LM25115A [TI]

LM25115A Secondary Side Post Regulator/DC-DC Converter with Power-Up/Power-Down Tracking;
LM25115A
型号: LM25115A
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

LM25115A Secondary Side Post Regulator/DC-DC Converter with Power-Up/Power-Down Tracking

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LM25115A  
www.ti.com  
SNVS501B FEBRUARY 2007REVISED APRIL 2013  
LM25115A Secondary Side Post Regulator/DC-DC Converter with Power-Up/Power-Down  
Tracking  
Check for Samples: LM25115A  
1
FEATURES  
DESCRIPTION  
The LM25115A controller contains all of the features  
necessary to produce multiple tracking outputs using  
the Secondary Side Post Regulation (SSPR)  
technique. The SSPR technique develops a highly  
efficient and well regulated auxiliary output from the  
secondary side switching waveform of an isolated  
power converter. LM25115A can be also used as a  
standalone DC/DC synchronous buck controller  
(Refer to Standalone DC/DC Synchronous Buck  
Mode section). Regulation of the auxiliary output  
voltage is achieved by leading edge pulse width  
modulation (PWM) of the main channel duty cycle.  
Leading edge modulation is compatible with either  
current mode or voltage mode control of the main  
output. The LM25115A drives external high-side and  
low-side NMOS power switches configured as a  
2
Power-up/Power-down Tracking  
Self-synchronization to Main Channel Output  
Leading Edge Pulse Width Modulation  
Valley Current Mode Control  
Standalone DC/DC Synchronous Buck Mode  
Operates from AC or DC Input up to 42V  
Wide 4.5V to 30V Bias Supply Range  
Wide 0.75V to 13.5V Output Range.  
Top and Bottom Gate Drivers Sink 2.5A Peak  
Adaptive Gate Driver Dead-time Control  
Wide Bandwidth Error Amplifier (4MHz)  
Programmable Soft-start  
Thermal Shutdown Protection  
synchronous buck regulator.  
A
current sense  
amplifier provides overload protection and operates  
over a wide common mode input range. Additional  
features include a low dropout (LDO) bias regulator,  
error amplifier, precision reference, adaptive dead  
time control of the gate signals and thermal  
shutdown.  
TSSOP-16 package  
Typical Application Circuit  
Phase Signal  
Main  
Output  
3.3V  
FEEDBACK  
Main Converter  
PWM Controller  
INPUT  
SYNC  
VCC  
HB  
+12V  
LM25115A  
R
S
HO  
Auxiliary  
Output  
2.5V  
VBIAS  
RAMP  
TRK/SS  
CO  
Main  
3.3V  
HS  
LO  
CS  
COMP  
VOUT  
PGND AGND  
FB  
Figure 1. Simplified Multiple Output Power Converter Utilizing SSPR Technique  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
All trademarks are the property of their respective owners.  
2
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2007–2013, Texas Instruments Incorporated  
 
LM25115A  
SNVS501B FEBRUARY 2007REVISED APRIL 2013  
www.ti.com  
Connection Diagram  
1
2
3
4
5
16  
15  
14  
13  
12  
11  
10  
9
VBIAS  
HB  
CS  
VOUT  
AGND  
CO  
HO  
HS  
VCC  
COMP  
6
7
FB  
LO  
TRK/SS  
PGND  
8
RAMP  
SYNC  
Figure 2. 16-Lead TSSOP  
See Package Numbers PW0016A  
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SNVS501B FEBRUARY 2007REVISED APRIL 2013  
PIN DESCRIPTIONS  
Pin  
Name  
Description  
Application Information  
1
CS  
Current Sense amplifier positive input  
A low inductance current sense resistor is connected between CS  
and VOUT. Current limiting occurs when the differential voltage  
between CS and VOUT exceeds 45mV (typical).  
2
VOUT  
Current sense amplifier negative input  
Connected directly to the output voltage. The current sense  
amplifier operates over a voltage range from 0V to 13.5V at the  
VOUT pin.  
3
4
AGND  
CO  
Analog ground  
Connect directly to the power ground pin (PGND).  
Current limit output  
For normal current limit operation, connect the CO pin to the  
COMP pin through a diode. CO pin is connected to ground through  
a resistor in series with a capacitor to provide adequate control  
loop compensation for the current limit gm amplifier. Leave this pin  
open to disable the current limit function.  
5
6
COMP  
FB  
Compensation. Error amplifier output  
Feedback. Error amplifier inverting input  
COMP pin pull-up is provided by an internal 300uA current source.  
Connected to the regulated output through the feedback resistor  
divider and compensation components. The non-inverting input of  
the error amplifier is internally connected to the SS pin.  
7
8
9
TRK/SS  
RAMP  
SYNC  
Tracking/Soft-start control  
PWM Ramp signal  
Non-inverting input to error amp with 15 µA pull-up current source.  
Can be used with capacitor for soft-start or tied to external divider  
of a master output for tracking. TRK/SS is the reference input to the  
amplifier when the voltage applied to the pin is < 0.75V. For higher  
inputs, the internal reference controls the amplifier.  
An external capacitor connected to this pin sets the ramp slope for  
the voltage mode PWM. The RAMP capacitor is charged with a  
current that is proportional to current into the SYNC pin. The  
capacitor is discharged at the end of every cycle by an internal  
MOSFET.  
