BQ500212ARGZT [TI]
Low System Cost, Wireless Power Controller for WPC TX A5 or A11; 低系统成本,无线电源控制器,用于WPC TX A5或A11型号: | BQ500212ARGZT |
厂家: | TEXAS INSTRUMENTS |
描述: | Low System Cost, Wireless Power Controller for WPC TX A5 or A11 |
文件: | 总28页 (文件大小:937K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
bq500212A
www.ti.com
SLUSBD6B –JULY 2013–REVISED NOVEMBER 2013
Low System Cost, Wireless Power Controller for WPC TX A5 or A11
Check for Samples: bq500212A
1
FEATURES
DESCRIPTION
The bq500212A is a Qi-certified value solution that
integrates all functions required to control wireless
2
•
•
•
Proven, Qi-Certified Value Solution for
Transmit-Side Application
power delivery to
a single WPC1.1 compliant
Lowest Device Count for Full WPC1.1 5-V
Solution
receiver. It is WPC1.1 compliant and designed for 5-V
systems as a wireless power consortium type A5 or
A11 transmitter. The bq500212A pings the
surrounding environment for WPC compliant devices
to be powered, safely engages the device, receives
packet communication from the powered device and
manages the power transfer according to WPC1.1
specification. To maximize flexibility in wireless power
control applications, Dynamic Power Limiting™ (DPL)
is featured on the bq500212A. Dynamic Power
Limiting™ enhances user experience by seamlessly
optimizing the usage of power available from limited
input supplies. The bq500212A supports both Foreign
Object Detection (FOD) and enhanced Parasitic
Metal Object Detection (PMOD) for legacy product by
continuously monitoring the efficiency of the
established power transfer, protecting from power lost
due to metal objects misplaced in the wireless power
transfer field. Should any abnormal condition develop
during power transfer, the bq500212A handles it and
provides indicator outputs. Comprehensive status and
fault monitoring features enable a low cost yet robust,
Qi-certified wireless power system design.
5-V Operation Conforms to Wireless Power
Consortium (WPC1.1) Type A5 or A11
Transmitter Specification
•
•
•
Fully WPC Compliant, Including Improved
Foreign Object Detection (FOD) Method
Permits X7R Type Resonant Capacitors for
Reduced Cost
Dynamic Power Limiting™ for USB and
Limited Source Operation
•
•
Digital Demodulation Reduces Components
LED Indication of Charging State and Fault
Status
•
Low Standby and High Efficiency
APPLICATIONS
•
•
Wireless Power Consortium (WPC1.1)
Compliant Wireless Chargers For:
–
Qi-Certified Smart Phones and other
Handhelds
The bq500212A is available in a 48-pin, 7-mm x 7-
mm QFN package.
–
Car and Other Vehicle Accessories
See www.ti.com/wirelesspower for More
Information on TI's Wireless Charging
Solutions
System Diagram and Efficiency Versus System Output Power
80
Current
Sense
5 V
VIN
70
LDO
60
50
bq500212A
Wireless
Power Controller
PWM
½ Bridge
Driver
½ Bridge
Driver
Tank /Coil
Assembly
LED
40
30
20
10
0
Communication
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
Power (W)
C001
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Dynamic Power Limiting is a trademark of Texas Instruments.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2013, Texas Instruments Incorporated
bq500212A
SLUSBD6B –JULY 2013–REVISED NOVEMBER 2013
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION(1)
OPERATING
TEMPERATURE
RANGE, TA
TOP SIDE
MARKING
ORDERABLE PART NUMBER
PIN COUNT
SUPPLY
PACKAGE
BQ500212ARGZR
BQ500212ARGZT
48 pin
48 pin
Reel of 2500
Reel of 250
QFN
QFN
BQ500212A
BQ500212A
-40°C to 110°C
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted)
VALUE
UNIT
MIN
–0.3
–0.3
–0.3
–40
MAX
3.6
Voltage applied at V33D to GND
Voltage applied at V33A to GND
3.6
V
(2)
Voltage applied to any pin
3.6
Storage temperature,TSTG
150
°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages referenced to GND.
2
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SLUSBD6B –JULY 2013–REVISED NOVEMBER 2013
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
MIN TYP MAX UNIT
V
Supply voltage during operation, V33D, V33A
Operating free-air temperature range
Junction temperature
3.0
3.3
3.6
110
110
V
TA
TJ
–40
°C
THERMAL INFORMATION
bq500212A
RGZ
48 PINS
28.4
THERMAL METRIC(1)
UNITS
θJA
Junction-to-ambient thermal resistance(2)
Junction-to-case (top) thermal resistance(3)
Junction-to-board thermal resistance(4)
Junction-to-top characterization parameter(5)
Junction-to-board characterization parameter(6)
Junction-to-case (bottom) thermal resistance(7)
θJCtop
θJB
14.2
5.4
°C/W
ψJT
0.2
ψJB
5.3
θJCbot
1.4
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
(3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-
standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
(5) The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7).
