ISO5851DWR [TI]
High-CMTI 2.5-A / 5-A Isolated IGBT, MOSFET Gate Driver with Active Safety Features;
| 型号： | ISO5851DWR |
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| 描述： | High-CMTI 2.5-A / 5-A Isolated IGBT, MOSFET Gate Driver with Active Safety Features 栅 驱动 双极性晶体管 光电二极管 接口集成电路 驱动器 |
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ISO5851
SLLSEN5A –JUNE 2015–REVISED JUNE 2015
ISO5851 High-CMTI 2.5-A / 5-A Isolated IGBT, MOSFET Gate Driver
with Active Safety Features
1 Features
3 Description
The ISO5851 is a 5.7-kVRMS, reinforced isolated gate
1
•
•
2.5-A Peak Source and 5-A Peak Sink Currents
driver for IGBTs and MOSFETs with 2.5-A source
and 5-A sink current. The input side operates from a
single 3-V to 5.5-V supply. The output side allows for
a supply range from minimum 15-V to maximum
30-V. Two complementary CMOS inputs control the
output state of the gate driver. The short propagation
time of 76 ns assures accurate control of the output
stage.
Short Propagation Delay: 76 ns (Typ), 110 ns
(Max)
•
•
•
2-A Active Miller Clamp
Output Short-Circuit Clamp
Fault Alarm upon Desaturation Detection is
Signaled on FLT and Reset Through RST
•
•
Input and Output Under Voltage Lock-Out (UVLO)
with Ready (RDY) Pin Indication
An internal desaturation (DESAT) fault detection
recognizes when the IGBT is in an overload
condition. Upon a DESAT detect the gate driver
output is driven low to VEE2 potential turning the IGBT
immediately off.
Active Output Pull-down and Default Low Outputs
with Low Supply or Floating Inputs
•
•
•
•
3-V to 5.5-V Input Supply Voltage
15-V to 30-V Output Driver Supply Voltage
CMOS Compatible Inputs
When desaturation is active, a fault signal is sent
across the isolation barrier pulling the FLT output at
the input side low and blocking the isolator input. The
FLT output condition is latched and can be reset
through a low-active pulse at the RST input.
Rejects Input Pulses and Noise Transients
Shorter Than 20 ns
•
100-kV/μs Minimum Common-Mode Transient
When the IGBT is turned off during normal operation
with bipolar output supply, the output is hard clamp to
VEE2. If the output supply is unipolar, an active Miller
clamp can be used, allowing Miller current to sink
across a low impedance path preventing IGBT to be
dynamically turned on during high voltage transient
conditions.
Immunity (CMTI) at VCM = 1500 V
•
•
Operating Temperature: –40°C to 125°C Ambient
Safety and Regulatory Approvals:
–
8000-VPK VIOTM and 2121-VPK VIORM
Reinforced Isolation per DIN V VDE V 0884-10
(VDE V 0884-10):2006-12
Device Information(1)
–
–
5700-VRMS Isolation for 1 Minute per UL 1577
CSA Component Acceptance Notice 5A, IEC
60950-1, IEC 60601-1 and IEC 61010-1 End
Equipment Standards
PART NUMBER
PACKAGE
BODY SIZE (NOM)
ISO5851
SOIC (16)
10.30 mm × 7.50 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
–
–
CQC Certification per GB4943.1-2011
All Certifications are Planned
Functional Block Diagram
2 Applications
•
Isolated IGBT and MOSFET Drives in
–
–
–
–
–
Industrial Motor Control Drives
Industrial Power Supplies
Solar Inverters
HEV and EV Power Modules
Induction Heating
OUT
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
ISO5851
SLLSEN5A –JUNE 2015–REVISED JUNE 2015
www.ti.com
Table of Contents
9.3 Feature Description................................................. 12
9.4 Device Functional Modes........................................ 16
10 Application and Implementation........................ 17
10.1 Application Information.......................................... 17
10.2 Typical Applications .............................................. 17
11 Power Supply Recommendations ..................... 25
12 Layout................................................................... 25
12.1 Layout Guidelines ................................................. 25
12.2 PCB Material......................................................... 25
12.3 Layout Example .................................................... 25
13 Device and Documentation Support ................. 26
13.1 Documentation Support ........................................ 26
13.2 Community Resources.......................................... 26
13.3 Trademarks........................................................... 26
13.4 Electrostatic Discharge Caution............................ 26
13.5 Glossary................................................................ 26
1
2
3
4
5
6
7
Features.................................................................. 1
Applications ........................................................... 1
Description ............................................................. 1
Revision History..................................................... 2
Description (continued)......................................... 2
Pin Configuration and Function........................... 3
Specifications......................................................... 4
7.1 Absolute Maximum Ratings ...................................... 4
7.2 ESD Ratings.............................................................. 4
7.3 Recommended Operating Conditions....................... 4
7.4 Thermal Information.................................................. 5
7.5 Electrical Characteristics........................................... 5
7.6 Switching Characteristics.......................................... 6
7.7 Typical Characteristics.............................................. 7
Parameter Measurement Information .................. 9
Detailed Description ............................................ 11
9.1 Overview ................................................................. 11
9.2 Functional Block Diagram ....................................... 11
8
9
14 Mechanical, Packaging, and Orderable
Information ........................................................... 26
4 Revision History
Changes from Original (June 2015) to Revision A
Page
•
Changed from a 1-page Product Preview to the full datasheet. ........................................................................................... 1
5 Description (continued)
The readiness for the gate driver to be operated is under the control of two undervoltage-lockout circuits
monitoring the input side and output side supplies. If either side has insufficient supply the RDY output goes low,
otherwise this output is high.
The ISO5851 is available in a 16-pin SOIC package. Device operation is specified over a temperature range from
–40°C to 125°C ambient.
2
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SLLSEN5A –JUNE 2015–REVISED JUNE 2015
6 Pin Configuration and Function
DW Package
16-Pin SOIC
Top View
VEE2
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
GND1
VCC1
RST
FLT
RDY
IN-
DESAT
GND2
NC
VCC2
OUT
CLAMP
VEE2
IN+
GND1
Pin Functions
PIN
I/O
DESCRIPTION
NAME
VEE2
DESAT
GND2
NC
NO.
1, 8
2
-
I
Output negative supply. Connect to GND2 for Unipolar supply application.
Desaturation voltage input
3
-
Gate drive common. Connect to IGBT emitter.
Not connected
4
-
VCC2
OUT
CLAMP
GND1
IN+
5
-
Most positive output supply potential.