Synchronization input  
A low impedance current input pin. The current into this pin sets the  
RAMP capacitor charge current and the frequency of an internal  
oscillator that provides a clock for the free-run (DC input) mode .  
10  
11  
PGND  
LO  
Power Ground  
Connect directly to the analog ground pin (AGND).  
Low-side gate driver output  
Connect to the gate of the low-side synchronous MOSFET through  
a short low inductance path.  
12  
VCC  
Output of bias regulator  
Nominal 7V output from the internal LDO bias regulator. Locally  
decouple to PGND using a low ESR/ESL capacitor located as  
close to controller as possible.  
13  
14  
15  
HS  
HO  
HB  
High-side MOSFET source connection  
High-side gate driver output  
Connect to negative terminal of the bootstrap capacitor and the  
source terminal of the high-side MOSFET.  
Connect to the gate of high-side MOSFET through a short low  
inductance path.  
High-side gate driver bootstrap rail  
Connect to the cathode of the bootstrap diode and the positive  
terminal of the bootstrap capacitor. The bootstrap capacitor  
supplies current to charge the high-side MOSFET gate and should  
be placed as close to controller as possible.  
16  
VBIAS  
Supply Bias Input  
Input to the LDO bias regulator and current sense amplifier that  
powers internal blocks. Input range of VBIAS is 4.5V to 30V.  
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SNVS501B FEBRUARY 2007REVISED APRIL 2013  
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
ABSOLUTE MAXIMUM RATINGS(1)(2)  
VBIAS to GND  
–0.3V to 32V  
–0.3V to 9V  
VCC to GND  
HS to GND  
–1V to 45V  
VOUT, CS to GND  
All other inputs to GND  
Storage Temperature Range  
Junction Temperature  
ESD Rating  
– 0.3V to 15V  
0.3V to 7.0V  
–55°C to +150°C  
+150°C  
(3)  
HBM  
2 kV  
(1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under  
which operation of the device is specified. Operating Ratings do not imply ensured performance limits. For ensured performance limits  
and associated test conditions, see the Electrical Characteristics tables.  
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and  
specifications.  
(3) The human body model is a 100 pF capacitor discharged through a 1.5kresistor into each pin.  
OPERATING RATINGS  
VBIAS supply voltage  
VCC supply voltage  
HS voltage  
5V to 30V  
5V to 7.5V  
0V to 42V  
HB voltage  
VCC + HS  
Operating Junction Temperature  
–40°C to +125°C  
TYPICAL OPERATING CONDITIONS  
Parameter  
Min  
4.5  
Typ  
Max  
30  
7
Units  
V
Supply Voltage, VBIAS  
Supply Voltage, VCC  
4.5  
V
Supply voltage bypass, CVBIAS  
Reference bypass capacitor, CVCC  
HB-HS bootstrap capacitor  
0.1  
1
1
µF  
µF  
µF  
µA  
V
0.1  
10  
0.047  
50  
SYNC Current Range (VCC = 4.5V)  
RAMP Saw Tooth Amplitude  
150  
1.75  
13.5  
1
VOUT regulation voltage (VBIAS min = 3V + VOUT)  
0.75  
V
ELECTRICAL CHARACTERISTICS(1)  
Unless otherwise specified, TJ = –40°C to +125°C, VBIAS = 12V, No Load on LO or HO.  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
VBIAS SUPPLY  
Ibias  
VBIAS Supply Current  
FSYNC = 200kHz  
4
mA  
VCC LOW DROPOUT BIAS REGULATOR  
VccReg  
VCC Regulation  
VCC open circuit. Outputs not switching  
6.65  
7
7.15  
V
mA  
V
(2)  
VCC Current Limit  
(
)
40  
VCC Under-voltage Lockout Voltage  
VCC Under-voltage Hysteresis  
Positive going VCC  
4
4.5  
0.3  
0.2  
0.25  
V
(1) Min and Max limits are 100% production tested at 25°C. Limits over the operating temperature range are specified through correlation  
using Statistical Quality Control (SQC) methods. Limits are used to calculate TI’s Average Outgoing Quality Level (AOQL).  
(2) Device thermal limitations may limit usable range.  
4
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ELECTRICAL CHARACTERISTICS(1) (continued)  
Unless otherwise specified, TJ = –40°C to +125°C, VBIAS = 12V, No Load on LO or HO.  
