SN74AXC2T245 [TI]
具有可配置电压转换和三态输出的双位 2 DIR 引脚双电源总线收发器;
| 型号： | SN74AXC2T245 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有可配置电压转换和三态输出的双位 2 DIR 引脚双电源总线收发器 总线收发器 |
| 文件： | 总32页 (文件大小：573K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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SN74AXC2T245
SCES879 –MAY 2020
SN74AXC2T245 2-Bit Dual-Supply Bus Transceiver with Configurable Voltage Translation
and Tri-State Outputs
The SN74AXC2T245 device is designed for
asynchronous communication between data buses.
The device transmits data from the A bus to the B
bus or from the B bus to the A bus, depending on the
logic level of the direction-control inputs (DIRx). The
SN74AXC2T245 device is designed so the control pin
1 Features
1
•
Fully configurable dual-rail design allows each
port to operate with a power supply range from
0.65 V to 3.6 V
•
•
•
•
Operating temperature from –40°C to +125°C
DIR control input for each channel
(DIR) is referenced to VCCA
.
This device is fully specified for partial-power-down
applications using the Ioff current. The Ioff protection
circuitry ensures that no excessive current is drawn
from or to an input, output, or combined I/O that is
biased to a specific voltage while the device is
powered down.
Glitch-free power supply sequencing
Up to 380-Mbps support when translating from 1.8
V to 3.3 V
•
VCC isolation feature
–
If either VCC input is below 100 mV, all I/O
outputs are disabled and become high-
impedance
The VCC isolation feature ensures that if either VCCA
or VCCB is less than 100 mV, both I/O ports enter a
high-impedance state by disabling their outputs.
•
•
•
Ioff supports partial-power-down mode operation
Compatible with AVC-family level shifters
Glitch-free power supply sequencing allows either
supply rail to be powered on or off in any order while
providing robust power sequencing performance.
Latch-up performance exceeds 100 mA per JESD
78, class II
•
ESD protection exceeds JEDEC JS-001
Device Information(1)
–
–
8000-V Human-body model
PART NUMBER
PACKAGE BODY SIZE (NOM)
1000-V Charged-device model
SN74AXC2T245RSWR
UQFN (10) 1.80 mm x 1.40 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
2 Applications
•
•
•
•
•
•
Industrial
Functional Block Diagram
Personal Electronics
Wireless Infrastructure
Building Automation
Point of Sale
One of Two Transceivers
VCCA
VCCB
DIRx
OE
Enterprise and communications
3 Description
The SN74AXC2T245 is a two-bit noninverting bus
transceiver that uses two individually configurable
power-supply rails. The device is operational with
both VCCA and VCCB supplies as low as 0.65 V. The A
port is designed to track VCCA, which accepts any
supply voltage from 0.65 V to 3.6 V. The B port is
designed to track VCCB, which also accepts any
supply voltage from 0.65 V to 3.6 V. Additionally the
SN74AXC2T245 is compatible with a single-supply
system.
Bx
Ax
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
SN74AXC2T245
SCES879 –MAY 2020
www.ti.com
Table of Contents
7.1 Load Circuit and Voltage Waveforms ..................... 17
Detailed Description ............................................ 19
8.1 Overview ................................................................. 19
8.2 Functional Block Diagram ....................................... 19
8.3 Feature Description................................................. 19
8.4 Device Functional Modes........................................ 20
Application and Implementation ........................ 21
9.1 Application Information............................................ 21
9.2 Typical Application ................................................. 21
1
2
3
4
5
6
Features.................................................................. 1
8
Applications ........................................................... 1
Description ............................................................. 1
Revision History..................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 5
6.4 Thermal Information.................................................. 5
6.5 Electrical Characteristics........................................... 6
6.6 Switching Characteristics, VCCA = 0.7 ± 0.05 V........ 7
6.7 Switching Characteristics, VCCA = 0.8 ± 0.04 V........ 8
6.8 Switching Characteristics, VCCA = 0.9 ± 0.045 V...... 9
6.9 Switching Characteristics, VCCA = 1.2 ± 0.1 V........ 10
6.10 Switching Characteristics, VCCA = 1.5 ± 0.1 V...... 11
6.11 Switching Characteristics, VCCA = 1.8 ± 0.15 V.... 12
6.12 Switching Characteristics, VCCA = 2.5 ± 0.2 V...... 13
6.13 Switching Characteristics, VCCA = 3.3 ± 0.3 V...... 14
6.14 Operating Characteristics: TA = 25°C ................... 15
Parameter Measurement Information ................ 17
9
10 Power Supply Recommendations ..................... 23
11 Layout................................................................... 23
11.1 Layout Guidelines ................................................. 23
11.2 Layout Example .................................................... 23
12 Device and Documentation Support ................. 24
12.1 Related Documentation ....................................... 24
12.2 Receiving Notification of Documentation Updates 24
12.3 Support Resources ............................................... 24
12.4 Trademarks........................................................... 24
12.5 Electrostatic Discharge Caution............................ 24
12.6 Glossary................................................................ 24
13 Mechanical, Packaging, and Orderable
7
Information ........................................................... 24
4 Revision History
DATE
REVISION
NOTES
May 2020
*
Initial release.