Gate drive voltage output
6
O
O
-
7
Miller clamp output
9, 16
10
11
12
13
14
15
Input ground
I
Non-inverting gate drive voltage control input
Inverting gate drive voltage control input
Power-good output, active high when both supplies are good.
Fault output, low-active during DESAT condition
Reset input, apply a low pulse to reset fault latch.
Positive input supply (3 V to 5.5 V)
IN-
I
RDY
FLT
O
O
I
RST
VCC1
-
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SLLSEN5A –JUNE 2015–REVISED JUNE 2015
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7 Specifications
7.1 Absolute Maximum Ratings(1)
Over operating free-air temperature range (unless otherwise noted)
MIN
GND1 - 0.3
–0.3
MAX
UNIT
V
VCC1
Supply voltage input side
6
35
VCC2
Positive supply voltage output side
Negative supply voltage output side
Total supply output voltage
(VCC2 – GND2)
(VEE2 – GND2)
V
V(EE2)
V(SUP2)
VOUT
–17.5
0.2
V
(VCC2 - VEE2
)
–0.3
35
V
Gate driver output voltage
V(EE2) - 0.3
VCC2 + 0.3
2.7
V
I(OUTH)
Gate driver high output current
Gate driver high output current
(max pulse width = 10 μs, max duty
cycle = 0.2%)
A
I(OUTL)
Gate driver low output current
5.5
A
V(LIP)
I(LOP)
Voltage at IN+, IN-,FLT, RDY, RST
Output current of FLT, RDY
GND1 - 0.3
VCC1 + 0.3
10
V
mA
V
V(DESAT) Voltage at DESAT
GND2 - 0.3
V(EE2) - 0.3
12800
VCC2 + 0.3
VCC2 + 0.3
V(CLAMP) Clamp voltage
V
V(SURGE) Surge Immunity per IEC 61000-4-5
V
TJ
Junction temperature
Storage temperature
–40
150
150
°C
°C
mW
mW
mW
TSTG
PID
POD
PD
–65
Input power dissipation
Output power dissipation
Full chip power dissipation
100
VCC1 = 5.5-V, VCC2 = 30-V, TA = 85°C
600
700(2)
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any conditions beyond those indicated under recommended operating conditions
is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability
(2) Full chip power dissipation is de-rated 10.7 mW/°C beyond 85°C ambient temperature. At 125°C ambient temperature, a maximum of
272 mW total power dissipation is allowed. Power dissipation can be optimized depending on ambient temperature and board design,
while ensuring that Junction temperature does not exceed 150°C.
7.2 ESD Ratings
VALUE
UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±4000
V(ESD)
Electrostatic discharge
V
Charged-device model (CDM), per JEDEC specification JESD22-
C101(2)
±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
V
VCC1
VCC2
V(EE2)
V(SUP2)
VIH
Supply voltage input side
3
5.5
Positive supply voltage output side (VCC2 – GND2)
Negative supply voltage output side (VEE2 – GND2)
15
30
V
–15
0
30
V
Total supply voltage output side (VCC2 – VEE2
High-level input voltage (IN+, IN-, RST)
Low-level input voltage (IN+, IN-, RST)
)
15
V
0.7 x VCC1
VCC1
V
VIL
0
40
0.3 x VCC1
V
tUI
Pulse width at IN+, IN- for full output (CLOAD = 1nF)
Pulse width at RST for resetting fault latch
Ambient temperature
ns
ns
°C
tRST
TA
800
-40
25
125
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7.4 Thermal Information
DW (SOIC)
UNIT
THERMAL METRIC(1)
16 PINS
θJA
Junction-to-ambient thermal resistance
91.8
51.9
θJCtop
θJB
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
56.6
20.2
56.1
°C/W
ψJT
ψJB
Junction-to-top characterization parameter
Junction-to-board characterization parameter
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
7.5 Electrical Characteristics
Over recommended operating conditions unless otherwise noted. All typical values are at TA = 25°C, VCC1 = 5 V, VCC2
GND2 = 15 V, GND2 – V(EE2) = 8 V
–
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VOLTAGE SUPPLY
Positive-going UVLO1 threshold voltage
input side
VIT+(UVLO1)
VIT-(UVLO1)
VHYS(UVLO1)
VIT+(UVLO2)
VIT-(UVLO2)
VHYS(UVLO2)
2.25
V
V
V
V
V
V
Negative-going UVLO1 threshold voltage
input side
1.7
UVLO1 Hysteresis voltage (VIT+ – VIT–
input side
)
0.24
12
11
1
Positive-going UVLO2 threshold voltage
output side
13
Negative-going UVLO2 threshold voltage
output side
9.5
UVLO2 Hysteresis voltage (VIT+ – VIT–
output side
)
IQ1
Input supply quiescent current
Output supply quiescent current
2.8
3.6
4.5
6
mA
mA
IQ2
LOGIC I/O
Positive-going input threshold voltage (IN+,
IN-, RST)
VIT+(IN,RST)
VIT-(IN,RST)
0.7 x VCC1
V
V
Negative-going input threshold voltage
(IN+, IN-, RST)
0.3 x VCC1
VHYS(IN,RST)
Input hysteresis voltage (IN+, IN-, RST)
High-level input leakage at (IN+)
Low-level input leakage at (IN-, RST)
Pull-up current of FLT, RDY
0.15 x VCC1
100
V
IIH
IN+ = VCC1
µA
µA
µA
V
IIL
IN- = GND1, RST = GND1
V(RDY) = GND1, V(FLT) = GND1
I(FLT) = 5 mA
-100
IPU
VOL
100
Low-level output voltage at FLT, RDY
0.2
2
GATE DRIVER STAGE
V(OUTPD)
V(OUTH)
V(OUTL)
Active output pull-down voltage
IOUT = 200 mA, VCC2 = open
IOUT = –20 mA
V
V
High-level output voltage
Low-level output voltage
VCC2 - 0.5
VCC2 - 0.24
13
IOUT = 20 mA
50
mV
IN+ = high, IN- = low,
VOUT = VCC2 - 15 V
I(OUTH)
I(OUTL)
High-level output peak current
Low-level output peak current
1.5
3.4
2.5
5
A
A
IN+ = low, IN- = high,
VOUT = V(EE2) + 15 V
ACTIVE MILLER CLAMP
V(CLP) Low-level clamp voltage
I(CLP)
I(CLP) = 20 mA
V(EE2) + 0.015
VEE2 + 0.08
2.5
V
A
V
Low-level clamp current
Clamp threshold voltage
