OPA211I [TI]
1.1nV/Noise, Low Power, Precision Operational Amplifier in Tiny DFN-8 Package; 1.1nV /噪声,低功耗,采用微型DFN -8封装的高精度运算放大器型号: | OPA211I |
厂家: | TEXAS INSTRUMENTS |
描述: | 1.1nV/Noise, Low Power, Precision Operational Amplifier in Tiny DFN-8 Package |
文件: | 总9页 (文件大小:329K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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OPA211
OPA2211
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SBOS377A–OCTOBER 2006–REVISED FEBRUARY 2007
1.1nV/√Hz Noise, Low Power, Precision
Operational Amplifier in Tiny DFN-8 Package
FEATURES
DESCRIPTION
•
•
•
•
•
•
•
LOW-VOLTAGE NOISE: 1.1nV/√Hz at 1kHz
100nVPP INPUT VOLTAGE NOISE, 0.1Hz–10Hz
LOW OFFSET VOLTAGE: 100µV (max)
LOW OFFSET VOLTAGE DRIFT: 0.2µV/°C (typ)
LOW SUPPLY CURRENT: 3.6mA/Ch
UNITY GAIN STABLE
The OPA211 series achieves very low 1.1nV/√Hz
noise density with a supply current of only 3.6mA. It
also offers rail-to-rail output swing, which helps to
maximize dynamic range.
The OPA211 series’ extremely low voltage and
current noise, high speed and wide output swing
make it an excellent choice as a loop filter amplifier
in PLL applications.
GAIN BANDWIDTH PRODUCT:
80MHz (G = 100)
In precision data acquisition applications, the
OPA211 series of op amps provide <1µs settling
time to 16-bit accuracy even for 10V output swings.
This ac performance, combined with only 100µV of
offset and low drift over temperature, make the
•
•
SLEW RATE: 27V/µs
WIDE SUPPLY RANGE:
±2.25V to ±18V, +4.5V to +36V
•
•
•
•
RAIL-TO-RAIL OUTPUT
OUTPUT CURRENT: 30mA
SHUTDOWN: 20µA (max)
OPA211
high-precision analog-to-digital converters (ADCs) or
buffering the outputs of high-resolution
digital-to-analog converters (DACs).
highly
suitable
for
driving
fast,
AVAILABLE IN TINY DFN-8 (3x3mm), MSOP-8,
SO-8
The OPA211 is specified over the very wide
dual-power supply range of ±2.25V to ±18V, or
single-supply operation from +4.5V to +36V.
APPLICATIONS
•
•
PLL LOOP FILTER
LOW-NOISE, LOW-POWER SIGNAL
PROCESSING
HIGH-PERFORMANCE ADC DRIVERS
HIGH-PERFORMANCE DAC OUTPUT
AMPLIFIER
The OPA211 is available in the tiny DFN-8 (3×3mm)
and MSOP-8 and SO-8 packages. A dual version,
the OPA2211, is available in the DFN-8 (3×3mm) or
an MSOP-8 package. This series of op amps is
specified from –40°C to +125°C.
•
•
OPA211
•
•
•
•
•
•
•
•
ACTIVE FILTERS
NC
-IN
+IN
V-
1
2
3
4
8
7
6
5
Enable
V+
LOW-NOISE INSTRUMENTATION AMPS
ULTRASOUND AMPLIFIERS
PROFESSIONAL AUDIO PREAMPLIFIERS
LOW-NOISE FREQUENCY SYNTHESIZERS
INFRARED DETECTOR AMPLIFIERS
HYDROPHONE AMPLIFIERS
MEDICAL
OUT
NC
MSOP-8
OPA2211
OUT A
-IN A
+IN A
V-
1
2
3
4
8
7
6
5
V+
A
OUT B
-IN B
+IN B
B
MSOP-8
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCT PREVIEW information concerns products in the
formative or design phase of development. Characteristic data and
other specifications are design goals. Texas Instruments reserves
the right to change or discontinue these products without notice.
Copyright © 2006–2007, Texas Instruments Incorporated
OPA211
OPA2211
www.ti.com
SBOS377A–OCTOBER 2006–REVISED FEBRUARY 2007
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
ABSOLUTE MAXIMUM RATINGS(1)
Over operating free-air temperature range (unless otherwise noted)
VALUE
UNIT
V
Supply Voltage
±20
(V–) – 0.7 to (V+) + 0.7
±10
Input Voltage
V
Input Current
mA
Output Short-Circuit(2)
Operating Temperature
Storage Temperature
Junction Temperature
Continuous
–55 to +150
–65 to +150
+150
°C
°C
°C
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not supported.
