BQ6400RGZT [TI]
Single Chip 3 or 4 Cell Li-Ion Battery Management Controller With PowerPump⑩ Cell Balancing Technology; 单芯片3或4节锂离子电池管理控制器， PowerPump⑩电池平衡技术
| 型号： | BQ6400RGZT |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | Single Chip 3 or 4 Cell Li-Ion Battery Management Controller With PowerPump⑩ Cell Balancing Technology |
| 文件： | 总17页 (文件大小：282K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
bq6400
www.ti.com ......................................................................................................................................................................................... SLUS841–SEPTEMBER 2008
Single Chip 3 or 4 Cell Li-Ion Battery Management Controller With PowerPump™ Cell
Balancing Technology
1
FEATURES
DESCRIPTION
23
•
Advanced SmartSafety™
–
–
Prevention – Optimal Cell Management
The bq6400 Battery Management Controller is a
complete Li-Ion control, monitoring, and safety
solution designed for notebook computers and
portable equipment. It is designed specifically to
provide an enhanced, optimized solution for packs
using three or four series cells.
Diagnosis – Improved Sensing of Cell
Problems
–
Fail Safe – Detection of Event Precursors
•
Rate-of-Change Detection of all Important Cell
Characteristics:
The bq6400 provides accurate gas gauging while
providing control, communications and safety
functions for the system. It provides simultaneous,
synchronized voltage and temperature measurements
using one A/D per-cell technology. Voltage
measurements are also simultaneous with pack
current measurements, eliminating system induced
noise from measurements. This allows the precise,
continuous, real-time calculation of cell impedance
under all operating conditions, even during widely
fluctuating loads.
–
Voltage – Impedance – Cell Temperature
•
•
PowerPump™ Active Cell Balancing Results in
Longer Run Time and Cell Life
High Resolution 18-Bit Integrating Delta-Sigma
Coulomb Counter for Precise Charge-Flow
Measurements and Gas Gauging
•
Multiple Independent Δ-Σ A/Ds: One-per-cell
Voltage, Plus Separate Temperature, Current
and Safety
•
•
Simultaneous, Synchronous Measurement of
Pack Current and Individual Cell Voltages
PowerPump™ technology transfers charge between
cells to balance their voltage and capacity. Balancing
is programmable during all battery modes: Charge,
discharge, and rest. Highly efficient charge transfer
circuitry nearly eliminates energy loss while providing
true real-time balance between cells, resulting in
longer run-time and improved cell cycle life.
Very Low Power Consumption: < 250 µA
Active, < 150 µA Standby, < 40 µA Ship, and <
1 A Under-Voltage Shutdown
•
•
•
Accurate, Advanced Temperature Monitoring
of Cells and MOSFETs With up to 13 Sensors
Temperature is sensed by one internal and up to 12
external sensors. This permits accurate temperature
monitoring of each cell individually as well as pack
protection MOSFETs. Internal firmware is then able to
compensate for the temperature induced effects on
cell capacity, impedance, and OCV on a cell-by-cell
basis, resulting in superior charge/discharge and
balancing control.
Fully Programmable Voltage, Current, Balance
and Temperature Protection Features
Cell Balancing Transfers Charge Efficiently
From Cell to Cell During all Operating
Conditions
•
Fail-Safe Operation of Pack Protection Circuits
and MOSFETs
Support for Intel™ Adaptive Mobile Power System
(AMPS) requirements for battery and MOSFET
control is built-in. User definable inputs require no
external hardware translation logic.
•
•
•
•
Designed for 3 to 4 Series Cell Battery Packs
Smart Battery System 1.1 Compliant
Integrated Support for Intel™ AMPS
Field Upgradeable Flash Memory
The bq6400 is completely user-configurable with
parametric tables in flash memory to suit a variety of
cell chemistries, operating conditions, safety control,
and data reporting needs. It is easily configured using
the supplied Battery Wizard™ graphical user
interface. The device is fully programmed and
requires no algorithm or firmware development.
APPLICATIONS
•
•
•
Notebook Computer Battery Packs
Portable Medical Equipment
Portable Test Equipment
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
3
PowerPump, SmartSafety are trademarks of Texas Instruments.