2
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SCES879 –MAY 2020
5 Pin Configuration and Functions
RSW Package
10-Pin UQFN
Transparent Top View
7
1
6
2
A1
A2
8
9
5
4
3
B1
B2
DIR1
GND
10
Pin Functions
PIN
NAME
NO.
DESCRIPTION
RSW
DIR2
OE
1
2
Direction Pin for channel A2/B2, Connect to GND or to VCCA
Tri-state output-mode enable. Pull OE high to place all outputs in tri-state mode. Referenced to VCCA
.
GND
B2
3
Ground
4
Output or input depending on state of DIR2. Output level depends on VCCB
Output or input depending on state of DIR1. Output level depends on VCCB
Supply Voltage B
.
B1
5
.
VCCB
VCCA
A1
6
7
Supply Voltage A
8
Output or input depending on state of DIR1. Output level depends on VCCA
Output or input depending on state of DIR2. Output level depends on VCCA
Direction Pin for channel A1/B1, Connect to GND or to VCCA
.
A2
9
.
DIR1
10
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SCES879 –MAY 2020
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
–0.5
–0.5
–0.5
–0.5
–0.5
–0.5
–0.5
MAX UNIT
VCCA Supply voltage A
VCCB Supply voltage B
4.2
4.2
4.2
4.2
4.2
4.2
4.2
V
V
I/O Ports (A Port)
I/O Ports (B Port)
Control Inputs
A Port
VI
Input Voltage(2)
V
VO
VO
Voltage applied to any output in the high-impedance or power-off state(2)
Voltage applied to any output in the high or low state(2)(3)
V
V
B Port
A Port
–0.5 VCCA + 0.2
–0.5 VCCB + 0.2
–50
B Port
IIK
IOK
IO
Input clamp current
VI < 0
mA
mA
Output clamp current
VO < 0
–50
Continuous output current
Continuous current through VCC or GND
Junction Temperature
–50
50 mA
–100
100 mA
Tj
150
150
°C
°C
Tstg
Storage temperature
–65
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input voltage and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
(3) The output positive-voltage rating may be exceeded up to 4.2 V maximum if the output current rating is observed.
6.2 ESD Ratings
VALUE
±8000
±1000
UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
Charged device model (CDM), per JEDEC specification JESD22-C101(2)
V(ESD)
Electrostatic discharge
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
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SCES879 –MAY 2020
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)(1)(2)(3)
MIN
0.65
MAX UNIT
VCCA
VCCB
Supply voltage A
Supply voltage B
3.6
3.6
V
V
0.65
VCCI = 0.65 V - 0.75 V
VCCI = 0.76 V - 1 V
VCCI = 1.1 V - 1.95 V
VCCI = 2.3 V - 2.7 V
VCCI = 3 V - 3.6 V
VCCI x 0.70
VCCI x 0.70
VCCI x 0.65
1.6
Data Inputs
2
VIH
High-level input voltage
V
VCCA = 0.65 V - 0.75 V
VCCA = 0.76 V - 1 V
VCCA = 1.1 V - 1.95 V
VCCA = 2.3 V - 2.7 V
VCCA = 3 V - 3.6 V
VCCI = 0.65 V - 0.75 V
VCCI = 0.76 V - 1 V
VCCI = 1.1 V - 1.95 V
VCCI = 2.3 V - 2.7 V
VCCI = 3 V - 3.6 V
VCCA x 0.70
VCCA x 0.70
VCCA x 0.65
1.6
Control Inputs(DIRx, OE)
Referenced to VCCA
2
VCCI x 0.30
VCCI x 0.30
VCCI x 0.35
0.7
Data Inputs
0.8
VIL
Low-level input voltage
V
VCCA = 0.65 V - 0.75 V
VCCA = 0.76 V - 1 V
VCCA = 1.1 V - 1.95 V
VCCA = 2.3 V - 2.7 V
VCCA = 3 V - 3.6 V
VCCA x 0.30
VCCA x 0.30
VCCA x 0.35
0.7
Control Inputs(DIRx, OE)
Referenced to VCCA
0.8
(3)
VI
Input voltage
0
0
0
3.6
V
V
Active State
Tri-State
VCCO
VO
Output voltage
3.6
Δt/Δv
Input transition rate
10 ns/V
125 °C
TA
Operating free-air temperature
–40
(1) VCCI is the VCC associated with the input port.
(2) VCCO is the VCC associated with the output port.
(3) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs.
