DS110DF111_14 [TI]

Low Power Multi-Rate Two Channel Retimer;
DS110DF111_14
型号: DS110DF111_14
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

Low Power Multi-Rate Two Channel Retimer

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DS110DF111  
www.ti.com  
SNLS461 MAY 2013  
Low Power Multi-Rate Two Channel Retimer  
Check for Samples: DS110DF111  
1
FEATURES  
DESCRIPTION  
The DS110DF111 is  
a
with  
dual channel (1-lane  
Pin Compatible Retimer Family  
bidirectional)  
retimer  
integrated  
signal  
DS125DF111 with DFE : 9.8 to 12.5G  
DS110DF111 with DFE : 8.5 to 11.3G  
conditioning. The DS110DF111 includes an input  
Continuous-Time Linear Equalizer (CTLE), clock and  
data recovery (CDR) and transmit driver on each  
channel.  
Adaptive CTLE up to 34 dB Boost at 11.3G  
Self Tuning 5-Tap DFE  
The DS110DF111 with its on-chip Decision Feedback  
Equalizer (DFE) can enhance the reach and  
robustness of long, lossy, cross-talk-impaired high  
speed serial links to achieve BER < 1x10-15. For Less  
demanding applications/interconnects, the DFE can  
be switched off and achieve the same BER  
performance. The DS125 and DS110 devices are pin-  
compatible.  
Raw Equalized and Retimed Data Loopback  
Adjustable Transmit VOD: 600 to 1300 mVp-p  
Settable Tx De-Emphasis Driver 0 to -12dB  
Low Power Consumption: 200mW/Channel  
Locks to Half/Quarter/Eighth Data Rates for  
Legacy Support  
On-Chip Eye Monitor (EOM), PRBS Generator  
Each channel of the DS110DF111 independently  
locks to serial data at data rates from 8.5 to 11.3  
Gbps or to any supported sub-rate of these data  
rates. This simplifies system design and lowers  
overall cost.  
Input Signal Detection, CDR Lock  
Detection/Indicator  
Single 3.3V or 2.5V ±5% Power Supply  
SMBus, EEPROM, or Pin Based Configuration  
4 mm x 4 mm, 24-Pin QFN Package  
Programmable transmit de-emphasis driver offers  
precise settings to meet the SFF-8431 template. The  
fully adaptive receive equalization (CTLE and DFE)  
enables longer distance transmission in lossy copper  
Operating Temp Range: -40°C to 85°C  
interconnect  
and  
backplanes  
with  
multiple  
connectors. The CDR function is ideal for use in front  
port parallel optical module applications to reset the  
jitter budget and retime high speed serial data.  
Line Card  
Switch Fabric  
Retimer with  
DFE  
Optical  
Retimer with  
DFE  
QSFP  
SFP  
10G  
ASIC  
ASIC  
FPGA  
FPGA  
10G  
Retimer with  
Passive  
Copper  
Cable  
DFE  
Retimer with  
DFE  
QSFP  
SFP  
Back  
Plane  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2013, Texas Instruments Incorporated  
DS110DF111  
SNLS461 MAY 2013  
www.ti.com  
PRODUCTION CONNECTION DIAGRAM  
PIN OUT DIAGRAM (TOP VIEW)  
INA+  
INA-  
24  
23  
22  
21  
20  
19  
OUTA+  
OUTA-  
7
8
DS110DF111  
9
VODA/READEN#  
ADDR1/VODB/DONE#  
INB+  
VDD  
VDD  
10  
11  
12  
4 mm x 4 mm, 0.5 mm pitch  
TOP VIEW  
OUTB+  
OUTB-  
DAP = GND  
INB-  
2
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PIN DESCRIPTIONS  
PIN NAME  
PIN #  
I/O TYPE  
DESCRIPTION  
HIGH SPEED DIFFERENTIAL I/OS  
OUTA+/-  
OUTB+/-  
INA+/-  
7, 8  
O, CML  
Inverting and non-inverting CML-compatible differential outputs.  
Outputs require AC coupling  
20, 19  
24, 23  
O, CML  
I, CML  
Inverting and non-inverting CML-compatible differential outputs.  
Outputs require AC coupling  
Inverting and non-inverting CML-compatible differential inputs. An on-  
chip 100 Ohm terminating resistor connects INA+ to INA-  
Inputs require AC coupling. TI recommends 100 nF capacitors. Note that  
for SFP+ applications, AC coupling is included as part of the SFP+  
module.  
INB+/-  
11, 12  
I, CML  
Inverting and non-inverting CML-compatible differential inputs. An on-  
chip 100 Ohm terminating resistor connects INB+ to INB-  
Inputs require AC coupling. TI recommends 100 nF capacitors. Note that  
for SFP+ applications, AC coupling is included as part of the SFP+  
module.  
LOOP FILTER CONNECTION PIN  
LPF_CP_A, LPF_REF_A 2, 1  
I/O, analog  
I/O, analog  
Loop filter connection, place a 22 nF capacitor in series between  
LPF_CP_A and LPF_REF_A  
LPF_CP_B, LPF_REF_B 17, 18  
Loop filter connection, place a 22 nF capacitor in series between  
LPF_CP_B and LPF_REF_B  
Reference Clock I/O  
REFCLK_IN  
INDICATOR PINS  
LOCK  
14  
I, LVCMOS  
25 MHz ± 100 ppm clock from external osc  
16  
13  
O, LVCMOS  
O, OD  
Goes high when CDR lock is attained on the corresponding channel.  
Note that this pin is shared with strap input functions read at startup  
LOS/INT#  
Output is driven LOW when a valid signal is present on CH A. Output is  
released when signal on CH A is lost (LOS). This output can be  
redefined as an INT# signal which will be driven LOW if the EOM check  
returns a value below the HEO/VEO interrupt threshold(1)  
SMBus MODE PINS  
ENSMB  
3
I, 4-Level  
System Management Bus (SMBus) enable pin  
HIGH = Register Access, SMBus Slave mode  
FLOAT = SMBus Master read from External EEPROM  
LOW = External Pin Control Mode  
SDA  
SCL  
4
5
I, 4-Level  
O, OD  
Data Input / Open Drain Output  
External pull-up resistor is required. Pin is 3.3 V LVCMOS tolerant(2)  
I, 4-Level  
O, OD  
Clock input in SMBus slave mode. Can also be an open drain output in  
SMBus master mode  
Pin is 3.3 V LVCMOS Tolerant(2)  
TX_DIS  
6
I, 4-Level  
Disable the transmitter and put the device in low power mode  
HIGH = OUTA Enabled/OUTB Disabled  
LOW = OUTA/OUTB Enabled (normal operation)  
ADDR0  
16  
10  
9
I, LVCMOS  
IO, LVCMOS  
I, 4-Level  
This pin sets the SMBus address for the retimer.  
This pin is a strap input. The state is read on power-up to set the SMBus  
address in SMBus control mode(2)  
ADDR1/DONE#  
READEN#  
This pin sets the SMBus address for the retimer in SMBus Slave Mode.  
Goes low to indicate that the SMBus master EEPROM read has been  
completed in SMBus Master Mode(2)  
Initiates SMBus master EEPROM read. When multiple DS110DS111 are  
connected to a single EEPROM, the READEN# input can be  
daisychained to the DONE# output. Pull low for proper register  
operation(2)  
(1) The LOS/INT# pin is an open drain output which requires external pull-up resistor to 3.3V to achieve a HIGH level.  
(2) This pin is shared with other functions.  
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PIN DESCRIPTIONS (continued)  
PIN NAME  
PIN #  
I/O TYPE  
DESCRIPTION  
(3)  
PIN CONTROL (ENSMB = LOW)  
DEMA  
DEMB  
LBK  
4
5
6
I, 4-Level  
I, 4-Level  
I, 4-Level  
Set CHA output de-emphasis level in pin control mode(4)  
Set CHB output de-emphasis level in pin control mode(4)  
HIGH = INA goes to OUTA, INB goes to OUTB  
LOW = INA goes to OUTB, INB goes to OUTA(4)  
VODA  
VODB  
POWER  
VDD  
9
I, 4-Level  
I, 4-Level  
Set CHA output launch amplitude in pin control mode(4)  
Set CHB output launch amplitude in pin control mode(4)  
10  
21, 22  
15  
Power  
Power  
Power  
VDD = 2.5 V +/- 5%  
3.3V Mode Operation: VDD Supply Output = 2.5V +/- 5%  
2.5V Mode Operation: VDD Supply Input = 2.5V +/- 5%  
VIN  
Regulator Input with Integrated Supply Mode Control  
3.3V Mode Operation: VIN Supply Input = 3.3V +/- 10%  
2.5V Mode Operation: VIN Supply Input = 2.5V +/- 5%  
DAP  
PAD  
Ground reference  
The exposed pad at the center of the package must be connected to  
ground plane of the board with at least 4 vias to lower the ground  
impedance and improve the thermal performance of the package  
(3) When in pin control mode, the production silicon DS110DF111 device operates at 1.25 and 10.3125 Gbps and has limited VOD and De-  
Emphasis control.  