Intel is a trademark of Intel Corporation.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008, Texas Instruments Incorporated
bq6400
SLUS841–SEPTEMBER 2008 ......................................................................................................................................................................................... www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
bq6400 BLOCK DIAGRAM
V4
PUMP4
XT4
PRE
Voltage
Balance
Temp
CHG
1st Level Safety
& FET Control
DSG
EFCID
EFCIC
V3
PUMP3
XT3
Voltage
Balance
Temp
8 bit
RISC
CPU
FUSE
2nd Level
Safety
CSBAT
CSPACK
V2
PUMP2
XT2*
Voltage
Balance
Temp
Coulomb Counter
Current A /D
CCBAT
CCPACK
V1
PUMP1
XT1*
Voltage
Balance
Temp
Internal
Oscillator
LED1-5,
LEDEN
6
LED Control
SMBus
Internal
Temperature
SMBCLK
SMBDAT
Reset
Logic
ALERT
Watchdog
Pack Interface
RSTN
Core / CPU
Measure
I/O
Safety
* XT1 & XT2 inputs can optionally multiplex up
to five (5) additional temperature sensors each.
AVAILABLE OPTIONS(1)
SPECIFIED
TEMPERATURE
PACKAGE
DESIGNATOR
ORDERING
NUMBER
TRANSPORT MEDIA
QUANTITY
PRODUCT
PACKAGE
RANGE
bq6400
QFN-48 7×7mm
RGZ
–40°C to 85°C
bq6400RGZR
Reel
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
2
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s) :bq6400
bq6400
www.ti.com ......................................................................................................................................................................................... SLUS841–SEPTEMBER 2008
QFN-48 PACKAGE
1
2
CHG
DSG
36
35
34
33
32
31
30
29
28
27
26
25
LED 5
LED 4
LED 3
LED 2
LED 1
LEDEN
FUSE
XC
PRE
3
EFCIC
EFCID
CCBAT
CCPACK
VLDO1
CSBAT
CSPACK
NC
4
5
bq6400
6
7
8
9
MISO/ALERT
MOSI
10
11
12
SCLK
RSTN
NC
49
T
A
B
*
*Tab connection located bottom
cente, r see mechanical drawing
for det.ail
TERMINAL FUNCTIONS
TERMINAL
NAME
I/O(1)
DESCRIPTION
NO.
1
CHG
O
O
O
I
Charge MOSFET control (Active high, enables current flow.)
Discharge MOSFET Control (Active high. Low opens MOSFET.)
Pre-Charge MOSFET control (Active high.)
External Charge FET Control, Intel™ AMPS compatible input
External Discharge FET Control, Intel™AMPS compatible input
Coulomb counter input (sense resistor), connect to battery negative
Coulomb counter input (sense resistor), connect to pack negative
Internal LDO-1 output, bypass with capacitor
Current sense input (safety), connect to battery negative
Current sense input (safety), connect to pack negative
Do not connect to this pin
2
DSG
3
PRE
4
EFCIC
EFCID
CCBAT
CCPACK
VLDO1
CSBAT
CSPACK
N/C
5
I
6
IA
IA
P
IA
IA
–
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
N/C
–
Do not connect to this pin
SDO0
SDI1
O
I
Requires 100kΩ pull-up resistor to VLDO1
Connect to SDO0 via a capacitor
P1N
O
O
O
O
I
Charge balance gate drive, cell 1 North
P2S
Charge balance gate drive, cell 2 South
P2N
Charge balance gate drive, cell 2 North
SDO2
SDI3
Connect to SDI3 via capacitor
Connect to SDO2 via capacitor
P3S
O
O
O
O
–
Charge balance gate drive, cell 3 South
P3N
Charge balance gate drive, cell 3 North
P4S
Charge balance gate drive, cell 4 South
P4N
Charge balance gate drive, cell 4 North
N/C
Do not connect to this pin
RSTN
I
Device reset, active low
(1) I – input, IA – analog input, O – output, OA – analog output, OD – open drain output, p – power
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
3
Product Folder Link(s) :bq6400
bq6400
SLUS841–SEPTEMBER 2008 ......................................................................................................................................................................................... www.ti.com
TERMINAL FUNCTIONS (continued)
TERMINAL
I/O(1)
DESCRIPTION
NO.