(6) The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7).
(7) The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
Spacer
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ELECTRICAL CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
SUPPLY CURRENT
IV33A
V33A = 3.3 V
8
44
52
15
55
60
IV33D
Supply current
V33D = 3.3 V
mA
ITOTAL
V33D = V33A = 3.3 V
INTERNAL REGULATOR CONTROLLER INPUTS/OUTPUTS
V33
3.3-V linear regulator
Emitter of NPN transistor
3.25
40
3.3
4
3.6
4.6
V
V33FB
IV33FB
Beta
3.3-V linear regulator feedback
Series pass base drive
Series NPN pass device
VIN = 12 V; current into V33FB pin
10
mA
EXTERNALLY SUPPLIED 3.3 V POWER
V33D
V33A
Digital 3.3-V power
Analog 3.3-V power
TA = 25°C
TA = 25°C
3
3
3.6
3.6
V
V33 slew rate between 2.3 V and 2.9 V,
V33A = V33D
V33Slew
V33 slew rate
0.25
V/ms
DIGITAL DEMODULATION INPUTS COMM_A+, COMM_A-, COMM_B+, COMM_B-
Vbias
COMM+ Bias Voltage
1.5
1
V
COMM+,
COMM-
Modulation voltage digital resolution
mV
REA
Input impedance
Ground reference
0.5
–5
1.5
3
5
MΩ
IOFFSET
Input offset current
1-kΩ source impedance
µA
ANALOG INPUTS V_SENSE, I_SENSE, T_SENSE, LED_MODE, LOSS_THR, SNOOZE_CAP, PWR_UP
VADDR_OPEN
VADDR_SHORT
VADC_RANGE
INL
Voltage indicating open pin
Voltage indicating pin shorted to GND
Measurement range for voltage monitoring
ADC integral nonlinearity
LED_MODE open
2.37
LED_MODE shorted to ground
ALL ANALOG INPUTS
0.36
2.5
V
0
-2.5
8
2.5
mV
MΩ
pF
RIN
Input impedance
Ground reference
CIN
Input capacitance
10
DIGITAL INPUTS/OUTPUTS
DGND1
+ 0.25
VOL
VOH
Low-level output voltage
IOL = 6 mA , V33D = 3 V
IOH = -6 mA , V33D = 3 V
V33D
- 0.6V
High-level output voltage
V
VIH
High-level input voltage
Low-level input voltage
Output high source current
Output low sink current
V33D = 3V
2.1
3.6
1.4
4
VIL
V33D = 3.5 V
IOH(MAX)
IOL(MAX)
mA
4
SYSTEM PERFORMANCE
VRESET
tRESET
fSW
Voltage where device comes out of reset
V33D Pin
2.4
V
Pulse width needed for reset
Switching Frequency
RESET pin
2
µs
112
205
kHz
4
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SLUSBD6B –JULY 2013–REVISED NOVEMBER 2013
DEVICE INFORMATION
Functional Block Diagram
6
7
8
9
SLEEP
bq500212A
LED_A
LED_B
SNOOZE
LED Control /
Low Power
Interface
COMM_A+ 37
COMM_A- 38
COMM_B+ 39
COMM_B- 40
15 FOD_CAL
18 LED_C
16 PMOD
17 FOD
Digital
Demodulation
12 PWM-A
13 PWM-B
Controller
PWM
PEAK_DET
1
V_SENSE 46
I_SENSE 42
12-bit
ADC
23 BUZ_AC
24 BUZ_DC
Buzzer
Control
T_SENSE
2
LOSS_THR 43
LED_MODE 44
POR
11 DATA
10 CLK
I2C
SNOOZE_CAP
3
5
UDG-13118
RESET
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RGZ Package
(Top View)
48 47 46 45 44 43 42 41 40 39 38 37
36
PEAK_DET
T_SENSE
1
2
3
4
5
6
7
8
9
GND
35
34
33
32
BPCAP
V33A
SNOOZE_CAP
N/C
V33D
GND
GND
RESET
SLEEP
31
bq500212A
LED_A
LED_B
SNOOZE
CLK
30
RESERVED
RESERVED
RESERVED
29
28
10
11
12
27
26
25
RESERVED
RESERVED
RESERVED
DATA
PWM_A
13 14 15 16 17 18 19 20 21 22 23 24
6
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SLUSBD6B –JULY 2013–REVISED NOVEMBER 2013
PIN FUNCTIONS
PIN
NAME
I/O
DESCRIPTION
NO.
1
2
PEAK_DET
T_SENSE
SNOOZE_CAP
N/C
I
I
I
I
Connected to peak detect circuit. Protects from coil overvoltage event.
