DS10CP152QMA/NOPB [TI]
汽车类 1.5Gbps 2X2 LVDS 交叉点开关 | D | 16 | -40 to 85;
| 型号： | DS10CP152QMA/NOPB |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 汽车类 1.5Gbps 2X2 LVDS 交叉点开关 | D | 16 | -40 to 85 开关 光电二极管 输出元件 |
| 文件： | 总15页 (文件大小：746K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DS10CP152Q
www.ti.com
SNLS295E –MAY 2008–REVISED APRIL 2013
DS10CP152Q Automotive 1.5 Gbps 2X2 LVDS Crosspoint Switch
Check for Samples: DS10CP152Q
1
FEATURES
DESCRIPTION
The DS10CP152Q is
a 1.5 Gbps 2x2 LVDS
2
•
•
AECQ-100 Grade 3
crosspoint switch optimized for high-speed signal
routing and switching over lossy FR-4 printed circuit
board backplanes and balanced cables. Fully
differential signal paths ensure exceptional signal
integrity and noise immunity. The non-blocking
architecture allows connections of any input to any
output or outputs.
DC - 1.5 Gbps Low Jitter, Low Skew, Low
Power Operation
•
•
Pin Configurable, Fully Differential, Non-
Blocking Architecture
Wide Input Common Mode Voltage Range
Allows DC-Coupled Interface to LVDS, CML
and LVPECL Drivers
Wide input common mode range allows the switch to
accept signals with LVDS, CML and LVPECL levels;
the output levels are LVDS. A very small package
footprint requires a minimal space on the board while
the flow-through pinout allows easy board layout.
Each differential input and output is internally
terminated with a 100Ω resistor to lower device return
losses, reduce component count and further minimize
board space.
•
On-Chip 100Ω Input and Output Termination
Minimizes Insertion and Return Losses,
Reduces Component Count and Minimizes
Board Space
•
•
8 kV ESD on LVDS I/O Pins Protects Adjoining
Components
Small SOIC-16 Space Saving Package
APPLICATIONS
•
•
•
Automotive Display Applications
Clock and Data Buffering and Muxing
SD/HD SDI Routers
Typical Application
DS10CP152Q
RED
GREEN
BLUE
RED
GREEN
BLUE
Navigation
Computer
24 TO 1
MONITOR
1
1 TO 24
SEL0
DS90UR241Q
DS90UR124Q
SEL1
RED
GREEN
BLUE
RED
GREEN
BLUE
Entertainment
System
MONITOR
2
1 TO 24
24 TO 1
2x2 CROSSPOINT
DS90UR241Q
DS90UR124Q
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008–2013, Texas Instruments Incorporated
DS10CP152Q
SNLS295E –MAY 2008–REVISED APRIL 2013
www.ti.com
Block Diagram
SEL1 SEL0
EN0
IN0+
OUT0+
OUT0-
EN1
IN0-
2 x 2
IN1+
IN1-
OUT1+
OUT1-
Connection Diagram
Figure 1. DS10CP152Q Pin Diagram
PIN DESCRIPTIONS
Pin Name
Pin
I/O, Type
Pin Description
Number
IN0+, IN0- ,
IN1+, IN1-
3, 4,
6, 7
I, LVDS
Inverting and non-inverting high speed LVDS input pins.
Inverting and non-inverting high speed LVDS output pins.
OUT0+, OUT0-,
OUT1+, OUT1-
14, 13,
11, 10
O, LVDS
SEL1, SEL0
EN0, EN1
NC
1, 2
16, 15
8, 9
5
I, LVCMOS
I, LVCMOS
NC
Switch configuration pins.
Output enable pins.
"NO CONNECT" pins.
Power supply pin.
Ground pin.
VDD
Power
GND
12
Power
2
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SNLS295E –MAY 2008–REVISED APRIL 2013
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings(1)(2)
Supply Voltage
−0.3V to +4V
−0.3V to (VCC + 0.3V)
−0.3V to +4V
1V
LVCMOS Input Voltage
LVDS Input Voltage
Differential Input Voltage |VID|
LVDS Output Voltage
LVDS Differential Output Voltage
LVDS Output Short Circuit Current Duration
Junction Temperature
Storage Temperature Range
Lead Temperature Range
Soldering (4 sec.)
