CSD96497Q5MCT [TI]
采用 DualCool 封装的 65A 同步降压 NexFET 智能功率级 | DMC | 12 | -55 to 150;
| 型号： | CSD96497Q5MCT |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 采用 DualCool 封装的 65A 同步降压 NexFET 智能功率级 | DMC | 12 | -55 to 150 |
| 文件： | 总12页 (文件大小：466K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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CSD96497Q5MC
ZHCSJC2A –JANUARY 2019–REVISED MARCH 2019
CSD96497Q5MC 同步降压 NexFET™ 智能功率级
1 特性
2 应用
1
•
•
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•
•
•
•
•
•
•
•
•
•
•
•
•
•
具有 65A 持续工作电流能力
•
多相同步降压转换器
30A 电流下系统效率超过 93.5%
工作频率高（高达 1.25MHz）
支持 FCCM 的二极管仿真模式
温度补偿双向电流感应
模拟温度输出
–
–
高频率 应用
高电流、低占空比 应用
•
•
•
POL 直流/直流转换器
存储器和显卡
台式机和服务器 VR12.x 和 VR13.x V-core 同步降
压转换器
故障监控 - OTP、HS OCP 和短路保护
兼容 3.3V 和 5V PWM 信号
三态 PWM 输入
•
用于网络通信的大电流 POL
3 说明
集成自举开关
CSD96497 NexFET™power stage是经过高度优化的
设计，用于高功率、高功率密度场合的同步降压转换
器。这款产品集成了驱动器 IC 和功率 MOSFET 来完
善功率级开关功能。该组合可在 5mm x 6mm 小型封
装中实现高电流、高效率以及高速切换功能。它还集成
了精确的电流检测和温度检测功能，可以简化系统设计
以及提高精度。此外，PCB 封装已经过优化，可帮助
减少设计时间并轻松完成总体系统设计。
用于击穿保护的经优化死区时间
高密度 5mm × 6mm QFN 封装
超低电感封装
系统已优化的 PCB 空间占用
DualCool™封装
符合 RoHS 标准、无铅端子镀层
无卤素
器件信息(1)
器件
介质
数量
封装
配送
13 英寸卷
带
QFN
5.00mm ×
6.00mm
CSD96497Q5MC
2500
卷带封
装
CSD96497Q5MCT 7 英寸卷带 250
(1) 如需了解所有可用封装，请参阅产品说明书末尾的可订购产品
附录。
典型功率级效率
简化应用
5VIN
VIN
100
90
80
70
60
50
40
30
21
18
15
12
9
CSD96497Q5MC
RLSET
CIN
LSET
VIN
RVDD
VDD
VDD = 5V
VIN = 12 V
VOUT = 1.8 V
CVDD
CBOOT
RBOOT
PWM
PWM
BOOT_R
EM/FCCM
TAO/FLT
IOUT
EM/FCCM
TAO/FLT
IOUT
L
OUT = 150 nH
BOOT
VOS
PGND
VOUT
f
SW = 600 kHz
TA = 25°C
PGND
6
VSW
REFIN
REFIN
3
0
0
10
20
30
40
50
60 65
Output Current (A)
D000
PGND
PGND PGND
PGND
1
本文档旨在为方便起见，提供有关 TI 产品中文版本的信息，以确认产品的概要。 有关适用的官方英文版本的最新信息，请访问 www.ti.com，其内容始终优先。 TI 不保证翻译的准确
性和有效性。 在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SLPS714
CSD96497Q5MC
ZHCSJC2A –JANUARY 2019–REVISED MARCH 2019
www.ti.com.cn
4 修订历史记录
Changes from Original (January 2019) to Revision A
Page
•
更正了简化应用 原理图........................................................................................................................................................... 1
2
版权 © 2019, Texas Instruments Incorporated
CSD96497Q5MC
www.ti.com.cn
ZHCSJC2A –JANUARY 2019–REVISED MARCH 2019
5 器件和文档支持
5.1 商标
DualCool, NexFET are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
5.2 静电放电警告
这些装置包含有限的内置 ESD 保护。 存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损
伤。
5.3 术语表
SLYZ022 — TI 术语表。
这份术语表列出并解释术语、缩写和定义。
版权 © 2019, Texas Instruments Incorporated
3
CSD96497Q5MC
ZHCSJC2A –JANUARY 2019–REVISED MARCH 2019
www.ti.com.cn
6 机械、封装和可订购信息
