CDCV857BIDGGRG4 [TI]

CDCV857B, CDCV857BI 2.5-V Phase-Lock Loop Clock Driver 48-TSSOP -40 to 85;
CDCV857BIDGGRG4
型号: CDCV857BIDGGRG4
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

CDCV857B, CDCV857BI 2.5-V Phase-Lock Loop Clock Driver 48-TSSOP -40 to 85

驱动 CD 光电二极管 逻辑集成电路
文件: 总17页 (文件大小:842K)
中文:  中文翻译
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CDCV857B, CDCV857BI  
2.5-V PHASE-LOCK LOOP CLOCK DRIVER  
SCAS689A FEBRUARY 2003 REVISED NOVEMBER 2010  
D
Phase-Lock Loop Clock Driver for Double  
Data-Rate Synchronous DRAM  
Applications  
D
Enters Low-Power Mode When No CLK  
Input Signal Is Applied or PWRDWN Is Low  
D
D
Operates From Dual 2.5-V Supplies  
D
D
D
D
D
D
Spread Spectrum Clock Compatible  
Operating Frequency: 60 MHz to 200 MHz  
Low Jitter (cycle-cycle): 50 ps  
Low Static Phase Offset: 50 ps  
Low Jitter (Period): 35 ps  
Available in a 48-Pin TSSOP Package or  
56-Ball MicroStar JuniorBGA Package  
Consumes < 100-μA Quiescent Current  
External Feedback Pins (FBIN, FBIN) Are  
Used to Synchronize the Outputs to the  
Input Clocks  
D
D
Distributes One Differential Clock Input to  
10 Differential Outputs  
D
Meets/Exceeds the Latest DDR JEDEC  
Spec JESD821  
Description  
The CDCV857B is a high-performance, low-skew, low-jitter zero delay buffer that distributes a differential clock  
input pair (CLK, CLK) to 10 differential pairs of clock outputs (Y[0:9], Y[0:9]) and one differential pair of feedback  
clock outputs (FBOUT, FBOUT). The clock outputs are controlled by the clock inputs (CLK, CLK), the feedback  
clocks (FBIN, FBIN), and the analog power input (AV ). When PWRDWN is high, theoutputs switch in phase  
DD  
and frequency with CLK. When PWRDWN is low, all outputs are disabled to a high-impedance state (3-state)  
and the PLL is shut down (low-power mode). The device also enters this low-power mode when the input  
frequency falls below a suggested detection frequency that is below 20 MHz (typical 10 MHz). An input  
frequency detection circuit detects the low frequency condition and, after applying a >20-MHz input signal, this  
detection circuit turns the PLL on and enables the outputs.  
When AV is strapped low, the PLL is turned off and bypassed for test purposes. The CDCV857B is also able  
DD  
to track spread spectrum clocking for reduced EMI.  
Since the CDCV857B is based on PLL circuitry, it requires a stabilization time to achieve phase-lock of the PLL.  
This stabilization time is required following power up. The CDCV857B is characterized for both commercial and  
industrial temperature ranges.  
AVAILABLE OPTIONS  
T
TSSOP (DGG)  
CDCV857BDGG  
CDCV857BIDGG  
MicroStar JuniorBGA (GQL)  
A
0°C to 85°C  
CDCV857BGQL  
40°C to 85°C  
FUNCTION TABLE  
(Select Functions)  
INPUTS  
PWRDWN  
OUTPUTS  
PLL  
AV  
CLK  
L
CLK  
Y[0:9]  
Y[0:9]  
FBOUT  
FBOUT  
DD  
GND  
H
H
L
H
L
L
H
Z
Z
L
H
L
L
H
Z
Z
L
H
L
Bypassed/Off  
GND  
H
Bypassed/Off  
X
L
H
L
Z
Z
H
L
Z
Z
H
L
Off  
Off  
On  
On  
Off  
X
L
H
2.5 V (nom)  
2.5 V (nom)  
2.5 V (nom)  
H
H
X
L
H
L
H
H
Z
H
Z
<20 MHz <20 MHz  
Z
Z
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
MicroStar Junior is a trademark of Texas Instruments Incorporated.  