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
NAME
SCLK
–
Do not connect to this pin
Do not connect to this pin
MOSI
MISO/ALERT
XC
I
O
Optional ALERT output – asserted low on alarm condition (interrupt)
Aux control
O
FUSE
LEDEN
LED1
LED2
LED3
LED4
LED5
SMBCLK
SMBDAT
V4
O
Safety fuse control output, active high
LED common anode drive (hi), Aux Temp(n) input enable (low)
SOCi LED drive (active low), Aux Temp input
SOCi LED drive (active low), Aux Temp input
SOCi LED drive (active low), Aux Temp input
SOCi LED drive (active low), Aux Temp input
SOCi LED drive (active low), Aux Temp input
SMBus clock signal
O
IO
IO
IO
IO
IO
IO
IO
IA
IA
IA
IA
P
SMBus data signal
Cell 4 positive input
XT4
External temperature sensor 4 input
External temperature sensor 3 input
Cell 3 positive input
XT3
V3
VLDO2
V2
Internal LDO-2 output, bypass with capacitor
Cell 2 positive input
IA
IA
IA
IA
IA
P
XT2
External temperature sensor 2 input / mux temp input 2
External temperature sensor 1 input / mux temp input 1
Cell 1 positive input
XT1
V1
VSS
Cell 1 negative input
TAB TAB
Connect to VSS
4
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s) :bq6400
bq6400
www.ti.com ......................................................................................................................................................................................... SLUS841–SEPTEMBER 2008
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted)
RANGE
–40 to 85
–65 to 150
–0.5 to 5.0
–0.5 to 5.0
–0.5 to 5.0
–0.5 to 5.0
0.5 to 5.0
UNITS
TA
Operating free-air temperature (ambient)
Storage temperature
Max cell voltage
°C
°C
V
TSTORAGE
V4-V3
V3-V2
Max cell voltage
V
V2-V1
Max cell voltage
V
V1-VSS
Voltage on LED1-5
Max cell voltage
V
With respect to VSS
V
Voltage on CCBAT, CCPACK, CSBAT, CSPACK,
XT1, XT2,SDIX, SDOX, LEDEN, FUSE
(VSS – 0.5) to
(VLDO1 + 0.5)
Max voltage on any I/O pin
Maximum voltage range
V
V
(V2 – 0.5) to
(VLDO2 + 0.5)
Voltage on XT3, XT4
EFCIC, EFCID
With respect to VSS
With respect to VSS
With respect to VSS
–0.5 to 5.5
V
V
Voltage on SMBCLK, SMBDAT, ALERT
Voltage on PRE, CHG, DSG
–0.5 to 6.0V
–0.5 to (VLDO1 + 0.5)
V
Current through PRE, CHG, DSG, LEDEN, LED1-5 Maximum current source/sink
20
20
mA
mA
VLDO1 maximum current
Maximum current draw from VLDO
JEDEC, JESD22-A114 Human Body Model,
R=1500 Ω, C=100 pF
ESD tolerance
2
kV
°C
Lead Temperature Soldering
Total time < 3 seconds
< 300
(1) Stresses or conditions in excess of those listed may cause permanent damage to the device. Exposure to these conditions for prolonged
periods may adversely affect device reliability. These ratings are provided for reference only, and not meant to imply functional operation
at these maxima or other circumstances beyond those indicated under recommended operating conditions.
Copyright © 2008, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Link(s) :bq6400
bq6400
SLUS841–SEPTEMBER 2008 ......................................................................................................................................................................................... www.ti.com
ELECTRICAL CHARACTERISTICS
TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
DC CHARACTERISTICS
TEST CONDITIONS
MIN
TYP
MAX
UNIT
(1)
VCELL
IDD
ISTBY
ISHIP
Operating range
Cells balanced
2.3
4.5
V
Operating mode current
Standby mode current
Ship mode current
Measure / report state
250
150
40
µA
µA
µA
µA
SMBCLK = SMBDAT = L
(2)
IECUV
Extreme cell under voltage
shutdown current
All cells < 2.7 V and any cell
< ECUV setpoint
1.0
0.5
VOL
IOL < 4.0 mA
0
(3)
VOH
VIL
IOH < –4.0 mA
VLDO1–0.10
General I/O pins
V
VLDO1× 0.25
VIH
VLDO1× 0.75
2.500
VOLTAGE MEASUREMENT CHARACTERISTICS
Measurement range
Resolution
4.500
V
<1
±3
mV
mV
Accuracy
CURRENT SENSE CHARACTERISTICS
Measurement range(4)
Input Offset
–0.100
0.100
V
±50
10
µV
µV
Resolution
±10 µV ±0.1%
Accuracy(5)
µV
of reading
COULOMB COUNTER CHARACTERISTICS(6) (7)
Resolution
Default range
2.8(8)
0.008%
±30(9)
nVh
Integral non-linearity
Snap-to-Zero (deadband)
µV
(1) Device remains operational to 1.85 V with reduced accuracy and performance.
(2) All cells at 2.3V at 25°C.
(3) Does not apply to SMBus pins
(4) Default range. Corresponds to ±10A using a 10mΩ sense resistor. Other gains and ranges available (8 options).
(5) After calibration. Accuracy is dependent on system calibration and temperature coefficient of sense resistor.
(6) Shares common inputs with Current Sense section.
(7) After calibration. Accuracy is dependent on system calibration and temperature coefficient of sense resistor.
(8) Corresponds to 0.0003mAh using 10mΩ sense resistor.
(9) Corresponds to 3mA using 10mΩ sense resistor.
