CSD95411RRB [TI]
65A 峰值连续电流同步降压 NexFET™ 功率级 | RRB | 41 | -40 to 125;
| 型号： | CSD95411RRB |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 65A 峰值连续电流同步降压 NexFET™ 功率级 | RRB | 41 | -40 to 125 |
| 文件： | 总17页 (文件大小：1298K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CSD95411
ZHCSOX2 –JANUARY 2023
CSD95411 同步降压NexFET™ 智能功率级
1 特性
3 说明
• 峰值连续电流：65A
• 峰值效率（fSW = 600kHz，LOUT = 150nH）：超过
94%
• 工作频率高：高达1.75MHz
• 二极管仿真功能
• 温度补偿双向电流感应
• 模拟温度输出
• 故障监控
CSD95411 NexFET™ 功率级是一款针对高功率、高密
度同步降压转换器进行高度优化的设计。该器件集成了
驱动器 IC 和功率 MOSFET 来完善功率级开关功能。
该组合采用 5mm × 6mm 小型封装，可实现高电流、
高效率以及高速切换功能。该功率级还集成了准确电流
检测和温度感测功能，可简化系统设计并提高准确度。
经过优化的 PCB 封装可帮助减少设计时间并轻松完成
总体系统设计。
• 兼容3.3V 和5V PWM 信号
• 三态PWM 输入
• 集成自举开关
• 用于击穿保护的经优化死区时间
• 高密度行业通用5mm × 6mm QFN 封装
• 超低电感封装
• 系统已优化的PCB 空间占用
• 耐热增强型顶部散热
• 符合RoHS 标准、无铅端子镀层
• 无卤素
器件信息
封装(1)
器件
介质
数量
2500
250
配送
CSD95411RRB
CSD95411RRBT
13 英寸卷带
7 英寸卷带
QFN
5.00mm × 6.00mm
卷带
包装
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附
录。
Controller
PWM1
CSD95411
CSP1
2 应用
• 多相位同步降压转换器
• –高频应用
PWM2
CSP2
PMBus
CSD95411
CSD95411
• –大电流、低占空比应用
• 多负载点(POL) 直流/直流转换器
• 内存和图形卡
• 台式机和服务器VR12.x / VR13.x / VR14.x 电压内
核同步降压转换器
PWMx
CSPx
简化版应用
本文档旨在为方便起见，提供有关TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问
www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SLPS751
CSD95411
ZHCSOX2 –JANUARY 2023
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Table of Contents
1 特性................................................................................... 1
2 应用................................................................................... 1
3 说明................................................................................... 1
4 Revision History.............................................................. 3
5 Device and Documentation Support..............................4
5.1 Device Support........................................................... 4
5.2 Documentation Support.............................................. 4
5.3 接收文档更新通知....................................................... 4
5.4 支持资源......................................................................4
5.5 Trademarks.................................................................4
5.6 Electrostatic Discharge Caution..................................4
5.7 术语表......................................................................... 4
6 Mechanical, Packaging, and Orderable Information....5
6.1 Package Option Addendum........................................6
6.2 Tape and Reel Information..........................................8
6.3 Mechanical Drawing..................................................10
6.4 Recommended PCB Land Pattern............................11
6.5 Recommended Stencil Opening............................... 12
6.6 Alternate Industry Standard Compatible PCB
Land Pattern................................................................13
6.7 Alternate Industry Standard Compatible Stencil
Opening.......................................................................14
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4 Revision History
DATE
REVISION
NOTES
January 2023
*
Initial release.
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5 Device and Documentation Support
5.1 Device Support
5.1.1 第三方产品免责声明
TI 发布的与第三方产品或服务有关的信息，不能构成与此类产品或服务或保修的适用性有关的认可，不能构成此
类产品或服务单独或与任何TI 产品或服务一起的表示或认可。
5.2 Documentation Support
5.3 接收文档更新通知
要接收文档更新通知，请导航至 ti.com 上的器件产品文件夹。点击订阅更新 进行注册，即可每周接收产品信息更
改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
5.4 支持资源
TI E2E™ 支持论坛是工程师的重要参考资料，可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解
答或提出自己的问题可获得所需的快速设计帮助。
链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅
TI 的《使用条款》。
5.5 Trademarks
NexFET™ and TI E2E™ are trademarks of Texas Instruments.
所有商标均为其各自所有者的财产。
5.6 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
5.7 术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。
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6 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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6.1 Package Option Addendum
Package
Type
Package
Drawing
Package
Qty
Lead/Ball
Finish
MSL Peak
Temp 3
Op Temp
(°C)
Orderable Device
CSD95411RRB
CSD95411RRBT
Status 1
ACTIVE
ACTIVE
Pins
41
Eco Plan 2
Device Marking4 5
95411RRB
Green (RoHS-Exempt &
no Sb/Br)
Level-2-260C-1
YEAR
QFN
RRB
RRB
2500
250
CU NIPDAU
CU NIPDAU
–55 to 150
–55 to 150
Green (RoHS-Exempt &
no Sb/Br)
Level-2-260C-1
YEAR
QFN
41
95411RRB
1. The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a
new design.
PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
space
2. Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://
www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6
substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high
temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible)
as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
space
3. MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
space
4. There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device
space
5. Multiple Device markings will be inside parentheses. Only on Device Marking contained in parentheses and separated by a "~" will appear on a
device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by
third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable
steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information
to be proprietary, and thus CAS numbers and other limited information may not be available for release.