Copyright © 2003, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
CDCV857B, CDCV857BI  
2.5-V PHASE-LOCK LOOP CLOCK DRIVER  
SCAS689A FEBRUARY 2003 REVISED NOVEMBER 2010  
MicroStar Junior (GQL) Package  
(TOP VIEW)  
DGG PACKAGE  
(TOP VIEW)  
1
2
3
4
5
6
GND  
Y0  
Y0  
VDDQ  
Y1  
GND  
Y5  
Y5  
VDDQ  
Y6  
Y6  
1
48  
47  
46  
45  
44  
43  
A
2
3
4
B
C
Y6  
Y6  
Y1  
Y1  
5
Y1  
6
GND  
GND  
Y2  
7
42 GND  
41 GND  
40 Y7  
NC  
NC  
NC  
GND  
GND  
GND  
GND  
8
9
D
E
F
NC  
NC  
NC  
Y7  
Y7  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
Y2  
Y7  
Y2  
Y2  
VDDQ  
VDDQ  
CLK  
CLK  
VDDQ  
AVDD  
AGND  
GND  
Y3  
Y3  
VDDQ  
Y4  
Y4  
GND  
VDDQ  
PWRDWN  
FBIN  
FBIN  
VDDQ  
FBOUT  
FBOUT  
GND  
Y8  
Y8  
VDDQ  
Y9  
Y9  
GND  
PWRDN  
V
V
DDQ  
DDQ  
V
DDQ  
NC  
NC  
NC  
FBIN  
FBIN  
CLK  
CLK  
G
H
J
NC  
NC  
V
DDQ  
V
DDQ  
FBOUT  
AV  
DD  
FBOUT  
GND  
AGND  
GND  
Y8  
Y8  
Y3  
Y3  
K
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
CDCV857B, CDCV857BI  
2.5-V PHASE-LOCK LOOP CLOCK DRIVER  
SCAS689A FEBRUARY 2003 REVISED NOVEMBER 2010  
functional block diagram  
3
Y0  
2
Y0  
5
Y1  
37  
PWRDWN  
6
Power Down  
and Test  
Logic  
Y1  
16  
AV  
DD  
10  
Y2  
9
Y2  
20  
Y3  
19  
Y3  
22  
Y4  
23  
Y4  
46  
Y5  
47  
Y5  
13  
14  
CLK  
CLK  
44  
Y6  
43  
Y6  
PLL  
FBIN 36  
39  
Y7  
35  
FBIN  
40  
Y7  
29  
Y8  
30  
Y8  
27  
Y9  
26  
Y9  
32  
FBOUT  
33  
FBOUT  
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
CDCV857B, CDCV857BI  
2.5-V PHASE-LOCK LOOP CLOCK DRIVER  
SCAS689A FEBRUARY 2003 REVISED NOVEMBER 2010  
Terminal Functions  
TERMINAL  
DGG  
DESCRIPTION  
NAME  
AGND  
AV  
GQL  
H1  
17  
Ground for 2.5-V analog supply  
2.5-V Analog supply  
16  
G2  
DD  
CLK, CLK  
FBIN, FBIN  
FBOUT, FBOUT  
GND  
13, 14  
35, 36  
32, 33  
F1, F2  
F5, F6  
H6, G5  
I
I
Differential clock input  
Feedback differential clock input  
Feedback differential clock output  
Ground  
O
1, 7, 8, 18,  
24, 25, 31,  
41, 42, 48  
A3, A4,  
C1, C2,  
C5, C6,  
H2, H5,  
K3, K4  
PWRDWN  
37  
E6  
I
Output enable for Y and Y  
2.5-V Supply  
V
DDQ  
4, 11, 12,  
15, 21, 28,  
34, 38, 45  
B3, B4,  
E1, E2,  
E5, G1,  
G6, J3, J4  
Y[0:9]  
Y[0:9]  
3, 5, 10,  
20, 22, 27,  
29, 39, 44,  
46  
A1, B2,  
D1, J2,  
K1, A6,  
B5, D6,  
J5, K6  
O
O
Buffered output copies of input clock, CLK  
Buffered output copies of input clock, CLK  
2, 6, 9, 19,  
23, 26, 30,  
40, 43, 47  
A2, B1,  
D2, J1,  
K2, A5,  
B6, D5,  
J6, K5  
absolute maximum ratings over operating free-air temperature (unless otherwise noted)†  
Supply voltage range, V  
, AV  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to 3.6 V  
