SN74CBT1G125_16 [TI]

SINGLE FET BUS SWITCH;
SN74CBT1G125_16
型号: SN74CBT1G125_16
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

SINGLE FET BUS SWITCH

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中文:  中文翻译
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SN74CBT1G125  
SINGLE FET BUS SWITCH  
SCDS046G – FEBRUARY 1998 – REVISED JANUARY 2003  
DBV OR DCK PACKAGE  
(TOP VIEW)  
5-Switch Connection Between Two Ports  
TTL-Compatible Control Input Levels  
Latch-Up Performance Exceeds 250 mA Per  
JESD 17  
OE  
A
GND  
V
B
1
2
3
5
4
CC  
ESD Protection Exceeds JESD 22  
– 2000-V Human-Body Model (A114-A)  
– 200-V Machine Model (A115-A)  
description/ordering information  
The SN74CBT1G125 features a single high-speed line switch. The switch is disabled when the output-enable  
(OE) input is high.  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
T
A
PACKAGE  
Reel of 3000  
Reel of 250  
Reel of 3000  
Reel of 250  
SN74CBT1G125DBVR  
SN74CBT1G125DBVT  
SN74CBT1G125DCKR  
SN74CBT1G125DCKT  
SOT (SOT-23) – DBV  
S25_  
–40°C to 85°C  
SOT (SC-70) – DCK  
SM_  
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines  
are available at www.ti.com/sc/package.  
The actual top-side marking has one additional character that designates the assembly/test site.  
FUNCTION TABLE  
INPUT  
FUNCTION  
OE  
L
A port = B port  
Disconnect  
H
logic diagram (positive logic)  
2
1
4
B
A
OE  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Copyright 2003, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN74CBT1G125  
SINGLE FET BUS SWITCH  
SCDS046G FEBRUARY 1998 REVISED JANUARY 2003  
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)  
Supply voltage range, V  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to 7 V  
CC  
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to 7 V  
I
Continuous channel current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA  
Input clamp current, I (V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA  
IK I/O  
Package thermal impedance, θ (see Note 2): DBV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 206°C/W  
JA  
DCK package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 252°C/W  
Storage temperature range, T  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65°C to 150°C  
stg  
Stresses beyond those listed under absolute maximum ratingsmay cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditionsis not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.  
2. The package thermal impedance is calculated in accordance with JESD 51-7.  
recommended operating conditions (see Note 3)  
MIN  
4
MAX  
UNIT  
V
V
V
V
Supply voltage  
5.5  
CC  
IH  
IL  
High-level control input voltage  
Low-level control input voltage  
Operating free-air temperature  
2
V
0.8  
85  
V
T
A
40  
°C  
NOTE 3: All unused control inputs of the device must be held at V  
or GND to ensure proper device operation. Refer to the TI application report,  
CC  
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.  
electrical characteristics over recommended operating free-air temperature range (unless  
otherwise noted)  
PARAMETER  
TEST CONDITIONS  
I = 18 mA  
MIN TYP  
MAX  
1.2  
±1  
UNIT  
V
V
V
V
V
= 4.5 V,  
= 5.5 V,  
= 5.5 V,  
IK  
CC  
CC  
CC  
I
I
I
V = 5.5 V or GND  
I
µA  
µA  
pF  
I
I
O
= 0,  
V = V or GND  
I CC  
1
CC  
C
C
Control input  
V = 3 V or 0  
I
3
4
i
V
O
= 3 V or 0,  
OE = V  
CC  
pF  
io(OFF)  
V
= 4 V,  
TYP at V  
= 4 V,  
V
= 2.4 V,  
I = 15 mA  
I
14  
5
20  
7
CC  
CC  
I
I = 64 mA  
I
§
V = 0  
I
r
on  
V
CC  
= 4.5 V  
I = 30 mA  
I
5
7
V
I
= 2.4 V,  
I = 15 mA  
I
10  
15  
§
All typical values are at V  
= 5 V (unless otherwise noted), T = 25°C.  
A
CC  
Measured by the voltage drop between the A and the B terminals at the indicated current through the switch. On-state resistance is determined  
by the lower of the voltages of the two (A or B) terminals.  
switching characteristics over recommended operating free-air temperature range, C = 50 pF  
L
(unless otherwise noted) (see Figure 1)  
V
= 5 V  
CC  
± 0.5 V  
V
= 4 V  
FROM  
(INPUT)  
TO  
(OUTPUT)  
CC  
PARAMETER  
UNIT  
MIN  
MAX  
MIN MAX  
t
t
t
A or B  
OE  
B or A  
A or B  
A or B  
0.35  