VOUT = V(EE2) + 2.5 V
1.6
1.6
2.5
2.1
V(CLTH)
SHORT CIRCUIT CLAMPING
Clamping voltage
V(CLP_OUT)
IN+ = high, IN- = low, tCLP=10 µs,
I(OUTH) = 500 mA
0.8
1.3
V
(VOUT - VCC2
)
IN+ = high, IN- = low, tCLP=10 µs,
I(CLP) = 500 mA
1.3
0.7
V
V
Clamping voltage
(VCLP - VCC2
V(CLP_CLAMP)
)
IN+ = High, IN- = Low, I(CLP) = 20 mA
1.1
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Electrical Characteristics (continued)
Over recommended operating conditions unless otherwise noted. All typical values are at TA = 25°C, VCC1 = 5 V, VCC2
GND2 = 15 V, GND2 – V(EE2) = 8 V
–
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
DESAT PROTECTION
I(CHG)
Blanking capacitor charge current
Blanking capacitor discharge current
V(DESAT) - V(GND2) = 2 V
V(DESAT) - V(GND2) = 6 V
0.42
9
0.5
14
0.58
mA
mA
I(DCHG)
DESAT threshold voltage with respect to
GND2
V(DSTH)
V(DSL)
8.3
0.4
9
9.5
1
V
V
DESAT voltage with respect to GND2,
when OUT is driven low
7.6 Switching Characteristics
Over recommended operating conditions unless otherwise noted. All typical values are at TA = 25°C, VCC1 = 5 V, VCC2
GND2 = 15 V, GND2 – V(EE2) = 8 V
–
PARAMETER
Output signal rise time
Output signal fall time
Propagation Delay
TEST CONDITIONS
MIN
12
TYP
20
MAX UNIT
tr
35
37
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
tf
12
20
tPLH, tPHL
tsk-p
76
110
20
CLOAD = 1 nF, see Figure 13,
Figure 14, and Figure 15
Pulse Skew |tPHL – tPLH
|
tsk-pp
Part-to-part skew
30(1)
tGF
Glitch filter on IN+, IN-, RST
DESAT sense to 10% OUT delay
DESAT glitch filter delay
20
30
415
40
tDESAT (10%)
tDESAT (GF)
tDESAT (FLT)
tLEB
300
500
330
DESAT sense to FLT-low delay
Leading edge blanking time
Glitch filter on RST for resetting FLT
see Figure 15
2000
400
2420
500
see Figure 13 and Figure 14
330
300
tGF(RSTFLT)
800
VI = VCC1 /2 + 0.4 x sin (2πft), f = 1
MHz, VCC1 = 5 V
CI
Input capacitance(2)
2
pF
CMTI
Common-mode transient immunity
VCM = 1500 V, see Figure 16
100
120
kV/μs
(1) Measured at same supply voltage and temperature condition
(2) Measured from input pin to ground.
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7.7 Typical Characteristics
0.5
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0.0
VCC2 - VOUT = 2.5 V
VCC2 - VOUT = 5 V
VCC2 - VOUT = 10 V
VCC2 - VOUT = 15 V
VCC2 - VOUT = 20 V
0.0
-0.5
-1.0
-1.5
-2.0
-2.5
-3.0
VOUT - VEE2 = 2.5 V
VOUT - VEE2 = 5 V
VOUT - VEE2 = 10 V
VOUT - VEE2 = 15 V
VOUT - VEE2 = 20 V
-40
-20
0
20
40
60
80
100 120 140
-40
-20
0
20
40
60
80
100 120 140
Ambient Temperature (qC)
Ambient Temperature (qC)
D001
D002
Figure 1. Output High Drive Current vs Temperature
Figure 2. Output Low Drive Current vs Temperature
0.0
7
6
5
4
3
2
1
0
TA = -40qC
TA = 25qC
TA = 125qC
-0.5
-1.0
-1.5
-2.0
-2.5
-3.0
-3.5
TA = -40qC
TA = 25qC
TA = 125qC
0
5
10
15
20
25
30
0
5
10
15
20
25
30
Output Voltage (V)
Output Voltage (V)
D003
D004
Figure 3. Output High Drive Current vs (VCC2 - VOUT
)
Figure 4. Output Low Drive Current vs (VOUT - VEE2)
9.5
9.4
9.3
9.2
9.1
9
VCC2 - VEE2 = VCC2 - GND2 = 15 V
VCC2 - VEE2 = VCC2 - GND2 = 30-V
8.9
8.8
8.7
8.6
8.5
Time - 50 ns/div
-40
-20
0
20
40
60
80
100 120 140
CL = 1 nF
RG = 0 Ω
Ambient Temperature (C)
D005
VCC2 - VEE2 = VCC2 - GND2 = 20 V
Figure 6. OUT Transient Waveform
Figure 5. DESAT Threshold Voltage vs Temperature
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Typical Characteristics (continued)
Time - 50 ns/div
Time - 500 ns/div
CL = 1 nF
RG = 10 Ω
CL = 10 nF
RG = 0 Ω
VCC2 - VEE2 = VCC2 - GND2 = 20 V
VCC2 - VEE2 = VCC2 - GND2 = 20 V
Figure 7. OUT Transient Waveform
Figure 8. OUT Transient Waveform
Time - 1 ms/div
RG = 0 Ω
Time - 500 ns/div
CL = 10 nF
RG = 10 Ω
CL = 100 nF
VCC2 - VEE2 = VCC2 - GND2 = 20 V
VCC2 - VEE2 = VCC2 - GND2 = 20 V
Figure 9. OUT Transient Waveform
Figure 10. OUT Transient Waveform
CH1: OUT
CH2: DESAT
CH3: FLT
Time - 1 ms/div
Time - 2 ms/div
RG = 10 Ω
CL = 100 nF
RG = 10 Ω
CL = 100 nF
VCC2 - VEE2 = VCC2 - GND2 = 20 V
VCC2 - VEE2 = VCC2 - GND2 = 20 V
Figure 12. OUT Transient Waveform DESAT and FLT
Figure 11. OUT Transient Waveform
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8 Parameter Measurement Information
IN-
0V
IN-
50 %
50 %
50 %
50 %
IN+
IN+
V
CC1
t
r
t
f
t
r
t
f
90%
50%
10%
90%
50%
10%
OUT
OUT
t
t
t
t
PHL
PLH
PHL
PLH
DESAT
DESAT
t
t
LEB
LEB
Figure 13. OUT Propagation Delay, Non-Inverting
Configuration
Figure 14. OUT Propagation Delay, Inverting
Configuration
tDESAT (10%)
tDESAT (FLT)
9V
tRST
VDESAT
OUT
10%
FLT
50 %
RST
Figure 15. DESAT, OUT, FLT, RST Delay
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Parameter Measurement Information (continued)
ISO5851
15
5
3
VCC2
VCC1
15V
0.1ꢀF
1ꢀF
3 V...5.5 V
9, 16
14
GND1
GND2
VEE2
1, 8
6
RST
IN+
+
10
OUT
+
S1
Pass-Fail Criterion:
-
11
13
OUT must remain stable
CL
1nF
IN-
2
FLT
DESAT
-
12
7
4
CLAMP
NC
RDY
-
+
VCM
Figure 16. Common-Mode Transient Immunity Test Circuit
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9 Detailed Description
9.1 Overview
The ISO5851 is an isolated gate driver for IGBTs and MOSFETs. Input CMOS logic and output power stage are
separated by a capacitive, silicon dioxide (SiO2), isolation barrier.
