CSD95420RCBT [TI]
50A 峰值连续同步降压 NexFET™ 智能功率级 | RCB | 27 | -40 to 125;
| 型号： | CSD95420RCBT |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 50A 峰值连续同步降压 NexFET™ 智能功率级 | RCB | 27 | -40 to 125 |
| 文件： | 总15页 (文件大小：1356K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CSD95420RCB
ZHCSM67 – NOVEMBER 2020
CSD95420RCB 同步降压 NexFET™ 智能功率级
1 特性
3 说明
•
•
•
•
•
•
•
•
•
•
•
•
50A 峰值持续电流
CSD95420RCB NexFET™ 功率级针对高功率、高密度
同步降压转换器进行了高度优化。这款产品集成了驱动
器器件和功率 MOSFET 来完善功率级开关功能。该组
合在小型 4 mm x 5 mm 外形尺寸封装中提供高电流、
高效率和高速开关功能。该器件集成了准确电流检测和
温度检测功能，可简化系统设计并提高准确度。经过优
化的 PCB 封装可帮助减少设计时间，并轻松完成总体
系统设计。
电流为 15A 时，系统效率超过 94%
工作频率高（高达 1.75 MHz）
二极管仿真功能
温度补偿双向电流感应
模拟温度输出
故障监控
兼容 3.3V 和 5V PWM 信号
三态 PWM 输入
器件信息
集成自举开关
器件(1)
介质
数量
封装
配送
优化了击穿保护死区时间
QFN 封装
CSD95420RCBRC
B
QFN
4.00mm × 5.00mm
卷带
包装
13 英寸卷带
2500
– 高密度
– 4 mm x 5 mm
– 超低电感
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附
录。
– 系统已优化的 PCB 空间占用
– 热增强型工具
– 符合 RoHS
– 无铅端子镀层
– 无卤素
Controller
PWM1
CSD59920
CSP1
2 应用
PWM2
CSP2
PMBus
CSD59920
CSD59920
•
多相同步降压转换器
– 高频应用
– 大电流、低占空比应用
负载点直流/直流转换器
存储器和显卡
台式机和服务器 VR13.x/VR14.x V-Core 同步降压
转换器
•
•
•
PWM8
CSP8
图 3-1. 简化版应用
本文档旨在为方便起见，提供有关 TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问
www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SLPS735
CSD95420RCB
ZHCSM67 – NOVEMBER 2020
www.ti.com.cn
Table of Contents
1 特性................................................................................... 1
2 应用................................................................................... 1
3 说明................................................................................... 1
4 Revision History.............................................................. 2
5 Device and Documentation Support..............................3
5.1 Documentation Support.............................................. 3
5.2 接收文档更新通知....................................................... 3
5.3 支持资源......................................................................3
5.4 Trademarks.................................................................3
5.5 静电放电警告.............................................................. 3
5.6 术语表......................................................................... 3
6 Mechanical, Packaging, and Orderable Information....3
6.1 Package Option Addendum........................................4
6.2 Mechanical Drawing....................................................8
6.3 Recommended PCB Land Pattern..............................9
6.4 Recommended Stencil Opening............................... 10
6.5 Alternate Industry Standard Compatible PCB
Land Pattern................................................................11
6.6 Alternate Industry Standard Compatible Stencil
Opening.......................................................................12
4 Revision History
DATE
REVISION
NOTES
November 2020
*
Initial release.
Copyright © 2023 Texas Instruments Incorporated
English Data Sheet: SLPS735
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5 Device and Documentation Support
5.1 Documentation Support
5.2 接收文档更新通知
要接收文档更新通知，请导航至 ti.com 上的器件产品文件夹。点击订阅更新 进行注册，即可每周接收产品信息更
改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
5.3 支持资源
TI E2E™ 支持论坛是工程师的重要参考资料，可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解
答或提出自己的问题可获得所需的快速设计帮助。
链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅 TI
的《使用条款》。
5.4 Trademarks
NexFET™ and TI E2E™ are trademarks of Texas Instruments.
