CD74HCT390M96G4 [TI]
High-Speed CMOS Logic Dual Decade Ripple Counter; 高速CMOS逻辑双路十年纹波计数器型号: | CD74HCT390M96G4 |
厂家: | TEXAS INSTRUMENTS |
描述: | High-Speed CMOS Logic Dual Decade Ripple Counter |
文件: | 总15页 (文件大小:424K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
CD74HC390,
CD54HCT390, CD74HCT390
Data sheet acquired from Harris Semiconductor
SCHS185C
High-Speed CMOS Logic
September 1997 - Revised October 2003
Dual Decade Ripple Counter
Features
Description
• Two BCD Decade or Bi-Quinary Counters
The CD74HC390 and ’HCT390 dual 4-bit decade ripple
counters are high-speed silicon-gate CMOS devices and are
pin compatible with low-power Schottky TTL (LSTTL). These
devices are divided into four separately clocked sections.
The counters have two divide-by-2 sections and two divide-
by-5 sections. These sections are normally used in a BCD
decade or bi-quinary configuration, since they share a com-
mon master reset (nMR). If the two master reset inputs (1MR
and 2MR) are used to simultaneously clear all 8 bits of the
counter, a number of counting configurations are possible
within one package. The separate clock inputs (nCP0 and
nCP1) of each section allow ripple counter or frequency divi-
sion applications of divide-by-2, 4. 5, 10, 20, 25, 50 or 100.
Each section is triggered by the High-to-Low transition of the
input pulses (nCP0 and nCP1).
• One Package Can Be Configured to Divide-by-2, 4,
5,10, 20, 25, 50 or 100
[ /Title
(CD74
HC390
,
CD74
HCT39
0)
/Sub-
ject
(High
Speed
CMOS
• Two Master Reset Inputs to Clear Each Decade
Counter Individually
• Fanout (Over Temperature Range)
- Standard Outputs. . . . . . . . . . . . . . . 10 LSTTL Loads
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads
o
o
• Wide Operating Temperature Range . . . -55 C to 125 C
• Balanced Propagation Delay and Transition Times
• Significant Power Reduction Compared to LSTTL
Logic ICs
For BCD decade operation, the nQ0 output is connected to
the nCP1 input of the divide-by-5 section. For bi-quinary
decade operation, the nO3 output is connected to the nCP0
• HC Types
- 2V to 6V Operation
input and nQ becomes the decade output.
0
- High Noise Immunity: N = 30%, N = 30% of V
IL IH CC
at V
= 5V
The master reset inputs (1MR and 2MR) are active-High
asynchronous inputs to each decade counter which oper-
ates on the portion of the counter identified by the “1” and “2”
prefixes in the pin configuration. A High level on the nMR
input overrides the clock and sets the four outputs Low.
CC
• HCT Types
- 4.5V to 5.5V Operation
- Direct LSTTL Input Logic Compatibility,
V = 0.8V (Max), V = 2V (Min)
IL IH
- CMOS Input Compatibility, I ≤ 1µA at V , V
Ordering Information
l
OL OH
TEMP. RANGE
o
PART NUMBER
CD54HCT390F3A
CD74HC390E
( C)
PACKAGE
16 Ld CERDIP
16 Ld PDIP
16 Ld SOIC
16 Ld SOIC
16 Ld SOIC
16 Ld PDIP
16 Ld SOIC
16 Ld SOIC
16 Ld SOIC
Pinout
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
CD54HCT390
(CERDIP)
CD74HC390, CD74HCT390
(PDIP, SOIC)
CD74HC390M
TOP VIEW
CD74HC390MT
CD74HC390M96
CD74HCT390E
CD74HCT390M
CD74HCT390MT
CD74HCT390M96
1CP0
1MR
1
2
3
4
5
6
7
8
16 V
CC
15 2CP0
14 2MR
13 2Q0
1Q
0
1CP1
1Q
1Q
1Q
12 2CP1
1
2
3
11 2Q
10 2Q
1
2
3
9
2Q
GND
NOTE: When ordering, use the entire part number. The suffix 96
denotes tape and reel. The suffix T denotes a small-quantity reel
of 250.