The IO circuitry on the input side interfaces with a micro controller and consists of gate drive control and RESET
(RST) inputs, READY (RDY) and FAULT (FLT) alarm outputs. The power stage consists of power transistors to
supply 2.5-A pull-up and 5-A pull-down currents to drive the capacitive load of the external power transistors, as
well as DESAT detection circuitry to monitor IGBT collector-emitter overvoltage under short circuit events. The
capacitive isolation core consists of transmit circuitry to couple signals across the capacitive isolation barrier, and
receive circuitry to convert the resulting low-swing signals into CMOS levels. The ISO5851 also contains under
voltage lockout circuitry to prevent insufficient gate drive to the external IGBT, and active output pull-down
feature which ensures that the gate-driver output is held low, if the output supply voltage is absent. The ISO5851
also has an active Miller clamp which can be used to prevent parasitic turn-on of the external power transistor,
due to Miller effect, for unipolar supply operation.
9.2 Functional Block Diagram
OUT
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9.3 Feature Description
9.3.1 Supply and active Miller clamp
The ISO5851 supports both bipolar and unipolar power supply with active Miller clamp.
For operation with bipolar supplies, the IGBT is turned off with a negative voltage on its gate with respect to its
emitter. This prevents the IGBT from unintentionally turning on because of current induced from its collector to its
gate due to Miller effect. In this condition it is not necessary to connect CLAMP output of the gate driver to the
IGBT gate. Typical values of VCC2 and VEE2 for bipolar operation are 15-V and -8-V with respect to GND2.
For operation with unipolar supply, typically, VCC2 is connected to 15-V with respect to GND2, and VEE2 is
connected to GND2. In this use case, the IGBT can turn-on due to additional charge from IGBT Miller
capacitance caused by a high voltage slew rate transition on the IGBT collector. To prevent IGBT to turn on, the
CLAMP pin is connected to IGBT gate and Miller current is sinked through a low impedance CLAMP transistor.
Miller CLAMP is designed for Miller current up to 2-A. When the IGBT is turned-off and the gate voltage
transitions below 2-V the CLAMP current output is activated.
9.3.2 Active Output Pull-down
The Active output pull-down feature ensures that the IGBT gate OUT is clamped to VEE2 to ensure safe IGBT off-
state when the output side is not connected to the power supply.
9.3.3 Undervoltage Lockout (UVLO) with Ready (RDY) Pin Indication Output
Undervoltage Lockout (UVLO) ensures correct switching of IGBT. The IGBT is turned-off, if the supply VCC1
drops below VIT-(UVLO1), irrespective of IN+, IN- and RST input till VCC1 goes above VIT+(UVLO1)
.
In similar manner, the IGBT is turned-off, if the supply VCC2 drops below VIT-(UVLO2), irrespective of IN+, IN- and
RST input till VCC2 goes above VIT+(UVLO2)
.
Ready (RDY) pin indicates status of input and output side Under Voltage Lock-Out (UVLO) internal protection
feature. If either side of device have insufficient supply (VCC1 or VCC2), the RDY pin output goes low; otherwise,
RDY pin output is high. RDY pin also serves as an indication to the micro-controller that the device is ready for
operation.
9.3.4 Fault (FLT) and Reset (RST)
During IGBT overload condition, to report desaturation error FLT goes low. If RST is held low for the specified
duration, FLT is cleared at rising edge of RST. RST has an internal filter to reject noise and glitches. By asserting
RST for at-least the specified minimum duration, device input logic can be enabled or disabled.
9.3.5 Short Circuit Clamp
Under short circuit events it is possible that currents are induced back into the gate-driver OUT and CLAMP pins
due to parasitic Miller capacitance between the IGBT collector and gate terminals. Internal protection diodes on
OUT and CLAMP help to sink these currents while clamping the voltages on these pins to values slightly higher
than the output side supply.
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Feature Description (continued)
9.3.6 High Voltage Feature Description
9.3.6.1 Package Insulation and Safety-Related Specifications
over recommended operating conditions (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
L(I01)
Minimum air gap (clearance)
Shortest terminal-to-terminal distance through air
8
mm
Shortest terminal-to-terminal distance across the package
surface
L(I02)(1)
Minimum external tracking (creepage)
8
mm
V
Tracking resistance (comparative
tracking index)
CTI
DIN EN 60112 (VDE 0303-11); IEC 60112; UL 746A
600
1012
1011
VIO = 500 V, TA = 25°C
Ω
Ω
RIO
CIO
Isolation resistance, input to output(2)
Barrier capacitance, input to output(2)
VIO = 500 V, 100°C ≤ TA ≤ max
VIO = 0.4 x sin (2πft), f = 1 MHz
1
pF
(1) Per JEDEC package dimensions.
(2) All pins on each side of the barrier tied together creating a two-terminal device.
NOTE
Creepage and clearance requirements should be applied according to the specific
equipment isolation standards of an application. Care should be taken to maintain the
creepage and clearance distance of a board design to ensure that the mounting pads of
the isolator on the printed-circuit board do not reduce this distance.
Creepage and clearance on a printed-circuit board become equal in certain cases.
Techniques such as inserting grooves and/or ribs on a printed circuit board are used to
help increase these specifications.