Symbol  
Parameter  
Conditions  
Min  
10  
Typ  
Max  
20  
Units  
TRACK / SOFT-START  
SS Pull-up Source  
15  
µA  
SS Discharge Impedance  
140  
ERROR AMPLIFIER and FEEDBACK REFERENCE  
VREF  
FB Reference Voltage  
FB Input Bias Current  
COMP Source Current  
Open Loop Voltage Gain  
Gain Bandwidth Product  
Input Offset Voltage  
COMP Offset  
Measured at FB pin  
.737  
.750  
0.2  
300  
60  
4
.763  
0.5  
V
µA  
µA  
dB  
MHz  
mV  
V
FB = 2V  
GBW  
Vio  
22  
2
Threshold for VHO = high RAMP = CS =  
VOUT = 0V  
RAMP Offset  
Threshold for VHO = high COMP = 1.5V,  
CS = VOUT = 0V  
1.0  
V
V
CURRENT SENSE AMPLIFIER  
Current Sense Amplifier Headroom  
Headroom = Vbias – Vout  
3
Vbias= 4.5 V and Vout= 1.5 V  
Current Sense Amplifier Gain  
Output DC Offset  
16  
V/V  
V
1.27  
500  
Amplifier Bandwidth  
kHz  
CURRENT LIMIT  
Slow ILIMIT Amp Transconductance  
Overall Transconductance  
Slow ILimit Threshold  
5
mA / V  
mA / V  
mV  
90  
45  
VCL = VCS - VVOUT  
VOUT = 6V and CO/COMP = 1.5V  
39  
34  
51  
46  
Slow ILimit Foldback  
VCL = VCS - VVOUT  
39  
mV  
VOUT = 0V and CO/COMP = 1.5V  
Fast ILimit Pull-Down Current  
Fast ILimit Threshold  
Vds = 2V  
45  
60  
mA  
mV  
mV  
VCLNEG  
Negative Current Limit  
VOUT = 6V  
-17  
VCL = VCS - VVOUT to cause LO to  
shutoff  
CO Clamp Voltage  
ICO Pull-Up Current  
5.5  
6
6.5  
V
15  
µA  
RAMP GENERATOR  
SYNC Input Impedance  
2.5  
20  
kΩ  
µA  
V
SYNC Threshold  
End of cycle detection threshold  
Free Run Mode Peak Threshold  
RAMP peak voltage with dc current  
applied to SYNC.  
2.35  
3.3  
Current Mirror Gain  
Ratio of RAMP charge current to SYNC  
input current.  
2.7  
A/A  
Discharge Impedance  
100  
LOW-SIDE GATE DRIVER  
VOLL  
VOHL  
LO Low-state Output Voltage  
LO High-state Output Voltage  
LO Rise Time  
ILO = 100mA  
0.15  
0.35  
15  
0.5  
0.8  
V
V
ILO = -100mA, VOHL = VCC -VLO  
CLOAD = 1000pF  
CLOAD = 1000pF  
VLO = 0V  
ns  
ns  
A
LO Fall Time  
12  
IOHL  
IOLL  
Peak LO Source Current  
Peak LO Sink Current  
2
VLO = 12V  
2.5  
A
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Units  
ELECTRICAL CHARACTERISTICS(1) (continued)  
Unless otherwise specified, TJ = –40°C to +125°C, VBIAS = 12V, No Load on LO or HO.  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
HIGH-SIDE GATE DRIVER  
VOLH  
VOHH  
HO Low-state Output Voltage  
HO High-state Output Voltage  
HO Rise Time  
IHO = 100mA  
0.15  
0.35  
15  
0.5  
0.8  
V
V
IHO = -100mA, VOHH = VHB –VHO  
CLOAD = 1000pF  
CLOAD = 1000pF  
VHO = 0V  
ns  
ns  
A
HO High-side Fall Time  
Peak HO Source Current  
Peak HO Sink Current  
12  
IOHH  
IOLH  
2
VHO = 12V  
2.5  
A
SWITCHING CHARACTERISITCS  
LO Fall to HO Rise Delay  
HO Fall to LO Rise Delay  
SYNC Fall to HO Fall Delay  
SYNC Rise to LO Fall Delay  
THERMAL SHUTDOWN  
CLOAD = 0  
CLOAD = 0  
CLOAD = 0  
CLOAD = 0  
40  
50  
ns  
ns  
ns  
ns  
120  
80  
TSD  
Thermal Shutdown Temp.  
150  
165  
25  
°C  
°C  
Thermal Shutdown Hysteresis  
THERMAL RESISTANCE  
θJA  
θJA  
Junction to Ambient  
Junction to Ambient  
PW Package  
SDA Package  
125  
32  
°C/W  
°C/W  
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TYPICAL PERFORMANCE CHARACTERISTICS  
Efficiency  
vs.  
Load Current and Vphase  
(VOUT = 2.5V)  
VCC Regulator Start-up Characteristics, VCC  
vs.  
VBIAS  
100  
98  
96  
94  
92  
90  
88  
86  
84  
82  
16  
14  
Vphase = 6V  
V
BIAS  
12  
10  
8
Vphase = 8V  
V
CC  
Vphase = 12V  
6
4
2
0
0
1
2
3
4
5
6
7
0
2
4
6
8
10 12 14 16  
(V)  
LOAD (A)  
V
BIAS  
Figure 3.  
Figure 4.  
Current Value (CV)  
vs.  
Current Sense Amplifier Gain and Phase  
vs.  
Current Limit (VCL  
)
Frequency  
2.5  
2
5
25  
20  
15  
10  
5
Gain  
V
= 6V  
OUT  
-10  
Phase  
16 V/V  
1.5  
1
-25  
-40  
-55  
-70  
Offset 1.27V  
0.5  
0
0
-20 -10  
0
10 20 30 40 50 60  
(mV)  
100  
1K  
10K  
100K  
1M  
V
CL  
FREQUENCY (Hz)  
Figure 5.  
Figure 6.  
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
Current Error Amplifier Transconductance  
Overall Current Amplifier Transconductance  
300  
200  
100  
0
700  
V
OUT  
= 6V  
600  
500  
V
= 0V  
OUT  
V
OUT  
= 6V  
5.9 mA/V  
400  
300  
88 mA/V  
-100  
99 mA/V  
200  
100  
-200  
-300  
0
30 32 34 36 38 40 42 44 46 48  
2.1  
1.96 1.98  
2
2.02 2.04 2.06 2.08  
(V)  
V
CS  
- V (mV)  
OUT  
C
V
Figure 7.  