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
Copyright © 2003, Texas Instruments Incorporated
1
CD74HC390, CD54HCT390, CD74HCT390
Functional Diagram
1 (15)
2 (14)
3 (13)
nCP0
nMR
nQ
0
÷
2
COUNTER
5 (11)
nQ
nQ
nQ
1
2
6 (10)
7 (9)
÷
5
4 (12)
COUNTER
nCP1
3
GND = 8
V
= 16
CC
TRUTH TABLE
INPUTS
CP
↑
MR
ACTION
No Change
Count
L
L
↓
X
H
All Qs Low
H = High Voltage Level, L = Low Voltage Level, X = Don’t Care,
↑ = Transition from Low to High Level, ↓ = Transition from High to Low.
B-QUINARY COUNT SEQUENCE FOR 1/2 THE 390
OUTPUTS
BCD COUNT SEQUENCE FOR 1/2 THE 390
OUTPUTS
COUNT
Q0
L
Q1
L
Q2
L
Q3
L
COUNT
Q0
L
Q1
L
Q2
L
Q3
L
0
1
2
3
4
5
6
7
8
9
0
1
2
3
4
5
6
7
8
9
L
H
L
L
L
H
L
L
L
L
L
H
H
L
L
H
H
L
L
L
L
H
L
L
H
L
L
L
L
H
L
H
H
H
H
L
L
H
H
H
H
H
L
L
H
L
L
L
H
L
H
H
H
L
L
H
H
L
L
L
H
L
L
H
L
L
H
H
H
H
L
L
Output nQ3 connected to nCP0 with counter input on nCP1.
Output nQ0 connected to nCP1 with counter input on nCP0.
2
CD74HC390, CD54HCT390, CD74HCT390
Logic Diagram
4(12)
nCP1
Q
Q
Q
Q
1(15)
nCP0
Φ
Φ
Φ
Φ
R
R
R
R
2(14)
nMR
V
= 16
CC
GND = 8
3(13)
0
5(11)
1
6(10)
2
7(9)
3
nQ
nQ
nQ
nQ
3
CD74HC390, CD54HCT390, CD74HCT390
Absolute Maximum Ratings
Thermal Information
o
DC Supply Voltage, V
. . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V
Thermal Resistance (Typical, Note 1)
θ
( C/W)
CC
DC Input Diode Current, I
JA
IK
E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . .
M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . .
67
73
For V < -0.5V or V > V
+ 0.5V. . . . . . . . . . . . . . . . . . . . . .±20mA
OK
For V < -0.5V or V > V
I
I
CC
o
DC Output Diode Current, I
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150 C
Maximum Storage Temperature Range . . . . . . . . . .-65 C to 150 C
Maximum Lead Temperature (Soldering 10s). . . . . . . . . . . . . 300 C
o
o
+ 0.5V . . . . . . . . . . . . . . . . . . . .±20mA
O
O
CC
o
DC Output Source or Sink Current per Output Pin, I
O
For V > -0.5V or V < V
+ 0.5V . . . . . . . . . . . . . . . . . . . .±25mA
O
O
CC
(SOIC - Lead Tips Only)
DC V
or Ground Current, I
I
. . . . . . . . . . . . . . . . . .±50mA
CC
CC or GND
Operating Conditions
o
o
Temperature Range (T ) . . . . . . . . . . . . . . . . . . . . . -55 C to 125 C
A
Supply Voltage Range, V
CC
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V
HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V
DC Input or Output Voltage, V , V . . . . . . . . . . . . . . . . . 0V to V
I
O
CC
Input Rise and Fall Time
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. The package thermal impedance is calculated in accordance with JESD 51-7.
