SN74CBT1G384DCKT [TI]
SINGLE FET BUS SWITCH; 单FET总线开关
| 型号： | SN74CBT1G384DCKT |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | SINGLE FET BUS SWITCH |
| 文件： | 总13页 (文件大小：636K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SN74CBT1G384
SINGLE FET BUS SWITCH
www.ti.com
SCDS065G–JULY 1998–REVISED JUNE 2006
FEATURES
•
•
5-Ω Switch Connection Between Two Ports
TTL-Compatible Control Input Levels
DBV PACKAGE
(TOP VIEW)
DCK PACKAGE
(TOP VIEW)
A
B
V
CC
1
2
3
5
1
2
3
5
A
B
V
CC
4
GND
OE
4
OE
GND
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
The SN74CBT1G384 features a single high-speed line switch. The switch is disabled when the output-enable
(OE) input is high.
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER
SN74CBT1G384DBVR
SN74CBT1G384DBVT
SN74CBT1G384DCKR
SN74CBT1G384DCKT
TOP-SIDE MARKING(2)
S8D_
Reel of 3000
SOT (SOT-23) – DBV
SOT (SC-70) – DCK
Reel of 250
Reel of 3000
Reel of 250
–40°C to 85°C
S8_
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) The actual top-side marking has one additional character that designates the assembly/test site.
FUNCTION TABLE
INPUT
FUNCTION
OE
L
A port = B port
Disconnect
H
LOGIC DIAGRAM (POSITIVE LOGIC)
1
2
B
A
4
OE
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 1998–2006, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
SN74CBT1G384
SINGLE FET BUS SWITCH
www.ti.com
SCDS065G–JULY 1998–REVISED JUNE 2006
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
MIN
–0.5
–0.5
MAX
UNIT
VCC Supply voltage range
7
V
VI
Input voltage range(2)
Continuous channel current
Input clamp current
7
128
–50
206
252
150
V
mA
mA
IIK
VI/O < 0
DBV package
DCK package
θJA
Package thermal impedance(3)
°C/W
°C
Tstg Storage temperature range
–65
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
(3) The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions(1)
MIN
4
MAX
UNIT
V
VCC Supply voltage
5.5
VIH
VIL
TA
High-level control input voltage
2
V
Low-level control input voltage
Operating free-air temperature
0.8
85
V
–40
°C
(1) All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
II = –18 mA
MIN TYP(1)
MAX UNIT
VIK
II
VCC = 4.5 V,
VCC = 5.5 V,
VCC = 5.5 V,
VI = 3 V or 0
VO = 3 V or 0,
VCC = 4 V,
–1.2
±1
1
V
VI = 5.5 V or GND
IO = 0,
µA
µA
pF
pF
ICC
Ci
VI = VCC or GND
Control input
3
4
Cio(OFF)
OE = VCC
TYP at VCC = 4 V,
VI = 2.4 V,
II = 64 mA
II = 30 mA
II = 15 mA
II = 15 mA
14
5
20
7
(2)
ron
VI = 0
Ω
VCC = 4.5 V
5
7
VI = 2.4 V,
10
15
(1) All typical values are at VCC = 5 V (unless otherwise noted), TA = 25°C.
(2) Measured by the voltage drop between the A and the B terminals at the indicated current through the switch. On-state resistance is
determined by the lower voltage of the two (A or B) terminals.
2
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SN74CBT1G384
SINGLE FET BUS SWITCH
www.ti.com
SCDS065G–JULY 1998–REVISED JUNE 2006
Switching Characteristics
over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1)
VCC = 5 V
± 0.5 V
VCC = 4 V
MIN
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
MAX
0.35
5.5
MIN
MAX
0.25
4.9
(1)
tpd
A or B
OE
B or A
A or B
A or B
ns
ns
ns
ten
1.6
1
tdis
OE
4.5
4.2
(1) The propagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load
capacitance, when driven by an ideal voltage source (zero output impedance).