Figure 8.  
Common Mode Output Voltage  
vs.  
Common Mode Output Voltage  
vs.  
Negative Current Limit (Room Temp)  
Positive Current Limit  
12  
10  
8
14  
12  
10  
-40oC  
125oC  
8
6
4
6
4
2
27oC  
2
0
0
0
10  
20  
V
30  
(mV)  
40  
50  
-17.8 -17.6-17.4 -17.2 -17 -16.8-16.6-16.4-16.2  
CL  
V
CL  
(mV)  
Figure 9.  
Figure 10.  
VCC Load Regulation to Current Limit  
8
7
6
5
4
3
2
1
0
0
5
10 15 20 25 30 35 40 45 50  
(mA)  
I
CC  
Figure 11.  
8
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BLOCK DIAGRAM  
V
CC  
VBIAS  
SYNC  
7V LDO  
REGULATOR  
V
CC  
LOGIC  
UVLO  
7V  
THERMAL  
LIMIT  
HB  
HO  
HS  
15 mA  
I
V
SYNC  
CC  
2.5k  
CLK  
2.5k  
R
S
Q
Q
LEVEL  
SHIFT  
DRIVER  
V
CC  
I
x 3  
SYNC  
RAMP  
0.7V  
ADAPTIVE  
DEAD TIME  
DELAY  
BUFFER  
100k  
55k  
CLK  
CRMIX  
V
CC  
FB  
PWM  
COMPARATOR  
40k  
V
CC  
LO  
V
CC  
DRIVER  
ERROR AMP  
(Sink Only)  
15 mA  
300 mA  
NEGATIVE  
CURRENT  
DETECTOR  
TRK/SS  
PGND  
1V  
0.75V  
AGND  
ENABLE  
ILIMIT SLOW  
Gm = 5 mA/V  
COMP  
CV  
ILIMIT FAST  
CURRENT SENSE AMP  
Gain = 16  
CS  
VBIAS  
2V  
1.27V  
CC  
V
OUT  
V
2.35V  
15 mA  
CO  
VINT  
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DETAILED OPERATING DESCRIPTION  
The LM25115A controller contains all of the features necessary to implement multiple output power converters  
utilizing the Secondary Side Post Regulation (SSPR) technique. The SSPR technique develops a highly efficient  
and well regulated auxiliary output from the secondary side switching waveform of an isolated power converter.  
Regulation of the auxiliary output voltage is achieved by leading edge pulse width modulation (PWM) of the main  
channel duty cycle. Leading edge modulation is compatible with either current mode or voltage mode control of  
the main output. The LM25115A drives external high-side and low-side NMOS power switches configured as a  
synchronous buck regulator. A current sense amplifier provides overload protection and operates over a wide  
common mode input range from 0V to 13.5V. Additional features include a low dropout (LDO) bias regulator,  
error amplifier, precision reference, adaptive dead time control of the gate driver signals and thermal shutdown.  
Low Drop-Out Bias Regulator (VCC)  
The LM25115A contains an internal LDO regulator that operates over an input supply range from 4.5V to 30V.  
The output of the regulator at the VCC pin is nominally regulated at 7V and is internally current limited to 40mA.  
VCC is the main supply to the internal logic, PWM controller, and gate driver circuits. When power is applied to  
the VBIAS pin, the regulator is enabled and sources current into an external capacitor connected to the VCC pin.  
The recommended output capacitor range for the VCC regulator is 0.1uF to 100uF. When the voltage at the VCC  
pin reaches the VCC under-voltage lockout threshold of 4.25V, the controller is enabled. The controller is  
disabled if VCC falls below 4.0V (250mV hysteresis). In applications where an appropriate regulated dc bias  
supply is available, the LM25115A controller can be powered directly through the VCC pin instead of the VBIAS  
pin. In this configuration, it is recommended that the VCC and the VBIAS pins be connected together such that  
the external bias voltage is applied to both pins. The allowable VCC range when biased from an external supply  
is 4.5V to 7V.  
Synchronization (SYNC) and Feed-Forward (RAMP)  
The pulsing “phase signal” from the main converter synchronizes the PWM ramp and gate drive outputs of the  
LM25115A. The phase signal is the square wave output from the transformer secondary winding before  
rectification (Figure 1). A resistor connected from the phase signal to the low impedance SYNC pin produces a  
square wave current (ISYNC) as shown in Figure 12. A current comparator at the SYNC input monitors ISYNC  
relative to an internal 15µA reference. When ISYNC exceeds 15µA, the internal clock signal (CLK) is reset and the  
capacitor connected to the RAMP begins to charge. The current source that charges the RAMP capacitor is  
equal to 3 times the ISYNC current. The falling edge of the phase signal sets the CLK signal and discharges the  
RAMP capacitor until the next rising edge of the phase signal. The RAMP capacitor is discharged to ground by a  
low impedance (100) n-channel MOSFET. The input impedance at SYNC pin is 2.5kwhich is normally much  
smaller than the external SYNC pin resistance.  