DC Electrical Specifications
TEST
CONDITIONS
o
o
o
o
o
25 C
-40 C TO 85 C -55 C TO 125 C
V
CC
PARAMETER
HC TYPES
SYMBOL
V (V)
I
I
(mA)
(V)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
O
High Level Input
Voltage
V
-
-
-
2
4.5
6
1.5
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
1.5
-
1.5
-
-
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
µA
IH
3.15
-
-
3.15
-
-
3.15
4.2
4.2
4.2
-
Low Level Input
Voltage
V
-
2
-
0.5
1.35
1.8
-
-
0.5
1.35
1.8
-
-
0.5
1.35
1.8
-
IL
4.5
6
-
-
-
-
-
-
High Level Output
Voltage
CMOS Loads
V
V
or V
IH IL
-0.02
2
1.9
1.9
1.9
OH
-0.02
-0.02
-
4.5
6
4.4
-
4.4
-
4.4
-
5.9
-
5.9
-
5.9
-
High Level Output
Voltage
TTL Loads
-
-
-
-
-
-
-
-4
4.5
6
3.98
-
3.84
-
3.7
-
-5.2
0.02
0.02
0.02
-
5.48
-
5.34
-
5.2
-
Low Level Output
Voltage
CMOS Loads
V
V
or V
IH IL
2
-
-
-
-
-
-
-
0.1
0.1
0.1
-
-
-
-
-
-
-
-
0.1
0.1
0.1
-
-
-
-
-
-
-
-
0.1
0.1
0.1
-
OL
4.5
6
Low Level Output
Voltage
TTL Loads
-
4
4.5
6
0.26
0.26
±0.1
0.33
0.33
±1
0.4
0.4
±1
5.2
-
Input Leakage
Current
I
V
or
6
I
CC
GND
Quiescent Device
Current
I
V
GND
or
0
6
-
-
8
-
80
-
160
µA
CC
CC
4
CD74HC390, CD54HCT390, CD74HCT390
DC Electrical Specifications (Continued)
TEST
CONDITIONS
o
o
o
o
o
25 C
-40 C TO 85 C -55 C TO 125 C
V
CC
PARAMETER
HCT TYPES
SYMBOL
V (V)
I
I
(mA)
(V)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
O
High Level Input
Voltage
V
-
-
-
-
4.5 to
5.5
2
-
-
-
-
-
0.8
-
2
-
-
0.8
-
2
-
-
0.8
-
V
V
V
IH
Low Level Input
Voltage
V
4.5 to
5.5
IL
High Level Output
Voltage
CMOS Loads
V
V
V
or V
-0.02
4.5
4.5
4.5
4.5
4.4
4.4
4.4
OH
IH
IH
IL
High Level Output
Voltage
TTL Loads
-4
3.98
-
-
-
-
3.84
-
3.7
-
V
V
V
Low Level Output
Voltage
CMOS Loads
V
or V
0.02
4
-
-
0.1
0.26
-
-
0.1
0.33
-
-
0.1
0.4
OL
IL
Low Level Output
Voltage
TTL Loads
Input Leakage
Current
I
V
and
0
0
-
5.5
5.5
-
-
-
-
-
±0.1
8
-
-
-
±1
80
-
-
-
±1
µA
µA
µA
I
CC
GND
Quiescent Device
Current
I
V
or
160
490
CC
CC
GND
Additional Quiescent
Device Current Per
Input Pin: 1 Unit Load
∆I
CC
(Note 2)
V
4.5 to
5.5
100
360
450
CC
-2.1
NOTE:
2. For dual-supply systems theoretical worst case (V = 2.4V, V
I
= 5.5V) specification is 1.8mA.
CC
HCT Input Loading Table
INPUT
nCP0
UNIT LOADS
0.45
0.6
nCP1, MR
NOTE: Unit Load is ∆I
360µA max at 25 C.