−0.3V to (VCC + 0.3V)
0V to 1V
5 ms
+105°C
−65°C to +150°C
+260°C
Maximum Package Power Dissipation at 25°C
D0016A Package
1.10W
Derate D0016A Package
Package Thermal Resistance
θJA
13.75 mW/°C above +25°C
+72.7°C/W
+41.2°C/W
θJC
ESD Susceptibility
(3)
HBM
≥8 kV
≥250V
(4)
MM
(5)
CDM
≥1250V
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur, including inoperability and degradation of
device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or
other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating
Conditions indicate conditions at which the device is functional and the device should not be operated beyond such conditions.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) Human Body Model, applicable std. JESD22-A114C
(4) Machine Model, applicable std. JESD22-A115-A
(5) Field Induced Charge Device Model, applicable std. JESD22-C101-C
Recommended Operating Conditions
Min
3.0
0
Typ
Max
3.6
1
Units
V
Supply Voltage (VCC
)
3.3
Receiver Differential Input Voltage (VID
)
V
Operating Free Air Temperature (TA)
−40
+25
+85
°C
DC Electrical Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified.
(1)(2)(3)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
LVCMOS DC SPECIFICATIONS
VIH
VIL
High Level Input Voltage
Low Level Input Voltage
2.0
VDD
0.8
V
V
GND
(1) The Electrical Characteristics tables list ensured specifications under the listed Recommended Operating Conditions except as
otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and
are not ensured.
(2) Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground
except VOD and ΔVOD
.
(3) Typical values represent most likely parametric norms for VCC = +3.3V and TA = +25°C, and at the Recommended Operation Conditions
at the time of product characterization and are not ensured.
Copyright © 2008–2013, Texas Instruments Incorporated
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DC Electrical Characteristics (continued)
Over recommended operating supply and temperature ranges unless otherwise specified. (1)(2)(3)
Symbol
Parameter
High Level Input Current
Conditions
Min
Typ
Max
Units
IIH
VIN = 3.6V
VCC = 3.6V
40
175
250
±10
−1.5
μA
IIL
Low Level Input Current
Input Clamp Voltage
VIN = GND
VCC = 3.6V
±1
μA
VCL
ICL = −18 mA, VCC = 0V
−0.9
V
LVDS INPUT DC SPECIFICATIONS
VID
Input Differential Voltage
0
1
V
mV
mV
V
VTH
VTL
Differential Input High Threshold
Differential Input Low Threshold
Common Mode Voltage Range
VCM = +0.05V or VCC-0.05V
VID = 100 mV
0
0
+100
−100
VCMR
0.05
VCC -
0.05
VIN = 3.6V or 0V
VCC = 3.6V or 0V
±1
±10
μA
IIN
Input Current
CIN
RIN
Input Capacitance
Any LVDS Input Pin to GND
Between IN+ and IN-
1.7
pF
Input Termination Resistor
100
Ω
LVDS OUTPUT DC SPECIFICATIONS
VOD
Differential Output Voltage
250
-35
350
1.2
450
35
mV
mV
V
RL = 100Ω
RL = 100Ω
ΔVOD
Change in Magnitude of VOD for Complimentary
Output States
VOS
Offset Voltage
1.05
-35
1.375
35
ΔVOS
Change in Magnitude of VOS for Complimentary
Output States
mV
(4)
IOS
Output Short Circuit Current
OUT to GND
-23
8
-55
55
mA
mA
pF
Ω
OUT to VCC
COUT
ROUT
Output Capacitance
Any LVDS Output Pin to GND
Between OUT+ and OUT-
1.2
100
Output Termination Resistor
SUPPLY CURRENT
ICC
Supply Current
Outputs Powered Down Supply Current
EN0 = EN1 = H
EN0 = EN1 = L
58
25
70
30
mA
mA
ICCZ
(4) Output short circuit current (IOS) is specified as magnitude only, minus sign indicates direction only.