Sensor Input. Device shuts down when below 1 V for longer than 150ms. If not used, keep
above 1 V by connecting to the 3.3-V supply.
3
4
Connected to interval timing capacitor
Not used. Can be left open. Can also be tied to GND and flooded with copper to improve
GND plane.
5
6
RESET
SLEEP
LED_A
LED_B
SNOOZE
CLK
I
O
I
Device reset. Use a 10-kΩ to 100-kΩ pull-up resistor to the 3.3-V supply.
Connected to 5 s interval circuit
7
Connect to an LED via 470-Ω resistor for status indication.
Connect to an LED via 470-Ω resistor for status indication.
Connected to 500ms ping interval circuit
8
I
9
O
I/O
I/O
10
11
12
10-kΩ pull-up resistor to 3.3-V supply. For factory use only.
10-kΩ pull-up resistor to 3.3-V supply. For factory use only.
DATA
PWM Output A, controls one half of the full bridge in a phase-shifted full bridge. Switching
deadtimes must be externally generated.
PWM_A
PWM_B
O
O
13
PWM Output B, controls other half of the full bridge in a phase-shifted full bridge. Switching
deadtimes must be externally generated.
14
15
16
RESERVED
FOD_CAL
O
O
Reserved. Leave open.
FOD Calibration pin. It controls the FOD calibration setting at startup.
Set the threshold used to detect a PMOD condition by connecting, via resistor, to pin 43.
Leave open to disable PMOD.
PMOD
FOD
O
O
17
Set the threshold used to detect an FOD condition by connecting, via resistor, to pin 43.
Leave open to disable FOD.
18
19
20
21
22
23
24
LED_C
O
O
I
Connect to an LED via 470-Ω resistor for status indication.
Reserved, leave this pin open.
RESERVED
RESERVED
DOUT_TX
SNOOZE_CHG
BUZ_AC
Reserved, connect to GND.
I
Not used. Leave this pin open.
I
Connected to interval timing capacitor.
O
AC Buzzer Output. Outputs a 400-ms, 4-kHz AC pulse when charging begins.
DC Buzzer Output. Outputs a 400-ms DC pulse when charging begins. This could also be
connected to an LED via 470-Ω resistor.
BUZ_DC
O
25
26
27
28
29
30
31
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
GND
I/O
I/O
I/O
I/O
I/O
I/O
I/O
Not used, leave this pin open.
Not used, leave this pin open.
Reserved, leave this pin open.
Reserved, leave this pin open.
Reserved, leave this pin open.
Reserved, leave this pin open.
Reserved, connect to GND.
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PIN FUNCTIONS (continued)
PIN
NAME
I/O
DESCRIPTION
NO.
32
GND
—
—
GND.
33
Digital core 3.3-V supply. Be sure to decouple with bypass capacitors as close to the part as
possible.
V33D
34
—
Analog 3.3-V Supply. This pin can be derived from V33D supply, decouple with 10-Ω resistor
and additional bypass capacitors
V33A
35
36
37
38
39
40
41
42
BPCAP
GND
—
—
I
Bypass capacitor for internal 1.8-V core regulator. Connect bypass capacitor to GND.
GND.
COMM_A+
COMM_A-
COMM_B+
COMM_B-
RESERVED
Digital demodulation non-inverting input A, connect parallel to input B+.
Digital demodulation inverting input A, connect parallel to input B-.
Digital demodulation non-inverting input B, connect parallel to input A+.
Digital demodulation inverting input B, connect parallel to input A-.
Reserved, leave this pin open.
I
I
I
O
I
Transmitter input current, used for efficiency calculations. Use 20-mΩ sense resistor and
A=50 gain current sense amplifier.
I_SENSE
43
44
45
46
LOSS_THR
LED_MODE
PWR_UP
I
I
I
I
Input to program FOD/PMOD thresholds and FOD_CAL correction.
Input to select from four LED modes.
Connected to external test circuit or LED drive circuit.
Transmitter input voltage, used for efficiency calculations. Use 76.8-kΩ to 10-kΩ divider to
minimize quiescent current.
V_SENSE
47
48
49
GND
—
I
GND.
ADCREF
EPAD
External Reference Voltage Input. Connect this input to GND.
Flood with copper GND plane and stitch vias to PCB internal GND plane.
—
8
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SLUSBD6B –JULY 2013–REVISED NOVEMBER 2013
Principles of Operation
Fundamentals
The principle of wireless power transfer is simply an open cored transformer consisting of primary and secondary
coils and associated electronics. The primary coil and electronics are also referred to as the transmitter, and the
secondary side the receiver. The transmitter coil and electronics are typically built into a charger pad. The
receiver coil and electronics are typically built into a portable device, such as a cell-phone.
When the receiver coil is positioned on the transmitter coil, magnetic coupling occurs when the transmitter coil is
driven. The flux is coupled into the secondary coil which induces a voltage, current flows, it is rectified and power
can be transferred quite effectively to a load - wirelessly. Power transfer can be managed via any of various
familiar closed-loop control schemes.