The RAMP and SYNC functions illustrated in Figure 12 provide line voltage feed-forward to improve the  
regulation of the auxiliary output when the input voltage of the main converter changes. Varying the input voltage  
to the main converter produces proportional variations in amplitude of the phase signal. The main channel PWM  
controller adjusts the pulse width of the phase signal to maintain constant volt*seconds and a regulated main  
output as shown in Figure 13. The variation of the phase signal amplitude and duration are reflected in the slope  
and duty cycle of the RAMP signal of the LM25115A (ISYNC α phase signal amplitude). As a result, the duty cycle  
of the LM25115A is automatically adjusted to regulate the auxiliary output voltage with virtually no change in the  
PWM threshold voltage. Transient line regulation is improved because the PWM duty cycle of the auxiliary  
converter is immediately corrected, independent of the delays of the voltage regulation loop.  
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Phase  
Signal  
R
SYNC  
SYNC  
Isync  
CLK  
15 mA  
2.5k  
2.5k  
Isync x 3  
RAMP  
BUFFER  
C
RAMP  
CLK  
Figure 12. Line Feed-Forward Diagram  
12V  
Phase signal  
6V  
Main Output = 3.3V  
PWM Threshold  
RAMP pin  
HS pin  
12V  
6V  
Secondary Output = 2.5V  
Figure 13. Line Feed-Forward Waveforms  
The recommended SYNC input current range is 50µA to 150µA. The SYNC pin resistor (RSYNC) should be  
selected to set the SYNC current (ISYNC) to 150µA with the maximum phase signal amplitude, VPHASE(max). This  
will ensure that ISYNC stays within the recommended range over a 3:1 change in phase signal amplitude. The  
SYNC pin resistor is therefore:  
RSYNC = (VPHASE(max) / 150µA) - 2.5k  
Once ISYNC has been established by selecting RSYNC, the RAMP signal slope/amplitude may be programmed by  
selecting the proper RAMP pin capacitor value. The RAMP signal slope should be selected to provide adequate  
slope compensation for the Valley current mode control scheme (Please refer to the Valley Current Mode Control  
section). The recommended peak amplitude of the ramp waveform is 1.75V.  
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Error Amplifier and Soft-Start (FB, CO, COMP & TRK/SS)  
An internal wide bandwidth error amplifier is provided within the LM25115A for voltage feedback to the PWM  
controller. The amplifier’s inverting input is connected to the FB pin. The output of the auxiliary converter is  
regulated by connecting a voltage setting resistor divider between the output and the FB pin. Loop compensation  
networks are connected between the FB pin and the error amplifier output (COMP). The amplifier has two non-  
inverting inputs. The first non-inverting input connects to a 0.75V bandgap reference while the second non-  
inverting input connects to the TRK/SS pin and it has 15 µA pull-up current source. The TRK/SS pin can be tied  
to an external resistor divider from the master output for tracking, or it can be tied to a capacitor for soft-start .  
TRK/SS is the reference input to the amplifier when the voltage applied to the pin is < 0.75V. For higher inputs,  
the internal reference controls the amplifier. When the VCC voltage is below the UVLO threshold, the TRK/SS  
pin is discharged to ground. When VCC rises and exceeds the positive going UVLO threshold (4.25V), the  
TRK/SS pin is released and allowed to rise. If an external capacitor is connected to the TRK/SS pin, it will be  
charged by the internal 15uA pull-up current source to gradually increase the non-inverting input of the error  
amplifier to 0.75V. During start-up, the output of the LM25115A converter will follow the following equation:  
VOUT(t) = VOUT(final) x15 µA x t /(.75 Vx Css )  
where  
Css = external Soft-Start capacitor  
VOUT(final) = regulator output set point  
Pull-up current for the error amplifier output is provided by an internal 300µA current source. The PWM threshold  
signal at the COMP pin can be controlled by either the open drain error amplifier or the open drain current  
amplifier connected through the CO pin to COMP. Since the internal error amplifier is configured as an open  
drain output it can be disabled by connecting FB to ground. The current sense amplifier and current limiting  
function will be described in a later section.  
Power-Up/Power-Down Tracking  
The LM25115A can track the output of a master power supply during soft start by connecting a resistor divider to  
the TRACK pin (Figure 14). Therefore, the output voltage slew rate of the LM25115A will be controlled by the  
master supply for loads that require precise sequencing. In order to track properly the output voltage of the  
LM25115A must be lower than the output voltage of the master supply.  
One way to use the tracking feature is to design the tracking resistor divider so that the master supply output  
voltage (VOUT1) and the LM25115A output voltage (VOUT2) both rise together and reach their target values at  
the same time. For this case, the equation governing the values of the tracking divider resistors RT1 and RT2 is:  
0.8 x RT2  
RT1  
=
VOUT1 - 0.8  
A value of 10k(1%) is recommended for RT2 as a good compromise between high precision and low quiescent  
current through the divider. If the master supply voltage was 3.3V and the LM25115A output voltage was 2.5 V,  
then the value of RT1 needed to give the two supplies identical soft start times would be 2.94 k(1%). The  
timing diagram and waveforms for the equal soft start time configuration are shown in Figure 15 and Figure 16.  
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3.3V  
Master  
Power  
Supply  
V
OUT1  
V
OUT1  
V
R
OUT2  
T2  
2.5V  
V
TRACK  
LM5115A  
SS  
V
OUT2  
R
V
R
FB2  
T1  
FB  
FB  
R
FB1  
Figure 14.  
Figure 15.  