(2) Short-circuit to ground, one amplifier per package.
PACKAGE/ORDERING INFORMATION(1)
PACKAGE
PRODUCT
PACKAGE-LEAD
SINGLE
ENABLE
DUAL
DESIGNATOR
PACKAGE MARKING
Standard Grade
DFN-8 (3×3mm)(2)
MSOP-8(2)
ü
ü
ü
ü
ü
DRG
DCK
D
TBD
TBD
TBD
TBD
TBD
OPA211A
OPA211A
SO-8
DFN-8 (3×3mm)(2)
MSOP-8(2)
ü
ü
DRG
DCK
OPA2211A
High Grade
DFN-8 (3×3mm)(2)
MSOP-8(2)
ü
ü
ü
ü
ü
DRG
DCK
D
TBD
TBD
TBD
TBD
TBD
OPA211I
SO-8
DFN-8 (3×3mm)(2)
MSOP-8(2)
ü
ü
DRG
DCK
OPA2211I
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Available Q4, 2007.
2
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OPA211
OPA2211
www.ti.com
SBOS377A–OCTOBER 2006–REVISED FEBRUARY 2007
PIN CONFIGURATIONS
OPA211
OPA211
OPA211
NC(1)
-IN
+IN
V-
1
2
3
4
8
7
6
5
NC(1)
V+
NC(1)
-IN
+IN
V-
1
2
3
4
8
7
6
5
NC(1)
-IN
+IN
V-
1
2
3
4
8
7
6
5
Enable(3)
V+
Enable(3)
V+
Exposed
Thermal
Die Pad
on
OUT
OUT
NC(1)
OUT
Underside(2)
NC(1)
NC(1)
DFN-8 (3x3mm)
SO-8
MSOP-8
OPA2211
OPA2211
V+
OUT A
-IN A
+IN A
V-
1
2
3
8
7
6
5
OUT A
-IN A
+IN A
V-
1
2
3
4
8
7
6
5
V+
Exposed
Thermal
Die Pad
on
A
OUT B
-IN B
+IN B
OUT B
-IN B
+IN B
B
Underside(2)
4
DFN-8 (3x3mm)
MSOP-8
(1) NC denotes no internal connection. Pin can be left floating or connected to any voltage between (V-) and (V+).
(2) Connect thermal die pad to V-.
(3) Enable function: (V-) £ ENABLED £ (V+) - 3V; DISABLED ³ (V+) - 0.35V.
3
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OPA211
OPA2211
www.ti.com
SBOS377A–OCTOBER 2006–REVISED FEBRUARY 2007
ELECTRICAL CHARACTERISTICS: VS = ±2.25V to ±18V
BOLDFACE limits apply over the specified temperature range, TA = –40°C to +125°C.
At TA = +25°C and RL = 10kΩ, unless otherwise noted.
Standard Grade
OPA211A, OPA2211A
High Grade
OPA211I, OPA2211I(1)
PARAMETER
OFFSET VOLTAGE
CONDITIONS
±15V
MIN
TYP
MAX
MIN
TYP
MAX
TBD
TBD
UNIT
Input Offset Voltage
Drift
VOS
dVOS/dT
PSRR
±20
±100
±20
µV
0.35
1
2
0.35
µV/°C
µV/V
vs Power Supply
INPUT BIAS CURRENT
Input Bias Current
Over Temperature
Offset Current
VS = ±2.25V to ±18V
VCM = 0V
IB
30
TBD
10
150
TBD
100
30
TBD
10
TBD
TBD
TBD
TBD
nA
nA
nA
nA
IOS
VCM = 0V
Over Temperature
NOISE
TBD
TBD
TBD
Input Voltage Noise:
f = 0.1Hz to 10Hz
Voltage Noise Density:
f = 10Hz
en
0.1
0.1
µVPP
2.5
1.6
1.1
2.5
1.6
1.1
nV/√Hz
nV/√Hz
nV/√Hz
f = 100Hz
f = 1kHz
Input Current Noise Density:
f = 10Hz
in
TBD
1.5
TBD
1.5
pA/√Hz
pA/√Hz
f = 1kHz
INPUT VOLTAGE RANGE
Common-Mode Voltage
Range
VCM
(V–)+1.8
114
(V+)–1.4
(V–)+1.8
114
(V+)–1.4
V
Common-Mode Rejection
Ratio
CMRR (V–)+1.8V < VCM < (V+)–1.4V
120
120
dB
INPUT IMPEDANCE
Differential
1010||TBD
109|| 2
1010 ||TBD
109 || 2
Ω || pF
Ω || pF
Common-Mode
OPEN-LOOP GAIN
Open-Loop Voltage Gain