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
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6.2 Tape and Reel Information
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
Reel
Diameter
(mm)
Reel
Width W1
(mm)
Package
Type
Package
Drawing
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
Device
Pins
SPQ
CSD95411RRB
CSD95411RRBT
QFN
QFN
RRB
RRB
41
41
2500
250
330
180
12.4
12.4
5.30
5.30
6.30
6.30
1.20
1.20
8.00
8.00
12.00
12.00
Q1
Q1
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TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
Device
Package Type
Package Drawing Pins
SPQ
2500
250
Length (mm) Width (mm)
Height (mm)
CSD95411RRB
CSD95411RRBT
QFN
QFN
RRB
RRB
41
41
367
213
367
191
38
35
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6.3 Mechanical Drawing
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning
and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pads must be soldered to the printed circuit board for optimal thermal and mechanical
performance.
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6.4 Recommended PCB Land Pattern
(R0.05) TYP
METAL UNDER
SOLDER MASK
TYP
16X (0.6)
39
30
(2.9)
16X (0.25)
1
23X (0.25)
(2.25)
29
(2.05)
SOLDER MASK
OPENING, TYP
40
3X (1.275)
(0.5)
14X (0.45)
(0.3)
19X (0.45)
(0.375)
25
(0.025)
6
(0.1)
(0.4)
0.000 PKG
24
41
3X (0.3)
(R0.05) TYP
5X (1.15)
(0.8)
7
9
(1.05)
(
0.2) VIA
TYP
5X (2)
20
(2.05)
(2.2)
(0.05) MIN
TYP
(2.6)
(2.75) TYP
(3.2) TYP
19
10
PKG
LAND PATTERN EXAMPLE
SOLDER MASK DEFINED
SCALE: 20X
4224073/A 03/2018
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning
and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This package is designed to be soldered to thermal pads on the board. For more information, see QFN/SON
PCB Attachment (SLUA271).
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6.5 Recommended Stencil Opening
(R0.05) TYP
29X (0.6)
39
30
(2.9)
23X (0.25)
16X (0.25)
1
(2.245)
29
14X (0.45)
EXPOSED METAL
TYP
(R0.05) TYP
19X (0.45)
(1.375)
(1.175)
40
SOLDER MASK
EDGE
TYP
(0.375)
(0.305)
25
24
(0.025)
6
0.000 PKG
3X (0.13)
(0.25)
(0.1)
(0.4)
41
(0.84)
(1.05)
7
9
3X (1.05)
3X (1.25)
20
EXPOSED METAL
TYP
4X (2.17)
(2.6)
METAL UNDER
SOLDER MASK
TYP
(2.75) TYP
10
(3.2) TYP
19
10X (0.25)
SOLDER PAST EXAMPLE
BASED ON 0.125 mm THICK STENCIL
PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
PADS 7-9 & 20-24: 70%
PAD 40: 70%
SCALE: 20X
4224073/A 03/2018
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning
and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525
may have alternate design recommendations.
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6.6 Alternate Industry Standard Compatible PCB Land Pattern
METAL UNDER
SOLDER MASK
TYP
16X (0.6)
39
30
(2.9)
16X (0.25)
1
(2.25)
(2.175)
(2.05)
(2.25)
29
SOLDER MASK
OPENING, TYP
40
(1.275)
14X (0.45)
(0.5)
(0.3)
25
24
(0.3)
(0.025)
6
(0.1)
0.000 PKG
(0.3)
41
(0.4)
(R0.05) TYP
5X (1.15)
(0.8)
7
(1.05)
19X (0.45)
(
0.2) VIA
TYP
9
5X (2)
20
(2.05)
(2.2)
(0.05) MIN
TYP
(2.6)
(2.75) TYP
(3.2) TYP
19
10
PKG
20X (0.25)
LAND PATTERN EXAMPLE
SOLDER MASK DEFINED
SCALE: 20X
4221590/D 04/2019
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning
and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525
may have alternate design recommendations.
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6.7 Alternate Industry Standard Compatible Stencil Opening
29X (0.6)
39
30
29X (0.25)
1
EXPOSED
METAL
4X (2.245)
29
24X (0.45)
4X (1.375)
4X (1.175)
40
EXPOSED
METAL
SOLDER MASK
OPENING
TYP
25
24
(0.375)
4X (0.305)
(0.025)
6
0.000 PKG
3X (0.13)
(0.25)
(0.12)
(0.38)
41
(0.84)
7
(1.05)
3X (1.05)
3X (1.25)
(R0.05) TYP
9
20
EXPOSED
METAL
4X (2.17)
(2.6)
(2.75) TYP
METAL UNDER
SOLDER MASK
TYP
10
(3.2) TYP
19
10X (0.25)
9X (0.45)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
PADS 7-9 & 20-24: 70%; PADS 25-29: 70%
PAD 40: 70%; PAD 41: 71%
SCALE: 20X
4221590/D 04/2019
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PACKAGE OPTION ADDENDUM
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23-Jan-2023
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
2500
250
(1)
(2)
(3)
(4/5)
(6)
CSD95411RRB
CSD95411RRBT
ACTIVE
VQFN-CLIP
VQFN-CLIP
RRB
41
41
RoHS-Exempt
& Green
NIPDAU
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
-40 to 125
-40 to 125
95411RRB
95411RRB
Samples
Samples
ACTIVE
RRB
RoHS-Exempt
& Green
NIPDAU
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
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23-Jan-2023
Addendum-Page 2
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保。
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CSD95430RRB
90-A peak continuous-current synchronous-buck NexFET™ smart power stage | RRB | 41 | -40 to 125
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