Vphase = 10V  
CH1 = Master output, 1V/Div  
CH2 = COMP, 5/Div  
CH3 = Iout, 1A/Div  
CH4 = SSPR Output (Slave), 1V/Div  
Horizontal Resolution= 200 µs/Div  
Figure 16. Tracking with Equal Soft Start Time  
Alternatively, the tracking feature can be used to create equal slew rates between the output voltages of the  
master supply and the LM25115A. This method ensures that the output voltage of the LM25115A always  
reaches regulation before the output voltage of the master supply. In this case, the tracking resistors can be  
determined based on the following equation:  
0.8 x RT2  
RT1  
=
VOUT2 - 0.8  
Again, a value of 10k1% is recommended for RT2. For the case of VOUT1 = 3.3V and VOUT2 = 2.5V, RT1  
should be 4.32 k1%. The timing diagram and the waveforms for equal slew rates configuration are shown in  
Figure 17 and Figure 18.  
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3.3V  
2.5V  
V
OUT1  
2.5V  
V
OUT2  
Figure 17.  
Vphase = 10V  
CH1 = Master output, 1V/Div  
CH2 = COMP, 5/Div  
CH3 = Iout, 1A/Div  
CH4 = SSPR Output (Slave), 1V/Div  
Horizontal Resolution= 200 µs/Div  
Figure 18. Tracking with Equal Slew Rate  
Leading Edge Pulse Width Modulation  
Unlike conventional voltage mode controllers, the LM25115A implements leading edge pulse width modulation. A  
current source equal to 3 times the ISYNC current is used to charge the capacitor connected to the RAMP pin as  
shown in Figure 19. The ramp signal and the output of the error amplifier (COMP) are combined through a  
resistor network to produce a voltage ramp with variable dc offset (CRMIX in Figure 19). The high-side MOSFET  
which drives the HS pin is held in the off state at the beginning of the phase signal. When the voltage of CRMIX  
exceeds the internal threshold voltage CV, the PWM comparator turns on the high-side MOSFET. The HS pin  
rises and the MOSFET delivers current from the main converter phase signal to the output of the auxiliary  
regulator. The PWM cycle ends when the phase signal falls and power is no longer supplied to the drain of the  
high-side MOSFET.  
Leading edge modulation of the auxiliary PWM controller is required if the main converter uses peak current  
mode control. If trailing edge modulation were used, the additional load on the transformer secondary from the  
auxiliary channel would be drawn only during the first portion of the phase signal pulse. Referring to Figure 20,  
the turn-off of the high- side MOSFET of the auxiliary regulator would create a non-monotonic negative step in  
the transformer current. This negative current step would produce instability in a peak current mode controller.  
With leading edge modulation, the additional load presented by the auxiliary regulator on the transformer  
secondary will be present during the latter portion of the phase signal. This positive step in the phase signal  
current can be accommodated by a peak current mode controller without instability.  
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Isync x 3  
0.7V  
RAMP  
Phase or CLK  
RAMP  
BUFFER  
CLK  
C
RAMP  
55k  
CRMIX  
PWM  
CV  
40k  
CRMIX  
COMP  
CV  
ERROR  
AMP  
FB  
100k  
HS  
TRK/SS  
Leading Edge  
Modulation  
0.75V  
Figure 19. Synchronization and Leading Edge Modulation  
Main  
Main  
PWM  
PWM  
Auxilary  
PWM  
Auxilary  
PWM  
Leading Edge  
Modulation  
Trailing Edge  
Modulation  
Peak Current  
Threshold  
Peak Current  
Threshold  
Transformer  
Current  
Transformer  
Current  
Figure 20. Leading versus Trailing Edge Modulation  
Valley Current Mode Control  
The LM25115A controller uniquely utilizes the elements and benefits of valley current mode control in  
conjunction with leading edge modulation to correct changes in output voltage due to line and load transients.  
Contrary to peak current mode control, valley current mode control turns on the high-side MOSFET when the  
inductor valley current reaches a programmable threshold. This programmable threshold (CRMIX) is the sum of  
the output of voltage error amplifier and the RAMP signal generated at the RAMP pin. Valley current mode  
control experiences sub-harmonic oscillation when the duty ratio, D, is less than or equal to 50%. Therefore,  
adequate slope compensation is needed for the proper operation across the full range of the duty ratio. The  
RAMP signal is proportional to the input voltage and it provides the required slope compensation for the valley  
current mode scheme. The desired RAMP pin capacitance can be calculated from the following equation:  
CRAMP = (0.05 x L) /(RSYNC x RSENSE  
)
where  
L is the power inductor  
RSYNC is the SYNC pin resistor  
RSENSE is the current sense resistor  
The current sense amplifier shown in Figure 21 monitors the inductor current as it flows through a sense resistor  
connected between CS and VOUT. The voltage gain of the sense amplifier is nominally equal to 16. The current  
sense output signal is shifted by 1.27V to produce the internal CV reference signal. The CV signal is applied to  
the negative input of the PWM comparator and compared to CRMIX as illustrated in Figure 21. Therefore when  
CRMIX exceeds the PWM threshold (CV), the PWM comparator turns on the high-side MOSFET. Insure that the  
Vbias voltage is at least 3V above the regulated output voltage (VOUT) to provide enough headroom for the  
current sense amplifier.  
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Valley current mode control improves the control loop stability and bandwidth. It also eliminates the R-C lead  
network in the feedback path that is normally required with voltage mode control (Figure 22). Eliminating the lead  
network not only simplifies the compensation, but also reduces sensitivity to output noise that could pass through  
the lead network to the error amplifier.  