3
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SN74CBT1G384
SINGLE FET BUS SWITCH
www.ti.com
SCDS065G–JULY 1998–REVISED JUNE 2006
PARAMETER MEASUREMENT INFORMATION
7 V
Open
TEST
S1
S1
500 W
tpd
Open
7 V
From Output
Under Test
GND
tPLZ/tPZL
tPHZ/tPZH
Open
CL = 50 pF
(see Note A)
500 W
3 V
0 V
Output
Control
1.5 V
1.5 V
LOAD CIRCUIT
tPZL
tPLZ
Output
Waveform 1
S1 at 7 V
3.5 V
VOL
3 V
0 V
1.5 V
Input
1.5 V
1.5 V
VOL + 0.3 V
(see Note B)
tPZH
tPHZ
tPLH
tPHL
Output
Waveform 2
S1 at Open
(see Note B)
VOH
0 V
VOH
VOH - 0.3 V
1.5 V
Output
1.5 V
1.5 V
VOL
VOLTAGE WAVEFORMS
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
PROPAGATION DELAY TIMES
NOTES: A . CL includes probe and jig capacitance.
B . Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C . All input pulses are supplied by generators having the following characteristics: PRR £ 10 MHz, ZO = 50 W, tr £ 2.5 ns, tf £ 2.5 ns.
D . The output is measured with one input transition per measurement.
E . tPLZ and tPHZ are the same as tdis
H . tPZL and tPZH are the same as ten
G . tPLH and tPHL are the same as tpd
.
.
.
Figure 1. Load Circuit and Voltage Waveforms
4
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PACKAGE OPTION ADDENDUM
www.ti.com
26-Mar-2013
PACKAGING INFORMATION
Orderable Device
74CBT1G384DBVRE4
74CBT1G384DBVRG4
74CBT1G384DBVTE4
74CBT1G384DBVTG4
74CBT1G384DCKRE4
74CBT1G384DCKRG4
74CBT1G384DCKTE4
74CBT1G384DCKTG4
SN74CBT1G384DBVR
SN74CBT1G384DBVT
SN74CBT1G384DCKR
SN74CBT1G384DCKT
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
ACTIVE
SOT-23
SOT-23
SOT-23
SOT-23
SC70
DBV
5
5
5
5
5
5
5
5
5
5
5
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
(S8D2 ~ S8DG ~
S8DJ ~ S8DR)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DBV
DBV
DBV
DCK
DCK
DCK
DCK
DBV
DBV
DCK
DCK
3000
250
Green (RoHS
& no Sb/Br)
(S8D2 ~ S8DG ~
S8DJ ~ S8DR)
Green (RoHS
& no Sb/Br)
(S8D2 ~ S8DR)
250
Green (RoHS
& no Sb/Br)
(S8D2 ~ S8DR)
3000
3000
250
Green (RoHS
& no Sb/Br)
(S83 ~ S8G ~ S8R ~
S8U)
SC70
Green (RoHS
& no Sb/Br)
(S83 ~ S8G ~ S8R ~
S8U)
SC70
Green (RoHS
& no Sb/Br)
(S83 ~ S8R)
SC70
250
Green (RoHS
& no Sb/Br)
(S83 ~ S8R)
SOT-23
SOT-23
SC70
3000
250
Green (RoHS
& no Sb/Br)
(S8D2 ~ S8DG ~
S8DJ ~ S8DR)
Green (RoHS
& no Sb/Br)
(S8D2 ~ S8DR)
3000
250
Green (RoHS
& no Sb/Br)
(S83 ~ S8G ~ S8R ~
S8U)
SC70
Green (RoHS
& no Sb/Br)
(S83 ~ S8R)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
26-Mar-2013
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
25-Aug-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
SN74CBT1G384DBVR SOT-23
SN74CBT1G384DBVR SOT-23
SN74CBT1G384DBVT SOT-23
DBV
DBV
DBV
DCK
DCK
5
5
5
5
5
3000
3000
250
178.0
180.0
180.0
178.0
180.0
9.0
8.4
8.4
9.0
8.4
3.23
3.23
3.23
2.4
3.17
3.17
3.17
2.5
1.37
1.37
1.37
1.2
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
Q3
Q3
Q3
Q3
Q3
SN74CBT1G384DCKR
SN74CBT1G384DCKT
SC70
SC70
3000
250
2.25
2.4
1.22
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
25-Aug-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
SN74CBT1G384DBVR
SN74CBT1G384DBVR
SN74CBT1G384DBVT
SN74CBT1G384DCKR
SN74CBT1G384DCKT
SOT-23
SOT-23
SOT-23
SC70
DBV
DBV
DBV
DCK
DCK
5
5
5
5
5
3000
3000
250
180.0
202.0
202.0
180.0
202.0
180.0
201.0
201.0
180.0
201.0
18.0
28.0
28.0
18.0
28.0
3000
250
SC70
Pack Materials-Page 2
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