(4) This pin is shared with other functions.  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
ABSOLUTE MAXIMUM RATINGS  
MIN  
-0.5  
-0.5  
-0.5  
-0.5  
-0.5  
-0.5  
-0.5  
-30  
MAX  
+2.75  
+3.6  
UNITS  
V
Supply Voltage (VDD  
)
Supply Voltage (VIN  
)
V
LVCMOS Input/Output Voltage  
4-Level Input Voltage (2.5V mode)  
4-Level Input Voltage (3.3V mode)  
SMBus Input/Output Voltage  
CML Input Voltage  
2.75  
V
VDD + 0.5  
3.6  
V
V
3.6  
V
VDD + 0.5  
+30  
V
CML Input Current  
mA  
°C  
kV  
kV  
Storage Temperature  
-40  
+125  
HBM, STD - JESD22-A114F  
> 2.5  
CDM, STD - JESD22-C101-D  
> 1.0  
ESD Rating  
Package Thermal  
Resistance  
θJA, No Airflow, 4 Layer  
42.0°C/W  
For soldering specifications, see product folder at www.ti.com  
RECOMMENDED OPERATING CONDITIONS  
MIN  
2.375  
3.0  
TYP  
2.5  
3.3  
25  
MAX  
2.625  
3.6  
UNIT  
2.5V Mode  
Supply Voltage  
3.3V Mode  
V
Ambient Temperature  
SMBus (SDA, SCL)  
-40  
+85  
°C  
V
3.0  
3.3  
3.6  
4
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DS110DF111  
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SNLS461 MAY 2013  
ELECTRICAL CHARACTERISTICS  
PARAMETER  
CONDITIONS  
MIN  
8.5  
TYP  
MAX  
11.3  
400  
UNIT  
Gbps  
KHz  
R_baud  
FSDC  
Input baud rate  
SMBus Clock Rate  
Clock Rate  
Full Rate: DS110DF111  
100  
REFCLK  
+/- 100 ppm  
25.0  
MHz  
Power Supply Current  
11.3 Gbps : DS110DF111  
170  
150  
mA  
mA  
11.3 Gbps : DS110DF111  
DFE Disabled  
Current Consumption  
(Whole Device)  
IDD  
Maximum Transient Supply Current  
Default Settings: CHA and CHB  
valid input signal detected  
235  
300  
mA  
CHA and CHB acquiring LOCK  
50 Hz to 100 Hz  
100 Hz to 10 MHz  
10 MHz to 5.0 GHz  
100  
40  
mVp-p  
mVp-p  
mVp-p  
NTps  
Supply Noise Tolerance  
10  
LVCMOS (LBK, READEN#, DONE#, LOCK)  
VIH  
VIL  
High level input voltage  
Low level input voltage  
High level output voltage  
Low level output voltage  
Input leakage current  
2.5V or 3.3V Supply Modes  
2.5V or 3.3V Supply Modes  
IOH = -3 mA  
1.7  
2.0  
V
0.7  
VOH  
VOL  
IIN  
V
IOL = 3 mA  
0.4  
VINPUT = GND or VIN  
-15  
+15  
uA  
4-Level Inputs (ENSMB, DEMA, DEMB, TX_DIS, VODA, VODB)  
IIN-R  
Input leakage current  
VINPUT = GND or VIN  
IOL = 3 mA  
-160  
+80  
0.4  
uA  
V
Open Drain (LOS/INT#)  
VOL  
Low level output voltage  
SIGNAL DETECT  
Signal Detect:  
ON Threshold Level  
Default level to assert  
Signal Detect, 10.3125 Gbps  
SDH  
SDL  
20  
15  
mVp-p  
mVp-p  
Signal Detect:  
OFF Threshold Level  
Default level to de-assert  
Signal Detect, 10.3125 Gbps  
CML RX Inputs  
R_Rd  
DC Input differential Resistance  
100  
-19  
-14  
-8  
SDD11 10 MHz  
RLRX-IN  
Input Return-Loss  
SDD11 2.0 GHz  
dB  
SDD11 6.0 - 11.1 GHz  
VRX-  
LAUNCH  
Source Transmit Signal Level  
600  
1600  
675  
mVp-p  
CML TX Outputs  
T_VDIFF0  
Output differential voltage  
Default setting, PRBS31  
400  
550  
mVp-p  
mVp-p  
Maximum setting, PRBS31  
Requires SMBus Control  
T_VDIFF7  
Output differential voltage  
1000  
1250  
Maximum setting, VOD and DE  
Requires SMBus Control  
Input: 10.3125Gbps, 64T pattern  
VOD_DE  
T_Rd  
De-emphasis Level  
-12  
100  
36  
dB  
DC Output Differential Resistance  
Output Rise/Fall Time  
Full Slew Rate  
20% - 80%  
TR/TF  
psec  
Input: 10.3125 Gbps, 8T Pattern  
Limited Slew Rate (Reg 0x18)  
20% - 80%  
TRS/TFS  
Output Rise/Fall Time  
50  
psec  
Input: 10.3125 Gbps, 8T Pattern  
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ELECTRICAL CHARACTERISTICS (continued)  
PARAMETER  
CONDITIONS  
MIN  
TYP  
-19  
MAX  
UNIT  
SDD22 10 MHz - 2 GHz  
SDD22 5.5GHz  
TSDD22  
Output differential mode return loss  
-15  
dB  
SDD22 11.1GHz  
-11  
TPD  
Propagation Delay  
Propagation Delay  
Retimed Data 10.3125 Gbps  
Raw Data  
350  
200  
psec  
psec  
TPD-RAW  
Transmit Jitter Specs(1)  
TTJ  
TRJ  
TDJ  
Total Jitter (1E-12)  
PRBS7, 10.3125 Gbps  
PRBS7, 10.3125 Gbps  
PRBS7, 10.3125 Gbps  
7.5  
0.33  
3.6  
ps  
ps (RMS)  
ps  
Random Jitter  
Deterministic Jitter  
(1) Rj and Dj Jitter decomposition as reported by TEK DSA8200 Sampling scope using a 80E09 Electrical sampling module, 80A06 Pattern  
trigger, and 82A04 Phase Reference Module.  
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ELECTRICAL CHARACTERISTICS (continued)  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
Clock and Data Recovery  
BWPLL  
JTOL  
PLL Bandwidth -3 dB  
Total jitter tolerance  
CDR Lock Time  
Measured at 10.3125 Gbps  
5
> 0.70  
10 - 30  
125  
MHz  
UI  
Jitter per SFF-8431 Appendix D.11  
Combination of Dj, Pj, and Rj  
Standards Based(2)  
TLOCK1  
mS  
0C  
Lock Temperature Range  
-40C to 85C operating range  
TEMPLOCK CDR Lock  
Serial Bus Interface Characteristics(3)  
Data, Clock Input Low Voltage  
(SDA / SCL)  
VIL  
0.8  
3.6  
V
V
Data, Clock Input High Voltage  
(SDA / SCL)  
VIH  
2.1  
VHY  
VOL  
Input Hystersis  
>50  
mV  
V
Output Low Voltage  
SDA or SCL, IOL = 1.25 mA  
0
0.36  
+15  
SDA or SCL, VINPUT = VIN, VDD  
GND  
,
IIN  
Input Current  
-15  
uA  
TR  
SDA Rise Time, Read Operation  
SDA Fall Time, Read Operation  
Setup Time, Read Operation  
Hold Time, Read Operation  
Input Filter  
SDA, RPU = 10K, Cb < 400 pF  
SDA, RPU = 10K, Cb < 400 pF  
430  
20  
ns  
ns  
ns  
ns  
ns  
pF  
TF  
TSU;DAT  
THD;DAT  
TSP  
560  
615  
50  
CIN  
Input Capacitance  
SDA or SCL  
< 5  
Recommended Timing for the Serial Bus Interface  
FSCL  
SCL Clock Frequency  
SCL Low Period  
400  
0.9  
KHz  
us  
us  
us  
us  
us  
ns  
us  
TLOW  
1.3  
0.6  
0.6  
0.6  
0
THIGH  
SCL High Period  
THD;STA  
TSU;STA  
THD;DAT  
TSU;DAT  
TSU;STO  
Hold Time, Start Operation  
Setup Time, Start Operation  
Data Hold Time  
Data Set Up Time  
100  
0.6  
Set Up Time, Stop Condtion  
Bus Free Time  
Between Stop - Start  
TBUF  
1.3  
us  
TR  
TF  
SCL and SDA, Rise Time  
SCL and SDA, Rise Time  
300  
300  
ns  
ns  
(2) The typical LOCK time can vary based on data-rate, input channel, and specific DS110DF111 settings.  
(3) EEPROM interface requires 400 KHz capable EEPROM device.  
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FUNCTIONAL DESCRIPTION  
1 of 2 Channels - DS110RT111  
EQ  
OUTBUF  
Retimer  
IN+  
IN-  
OUT+  
OUT-  
100Ω  
100Ω  
CDR  
SMBus  
SCL  
SDA  
Signal  
Detect  
SMBus  
Figure 1. DS110DF111 Data Path Block Diagram  
The DS110DF111 is a low-power, multi-rate, 2-channel retimer. Both channels operate independently. Each  
channel includes a Continuous Time Linear Equalizer (CTLE) which compensates for the presence of a  
dispersive transmission channel between the source and the DS110DF111's input. Each channel includes an  
independent Voltage-Controlled Oscillator (VCO) and Phase-Locked Loop (PLL) which produce a clean clock.  
The clean clock produced by the VCO and the PLL is phase-locked to the incoming data clock, but the high-  
frequency jitter on the incoming data is attenuated by the PLL, producing a clean clock with substantially reduced  
jitter. This clean clock is used to retime the incoming data, removing high-frequency jitter from the data stream  
and producing a data output signal with reduced jitter. This provides the Clock and Data Recovery (CDR)  
function of the retimer.  
Each channel of the DS110DF111 features an output driver with settable differential output voltage and settable  
output de-emphasis. The output de-emphasis compensates for dispersion in the transmission channel at the  
output of the DS110DF111.  
DEVICE DATA PATH OPERATION  
The data path operation of the DS110DF111 comprises three functional sections as shown in the data path block  
diagram of Figure 1. The three functional sections are as follows.  
Channel Equalization  
Clock and Data Recovery  
Output Driver  
CHANNEL EQUALIZATION  
Physical transmission media comprising traces on printed circuit boards (PCBs) or copper cables exhibit a low-  
pass frequency response characteristic. The magnitude of the high frequency loss varies with the length of the  
transmission medium and with the loss of the materials which comprise it. This differential high frequency loss  
and the frequency-dependent group delay of the transmission medium introduce inter-symbol interference in the  
high-speed broadband signals propagating through the transmission medium.  
To make configuration of these settings easier, the DS110DF111 is designed to determine the correct settings  
for the CTLE autonomously by automatically adapting these equalizations to the input transmission medium. The  
automatic adaptation takes place when a signal is first detected at the input to the DS110DF111, immediately  
after the DS110DF111 acquires phase lock.  
The automatic adaptation is also triggered whenever the CDR circuitry is reset. The DS110DF111 uses its  
internal eye monitor to generate a figure of merit for the adaptation. The DS110DF111 adjusts its CTLE boost  
settings in a systematic way to optimize this figure of merit.  
8
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The DFE discriminates against input noise and random jitter as well as against crosstalk at the input to the  
DS110DF111. The DFE tap weights and polarities are adaptive and operate in conjunction with the CTLE to  
achieve an acceptable BER with more severe channel impairments.  
CLOCK AND DATA RECOVERY  
The DS110DF111 performs its clock and data recovery function by detecting the bit transitions in the incoming  
data stream and locking its internal VCO to the clock represented by the mean arrival times of these bit  
transitions. This process produces a recovered clock with greatly reduced jitter at jitter frequencies outside the  
bandwidth of the CDR Phase-Locked Loop (PLL). This is the primary benefit of using the DS110DF111 in a  
system. It significantly reduces the jitter present in the data stream, in effect resetting the jitter budget for the  
system.  
OUTPUT DRIVER  
Once the input data has been retimed by the DS110DF111 to the recovered, cleaned, clock, it is output to the  
next device in the signal path using the output driver. The DS110DF111 is commonly used in applications where  
lossy transmission media exist both at the input and the output of the DS110DF111. The CTLE compensates for  
lossy transmission media at the input to the DS110DF111. The output de-emphasis compensates for the lossy  
transmission medium at the output of the DS110DF111.  
When there is a transition in the output data stream, the output differential voltage reaches its configured  
maximum value within the configured rise/fall time of the output driver. Following this, the differential voltage  
rapidly falls off until it reaches the configured VOD level minus the configured de-emphasis level. This  
accentuates the high-frequency components of the output driver signal at the expense of the low frequency  
components. The pre-distorted DS110DF111 output signal, with high-frequency components emphasized relative  
to its low frequency components, exhibits less inter-symbol interference after traveling down a dispersive  
transmission medium than an undistorted output signal.  
An idealized transmit waveform with analog de-emphasis applied  
1
0.5  
0
-0.5  
-1  
0
1
2
3
4
5
6
7
8
9
10  
Figure 2. Idealized De-Emphasis Waveform  
The output driver is capable of driving variable output voltages with variable amounts of analog de-emphasis.  
The output voltage and de-emphasis level can be configured by writing registers over the SMBus. The  
DS110DF111 cannot determine independently the appropriate output voltage or de-emphasis setting, so the user  
is responsible for configuring these parameters. They can be set for each channel independently.  
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REFERENCE CLOCK  
A 25 MHz +/- 100 ppm reference clock is required for proper device operation. The DS110DF111 uses the  
reference clock to determine when its VCO is properly phase-locked to the incoming data-rate. The  
DS110DF111 does not include a crystal driver, so a stand-alone external oscillator is required.  
The DS110DF111 is set to phase lock to a constrained set of data-rates, the digital circuitry in the device pre-  
configures the VCO frequency. This enables the DS110DF111 to detect very quickly that a loss of lock has  
occurred.  
The phase noise of the reference clock is not critical. Any commercially-available 25 MHz oscillator (+/- 100ppm  
maximum) can provide an acceptable reference clock. The 25 MHz clock high level input voltage must match the  
VIN level utilized on the DS110DF111.  