Wireless Power Consortium (WPC)
The Wireless Power Consortium (WPC) is an international group of companies from diverse industries. The WPC
standard was developed to facilitate cross compatibility of compliant transmitters and receivers. The standard
defines the physical parameters and the communication protocol to be used in wireless power. For more
information, go to www.wirelesspowerconsortium.com.
Power Transfer
Power transfer depends on coil coupling. Coupling is dependant on the distance between coils, alignment, coil
dimensions, coil materials, number of turns, magnetic shielding, impedance matching, frequency and duty cycle.
Most importantly, the receiver and transmitter coils must be aligned for best coupling and efficient power transfer.
The closer the space between the coils, the better the coupling, but the practical distance is set to be less than 5
mm (as defined within the WPC Specification) to account for housing and interface surfaces.
Shielding is added as a backing to both the transmitter and receiver coils to direct the magnetic field to the
coupled zone. Magnetic fields outside the coupled zone do not transfer power. Thus, shielding also serves to
contain the fields to avoid coupling to other adjacent system components.
Regulation can be achieved by controlling any one of the coil coupling parameters. For WPC compatibility, the
transmitter coils and capacitance are specified and the resonant frequency point is fixed at 100 kHz. Power
transfer is regulated by changing the operating frequency between 110 kHz to 205 kHz. The higher the
frequency, the further from resonance and the lower the power. Duty cycle remains constant at 50% throughout
the power band and is reduced only once 205 kHz is reached.
The WPC standard describes the dimension and materials of the coils. It also has information on tuning the coils
to resonance. The value of the inductor and resonant capacitor are critical to proper operation and system
efficiency.
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Communication
Communication within the WPC is from the receiver to the transmitter, where the receiver tells the transmitter to
send power and how much. In order to regulate, the receiver must communicate with the transmitter whether to
increase or decrease frequency. The receiver monitors the rectifier output and using Amplitude Modulation (AM),
sends packets of information to the transmitter. A packet is comprised of a preamble, a header, the actual
message and a checksum, as defined by the WPC standard.
The receiver sends a packet by modulating an impedance network. This AM signal reflects back as a change in
the voltage amplitude on the transmitter coil. The signal is demodulated and decoded by the transmitter side
electronics and the frequency of its coil drive output is adjusted to close the regulation loop. The bq500212A
features internal digital demodulation circuitry.
The modulated impedance network on the receiver can either be resistive or capacitive. Figure 1 shows the
resistive modulation approach, where a resistor is periodically added to the load and also shows the resulting
change in resonant curve which causes the amplitude change in the transmitter voltage indicated by the two
operating points at the same frequency. Figure 2 shows the capacitive modulation approach, where a capacitor
is periodically added to the load and also shows the resulting amplitude change in the transmitter voltage.
Rectifier
Receiver
Capacitor
Amax
Receiver Coil
Modulation
Resitor
Operating state at logic “0”
Operating state at logic “1”
A(0)
A(1)
Comm
Fsw
F, kHz
a)
b)
Figure 1. Receiver Resistive Modulation Circuit
Rectifier
Receiver
Capacitor
Receiver Coil
Amax
Modulation
Capacitors
Operating state at logic “ 0”
Operating state at logic “ 1”
A(0)
A(1)
Comm
Fsw
F, kHz
Fo(1) < Fo(0)
a)
b)
Figure 2. Receiver Capacitive Modulation Circuit
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SLUSBD6B –JULY 2013–REVISED NOVEMBER 2013
Application Information
Coils and Matching Capacitors
The coil and matching capacitor selection for the transmitter has been established by WPC standard. These
values are fixed and cannot be changed on the transmitter side.
An up to date list of available and compatible A5 or A11 transmitter coils can be found here (Texas Instruments
Literature Number SLUA649):
Capacitor selection is critical to proper system operation. A total capacitance value of 400 nF is required in the
resonant tank. A 400-nF capacitor is not a standard value and therefore several must be combined in parallel. It
is recommended to use 4 x 100nF, as these are very commonly available.
NOTE
A total capacitance value of 400 nF/50 V is required in the resonant tank to achieve a 100-
kHz resonance frequency.
To achieve the 400nF total capacitance in the resonant tank, the bq500212A sensitive demodulation circuitry
allows the use of three (3) lower cost 100nF/X7R type capacitors in parallel with one (1) high quality 100nF/C0G
type, thereby reducing system cost from competitive solutions requiring four C0G types.
The capacitors chosen must be rated for 50 V operation. Use quality capacitors from reputable vendors such as
KEMET, MURATA or TDK.
Dynamic Power Limiting™
Dynamic Power Limiting™ (DPL) allows operation from a 5-V supply with limited current capability (such as a
USB port). When the input voltage is observed drooping, the output power is dynamically limited to reduce the
load and provides margin relative to the supply’s capability.