6.4 Thermal Information
SN74AXC2T245
THERMAL METRIC(1)
RSW (UQFN)
10 PINS
209.0
UNIT
RθJA
RθJC(top)
RθJB
ψJT
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
129.1
122.9
Junction-to-top characterization parameter
Junction-to-board characterization parameter
18.4
ψJB
122.5
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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6.5 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
(1)(2)
Operating free-air temperature (TA)
-40°C to 85°C -40°C to 125°C
PARAMETER
TEST CONDITIONS
VCCA
VCCB
UNIT
MIN TYP(3)
MAX
MIN TYP(3)
MAX
VCCO
– 0.1
VCCO
– 0.1
IOH = -100 µA
0.7 V - 3.6 V 0.7 V - 3.6 V
IOH = -50 µA
IOH = -200 µA
IOH = -500 µA
0.65 V
0.76 V
0.85 V
1.1 V
1.4 V
1.65 V
2.3 V
3 V
0.65 V
0.76 V
0.85 V
1.1 V
1.4 V
1.65 V
2.3 V
3 V
0.55
0.58
0.65
0.85
1.05
1.2
0.55
0.58
0.65
0.85
1.05
1.2
High-level
output
voltage
VOH
VI = VIH
V
IOH = -3 mA
IOH = -6 mA
IOH = -8 mA
IOH = -9 mA
1.75
2.3
1.75
2.3
IOH = -12 mA
IOL = 100 µA
IOL = 50 µA
0.7 V - 3.6 V 0.7 V - 3.6 V
0.1
0.1
0.1
0.1
0.65 V
0.76 V
0.85 V
1.1 V
1.4 V
1.65 V
2.3 V
3 V
0.65 V
0.76 V
0.85 V
1.1 V
1.4 V
1.65 V
2.3 V
3 V
IOL = 200 µA
IOL = 500 µA
VI = VIL IOL = 3 mA
IOL = 6 mA
0.18
0.2
0.18
0.2
0.25
0.35
0.45
0.55
0.7
Low-level
output
voltage
VOL
0.25
0.35
0.45
0.55
0.7
V
IOL = 8 mA
IOL = 9 mA
IOL = 12 mA
Control inputs (DIRx, OE):
VI = VCCA or GND
0.65 V- 3.6 V 0.65 V- 3.6 V
0.65 V- 3.6 V 0.65 V- 3.6 V
–0.5
–4
0.5
4
–1
–8
1
8
µA
µA
Input leakage
current
II
Data Inputs (Ax, Bx)
VI = VCCI or GND
0 V
0 V - 3.6 V
0 V
–4
–4
4
4
–8
–8
8
8
A or B Port
VI or VO = 0 V - 3.6 V
Partial power
down current
Ioff
µA
µA
0 V - 3.6 V
A or B Port
VI = VCCI or GND, VO
VCCO or GND, OE = VIH
Tri-state
output
IOZ
3.6 V
3.6 V
–4
–2
4
–8
8
=
(4)
current
0.65 V- 3.6 V 0.65 V- 3.6 V
10
14
VI =
VCCA supply
current
ICCA
VCCI or IO = 0
GND
0 V
3.6 V
0 V
–12
µA
µA
3.6 V
5
10
5
10
14
10
0.65 V- 3.6 V 0.65 V- 3.6 V
VI =
VCCB supply
current
ICCB
VCCI or IO = 0
GND
0 V
3.6 V
0 V
3.6 V
–2
–12
Combined
supply
current
VI =
ICCA
ICCB
+
VCCI or IO = 0
GND
0.65 V- 3.6 V 0.65 V- 3.6 V
16
23
µA
pF
pF
Control input
capacitance
Ci
VI = 3.3 V or GND
3.3 V
3.3 V
3.3 V
3.0
5.1
3.0
5.1
OE = VCCA, VO = 1.65V
DC +1 MHz -16 dBm sine 3.3 V
wave
Data I/O
capacitance
Cio
(1) VCCI is the VCC associated with the input port.
(2) VCCO is the VCC associated with the output port.
(3) All typical data is taken at 25°C.
(4) For I/O ports, the parameter IOZ includes the input leakage current.
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6.6 Switching Characteristics, VCCA = 0.7 ± 0.05 V
See Figure 1 and Table 1 for test circuit and loading. See Figure 2, Figure 3, and Figure 4 for measurement waveforms.
B-Port Supply Voltage (VCCB
)
PARAMETER
FROM
TO
Test Conditions 0.7 ± 0.05 V 0.8 ± 0.04 V 0.9 ± 0.045 V 1.2 ± 0.1 V
MIN MAX MIN MAX MIN MAX MIN MAX
1.5 ± 0.1 V
MIN MAX
1.8 ± 0.15 V
MIN MAX
2.5 ± 0.2 V
MIN MAX
3.3 ± 0.3 V
MIN MAX
UNIT
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
169
169
169
169
132
132
129
129
196
196
212
212
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
115
115
149
149
132
132
102
102
196
196
131
136
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
84
84
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
50
50
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
51
51
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
56
56
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
72
72
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
106
106
76
A
B
B
A
A
B
A
B
Propagation
delay
tpd
ns
122
122
132
132
88
84
79
78
77
84
79
78
77
76
132
132
48
132
132
43
132
132
43
132
132
53
132
132
98
OE
OE
OE
OE
tdis Disable time
ns
ns
88
48
43
43
53
98
196
196
94
196
196
54
196
196
42
196
196
43
196
196
60
196
196
128
128
ten Enable time
102
59
43
43
60
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6.7 Switching Characteristics, VCCA = 0.8 ± 0.04 V
See Figure 1 and Table 1 for test circuit and loading. See Figure 2, Figure 3, and Figure 4 for measurement waveforms.