CONTROL PINS  
The 4-level input pins utilize a resistor divider to help set the 4 valid levels and provide a wider range of control  
settings when ENSMB=0. There is an internal 30K pull-up and a 60K pull-down connected to the package pin.  
These resistors, together with the external resistor connection combine to achieve the desired voltage level.  
Using the 1K pull-up, 1K pull-down, no connect, and 20K pull-down provide the optimal voltage levels for each of  
the four input states.  
Table 1. 4-Level Inputs  
LEVEL  
SETTING  
1K to GND  
20K to GND  
No connection  
1K to VIN  
VOLTAGE  
0.1 V  
0
R
0.33 * VIN  
0.67 * VIN  
VIN - 0.05V  
Float  
1
In order to minimize the startup current associated with the integrated 2.5V regulator the 1K pull-up / pull-down  
resistors are recommended. If several 4 level inputs require the same setting, it is possible to combine two or  
more 1K resistors into a single lower value resistor. As an example; combining two inputs with a single 500 Ohm  
resistor is a good way to save board space.  
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SMBus INTERFACE  
ENSMB PIN DESCRIPTION  
To select different programming device, the ENSMB pin selects the control modes. The DS110DF111device can  
be programmed using external pin control, a SMBus controller, or through an EEPROM configuration load.  
Table 2. ENSMB Control Description  
ENSMB PIN  
DESCRIPTION  
READEN# Pin  
Pull Low to initiate reading configuration data from  
the EEPROM  
High  
SMBus Slave Mode  
Tie Low to enable proper address strapping on  
power up  
Float  
SMBus Master Mode  
R
N/A  
Low  
Pin Mode Control  
Shared with VODA pin control function  
SMBus REGISTER MODE CONTROL  
SDA and SCL  
To select different programming device, the ENSMB pin selects the control modes. The DS110DF111device can  
be programmed using external pin control, a SMBus controller, or through an EEPROM configuration load.  
SMBus Master mode and SMBus Slave Mode  
In SMBus master mode the DS110DF111 reads its initial configuration from an external EEPROM upon  
powerup. Once the DS100DF410 has finished reading its initial configuration from the external EEPROM in  
SMBus master mode it reverts to SMBus slave mode and can be further configured by an external controller over  
the SMBus. Two device pins initiate reading the configuration from the external EEPROM and indicate when the  
configuration read is complete.  
DONE#  
READEN#  
These pins are meant to work together. When the DS110DF111 is powered up in SMBus master mode, it reads  
its configuration from the external EEPROM. This is triggered when the READEN# pin goes low. When the  
DS110DF111 is finished reading its configuration from the external EEPROM, it drives its DONE# pin low. In this  
mode, as the name suggests, the DS110DF111 acts as an SMBus master during the time it is reading its  
configuration from the external EEPROM. After the DS110DF111 has finished reading its configuration from the  
EEPROM, it releases control of the SMBus and becomes a SMBus slave. In applications where there is more  
than one DS110DF111 on the same SMBus, bus contention can result if more than one DS110DF111 tries to  
take command of the SMBus as the SMBus master at the same time. The READEN# and DONE# pins prevent  
this bus contention.  
In a system where the DS110DF111s are meant to operate in SMBus master mode, the READEN# pin of one  
retimer should be wired to the DONE# pin of the next. The system should be designed so that the READEN# pin  
of one (and only one) of the DS110DF111s in the system is driven low on power-up. This DS110DF111 will take  
command of the SMBus on power-up and will read its initial configuration from the external EEPROM. When it is  
finished reading its configuration, it will set its DONE# pin low. This pin should be connected to the READEN#  
pin of another DS110DF111. When this DS110DF111 senses its READEN# pin driven low, it will take command  
of the SMBus and read its initial configuration from the external EEPROM, after which it will set its DONE# pin  
low. By connecting the DONE# pin of each DS110DF111 to the READEN# pin of the next DS110DF111, each  
DS110DF111 can read its initial configuration from the EEPROM without causing bus contention.  
For SMBus slave mode, the READEN# pin must be tied LOW. Do not leave it Floating or tie it HIGH.  
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Address Lines  
In either SMBus mode the DS110DF111 must be assigned a SMBus address. A unique address should be  
assigned to each device on the SMBus.  
The SMBus address is latched into the DS110DF111 on power-up. The address is read in from the state of the  
ADR[1:0] lines upon power-up. A floating address line input will be interpreted as a logic 0.  
The DS110DF111 can be configured with any of 4 SMBus addresses. The SMBus addressing scheme uses the  
least significant bit of the SMBus address as the Write/Read_N address bit. When an SMBus device is  
addressed for writing, this bit is set to 0; for reading, to 1. Table 3 shows the write address setting for the  
DS110DF111versus the values latched in on the address line at power-up.  
Device Configuration in SMBus Slave Mode  
The configurable settings of the DS110DF111 may be set independently for each channel at any time after  
power up using the SMBus. A register write is accomplished when the controller sends a START condition on the  
SMBus followed by the Write address of the DS110DF111 to be configured. See Table 3 for the mapping of the  
address lines to the SMBus Write addresses. After sending the Write address of the DS110DF111, the controller  
sends the register address byte followed by the register data byte. The DS110DF111 acknowledges each byte  
written to the controller according to the data link protocol of the SMBus Version 2.0 Specification. See this  
specification for additional information on the operation of the SMBus.  
There are two types of device registers in the DS110DF111. These are the control/shared registers and the  
channel registers. The control/shared registers control or allow observation of settings which affect the operation  
of all channels of the DS110DF111. They are also used to select which channel of the device is to be the target  
channel for reads from and writes to the channel registers.  
The channel registers are used to set all the configuration settings of the DS110DF111. They provide  
independent control for each channel of the DS110DF111 for all the settable device characteristics. Any registers  
not described in the tables that follow should be treated as reserved. The user should not try to write new values  
to these registers. The user-accessible registers described in the tables that follow provide a complete capability  
for customizing the operation of the DS110DF111 on a channel-by-channel basis.  
Bit Fields in the Register Set  
Many of the registers in the DS110DF111 are divided into bit fields. This allows a single register to serve multiple  
purposes, which may be unrelated. Often configuring the DS110DF111 requires writing a bit field that makes up  
only part of a register value while leaving the remainder of the register value unchanged.  
Writing to and Reading From the Control/Shared Registers  
Any write operation targeting register 0xff writes to the control/shared register 0xff. This is the only register in the  
DS110DF111 with an address of 0xff. Bit 2 of register 0xff is used to select either the control/shared register set  
or a channel register set. If bit 2 of register 0xff is cleared (written with a 0), then all subsequent read and write  
operations over the SMBus are directed to the control/shared register set. This situation persists until bit 2 of  
register 0xff is set (written with a 1). There is a register with address 0x00 in the control/shared register set, and  
there is also a register with address 0x00 in each channel register set. If you read the value in register 0x00  
when bit 2 of register 0xff is cleared to 0, then the value returned by the DS110DF111 is the value in register  
0x00 of the control/shared register set. If you read the value in register 0x00 when bit 2 of register 0xff is set to 1,  
then the value returned by the DS110DF111 is the value in register 0x00 of the selected channel register set.  
The channel register set is selected by bits 1:0 of register 0xff. If bit 3 of register 0xff is set to 1 and bit 2 of  
register 0xff is also set to 1, then any write operation to any register address will write all the channel register  
sets in the DS110DF111 simultaneously. This situation will persist until either bit 3 of register 0xff or bit 2 of  
register 0xff is cleared.  
Note that when you write to register 0xff, independent of the current settings in register 0xff, the write operation  
ALWAYS targets the control/shared register 0xff. This channel select register, register 0xff, is unique in this  
regard. Table 4 shows the control/shared register set.  
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Table 3. SMBus Write Address Assignment(1)  
ADDR1  
ADDR0  
SMBus WRITE ADDRESS  
SMBus READ ADDRESS  
0
0
1
1
0
1
0
1
0x30  
0x32  
0x34  
0x36  
0x31  
0x33  
0x35  
0x37  
(1) A floating ADDR[1:0] pin at power-up will be interpreted as a logic 0.  
Table 4. Control and Shared Register Space  
DEFAULT  
REGISTER  
VALUE (HEX)  
DEFAULT BIT  
VALUE  
(BINARY)  
ADDRESS  
(HEX)  
BITS  
MODE  
DESCRIPTION  
0x00  
0x01  
00  
7:4  
7:5  
4:0  
6
0000  
R
SMBus Address Strap Observation <3:0>  
Device Revision  
011  
R
R
40  
0 0000  
Device ID  
0x04  
0x05  
0
0
0
0
0
0
R/W/SC  
R/W  
R/W  
R
Self-Clearing Reset for Control/Shared Registers  
Reset for SMBus Master Mode  
01  
5
4
Force EEPROM Configuration  
4
Indicates EEPROM read complete  
Indicates Channel A has interrupted  
Indicates Channel B has interrupted  
00  
00  
3
R
2
R
0x06  
0x07  
Write to 0xA’h to observe SMBus Address strap in Reg  
0x00[7:4]  
3:0  
1
0000  
R/W  
R/W  
R/W  
Loopback:  
0
0
Loopback Input of Channel A to output of Channel B  
04  
Loopback:  
0
Loopback Input of Channel B to output of Channel A  
0xff  
Controls LOCK pin output  
00: Logical AND of Lock Status from CH A and CH B  
01: Lock Status from Channel A  
7:6  
00  
R/W  
10: Lock Status from Channel B  
11: Logical OR of Lock Status from CH A and CH B  
Loss of Signal / Interrupt (LOS/INT) pin output  
5
3
0
0
R/W  
R/W  
0: LOS  
1: Interrupt  
00  
Selects Both Channels for Register Write. Register read from  
one channel based on the selected channel in register 0xff bits  
1:0. See Table 5  
0 = reads/writes directed to shared registers  
2
0
0
R/W  
R/W  
1 = reads/writes directed to channel registers based on target  
channel defined by register 0xff bits 1:0. See Table 5  
Selects Target Channel for Register Reads and Writes. See  
Table 5  
1:0  
SMBus Strap Observation  
Register 0x00, bits 7:4  
In order to communicate with the DS110DF111 over the SMBus, it is necessary for the SMBus controller to know  
the address of the DS110DF111. The address strap observation bits in control/shared register 0x00 are primarily  
useful as a test of SMBus operation. In order to use the address strap observation bits of control/shared register  
0x00, it is necessary first to set the diagnostic test control bits of control/shared register 0x06. This four bit field  
should be written with a value of 0xa. When this value is written to bits 3:0 of control/shared register 0x06, then  
the value of the SMBus address straps can be read in register 0x00, bits 7:4. The value read will be the same as  
the value present on the ADDR line when the DS110DF111 powers up. For example, if a value of 0x0 is read  
from control/shared register 0x00, bits 7:4, then at power-up the ADDR line was set to 0. The DS110DF111 is set  
to a SMBus Write address of 0x30.  
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Interrupt Channel Flag Bits  
Register 0x05, bits 3:2  
The operation of these bits is described in the section on interrupt handling later in this data sheet.  
Control/Shared Register Reset  
Register 0x04, bit 6  
Register 0x04, bit 6, clears all the control/shared registers back to their factory defaults. This bit is self clearing,  
so it is cleared after it is written and the control/shared registers are reset to their factory default values.  
Device Revision and Device ID  
Register 0x01  
Control/shared register 0x01 contains the device revision and device ID. The device ID will be different for the  
different devices in the retimer family. This register is useful because it can be interrogated by software to  
determine the device variant and revision installed in a particular system. The software might then configure the  
device with appropriate settings depending upon the device variant and revision.  