以下页面包含机械、封装和可订购信息。这些信息是指定器件的最新可用数据。数据如有变更，恕不另行通知，且
不会对此文档进行修订。如需获取此数据表的浏览器版本，请查阅左侧的导航栏。
6.1 机械制图
5.1
4.9
A
B
PIN 1 INDEX AREA
6.1
5.9
NOTE 4
TYP
C
1.05 MAX
SEATING PLANE
0.08 C
(0.51) TYP
(0.51)
3.3 0.1
2X (2)
(0.2) TYP
4X (0.25)
0.05
0.00
0.6
0.4
2X (0.31)
2X
6
7
EXPOSED
THERMAL
PAD
2X
5
13
5.4 0.1
NOTE 4
1
12
20X 0.5
0.3
0.2
22X
0.6
0.4
10X
PIN 1 ID
(OPTIONAL)
0.1
C A B
C
0.05
4223036/A 07/2016
1. 所有线性尺寸的单位均为毫米。括号中的任何尺寸仅供参考。尺寸和公差值符合 ASME Y14.5M 标准。
2. 本图如有变更，恕不另行通知。
3. 封装散热盘必须在印刷电路板上焊接，包装散热和机械性能。
4. 外露的连接杆 特性 可能会有所不同。
4
版权 © 2019, Texas Instruments Incorporated
CSD96497Q5MC
www.ti.com.cn
ZHCSJC2A –JANUARY 2019–REVISED MARCH 2019
6.2 推荐 PCB 焊盘图案
(3.3)
10X (0.7)
SYMM
(R0.05) TYP
12
1
22X (0.25)
20X (0.5)
2X
(1.13)
6X
(1.32)
8
5
13
SYMM
(5.4)
METAL UNDER
SOLDER MASK
2X
2X
(2.85)
SOLDER MASK
OPENING
2X
(
0.2) VIA
TYP
6
7
(0.05) TYP
6X (1.4)
2X (0.7)
2X (0.31)
(4.7)
0.05 MIN
ALL AROUND
0.05 MAX
ALL AROUND
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
(PREFERRED FOR PADS 1 - 5 & 8 - 12)
SOLDER MASK
DEFINED
(PADS 6 - 7, OPTIONAL FOR OTHER PADS)
1. 所有线性尺寸的单位均为毫米。括号中的任何尺寸仅供参考。尺寸和公差值符合 ASME Y14.5M 标准。
2. 本图如有变更，恕不另行通知。
3. 此封装设计用于焊接到电路板的散热焊盘上。有关更多信息，请参阅《QFN/SON PCB 连接》(SLUA271)。
4. 根据具体应用决定是否选用通孔，请参见器件数据表。如需实施任意通孔，请参见此视图上的通孔位置。建议
对焊锡膏下方的通孔进行填充、堵塞或包覆。
版权 © 2019, Texas Instruments Incorporated
5
CSD96497Q5MC
ZHCSJC2A –JANUARY 2019–REVISED MARCH 2019
www.ti.com.cn
6.3 建议模版开孔
SYMM
METAL
TYP
13
10X (0.7)
8X (1.41)
1
12
8X
(1.12)
22X (0.25)
20X (0.5)
8
5
SYMM
(0.66)
TYP
(R0.05) TYP
METAL UNDER
SOLDER MASK
2X
(1.32)
TYP
7
6
2X (0.7)
(0.8) TYP
(4.7)
2X (0.31)
1. 所有线性尺寸的单位均为毫米。括号中的任何尺寸仅供参考。尺寸和公差值符合 ASME Y14.5M 标准。
2. 本图如有变更，恕不另行通知。
3. 具有漏斗形壁和圆角的激光切割孔可提供更佳的锡膏脱离。IPC-7525 可能提供替代设计建议。
6
版权 © 2019, Texas Instruments Incorporated
CSD96497Q5MC
www.ti.com.cn
ZHCSJC2A –JANUARY 2019–REVISED MARCH 2019
6.4 Package Option Addendum
6.4.1 Packaging Information
Package
Type
Package
Drawing
Package
Qty
(1)
(2)
(3)
Orderable Device
Status
Pins
Eco Plan
Lead/Ball Finish MSL Peak Temp
Op Temp (°C)
Device Marking(4)(5)
PB-Free
(RoHS
Exempt)
Level-2-260C-1
CSD96497
Active
VSON-CLIP
DMC
12
2500
CU SN
YEAR
–55 to 150
96497MC
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
space
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest
availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the
requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified
lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used
between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by
weight in homogeneous material)
space
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