AOL (V–)+0.2V < VO < (V+)–0.2V,
RL = 10kΩ
114
110
110
120
114
114
114
110
120
114
114
dB
dB
dB
AOL (V–)+0.6V < VO < (V+)–0.6V,
RL = 600Ω
Over Temperature
(V–)+0.6V < VO < (V+)–0.6V,
RL = 600Ω, IO < 25mA
FREQUENCY RESPONSE
Gain-Bandwidth Product
GBW
SR
G = 100
G = 1
80
58
80
58
MHz
MHz
V/µs
µs
Slew Rate
27
27
Settling Time, 0.01%
0.0015% (16-bit)
Overload Recovery Time
tS G = –1, 10V Step, CL = 100pF
G = –1, 10V Step, CL = 100pF
G = –1
TBD
TBD
< 1
TBD
TBD
< 1
µs
µs
Total Harmonic Distortion +
Noise
G = +10, f = 20kHz,
VO = 20VPP, 600Ω
THD+N
TBD
TBD
%
(1) Shaded cells indicate different specifications from low-grade version of device.
4
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OPA211
OPA2211
www.ti.com
SBOS377A–OCTOBER 2006–REVISED FEBRUARY 2007
ELECTRICAL CHARACTERISTICS: VS = ±2.25V to ±18V (continued)
BOLDFACE limits apply over the specified temperature range, TA = –40°C to +125°C.
At TA = +25°C and RL = 10kΩ, unless otherwise noted.
Standard Grade
OPA211A, OPA2211A
High Grade
OPA211I, OPA2211I(1)
PARAMETER
CONDITIONS
MIN
TYP
MAX
MIN
TYP
MAX
UNIT
OUTPUT
Voltage Output
VOUT
RL = 10kΩ, AOL > 114dB
RL = 600Ω, AOL > 110dB
(V–)+0.2
(V+)–0.2
(V–)+0.2
(V+)–0.2
V
(V–)+0.6
(V+)–0.6
(V–)+0.6
(V+)–0.6
V
RL = 600Ω, AOL > 110dB,
(V–)+0.6
(V+)–0.6
(V–)+0.6
(V+)–0.6
V
IO < 25mA
Short-Circuit Current
Capacitive Load Drive
POWER SUPPLY
Specified Voltage
ISC
+30/–45
+30/–45
mA
pF
CLOAD
See Typical Characteristics
See Typical Characteristics
VS
IQ
±2.25
±18
±2.25
±18
V
Quiescent Current
(per channel)
IOUT = 0
3.6
TBD
3.6
TBD
mA
Over Temperature
Shutdown Current
TBD
TBD
20
TBD
TBD
20
mA
µA
V
Disabled
Enabled
Disabled
TBD
TBD
ENABLE Pin Input Voltage
ENABLE Pin Input Voltage
TEMPERATURE RANGE
Specified Range
(V+)–3
(V+)–3
(V+)–0.35
(V+)–0.35
V
–40
–55
+125
+150
–40
–55
+125
+150
°C
°C
Operating Range
Thermal Resistance
θ
JA
Soldered to approximately
5cm × 5cm copper area
DFN (3mm × 3mm)
65
65
°C/W
°C/W
SO-8, MSOP-8
150
150
5
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PACKAGE OPTION ADDENDUM
www.ti.com
30-Jan-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
SOIC
MSOP
MSOP
SOIC
SOIC
Drawing
OPA211AID
OPA211AIDGKR
OPA211AIDGKT
OPA211AIDR
PREVIEW
PREVIEW
PREVIEW
PREVIEW
PREVIEW
D
DGK
DGK
D
8
8
8
8
8
75
2500
250
2500
75
TBD
TBD
TBD
TBD
TBD
Call TI
Call TI
Call TI
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Call TI
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Call TI
Call TI
POPA211AID
D
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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Addendum-Page 1
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