BQ4847_07 [TI]
RTC Module With CPU Supervisor; RTC模块, CPU监控电路型号: | BQ4847_07 |
厂家: | TEXAS INSTRUMENTS |
描述: | RTC Module With CPU Supervisor |
文件: | 总6页 (文件大小:247K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
bq4847/bq4847Y
RTC Module With CPU Supervisor
tolerance to allow for power supply
General Description
Features
and processor stabilization.
➤ Real-Time Clock counts seconds
The bq4847 Real-Time Clock Mod-
Th e bq4847 a ls o h a s a bu ilt -in
ule is a low-power microprocessor
through years in BCD format
watchdog timer to monitor processor
peripheral that integrates a time-
➤ Integrated battery and crystal
operation. If the microprocessor does
of-day clock, a 100-year calendar, a
not toggle the watchdog input (WDI)
CPU supervisor, a battery, and a crys-
➤ On-chip battery-backup switch-
over circuit with nonvolatile con-
trol for an external SRAM
within the programmed time-out,
tal in a 28-pin DIP module. The part
the bq4847 asserts WDO and RST.
is ideal for fax machines, copiers, in-
WD I u n con n e ct e d d is a b le s t h e
dustrial control systems, point-of-sale
watchdog timer.
➤ 130mAh battery capacity
terminals, data loggers, and comput-
ers.
The bq4847 can generate other in-
➤ ±1 minute per month clock accu-
terrupts based on a clock alarm con-
Th e bq4847 con t a in s a n in t er n a l
racy
dition or a periodic setting. The
battery and crystal. Through the use
➤ Less than 500nA of clock opera-
alarm interrupt can be set to occur
of the conditional chip enable output
tion current in backup mode
from once per second to once per
(CEOUT) and battery voltage output
month. The alarm can be made ac-
(VOUT) pin s, t h e bq4847 can write-
➤ Microprocessor reset valid to
tive in the battery-backup mode to
protect and make n on vola t ile a n
VCC = VSS
serve as a system wake-up call. For
ext er n a l SRAM. Th e ba cku p cell
interrupts at a rate beyond once per
p ower s t h e r ea l-t im e clock a n d
➤ I n d ep en d en t wa t ch d og t im er
with a programmable time-out
period
second, the periodic interrupt can be
programmed with periods of 30.5µs
to 500ms.
m a in t a in s SRAM in for m a t ion in
the absence of system voltage.
➤ Power-fail interrupt warning
T h e
b q 4 8 4 7
con t a i n s
a
t em per a t u r e-com pen sa t ed r efer-
ence and comparator circuit that
monitors the status of its voltage
su pply. Wh en a n ou t -of-t oler a n ce
condition is detected, the bq4847
gen er a t es a n in t er r u pt wa r n in g
a n d su bsequ en t ly a m icr opr oces-
sor r eset . Th e r eset st a ys a ct ive
for 200m s a ft er VCC r ises wit h in
➤ Programmable clock alarm inter-
r u pt a ct ive in ba t t er y-ba cku p
mode
Caution:
Take care to avoid inadvertent dis-
charge through VOUT and CEOUT
after battery isolation has been
broken.
➤ Programmable periodic interrupt
➤ Battery-low warning
Pin Connections
Pin Names
A0–A3
Clock/Control address
inputs
NC
No connect
V
28
1
V
OUT
NC
NC
CC
WE
27
26
2
3
VOUT
INT
Back-up battery output
Interrupt output
Microprocessor reset
Watchdog input
Watchdog output
+5V supply
CE
CE
NC
IN
DQ0–DQ7 Data inputs/outputs
4
WDO
INT
25
24
23
22
21
20
19
18
17
16
15
OUT
5
WE
OE
Write enable
RST
6
WDI
OE
CS
RST
WDI
WDO
VCC
VSS
A
3
7
Output enable
Chip select input
A
A
A
8
9
2
1
0
NC
10
11
12
13
14
DQ
7
DQ
DQ
DQ
DQ
CS
DQ
0
1
2
6
DQ
DQ
5
4
3
CEIN
External RAM chip
enable
V
SS
Ground
CEOUT
Conditional RAM chip
enable
28-Pin DIP Module
PN484701.eps
Sept. 1996
1
bq4847/bq4847Y
room temperature. For a complete description of fea-
tures, operating conditions, electrical characteristics,
bus timing, and pin descriptions, see the bq4845 data
sheet. Valid part types for ordering are bq4847MT (5%)
and bq4847YMT (10%).