AC Electrical Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified.
(1)(2)(3)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
LVDS OUTPUT AC SPECIFICATIONS
tPLHD
tPHLD
tSKD1
Differential Propagation Delay Low to
High
440
400
40
650
650
120
ps
ps
ps
RL = 100Ω
Differential Propagation Delay High to
Low
Pulse Skew |tPLHD − tPHLD
|
(4)
(1) The Electrical Characteristics tables list ensured specifications under the listed Recommended Operating Conditions except as
otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and
are not ensured.
(2) Typical values represent most likely parametric norms for VCC = +3.3V and TA = +25°C, and at the Recommended Operation Conditions
at the time of product characterization and are not ensured.
(3) Specification is ensured by characterization and is not tested in production.
(4) tSKD1, |tPLHD − tPHLD|, Pulse Skew, is the magnitude difference in differential propagation delay time between the positive going edge and
the negative going edge of the same channel.
4
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SNLS295E –MAY 2008–REVISED APRIL 2013
AC Electrical Characteristics (continued)
Over recommended operating supply and temperature ranges unless otherwise specified. (1)(2)(3)
Symbol
tSKD2
Parameter
Conditions
Min
Typ
Max
Units
Channel to Channel Skew
25
60
ps
(5)
tSKD3
Part to Part Skew
45
190
ps
(6)
tLHT
tHLT
tON
Rise Time
170
170
5
350
350
20
ps
ps
μs
ns
ns
RL = 100Ω
Fall Time
Output Enable Time
Output Disable Time
tOFF
tSEL
3
12
Select Time
3
12
(3)
JITTER PERFORMANCE
tRJ1
tRJ2
VID = 350 mV
VCM = 1.2V
Clock (RZ)
135 MHz
0.5
0.5
0.5
0.5
9
1.2
1.2
1.2
1.2
38
ps
ps
311 MHz
503 MHz
750 MHz
270 Mbps
622 Mbps
1.06 Gbps
1.5 Gbps
270 Mbps
622 Mbps
1.06 Gbps
1.5 Gbps
Random Jitter (RMS Value)
tRJ3
tRJ4
tDJ1
tDJ2
tDJ3
tDJ4
tTJ1
tTJ2
tTJ3
tTJ4
ps
ps
VID = 350 mV
VCM = 1.2V
Clock (RZ)
ps
7
36
ps
Deterministic Jitter (Peak-to-Peak Value )
Total Jitter (Peak to Peak Value)
7
34
ps
9
35
ps
VID = 350 mV
VCM = 1.2V
PRBS-23 (NRZ)
0.01
0.01
0.01
0.01
0.03
0.04
0.05
0.07
UIP-P
UIP-P
UIP-P
UIP-P
(5) tSKD2, Channel to Channel Skew, is the difference in propagation delay (tPLHD or tPHLD) among all output channels in Broadcast mode
(any one input to all outputs).
(6) tSKD3, Part to Part Skew, is defined as the difference between the minimum and maximum differential propagation delays. This
specification applies to devices at the same VCC and within 5°C of each other within the operating temperature range.
DC Test Circuits
V
OH
OUT+
OUT-
IN+
IN-
Power Supply
Power Supply
R
L
R
D
V
OL
Figure 2.
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AC Test Circuits and Timing Diagrams
OUT+
OUT-
IN+
Signal Generator
R
L
R
D
IN-
Figure 3.
Figure 4.
Figure 5.
FUNCTIONAL DESCRIPTION
The DS10CP152Q is a 1.5 Gbps 2x2 LVDS digital crosspoint switch optimized for high-speed signal routing and
switching over lossy FR-4 printed circuit board backplanes and balanced cables.
Table 1. Switch Configuration Truth Table
SEL1
SEL0
OUT1
IN0
OUT0
IN0
0
0
1
1
0
1
0
1
IN0
IN1
IN1
IN0
IN1
IN1
Table 2. Output Enable Truth Table
EN1
EN0
OUT1
OUT0
0
0
1
1
0
1
0
1
Disabled
Disabled
Enabled
Enabled
Disabled
Enabled
Disabled
Enabled
6
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DS10CP152Q
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SNLS295E –MAY 2008–REVISED APRIL 2013
INPUT INTERFACING
The DS10CP152Q accepts differential signals and allows simple AC or DC coupling. With a wide common mode
range, the DS10CP152Q can be DC-coupled with all common differential drivers (i.e. LVPECL, LVDS, CML).