space
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device
space
(5) Multiple Device markings will be inside parentheses. Only on Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief
on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third
parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for
release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
版权 © 2019, Texas Instruments Incorporated
7
CSD96497Q5MC
ZHCSJC2A –JANUARY 2019–REVISED MARCH 2019
www.ti.com.cn
6.4.2 Tape and Reel Information
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
Reel
Diameter
(mm)
Reel
Width W1
(mm)
Package
Type
Package
Drawing
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
Device
Pins
SPQ
VSON-
CLIP
CSD96497
DMC
12
2500
330
12.4
5.30
6.30
1.20
8.00
12.00
Q1
8
版权 © 2019, Texas Instruments Incorporated
重要声明和免责声明
TI 均以“原样”提供技术性及可靠性数据（包括数据表）、设计资源（包括参考设计）、应用或其他设计建议、网络工具、安全信息和其他资
源，不保证其中不含任何瑕疵，且不做任何明示或暗示的担保，包括但不限于对适销性、适合某特定用途或不侵犯任何第三方知识产权的暗示
担保。
所述资源可供专业开发人员应用TI 产品进行设计使用。您将对以下行为独自承担全部责任：(1) 针对您的应用选择合适的TI 产品；(2) 设计、
验证并测试您的应用；(3) 确保您的应用满足相应标准以及任何其他安全、安保或其他要求。所述资源如有变更，恕不另行通知。TI 对您使用
所述资源的授权仅限于开发资源所涉及TI 产品的相关应用。除此之外不得复制或展示所述资源，也不提供其它TI或任何第三方的知识产权授权
许可。如因使用所述资源而产生任何索赔、赔偿、成本、损失及债务等，TI对此概不负责，并且您须赔偿由此对TI 及其代表造成的损害。
TI 所提供产品均受TI 的销售条款 (http://www.ti.com.cn/zh-cn/legal/termsofsale.html) 以及ti.com.cn上或随附TI产品提供的其他可适用条款的约
束。TI提供所述资源并不扩展或以其他方式更改TI 针对TI 产品所发布的可适用的担保范围或担保免责声明。IMPORTANT NOTICE
邮寄地址：上海市浦东新区世纪大道 1568 号中建大厦 32 楼，邮政编码：200122
Copyright © 2019 德州仪器半导体技术（上海）有限公司
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
2500
250
(1)
(2)
(3)
(4/5)
(6)
CSD96497Q5MC
CSD96497Q5MCT
ACTIVE
VSON-CLIP
VSON-CLIP
DMC
12
12
RoHS-Exempt
& Green
SN
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
-55 to 150
-55 to 150
96497MC
96497MC
ACTIVE
DMC
RoHS-Exempt
& Green
SN
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
Addendum-Page 2
重要声明和免责声明
TI 均以“原样”提供技术性及可靠性数据（包括数据表）、设计资源（包括参考设计）、应用或其他设计建议、网络工具、安全信息和其他资
源，不保证其中不含任何瑕疵，且不做任何明示或暗示的担保，包括但不限于对适销性、适合某特定用途或不侵犯任何第三方知识产权的暗示
担保。
所述资源可供专业开发人员应用TI 产品进行设计使用。您将对以下行为独自承担全部责任：(1) 针对您的应用选择合适的TI 产品；(2) 设计、
验证并测试您的应用；(3) 确保您的应用满足相应标准以及任何其他安全、安保或其他要求。所述资源如有变更，恕不另行通知。TI 对您使用
所述资源的授权仅限于开发资源所涉及TI 产品的相关应用。除此之外不得复制或展示所述资源，也不提供其它TI或任何第三方的知识产权授权
许可。如因使用所述资源而产生任何索赔、赔偿、成本、损失及债务等，TI对此概不负责，并且您须赔偿由此对TI 及其代表造成的损害。
TI 所提供产品均受TI 的销售条款 (http://www.ti.com.cn/zh-cn/legal/termsofsale.html) 以及ti.com.cn上或随附TI产品提供的其他可适用条款的约
束。TI提供所述资源并不扩展或以其他方式更改TI 针对TI 产品所发布的可适用的担保范围或担保免责声明。IMPORTANT NOTICE
邮寄地址：上海市浦东新区世纪大道 1568 号中建大厦 32 楼，邮政编码：200122
Copyright © 2020 德州仪器半导体技术（上海）有限公司
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