Anytime the DPL control loop is regulating the operating point of the transmitter, the LED will indicate that DPL is
active. The LED color and flashing pattern are determined by the LED Table. If the receiver sends a Control
Error Packet (CEP) with a negative value, (for example, to reduce power to the load), the WPTX in DPL mode
will respond to this CEP via the normal WPC control loop.
NOTE
The power limit indication depends on the LED_MODE selected.
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Option Select Pins
Several pins on the bq500212A are allocated to programming the FOD and PMOD Loss Threshold and the LED
mode of the device. At power up, a bias current is applied to pins LED_MODE and LOSS_THR and the resulting
voltage measured in order to identify the value of the attached programming resistor. The values of the operating
parameters set by these pins are determined using Table 2. For LED_MODE, the selected bin determines the
LED behavior based on Table 1; for the LOSS_THR, the selected bin sets a threshold used for parasitic metal
object detection (see Parasitic Metal Detection (PMOD) and Foreign Object Detection (FOD) section). Table 1.
bq500212A
LED_MODE
44
Resistors
to set
options
LOSS_THR
To 12-bit ADC
43
FOD
PMOD FOD_CAL
16 15
17
UDG-13119
Figure 3. Option Select Pin Programming
LED Indication Modes
The bq500212A can directly drive up to three (3) LED outputs (pin 7, pin 8 and pin 18) through a simple current
limit resistor (typically 470 Ω), based on the mode selected. The current limit resistors can be individually
adjusted to tune or match the brightness of the LEDs. Do not exceed the maximum output current rating of the
device. The resistor in Figure 3 connected to pin 44 and GND selects the desired LED indication scheme in
Table 1.
•
•
•
LED modes permit the use of one to three indicator LED's. Amber in the 2-LED mode is obtained by turning
on both the green and red.
LEDs can be turned on solid or configured to blink either slow (approx. 1.6s period) or fast (approx. 400ms
period).
Except in modes 2 and 9, the charge complete state is only maintained for 5 seconds after which it reverts to
idle. This permits the processor to sleep in order to reduce standby power consumption. In other modes,
external logic, such as a flip-flop, may be implemented to maintain the charge complete indication if desired.
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SLUSBD6B –JULY 2013–REVISED NOVEMBER 2013
Table 1. LED Modes
OPERATIONAL STATES
LED
CONTROL
OPTION
LED
SELECTION
RESISTOR
DYNAMIC
CHARGE
DESCRIPTION
LED
POWER
STANDBY
FAULT
POWER
LIMITING™
FOD Warning
TRANSFER
COMPLETE
LED1, green
LED2, red
X
1
< 36.5 kΩ
42.2 kΩ
48.7 kΩ
56.2 kΩ
64.9 kΩ
75 kΩ
Reserved, do not use
Choice number 1
Choice number 2
Choice number 3
Choice number 4
Choice number 5
Choice number 6
Choice number 7
Choice number 8
Choice number 9
Choice number 10
-
-
-
-
-
-
LED3, amber
LED1, green
LED2, red
Off
Off
-
Blink slow
On
Off
-
Off
Blink slow
Off
Off
On
Blink slow
Blink fast
LED3, amber
LED1, green
LED2, red
-
-
-
-
On
On
-
Blink slow
On
Off
-
Off
Blink slow
Off
2
Off
On
Blink slow
Blink fast
LED3, amber
LED1, green
LED2, red
-
-
-
-
Off
-
On
Off
-
Blink fast
On
On
3
-
-
-
-
LED3, amber
LED1, green
LED2, red
-
-
-
-
-
-
Off
Off
-
On
Off
Off
-
Off
Off
Off
4
Off
On
Blink slow
Blink fast
LED3, amber
LED1, green
LED2, red
-
-
-
-
Off
Off
Off
Off
Off
Off
Off
Off
Off
Off
Off
-
Off
On
Off
Off
On
Off
Off
Off
On
Off
On
Off
-
Off
Off
Off
5
On
Off
On
On
LED3, amber
LED1, green
LED2, red
Off
Blink slow
Off
Off
Blink slow
Off
Off
Off
6
86.6 kΩ
100 kΩ
115 kΩ
133 kΩ
154 kΩ
Off
On
Off
Blink fast
LED3, amber
LED1, green
LED2, red
Off
Off
Blink Slow
Off
Blink slow
Off
Off
Off
7
Off
Off
Off
Off
LED3, amber
LED1, green
LED2, red
Off
On
Blink slow
Blink fast
Off
Blink slow
Off
Off
8
On
Blink slow
On
On
LED3, amber
LED1, green
LED2, red
-
-
-
-
Off
Off
-
Blink slow
On
Off
-
Off
Blink slow
Off
9
Off
-
On
Blink slow
Blink fast
LED3, amber
LED1, green
LED2, red
-
-
-
Off
Off
-
On
Off
-
Off
On
-
Blink fast
Blink slow
On
Off
-
10
Off
-
Off
-
LED3, amber
Copyright © 2013, Texas Instruments Incorporated
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bq500212A
SLUSBD6B –JULY 2013–REVISED NOVEMBER 2013
www.ti.com
Parasitic Metal Object Detect (PMOD), Foreign Object Detection (FOD) and FOD Calibration
The bq500212A supports improved FOD (WPC1.1) and enhanced PMOD (WPC 1.0) features. Continuously
monitoring input power, known losses, and the value of power reported by the RX device being charged, the
bq500212A can estimate how much power is unaccounted for and presumed lost due to metal objects placed in
the wireless power transfer path. If this unexpected loss exceeds the threshold set by the FOD or PMOD
resistors, a fault is indicated and power transfer is halted. Whether the FOD or the PMOD algorithm is used is
determined by the ID packet of the receiver being charged.