Table 5. Channel Select Register Values Mapped to Register Set Target  
BROADCAST  
CHANNEL  
REGISTER  
SELECTION  
TARGETED  
CHANNEL  
REGISTER  
SELECTION  
SHARED/CHANNEL  
REGISTER  
REGISTER 0xFF  
VALUE (HEX)  
COMMENTS  
SELECTION  
0x00  
0x01  
0x02  
0x03  
0x04  
0x05  
0x08  
0x09  
0x0a  
0x0b  
Shared  
Shared  
Shared  
Shared  
Channel  
Channel  
Shared  
Shared  
Shared  
Shared  
N/A  
N/A  
N/A  
N/A  
No  
N/A  
N/A  
N/A  
N/A  
A
All reads and writes target shared register set  
All reads and writes target shared register set  
All reads and writes target shared register set  
All reads and writes target shared register set  
All reads and writes target channel register set  
All reads and writes target channel register set  
All reads and writes target channel register set  
All reads and writes target shared register set  
All reads and writes target shared register set  
All reads and writes target shared register set  
No  
B
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
All writes target all channel register sets, all reads  
target Channel A register set  
0x0c  
0x0d  
Channel  
Channel  
Yes  
Yes  
A
B
All writes target all channel register sets, all reads  
target Channel B register set  
Channel Select Register  
Register 0xff, bits 3:0  
Register 0xff, as described above, selects the channel or channels for channel register reads and writes. It is  
worth describing the operation of this register again for clarity. If bit 3 of register 0xff is set, then any channel  
register write applies to all channels. Channel register read operations always target only the channel specified in  
bits 1:0 of register 0xff regardless of the state of bit 3 of register 0xff. Read and write operations target the  
channel register sets only when bit 2 of register 0xff is set.  
Bit 2 of register 0xff is the universal channel register enable. This bit must be set in order for any channel register  
reads and writes to occur. If this bit is set, then read operations from or write operations to register 0x00, for  
example, target channel register 0x00 for the selected channel rather than the control/shared register 0x00. In  
order to access the control/shared registers again, bit 2 of register 0xff should be cleared. Then the  
control/shared registers can again be accessed using the SMBus. Write operations to register 0xff always target  
the register with address 0xff in the control/shared register set. There is no other register, and specifically, no  
channel register, with address 0xff.  
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The contents of the channel select register, register 0xff, cannot be read back over the SMBus. Read operations  
on this register will always yield an invalid result. All eight bits of this register should always be set to the desired  
values whenever this register is written. Always write 0x0 to the four most significant bits of register 0xff. The  
register set target selected by each valid value written to the channel select register is shown in Table 5.  
Reading to and Writing From the Channel Registers  
Each channel has a complete set of channel registers associated with it. The channel registers or the control/  
shared registers are selected by channel select register 0xff. The settings in this register control the target for  
subsequent register reads and writes until the contents of register 0xff are explicitly changed by a register write  
to register 0xff. As noted, there is only one register with an address of 0xff, the channel select register.  
Table 6. Channel Register Definition  
DEFAULT  
REGISTER  
VALUE (HEX)  
ADDRESS  
(HEX)  
DEFAULT BIT  
VALUE (BINARY)  
BITS  
MODE  
DESCRIPTION  
Reset Channel Registers to Defaults  
(Self-clearing)  
0x00  
0x01  
00  
00  
2
0
R/W/SC  
4
0
0
0
R
R
CDR Lock Loss Interrupt  
Signal Detect Loss Interrupt  
CDR Status [7:0]  
Bit[7] = PPM Count met  
Bit[6] = Auto Adapt Complete  
Bit[5] = Fail Lock Check  
Bit[4] = Lock  
0x02  
0x03  
00  
00  
7:0  
00’h  
R
Bit[3] = CDR Lock  
Bit[2] = Single Bit Limit Reached  
Bit[1] = Comp LPF High  
Bit[0] = Comp LPF Low  
7:6  
5:4  
3:2  
00  
00  
00  
R/W  
R/W  
R/W  
Used for setting CTLE value when Channel  
Register 0x2D[3] is high. Read-back value going  
to analog in Channel Register 0x52.  
CTLE Boost Stage [0] <1:0> Bits [7:6]  
CTLE Boost Stage [1] <1:0> Bits [5:4]  
CTLE Boost Stage [2] <1:0> Bits [3:2]  
CTLE Boost Stage [3] <1:0> Bits [1:0]  
1:0  
00  
R/W  
Enable Override Output Mux  
(Register 0x1E[7:5])  
5
2
0
0
R/W  
R/W  
0x09  
0x0A  
00  
10  
Enable Override Divider Select  
(Register 0x18[6:4])  
3
2
0
0
R/W  
R/W  
R/W  
Enable CDR Reset Override (Register 0x0A[2])  
CDR Reset Override Bit  
7:4  
0000  
Status Control[3:0]  
Single Bit Transition Detector – Lock  
Qualification  
1: Enables SBT  
0x0C  
0x0D  
08  
00  
3
5
1
0
R/W  
R/W  
0: Disables SBT  
PRBS pattern shift Enable.  
Use in conjunction with 0x1E[4] and 0x30[3] to  
start PRBS.  
Note: This bit must be set high last.  
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Table 6. Channel Register Definition (continued)  
DEFAULT  
REGISTER  
VALUE (HEX)  
ADDRESS  
(HEX)  
DEFAULT BIT  
VALUE (BINARY)  
BITS  
MODE  
DESCRIPTION  
Eye Opening Monitor Voltage Range <1:0>  
00: 3.125 mV  
7:6  
00  
R/W  
01: 6.250 mV  
10: 9.375 mV  
11: 12.500 mV  
5
3
1
0
R/W  
R/W  
Eye Opening Monitor Power Down  
DFE Tap 2 Polarity  
(Use w/manual DFE override, 0x15[7])  
0x11  
20  
DFE Tap 3 Polarity  
(Use w/manual DFE override, 0x15[7])  
2
1
0
7
0
0
0
1
R/W  
R/W  
R/W  
R/W  
DFE Tap 4 Polarity  
(Use w/manual DFE override, 0x15[7])  
DFE Tap 5 Polarity  
(Use w/manual DFE override, 0x15[7])  
DFE Tap 1 Polarity  
(Use w/manual DFE override, 0x15[7])  
0x12  
0x13  
A0  
90  
5
4:0  
4
1
0000  
1
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
DFE Select negative gm  
DFE Tap 1 Weight <4:0>  
Enable DC offset control  
2
0
CTLE Boost Stage 3, Bit 2 (Limiting Bit)  
Enable DWDM Mode  
1
0
7
0
Force Signal Detect On  
6
0
Force Signal Detect Off  
0x14  
0x15  
00  
10  
5:4  
3:2  
00  
00  
Signal Detect – Assert Reference Levels  
Signal Detect – De-assert Reference Levels  
Enables manual DFE tap settings  
Use with 0x11[3:0], 0x12[7], 0x12[4:0], 0x20[7:0],  
0x21[7:0]  
7
0
R/W  
6
3
0
0
R/W  
R/W  
Compress the range of de-emphasis to 0-6 dB  
Driver Power-Down  
Driver De-emphasis Setting<2:0>; 0dB - 12dB;  
See Table 16  
2:0  
000  
R/W  
VCO Divider Ratio <2:0>  
(Enable from Register 0x09, Bit 2)  
000: Full-Rate  
6:4  
000  
R/W  
001: Divide by 2  
010: Divide by 4  
0x18  
40  
011: Divide by 8  
100: Default value at power up  
2
0
R/W  
R/W  
Enable slow rise/fall time edge rate  
Selects PFD MUX for Loopback  
000: Raw Data  
001: Re-timed Data  
100: PRBS Generator  
111: Mute  
7:5  
111  
0x1E  
E1  
Enable the PRBS serializer, used with 0x1E[7:5],  
0x30[3:0], 0x0D[5]  
4
0
R/W  
3
7
0
0
R/W  
R/W  
Disable the DFE function (Disable = 1)  
Invert the polarity of the driver  
0x1F  
0x20  
55  
00  
DFE Tap 5 Weight <3:0>  
(Use w/manual DFE override, 0x15[7])  
7:4  
3:0  
0000  
0000  
R/W  
R/W  
DFE Tap 4 Weight <3:0>  
(Use w/manual DFE override, 0x15[7])  
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Table 6. Channel Register Definition (continued)  
DEFAULT  
REGISTER  
VALUE (HEX)  
ADDRESS  
(HEX)  
DEFAULT BIT  
VALUE (BINARY)  
BITS  
MODE  
DESCRIPTION  
DFE Tap 3 Weight <3:0>  
(Use w/manual DFE override, 0x15[7])  
7:4  
3:0  
0000  
0000  
R/W  
R/W  
0x21  
0x23  
00  
40  
DFE Tap 2 Weight <3:0>  
(Use w/manual DFE override, 0x15[7])  
6
7
2
1
0
0
R/W  
R/W  
DFE Override  
Enable Fast Eye Opening Monitor Mode  
Start DFE Adaptation (Self- Clearing)  
R/W/SC  
0x24  
00  
Start Eye Opening Monitor Counter  
(Self-Clearing)  
0
0
R/W/SC  
0x25  
0x26  
00  
00  
7:0  
7:0  
00’h  
00’h  
R
R
Eye Opening Monitor Count <15:8>  
Eye Opening Monitor Count <7:0>  
HEO Value <7:0>  
(Measured in 0-63 phase settings)  
0x27  
0x28  
00  
00  
7:0  
7:0  
00’h  
00’h  
R
R
VEO Value <7:0>  
Eye Opening Monitor Voltage Range Setting  
0x29  
0x2A  
00  
30  
6:5  
7:0  
00  
R
<1:0>  
See 0x11[7:6]  
30’h  
R/W  
Eye Opening Monitor Timer Threshold <7:0>  
DFE Adaptation Figure of Merit Type <1:0>  
00: Not Valid  
5:4  
11  
R/W  
01: State Machine uses only HEO  
10: State Machine uses only VEO  
11: State Machine uses both HEO and VEO  
0x2C  
72  
Determines number of DFE settings to look-  
beyond current best Figure of Merit (FOM)  
3:0  
0010  
R/W  
7
6
1
0
R/W  
R/W  
Enable Driver Short Circuit protection  
Enable FAST signal detect  
Increase the Assert and De-assert reference  
thresholds  
5
4
0
0
R/W  
R/W  
Set high (1) to decrease the signal detect gain  
Set high (1) to override the EQ setting going to  
3
0
R/W  
R/W  
the analog  
from 0x03[7:0]  
0x2D  
80  
Output Driver VOD [2:0]  
000: 600 mV  
001: 700 mV  
010: 800 mV  
011: 900 mV  
2:0  
000  
100: 1000 mV  
101: 1100 mV  
110: 1200 mV  
111: 1300 mV  
7:6  
5:4  
0
0
R/W  
R/W  
Rate <1:0>  
Subrate <1:0>  
CTLE Adaptation Index Override  
0: CTLE adaption will start at Reg_0x40 +  
Reg_0x39[3:0]. So this may be used to preclude  
lower CTLE settings.  
1: CTLE will not adapt and will use the CTLE  
setting of Reg_0x40 + Reg_0x39[3:0] for scalar  
divide ratios of 1 or 2. Divide ratios of 4 & 8 will  
take CTLE settings from 0x3A unless 0x55[0] is  
high, which will revert to the setting in Reg_0x40  
+ Reg_0x39[3:0].  