DDQ  
DD  
Input voltage range, V (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to V  
+ 0.5 V  
+ 0.5 V  
I
DDQ  
Output voltage range, V (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to V  
O
DDQ  
Input clamp current, I (V < 0 or V > V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA  
IK  
I
I
DDQ  
Output clamp current, I (V < 0 or V > V )  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA  
) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA  
OK  
O
O
DDQ  
Continuous output current, I (V = 0 to V  
O
O
DDQ  
Continuous current to GND or V  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA  
DDQ  
Package thermal impedance, θ (see Note 3): GQL package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137.6°C/W  
JA  
Storage temperature range T  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65°C to 150°C  
stg  
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTES: 1. The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed.  
2. This value is limited to 3.6 V maximum.  
3. The package thermal impedance is calculated in accordance with JESD 51.  
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
CDCV857B, CDCV857BI  
2.5-V PHASE-LOCK LOOP CLOCK DRIVER  
SCAS689A FEBRUARY 2003 REVISED NOVEMBER 2010  
recommended operating conditions (see Note 4)  
MIN  
2.3  
TYP  
MAX UNIT  
V
2.7  
2.7  
V
V
DDQ  
Supply voltage  
AV  
V
DDQ  
0.12  
DD  
CLK, CLK, FBIN, FBIN  
PWRDWN  
V /2 – 0.18  
DDQ  
0.7  
Low-level input voltage, V  
V
IL  
0.3  
CLK, CLK, FBIN, FBIN  
PWRDWN  
V
DDQ  
/2 + 0.18  
High-level input voltage, V  
V
V
IH  
1.7  
V
DDQ  
V
DDQ  
V
DDQ  
V
DDQ  
+ 0.3  
+ 0.3  
+ 0.6  
+ 0.6  
DC input signal voltage (see Note 5)  
Differential input signal voltage, V (see Note 6)  
–0.3  
0.36  
0.7  
dc  
ac  
CLK, FBIN  
CLK, FBIN  
V
ID  
Input differential pair cross voltage, V (see Note 7)  
V
DDQ  
/2 – 0.2  
V
DDQ  
/2 + 0.2  
12  
12  
V
IX  
High-level output current, I  
mA  
mA  
V/ns  
OH  
OL  
Low-level output current, I  
Input slew rate, SR  
1
0
4
Commercial  
Industrial  
85  
Operating free-air temperature, T  
°C  
A
40  
85  
NOTES: 4. The unused inputs must be held high or low to prevent them from floating.  
5. The dc input signal voltage specifies the allowable dc execution of the differential input.  
6. The differential input signal voltage specifies the differential voltage |VTR VCP| required for switching, where VTR is the true input  
level and VCP is the complementary input level.  
7. The differential cross-point voltage is expected to track variations of V and is the voltage at which the differential signals must  
CC  
be crossing.  