9.3.6.2 Insulation Characteristics
PARAMETER
Distance through the insulation
TEST CONDITIONS
SPECIFICATION
UNIT
μm
DTI
Minimum internal gap (internal clearance)
21
1500
2121
VRMS
VDC
VIOWM
Maximum isolation working voltage
Time dependent dielectric breakdown (TDDB) Test
DIN V VDE V 0884-10 (VDE V 0884-10):2006-12
VIORM
Maximum repetitive peak isolation voltage
2121
2545
Method A, After Input/Output safety test subgroup 2/3,
VPR = 1.2 x VIORM, t = 10 sec,
Partial discharge < 5 pC
Method A, After environmental tests subgroup 1,
VPR = 1.6 × VIORM, t = 10 sec (qualification)
Partial discharge < 5 pC
VPR
Input to output test voltage
3393
3976
VPK
Method B1, 100% Production test,
VPR = 1.875 × VIORM, t = 1 sec
Partial discharge < 5 pC
VTEST = VIOTM, t = 60 sec (qualification), t = 1 sec (100%
production)
VIOTM
Maximum Transient isolation voltage
Maximum surge isolation voltage
8000
8000
Test method per IEC 60065, 1.2/50 μs waveform, VTEST
1.6 x VIOSM = 12800 VPK (qualification)
=
VIOSM
RS
> 109
2
Insulation resistance
Pollution degree
VIO = 500 V at TS
Ω
UL 1577
VTEST = VISO, t = 60 sec (qualification),
VTEST = 1.2 × VISO = 6840 VRMS, t = 1 sec (100%
production)
VISO
Withstanding Isolation voltage
5700
VRMS
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9.3.6.3 Regulatory Information
VDE
CSA
UL
CQC
Certified according to DIN V VDE V
0884-10 (VDE V 0884-10):2006-12
and DIN EN 60950-1 (VDE 0805 Teil
1):2011-01
Approved under CSA Component
Acceptance Notice 5A, IEC 60950-1,
IEC 61010-1, and IEC 60601-1
Recognized under 1577 Component
Recognition Program
Certified according to GB 4943.1-
2011
Reinforced insulation per CSA 61010-
1-12 and IEC 61010-1 (3rd Ed.), 300
VRMS max working voltage);
Reinforced Insulation Maximum
Transient isolation voltage, 8000 VPK
Maximum surge isolation voltage,
Reinforced insulation per CSA 60950-
1- 07+A1+A2 and IEC 60950-1 (2nd
Ed.), 800 VRMS max working voltage
(pollution degree 2, material group I) ;
2 MOPP (Means of Patient Protection)
per CSA 60601-1:14 and IEC 60601-1
Ed. 3.1, 250 VRMS (354 VPK) max
working voltage
;
Reinforced Insulation, Altitude ≤
5000m, Tropical climate, 250 VRMS
maximum working voltage
(1)
Single Protection, 5700 VRMS
8000 VPK
,
Maximum repetitive peak isolation
voltage, 2121 VPK
Certification planned
Certification planned
Certification planned
Certification planned
(1) Production tested ≥ 6840 VRMS for 1 second in accordance with UL 1577.
9.3.6.4 IEC 60664-1 Rating Table
PARAMETER
Basic Isolation Group
TEST CONDITIONS
SPECIFICATION
Material Group
I
Rated Mains Voltage ≤ 600 VRMS
Rated Mains Voltage ≤ 1000 VRMS
I-IV
I-III
Installation Classification
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9.3.6.5 Safety Limiting Values
Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output circuitry.
A failure of the I/O can allow low resistance to ground or the supply and, without current limiting, dissipate
sufficient power to overheat the die and damage the isolation barrier, potentially leading to secondary system
failures.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
378
248
45
UNIT
mA
θJA = 91.8°C/W, VI = 3.6 V, TJ = 150°C, TA = 25°C
θJA = 91.8°C/W, VI = 5.5 V, TJ = 150°C, TA = 25°C
θJA = 91.8°C/W, VI = 30 V, TJ = 150°C, TA = 25°C
IS
Safety Limiting Current
Case Temperature
TS
150
°C
The safety-limiting constraint is the absolute-maximum junction temperature specified in the Absolute Maximum
Ratings table. The power dissipation and junction-to-air thermal impedance of the device installed in the
application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the
Thermal Information table is that of a device installed in the High-K Test Board for Leaded Surface-Mount
Packages. The power is the recommended maximum input voltage times the current. The junction temperature is
then the ambient temperature plus the power times the junction-to-air thermal resistance.
400
VCC1 = 3.6 V
VCC1 = 5.5 V
VCC2 - VEE2 = 30 V
350
300
250
200
150
100
50
0
0
50
100
150
200
Case Temperature (qC)
Figure 17. DW-16 θJC Thermal Derating Curve
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9.4 Device Functional Modes
In ISO5851 OUT to follow IN+ in normal functional mode, FLT needs to be in high state.
Table 1. Function Table(1)
VCC1
PU
PD
PU
PU
PU
PU
PU
VCC2
PD
IN+
X
IN-
X
RST
X
RDY
Low
Low
High
Low
High
High
High
OUT
Low
Low
Low
Low
Low
Low
High
PU
X
X
X
PU
X
X
Low
X
Open
PU
X
X
Low
X
X
X
PU
High
Low
X
PU
High
High
(1) PU: Power Up (VCC1 ≥ 2.25-V, VCC2 ≥ 13-V), PD: Power Down (VCC1 ≤ 1.7-V, VCC2 ≤ 9.5-V), X: Irrelevant
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10 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
10.1 Application Information
The ISO5851 is an isolated gate driver for power semiconductor devices such as IGBTs and MOSFETs. It is
intended for use in applications such as motor control, industrial inverters and switched mode power supplies. In
these applications, sophisticated PWM control signals are required to turn the power devices on and off, which at
the system level eventually may determine, for example, the speed, position, and torque of the motor or the
output voltage, frequency and phase of the inverter. These control signals are usually the outputs of a micro
controller, and are at low voltage levels such as 3.3-V or 5-V. The gate controls required by the MOSFETs and
IGBTs, on the other hand, are in the range of 30-V (using Unipolar Output Supply) to 15-V (using Bipolar Output
Supply), and need high current capability to be able to drive the large capacitive loads offered by those power
transistors. Not only that, the gate drive needs to be applied with reference to the Emitter of the IGBT (Source for
MOSFET), and by construction, the Emitter node in a gate drive system swings between 0 to the DC bus
voltage, that can be several 100s of volts in magnitude.