所有商标均为其各自所有者的财产。
5.5 静电放电警告
静电放电 (ESD) 会损坏这个集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理
和安装程序，可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级，大至整个器件故障。精密的集成电路可能更容易受到损坏，这是因为非常细微的参
数更改都可能会导致器件与其发布的规格不相符。
5.6 术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。
6 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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English Data Sheet: SLPS735
CSD95420RCB
ZHCSM67 – NOVEMBER 2020
www.ti.com.cn
6.1 Package Option Addendum
6.1.1 Packaging Information
Package
Type
Package
Drawing
Package
Qty
Orderable Device
Status (1)
Pins
Eco Plan (2)
Lead/Ball Finish MSL Peak Temp (3)
CU NIPDAU Level-2-260CUNLIM
Op Temp (°C)
Device Marking(4) (5)
CSD95420RCBRCB
Active
QFN
RCB
27
2500
PB-Free (RoHS Exempt)
–55 to 150
59920RB
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
space
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest
availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the
requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified
lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used
between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1%
by weight in homogeneous material)
space
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
space
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device
space
(5) Multiple Device markings will be inside parentheses. Only on Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided
by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider
certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Copyright © 2023 Texas Instruments Incorporated
English Data Sheet: SLPS735
4
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6.1.2 Tape and Reel Information
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
Package
Type
Package
Drawing
Reel
Diameter (mm)
Reel
Width W1 (mm)
A0
(mm)
B0
(mm)
K0
P1
(mm)
W
(mm)
Pin1
Quadrant
Device
Pins
SPQ
(mm)
1.30
1.30
CSD95420RCB
CSD95420RCBT
VQFN-CLIP
VQFN-CLIP
RCB
RCB
27
27
2500
250
330
330
12.4
12.4
4.30
4.30
5.30
5.30
8.00
8.00
12.00
12.00
Q1
Q1
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English Data Sheet: SLPS735
CSD95420RCB
ZHCSM67 – NOVEMBER 2020
www.ti.com.cn
6.1.1 Packaging Information
Package
Type
Package
Drawing
Package
Qty
Orderable Device
Status (1)
Pins
Eco Plan (2)
Lead/Ball Finish MSL Peak Temp (3)
CU NIPDAU Level-2-260CUNLIM
Op Temp (°C)
Device Marking(4) (5)
CSD95420RCBRCB
Active
QFN
RCB
27
2500
PB-Free (RoHS Exempt)
–55 to 150
59920RB
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
space
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest
availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the
requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified
lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used
between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1%
by weight in homogeneous material)
space
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
space
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device
space
(5) Multiple Device markings will be inside parentheses. Only on Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided
by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider
certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Copyright © 2023 Texas Instruments Incorporated
English Data Sheet: SLPS735
6
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CSD95420RCB
ZHCSM67 – NOVEMBER 2020
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6.1.2 Tape and Reel Information
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
Package
Type
Package
Drawing
Reel
Diameter (mm)
Reel
Width W1 (mm)
A0
(mm)
B0
(mm)
K0
P1
(mm)
W
(mm)
Pin1
Quadrant
Device
Pins
SPQ
(mm)
1.30
1.30
CSD95420RCB
CSD95420RCBT
VQFN-CLIP
VQFN-CLIP
RCB
RCB
27
27
2500
250
330
330
12.4
12.4
4.30
4.30
5.30
5.30
8.00
8.00
12.00
12.00
Q1
Q1
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English Data Sheet: SLPS735
PACKAGE OUTLINE
CSD95420RCB
www.ti.com.cn
VQFN-CLIP - 1.05 mm max height
ZHCSM67 – NOVEMBER 2020
RCB0027A
PLASTIC QUAD FLATPACK - NO LEAD
6.2 Mechanical Drawing
4.1
3.9
A
B
PIN 1 INDEX AREA
5.1
4.9
C
1.05 MAX
SEATING PLANE
0.08 C
(0.203) TYP
4X 0.5
0.05
0.00
0.3
5X
0.2
(0.1) TYP
0.3
0.2
8
12
5X
2.15 0.1
1.75 0.1
1.58
3X 0.5
7
6
13
1.48
0.91 0.1
0.53 0.1
0.23 0.1
R0.1
TYP
15
16
27
26
0.21 0.1
0.000
PKG
5
0.174 0.1
0.4
0.3
15X
1.84 0.1
1.86
1.58
18
19
1
PIN 1 ID
25
(45 X0.3)
0.3
15X
0.2
0.1
0.05
12X 0.5
C A B
•
All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning
4224521/A 09/2018
and tolerancing per ASME Y14.5M.
NOTES:
•
•
This drawing is subject to change without notice.
The package thermal pads must be soldered to the printed circuit board for optimal thermal and mechanical
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
performance.
2. This drawing is subject to change without notice.
3. The package thermal pads must be soldered to the printed circuit board for optimal thermal and mechanical performance.
