  
REEL DIMENSIONS  
TAPE DIMENSIONS  
K0  
P1  
W
B0  
Reel  
Diameter  
Cavity  
A0  
A0 Dimension designed to accommodate the component width  
B0 Dimension designed to accommodate the component length  
K0 Dimension designed to accommodate the component thickness  
Overall width of the carrier tape  
W
P1 Pitch between successive cavity centers  
Reel Width (W1)  
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE  
Sprocket Holes  
Q1 Q2  
Q3 Q4  
Q1 Q2  
Q3 Q4  
User Direction of Feed  
Pocket Quadrants  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
ADS1602IPFBR  
TQFP  
PFB  
48  
1000  
330.0  
16.4  
9.6  
9.6  
1.5  
12.0  
16.0  
Q2  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
24-Feb-2023  
TAPE AND REEL BOX DIMENSIONS  
Width (mm)  
H
W
L
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
TQFP PFB 48  
SPQ  
Length (mm) Width (mm) Height (mm)  
350.0 350.0 43.0  
ADS1602IPFBR  
1000  
Pack Materials-Page 2  
MECHANICAL DATA  
MTQF019A – JANUARY 1995 – REVISED JANUARY 1998  
PFB (S-PQFP-G48)  
PLASTIC QUAD FLATPACK  
0,27  
0,17  
0,50  
M
0,08  
36  
25  
37  
24  
48  
13  
0,13 NOM  
1
12  
5,50 TYP  
7,20  
SQ  
Gage Plane  
6,80  
9,20  
SQ  
8,80  
0,25  
0,05 MIN  
0°7°  
1,05  
0,95  
0,75  
0,45  
Seating Plane  
0,08  
1,20 MAX  
4073176/B 10/96  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Falls within JEDEC MS-026  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
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AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY  
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD  
PARTY INTELLECTUAL PROPERTY RIGHTS.  
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate  
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable  
standards, and any other safety, security, regulatory or other requirements.  
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