electrical characteristics over recommended operating free-air temperature range (unless  
otherwise noted)  
PARAMETER  
Input voltage  
TEST CONDITIONS  
= 2.3 V, I = 18 mA  
MIN  
TYP  
MAX UNIT  
V
V
All inputs  
V
V
V
V
V
–1.2  
V
IK  
DDQ  
DDQ  
DDQ  
DDQ  
DDQ  
I
= min to max, I = –1 mA  
V
– 0.1  
1.7  
OH  
DDQ  
High-level output voltage  
Low-level output voltage  
V
OH  
= 2.3 V, I = 12 mA  
OH  
= min to max, I = 1 mA  
0.1  
0.6  
OL  
V
OL  
V
V
= 2.3 V, I = 12 mA  
OL  
}
Differential outputs are terminated  
with 120 Ω /CL = 14 pF (See  
Figure 3)  
V
V
Output voltage swing  
1.1  
V
– 0.4  
OD  
DDQ  
w
Output differential cross-voltage  
V
/2 – 0.15  
V
/2  
V
/2 + 0.15  
OX  
DDQ  
DDQ  
DDQ  
I
I
Input current  
V
V
= 2.7 V, V = 0 V to 2.7 V  
10  
10  
μA  
μA  
I
DDQ  
DDQ  
I
High-impedance state output current  
Power-down current on  
= 2.7 V, V = V  
or GND  
OZ  
O
DDQ  
CLK and CLK = 0 MHz; PWRDWN  
= Low; Σ of I and AI  
I
20  
100  
μA  
DDPD  
V
DDQ  
+ AV  
DD  
DD DD  
f
f
= 170 MHz  
= 200 MHz  
7
9
10  
12  
O
AI  
Supply current on AV  
Input capacitance  
mA  
pF  
DD  
DD  
O
C
V
= 2.5 V, V = V  
or GND  
2
2.5  
3.5  
I
DDQ  
I
DDQ  
All typical values are at a respective nominal V  
The differential output signal voltage specifies the differential voltage VTR VCP, where VTR is the true output level and VCP is the  
.
DDQ  
complementary output level.  
The differential cross-point voltage is expected to track variations of V  
The frequency range is 100 MHz to 200 MHz.  
§
and is the voltage at which the differential signals must be crossing.  
DDQ  
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
 
CDCV857B, CDCV857BI  
2.5-V PHASE-LOCK LOOP CLOCK DRIVER  
SCAS689A FEBRUARY 2003 REVISED NOVEMBER 2010  
electrical characteristics over recommended operating free-air temperature range (unless  
otherwise noted) (continued)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX UNIT  
110  
f
O
f
O
= 170 MHz  
= 200 MHz  
100  
Without load  
105  
200  
120  
Differential outputs  
terminated with  
120 Ω/CL = 0 pF  
f
O
f
O
f
O
f
O
= 170 MHz  
= 200 MHz  
= 170 MHz  
= 200 MHz  
240  
I
Dynamic current on V  
mA  
DD  
DDQ  
210  
260  
280  
250  
Differential outputs  
terminated with  
120 Ω/CL = 14 pF  
300  
320  
Part-to-part input capacitance  
variation  
ΔC  
V
= 2.5 V, V = V  
or GND  
or GND  
1
pF  
DDQ  
I
DDQ  
DDQ  
Input capacitance difference between  
CLK and CLKB, FBIN, and FBINB  
C
C
V
= 2.5 V, V = V  
0.25  
3.5  
pF  
pF  
Δ)  
I(  
DDQ  
DDQ  
I
Output capacitance  
V
= 2.5 V, V = V or GND  
DDQ  
2.5  
3
O
O
All typical values are at a respective nominal V  
.
DDQ  
timing requirements over recommended ranges of supply voltage and operating free-air  
temperature  
MIN  
MAX  
UNIT  
Operating clock frequency  
Application clock frequency  
Input clock duty cycle  
f
60  
200  
MHz  
CLK  
40%  
60%  
10  
{
Stabilization time (PLL mode)  
μs  
}
Stabilization time (Bypass mode)  
30  
ns  
The time required for the integrated PLL circuit to obtain phase lock of its feedback signal to its reference signal. For phase lock to be obtained,  
a fixed-frequency, fixed-phase reference signal must be present at CLK and V must be applied. Until phase lock is obtained, the specifications  
DD  
for propagation delay, skew, and jitter parameters given in the switching characteristics table are not applicable. This parameter does not apply  
for input modulation under SSC application.  