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Copyright © 2023 Texas Instruments Incorporated
English Data Sheet: SLPS735
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6.3 Recommended PCB Land Pattern
METAL UNDER
SOLDER MASK
TYP
19
25
15X (0.55)
(2.425)
15X (0.25)
1
(1.86)
(1.84)
18
(1.607)
(1.58)
26
3X (1.007)
SOLDER MASK
OPENING, TYP
12X (0.5)
16
15
(0.407)
(0.174)
(
0.2) VIA
TYP
0.000 PKG
(0.21)
5
(0.23)
27
2X (0.48)
(0.53)
(0.91)
10X (0.25)
6
2X (1.33)
2X (1.48)
(2.15)
13
7
(1.75)
(0.05) MIN
TYP
(0.1) TYP
(2.7) TYP
8
12
•
All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning
and tolerancing per ASME Y14.5M.
•
•
This drawing is subject to change without notice.
This package is designed to be soldered to thermal pads on the board. For more information, see QFN/SON
PCB Attachment (SLUA271).
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English Data Sheet: SLPS735
CSD95420RCB
ZHCSM67 – NOVEMBER 2020
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6.4 Recommended Stencil Opening
EXPOSED
METAL
25
19
20X (0.55)
(2.425)
20X (0.25)
1
(R0.05) TYP
(1.86)
(1.767)
15X (0.5)
18
16
METAL UNDER
SOLDER MASK
TYP
(1.107)
(0.907)
26
SOLDER MASK
OPENING
TYP
(0.58)
(0.247)
0.000 PKG
5
(0.23)
2X (0.27)
(0.48)
27
(0.53)
15
13
6
(0.932)
(1.08)
7
2X (1.69)
(1.729)
(2.15)
EXPOSED
METAL
(2.25) TYP
8
(2.7) TYP
12
5X (0.25)
4X (0.5)
•
All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning
and tolerancing per ASME Y14.5M.
•
•
This drawing is subject to change without notice.
Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525
may have alternate design recommendations.
Copyright © 2023 Texas Instruments Incorporated
English Data Sheet: SLPS735
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6.5 Alternate Industry Standard Compatible PCB Land Pattern
METAL UNDER
SOLDER MASK
TYP
12 (0.55)
25
19
(2.425)
12X (0.25)
1
(1.84)
(1.843)
(1.58)
18
(1.607)
26
SOLDER MASK
OPENING, TYP
(1.08)
3X (1.007)
14X (0.5)
(0.58)
16
15
(0.318)
(0.407)
(0.174)
0.000 PKG
(0.21)
5
(0.23)
(0.53)
27
2X (0.48)
(0.91)
2X (1.33)
(1.75)
6
7
(
0.2) VIA
TYP
2X (1.48)
13
(2.15)
(0.05) MIN.
TYP
(2.25) TYP
(2.7) TYP
8
12
PKG
LAND PATTERN EXAMPLE
SOLDER MASK DEFINED
SCALE: 20X
4223993/B 09/2019
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning
and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pads must be soldered to the printed circuit board for optimal themral and mechanical
performance.
4. This package is designed to be soldered to thermal pads on the board. For more information, see Texas
Instruments literature number SLUA271 (www.ti.com/lit/slua271).
5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525
may have alternate design recommendations.
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English Data Sheet: SLPS735
CSD95420RCB
ZHCSM67 – NOVEMBER 2020
www.ti.com.cn
6.6 Alternate Industry Standard Compatible Stencil Opening
25
19
29X (0.25)
EXPOSED
METAL
24X (0.5)
1
(1.86)
(1.783)
(1.767)
18
16
(1.107)
26
(0.907)
(0.377)
SOLDER MASK
OPENING
TYP
(0.247)
0.000 PKG
5
2X (0.27)
(0.48)
(0.23)
(0.53)
27
15
13
6
7
(0.932)
(1.08)
(R0.05) TYP
2X (1.69)
(1.729)
(2.15)
EXPOSED
METAL
(2.25) TYP
8
METAL UNDER
SOLDER MASK
TYP
(2.7) TYP
12
10X (0.25)
9X (0.5)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
PADS 6-7 & 13-15: 70%
PADS 16-18: 70%
PAD 26: 70%
SCALE: 20X
4223993/B 09/2019
Copyright © 2023 Texas Instruments Incorporated
English Data Sheet: SLPS735
12
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PACKAGE OPTION ADDENDUM
www.ti.com
20-Oct-2022
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
2500
250
(1)
(2)
(3)
(4/5)
(6)
CSD95420RCB
CSD95420RCBT
ACTIVE
VQFN-CLIP
VQFN-CLIP
RCB
27
27
RoHS-Exempt
& Green
NIPDAU
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
-40 to 125
-40 to 125
95420RB
95420RB
Samples
Samples
ACTIVE
RCB
RoHS-Exempt
& Green
NIPDAU
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
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TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
20-Oct-2022
Addendum-Page 2
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相关型号：
CSD95430RRB
90-A peak continuous-current synchronous-buck NexFET™ smart power stage | RRB | 41 | -40 to 125
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