6
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s) :bq6400
bq6400
www.ti.com ......................................................................................................................................................................................... SLUS841–SEPTEMBER 2008
ELECTRICAL CHARACTERISTICS (Continued)
TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
CURRENT SENSE (SAFETY) CHARACTERISTICS(1)
Measurement Range – Gain 1
TEST CONDITIONS
MIN
TYP
MAX UNIT
–0.650
0.650
0.325
V
Resolution (short circuit detection)
20
mV
mV
V
Resolution (over-current detection, charge and discharge)
Measurement Range – Gain 2
2.5
–0.325
–30
Resolution (Short circuit detection)
10
mV
mV
Resolution (over-current detection, charge and discharge)
INTERNAL TEMPERATURE SENSOR CHARACTERISTICS
Measurement Range
1.25
85
90
°C
°C
°C
Resolution
0.1
1
Accuracy (after calibration)
TA = –30°C to 85°C
EXTERNAL TEMPERATURE SENSOR(s) TYPICAL CHARACTERISTICS(2)
Measurement Range(3)
–40
°C
°C
Resolution
0.2
±1
±2
TA = 25°C
Accuracy(4)
°C
TA = 0°C to 85°C
SMBus CHARACTERISTICS(5)
VIL
VIH
VOL
CI
Input low voltage
0
2.1
0
0.8
5.5
0.4
10
V
V
Input high voltage
(6)
Output low voltage
350 µA sink current
V
Capacitance each I/O pin
SCLK nominal clock frequency
pF
kHz
FSCL
TA = 25°C
100
VBUS 5V nominal
VBUS 3V nominal
13.3
2.4
15.3
6.8
(7)
RPU
Pull-up resistors for SCLK, SDATA
kΩ
(1) Post calibration: Dependent on calibration and temperature coefficient of sense resistor. Uncertainty 1.5 LSB.
(2) Typical for dual diode (MMBD4148 or equivalent) external sensor using recommended circuit.
(3) Range of diode sensors may exceed operational limits of IC and battery cells.
(4) Typical behavior after calibration, final result dependent on specific component characteristics.
(5) SMBus timing and signals meet the SMBus 2.0 specification requirements under normal operating conditions. All signals are measured
with respect to PACK-Negative.
(6) Parameter not tested in production.
(7) Pull-ups are typically implemented external to battery pack, and are selected to meet SMBus requirements.
Copyright © 2008, Texas Instruments Incorporated
Submit Documentation Feedback
7
Product Folder Link(s) :bq6400
bq6400
SLUS841–SEPTEMBER 2008 ......................................................................................................................................................................................... www.ti.com
RPRE
CHEMICAL FUSE
+
PACK+
FUSE
SDO2
SDI3
CELL 1
External
Independent
Safety
LED1
LED2
LED3
LED4
V4
V3
CELL 4
CELL 3
CELL 2
CELL 1
VLDO 2
V2
Battery
Management
Controller
LED5
LEDEN
SOCi
V1
CNT1
EFCIC
EFCID
XT
1-4
CNT2
Temperature
Sensor
(typical)
SDI 1
CRFI
MOSI
SDO 0
MISO/ALERT
One of 12 external
sensors shown
VLDO1
SMBCLK
SMBDAT
SMBCLK
SMBDAT
RSTN
-
PACK-
RSENSE
Typical four cell configuration shown .
Some components omitted for clarity .
Figure 1. bq6400 Simplified Example Circuit Diagram
FEATURE SET
Primary (1st Level) Safety Features
The bq6400 implements a breadth of system protection features which are easily configured by the customer.
First Level protections work by controlling the MOSFET switches. These include:
•
•
Battery cell over/under voltage protection
Battery pack over/under voltage protection
8
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s) :bq6400
bq6400
www.ti.com ......................................................................................................................................................................................... SLUS841–SEPTEMBER 2008
•
•
•
•
•
•
•
•
•
Charge and discharge over-current protection
Short circuit protection
Intel™ AMPS compatible external MOSFET control inputs
One internal temperature sensor
External MOSFET Control Inputs (EFCIx) with programmable polarity
Up to twelve (12) external temperature inputs for accurate cell and MOSFET monitoring
Watchdog timer protection
Unconnected FUSE drive output
Brownout detection and protection against extreme pack under voltage
Secondary (2nd Level) Safety Features
The bq6400 can detect more serious system faults and activate the FUSE pin, which can be used to open an
in-line chemical fuse to permanently disable the pack. Secondary optional features include:
•
•
Fully independent of First Level protections
SmartSafety™ algorithms for early detection of potential faults
–
–
–
–
Temperature abnormalities (variances, rate of change, etc.)