0x2F  
06  
3
0
0
0
R/W  
R
Start CTLE Adaptation  
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Table 6. Channel Register Definition (continued)  
DEFAULT  
REGISTER  
VALUE (HEX)  
ADDRESS  
(HEX)  
DEFAULT BIT  
VALUE (BINARY)  
BITS  
MODE  
DESCRIPTION  
4
3
0
0
R
Goes High if Interrupt from CDR Goes High  
Enable PRBS digital CLK  
0x30  
0x31  
00  
R/W  
Adaptation Mode <1:0>  
00: No adaption  
01: Adapt only CTLE till optimal  
10: Adapt CTLE till optimal, then DFE, then  
CTLE again  
11: Adapt CTLE till LOCK, then DFE, then CTLE  
till optimal  
6:5  
4:3  
10  
00  
R/W  
R/W  
40  
CTLE Adaptation Figure of Merit Type <1:0>  
00: SM uses both HEO and VEO  
01: SM uses only HEO  
10: SM uses only VEO  
11: SM uses both HEO and VEO  
HEO Interrupt Threshold <3:0>  
Compares HEO value,  
Reg_0x27[7:0] vs. threshold of Reg_0x32[7:4]*4  
7:4  
3:0  
0001  
0001  
R/W  
R/W  
0x32  
0x33  
11  
88  
VEO Interrupt Threshold <3:0>  
Compares VEO value,  
Reg_0x28[7:0] vs. threshold of Reg_0x32[3:0]*4  
HEO Threshold for CTLE Adaptation Handoff to  
DFE Adaptation  
Compares HEO value,  
7:4  
3:0  
1000  
1000  
R/W  
R/W  
Reg_0x27[7:0] vs. threshold of Reg_0x33[7:4]*2  
VEO Threshold for CTLE Adaptation Handoff to  
DFE Adaptation  
Compares HEO value,  
Reg_0x27[7:0] vs. threshold of Reg_0x33[3:0]*2  
Maximum DFE Tap Absolute Value for Taps 2–5  
<3:0>  
0x34  
0x35  
3F  
1F  
3:0  
4:0  
1111  
R/W  
R/W  
Maximum DFE Tap Absolute Value for Tap 1  
<4:0>  
1 1111  
6
0
11  
0
R/W  
R/W  
R/W  
R/W  
Enable HEO/VEO Interrupt  
Reserved  
5:4  
2
0x36  
0x39  
33  
00  
Reserved  
1:0  
11  
Reserved  
Start Index for CTLE Adaptation <4:0>  
(Enable from Register 0x2f, Bit 3)  
4:0  
7:6  
5:4  
3:2  
1:0  
0 0000  
10  
R/W  
R/W  
R/W  
R/W  
R/W  
Fixed CTLE Stage 0 Boost Setting for Divide  
Ratios 4 and 8 <1:0>  
Fixed CTLE Stage 1 Boost Setting for Divide  
Ratios 4 and 8 <1:0>  
10  
0x3A  
0x3E  
A5  
80  
Fixed CTLE Stage 2 Boost Setting for Divide  
Ratios 4 and 8 <1:0>  
01  
Fixed CTLE Stage 3 Boost Setting for Divide  
Ratios 4 and 8 <1:0>  
01  
Enable HEO/VEO lock monitoring once SBT/FLD  
declare lock. Once the lock and adaptation  
processes are complete, HEO/VEO monitoring is  
performed once per the interval determined by  
Reg_0x69[3:0].  
7
1
R/W  
0x40 - 0x4F  
CTLE Settings for Adaptation  
4
0
R/W  
R/W  
R
Slicer Sign Bit  
0x50  
0x52  
00  
00  
Slicer adjustment in 5mV steps. Maximum  
adjustment value is 50mV or 0x50[3:0] = A’h  
3:0  
7:0  
0000  
00’h  
CTLE Boost setting readback register.  
18  
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Table 6. Channel Register Definition (continued)  
DEFAULT  
REGISTER  
VALUE (HEX)  
ADDRESS  
(HEX)  
DEFAULT BIT  
VALUE (BINARY)  
BITS  
MODE  
DESCRIPTION  
7
6
1
0
0
0
0
0
R
R
R
R
Signal Detect observation bit.  
EQ Limiting (CTLE Stage 3[2]) observation bit.  
CDR Lock Interrupt  
0x54  
0x55  
00  
00  
Signal Detect Interrupt  
Allows observation of the alternate HEO/VEO  
Figure of Merit  
In Reg_0x27 and Reg_0X28  
4
0
R
0
1
0
0
0
0
R
Enables Adaption in the lower divide ratios  
CDR loss of lock. Sticky Bit. Clears when read  
Loss of Signal. Sticky Bit. Clears when read  
R/W  
R/W  
0x56  
0x60  
00  
00  
Group 0 (Rate/Subrate defined) PPM counter  
<7:0> LSBs  
7:0  
00’h  
R/W  
Override standard Group 0 tie cells for PPM  
count and tolerance with Channel Registers  
0x60, 0x61, and 0x64  
7
0
R/W  
0x61  
0x62  
0x63  
00  
00  
00  
Group 0 (Rate/Subrate defined) PPM counter  
<14:8> MSBs  
6:0  
7:0  
000 0000  
00’h  
R/W  
R/W  
Group 1 (Rate/Subrate defined) PPM counter  
<7:0> LSBs  
Override standard Group 1 tie cells for PPM  
count and tolerance with Channel Registers  
0x62, 0x63, and 0x64  
7
0
R/W  
R/W  
Group 1 (Rate/Subrate defined) PPM counter  
<14:8> MSBs  
6:0  
000 0000  
7:4  
3:0  
0000  
0000  
R/W  
R/W  
Group 0 PPM Delta  
Group 1 PPM Delta  
0x64  
0x69  
0x6A  
0x6B  
00  
0A  
44  
40  
HEO/VEO interval while monitoring lock.  
Monitoring will take place 1 out of the indicated  
count intervals (default h'A). Interval time is  
determined 0x2B[5:4], which is 6.5ms by default.  
3:0  
1010  
R/W  
7:4  
3:0  
0100  
0100  
R/W  
R/W  
Vertical Eye Opening Lock Threshold <3:0>  
Horizontal Eye Opening Lock Threshold <3:0>  
Adaptation Figure of Merit Term A<7:0>  
FoM = Min [(HEO - B)*A, (VEO - C)*(1-A)]  
FoM = Min [(HEO - 0x6C) * (0x6B)/127, (VEO -  
0x6D) * (128 - 0x6B)/127]  
7:0  
7:0  
7:0  
40’h  
0x0  
0x0  
R/W  
R/W  
R/W  
Adaptation Figure of Merit Term B<7:0>  
FoM = Min [(HEO - B)*A, (VEO - C)*(1-A)]  
FoM = Min [(HEO - 0x6C) * (0x6B)/127, (VEO -  
0x6D) * (128 - 0x6B)/127]  
0x6C  
0x6D  
00  
00  
Adaptation Figure of Merit Term C<7:0>  
FoM = Min [(HEO - B)*A, (VEO - C)*(1-A)]  
FoM = Min [(HEO - 0x6C) * (0x6B)/127, (VEO -  
0x6D) * (128 - 0x6B)/127]  
Enable Alternate Figure of Merit for CTLE  
Adaptation  
7
6
0x0  
0x0  
R/W  
R/W  
0x6E  
00  
Enable Alternate Figure of Merit for DFE  
Adaptation  
0x70  
0x71  
03  
00  
2:0  
5
011  
0
R/W  
R
CTLE Adaptation Look-Beyond Count <2:0>  
DFE Tap 1 Polarity (Read Only)  
4:0  
4
0 0000  
0
R
DFE Tap 1 Weight (Read Only) <4:0>  
DFE Tap 2 Polarity (Read Only)  
R
0x72  
00  
3:0  
0000  
R
DFE Tap 2 Weight (Read Only) <3:0>  
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Table 6. Channel Register Definition (continued)  
DEFAULT  
REGISTER  
VALUE (HEX)  
ADDRESS  
(HEX)  
DEFAULT BIT  
VALUE (BINARY)  
BITS  
MODE  
DESCRIPTION  
4
3:0  
4
0
R
R
R
R
R
R
DFE Tap 3 Polarity (Read Only)  
DFE Tap 3 Weight (Read Only) <3:0>  
DFE Tap 4 Polarity (Read Only)  
DFE Tap 4 Weight (Read Only) <3:0>  
DFE Tap 5 Polarity (Read Only)  
DFE Tap 5 Weight (Read Only) <3:0>  
0x73  
0x74  
0x75  
00  
0000  
0
00  
00  
3:0  
4
0000  
0
3:0  
0000  
Resetting Individual Channels of the Retimer  
Register 0x00, bit 2, and register 0x0a, bits 3:2  
Bit 2 of channel register 0x00 is used to reset all the registers for the corresponding channel to their factory  
default settings. This bit is self-clearing. Writing this bit will clear any register changes you have made in the  
DS110DF111 since it was powered-up.  
To reset just the CDR state machine without resetting the register values, which will re-initiate the lock and  
adaptation sequence for a particular channel, use channel register 0x0a. Set bit 3 of this register to enable the  
reset override, then set bit 2 to force the CDR state machine into reset. These bits can be set in the same  
operation. When bit 2 is subsequently cleared, the CDR state machine will resume normal operation. If a signal  
is present at the input to the selected channel, the DS110DF111 will attempt to lock to it and will adapt its CTLE  
and its DFE according to the currently configured adapt mode for the selected channel. The adapt mode is  
configured by channel register 0x31, bits 6:5.  
20  
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Rate and Subrate Setting  
Each channel of the DS110DF111 will, by default operate at 10.3125 Gbps and 1.25 Gbps. The device can be  
configured to operate at other VCO frequencies between 8.5 GHz and 11.3 GHz using the RATE (Reg: 0x2F bits  
[7:6]) and SUBRATE (Reg: 0x2F bits [5:4]) registers.  
The DS110DF111 is designed to lock to signals conforming to several different data transmission standards.  
These standards may define a single data rate or multiple data rates. The rate and subrate settings of the  
DS110DF111 may be used to select a data transmission standard to which the input signal is expected to  
conform. The DS110DF111 searches each data rate applicable to the selected standard to find a valid signal to  
which it then phase locks.  
Table 7. Rate/Subrate VCO and Data-rate Information  
GROUP 0  
DIVIDE  
RATIOS  
GROUP 1  
DIVIDE  
RATIOS  
INPUT DATA  
RATES  
GROUP 0  
VCO  
GROUP 1  
VCO  
RATE  
00  
SUBRATE  
DS110DF111 DS125DF111  
1.25G,  
10.3125G  
00  
01  
10  
11  
8
1
10G  
10.3125G  
10.51875G  
10G  
X
X
X
X
X
X
X
X
2.125G,  
4.25G, 8.5G,  
10.51875G  
00  
1, 2, 4  
1, 2, 4  
1, 2, 4  
1
8.5G  
2.5G, 5G,  
10G  
00  
1, 2, 4  
1, 2, 4  
10G  
2.4576G,  
4.9152G,  
9.8304G  
00  
9.8304G  
9.8304G  
3.072G,  
6.144G  
01  
01  
01  
00  
01  
10  
2, 4  
1, 4  
2, 4  
1, 4  
12.288G  
9.95328G  
12.0G  
12.288G  
9.95328G  
12.0G  
X
X
X
2.48832G,  
9.95328G  
X
X
1.5G, 3G,  
6G, 12G  
1, 2, 4, 8  
1, 2, 4, 8  
01  
10  
10  
10  
11  
00  
01  
10  
8.25G  
1
1
1
2
1
1
1
2
8.25G  
8.5G  
8.25G  
8.5G  
8.5G  
11.5G  
11.5G  
12.5G  
11.5G  
12.5G  
X
X
6.25G, 12.5G  
3.125G,  
6.25G  
10  
11  
2, 4  
2, 4  
12.5G  
12.5G  
X
11  
11  
11  
00  
01  
10  
10.3125G  
9.95328G  
7.5G  
1
1
1
1
1
1
10.3125G  
9.95328G  
7.5G  
10.3125G  
9.95328G  
7.5G  
X
X
X
X
1.25G,  
10.3125G  
11  
11  
8
1
10G  
10.3125G  
X
X
Overriding the CTLE Boost Setting  
Register 0x03, Register 0x2D, bit 3, and Register 0x3a  
To override the adaptive CTLE boost settings, channel register 0x03 is used in conjuction with override register  
bit for the CTLE (0x2D[3]).  