The design of the voltage feedback path through the error amp begins with the selection of R1 and R2 in  
Figure 22 to set the regulated output voltage. The steady state output voltage after soft-start is determined by the  
following equation:  
VOUT(final) = 0.75V x (1+R1/R2)  
The parallel impedance of the R1, R2 resistor divider should be approximately 2k(between 0.5kand 5k).  
Lower resistance values may not be properly driven by the error amplifier output and higher feedback resistances  
can introduce noise sensitivity. The next step in the design process is selection of R3, which sets the ac gain of  
the error amplifier.  
The capacitor C1 is connected in series with R3 to increase the dc gain of the voltage regulation loop and  
improve output voltage accuracy. The corner frequency set by R3 x C1 should be less than 1/10th of the cross-  
over frequency of the overall converter such that capacitor C1 does not add phase lag at the crossover  
frequency.  
Negative Current  
Comparator  
Low Side  
Enable  
1V  
ILIMIT SLOW  
Gm = 5 mA/V  
CS  
Vbias  
1.27V  
ILIMIT FAST  
CO  
2V  
V
CL  
V
OUT  
AV=16  
Current  
2.35V  
Sense Amp  
PWM  
Comparator  
CV  
to PWM  
Latch  
CRMIX  
ERROR  
AMP  
COMP  
FB  
TRK/SS  
0.75V  
Figure 21. Current Sensing and Limiting  
V
OUT  
No Lead  
Network  
Required  
R1  
PWM  
ERROR  
AMP  
FB  
CV  
40k  
TRK/SS  
0.75V  
100k  
COMP  
R3  
C1  
R2  
Figure 22. Voltage Sensing and Feedback  
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Current Limiting (CS, CO and VOUT)  
Current limiting is implemented through the current sense amplifier as illustrated in Figure 21. The current sense  
amplifier monitors the inductor current that flows through a sense resistor connected between CS and VOUT.  
The voltage gain of the current sense amplifier is nominally equal to 16. The output of current sense signal is  
shifted by 1.27V to produce the internal CV reference signal. The CV signal drives two current limit amplifiers.  
Both of the current limit amplifiers have open drain (sink only) output stages which are connected to the CO pin.  
The CO pin is typically connected to the COMP pin through a diode (the cathode is connected to the CO pin and  
the anode is connected to the COMP pin). The slow current limit amplifier has a nominal transconductance of 5  
mA/V and provides constant current mode operation at the desired current limit set point. The fast current limit  
amplifier has nominal current pull-down capability of 100mA and provides protection against fast over-current  
conditions. During normal operation, the voltage error amplifier controls the COMP pin voltage which adjusts the  
PWM duty cycle by varying the internal CRMIX level. However when the current sense input voltage, VCL  
,
exceeds 45mV, the slow current limit amplifier gradually pulls down on COMP through the CO pin. Pulling COMP  
low reduces the CRMIX signal and thereby reducing the operating duty cycle. By controlling the operating duty  
cycle, the slow current limit amplifier will force a constant current mode of operation at the desired current limit  
set point (Figure 23). A resistor in series with a capacitor are connected from the CO Pin to ground to provide  
adequate control loop compensation for the slow current limit (Figure 21). The desired current limit set point,  
ILimit, can be programmed by selecting the proper current sense resistor, RSENSE,using the following equation:  
RSENSE = 0.045 V/ ILimit  
In the event that the current sense input voltage, VCL, exceeds 60mV, the fast current limit amplifier will pull down  
hard on COMP through the CO pin. This will reduce the CRMIX signal to a voltage below the CV signal level.  
Therefore, the PWM comparator will inhibit output pulses. Once the fault condition is removed, the fast current  
limit amplifier will release COMP. Therefore, the CRMIX signal will increase to a normal operating threshold and  
the switching will resume (Figure 24). A current limit fold-back feature is provided by the LM25115A to reduce the  
peak output current delivered to a shorted load. When the common mode input voltage to the current sense  
amplifier (CS and VOUT pins) falls below 2V, the current limit threshold is reduced from the normal level. At  
common mode voltages > 2V, the current limit threshold is nominally 45mV. When VOUT is reduced to 0 V the  
current limit threshold drops to 39mV to reduce stress on the inductor and power MOSFETs.  
Vphase=10V  
CH1 = CO, 5V/Div  
CH2 = COMP, 5/Div  
CH3 = Iout, 5A/Div  
CH4 = SSPR Switch Signal, 5V/Div  
Horizontal Resolution= 2 µs/Div  
Figure 23. SSPR Steady State Current Limit (Output Shorted)  
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Vphase=10V  
CH1 = CO, 5V/Div  
CH2 = COMP, 5/Div  
CH3 = Iout, 10A/Div  
CH4 = SSPR Switch Signal, 4V/Div  
Horizontal Resolution= 20 µs/Div  
Figure 24. SSPR Short Circuit Transient (No-Load to Short-Circuit)  
Negative Current Limit  
Under certain conditions synchronous buck regulators are capable of sinking current from the output capacitors.  