limit specified in DC Electrical Table, e.g.,
CC
o
Prerequisite for Switching Specifications
o
o
o
o
o
25 C
-40 C TO 85 C
-55 C TO 125 C
CHARACTERISTIC
HC TYPES
SYMBOL
V
(V)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
CC
Maximum Clock
Frequency
f
2
6
-
-
-
-
-
-
-
-
-
-
-
-
5
24
28
100
20
17
-
-
-
-
-
-
4
20
24
120
24
20
-
-
-
-
-
-
MHz
MHz
MHz
ns
MAX
4.5
30
35
80
16
14
6
2
Clock Pulse Width,
nCP0, nCP1
t
W
4.5
6
ns
ns
5
CD74HC390, CD54HCT390, CD74HCT390
Prerequisite for Switching Specifications (Continued)
o
o
o
o
o
25 C
-40 C TO 85 C
-55 C TO 125 C
CHARACTERISTIC
SYMBOL
t
V
(V)
MIN
70
14
12
50
10
9
TYP
MAX
MIN
90
18
15
65
13
11
MAX
MIN
105
21
MAX
UNITS
ns
CC
Reset Removal Time
2
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
REM
4.5
ns
6
2
18
ns
Reset Pulse Width
t
75
ns
W
4.5
6
15
ns
13
ns
HCT TYPES
Maximum Clock
Frequency
f
MAX
4.5
4.5
27
19
-
-
-
-
22
24
-
-
18
29
-
-
MHz
ns
Clock Pulse Width,
nCP0, nCP1
t
W
Reset Removal Time
Reset Pulse Width
t
4.5
4.5
15
13
-
-
-
-
19
16
-
-
22
20
-
-
ns
ns
REM
t
W
Switching Specifications Input t , t = 6ns
r
f
o
o
o
o
o
25 C
-40 C TO 85 C -55 C TO 125 C
TEST
V
CC
PARAMETER
HC TYPES
Propagation Delay (Figure 1)
SYMBOL CONDITIONS
(V)
MIN TYP MAX
MIN
MAX
MIN
MAX UNITS
t
C = 50pF
2
4.5
5
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
175
35
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
220
44
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
265
53
-
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
PLH,
L
t
PHL
nCP0 to nQ
nCP1 to nQ
nCP1 to nQ
nCP1 to nQ
0
1
2
3
C =15pF
14
-
L
C = 50pF
6
30
185
37
31
245
49
42
180
36
-
37
230
46
39
305
61
52
225
45
-
45
280
56
48
370
74
63
270
54
-
L
t
t
t
C = 50pF
2
-
PLH,
L
t
PHL
4.5
6
-
-
C = 50pF
2
-
PLH,
L
t
PHL
4.5
6
-
-
C = 50pF
2
-
PLH,
L
t
PHL
4.5
5
-
15
-
6
31
365
73
62
190
38
-
38
455
91
77
240
48
-
46
550
110
94
285
57
-
nCP0 to nQ3
(nQ connected to nCP1)
t
t
C = 50pF
2
-
PLH,
L
t
0
PHL
4.5
6
-
-
MR to Q
C = 50pF
2
-
n
PLH,
L
t
PHL
4.5
5
-
C =15pF
16
-
L
C = 50pF
6
32
41
48
L
6
CD74HC390, CD54HCT390, CD74HCT390
Switching Specifications Input t , t = 6ns (Continued)
r
f
o
o
o
o
o
25 C
-40 C TO 85 C -55 C TO 125 C
TEST
V
CC
(V)
PARAMETER
SYMBOL CONDITIONS
MIN TYP MAX
MIN
MAX
95
19
16
10
-
MIN
MAX UNITS
Output Transition Time
(Figure 1)
t
, t
C = 50pF
2
4.5
6
-
-
-
-
-
-
-
75
15
13
10
-
-
-
-
-
-
-
-
-
-
-
110
22
19
10
-
ns
ns
ns
pF
pF
TLH THL
L
-
Input Capacitance
C
C = 50pF
-
-
IN
L
Power Dissipation Capacitance
(Notes 3, 4)
C
C =15pF
5
28
PD
L
HCT TYPES
Propagation Delay (Figure 1)
t
t
C = 50pF
4.5
5
-
-
-
-
17
-
40
-
-
-
-
50
-
-
-
-
60
-
ns
ns
ns
PLH,
L
PHL
nCP0 to nQ
nCP1 to nQ
C =15pF
L
0
t
t
t
C = 50pF
4.5
43
51
65
1
PLH,
L
t
PHL
nCP1 to nQ
nCP1 to nQ
C = 50pF
4.5
4.5
-
-
-
-
55
42
-
-
69
53
-
-
83
63
ns
ns
2
PLH,
L
t
PHL
C = 50pF
3
PLH,
L
t
PHL
C =15pF
5
-
-
18
-
-
-
-
-
-
-
-
ns
ns
L
nCP0 to nQ2
(nQ connected to nCP1)
t
t
C = 50pF
4.5
84
105
126
PLH,
L
t
0
PHL
MR to Q
C = 50pF
4.5
5
-
-
-
-
-
-
18
-
42
-
-
-
-
-
-
53
-
-
-
-
-
-
63
-
ns
ns
ns
pF
pF
n
PLH,
L
t
PHL
C =15pF
L
Output Transition
Input Capacitance
t
, t
C = 50pF
4.5
-
15
10
-
19
10
-
22
10
-
TLH THL
L
C
C =15pF
-
IN
L
Power Dissipation Capacitance
(Notes 3, 4)
C
C =15pF
5
32
PD
L
NOTES:
3. C
is used to determine the dynamic power consumption, per multiplexer.