The ISO5851 is thus used to level shift the incoming 3.3-V and 5-V control signals from the microcontroller to the
30-V (using Unipolar Output Supply) to 15-V (using Bipolar Output Supply) drive required by the power
transistors while ensuring high-voltage isolation between the driver side and the microcontroller side.
10.2 Typical Applications
Figure 18 shows the typical application of a three-phase inverter using six ISO5851 isolated gate drivers. Three-
phase inverters are used for variable-frequency drives to control the operating speed of AC motors and for high
power applications such as High-Voltage DC (HVDC) power transmission.
The basic three-phase inverter consists of three single-phase inverter switches each comprising two ISO5851
devices that are connected to one of the three load terminals. The operation of the three switches is coordinated
so that one switch operates at each 60 degree point of the fundamental output waveform, thus creating a six-
step line-to-line output waveform. In this type of applications, carrier-based PWM techniques are applied to retain
waveform envelope and cancel harmonics.
Figure 18. Typical Motor Drive Application
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Typical Applications (continued)
10.2.1 Design Requirements
Unlike optocoupler based gate drivers which need external current drivers and biasing circuitry to provide the
input control signals, the input control to the ISO5851 is CMOS and can be directly driven by the microcontroller.
Other design requirements include decoupling capacitors on the input and output supplies, a pullup resistor on
the common drain FLT output signal, and a high-voltage protection diode between the IGBT collector and the
DESAT input. Further details are explained in the subsequent sections. Table 2 shows the allowed range for
Input and Output supply voltage, and the typical current output available from the gate-driver.
Table 2. Design Parameters
PARAMETER
Input supply voltage
VALUE
3-V to 5.5-V
15-V to 30-V
15-V to 30-V
0-V to 15-V
2.5-A
Unipolar output supply voltage (VCC2 - GND2 = VCC2 - VEE2
)
Bipolar output supply voltage (VCC2 - VEE2
)
Bipolar output supply voltage (GND2 - VEE2
Output current
)
10.2.2 Detailed Design Procedure
10.2.2.1 Recommended ISO5851 Application Circuit
The ISO5851 has both, inverting and non-inverting gate control inputs, an active low reset input, and an open
drain fault output suitable for wired-OR applications. The recommended application circuit in Figure 19 illustrates
a typical gate driver implementation with Unipolar Output Supply and Figure 20 illustrates a typical gate driver
implementation with Bipolar Output Supply using the ISO5851.
A 0.1-μF bypass capacitor, recommended at input supply pin VCC1 and 1-μF bypass capacitor, recommended at
output supply pin VCC2, provide the large transient currents necessary during a switching transition to ensure
reliable operation. The 220 pF blanking capacitor disables DESAT detection during the off-to-on transition of the
power device. The DESAT diode (DDST) and its 1-kΩ series resistor are external protection components. The RG
gate resistor limits the gate charge current and indirectly controls the IGBT collector voltage rise and fall times.
The open-drain FLT output and RDY output has a passive 10-kΩ pull-up resistor and a 220-pF filtering capacitor.
In this application, the IGBT gate driver is disabled when a fault is detected and will not resume switching until
the micro-controller applies a reset signal.
10R
10R
15
9,16
10
5
15
9,16
10
5
VCC1
GND1
IN+
VCC2
GND2
VEE2
VCC1
GND1
IN+
VCC2
GND2
VEE2
ISO5851
ISO5851
1ꢀF
1ꢀF
1ꢀF
0.1ꢀF
3V - 5.5V
3V-5.5V
15V
0.1ꢀF
15V
15V
3
3
1,8
1,8
DDST
DDST
1N
1N
10k
10k
10k
10k
11
12
13
14
2
7
6
4
11
12
13
14
2
7
6
4
IN-
DESAT
CLAMP
OUT
IN-
DESAT
CLAMP
OUT
RDY
FLT
RST
RDY
RG
RG
FLT
NC
NC
RST
220
pF
220
pF
Figure 19. Unipolar Output Supply
Figure 20. Bipolar Output Supply
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10.2.2.2 FLT and RDY Pin Circuitry
There is 50k pull-up resistor internally. The FLT and RDY pin is an open-drain output requiring a 10-kΩ pull-up
resistor to provide logic high when FLT and RDY is inactive, as shown in Figure 21.
Fast common mode transients can inject noise and glitches on FLT and RDY pins due to parasitic coupling. This
is dependent on board layout. If required, additional capacitance (100pF to 300pF) can be included on the FLT
and RDY pins.
10R
ISO5851
15
VCC1
0.1ꢀF
3V - 5V
9, 16
GND1
10k
10k
12
13
RDY
FLT
ꢀC
14
10
RST
IN+
11
IN-
Figure 21. FLT and RDY Pin Circuitry for High CMTI
10.2.2.3 Driving the Control Inputs
The amount of common-mode transient immunity (CMTI) can be curtailed by the capacitive coupling from the
high-voltage output circuit to the low-voltage input side of the ISO5851. For maximum CMTI performance, the
digital control inputs, IN+ and IN-, must be actively driven by standard CMOS, push-pull drive circuits. This type
of low-impedance signal source provides active drive signals that prevent unwanted switching of the ISO5851
output under extreme common-mode transient conditions. Passive drive circuits, such as open-drain
configurations using pull-up resistors, must be avoided. There is a 20 ns glitch filter which can filter a glitch up to
20 ns on IN+ or IN-.
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10.2.2.4 Local Shutdown and Reset
In applications with local shutdown and reset, the FLT output of each gate driver is polled separately, and the
individual reset lines are asserted low independently to reset the motor controller after a fault condition.
10R
ISO5851
VCC1
15
10R
15
ISO5851
VCC1
0.1ꢀF
3V - 5V
0.1ꢀF
3V - 5V
9,16
9,16
GND1
GND1
10k
10k
10k
10k
12
13
12
13
RDY
FLT
RDY
FLT
ꢀC
ꢀC
14
10
14
10
RST
IN+
RST
IN+
11
IN-
11
IN-
Figure 22. Local Shutdown and Reset for Noninverting (left) and Inverting Input Configuration (right)
10.2.2.5 Global-Shutdown and Reset
When configured for inverting operation, the ISO5851 can be configured to shutdown automatically in the event
of a fault condition by tying the FLT output to IN+. For high reliability drives, the open drain FLT outputs of
multiple ISO5851 devices can be wired together forming a single, common fault bus for interfacing directly to the
micro-controller. When any of the six gate drivers of a three-phase inverter detects a fault, the active low FLT
output disables all six gate drivers simultaneously; thereby, providing protection against further catastrophic
failures.
