AFE1256TDS [TI]
适用于数字 X 射线平板检测器的 256 通道模拟前端 (AFE) | TDS | 314 | 0 to 70;
| 型号： | AFE1256TDS |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 适用于数字 X 射线平板检测器的 256 通道模拟前端 (AFE) | TDS | 314 | 0 to 70 |
| 文件： | 总10页 (文件大小：696K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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AFE1256
ZHCSCC5D –OCTOBER 2013–REVISED MAY 2016
AFE1256 用于数字 X 射线平板探测器、的 256 通道模拟前端
1 特性
2 应用范围
平板 X 射线检测器
1
•
•
•
•
•
256 个通道
片上 16 位模数转换器 (ADC)
3 说明
光电二极管抗短路
AFE1256 是一款 256 个通道模拟前端 (AFE)，此器件
数据线（列）抗短路
被设计成满足基于平板检测器 (FPD) 的数字 X 射线系
高性能：
统的的要求。此器件包括 256 个积分器，一个用于满
–
–
–
噪声：758 electronRMS (eRMS)，1.2pC 范围
内的 28pF 传感器电容器
量程充电电平选择的可编程增益放大器 (PGA)，一个
具有双组的相交双采样器 (CDS)，256:4 模拟复用器和
四个板载 16 位，逐次逼近寄存器 (SAR) 模数转换器
(ADC)。ADC 提供格式为 SPI™的串行数据。
积分非线性：
内部 16 位 ADC 的 ±2 最低有效位 (LSB)
最小扫描时间：
–
–
正常模式下为 37.9µs
硬件可选积分极性可实现正或负电荷积分，并在系统设
计中提供更多的灵活性。此打盹特性大大节省了能耗。
这一节电特性特别适合于电池供电类系统。
2x 双像素模式下为 20µs
•
集成：
–
8 个可选满量程范围：
0.15pC（最小值）至 9.6pC（最大值）
该器件可以 22mm × 5mm 凸出式金属接点芯片形式提
供，也提供 38mm × 28mm、COF-314 TDS 封装。
–
–
内置相关双采样器
针对更快速数据吞吐量的 2x 双像素模式（两个
相邻通道的平均充电）
如需完整数据表或其他设计资源，请点击：请求获取
AFE1256
–
管道式积分和读取：积分期间允许数据读取
器件信息(1)
封装
•
•
灵活性：
订货编号
AFE1256GBTD
AFE1256TDS
封装尺寸
22mm x 5mm
38mm x 28mm
–
电子和空穴积分
凸出式金属接点芯片
(533)
低功耗：
COF (314)
–
–
–
–
具有 ADC 时，每通道 2.9mW
(1) 要了解所有可用封装，请参见数据表末尾的封装选项附录。
(2) 产品预览器件。
无 ADC 时，每通道 2.3mW
打盹模式时，每通道 0.1mW
总断电特性
空白
•
22mm x 5mm 凸出式金属接点芯片，
适用于带载封装 (TCP) 和 覆晶薄膜封装 (COF)
AFE1256 电路原理图
Device
Reference
REFP, REFM
Voltage
16-Bit
ADC[3:0]
Mux
Integrators and
CDS
SDO[3:0]
SPI
Interface
TFT Switch
Pixel
Capacitor
[255:0]
[255:0]
Timing and Control
STI, CLK, A_BZ, RST, IRST, SHR, SHS, LPF_ON
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
English Data Sheet: SBAS630
AFE1256
ZHCSCC5D –OCTOBER 2013–REVISED MAY 2016
www.ti.com.cn
目录
5.1 商标........................................................................... 3
5.2 静电放电警告............................................................. 3
5.3 Glossary.................................................................... 3
机械封装和可订购信息............................................. 3
6.1 托盘尺寸.................................................................... 4
6.2 GBTD 芯片................................................................ 5
1
2
3
4
5
特性.......................................................................... 1
应用范围................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
器件和文档支持........................................................ 3
6
4 修订历史记录
注：之前版本的页码可能与当前版本有所不同。
Changes from Revision C (August 2015) to Revision D
Page
•
已添加 请求获取完整数据表的链接......................................................................................................................................... 1
Changes from Revision B (April 2014) to Revision C
Page
•
•
•
•
•
已将文档状态从混合改为量产数据.......................................................................................................................................... 1
已从文档中删除 TDQ 封装...................................................................................................................................................... 1
已更改说明部分的最后一段..................................................................................................................................................... 1
已删除器件信息表中的第二行 ................................................................................................................................................. 1
已更改托盘尺寸部分：已删除图 1 ......................................................................................................................................... 4
Changes from Revision A (March 2014) to Revision B
Page
•
已将 TDS 封装更改为量产数据............................................................................................................................................... 1
Changes from Original (October 2013) to Revision A
Page
•
已更改产品预览数据表 ........................................................................................................................................................... 1
2
版权 © 2013–2016, Texas Instruments Incorporated
AFE1256
www.ti.com.cn
ZHCSCC5D –OCTOBER 2013–REVISED MAY 2016
5 器件和文档支持
5.1 商标
SPI is a trademark of Motorola.