2
PD
4. P = V
f (C
PD
+ C ) where f = Input Frequency, C = Output Load Capacitance, V = Supply Voltage.
CC
D
CC
i
L
i
L
Test Circuits and Waveforms
t = 6ns
f
t = 6ns
t = 6ns
t = 6ns
r
r
f
V
3V
CC
90%
50%
10%
2.7V
1.3V
0.3V
INPUT
INPUT
GND
GND
t
t
t
t
THL
TLH
THL
TLH
90%
1.3V
90%
50%
10%
INVERTING
OUTPUT
INVERTING
OUTPUT
10%
t
t
PLH
PHL
t
t
PLH
PHL
FIGURE 1. HC AND HCU TRANSITION TIMES AND PROPAGA-
TION DELAY TIMES, COMBINATION LOGIC
FIGURE 2. HCT TRANSITION TIMES AND PROPAGATION
DELAY TIMES, COMBINATION LOGIC
7
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
CDIP
CDIP
PDIP
Drawing
5962-9098401MEA
CD54HCT390F3A
CD74HC390E
ACTIVE
ACTIVE
ACTIVE
J
J
16
16
16
1
1
TBD
TBD
A42 SNPB
A42 SNPB
N / A for Pkg Type
N / A for Pkg Type
N
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
CD74HC390EE4
CD74HC390M
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
PDIP
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
N
D
D
D
D
D
D
D
D
D
N
N
D
D
D
D
D
D
D
D
D
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD74HC390M96
CD74HC390M96E4
CD74HC390M96G4
CD74HC390ME4
CD74HC390MG4
CD74HC390MT
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD74HC390MTE4
CD74HC390MTG4
CD74HCT390E
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
CD74HCT390EE4
CD74HCT390M
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD74HCT390M96
CD74HCT390M96E4
CD74HCT390M96G4
CD74HCT390ME4
CD74HCT390MG4
CD74HCT390MT
CD74HCT390MTE4
CD74HCT390MTG4
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Oct-2007
TAPE AND REEL BOX INFORMATION
Device
Package Pins
Site
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) (mm) Quadrant
(mm)
330
(mm)
16
CD74HC390M96
CD74HCT390M96
D
D
16
16
SITE 27
SITE 27
6.5
6.5
10.3
10.3
2.1
2.1
8
8
16
16
Q1
Q1
330
16
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Oct-2007
Device
Package
Pins
Site
Length (mm) Width (mm) Height (mm)
CD74HC390M96
CD74HCT390M96
D
D
16
16
SITE 27
SITE 27
342.9
342.9
336.6
336.6
28.58
28.58
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties
may be subject to additional restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Applications
Audio
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/audio
Automotive
Broadband
Digital Control
Military
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/military
Interface
interface.ti.com
logic.ti.com
Logic
Power Mgmt
Microcontrollers
RFID
power.ti.com
Optical Networking
Security
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lpw
Telephony
Low Power
Wireless
Video & Imaging
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
相关型号:
©2020 ICPDF网 联系我们和版权申明