A recovery time is required when the device goes from power-down mode into bypass mode (AVDD at GND).  
switching characteristics  
PARAMETER  
TEST CONDITIONS  
Test mode/CLK to any output  
Test mode/CLK to any output  
66 MHz  
MIN  
TYP  
3.5  
MAX  
UNIT  
ns  
w
w
t
t
Low to high level propagation delay time  
High-to low level propagation delay time  
PLH  
3.5  
ns  
PHL  
60  
35  
75  
50  
100  
75  
1
60  
35  
ps  
W
t
Jitter (period), See Figure 7  
jit(per)  
100/133/167/200 MHz  
66 MHz  
ps  
75  
W
t
Jitter (cycle-to-cycle), See Figure 4  
ps  
jit(cc)  
100/133/167/200 MHz  
66 MHz  
50  
100  
75  
W
t
t
Half-period jitter, See Figure 8  
ps  
jit(hper)  
100/133/167/200 MHz  
Load: 120 Ω/14 pF  
66 MHz  
Output clock slew rate, See Figure 9  
2
V/ns  
slr(o)  
–100  
–50  
100  
50  
t
Static phase offset, See Figure 5  
ps  
(Ø)  
100/133/167/200 MHz  
Load: 120 Ω/14 pF  
Load: 120 Ω/14 pF  
tsk  
Output skew, See Figure 6  
70  
100  
900  
ps  
ps  
(o)  
f
t , t  
r
Output rise and fall times (20% 80%)  
600  
§
Refers to the transition of the noninverting output.  
This parameter is assured by design but can not be 100% production tested.  
6
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
CDCV857B, CDCV857BI  
2.5-V PHASE-LOCK LOOP CLOCK DRIVER  
SCAS689A FEBRUARY 2003 REVISED NOVEMBER 2010  
PARAMETER MEASUREMENT INFORMATION  
V
DD  
V
Yx  
R = 60 Ω  
R = 60 Ω  
V
DD  
/2  
V
Yx  
CDCV857B  
GND  
Figure 1. IBIS Model Output Load  
V
DD  
/2  
SCOPE  
CDCV857B  
V /2  
DD  
C = 14 pF  
R = 10 Ω  
Z = 50 Ω  
Z = 60 Ω  
Z = 60 Ω  
R = 50 Ω  
V
(TT)  
Z = 50 Ω  
R = 10 Ω  
R = 50 Ω  
C = 14 pF  
V
(TT)  
V /2  
DD  
V
(TT)  
= GND  
V /2  
DD  
Figure 2. Output Load Test Circuit  
7
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
CDCV857B, CDCV857BI  
2.5-V PHASE-LOCK LOOP CLOCK DRIVER  
SCAS689A FEBRUARY 2003 REVISED NOVEMBER 2010  
V
DD  
PROBE  
CDCV857B  
C = 14 pF  
GND  
Z = 60 Ω  
Z = 60 Ω  
C = 1 pF  
C = 1 pF  
R = 1 MΩ  
R = 120 Ω  
V
(TT)  
C = 14 pF  
R = 1 MΩ  
V
(TT)  
GND  
V
(TT)  
= GND  
GND  
Figure 3. Output Load Test Circuit for Crossing Point  
Yx, FBOUT  
Yx, FBOUT  
t
t
c(n+1)  
c(n)  
t
= t  
t  
jit(cc)  
c(n) c(n+1)  
Figure 4. Cycle-to-Cycle Jitter  
8
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
CDCV857B, CDCV857BI  
2.5-V PHASE-LOCK LOOP CLOCK DRIVER  
SCAS689A FEBRUARY 2003 REVISED NOVEMBER 2010  
PARAMETER MEASUREMENT INFORMATION  
CLK  
CLK  
FBIN  
FBIN  
t
t
(
) n  
(
) n+1  
n = N  
1
t
(
) n  
t
=
)
(
N
(N > 1000 Samples)  
Figure 5. Phase Offset  
Yx  
Yx  
Yx, FBOUT  
Yx, FBOUT  
t
sk(o)  
Figure 6. Output Skew  
9
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
CDCV857B, CDCV857BI  
2.5-V PHASE-LOCK LOOP CLOCK DRIVER  
SCAS689A FEBRUARY 2003 REVISED NOVEMBER 2010  
PARAMETER MEASUREMENT INFORMATION  
Yx, FBOUT  
Yx, FBOUT  
t
c(n)  
Yx, FBOUT  
Yx, FBOUT  
1
f
o
1
t
= t  
cn  
jit(per)  
f
= Average input frequency measured at CLK/CLK  
O
f
o
Figure 7. Period Jitter  
Yx, FBOUT  
Yx, FBOUT  
t
t
(hper_n+1)  