Functional Description
Figure 1 is a block diagram of the bq4847. The bq4847 is
functionally equivalent to the bq4845 except that the bat-
tery (20, 24) and crystal (2, 3) pins are not accessible. The
pins are connected internally to a coin cell and quartz
crystal. The coin cell provides 130mAh of capacity. It is in-
ternally isolated from VOUT and CEOUT until the initial
application of VCC. Once VCC rises above VPFD, this isola-
tion is broken, and the backup cell provides power to
VOUT and CEOUT for the external SRAM. The real-time
clock keeps time to within one minute per month at
Figure 2 illustrates the address map for the bq4847. Ta-
ble 1 is a map of the bq4847 registers, and Table 2 de-
scribes the register bits.
Figure 1. Block Diagram
Truth Table
VCC
CS
VIH
VIL
VIL
VIL
X
OE
X
WE
X
CEOUT
CEIN
CEIN
CEIN
CEIN
VOH
VOUT
VOUT1
VOUT1
VOUT1
VOUT1
VOUT1
VOUT2
Mode
Deselect
Write
DQ
Power
Standby
Active
< VCC (max.)
High Z
DIN
X
VIL
VIH
VIH
X
> VCC (min.)
VIL
VIH
X
Read
DOUT
High Z
High Z
Active
Read
Active
< VPFD (min.) > VSO
Deselect
Deselect
CMOS standby
X
X
X
VOHB
High Z Battery-backup mode
≤ VSO
Sept. 1996
2
bq4847/bq4847Y
MT: 28-Pin T-Type Module
(
)
28-Pin MT T-Type Module
Inches
Millimeters
Dimension
Min.
0.360
0.015
0.015
0.008
1.520
0.710
0.590
0.090
0.110
0.100
Max.
0.390
-
Min.
Max.
9.91
-
A
A1
B
C
D
E
9.14
0.38
0.022
0.013
1.535
0.740
0.620
0.110
0.130
0.120
0.38
0.56
0.33
38.99
18.80
15.75
2.79
3.30
3.05
0.20
38.61
18.03
14.99
2.29
e
G
L
2.79
S
2.54
Ordering Information
bq4847
- MT
Pa ck a ge Op tion :
MT = 28-pin T-type Module
Volta ge Toler a n ce:
Blank = 5%
Y = 10%
Device:
bq4847 Real-Time Clock Module With CPU Supervisor
Sept. 1996
3
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
PACKAGING INFORMATION
Orderable Device
BQ4847MT
Status (1)
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
DIP MOD
ULE
MT
28
1
Pb-Free
(RoHS)
CU SN
N / A for Pkg Type
BQ4847YMT
DIP MOD
ULE
MT
28
1
Pb-Free
(RoHS)
CU SN
N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
MPDI064 – MAY 2001
MT (R-PDIP-T**)
PLASTIC DUAL-IN-LINE
28 PINS SHOWN
Inches
Max.
Millimeters
Min.
9.14
Max.
Dimension
Min.
0.360
0.015
0.015
0.008
1.320
1.520
0.710
0.590
0.090
0.110
0.100
0.390
–
A
9.91
–
A1
B
0.38
0.022
0.56
0.33
0.38
0.20
C
0.013
1.335
1.535
0.740
D/24 PIN
D/28 PIN
33.53
38.61
18.03
33.91
38.99
18.80
16.00
2.79
E
e
D
14.99
2.29
0.630
0.110
G
L
3.30
2.79
2.54
0.130
0.120
S
3.05
E
A1
A
C
B
L
S
G
e
4201978/A 03/01
NOTES: A. All linear dimensions are in inches (mm).
B. This drawing is subject to change without notice.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties
may be subject to additional restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Applications
Audio
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/audio
Automotive
Broadband
Digital Control
Military
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/military
Interface
interface.ti.com
logic.ti.com
Logic
Power Mgmt
Microcontrollers
RFID
power.ti.com
Optical Networking
Security
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lpw
Telephony
Low Power
Wireless
Video & Imaging
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
相关型号:
©2020 ICPDF网 联系我们和版权申明