10R
15
ISO5851
VCC1
0.1ꢀF
3V - 5V
9,16
GND1
10k
10k
12
13
RDY
FLT
ꢀC
14
10
RST
IN+
11
IN-
to other
to other
s
s
FLT
RST
Figure 23. Global Shutdown with Inverting Input Configuration
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10.2.2.6 Auto-Reset
In this case, the gate control signal at IN+ is also applied to the RST input to reset the fault latch every switching
cycle. Incorrect RST makes output go low. A fault condition, however, the gate driver remains in the latched fault
state until the gate control signal changes to the 'gate low' state and resets the fault latch.
If the gate control signal is a continuous PWM signal, the fault latch will always be reset before IN+ goes high
again. This configuration protects the IGBT on a cycle by cycle basis and automatically resets before the next
'on' cycle.
ISO5851
VCC1
10R
ISO5851
VCC1
10R
15
15
0.1ꢀF
3V - 5V
0.1ꢀF
3V - 5V
9, 16
9, 16
GND1
GND1
RDY
10k
10k
10k
10k
12
13
12
13
RDY
FLT
FLT
RST
IN+
ꢀC
ꢀC
14
10
14
10
RST
IN+
11
11
IN-
IN-
Figure 24. Auto Reset for Non-inverting and Inverting Input Configuration
10.2.2.7 DESAT Pin Protection
Switching inductive loads causes large instantaneous forward voltage transients across the freewheeling diodes
of IGBTs. These transients result in large negative voltage spikes on the DESAT pin which draw substantial
current out of the device. To limit this current below damaging levels, a 100-Ω to 1-kΩ resistor is connected in
series with the DESAT diode.
Further protection is possible through an optional Schottky diode, whose low forward voltage assures clamping of
the DESAT input to GND2 potential at low voltage levels.
ISO5851
5
VCC2
GND2
VEE2
1ꢀF
1ꢀF
15V
15V
3
1,8
DDST
RS
2
7
6
4
DESAT
CLAMP
OUT
RG
VFW-Inst
NC
220 pF
VFW
Figure 25. DESAT Pin Protection with Series Resistor and Schottky Diode
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10.2.2.8 DESAT Diode and DESAT Threshold
The DESAT diode’s function is to conduct forward current, allowing sensing of the IGBT’s saturated collector-to-
emitter voltage, VCESAT, (when the IGBT is "on") and to block high voltages (when the IGBT is "off"). During the
short transition time when the IGBT is switching, there is commonly a high dVCE/dt voltage ramp rate across the
IGBT. This results in a charging current ICHARGE = CD-DESAT x dVCE/dt, charging the blanking capacitor. CD-DESAT is
the diode capacitance at DESAT.
To minimize this current and avoid false DESAT triggering, fast switching diodes with low capacitance are
recommended. As the diode capacitance builds a voltage divider with the blanking capacitor, large collector
voltage transients appear at DESAT attenuated by the ratio of 1+ CBLANK / CD-DESAT
.
Because the sum of the DESAT diode forward-voltage and the IGBT collector-emitter voltage make up the
voltage at the DESAT-pin, VF + VCE = VDESAT, the VCE level, which triggers a fault condition, can be modified by
adding multiple DESAT diodes in series: VCE-FAULT(TH) = 9 V – n x VF (where n is the number of DESAT diodes).
When using two diodes instead of one, diodes with half the required maximum reverse-voltage rating may be
chosen.
10.2.2.9 Determining the Maximum Available, Dynamic Output Power, POD-max
The ISO5851 maximum allowed total power consumption of PD = 272 mW consists of the total input power, PID,
the total output power, POD, and the output power under load, POL
:
PD = PID + POD + POL
(1)
(2)
(3)
(4)
With:
PID = VCC1-max × ICC1-max = 5.5 V × 4.5 mA = 24.75 mW
and:
POD = (VCC2 – VEE2) x ICC2-max = (15 V – ( –8 V )) × 6 mA = 138 mW
then:
POL = PD – PID – POD = 272 mW – 24.75 mW – 138 mW = 109.25 mW
In comparison to POL, the actual dynamic output power under worst case condition, POL-WC, depends on a variety
of parameters:
æ
ç
è
ö
÷
ø
ron-max
roff-max
POL-WC = 0.5 ´ f
´ QG
´
V
- VEE2
´
+
(
)
INP
CC2
ron-max + RG
roff-max + RG
where
•
•
•
•
•
•
•
fINP = signal frequency at the control input IN+
QG = power device gate charge
VCC2 = positive output supply with respect to GND2
VEE2 = negative output supply with respect to GND2
ron-max = worst case output resistance in the on-state: 4Ω
roff-max = worst case output resistance in the off-state: 2.5Ω
RG = gate resistor
(5)
Once RG is determined, Equation 5 is to be used to verify whether POL-WC < POL. Figure 26 shows a simplified
output stage model for calculating POL-WC
.
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ISO5851
VCC2
15V
RG
ron-max
OUT
QG
roff-max
8V
VEE2
Figure 26. Simplified Output Model for Calculating POL-WC
10.2.2.10 Example
This examples considers an IGBT drive with the following parameters:
ION-PK = 2 A, QG = 650 nC, fINP = 20 kHz, VCC2 = 15V, VEE2 = –8 V
(6)
Applying the value of the gate resistor RG = 10 Ω.
Then, calculating the worst-case output power consumption as a function of RG, using Equation 5 ron-max = worst
case output resistance in the on-state: 4 Ω, roff-max = worst case output resistance in the off-state: 2.5 Ω, RG
=
gate resistor yields
4 Ω
2.5 Ω
æ
ç
è
ö
÷
ø
POL-WC = 0.5´20 kHz´650 nC´ 15 V -( -8 V) ´
( )
+
4 Ω + 10 Ω 2.5 Ω + 10 Ω
= 72.61 mW
(7)
Because POL-WC = 72.61 mW is below the calculated maximum of POL = 109.25 mW, the resistor value of RG
=
10 Ω is suitable for this application.
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10.2.2.11 Higher Output Current Using an External Current Buffer
To increase the IGBT gate drive current, a non-inverting current buffer (such as the npn/pnp buffer shown in
Figure 27) may be used. Inverting types are not compatible with the desaturation fault protection circuitry and
must be avoided. The MJD44H11/MJD45H11 pair is appropriate for currents up to 8 A, the D44VH10/ D45VH10
pair for up to 15 A maximum.
