SN74CBT1G125_16 [TI]
SINGLE FET BUS SWITCH;型号: | SN74CBT1G125_16 |
厂家: | TEXAS INSTRUMENTS |
描述: | SINGLE FET BUS SWITCH |
文件: | 总12页 (文件大小:814K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SN74CBT1G125
SINGLE FET BUS SWITCH
SCDS046G – FEBRUARY 1998 – REVISED JANUARY 2003
DBV OR DCK PACKAGE
(TOP VIEW)
5-Ω Switch Connection Between Two Ports
TTL-Compatible Control Input Levels
Latch-Up Performance Exceeds 250 mA Per
JESD 17
OE
A
GND
V
B
1
2
3
5
4
CC
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
description/ordering information
The SN74CBT1G125 features a single high-speed line switch. The switch is disabled when the output-enable
(OE) input is high.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
T
A
PACKAGE
‡
Reel of 3000
Reel of 250
Reel of 3000
Reel of 250
SN74CBT1G125DBVR
SN74CBT1G125DBVT
SN74CBT1G125DCKR
SN74CBT1G125DCKT
SOT (SOT-23) – DBV
S25_
–40°C to 85°C
SOT (SC-70) – DCK
SM_
†
‡
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
The actual top-side marking has one additional character that designates the assembly/test site.
FUNCTION TABLE
INPUT
FUNCTION
OE
L
A port = B port
Disconnect
H
logic diagram (positive logic)
2
1
4
B
A
OE
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2003, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN74CBT1G125
SINGLE FET BUS SWITCH
SCDS046G – FEBRUARY 1998 – REVISED JANUARY 2003
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
CC
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
I
Continuous channel current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA
Input clamp current, I (V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –50 mA
IK I/O
Package thermal impedance, θ (see Note 2): DBV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 206°C/W
JA
DCK package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 252°C/W
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
MIN
4
MAX
UNIT
V
V
V
V
Supply voltage
5.5
CC
IH
IL
High-level control input voltage
Low-level control input voltage
Operating free-air temperature
2
V
0.8
85
V
T
A
–40
°C
NOTE 3: All unused control inputs of the device must be held at V
or GND to ensure proper device operation. Refer to the TI application report,
CC
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
‡
PARAMETER
TEST CONDITIONS
I = –18 mA
MIN TYP
MAX
–1.2
±1
UNIT
V
V
V
V
V
= 4.5 V,
= 5.5 V,
= 5.5 V,
IK
CC
CC
CC
I
I
I
V = 5.5 V or GND
I
µA
µA
pF
I
I
O
= 0,
V = V or GND
I CC
1
CC
C
C
Control input
V = 3 V or 0
I
3
4
i
V
O
= 3 V or 0,
OE = V
CC
pF
io(OFF)
V
= 4 V,
TYP at V
= 4 V,
V
= 2.4 V,
I = 15 mA
I
14
5
20
7
CC
CC
I
I = 64 mA
I
§
V = 0
I
Ω
r
on
V
CC
= 4.5 V
I = 30 mA
I
5
7
V
I
= 2.4 V,
I = 15 mA
I
10
15
‡
§
All typical values are at V
= 5 V (unless otherwise noted), T = 25°C.
A
CC
Measured by the voltage drop between the A and the B terminals at the indicated current through the switch. On-state resistance is determined
by the lower of the voltages of the two (A or B) terminals.
switching characteristics over recommended operating free-air temperature range, C = 50 pF
L
(unless otherwise noted) (see Figure 1)
V
= 5 V
CC
± 0.5 V
V
= 4 V
FROM
(INPUT)
TO
(OUTPUT)
CC
PARAMETER
UNIT
MIN
MAX
MIN MAX
¶
t
t
t
A or B
OE
B or A
A or B
A or B
0.35
5.5
0.25
4.9
ns
ns
ns
pd
en
1.6
1
4.5
4.2
OE
dis
¶
Thepropagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance, when
driven by an ideal voltage source (zero output impedance).