Disconnected cell voltage inputs
Cell imbalance exceeds safety limit
Impedance rise due to cell or weld strap fault
•
•
•
•
•
MOSFET failure or loss of MOSFET control
Safety over-voltage, pack and cell
Safety over-temperature, limits for both charge and discharge
Safety over-current, charge and discharge
Failed current measurement, voltage measurement, or temperature measurement
Charge Control Features
•
•
Meets SMBus 2.0 and Smart Battery System (SBS) Specification 1.1 requirements
Active cell balancing using patented PowerPump™ technology which eliminates unrecoverable capacity loss
due to normal cell imbalance
•
•
•
•
•
•
•
•
Balancing-current tracked to detect cell problems
Simultaneous, synchronous measurement of all cell voltages in a pack
Simultaneous, synchronous measurement of pack current with cell voltages
Reports target charging current and/or voltage to an SBS Smart Charger
Reports the chemical State-of-Charge for each cell and pack
Supports precharging and zero-volt charging with separate FET control
Programmable, chemistry-specific parameters
Fault reporting
Fuel Gauging
•
•
•
The bq6400 accurately reports battery cell and pack state-of-charge (SOC), with greater than 1% precision.
No full charge/discharge cycle is required for accurate reporting.
State-Of-Charge is reported via SMBus and available via LED display. Data available in Amp-hours and
Watt-hours.
18-bit Integrating Delta-Sigma A/D Coulomb Counter, with programmable snap-to-zero value.
LED Display
The bq6400 drives a three to five segment LED display in response to a push-button (LEDEN) input signal.
Each LED pin can sink up to 10 mA.
•
Lifetime Data Logging (readable via SMBus)
Recording of faults, events, anomalies, min and max values
•
Copyright © 2008, Texas Instruments Incorporated
Submit Documentation Feedback
9
Product Folder Link(s) :bq6400
bq6400
SLUS841–SEPTEMBER 2008 ......................................................................................................................................................................................... www.ti.com
•
•
•
•
Maximum/minimum cell temperature
Maximum/minimum pack voltage
Maximum/minimum cell voltages
Maximum discharge power
Forensic Data Logging (Readable via SMBus)
•
•
•
•
•
•
•
•
•
•
•
Last known full capacity of the battery
Capacity (or SOC) at the time of failure
Cycle count and/or cumulative number of Ah delivered by the battery
Battery pack status; being charged, discharged or at rest
Balancing effort required by each bank of cells to maintain balance
Cell bank impedance information
Last ten (10) previous failures causing primary (first level) safety action
Degree days histogram (time that the battery has spent in a temperature range)
Voltage Hours – Time for each cell measurement spent above/below safety limits
Forensic data up-loadable to Host CPU via SMBus (see below)
Forensic data recording of anomalies and events
Power Modes
•
Normal Mode: The bq6400 performs measurements and calculations, makes decisions, and updates internal
data at approximately once per second. All safety circuitry is fully functional in this mode.
•
Standby Mode: The bq6400 performs as in normal mode, but at a reduced measurement rate to lower power
consumption at times when the host computer is inactive or the pack is removed from the system. All safety
circuitry remains fully functional in this mode.
•
•
Ship Mode: The bq6400 disables (opens) all the protection MOSFETs, and continues to monitor temperature
and voltage, but at a reduced measurement rate to dramatically lower power consumption. Environmental
data is saved in flash as a part of the historical record. Safety circuitry is disabled in this mode. The device
does not enter this power state as a part of normal operation – it is intended for use after factory
programming and test. Entry occurs only after a unique SMBus command is issued and then only when the
SMBus lines are set to logic low. Exit occurs when the SMBus lines return to an active state.
Extreme Cell Under-Voltage (ECUV) Shutdown Mode: In this mode, the bq6400 draws minimal current and
the Charge and Discharge protection MOSFETs are disabled (opened). The Pre-Charge MOSFET remains
enabled when a charge voltage is present. Safety circuitry is disabled in this mode. The device does not enter
this mode as a part of normal operation: It enters this state during extreme cell under-voltage conditions
(ECUV). The ECUV threshold is fully programmable below 2.7V.