As the default, both PMOD and FOD resistors should set a threshold of 400 mW (selected by 56.2-kΩ resistors
from FOD (pin 17) and PMOD(pin16) to LOSS_THR (pin43)). 400 mW has been empirically determined using
standard WPC FOD test objects (disc, ring and foil). Some tuning might be required as every system will be
slightly different. This tuning is best done by trial and error, use the set resistor values given in the table to
increase or decrease the loss threshold and retry the system with the standard test objects. The ultimate goal of
the FOD feature is safety; to protect misplaced metal objects from becoming hot. Reducing the loss threshold
and making the system too sensitive will lead to false trips and a bad user experience. Find the balance which
best suits the application.
If the application requires disabling one function or the other (or both), it is possible by leaving the respective
FOD/PMOD pin open. For example, to selectively disable the PMOD function, PMOD (pin16) should be left open.
NOTE
Disabling FOD results in a TX solution that is not WPC compliant.
Resistors of 1% tolerance should be used for a reliable selection of the desired threshold.
The FOD and PMOD resistors (pin17 and pin16) program the permitted power loss for the FOD and PMOD
algorithms respectively. The FOD_CAL resistor (pin15), can be used to compensate for any load dependent
effect on the power loss. Using a calibrated test receiver with no foreign objects present, the FOD_CAL resistor
should be selected such that the calculated loss across the load range is substantially constant (within ~100
mW). After correcting for the load dependence, the FOD and PMOD thresholds should be re-set above the
resulting average by approximately 400 mW in order for the transmitter to satisfy the WPC requirements on
tolerated heating. Please contact TI for more information about setting appropriate FOD, PMOD, and FOD_CAL
resistor values for your design.
Table 2. Option Select Bins
LOSS THRESHOLD
BIN NUMBER
RESISTANCE (kΩ)
(mW)
0
1
<36.5
42.2
48.7
56.2
64.9
75.0
86.6
100
250
300
2
350
3
400
4
450
5
500
6
550
7
600
8
115
650
9
133
700
10
11
12
13
154
750
800
178
205
850
>237
Feature Disabled
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bq500212A
www.ti.com
SLUSBD6B –JULY 2013–REVISED NOVEMBER 2013
Shut Down via External Thermal Sensor or Trigger
Typical applications of the bq500212A will not require additional thermal protection. This shutdown feature is
provided for enhanced applications and is not only limited to thermal shutdown. The key parameter is the 1.0 V
threshold on pin 2. Voltage below 1.0 V on pin 2 for longer than 150ms causes the device to shutdown.
The application of thermal monitoring via a Negative Temperature Coefficient (NTC) sensor, for example, is
straightforward. The NTC forms the lower leg of a temperature dependant voltage divider. The NTC leads are
connected to the bq500212A device, pin 2 and GND. The threshold on pin 2 is set to 1.0 V, below which the
system shuts down and a fault is indicated (depending on LED mode chosen).
To implement this feature follow these steps:
1) Consult the NTC datasheet and find the resistence vs temperature curve.
2) Determine the actual temperature where the NTC will be placed by using a thermal probe.
3) Read the NTC resistance at that temperature in the NTC datasheet, that is R_NTC.
4) Use the following formula to determine the upper leg resistor (R_Setpoint):
R _Setpoint = 2.3´R _NTC
(1)
The system will restore normal operation after approximately five minutes or if the receiver is removed. If the
feature is not used, this pin must be pulled high.
NOTE
Pin 2 must always be terminated, else erratic behavior may result.
3V3_VCC
Optional
Temperature
R_Setpoint
Sensor
2
T_SENSE
AGND
AGND
Figure 4. Negative Temperature Coefficient (NTC) Application
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bq500212A
SLUSBD6B –JULY 2013–REVISED NOVEMBER 2013
www.ti.com
Fault Handling and Indication
The following table provides approximate durations for the time before a retry is attempted for End Power
Transfer (EPT) packets and fault events. Precise timing may be affected by external components, or shortened
by receiver removal. The LED mode selected determines how the LED indicates the condition or fault.