B-Port Supply Voltage (VCCB
)
PARAMETER
FROM
TO
Test Conditions 0.7 ± 0.05 V 0.8 ± 0.04 V 0.9 ± 0.045 V 1.2 ± 0.1 V
MIN MAX MIN MAX MIN MAX MIN MAX
1.5 ± 0.1 V
MIN MAX
1.8 ± 0.15 V
MIN MAX
2.5 ± 0.2 V
MIN MAX
3.3 ± 0.3 V
MIN MAX
UNIT
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
149
149
115
115
91
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
94
94
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
63
63
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
34
34
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
28
28
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
27
27
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
28
28
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
34
34
A
B
B
A
A
B
A
B
Propagation
delay
tpd
ns
94
76
50
41
40
39
38
94
76
50
41
40
39
38
91
91
91
91
91
91
91
OE
OE
OE
OE
91
91
91
91
91
91
91
91
tdis Disable time
ns
ns
121
121
109
109
198
198
94
79
38
32
31
30
35
94
79
38
32
31
30
35
109
109
121
128
109
109
84
109
109
46
109
109
33
109
109
28
109
109
28
109
109
35
ten Enable time
95
52
35
30
28
35
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6.8 Switching Characteristics, VCCA = 0.9 ± 0.045 V
See Figure 1 and Table 1 for test circuit and loading. See Figure 2, Figure 3, and Figure 4 for measurement waveforms.
B-Port Supply Voltage (VCCB
)
PARAMETER
FROM
TO
Test Conditions 0.7 ± 0.05 V 0.8 ± 0.04 V 0.9 ± 0.045 V 1.2 ± 0.1 V
MIN MAX MIN MAX MIN MAX MIN MAX
1.5 ± 0.1 V
MIN MAX
1.8 ± 0.15 V
MIN MAX
2.5 ± 0.2 V
MIN MAX
3.3 ± 0.3 V
MIN MAX
UNIT
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
122
122
84
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
76
76
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
51
51
51
51
70
70
74
75
65
65
78
91
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
23
23
39
39
70
70
33
33
65
65
42
48
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
18
18
28
28
70
70
26
27
65
65
29
32
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
16
16
24
24
70
70
25
25
65
65
25
26
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
15
15
21
21
70
70
22
23
65
65
20
21
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
17
17
21
21
70
70
25
26
65
65
21
22
A
B
B
A
A
B
A
B
Propagation
delay
tpd
ns
63
84
63
70
70
OE
OE
OE
OE
70
70
tdis Disable time
ns
ns
116
116
65
89
89
65
65
65
ten Enable time
184
184
115
123
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6.9 Switching Characteristics, VCCA = 1.2 ± 0.1 V
See Figure 1 and Table 1 for test circuit and loading. See Figure 2, Figure 3, and Figure 4 for measurement waveforms.
B-Port Supply Voltage (VCCB
)
PARAMETER
FROM
TO
Test Conditions 0.7 ± 0.05 V 0.8 ± 0.04 V 0.9 ± 0.045 V 1.2 ± 0.1 V
MIN MAX MIN MAX MIN MAX MIN MAX
1.5 ± 0.1 V
MIN MAX
1.8 ± 0.15 V
MIN MAX
2.5 ± 0.2 V
MIN MAX
3.3 ± 0.3 V
MIN MAX
UNIT
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
84
84
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
50
50
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
39
39
23
23
25
26
69
70
29
30
70
83
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
15
15
15
15
25
26
27
28
29
30
37
43
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
10
11
12
12
25
26
20
22
29
30
25
28
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
9
9
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
7
8
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
8
8
A
B
B
A
A
B
A
B
Propagation
delay
tpd
ns
50
33
10
10
25
26
18
20
29
30
20
22
8
7
50
33
8
7
25
25
25
26
15
16
29
30
15
17
25
26
15
16
29
30
13
15
OE
OE
OE
OE
26
26
tdis Disable time
ns
ns
110
110
29
83
84
29
30
30
ten Enable time
154
165
102
112
10
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6.10 Switching Characteristics, VCCA = 1.5 ± 0.1 V
See Figure 1 and Table 1 for test circuit and loading. See Figure 2, Figure 3, and Figure 4 for measurement waveforms.
B-Port Supply Voltage (VCCB
)
PARAMETER
FROM
TO
Test Conditions 0.7 ± 0.05 V 0.8 ± 0.04 V 0.9 ± 0.045 V 1.2 ± 0.1 V
MIN MAX MIN MAX MIN MAX MIN MAX
1.5 ± 0.1 V
MIN MAX
1.8 ± 0.15 V
MIN MAX
2.5 ± 0.2 V
MIN MAX
3.3 ± 0.3 V
MIN MAX
UNIT
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
79
79
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
41
41
28
28
17
18
82
82
18
19
92
106
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
28
28
18
18
17
18
67
68
18
19
65
78
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
12
12
10
11
17
18
25
26
18
19
34
40
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
9
9
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
7
8
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
6
6
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
6
6
A
B
B
A
A
B
A
B
Propagation
delay
tpd
ns
50
9
8
6
5
50
9
8
6
5
17
17
18
18
20
18
19
22
25
17
18
16
18
18
19
18
20
17
18
13
14
18
19
13
15
17
18
13
14
18
19
11
13
OE
OE
OE
OE
18
tdis Disable time
ns
ns
108
108
18
19
ten Enable time
148
157
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6.11 Switching Characteristics, VCCA = 1.8 ± 0.15 V
See Figure 1 and Table 1 for test circuit and loading. See Figure 2, Figure 3, and Figure 4 for measurement waveforms.