The current CTLE setting applied to the high-speed analog input can always be readback from register 0x52.  
This readback register value is valid for adaptive CTLE settings or when the override mechanism is enabled and  
the CTLE value from register 0x03 is being used.  
When in divide by 4 or 8 VCO settings, CTLE channel register 0x3A comes into play. Divide by 4 and divide by 8  
data-rates do not automatically adapt the CTLE setting, they use the value in register 0x3A as a settable CTLE  
level.  
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Table 8. Default Output Status Description  
INPUT SIGNAL  
STATUS  
CHANNEL STATUS  
OUTPUT STATUS  
Not Present  
Present  
No Signal Detected  
Not Locked  
Mute  
Mute  
Present  
Locked  
Raw or Retimed, Set by 0x1e[7], 0x09[5]  
Table 9. Output Multiplexer Override Settings,  
Retimed or Raw, Register 0x1E Bit 7  
OUTPUT  
BIT FIELD VALUE  
COMMENTS  
MULTIPLEXER  
0x1  
0x0  
Retimed Data  
Raw Data  
Default when the retimer is locked  
Output of the CTLE + DFE, before retiming  
Overriding the Output Multiplexer  
Register 0x09, bit 5, Register 0x14, bits 7:6, and Register 0x1e, bits 7:5  
By default, the DS110DF111 output for each channel will be as shown in Table 8 and Table 9.  
This default behavior can be modified by register writes. Register 0x1e, bits 7:5, contain the output multiplexer  
override value. The values of this three-bit field and the corresponding meanings of each are shown in Table 9.  
When no signal is present at the input to the selected channel of the DS110DF111 the signal detect circuitry will  
power down the channel. This includes the output driver which is therefore muted when no signal is present at  
the input.  
Table 10. Divider Ratio Map  
Bit Field Value Reg 18 [6:4]  
Divider Ratio  
0
1
2
3
1
2
4
8
22  
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Overriding the VCO Divider Selection  
Register 0x09, bit 2, and Register 0x18, bits 6:4  
In normal operation, the DS110DF111 sets its VCO divider to the correct divide ratio, either 1, 2, 4, or 8  
depending upon the bit rate of the signal at the channel input. It is possible to override the divider selection. This  
might be desired if the VCO is set to free run, for example, to output a signal at a sub-harmonic of the actual  
VCO frequency.  
In order to override the VCO divider settings, first set bit 2 of register 0x09. This is the VCO divider override  
enable. Once this bit is set, the VCO divider setting is controlled by the value in register 0x18, bits 6:4. The valid  
values for this three-bit field are 0x0 to 0x3. The mapping of the bit field values to the divider ratio is shown in  
Table 10.  
In normal operation, the DS110DF111 will determine the required VCO divider ratio automatically. In order for the  
DS110DF111 to acquire LOCK, the override divider selection must be included in the Group 0 VCO list for the  
current Rate/Subrate setting.  
Using the Internal Eye Opening Monitor  
Register 0x11, bits 7:6 and bit 5, Register 0x22, bit 7, Register 0x24, bit 7 and bit 0, Register 0x25, Register  
0x26, Register 0x27, Register 0x28, Register 0x2a and Register 0x3e, bit 7  
The DS110DF111 includes an internal eye opening monitor. The eye opening monitor is used by the retime to  
compute a figure of merit for automatic adaptation of the CTLE and the DFE. It can also be controlled and  
queried through the SMBus by a system controller.  
The eye opening monitor produces error hit counts for settable phase and voltage offsets of the comparator in  
the retimer. This is similar to the way many Bit Error Rate Test Sets measure eye opening. At each phase and  
amplitude offset setting, the eye opening monitor determines the nominal bit value (“0” or “1”) using its primary  
comparator. This is the bit value that is resynchronized to the recovered clock and presented at the output of the  
DS110DF111. The eye opening monitor also determines the bit value detected by the offset comparator. This  
information yields an eye contour. Here's how this works.  
If the offset comparator is offset in voltage by an amount larger than the vertical eye opening, for example, then  
the offset comparator will always decide that the current bit has a bit value of “0”. When the bit is really a “1”, as  
determined by the primary comparator, this is considered a bit error. The number of bit errors is counted for a  
settable interval at each setting of the offset phase and voltage of the offset comparator. These error counts can  
be read from registers 0x25 and 0x26 for sequential phase and voltage offsets. These error counts for all phase  
and voltage offsets form a 64 X 64 point array. A surface or contour plot of the error hit count versus phase and  
voltage offset produces an eye diagram, which can be plotted by external software.  
The eye opening monitor works in two modes. In the first, only the horizontal and vertical eye openings are  
measured. The eye opening monitor first sweeps its variable-phase clock through one unit interval with the  
comparison voltage set to the mid-point of the signal. This determines the mid-point of the horizontal eye  
opening. The eye opening monitor then sets its variable phase clock to the mid-point of the horizontal eye  
opening and sweeps its comparison voltage. These two measurements determine the horizontal and vertical eye  
openings. The horizontal eye opening value is read from register 0x27 and the vertical eye opening from register  
0x28. Both values are single byte values.  
The measurement of horizontal and vertical eye opening is very fast. The speed of this measurement makes it  
useful for determining the adaptation figure of merit. In normal operation, the HEO and VEO are automatically  
measured periodically to determine whether the DS110DF111 is still in lock. Reading registers 0x27 and 0x28  
will yield the most-recently measured HEO and VEO values.  
In normal operation, the eye monitor circuitry is powered down most of the time to save power. When the eye is  
to be measured under external control, it must first be enabled by writing a 0 to bit 5 of register 0x11. The default  
value of this bit is 1, which powers down the eye monitor except when it is powered-up periodically by the CDR  
state machine and used to test CDR lock. The eye monitor must be powered up to measure the eye under  
external SMBus control.  
Bits 7:6 of register 0x11 are also used during eye monitor operation to set the EOM voltage range. This is  
described below. A single write to register 0x11 can set both bit 5 and bits 7:6 in one operation.  
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Register 0x3e, bit 7, enables horizontal and vertical eye opening measurements as part of the lock validation  
sequence. When this bit is set, the CDR state machine periodically uses the eye monitor circuitry to measure the  
horizontal and vertical eye opening. If the eye openings are too small, according to the pre-determined  
thresholds in register 0x6a, then the CDR state machine declares lock loss and begins the lock acquisition  
process again. For SMBus acquisition of the internal eye, this lock monitoring function must be disabled. Prior to  
overriding the EOM by writing a 1 to bit 0 of register 0x24, disable the lock monitoring function by writing a 0 to  
bit 7 of register 0x3e.  
Once the eye has been acquired, you can reinstate HEO and VEO lock monitoring by once again writing a 1 to  
bit 7 of register 0x3e. Under external SMBus control, the eye opening monitor can be programmed to sweep  
through all its 64 states of phase and voltage offset autonomously. This mode is initiated by setting register 0x24,  
bit 7, the fast_eom mode bit.  
Register 0x11, bits 7:6 and bit 5, Register 0x22, bit 7, Register 0x24, bit 7 and bit 0, Register 0x25, Register  
0x26, Register 0x27, Register 0x28, Register 0x2a and Register 0x3e, bit 7  
Register 0x22, bit 7, the eom_ov bit, should be cleared in this mode. When the fast_eom bit is set, the eye  
opening monitor operation is initiated by setting bit 0 of register 0x24, which is self-clearing. As soon as this bit is  
set, the eye opening monitor begins to acquire eye data. The results of the eye opening monitor error counter are  
stored in register 0x25 and 0x26. In this mode the eye opening monitor results can be obtained by repeated  
multi-byte reads from register 0x25. It is not necessary to read from register 0x26 for a multi-byte read. As soon  
as the eight most significant bits are read from register 0x25, the eight least significant bits for the current setting  
are loaded into register 0x25 and they can be read immediately. As soon as the read of the eight most significant  
bits has been initiated, the DS110DF111 sets its phase and voltage offsets to the next setting and starts its error  
counter again. The result of this is that the data from the eye opening monitor is available as quickly as it can be  
read over the SMBus with no further register writes required. The external controller just reads the data from the  
DS110DF111 over the SMBus as fast as it can. When all the data has been read, the DS110DF111 clears the  
eom_start bit.  
If multi-byte reads are not used, meaning that the device is addressed each time a byte is read from it, then it is  
necessary to read register 0x25 to get the MSB (the eight most significant bits) and register 0x26 to get the LSB  
(the eight least significant bits) of the current eye monitor measurement. Again, as soon as the read of the MSB  
has been initiated, the DS110DF111 sets its phase and voltage offsets to the next setting and starts its error  
counter again. In this mode both registers 0x25 and 0x26 must be read in order to get the eye monitor data. The  
eye monitor data for the next set of phase and voltage offsets will not be loaded into registers 0x25 and 0x26  
until both registers have been read for the current set of phase and voltage offsets. In all eye opening monitor  
modes, the amount of time during which the eye opening monitor accumulates eye opening data can be set by  
the value of register 0x2a. In general, the greater this value the longer the accumulation time. When this value is  
set to its maximum possible value of 0xff, the maximum number of samples acquired at each phase and  
amplitude offset is approximately 218. Even with this setting, the eye opening monitor values can be read from  
the SMBus with no delay. The eye opening monitor operation is sufficiently fast that the SMBus read operation  
cannot outrun it.  
The eye opening is measured at the input to the data comparator. At this point in the data path, a significant  
amount of gain has been applied to the signal by the CTLE. In many cases, the vertical eye opening as  
measured by the EOM will be on the order of 400 to 500 mV peak-to-peak. The secondary comparator, which is  
used to measure the eye opening, has an adjustable voltage range from ±100 mV to ±400 mV. The EOM voltage  
range is normally set by the CDR state machine during lock and adaptation, but the range can be overridden by  
writing a two-bit code to bits 7:6 of register 0x11. The values of this code and the corresponding EOM voltage  
ranges are shown in Table 11.  
Table 11. EOM Voltage Range vs Reg 0x11 [7:6]  
VALUE IN BITS 7:6 OF  
EOM VOLTAGE RANGE (± mV)  
REGISTER 0x11  
0x0  
0x1  
0x2  
0x3  
±100  
±200  
±300  
±400  
24  
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Note that the voltage ranges shown in Table 11 are the voltage ranges of the signal at the input to the data path  
comparator. These values are not directly equivalent to any observable voltage measurements at the input to the  
DS110DF111. Note also that if the EOM voltage range is set too small the voltage sweep of the secondary  
comparator may not be sufficient to capture the vertical eye opening. When this happens the eye boundaries will  
be outside the vertical voltage range of the eye measurement.  
To summarize, the procedure for reading the eye monitor data from the DS110DF111is shown below.  