CURRENT DRAW
STATE
OVER-CURRENT
Fully active
ENTRY CONDITION
EXIT CONDITION
(TYP)
Active
< 250 µA
Normal operation as determined
by firmware
Firmware directed to operating
modes below
Standby
Ship
< 150 µA
< 40 µA
< 1 µA
Fully active
Not active
No load current flowing for
predetermined time
Load activity
Protected SMBus command and
SMBus then off (low)
Either SMBus line high
Extreme Cell
Under-Voltage
Not active (Pre-Charge Enabled when Vcell < ECUV
enabled)
Vcell charge above ECUV
recovery threshold (2.7V/cell
typical)
OPERATION
The bq6400 Battery Management Controller serves as the master controller for a Li-Ion battery system consisting
of three or four cells in series. Any number may be connected in parallel; other system or safety issues will limit
this to a more practical number. The bq6400 provides extraordinarily precise State-of-Charge gas gauging, and
first and second level pack safety functions. Voltage and current measurements are performed synchronously
and simultaneously for all cells in the pack allowing a level of precision not previously possible in battery
10
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s) :bq6400
bq6400
www.ti.com ......................................................................................................................................................................................... SLUS841–SEPTEMBER 2008
management. Temperature is measured by one internal sensor and up to 12 additional multiplexed external
temperature sensors, for a total of up to 13 independent measurement points in the pack. Coulomb counting is
captured continuously by a dedicated 18-bit integrating Delta-Sigma A/D converter. The bq6400 is also
responsible for pack data calculations, black-box forensic data storage and communicating parameters via
SMBus to a host processor as the core of a Smart Battery System (SBS).
Safety
Unique in the battery management controller market, the bq6400 simultaneously measures voltage and current
using independent and highly accurate Delta-Sigma A/D converters. This technique removes virtually all systemic
noise from measurements, which are made during all modes of battery operation – charge, discharge, and rest.
Battery impedance and self-discharge characteristics are thus measured with an unprecedented level of
accuracy in real-time. The device applies this precise information to SmartSafety™ algorithms to detect certain
anomalies and conditions which may be indicative of internal cell faults, before they become serious problems.
The bq6400 uses its enhanced measurement system to detect pack faults including cell under and over-voltage,
cell under and over-temperature, pack over-voltage, and pack over-current, over-charge, and short circuit
conditions. First level safety algorithms will first attempt to open the MOSFET safety switches. If this fails, 2nd
level safety algorithms will open the in-line chemical fuse and provide permanent, hard protection for the pack
and user. External MOSFET control inputs with programmable polarity can also be used to operate the protection
MOSFETs under control of user supplied circuitry. The bq6400 continuously monitors these inputs. If the
MOSFETs fail to open when commanded, the 2nd level safety algorithms will also activate the fuse. All 1st and 2nd
level safety algorithms have programmable time delays to prevent false triggering on noise events.
Cell Balancing
Patented PowerPump™ cell balancing drastically increases the useful life of battery packs by eliminating the
cycle life fade of multi-cell packs due to cell imbalance. PowerPump™ efficiently transfers charge from cell to
cell, rather than simply bleeding off charging energy as heat the way competitor’s circuits using resistive-bleed
balancing do. Balancing is configurable and may be performed during any combination of battery operational
modes – charge, discharge, and rest. Compared to resistive bleed balancing, virtually no energy is lost as heat.
The actual balance current is externally scalable and can range from 10mA to 1A depending on component
selection and application or cell requirements.
A variety of techniques, such as voltage or State-Of-Charge balancing, are easily implemented by the bq6400.
By tracking the balancing required by individual cells, overall battery safety is enhanced – often allowing early
detection of soft shorts or other cell failures. Balancing is achieved between all cells within the pack as
dynamically determined by the bq6400.
Outputs
Charge Control
The open drain outputs CHG and PRE are used to drive MOSFET transistors controlling cell stack charging.
Charge or Pre-charge mode is selected based on the current cell voltage compared to the user-definable cell
pre-charge under-voltage thresholds. When below the limit, or when below the charge temperature minimum, the
PRE signal is active and CHG signal is inactive. This turns on the Pre-Charge MOSFET and is used to charge a
depleted pack through a current-limiting series resistor. When all cell voltages are above the limit and the
temperature is above the charge temperature minimum, then the CHG output also becomes active and enables
the Charge MOSFET to turn on and provide a high current path between the charger and battery cells.
The CHG and PRE MOSFET control outputs are both disabled (low) when a cell reaches any safety cutoff limit
or temperature threshold. During active charging modes (and above cell voltage thresholds), the Discharge
MOSFET is also enabled to avoid excessive heating of the body diode. Similarly, the CHG MOSFET is active
during discharge provided current flow is in the correct direction and no safety violations are present.
The CHG and PRE outputs are intended to drive buffer transistors acting as inverting level shifters.
Discharge Control
The DSG output operates similarly to control cell stack discharging. It is enabled (high) by default. If either a cell
voltage falls below the lower threshold, or excessive current or other safety related fault is sensed, the DSG
output is disabled (low) to prevent damage to the cell or pack.
Copyright © 2008, Texas Instruments Incorporated
Submit Documentation Feedback
11
Product Folder Link(s) :bq6400
bq6400
SLUS841–SEPTEMBER 2008 ......................................................................................................................................................................................... www.ti.com
All facets of safely charging and discharging the cell stack are controlled by user-definable parameters which
provide precise control over MOSFET states. Both pack and cell over and under-voltage limits are provided as
well as programmable hysteresis to prevent oscillation. Temperature and current thresholds are also provided,
each with independent timers to prevent nuisance activations.