B-Port Supply Voltage (VCCB
)
PARAMETER
FROM
TO
Test Conditions 0.7 ± 0.05 V 0.8 ± 0.04 V 0.9 ± 0.045 V 1.2 ± 0.1 V
MIN MAX MIN MAX MIN MAX MIN MAX
1.5 ± 0.1 V
MIN MAX
1.8 ± 0.15 V
MIN MAX
2.5 ± 0.2 V
MIN MAX
3.3 ± 0.3 V
MIN MAX
UNIT
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
78
78
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
40
40
27
27
15
16
81
82
14
15
88
103
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
24
24
16
16
15
16
67
67
14
15
62
74
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
10
10
9
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
8
8
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
7
7
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
6
6
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
5
5
A
B
B
A
A
B
A
B
Propagation
delay
tpd
ns
56
7
7
5
4
56
9
8
7
6
5
15
15
16
24
26
14
15
32
38
15
16
18
19
14
15
21
24
15
16
16
17
14
15
17
19
15
16
12
13
14
15
13
14
15
16
12
13
14
15
11
12
OE
OE
OE
OE
16
tdis Disable time
ns
ns
108
108
14
15
ten Enable time
147
155
12
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6.12 Switching Characteristics, VCCA = 2.5 ± 0.2 V
See Figure 1 and Table 1 for test circuit and loading. See Figure 2, Figure 3, and Figure 4 for measurement waveforms.
B-Port Supply Voltage (VCCB
)
PARAMETER
FROM
TO
Test Conditions 0.7 ± 0.05 V 0.8 ± 0.04 V 0.9 ± 0.045 V 1.2 ± 0.1 V
MIN MAX MIN MAX MIN MAX MIN MAX
1.5 ± 0.1 V
MIN MAX
1.8 ± 0.15 V
MIN MAX
2.5 ± 0.2 V
MIN MAX
3.3 ± 0.3 V
MIN MAX
UNIT
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
77
77
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
39
39
28
28
11
12
81
81
10
11
86
101
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
22
22
15
15
11
12
66
67
10
11
59
72
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
8
8
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
6
6
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
5
5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
5
5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
4
5
A
B
B
A
A
B
A
B
Propagation
delay
tpd
ns
71
7
6
5
5
4
71
8
6
6
5
4
11
11
12
24
25
10
11
29
35
11
12
17
18
10
11
19
21
11
12
15
16
10
11
15
17
11
12
11
12
10
11
12
13
11
12
11
12
10
11
10
11
OE
OE
OE
OE
12
tdis Disable time
ns
ns
108
108
10
11
ten Enable time
146
153
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6.13 Switching Characteristics, VCCA = 3.3 ± 0.3 V
See Figure 1 and Table 1 for test circuit and loading. See Figure 2, Figure 3, and Figure 4 for measurement waveforms.
B-Port Supply Voltage (VCCB
)
PARAMETER
FROM
TO
Test Conditions 0.7 ± 0.05 V 0.8 ± 0.04 V 0.9 ± 0.045 V 1.2 ± 0.1 V
MIN MAX MIN MAX MIN MAX MIN MAX
1.5 ± 0.1 V
MIN MAX
1.8 ± 0.15 V
MIN MAX
2.5 ± 0.2 V
MIN MAX
3.3 ± 0.3 V
MIN MAX
UNIT
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
76
76
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
38
38
34
34
10
11
81
81
8
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
21
21
17
17
10
11
66
67
8
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
7
8
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
5
5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
4
5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
4
4
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
4
4
A
B
B
A
A
B
A
B
Propagation
delay
tpd
ns
106
106
10
8
6
5
4
4
8
6
5
5
4
10
11
24
25
8
10
11
17
18
8
10
11
15
16
8
10
11
11
12
8
10
11
11
11
8
OE
OE
OE
OE
11
tdis Disable time
ns
ns
108
108
8
9
9
9
9
9
9
9
9
ten Enable time
146
153
85
101
58
72
28
34
18
21
14
16
11
12
9
10
14
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6.14 Operating Characteristics: TA = 25°C
PARAMETER
TEST CONDITIONS
VCCA
0.7 V
VCCB
0.7 V
MIN
TYP
MAX UNIT
2.1
2.0
0.8 V
0.9 V
1.2 V
1.5 V
1.8 V
2.5 V
3.3 V
0.7 V
0.8 V
0.9 V
1.2 V
1.5 V
1.8 V
2.5 V
3.3 V
0.7 V
0.8 V
0.9 V
1.2 V
1.5 V
1.8 V
2.5 V
3.3 V
0.7 V
0.8 V
0.9 V