This energy is stored in the inductor and returned to the input source. The LM25115A detects this current  
reversal by detecting a negative voltage being developed across the current sense resistor. The intent of this  
negative current comparator is to protect the low-side MOSFET from excessive currents. Excessive negative  
current can also lead to a large positive voltage spike on the HS pin at the turn-off of the low-side MOSFET. This  
voltage spike may damage the chip if its magnitude exceeds the maximum voltage rating of the part. The  
negative current comparator threshold is sufficiently negative to allow inductor current to reverse at no load or  
light load conditions. It is not intended to support discontinuous conduction mode with diode emulation by the  
low-side MOSFET. The negative current comparator shown in Figure 21 monitors the CV signal and compares  
this signal to a fixed 1V threshold. This corresponds to a negative VCL voltage between CS and VOUT of -17mV.  
The negative current limit comparator turns off the low-side MOSFET for the remainder of the cycle when the VCL  
input falls below this threshold.  
Gate Driver Outputs (HO & LO)  
The LM25115A provides two gate driver outputs, the floating high-side gate driver HO and the synchronous  
rectifier low-side driver LO. The low-side driver is powered directly by the VCC regulator. The high-side gate  
driver is powered from a bootstrap capacitor connected between HB and HS. An external diode connected  
between VCC and HB charges the bootstrap capacitor when the HS is low. When the high-side MOSFET is  
turned on, HB rises with HS to a peak voltage equal to VCC + VHS - VD where VD is the forward drop of the  
external bootstrap diode. Both output drivers have adaptive dead-time control to avoid shoot through currents.  
The adaptive dead-time control circuit monitors the state of each driver to ensure that one MOSFET is turned off  
before the other is turned on. The HB and VCC capacitors should be placed close to the pins of the LM25115A  
to minimize voltage transients due to parasitic inductances and the high peak output currents of the drivers. The  
recommended range of the HB capacitor is 0.047µF to 0.22µF.  
Both drivers are controlled by the PWM logic signal from the PWM latch. When the phase signal is low, the  
outputs are held in the reset state with the low-side MOSFET on and the high-side MOSFET off. When the phase  
signal switches to the high state, the PWM latch reset signal is de-asserted. The high-side MOSFET remains off  
until the PWM latch is set by the PWM comparator (CRMIX > CV as shown in Figure 19). When the PWM latch  
is set, the LO driver turns off the low-side MOSFET and the HO driver turns on the high-side MOSFET. The high-  
side pulse is terminated when the phase signal falls and SYNC input comparator resets the PWM latch.  
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Thermal Protection  
Internal thermal shutdown circuitry is provided to protect the integrated circuit in the event the maximum junction  
temperature limit is exceeded. When activated, typically at 165 degrees Celsius, the controller is forced into a low  
power standby state with the output drivers and the bias regulator disabled. The device will restart when the  
junction temperature falls below the thermal shutdown hysteresis, which is typically 25 degrees. The thermal  
protection feature is provided to prevent catastrophic failures from accidental device overheating.  
Standalone DC/DC Synchronous Buck Mode  
The LM25115A can be configured as a standalone DC/DC synchronous buck controller. In this mode the  
LM25115A uses leading edge modulation in conjunction with valley current mode control to control the  
synchronous buck power stage. The internal oscillator within the LM25115A sets the clock frequency for the high  
and low-side drivers of the external synchronous buck power MOSFETs . The clock frequency in the  
synchronous buck mode is programmed by the SYNC pin resistor and RAMP pin capacitor. Connecting a  
resistor between a dc bias supply and the SYNC pin produces a current, ISYNC, which sets the charging current of  
the RAMP pin capacitor. The RAMP capacitor is charged until its voltage reaches the peak ramp threshold of  
2.25V. The RAMP capacitor is then discharged for 300ns before beginning a new PWM cycle. The 300ns reset  
time of the RAMP pin sets the minimum off-time of the PWM controller in this mode. The internal clock frequency  
in the synchronous buck mode is set by ISYNC, the ramp capacitor, the peak ramp threshold, and the 300ns  
deadtime.  
FCLK 1 / ((CRAMP x 2.25V) / (ISYNC x 3) + 300ns)  
See the LM5115 dc evaluation board application note (AN-1367, literature number SNVA106) for more details on  
the synchronous buck mode. Please note that LM25115A is similar to LM5115 except for the tracking feature.  
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Application Circuit  
(Inputs from LM5025 Forward Active Clamp Converter, 36V to 78V)  
Figure 25. LM25115A Secondary Side Post Regulator  
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REVISION HISTORY  
Changes from Revision A (March 2013) to Revision B  
Page  
Changed layout of National Data Sheet to TI format .......................................................................................................... 19  
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PACKAGE OPTION ADDENDUM  
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7-Oct-2013  
PACKAGING INFORMATION  
Orderable Device  
LM25115AMT/NOPB  
LM25115AMTX/NOPB  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-40 to 125  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
ACTIVE  
TSSOP  
TSSOP  
PW  
16  
16  
92  
Green (RoHS  
& no Sb/Br)  
CU SN  
CU SN  
Level-1-260C-UNLIM  
L25115  
AMT  
ACTIVE  
PW  
2500  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
-40 to 125  
L25115  
AMT  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
6-Nov-2015  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
LM25115AMTX/NOPB  
TSSOP  
PW  
16  
2500  
330.0  
12.4  
6.95  
5.6  
1.6  
8.0  
12.0  
Q1  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
6-Nov-2015  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
TSSOP PW 16  
SPQ  
Length (mm) Width (mm) Height (mm)  
367.0 367.0 35.0  
LM25115AMTX/NOPB  
2500  
Pack Materials-Page 2  
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