DURATION
CONDITION
HANDLING
(before retry)
Immediate
5 seconds
Infinite
EPT-00
EPT-01
Unknown
Charge complete
Internal fault
EPT-02
EPT-03
5 minutes
Immediate
Immediate
Infinite
Over temperature
Over voltage
EPT-04
EPT-05
Over current
EPT-06
Battery failure
Reconfiguration
No response
EPT-07
Not applicable
Immediate
1 minute
EPT-08
OC (over current)
NTC (external sensor)
5 minutes
10 seconds LED only,
2 seconds LED +
buzzer
PMOD/FOD warning
PMOD/FOD
12 seconds
5 minutes
Power Transfer Start Signal
The bq500212A features two signal outputs to indicate that power transfer has begun. Pin 23 outputs a 400-ms
duration, 4-kHz square wave for driving low cost AC type ceramic buzzers. Pin 24 outputs logic high, also for 400
ms, which is suitable for DC type buzzers with built-in tone generators, or as a trigger for any type of customized
indication scheme. If not used, these pins can be left open.
Power-On Reset
The bq500212A has an integrated Power-On Reset (POR) circuit which monitors the supply voltage and handles
the correct device startup sequence. Additional supply voltage supervisor or reset circuits are not needed.
External Reset, RESET Pin
The bq500212A can be forced into a reset state by an external circuit connected to the RESET pin. A logic low
voltage on this pin holds the device in reset. For normal operation, this pin is pulled up to 3.3 VCC with a 10-kΩ
pull-up resistor.
Low Power Mode
During standby, when nothing is on the transmitter pad, the bq500212A pings the surrounding environment at
fixed intervals. The ping interval can be adjusted; the component values selected for the SNOOZE circuit
determine this interval between pings. The choice of the ping interval effects two quantities: the idle efficiency of
the system, and the time required to detect the presence of a receiver when it is placed on the pad. A trade off
should be made which balances low power (longest ping interval) with good user experience (quick detection
through short ping interval) while still meeting the WPC requirement for detection within 0.5 seconds.
The system power consumption is approximately 300 mW during an active ping, which lasts approximately 90
ms, and 40 mW for the balance of the cycle. A weighted average can thus be used to estimate the overall
system’s idle consumption:
If T_ping is the interval between pings in ms, P_idle in mW is approximately:
(40 x (T_ping – 90) + 300 x 90)/T_ping
(2)
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bq500212A
www.ti.com
SLUSBD6B –JULY 2013–REVISED NOVEMBER 2013
Trickle Charge and CS100
The WPC specification provides an End-of-Power Transfer message (EPT–01) to indicate charge complete.
Upon receipt of the charge complete message, the bq500212A will change the LED indication. The exact
indication depends on the LED_MODE chosen.
In some battery charging applications there is a benefit to continue the charging process in trickle-charge mode
to top off the battery. There are several information packets in the WPC specification related to the levels of
battery charge (Charge Status). The bq500212A uses these commands to enable top-off charging. The
bq500212A changes the LED indication to reflect charge complete when a Charge Status message is 100%
received, but unlike the response to an EPT, it will not halt power transfer while the LED is solid green. The
mobile device can use a CS100 packet to enable trickle charge mode.
If the reported charge status drops below 90% normal, charging indication will be resumed.
Current Monitoring Requirements
The bq500212A is WPC1.1 ready. In order to enable the FOD or PMOD features, current monitoring circuitry
must be provided in the application design.
For proper scaling of the current monitor signal, the current sense resistor should be 20 mΩ and the current
shunt amplifier should have a gain of 50, such as the INA199A1. For FOD accuracy, the current sense resistor
must be a quality component with 1% tolerance, at least 1/4-Watt rating, and a temperature stability of ±200
PPM. Proper current sensing techniques in the application hardware should also be observed.
If WPC compliance is not required current monitoring can be omitted. Connect the I_SENSE pin (pin 42) to GND.
All Unused Pins
All unused pins can be left open unless otherwise indicated. Pin 4 can be tied to GND and flooded with copper to
improve ground shielding. Please refer to the pin definition table for further explanations.
Design Checklist for WPC1.1 Compliance with the bq500212A
•
•
•
•
Coil and capacitor selection matches the A5/A11 specification.
Total 400-nF resonant capacitor requirement is composed of: (3 x 100nF/X7R) + (1 x 100nF/C0G) types.
Precision current sense amp used, such as the INA199A1. This is required for accurate FOD operation.
Current shunt resistor 1% and <200 PPM. This is required for accurate FOD operation.