1.2 V
1.5 V
1.8 V
2.5 V
3.3 V
0.8 V
0.9 V
1.2 V
1.5 V
1.8 V
2.5 V
3.3 V
0.7 V
0.8 V
0.9 V
1.2 V
1.5 V
1.8 V
2.5 V
3.3 V
0.7 V
0.8 V
0.9 V
1.2 V
1.5 V
1.8 V
2.5 V
3.3 V
0.7 V
0.8 V
0.9 V
1.2 V
1.5 V
1.8 V
2.5 V
3.3 V
2.0
Power Dissipation Capacitance
per transceiver (A to B: outputs
enabled)
2.0
CL = 0, RL = Open f = 1
MHz, tr = tf = 1 ns
pF
2.1
2.1
2.5
3.1
1.6
1.6
1.6
Power Dissipation Capacitance
per transceiver (A to B: outputs
disabled)
1.6
CL = 0, RL = Open f = 1
MHz, tr = tf = 1 ns
pF
pF
pF
1.6
1.7
2.1
2.6
CpdA
10.5
10.6
10.6
10.8
11.2
12.5
16.3
20.0
1.0
Power Dissipation Capacitance
per transceiver (B to A: outputs
enabled)
CL = 0, RL = Open f = 1
MHz, tr = tf = 1 ns
0.9
0.9
Power Dissipation Capacitance
per transceiver (B to A: outputs
disabled)
0.9
CL = 0, RL = Open f = 1
MHz, tr = tf = 1 ns
0.9
0.9
0.9
0.9
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Operating Characteristics: TA = 25°C (continued)
PARAMETER
TEST CONDITIONS
VCCA
0.7 V
VCCB
0.7 V
MIN
TYP
10.9
10.9
10.9
11.1
11.4
12.6
16.3
20.0
1.3
MAX UNIT
0.8 V
0.9 V
1.2 V
1.5 V
1.8 V
2.5 V
3.3 V
0.7 V
0.8 V
0.9 V
1.2 V
1.5 V
1.8 V
2.5 V
3.3 V
0.7 V
0.8 V
0.9 V
1.2 V
1.5 V
1.8 V
2.5 V
3.3 V
0.7 V
0.8 V
0.9 V
1.2 V
1.5 V
1.8 V
2.5 V
3.3 V
0.8 V
0.9 V
1.2 V
1.5 V
1.8 V
2.5 V
3.3 V
0.7 V
0.8 V
0.9 V
1.2 V
1.5 V
1.8 V
2.5 V
3.3 V
0.7 V
0.8 V
0.9 V
1.2 V
1.5 V
1.8 V
2.5 V
3.3 V
0.7 V
0.8 V
0.9 V
1.2 V
1.5 V
1.8 V
2.5 V
3.3 V
Power Dissipation Capacitance
per transceiver (A to B: outputs
enabled)
CL = 0, RL = Open f = 1
MHz, tr = tf = 1 ns
pF
pF
pF
pF
1.2
1.2
Power Dissipation Capacitance
per transceiver (A to B: outputs
disabled)
1.1
CL = 0, RL = Open f = 1
MHz, tr = tf = 1 ns
1.1
1.1
1.1
1.2
CpdB
2.1
2.1
2.0
Power Dissipation Capacitance
per transceiver (B to A: outputs
enabled)
2.0
CL = 0, RL = Open f = 1
MHz, tr = tf = 1 ns
2.1
2.2
2.5
3.1
1.6
1.6
1.6
Power Dissipation Capacitance
per transceiver (B to A: outputs
disabled)
1.6
CL = 0, RL = Open f = 1
MHz, tr = tf = 1 ns
1.6
1.7
2.1
2.6
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7 Parameter Measurement Information
7.1 Load Circuit and Voltage Waveforms
Unless otherwise noted, all input pulses are supplied by generators having the following characteristics:
•
•
•
f = 1 MHz
ZO = 50 Ω
dv/dt ≤ 1 ns/V
Measurement Point
2 x VCCO
Open
S1
RL
Output Pin
Under Test
GND
(1)
CL
RL
(1) CL includes probe and jig capacitance.
Figure 1. Load Circuit
Table 1. Load Circuit Conditions
Parameter
VCCO
RL
CL
S1
VTP
N/A
N/A
Δt/Δv Input transition rise or fall rate
0.65 V – 3.6 V
1.1 V – 3.6 V
1 MΩ
2 kΩ
15 pF
15 pF
Open
Open
tpd Propagation (delay) time
0.65 V – 0.95
V
20 kΩ
15 pF
Open
N/A
3 V – 3.6 V
1.65 V – 2.7 V
1.1 V – 1.6 V
2 kΩ
2 kΩ
2 kΩ
15 pF
15 pF
15 pF
2 × VCCO
2 × VCCO
2 × VCCO
0.3 V
0.15 V
0.1 V
ten, tdis Enable time, disable time
0.65 V – 0.95
V
20 kΩ
15 pF
2 × VCCO
0.1 V
3 V – 3.6 V
1.65 V – 2.7 V
1.1 V – 1.6 V
2 kΩ
2 kΩ
2 kΩ
15 pF
15 pF
15 pF
GND
GND
GND
0.3 V
0.15 V
0.1 V
ten, tdis Enable time, disable time
0.65 V – 0.95
V
20 kΩ
15 pF
GND
0.1 V
(1)
VCCI
(1)
VCCI
Input A, B
100 kHz
VCCI / 2
VCCI / 2
Input A, B
500 ps/V œ 100 ns/V
0 V
VOH
0 V
VOH
(2)
tpd
tpd
(2)
Output B, A
Ensure Monotonic
Rising and Falling Edge
(2)
VOL
Output B, A
VCCI / 2
VCCI / 2
(2)
VOL
1. VCCI is the supply pin associated with the input port.
2. VOH and VOL are typical output voltage levels that occur with
specified RL, CL, and S1
1. VCCI is the supply pin associated with the input port.
2. VOH and VOL are typical output voltage levels that occur with
specified RL, CL, and S1
Figure 3. Input Transition Rise or Fall Rate
Figure 2. Propagation Delay
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VCCA
GND
OE
VCCA / 2
VCCA / 2
tdis
ten
(3)
VCCO
Output(1)
VCCO / 2
VOL + VTP
(4)
VOL
(4)
VOH
VOH - VTP
Output(2)
VCCO / 2
GND
(1) Output waveform on the condition that input is driven to a valid Logic Low.