The following three figures illustrate typical DC-coupled interface to common differential drivers. Note that the
DS10CP152Q inputs are internally terminated with a 100Ω resistor.
LVDS
Driver
DS10CP152
Receiver
100W Differential T-Line
OUT+
IN+
100W
IN-
OUT-
Figure 6. Typical LVDS Driver DC-Coupled Interface to an DS10CP152Q Input
CML3.3V or CML2.5V
Driver
V
CC
DS10CP152
Receiver
50W
50W
100W Differential T-Line
OUT+
OUT-
IN+
IN-
100W
Figure 7. Typical CML Driver DC-Coupled Interface to an DS10CP152Q Input
LVPECL
Driver
LVDS
Receiver
100W Differential T-Line
IN+
IN-
OUT+
100W
OUT-
150-250W
150-250W
Figure 8. Typical LVPECL Driver DC-Coupled Interface to an DS10CP152Q Input
OUTPUT INTERFACING
The DS10CP152Q outputs signals compliant to the LVDS standard. Its outputs can be DC-coupled to most
common differential receivers. The following figure illustrates typical DC-coupled interface to common differential
receivers and assumes that the receivers have high impedance inputs. While most differential receivers have a
common mode input range that can accomodate LVDS compliant signals, it is recommended to check respective
receiver's data sheet prior to implementing the suggested interface implementation.
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DS10CP152
Driver
Differential
Receiver
100W Differential T-Line
OUT+
IN+
IN-
CML or
LVPECL or
LVDS
100W
100W
OUT-
Figure 9. Typical DS10CP152Q Output DC-Coupled Interface to an LVDS, CML or LVPECL Receiver
8
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DS10CP152Q
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SNLS295E –MAY 2008–REVISED APRIL 2013
Typical Performance Characteristics
Figure 10. A 270 Mbps NRZ PRBS-7 After 2"
Differential FR-4 Stripline
Figure 11. A 622 Mbps NRZ PRBS-7 After 2"
Differential FR-4 Stripline
V:100 mV / DIV, H:500 ps / DIV
V:100 mV / DIV, H:200 ps / DIV
Figure 12. A 1.06 Gbps NRZ PRBS-7 After 2"
Differential FR-4 Stripline
Figure 13. A 1.5 Gbps NRZ PRBS-7 After 2"
Differential FR-4 Stripline
V:100 mV / DIV, H:200 ps / DIV
V:100 mV / DIV, H:100 ps / DIV
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SNLS295E –MAY 2008–REVISED APRIL 2013
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REVISION HISTORY
Changes from Revision D (April 2013) to Revision E
Page
•
Changed layout of National Data Sheet to TI format ............................................................................................................ 9
10
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PACKAGE OPTION ADDENDUM
www.ti.com
12-Apr-2013
PACKAGING INFORMATION
Orderable Device
DS10CP152QMA/NOPB
DS10CP152QMAX/NOPB
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
ACTIVE
SOIC
SOIC
D
16
16
250
Green (RoHS
& no Sb/Br)
CU SN
CU SN
Level-1-260C-UNLIM
DS10CP152
QMA
ACTIVE
D
2500
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
-40 to 85
DS10CP152
QMA
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Oct-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
DS10CP152QMA/NOPB
SOIC
D
D
16
16
250
178.0
330.0
16.4
16.4
6.5
6.5
10.3
10.3
2.3
2.3
8.0
8.0
16.0
16.0
Q1
Q1
DS10CP152QMAX/NOPB SOIC
2500
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Oct-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
DS10CP152QMA/NOPB
DS10CP152QMAX/NOPB
SOIC
SOIC
D
D
16
16
250
210.0
367.0
185.0
367.0
35.0
35.0
2500
Pack Materials-Page 2
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