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bq500212A
SLUSBD6B –JULY 2013–REVISED NOVEMBER 2013
www.ti.com
APPLICATION INFORMATION
Overview
The application schematic for the transmitter with reduced standby power is shown in Figure 5.
CAUTION
Please check the bq500212A product page for the most up-to-date application
schematic and list of materials package before starting a new design.
I N -
O U T
I N +
V 3 3 A
V 3 3 D
A P D
4 9
G N D
3 4
3 3
3 2
G N D
G N D
3 6
4 7
I N
Figure 5. bq500121A Schematic
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bq500212A
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SLUSBD6B –JULY 2013–REVISED NOVEMBER 2013
Input Regulator
The bq500212A requires 3.3 VDC to operate. A buck regulator or a linear regulator can be used to step down
from the 5-V system input. Either choice is fully WPC compatible, the decision lies in the user's requirements with
respect to cost or efficiency.
For lowest cost the TLV70033 linear regulator is recommended.
Power Train
The bq500212A drives a phase-shifted full bridge. This is essentially twin half bridges and the choice of driver
devices is quite simple; a pair of CSD97376 Integrated Power Stages are used. Other combinations using
discrete driver and MOSFETs can work and system performance with regards to efficiency and EMI emissions
will vary. Any alternate MOSFETs chosen must be fully saturated at the 5-V system gate drive voltage available
and be sure to pay attention whether or not to use gate resistors; some tuning might be required.
PCB Layout
A good PCB layout is critical to proper system operation and due care should be taken. There are many
references on proper PCB layout techniques.
Generally speaking, the system layout will require a 4-layer PCB layout, although a 2-layer PCB layout can be
achieved. A proven and recommended approach to the layer stack-up has been:
•
•
•
•
Layer 1, component placement and as much ground plane as possible.
Layer 2, clean ground.
Layer 3, finish routing.
Layer 4, clean ground.
Thus, the circuitry is virtually sandwiched between grounds. This minimizes EMI noise emissions and also
provides a noise free voltage reference plane for device operation.
Keep as much copper as possible. Make sure the bq500212A GND pins and the power pad have a continuous
flood connection to the ground plane. The power pad should also be stitched to the ground plane, which also
acts as a heat sink for the bq500212A. A good GND reference is necessary for proper bq500212A operation,
such as analog-digital conversion, clock stability and best overall EMI performance.
Separate the analog ground plane from the power ground plane and use only one tie point to connect grounds.
Having several tie points defeats the purpose of separating the grounds.
The COMM return signal from the resonant tank should be routed as a differential pair. This is intended to reduce
stray noise induction. The frequencies of concern warrant low-noise analog signaling techniques, such as
differential routing and shielding, but the COMM signal lines do not need to be impedance matched.
Typically a single chip controller solution with integrated power FET and synchronous rectifier will be used. To
create a tight loop, pull in the buck inductor and power loop as close as possible. Likewise, the power-train, full-
bridge components should be pulled together as tight as possible. See the bq500212AEVM-550, bqTESLA
Wireless Power TX EVM User's Guide (Texas Instruments Literature Number SLVU536) for layout examples.
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SLUSBD6B –JULY 2013–REVISED NOVEMBER 2013
www.ti.com
References
1. Building a Wireless Power Transmitter, Application Report, (Texas Instruments Literature Number, SLUA635)
2. Technology, Wireless Power Consortium, www.wirelesspowerconsortium.com
3. An Introduction to the Wireless Power Consortium Standard and TI’s Compliant Solutions, (Johns Bill, Texas
Instruments)
4. Integrated Wireless Power Supply Receiver, Qi (Wireless Power Consortium), BQ51013 Datasheet, (Texas
Instruments Literature Number, SLUSAY6)
REVISION HISTORY
Changes from Original (July) to Revision A
Page
•
Changed marketing status from Product Preview to Production Data. ................................................................................ 1
Changes from Revision A (August, 2013) to Revision B
Page
•
Changed WPC1 to WPC1.1 throughout the document. ....................................................................................................... 1
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PACKAGE OPTION ADDENDUM
www.ti.com
4-Nov-2013
PACKAGING INFORMATION
Orderable Device
BQ500212ARGZR
BQ500212ARGZT
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 110
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
ACTIVE
VQFN
VQFN
RGZ
48
48
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
BQ500212A
BQ500212A
ACTIVE
RGZ
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 110
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
4-Nov-2013
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Nov-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
BQ500212ARGZR
BQ500212ARGZT
VQFN
VQFN
RGZ
RGZ
48
48
2500
250
330.0
180.0
16.4
16.4
7.3
7.3
7.3
7.3
1.5
1.5
12.0
12.0
16.0
16.0
Q2
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Nov-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
BQ500212ARGZR
BQ500212ARGZT
VQFN
VQFN
RGZ
RGZ
48
48
2500
250
367.0
210.0
367.0
185.0
38.0
35.0
Pack Materials-Page 2
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