5.5  
0.25  
4.9  
ns  
ns  
ns  
pd  
en  
1.6  
1
4.5  
4.2  
OE  
dis  
Thepropagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance, when  
driven by an ideal voltage source (zero output impedance).  
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN74CBT1G125  
SINGLE FET BUS SWITCH  
SCDS046G FEBRUARY 1998 REVISED JANUARY 2003  
PARAMETER MEASUREMENT INFORMATION  
7 V  
Open  
GND  
TEST  
S1  
S1  
500 Ω  
t
Open  
7 V  
From Output  
Under Test  
pd  
t
/t  
PLZ PZL  
t
/t  
Open  
PHZ PZH  
C
= 50 pF  
L
500 Ω  
(see Note A)  
3 V  
0 V  
Output  
Control  
1.5 V  
1.5 V  
LOAD CIRCUIT  
t
t
PLZ  
PZL  
Output  
Waveform 1  
S1 at 7 V  
3.5 V  
3 V  
0 V  
1.5 V  
Input  
V
V
+ 0.3 V  
1.5 V  
1.5 V  
OL  
V
(see Note B)  
OL  
OH  
t
t
PHZ  
PZH  
t
t
PHL  
PLH  
Output  
Waveform 2  
S1 at Open  
(see Note B)  
V
V
OH  
0.3 V  
OH  
1.5 V  
Output  
1.5 V  
1.5 V  
0 V  
V
OL  
VOLTAGE WAVEFORMS  
PROPAGATION DELAY TIMES  
VOLTAGE WAVEFORMS  
ENABLE AND DISABLE TIMES  
NOTES: A.  
C includes probe and jig capacitance.  
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.  
C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, Z = 50 , t 2.5 ns, t 2.5 ns.  
O
r
f
D. The outputs are measured one at a time with one transition per measurement.  
E.  
F.  
G.  
t
t
t
and t  
and t  
and t  
are the same as t  
are the same as t  
are the same as t  
.
dis  
en  
.
pd  
PLZ  
PZL  
PLH  
PHZ  
PZH  
PHL  
.
Figure 1. Load Circuit and Voltage Waveforms  
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
PACKAGE OPTION ADDENDUM  
www.ti.com  
11-Apr-2013  
PACKAGING INFORMATION  
Orderable Device  
74CBT1G125DBVRE4  
74CBT1G125DBVRG4  
74CBT1G125DBVTE4  
74CBT1G125DBVTG4  
74CBT1G125DCKRE4  
74CBT1G125DCKRG4  
74CBT1G125DCKTE4  
74CBT1G125DCKTG4  
SN74CBT1G125DBVR  
SN74CBT1G125DBVT  
SN74CBT1G125DCKR  
SN74CBT1G125DCKT  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
Top-Side Markings  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4)  
ACTIVE  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SC70  
DBV  
5
5
5
5
5
5
5
5
5
5
5
5
3000  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
(S25G ~ S25J ~  
S25S)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
DBV  
DBV  
DBV  
DCK  
DCK  
DCK  
DCK  
DBV  
DBV  
DCK  
DCK  
3000  
250  
Green (RoHS  
& no Sb/Br)  
(S25G ~ S25J ~  
S25S)  
Green (RoHS  
& no Sb/Br)  
(S253 ~ S25S)  
250  
Green (RoHS  
& no Sb/Br)  
(S253 ~ S25S)  
3000  
3000  
250  
Green (RoHS  
& no Sb/Br)  
(SM3 ~ SMS ~ SMT ~  
SMU)  
SC70  
Green (RoHS  
& no Sb/Br)  
(SM3 ~ SMS ~ SMT ~  
SMU)  
SC70  
Green (RoHS  
& no Sb/Br)  
(SM3 ~ SMS)  
SC70  
250  
Green (RoHS  
& no Sb/Br)  
(SM3 ~ SMS)  
SOT-23  
SOT-23  
SC70  
3000  
250  
Green (RoHS  
& no Sb/Br)  
(S25G ~ S25J ~  
S25S)  
Green (RoHS  
& no Sb/Br)  
(S253 ~ S25S)  
3000  
250  
Green (RoHS  
& no Sb/Br)  
(SM3 ~ SMS ~ SMT ~  
SMU)  
SC70  
Green (RoHS  
& no Sb/Br)  
(SM3 ~ SMS)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
11-Apr-2013  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4)  
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a  
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
16-May-2013  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
SN74CBT1G125DBVR SOT-23  
SN74CBT1G125DBVR SOT-23  
SN74CBT1G125DBVT SOT-23  
DBV  
DBV  
DBV  
DCK  
DCK  
5
5
5
5
5
3000  
3000  
250  
178.0  
180.0  
180.0  
180.0  
180.0  
9.0  
8.4  
8.4  
8.4  
8.4  
3.23  
3.23  
3.23  
2.25  
2.25  
3.17  
3.17  
3.17  
2.4  
1.37  
1.37  
1.37  
1.22  
1.22  
4.0  
4.0  
4.0  
4.0  
4.0  
8.0  
8.0  
8.0  
8.0  
8.0  
Q3  
Q3  
Q3  
Q3  
Q3  
SN74CBT1G125DCKR  
SN74CBT1G125DCKT  
SC70  
SC70  
3000  
250  
2.4  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
16-May-2013  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
SN74CBT1G125DBVR  
SN74CBT1G125DBVR  
SN74CBT1G125DBVT  
SN74CBT1G125DCKR  
SN74CBT1G125DCKT  
SOT-23  
SOT-23  
SOT-23  
SC70  
DBV  
DBV  
DBV  
DCK  
DCK  
5
5
5
5
5
3000  
3000  
250  
180.0  
202.0  
202.0  
202.0  
202.0  
180.0  
201.0  
201.0  
201.0  
201.0  
18.0  
28.0  
28.0  
28.0  
28.0  
3000  
250  
SC70  
Pack Materials-Page 2  
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