All other trademarks are the property of their respective owners.
5.2 静电放电警告
这些装置包含有限的内置 ESD 保护。 存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损
伤。
5.3 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
6 机械封装和可订购信息
以下页中包括机械、封装和可订购信息。这些信息是针对指定器件可提供的最新数据。这些数据会在无通知且不对
本文档进行修订的情况下发生改变。欲获得该数据表的浏览器版本，请查阅左侧的导航栏。
版权 © 2013–2016, Texas Instruments Incorporated
3
AFE1256
ZHCSCC5D –OCTOBER 2013–REVISED MAY 2016
www.ti.com.cn
6.1 托盘尺寸
TDS 封装的托盘尺寸如图 1 所示。
图 1. TDS 托盘尺寸
4
版权 © 2013–2016, Texas Instruments Incorporated
AFE1256
www.ti.com.cn
ZHCSCC5D –OCTOBER 2013–REVISED MAY 2016
6.2 GBTD 芯片
图 2 未考虑划线密封。
图 2. GBTD 芯片机械数据
版权 © 2013–2016, Texas Instruments Incorporated
5
AFE1256
ZHCSCC5D –OCTOBER 2013–REVISED MAY 2016
www.ti.com.cn
GBTD 芯片 (接下页)
图 3 提供了 GBTD 芯片的托盘尺寸。
图 3. GBTD 芯片托盘尺寸详细信息
6
版权 © 2013–2016, Texas Instruments Incorporated
AFE1256
www.ti.com.cn
ZHCSCC5D –OCTOBER 2013–REVISED MAY 2016
GBTD 芯片 (接下页)
芯片被有源侧朝上（金属接点朝上）放置在晶圆封装中。如 图 4 中所示，晶圆封装缺口在右上部。
图 4. GBTD 芯片，引脚 1 位置
版权 © 2013–2016, Texas Instruments Incorporated
7
PACKAGE OPTION ADDENDUM
www.ti.com
10-Nov-2022
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
AFE1256GBTD
AFE1256TDS
ACTIVE
ACTIVE
0
39
35
RoHS & Green
RoHS & Green
Call TI
Call TI
0 to 70
0 to 70
AFE1256
AFE1256TDS
Samples
Samples
COF
TDS
314
AU
N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Nov-2022
Addendum-Page 2
重要声明和免责声明
TI“按原样”提供技术和可靠性数据（包括数据表）、设计资源（包括参考设计）、应用或其他设计建议、网络工具、安全信息和其他资源，
不保证没有瑕疵且不做出任何明示或暗示的担保，包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担
保。
这些资源可供使用 TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任：(1) 针对您的应用选择合适的 TI 产品，(2) 设计、验
证并测试您的应用，(3) 确保您的应用满足相应标准以及任何其他功能安全、信息安全、监管或其他要求。
这些资源如有变更，恕不另行通知。TI 授权您仅可将这些资源用于研发本资源所述的 TI 产品的应用。严禁对这些资源进行其他复制或展示。
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