5
VCC2
ISO5851
1ꢀF
1ꢀF
15V
15V
3
GND2
1,
8
VEE2
DDST
1N
2
7
6
4
DESAT
CLAMP
OUT
rG
10
NC
220
pF
Figure 27. Current Buffer for Increased Drive Current
10.2.3 Application Curve
Time - 2 ms/div
Time - 50 ns/div
CL = 10 nF
RG = 10 Ω
CL = 1 nF
RG = 0 Ω
VCC2 - VEE2= 23 V GND2 - VEE2 = 8 V
VCC2 - VEE2 = VCC2 - GND2 = 20 V
Figure 29. Normal Operation-Bipolar Supply
Figure 28. OUT Transient Waveform
24
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Product Folder Links: ISO5851
ISO5851
www.ti.com
SLLSEN5A –JUNE 2015–REVISED JUNE 2015
11 Power Supply Recommendations
To ensure reliable operation at all data rates and supply voltages, a 0.1-μF bypass capacitor is recommended at
input supply pin VCC1 and 1-μF bypass capacitor is recommended at output supply pin VCC2. The capacitors
should be placed as close to the supply pins as possible. Recommended placement of capacitors needs to be 2-
mm maximum from input and output power supply pin (VCC1 and VCC2).
12 Layout
12.1 Layout Guidelines
A minimum of four layers is required to accomplish a low EMI PCB design (see Figure 30). Layer stacking should
be in the following order (top-to-bottom): high-current or sensitive signal layer, ground plane, power plane and
low-frequency signal layer.
•
Routing the high-current or sensitive traces on the top layer avoids the use of vias (and the introduction of
their inductances) and allows for clean interconnects between the gate driver and the microcontroller and
power transistors. Gate driver control input, Gate driver output OUT and DESAT should be routed in the top
layer.
•
•
Placing a solid ground plane next to the sensitive signal layer provides an excellent low-inductance path for
the return current flow. On the driver side, use GND2 as the ground plane.
Placing the power plane next to the ground plane creates additional high-frequency bypass capacitance of
approximately 100 pF/inch2. On the gate-driver VEE2 and VCC2 can be used as power planes. They can share
the same layer on the PCB as long as they are not connected together.
•
Routing the slower speed control signals on the bottom layer allows for greater flexibility as these signal links
usually have margin to tolerate discontinuities such as vias.
For more detailed layout recommendations, including placement of capacitors, impact of vias, reference planes,
routing etc. see Application Note SLLA284, Digital Isolator Design Guide.
12.2 PCB Material
Standard FR-4 epoxy-glass is recommended as PCB material. FR-4 (Flame Retardant 4) meets the
requirements of Underwriters Laboratories UL94-V0, and is preferred over cheaper alternatives due to its lower
dielectric losses at high frequencies, less moisture absorption, greater strength and stiffness, and its self-
extinguishing flammability-characteristics.
12.3 Layout Example
High-speed traces
10 mils
Ground plane
Keep this
FR-4
0 ~ 4.5
space free
from planes,
traces , pads,
and vias
40 mils
10 mils
r
Power plane
Low-speed traces
Figure 30. Recommended Layer Stack
Copyright © 2015, Texas Instruments Incorporated
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ISO5851
SLLSEN5A –JUNE 2015–REVISED JUNE 2015
www.ti.com
13 Device and Documentation Support
13.1 Documentation Support
13.1.1 Related Documentation
For related documentation see the following:
•
•
•
ISO5851 Evaluation Module (EVM) User’s Guide, SLLU218
Digital Isolator Design Guide, SLLA284
Isolation Glossary (SLLA353)
13.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
13.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
13.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
13.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
14 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
26
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Product Folder Links: ISO5851
PACKAGE OUTLINE
DW0016B
SOIC - 2.65 mm max height
S
C
A
L
E
1
.
5
0
0
SOIC
C
10.63
9.97
SEATING PLANE
TYP
PIN 1 ID
AREA
0.1 C
A
14X 1.27
16
1
2X
10.5
10.1
NOTE 3
8.89
8
9
0.51
0.31
16X
7.6
7.4
B
2.65 MAX
0.25
C A
B
NOTE 4
0.38
0.25
TYP
SEE DETAIL A
0.25
GAGE PLANE
0.3
0.1
0 - 8
1.27
0.40
DETAIL A
TYPICAL
(1.4)
4221009/A 08/2013
NOTES:
1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm, per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm, per side.
5. Reference JEDEC registration MO-013, variation AA.
www.ti.com
EXAMPLE BOARD LAYOUT
DW0016B
SOIC - 2.65 mm max height
SOIC
SYMM
SYMM
16X (2)
16X (1.65)
SEE
DETAILS
SEE
DETAILS
1
1
16
16
16X (0.6)
16X (0.6)
SYMM
SYMM
14X (1.27)
14X (1.27)
9
9
8
8
(9.75)
(9.3)
HV / ISOLATION OPTION
8.1 mm CLEARANCE/CREEPAGE
IPC-7351 NOMINAL
7.3 mm CLEARANCE/CREEPAGE
LAND PATTERN EXAMPLE
SCALE:4X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL
METAL
0.07 MAX
ALL AROUND
0.07 MIN
ALL AROUND
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4221009/A 08/2013
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DW0016B
SOIC - 2.65 mm max height
SOIC
SYMM
SYMM
16X (1.65)
16X (2)
1
1
16
16
16X (0.6)
16X (0.6)
SYMM
SYMM
14X (1.27)
14X (1.27)
8
9
8
9
(9.75)
(9.3)
HV / ISOLATION OPTION
8.1 mm CLEARANCE/CREEPAGE
IPC-7351 NOMINAL
7.3 mm CLEARANCE/CREEPAGE
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:4X
4221009/A 08/2013
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
PACKAGE OPTION ADDENDUM
www.ti.com
30-Jun-2015
PACKAGING INFORMATION
Orderable Device
ISO5851DW
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 125
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
ACTIVE
SOIC
SOIC
DW
16
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
ISO5851
ISO5851
ISO5851DWR
ACTIVE
DW
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
30-Jun-2015
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Jun-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
ISO5851DWR
SOIC
DW
16
2000
330.0
16.4
10.75 10.7
2.7
12.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Jun-2015
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SOIC DW 16
SPQ
Length (mm) Width (mm) Height (mm)
367.0 367.0 38.0
ISO5851DWR
2000
Pack Materials-Page 2
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