1. Select the DS110DF111 channel to be used for the eye monitor measurement by writing the channel select  
register, register 0xff, with the appropriate value as shown in Table 5 if the correct channel register set is  
already selected, this step may be skipped.  
2. Select the eye monitor voltage range by setting bits 7:6 of register 0x11 according to the values in Table 11.  
The CDR state machine will have set this range during lock acquisition, but it may be necessary to change it  
to capture the entire vertical eye extent.  
3. Power up the eye monitor circuitry by clearing bit 5 of register 0x11. Normally the eye monitor circuitry is  
powered up periodically by the CDR state machine. Clearing bit 5 of register 0x11 enables the eye monitor  
circuitry unconditionally. This bit should be set again once the eye acquisition is complete. Clearing bit 5 and  
setting bits 7:6 of register 0x11 as desired can be combined into a single register write if desired.  
4. Clear bit 7 of register 0x22. This is the eye monitor override bit. It is cleared by default, so you may not need  
to change it.  
5. Set bit 7 of register 0x24. This is the fast eye monitor enable bit.  
6. Set bit 1 of register 0x24. This initiates the automatic fast eye monitor measurement. This bit can be set at  
the same time a bit 7 of register 0x24 if desired.  
7. Read the data array from the DS110DF111. This can be accomplished in two ways.  
If you are using multi-byte reads, address the DS110DF111 to read from register 0x25. Continue to read  
from this register without addressing the device again until you have read all the data desired. The read  
operation can be interrupted by addressing the device again and then resumed by reading once again  
from register 0x25.  
If you are not using multi-byte reads, then read the MSB for each phase and amplitude offset setting from  
register 0x25 and the LSB for each setting from register 0x26. In this mode, you address the device each  
time you want to read a new byte.  
8. In either mode, the first four bytes do not contain valid data. These should be discarded.  
9. Continue reading eye monitor data until you have read the entire 64X64 array.  
10. Clear bit 7 of register 0x24. This disables fast eye monitor mode.  
11. Set bit 5 of register 0x11. This will return control of the eye monitor circuitry to the CDR state machine.  
12. Set bit 7 of register 0x3e. This re-enables the HEO and VEO lock monitoring.  
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Overriding the DFE Tap Weights and Polarities  
Register 0x11, bits 3:0, Register 0x12, bit 7 and bits 4:0, Register 0x15, bit 7, Register 0x1e, bit 3, Register 0x20,  
Register 0x21, Register 0x23, bit 6, Register 0x24, bit 2, Register 0x2f, bit 0, and Registers 0x71–0x75  
For the DS110DF111 the DFE tap weights and polarities are normally set automatically by the adaptation  
procedure. These values can be overridden by the user if desired.  
Prior to overriding the DFE tap weights and polarities, the dfe_ov bit, bit 6 of register 0x23, should be set. This bit  
is set by default. In order for the DFE tap weights and polarities to be applied to the input signal, bit 3 of register  
0x1e, the dfe_PD bit, which powers down the DFE, should be cleared. This bit is cleared by default. It is not  
necessary to change the default settings of these registers, but verify that they are set as described.  
It is necessary to set bit 7 of register 0x15 to manually set the DFE tap weights. This bit is cleared by default.  
Bits 4:0 of register 0x12 set the five-bit weight for DFE tap 1. The first DFE tap has a five-bit setting, while the  
other taps are set using four bits. Often the first DFE tap has the largest effect in improving the bit error rate of  
the system, which is why this tap has a five-bit weight setting.  
The polarity of the tap weight for tap 1 is set using bit 7 of the same register, register 0x12. The polarity is set to  
0 by default, which corresponds to a negative algebraic sign for the tap.  
The other four taps are set using four-bit fields in registers 0x20 and 0x21. The polarities of these taps are set by  
bits 3:0 in register 0x11. These tap polarities are all set to 0 by default.  
As is the case for the CTLE settings, if changing the DFE tap weights or polarities causes the DS110DF111 to  
lose lock, it may readapt its CTLE in order to reacquire lock. If this occurs, the CTLE settings may appear to  
change spontaneously when the DFE tap weights are changed. The mechanism is the same as that described  
above for the CTLE boost settings.  
When the DS110DF111 is set to adapt mode 2 or 3 using bits 6:5 of register 0x31, it will automatically adapt its  
DFE whenever its CDR state machine is reset. This occurs when the user manually resets the CDR state  
machine using bits 3:2 of register 0x0a, or when a signal is first presented at the input to the channel when the  
channel is in an unlocked state.  
Regardless of the adapt mode, DFE adaptation can be initiated under SMBus control. Because the DFE tap  
weight registers are used by the DFE state machine during adaptation, they may be reset prior to adaptation,  
which can cause the adaptation to fail. The DFE tap observation registers can be used to prevent this.  
Prior to initiating DFE adaptation under SMBus control, write the starting values of the DFE tap settings into the  
DFE tap weight registers, registers 0x11, 0x12, 0x20, and 0x21. The values can be read from the observation  
registers, registers 0x71 through 0x75. For each DFE tap, read the current value in the observation register. Both  
the polarities and the tap weights are contained in the observation registers. For each DFE tap, write the current  
tap polarity and tap weight into the DFE tap register. Once all these values have been written, DFE adaptation  
can be initiated and it will proceed normally. If the DS110DF111 fails to find a set of DFE tap weights producing a  
better adaptation figure of merit than the starting tap weights, the starting tap weights will be retained and used.  
CTLE adaptation can also be initiated manually. Setting and then clearing bit 0 of register 0x2f will initiate  
adaptation of the CTLE. As with the DFE, if the DS110DF111 fails to find a set of CTLE settings that produce a  
better adaptation figure of merit than the starting CTLE values, the starting CTLE values will be retained and  
used.  
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Enabling Slow Rise/Fall Time on the Output Driver  
Register 0x18, bit 2  
Normally the rise and fall times of the output driver of the DS110DF111 are set by the slew rate of the output  
transistors. By default, the output transistors are biased to provide the maximum possible slew rate, and hence  
the minimum possible rise and fall times. In some applications, slower rise and fall times may be desired. For  
example, slower rise and fall times may reduce the amplitude of electromagnetic interference (EMI) produced by  
a system.  
Setting bit 2 of register 0x18 will adjust the output driver circuitry to increase the rise and fall times of the signal.  
Setting this bit will approximately double the nominal rise and fall times of the DS110DF111 output driver. This bit  
is cleared by default.  
Inverting the Output Polarity  
Register 0x1f, bit 7  
In some systems, the polarity of the data does not matter. In systems where it does matter, it is sometimes  
necessary, for the purposes of trace routing, for example, to invert the normal polarities of the data signals.  
The DS110DF111 can invert the polarity of the data signals by means of a register write. Writing a 1 to bit 7 of  
register 0x1f inverts the polarity of the output signal for the selected channel. This can provide additional flexibility  
in system design and board layout.  
Overriding the Figure of Merit Adaption  
Register 0x2c, bits 5:4, Register 0x31, bits 6:5, Register 0x6b, Register 0x6c, Register 0x6d, and Register 0x6e,  
bits 7 and 6  
The default figure of merit for both the CTLE and DFE adaptation is simple. The horizontal and vertical eye  
openings are measured for each CTLE boost setting or set of DFE tap weights and polarities. The vertical eye  
opening is scaled to a constant reference vertical eye opening and the smaller of the horizontal or vertical eye  
opening is taken as the figure of merit for that set of equalizer settings. The objective is to adapt the equalizer to  
a point where the horizontal and vertical eye openings are both large and approximately equal in magnitude. This  
usually provides optimum bit error rate performance for most transmission channels.  
Table 12. DS110DF111 Adaption Algorithm Settings, Register 0x31 Bits 6:5  
ADAPT MODE  
SETTING  
<1:0>  
REGISTER 0X31, BIT REGISTER 0x31, BIT 5  
ADAPTION ALGORITHM  
6 adapt_mode [1]  
adapt_mode [0]  
0
0
1
1
0
1
0
1
00  
01  
10  
11  
No Adaption  
Adapt CTLE Until Optimum  
Adapt CTLE Until Optimum the DFE, then CTLE Again (Default)  
Adapt CTLE Until Lock, the DFE, the CTLE Again  
In the DS110DF111 the CTLE figure of merit type is selected using the two-bit field in register 0x31, bits 6:5.  
Table 13. Figure of Merit Type Settings  
VALUE IN BITS 5:4 OF  
FIGURE OF MERIT TYPE  
REGISTER 0x2C  
0x0  
0x1  
Both HEO and VEO used  
Only HEO used  
0x2  
Only VEO used  
0x3 (Default)  
Both HEO and VEO used  
For some transmission media the adaptation can reach a better setting if a different figure of merit is used. The  
DS110DF111 includes the capability of adapting based on a configurable figure of merit. The configurable figure  
of merit is structured as shown in the equation below.  
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FOM = Minimum [(HEO - b) x a, (VEO - c) x (1 - a)]  
where  
HEO is horizontal eye opening  
VEO is vertical eye opening  
FOM is the figure of merit  
the factors a, b, and c are set using registers 0x6b, 0x6c, and 0x6d respectively  
(1)  
In order to use the configurable figure of merit, the enable bits must be set. To use the configurable figure of  
merit for the CTLE adaptation, set bit 7 of register 0x6e. To use the configurable figure of merit for the DFE  
adaptation, set bit 6 of register 0x6e. The same scaling factors are used for both CTLE and DFE adaptation  
when the configurable figure of merit is enabled.  
Setting the Rate and Subrate for Lock Acquisition  
Register 0x2f, bits 7:6  
The rate and subrate settings, which constrain the data rate search can be set using channel register 0x2f. Bits  
7:6 are RATE<1:0>, and bits 5:4 are SUBRATE<1:0>.  
Setting the Adaption/Lock Mode  
Register 0x31, bits 6:5, and Register 0x33, bits 7:4 and 3:0, Register 0x34, bits 3:0, Register 0x35, bits 4:0,  
Register 0x3e, bit 7, and Register 0x6a  
There are four adaptation modes available in the DS110DF111.  
Mode 0: The user is responsible for setting the CTLE and DFE (for the DS110DF111) values. This mode is  
used if the transmission channel response is fixed.  
Mode 1: Only the CTLE is adapted to equalize the transmission channel. The DFE is enabled , but the tap  
weights are all set to 0. This mode is primarily used for smoothly-varying high-loss transmission channels  
such as cables and simple PCB traces.  
Mode 2: In this mode, both the CTLE and the DFE are adapted to compensate for additional loss, reflections,  
and crosstalk in the input transmission channel. The maximum DFE tap weights can be constrained using  
register 0x34, bits 3:0, and register 0x35, bits 4:0.  
Mode 3: In this mode, both the CTLE and DFE are adapted as in mode 2. However, in mode 3, more  
emphasis is placed on the DFE setting. This mode may give better results for high crosstalk transmission  
channels.  
Bits 6:5 of register 0x31 determine the adaptation mode to be used. The mapping of these register bits to the  
adaptation algorithm is shown in.  
By default the DS110DF111 requires that the equalized internal eye exhibit horizontal and vertical eye openings  
greater than a pre-set minimum in order to declare a successful lock. The minimum values are set in register  
0x6a.  
The DS110DF111 continuously monitors the horizontal and vertical eye openings while it is in lock. If the eye  
opening falls below the threshold set in register 0x6a, the DS110DF111 will declare a loss of lock.  
The continuous monitoring of the horizontal and vertical eye openings may be disabled by clearing bit 7 of  
register 0x3e.  