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN74CBT1G125
SINGLE FET BUS SWITCH
SCDS046G – FEBRUARY 1998 – REVISED JANUARY 2003
PARAMETER MEASUREMENT INFORMATION
7 V
Open
GND
TEST
S1
S1
500 Ω
t
Open
7 V
From Output
Under Test
pd
t
/t
PLZ PZL
t
/t
Open
PHZ PZH
C
= 50 pF
L
500 Ω
(see Note A)
3 V
0 V
Output
Control
1.5 V
1.5 V
LOAD CIRCUIT
t
t
PLZ
PZL
Output
Waveform 1
S1 at 7 V
3.5 V
3 V
0 V
1.5 V
Input
V
V
+ 0.3 V
1.5 V
1.5 V
OL
V
(see Note B)
OL
OH
t
t
PHZ
PZH
t
t
PHL
PLH
Output
Waveform 2
S1 at Open
(see Note B)
V
V
OH
– 0.3 V
OH
1.5 V
Output
1.5 V
1.5 V
0 V
V
OL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
NOTES: A.
C includes probe and jig capacitance.
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z = 50 Ω, t ≤ 2.5 ns, t ≤ 2.5 ns.
O
r
f
D. The outputs are measured one at a time with one transition per measurement.
E.
F.
G.
t
t
t
and t
and t
and t
are the same as t
are the same as t
are the same as t
.
dis
en
.
pd
PLZ
PZL
PLH
PHZ
PZH
PHL
.
Figure 1. Load Circuit and Voltage Waveforms
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
74CBT1G125DBVRE4
74CBT1G125DBVRG4
74CBT1G125DBVTE4
74CBT1G125DBVTG4
74CBT1G125DCKRE4
74CBT1G125DCKRG4
74CBT1G125DCKTE4
74CBT1G125DCKTG4
SN74CBT1G125DBVR
SN74CBT1G125DBVT
SN74CBT1G125DCKR
SN74CBT1G125DCKT
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
ACTIVE
SOT-23
SOT-23
SOT-23
SOT-23
SC70
DBV
5
5
5
5
5
5
5
5
5
5
5
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
(S25G ~ S25J ~
S25S)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DBV
DBV
DBV
DCK
DCK
DCK
DCK
DBV
DBV
DCK
DCK
3000
250
Green (RoHS
& no Sb/Br)
(S25G ~ S25J ~
S25S)
Green (RoHS
& no Sb/Br)
(S253 ~ S25S)
250
Green (RoHS
& no Sb/Br)
(S253 ~ S25S)
3000
3000
250
Green (RoHS
& no Sb/Br)
(SM3 ~ SMS ~ SMT ~
SMU)
SC70
Green (RoHS
& no Sb/Br)
(SM3 ~ SMS ~ SMT ~
SMU)
SC70
Green (RoHS
& no Sb/Br)
(SM3 ~ SMS)
SC70
250
Green (RoHS
& no Sb/Br)
(SM3 ~ SMS)
SOT-23
SOT-23
SC70
3000
250
Green (RoHS
& no Sb/Br)
(S25G ~ S25J ~
S25S)
Green (RoHS
& no Sb/Br)
(S253 ~ S25S)
3000
250
Green (RoHS
& no Sb/Br)
(SM3 ~ SMS ~ SMT ~
SMU)
SC70
Green (RoHS
& no Sb/Br)
(SM3 ~ SMS)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
16-May-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
SN74CBT1G125DBVR SOT-23
SN74CBT1G125DBVR SOT-23
SN74CBT1G125DBVT SOT-23
DBV
DBV
DBV
DCK
DCK
5
5
5
5
5
3000
3000
250
178.0
180.0
180.0
180.0
180.0
9.0
8.4
8.4
8.4
8.4
3.23
3.23
3.23
2.25
2.25
3.17
3.17
3.17
2.4
1.37
1.37
1.37
1.22
1.22
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
Q3
Q3
Q3
Q3
Q3
SN74CBT1G125DCKR
SN74CBT1G125DCKT
SC70
SC70
3000
250
2.4
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
16-May-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
SN74CBT1G125DBVR
SN74CBT1G125DBVR
SN74CBT1G125DBVT
SN74CBT1G125DCKR
SN74CBT1G125DCKT
SOT-23
SOT-23
SOT-23
SC70
DBV
DBV
DBV
DCK
DCK
5
5
5
5
5
3000
3000
250
180.0
202.0
202.0
202.0
202.0
180.0
201.0
201.0
201.0
201.0
18.0
28.0
28.0
28.0
28.0
3000
250
SC70
Pack Materials-Page 2
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