LEDEN
This pin is multi-purpose: It can provide output current to the LED display array; it can be used as an output to
enable multiplexing of eleven external temperature sensors; or it can be a State-of-Charge indicator (SOCi)
push-button input. (This pin can also be configured as a general purpose I/O pin.)
LED SOCi Outputs
LED1-5 are current sinking outputs designed to drive low-current LEDs. The LEDs can be activated by the
LEDEN pin via a pushbutton switch. They can be configured (using SBS parameters) to operate in bar or dot
mode and to use 3-5 LEDs to represent State-Of-Charge information.
Inputs
Current Measurement
Current is monitored by four (4) separate A/D converters. All utilize the same very low value sense resistor,
typically either 5 or 10 milliohms in series with the pack negative connection. CCBAT and CCPACK connections
to the sense resistor utilize an R/C filter for noise reduction. (CSBAT and CSPACK are direct connections used
for secondary safety.)
A 14-bit Delta-Sigma A/D converter is used to accurately measure current flow in both directions. The
measurements are taken simultaneously and synchronously with the cell voltage measurements. This value is
used for internal calculations, and SMBus reporting.
Coulomb Counting
A dedicated Coulomb counter is used to measure charge flow with 18 bit precision in both directions by a
calibrated, integrating Delta-Sigma A/D converter. This allows the bq6400 to keep very accurate State-Of-Charge
(SOC) information and battery statistics. A small deadband is applied to further reduce noise effects. The
Coulomb counter is unique in that it continues to accumulate (integrate) current flow in either direction even as
the rest of the internal microcontroller is placed in a very low power state, further lowering power consumption
without compromising system accuracy.
Safety Current
Two additional A/D converters are used to directly monitor for over current or short-circuit current conditions,
independently of the internal microcontroller. This provides a direct and rapid response to insure pack integrity
and safe operation.
Voltage Measurement
Voltage measurement is performed by four independent Delta-Sigma A/D converters which operate
simultaneously and are triggered synchronously so that all four voltages are read at precisely the same moment.
Voltage is converted with better than 1mV of resolution providing superior accuracy. One A/D per-cell technology
means that voltage is also measured simultaneously with current, permitting accurate, real-time cell impedance
calculation during all operating conditions. This technique also provides greatly enhanced noise immunity and
filtering of the input voltages without signal loss.
Temperature Measurement
Temperature measurement is performed by up to twelve (12) external low cost sensor diodes, and one internal
silicon sensor. Each external sensor consists of a low cost silicon diode and capacitor combination. These may
be used to monitor individual cell conditions, sense resistor or MOSFET temperatures, or other sources
determined by the user. The bq6400 can report all of these temperatures individually, and as an average.
XT1-2 can be used as dedicated inputs, or they can be used as multiplexed inputs providing ten (10) external
temperature sensors to the pack designer. In this configuration, the cathodes of five (5) of the sensors are
connected to the cathodes of the LED1-5 connections. The anodes are connected together and then to XT1. The
bq6400 internally multiplexes the LEDEN, LED and XT1 pins to read the temperature sensors using this scheme.
Similarly, another five (5) sensors can be connected together and read via the XT2 input.
XT3-4 are dedicated inputs directly connected to the external temperature sensors, providing the eleventh and
twelfth external inputs.
12
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s) :bq6400
bq6400
www.ti.com ......................................................................................................................................................................................... SLUS841–SEPTEMBER 2008
EFCIx
The External FET Control Inputs are for user control of MOSFETs based on external circuitry and conditions. The
polarity of the input signal is user programmable. Two modes of operation are possible: The first mode is used to
implement additional hardware safety inputs, and is used to force the MOSFETs to an OFF state. The inputs
control the MOSFETs directly through hardware, no firmware is used. The second mode of operation is used to
implement the Intel™ AMPS interface signals CNT1 and CNT2 without additional circuitry.
COMMUNICATIONS
SMBus
The bq6400 uses the industry standard Smart Battery System’s two-wire System Management Bus (SMBus)
communications protocol for all external communication. SMBus version 2.0 is supported by the bq6400, and
includes clock stretching, bus fault timeout detection, and optional Packet Error Checking (PEC). For additional
information, see the www.smbus.org or www.sbs-forum.org websites.
Smart Battery Data (SBData)
The data content and formatting of the bq6400 information conforms to the Smart Battery System’s (SBS) Smart
Battery Data specification, version 1.1. The reader is directed to the SBS/SMBus site at www.sbs-forum.com for
further information regarding these specifications.