Initiating Adaption  
Register 0x24, bit 2, and Register 0x2f, bit 0  
When the DS110DF111 becomes unlocked, it will automatically try to acquire lock. If an adaptation mode is  
selected using bits 6:5 in register 0x31, the DS110DF111 will also try to adapt its CTLE and DFE.  
Adaptation can also be initiated by the user. CTLE adaptation can be initiated by setting and then clearing  
register 0x2f, bit 0. In the DS110DF111, DFE adaptation can be initiated by setting and then clearing bit 2 of  
register 0x24.  
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Overriding the CTLE Settings used for CTLE Adaption  
Register 0x2c, bits 3:0, Register 0x2f, bit 3, Register 0x39, bits 4:0, and Registers 0x40-0x4f  
The CTLE adaptation algorithm operates by setting the CTLE boost stage controls to a set of pre-determined  
boost settings, each of which provides progressively more high-frequency boost. At each stage in the adaptation  
process, the DS110DF111 attempts to phase lock to the equalized signal. If the phase lock succeeds, the  
DS110DF111 measures the horizontal and vertical eye openings using the internal eye monitor circuit. The  
DS110DF111 computes a figure of merit for the eye opening and compares it to the previous best value of the  
figure of merit. While the figure of merit continues to improve, the DS110DF111 continues to try additional values  
of the CTLE boost setting until the figure of merit ceases to improve and begins to degrade. When the figure of  
merit starts to degrade, the DS110DF111 still continues to try additional CTLE settings for a pre-determined trial  
count called the “look-beyond” count, and if no improvement in the figure of merit results, it resets the CTLE  
boost values to those that produced the best figure of merit. The resulting CTLE boost values are then stored in  
register 0x03. The “look-beyond” count is configured by the value in register 0x2c, bits 3:0. The value is 0x2 by  
default.  
The set of boost values used as candidate values during CTLE adaptation are stored as bit fields in registers  
0x40-0x4F. The default values for these settings are shown in Table 14. These values may be overridden by  
setting the corresponding register values over the SMBus. If these values are overridden, then the next time the  
CTLE adaptation is performed the set of CTLE boost values stored in these registers will be used for the  
adaptation. Resetting the channel registers by setting bit 2 of channel register 0x00 will reset the CTLE boost  
settings to their defaults. So will power-cycling the DS110DF111.  
Table 14. CTLE Settings for Adaption, Register 0x40-0x4F  
REGISTER  
(HEX)  
BITS 7:6  
(CTLE STAGE 0)  
BITS 5:4  
BITS 3:2  
BITS 1:0  
CTLE  
BOOST  
STRING  
CTLE ADAPTATION  
INDEX  
(CTLE STAGE 1) (CTLE STAGE 2) (CTLE STAGE 3)  
40  
41  
42  
43  
44  
45  
46  
47  
48  
49  
4A  
4B  
4C  
4D  
4E  
4F  
0
1
2
1
3
2
1
2
2
2
1
3
2
2
3
3
0
0
0
1
0
1
1
2
3
1
2
1
1
2
2
3
0
0
0
0
0
0
1
0
0
1
2
1
2
1
1
2
0
0
0
0
0
0
0
0
0
1
1
1
1
1
2
1
0000  
1000  
2000  
1100  
3000  
2100  
1110  
2200  
2300  
2111  
1221  
3111  
2121  
2211  
3212  
3321  
0
1
2
3
4
5
6
7
8
9
10  
11  
12  
13  
14  
15  
As an alternative to, or in conjunction with, writing the CTLE boost setting registers 0x40 through 0x4f, it is  
possible to set the starting CTLE boost setting index. To override the default setting, which is 0, set bit 3 of  
register 0x2f. When this bit is set, the starting index for adaptation comes from register 0x39, bits 4:0. This is the  
index into the CTLE settings table in registers 0x40 through 0x4f. When this starting index is 0, which is the  
default, CTLE adaptation starts at the first setting in the table, the one in register 0x40, and continues until the  
optimum FOM is reached.  
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Table 15. VOD Settings  
VODA/B  
BIT 2, sel_vod[2]  
BIT 1, sel_vod[1]  
BIT 0, sel_vod[0]  
OUTPUT VOD (mVppd)  
0
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
600  
700  
R
800  
900  
F
1
1000  
1100  
1200  
1300  
Setting the Output Differential Voltage  
Register 0x2d, bits 2:0  
There are eight levels of output differential voltage available in the DS110DF111, from 0.6 V to 1.3 V in 0.1 V  
increments. The values in bits 2:0 of register 0x2d set the output VOD. The available VOD settings and the  
corresponding values of this bit field are shown in Table 15. Not all VOD levels are available using the VODA/B  
control pins.  
Setting the Output De-Emphasis Setting  
Register 0x15, bits 2:0 and bit 6  
Fifteen output de-emphasis settings are available in the DS110DF111, ranging from 0 dB to -12 dB. The de-  
emphasis values come from register 0x15, bits 2:0 and register 0x15, bit 6, which is the de-emphasis range bit.  
The available driver de-emphasis settings and the mapping to these bits are shown in Table 16.  
Table 16. De-Emphasis Settings  
REGISTER 0X15 BIT REGISTER 0X15 BIT REGISTER 0X15 BIT REGISTER 0X15 BIT  
DE-EMPHASIS  
SETTTING (dB)  
PIN SETTING  
[2], drv_dem[2]  
[1], drv_dem[1]  
[0], drv_dem[0]  
[6], drv_dem_range  
0
0
0
0
0
0
1
0
1
1
0
1
1
1
1
1
0
0
0
1
1
0
1
0
1
1
1
0
0
1
1
0
1
1
0
1
0
0
1
0
1
1
0
1
0
1
0
1
0
1
1
1
0
1
1
0
1
0
0
0
0
0.0  
-0.9  
-1.5  
-2.0  
-2.8  
-3.3  
-3.5  
-3.9  
-4.5  
-5.0  
-5.6  
-6.0  
-7.5  
-9.0  
-12.0  
R
F
1
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Table 17. Revision History  
Revision  
0.1  
Date  
Update  
Comments  
4-25-2012  
7-23-2012  
7-24-2012  
Lee Sledjeski  
Nate Unger  
Nate Unger  
Initial Revision  
0.2  
1. Added LBK pin and function2.  
0.3  
1.Added pin mode functions; VOD, De-emphasis, loopback,  
RATE/SUBRATE,  
2.Changed Loopback feature to control wire-side loopback  
when pulled down  
0.4  
7-27-2012  
7-29-2012  
Nate Unger  
Nate Unger  
1. Moved LBK pin to 6  
2. Removed RATE and SUBRATE  
3. Added DEMA and DEMB  
4. Added VODA and VODB5  
0.41  
Revised look and feel to fit TI template  
Added RATE and SUBRATE table for register operation  
Added loopback diagrams  
Fixed table and figure numbering  
Fixed many formatting issues  
Inserted register commands for loopback  
0.42  
8-1-2012  
Nate Unger  
Updated table reference numbers  
Added register descriptions for 0x18, 0x1f, 0x20  
Reduced reference modes from table 21  
Fixed figure 1 reference on page  
Fixed reference to VODB pin 10 in table 7  
0.45  
0.5  
8-24-2012  
9-27-2012  
Lee Sledjeski  
Lee Sledjeski  
Updated pin type to reflect definitions  
Added Shared reg0x07[1:0] for Loopback  
Added Channel reg0x04[3:2] for DWDM/ZR  
Updated Address input to a 2-level pin  
Updated Table 9 (SMBus address)  
Added FANOUT modes to the Loopback function  
Reduced CTLE table to 16 values  
0.5  
9-27-2012  
9-28-2012  
9-28-2012  
9-28-2012  
Lee Sledjeski  
Lee Sledjeski  
Lee Sledjeski  
Lee Sledjeski  
Copied version from DS110RT/DF111  
Updated Rate/Subrate information in Table 13  
Updated graphics to DS125DF111 part #  
0.51  
0.52  
0.53  
Removed register description and tables  
Added Alpha vs Production section  
0.55  
0.6  
10-15-2012  
10-26-2012  
Lee Sledjeski  
Lee Sledjeski  
Changed temperature range: -40 – 85C  
Updated Electrical Table  
Removed non-DF information  
Added ADDR1 input on Pin 9  
0.65  
10-30-2012  
Lee Sledjeski  
Added LOS/INT# pin 13 information  
Updated graphics and tables to have a common pin naming  
convention; Strap/Slave/Pin/Master  
11-7-2012  
12-12-12  
Lee Sledjeski  
Lee Sledjeski  
Converted to DS110 datasheet  
0.70  
0.71  
0.8  
Adjusted Package Thermal and power dissipation  
Removed VRX-IN  
Increased Dj to 5ps  
Removed Jtrans  
12-18-12  
Lee Sledjeski  
Lee Sledjeski  
Used DS110DF111 Version 0.70 as a starting point to create  
new DS125DF111 datasheet  
Updated default to be Rate/Subrate = 06 which enables all  
divider options 1,2,4, and 8.  
1-31-2013  
Removed references to Alpha Silicon  
Made DS110 primary version  
Default data – rates 1.25 / 10.3125 Gbps  
Adjusted Trise,TPD,Tlock range  
Added TPD – raw data  
0.81  
0.82  
0.85  
0.9  
2-04-2013  
3-26-2013  
4-03-2013  
4-10-2013  
Lee Sledjeski  
Lee Sledjeski  
Lee Sledjeski  
Lee Sledjeski  
Updated 1st page graphic to remove TIA interface  
Updated SMBus table to match pinout  
Updated DEM table to match PRS features doc  
Updated Version and Device ID (expected RTM)  
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Table 17. Revision History (continued)  
0.91  
0.92  
4-10-2013  
4-16-2013  
Lee Sledjeski  
Lee Sledjeski  
Fixed description on Channel Reg 0x31  
Updated VOD Table 17  
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PACKAGE OPTION ADDENDUM  
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PACKAGING INFORMATION  
Orderable Device  
DS110DF111SQ/NOPB  
DS110DF111SQE/NOPB  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-40 to 85  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
ACTIVE  
WQFN  
WQFN  
RTW  
24  
24  
1000  
Green (RoHS  
& no Sb/Br)  
CU SN  
CU SN  
Level-3-260C-168 HR  
1D111B3  
1D111B3  
ACTIVE  
RTW  
250  
Green (RoHS  
& no Sb/Br)  
Level-3-260C-168 HR  
-40 to 85  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
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www.ti.com  
29-May-2013  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
DS110DF111SQ/NOPB WQFN  
DS110DF111SQE/NOPB WQFN  
RTW  
RTW  
24  
24  
1000  
250  
178.0  
178.0  
12.4  
12.4  
4.3  
4.3  
4.3  
4.3  
1.3  
1.3  
8.0  
8.0  
12.0  
12.0  
Q1  
Q1  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
29-May-2013  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
DS110DF111SQ/NOPB  
DS110DF111SQE/NOPB  
WQFN  
WQFN  
RTW  
RTW  
24  
24  
1000  
250  
213.0  
213.0  
191.0  
191.0  
55.0  
55.0  
Pack Materials-Page 2  
MECHANICAL DATA  
RTW0024A  
SQA24A (Rev B)  
www.ti.com  
IMPORTANT NOTICE  
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Applications  
Audio  
www.ti.com/audio  
amplifier.ti.com  
dataconverter.ti.com  
www.dlp.com  
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Communications and Telecom www.ti.com/communications  
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Data Converters  
DLP® Products  
DSP  
Computers and Peripherals  
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Energy and Lighting  
Industrial  
www.ti.com/computers  
www.ti.com/consumer-apps  
www.ti.com/energy  
dsp.ti.com  
Clocks and Timers  
Interface  
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logic.ti.com  
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