(2) Output waveform on the condition that input is driven to a valid Logic High.
(3) VCCO is the supply pin associated with the output port.
(4) VOH and VOL are typical output voltage levels with specified RL, CL, and S1.
Figure 4. Enable Time And Disable Time
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8 Detailed Description
8.1 Overview
The SN74AXC2T245 is a 2-bit, dual-supply noninverting bidirectional voltage level translation device. Ax pins
and control pins (DIRx and OE) are reference to VCCA logic levels, and Bx pins are referenced to VCCB logic
levels. The A port is able to accept I/O voltages ranging from 0.65 V to 3.6 V, while the B port can accept I/O
voltages from 0.65 V to 3.6 V. A high on DIR enables data transmission from A to B and a low on DIR enables
data transmission from B to A. See Device Functional Modes for a summary of the operation of the control logic.
8.2 Functional Block Diagram
One of Two Transceivers
VCCA
VCCB
DIRx
OE
Bx
Ax
8.3 Feature Description
8.3.1 Standard CMOS Inputs
Standard CMOS inputs are high impedance and are typically modeled as a resistor in parallel with the input
capacitance given in the Electrical Characteristics. The worst case resistance is calculated with the maximum
input voltage, given in the Absolute Maximum Ratings, and the maximum input leakage current, given in the
Electrical Characteristics, using Ohm's law (R = V ÷ I).
Signals applied to the inputs need to have fast edge rates, as defined by Δt/Δv in Recommended Operating
Conditions to avoid excessive current consumption and oscillations. If a slow or noisy input signal is required, a
device with a Schmitt-trigger input should be used to condition the input signal prior to the standard CMOS input.
8.3.2 Balanced High-Drive CMOS Push-Pull Outputs
A balanced output allows the device to sink and source similar currents. The high drive capability of this device
creates fast edges into light loads so routing and load conditions should be considered to prevent ringing.
Additionally, the outputs of this device are capable of driving larger currents than the device can sustain without
being damaged. The electrical and thermal limits defined in the Absolute Maximum Ratings must be followed at
all times.
8.3.3 Partial Power Down (Ioff
)
The inputs and outputs for this device enter a high-impedance state when the device is powered down, inhibiting
current backflow into the device. The maximum leakage into or out of any input or output pin on the device is
specified by Ioff in the Electrical Characteristics.
8.3.4 VCC Isolation
The inputs and outputs for this device enter a high-impedance state when either supply is < 100mV.
8.3.5 Over-voltage Tolerant Inputs
Input signals to this device can be driven above the supply voltage so long as they remain below the maximum
input voltage value specified in the Recommended Operating Conditions.
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Feature Description (continued)
8.3.6 Glitch-free Power Supply Sequencing
Either supply rail may be powered on or off in any order without producing a glitch on the I/Os (that is, where the
output erroneously transitions to VCC when it should be held low). Glitches of this nature can be misinterpreted
by a peripheral as a valid data bit, which could trigger a false device reset of the peripheral, a false device
configuration of the peripheral, or even a false data initialization by the peripheral. For more information
regarding the power up glitch performance of the AXC family of level translators, see the Glitch Free Power
Sequencing With AXC Level Translators application report
8.3.7 Negative Clamping Diodes
The inputs and outputs to this device have negative clamping diodes as depicted in Figure 5.
CAUTION
Voltages beyond the values specified in the Absolute Maximum Ratings table can
cause damage to the device. The input negative-voltage and output voltage ratings
may be exceeded if the input and output clamp-current ratings are observed.
VCC
Device
Input
Output
Logic
GND
-IIK
-IOK
Figure 5. Electrical Placement of Clamping Diodes for Each Input and Output
8.3.8 Fully Configurable Dual-Rail Design
Both the VCCA and VCCB pins can be supplied at any voltage from 0.65 V to 3.6 V, making the device suitable for
translating between any of the voltage nodes (0.7 V, 0.8 V, 0.9 V, 1.2 V, 1.8 V, 2.5 V and 3.3 V).
8.3.9 Supports High-Speed Translation
The SN74AXC2T245 device can support high data-rate applications. The translated signal data rate can be up to
380 Mbps when the signal is translated from 1.8 V to 3.3 V.
8.4 Device Functional Modes
Table 2. Function Table
(Each Transceiver)(1)(2)
CONTROL INPUTS
Port Status
A PORT
OPERATION
OE
L
DIRx
B PORT
Input (Hi-Z)
L
H
X
Output (Enabled)
Input (Hi-Z)
B data to A bus
A data to B bus
Isolation
L
Output (Enabled)
Input (Hi-Z)
H
Input (Hi-Z)
(1) Input circuits of the data I/Os are always active.
(2) Pins configured as inputs should not be left floating.
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The SN74AXC2T245 device can be used in level-translation applications for interfacing devices or systems
operating at different interface voltages with one another. The SN74AXC2T245 device is ideal for use in
applications where a push-pull driver is connected to the data I/Os. The max data rate can be up to 380 Mbps
when device translates a signal from 1.8 V to 3.3 V.
One example application is shown in Figure 6, where the SN74AXC2T245 device is used to translate low voltage
UART signals from a CPU to a higher voltage signal to properly drive the inputs of a bluetooth module.