(hper_n)  
1
f
o
n = any half cycle  
1
t
= t  
(hper_n)  
jit(hper)  
f
= Average input frequency measured at CLK/CLK  
O
2xf  
o
Figure 8. Half-Period Jitter  
V
OH  
, V  
IH  
80%  
80%  
20%  
20%  
20%  
Clock Inputs  
and Outputs  
V , V  
OL IL  
t
t
f
r
V
* V  
V
* V  
80%  
t
20%  
80%  
+
t
+
t
slr(IńO)  
slf(IńO)  
t
r(IńO)  
f(IńO)  
Figure 9. Input and Output Slew Rates  
10  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
PACKAGE OPTION ADDENDUM  
www.ti.com  
24-Jan-2013  
PACKAGING INFORMATION  
Orderable Device  
CDCV857BDGG  
Status Package Type Package Pins Package Qty  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
0 to 70  
Top-Side Markings  
Samples  
Drawing  
(1)  
(2)  
(3)  
(4)  
ACTIVE  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
DGG  
48  
48  
48  
48  
56  
40  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
SNPB  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2A-220C-4 WKS  
CDCV857B  
CDCV857B  
CDCV857B  
CDCV857B  
CDCV857B  
CDCV857BDGGG4  
CDCV857BDGGR  
CDCV857BDGGRG4  
CDCV857BGQLR  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
DGG  
DGG  
DGG  
GQL  
40  
Green (RoHS  
& no Sb/Br)  
0 to 70  
2000  
2000  
1000  
Green (RoHS  
& no Sb/Br)  
0 to 70  
Green (RoHS  
& no Sb/Br)  
0 to 70  
BGA  
TBD  
0 to 70  
MICROSTAR  
JUNIOR  
CDCV857BIDGG  
CDCV857BIDGGG4  
CDCV857BIDGGR  
CDCV857BIDGGRG4  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
DGG  
DGG  
DGG  
DGG  
48  
48  
48  
48  
40  
40  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
CDCV857B-I  
CDCV857B-I  
CDCV857B-I  
CDCV857B-I  
Green (RoHS  
& no Sb/Br)  
2000  
2000  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
24-Jan-2013  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) Only one of markings shown within the brackets will appear on the physical device.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
26-Mar-2013  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
CDCV857BIDGGR  
TSSOP  
DGG  
48  
2000  
330.0  
24.4  
8.6  
15.8  
1.8  
12.0  
24.0  
Q1  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
26-Mar-2013  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
TSSOP DGG 48  
SPQ  
Length (mm) Width (mm) Height (mm)  
367.0 367.0 45.0  
CDCV857BIDGGR  
2000  
Pack Materials-Page 2  
MECHANICAL DATA  
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998  
DGG (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE PACKAGE  
48 PINS SHOWN  
0,27  
0,17  
M
0,08  
0,50  
48  
25  
6,20  
6,00  
8,30  
7,90  
0,15 NOM  
Gage Plane  
0,25  
1
24  
0°8°  
A
0,75  
0,50  
Seating Plane  
0,10  
0,15  
0,05  
1,20 MAX  
PINS **  
48  
56  
64  
DIM  
A MAX  
12,60  
12,40  
14,10  
13,90  
17,10  
16,90  
A MIN  
4040078/F 12/97  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-153  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
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TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms  
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