This SBS Data (SBData) specification defines read/write commands for accessing data commonly required in
laptop computer applications. The commands are generic enough to be useful in most applications.
The bq6400 provides a wealth of control and battery information beyond the SBData standard. For the additional
data, new command codes have been defined. In addition, new battery data features, such as State-of-Health,
use newly defined extended SBData command codes are used.
SBS Standard Data Parameter List (abridged)
1. Parameters 0x00 – 0x3F are compatible with the SBDATA specification.
2. Parameters 0x40 – 0x7F are reserved for compatibility with other manufacturer’s assignments
3. Parameters 0x80 – 0xFF are specific for internal use.
4. By default, the bq6400 initially responds to the SBData slave address <0001 011R/W> (0x16, 0x17).
COMMAND
DATA TYPE
R/W Word (unsigned)
DESCRIPTION
00
01
02
03
04
05
06
07
08
09
0A
0B
0C
0D
0E
0F
10
11
12
13
Manufacturer Access
R/W Word (unsigned)
R/W Word (unsigned)
R/W Word (unsigned)
R/W Word (unsigned)
Read Word (unsigned)
Read Word (unsigned)
Read Word (Boolean)
Read Word (unsigned)
Read Word (unsigned)
Read Word (unsigned)
Read Word (unsigned)
Read Word (unsigned)
Read Word (unsigned)
Read Word (unsigned)
Read Word (unsigned)
Read Word (unsigned)
Read Word (unsigned)
Read Word (unsigned)
Read Word (unsigned)
Remaining Capacity Alarm Level
Remaining Time Alarm Level
Battery Mode
At Rate value used in AtRate calculations
At Rate Time to Full
At Rate Time to Empty
At Rate OK
Pack Temperature (maximum of all individual cells)
Pack Voltage (sum of individual cell readings)
Pack Current
Average Pack Current
Max Error
Relative State of Charge
Absolute State of Charge
Remaining Pack Capacity
Full Charge Capacity
Run Time to Empty
Average Time to Empty
Average Time to Full
Copyright © 2008, Texas Instruments Incorporated
Submit Documentation Feedback
13
Product Folder Link(s) :bq6400
bq6400
SLUS841–SEPTEMBER 2008 ......................................................................................................................................................................................... www.ti.com
COMMAND
14
DATA TYPE
Read Word (unsigned)
DESCRIPTION
Charging Current
Charging Voltage
Battery Status
15
Read Word (unsigned)
Read Word (unsigned)
Read Word (unsigned)
Read Word (unsigned)
Read Word (unsigned)
Read Word (unsigned)
Read Word (unsigned)
Read Word (unsigned)
Reserved
16
17
Cycle Count
18
Design Capacity
Design Voltage
Specification Information
Manufacture Date
Serial Number
19
1A
1B
1C
1D-1F
20
Read Block (String)
Read Block (String)
Read Block (String)
Read Block (String)
Reserved
Pack Manufacturer Name (31 characters maximum)
Pack Device Name (31 characters maximum)
Pack Chemistry
21
22
23
Manufacturer Data
24-2E
2F
R/W Block
Optional Manufacturer Function 5
30-3B
3C
Reserved
R/W Word (unsigned)
R/W Word (unsigned)
R/W Word (unsigned)
R/W Word (unsigned)
<unused>
Optional Manufacturer Function 4 (Vcell 4)
Optional Manufacturer Function 3 (Vcell 3)
Optional Manufacturer Function 2 (Vcell 2)
Optional Manufacturer Function 1 (Vcell 1)
3D
3E
3F
40-45
46-47
48-4F
50-55
56-57
58-5A
5B-5F
60-62
63-6F
70
Reserved
<unused>
Reserved
<unused>
Reserved
<unused>
Reserved
<unused>
Reserved
71-FF
<unused>
14
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s) :bq6400
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
QFN
QFN
Drawing
BQ6400RGZR
BQ6400RGZT
ACTIVE
ACTIVE
RGZ
48
48
2500
250
TBD
TBD
Call TI
Call TI
Call TI
Call TI
RGZ
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Amplifiers
Data Converters
DSP
Clocks and Timers
Interface
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
Logic
Military
Power Mgmt
Microcontrollers
RFID
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
RF/IF and ZigBee® Solutions www.ti.com/lprf
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2008, Texas Instruments Incorporated
相关型号：
BQ71550DCKR
5V FIXED POSITIVE LDO REGULATOR, 0.75V DROPOUT, PDSO5, PLASTIC, SOT-323, SC-70, 5 PIN
TI
BQ75614PAPRQ1
Automotive 16-S precision battery monitor, balancer and integrated protector with ASIL-D compliance | PAP | 64 | -40 to 125
TI
©2020 ICPDF网 联系我们和版权申明