9.2 Typical Application
Pullup Resistors keep device disabled
during power up. OE input may also be
tied to GND to keep device enabled
0.7 V
3.3 V
0.1 µF
0.1 µF
VCCA
VCCB
DIR1
DIR2
Bluetooth
Module
SoC
SN74AXC2T245
GPIO1
OE
A1
A2
TX
RX
RX
TX
B1
B2
GND
Figure 6. 2-Pin UART Application
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Typical Application (continued)
9.2.1 Design Requirements
For this design example, use the parameters listed in Table 3.
Table 3. Design Parameters
DESIGN PARAMETERS
Input voltage range
EXAMPLE VALUES
0.65 V to 3.6 V
Output voltage range
0.65 V to 3.6 V
9.2.2 Detailed Design Procedure
To begin the design process, determine the following:
•
Input voltage range
–
Use the supply voltage of the device that is driving the SN74AXC2T245 device to determine the input
voltage range. For a valid logic high, the value must exceed the high-level input voltage (VIH) of the input
port. For a valid logic low the value must be less than the low-level input voltage (VIL) of the input port.
•
Output voltage range
–
Use the supply voltage of the device being driven by the SN74AXC2T245 determine the output voltage
range of the SN74AXC2T245.
9.2.3 Application Curve
Figure 7. Up Translation at 2.5 MHz (0.7 V to 3.3 V)
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10 Power Supply Recommendations
Always apply a ground reference to the GND pins first. This device is designed for glitch-free power sequencing
without any supply sequencing requirements such as ramp order or ramp rate.
This device is designed with various power supply sequencing methods in mind to help prevent unintended
triggering of downstream devices. For more information regarding the power-up glitch performance of the AXC
family of level translators, see the Glitch Free Power Sequencing With AXC Level Translators application report
11 Layout
11.1 Layout Guidelines
To ensure reliability of the device, following common printed-circuit board layout guidelines are recommended:
•
Use bypass capacitors on the power supply pins and place them as close to the device as possible. A 0.1-µF
capacitor is recommended, but transient performance can be improved by having both 1-µF and 0.1-µF
capacitors in parallel as bypass capacitors.
•
Use short trace lengths to avoid excessive loading.
11.2 Layout Example
Legend
Via to VCCA
Via to VCCB
A
B
G
Via to GND
Copper Traces
SN74AXC2T245RSW
0201
0201
G
0.1µF
0.1µF
A
B
VCCA
VCCB
8 mil
7
6
TX from Module
RX to Module
RX to SoC
B1
B2
8
9
5
4
A1
TX from Soc
A2
DIR1
10
3 GND
G
1
2
DIR2
OE
G
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12 Device and Documentation Support
12.1 Related Documentation
For related documentation see the following:
Texas Instruments, Implications of Slow or Floating CMOS Inputs application report
Texas Instruments, Power Sequencing for AXC Family of Devices application report
12.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
12.3 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
12.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
12.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
SN74AXC2T245RSWR
ACTIVE
UQFN
RSW
10
3000 RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
1HN
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN74AXC2T245 :
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
Automotive: SN74AXC2T245-Q1
•
NOTE: Qualified Version Definitions:
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Jun-2023
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
SN74AXC2T245RSWR
UQFN
RSW
10
3000
180.0
9.5
1.6
2.0
0.8
4.0
8.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Jun-2023
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
UQFN RSW 10
SPQ
Length (mm) Width (mm) Height (mm)
189.0 185.0 36.0
SN74AXC2T245RSWR
3000
Pack Materials-Page 2
PACKAGE OUTLINE
RSW0010A
UQFN - 0.55 mm max height
S
C
A
L
E
7
.
0
0
0
PLASTIC QUAD FLATPACK - NO LEAD
1.45
1.35
A
B
PIN 1 INDEX AREA
1.85
1.75
0.55
0.45
C
NOTE 3
SEATING PLANE
0.05 C
0.05
0.00
2X 0.8
SYMM
(0.13) TYP
3
5
0.45
0.35
9X
2
6
7
SYMM
6X 0.4
1
0.25
10X
0.15
0.07
0.05
C A B
10
8
0.55
0.45
PIN 1 ID
4224897/A 03/2019
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This package complies to JEDEC MO-288 variation UDEE, except minimum package height.
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EXAMPLE BOARD LAYOUT
RSW0010A
UQFN - 0.55 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
SYMM
8
10
SEE SOLDER MASK
DETAIL
10X (0.2)
(0.7)
1
7
SYMM
6X (0.4)
(1.6)
6
2
(R0.05) TYP
9X (0.6)
3
5
(1.2)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 30X
0.05 MIN
ALL AROUND
0.05 MAX
ALL AROUND
METAL UNDER
SOLDER MASK
METAL EDGE
EXPOSED METAL
SOLDER MASK
OPENING
EXPOSED
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4224897/A 03/2019
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
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EXAMPLE STENCIL DESIGN
RSW0010A
UQFN - 0.55 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
SYMM
8
10
10X (0.2)
6X (0.4)
(0.7)
1
7
SYMM
(1.6)
6
2
(R0.05) TYP
9X (0.6)
3
5
(1.2)
SOLDER PASTE EXAMPLE
BASED ON 0.125 MM THICK STENCIL
SCALE: 30X
4224897/A 03/2019
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
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相关型号：
SN74AXC4T245-Q1_V03
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