SN74LVC1G29DCURG4 [TI]
LVC/LCX/Z SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, PDSO8, GREEN, PLASTIC, VSSOP-8;
| 型号： | SN74LVC1G29DCURG4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | LVC/LCX/Z SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, PDSO8, GREEN, PLASTIC, VSSOP-8 驱动 光电二极管 输出元件 逻辑集成电路 |
| 文件： | 总17页 (文件大小：889K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SN74LVC1G29
www.ti.com
SCES569C –JUNE 2004–REVISED JANUARY 2014
SN74LVC1G29 2-of-3 Decoder/Demultiplexer
Check for Samples: SN74LVC1G29
1
FEATURES
DESCRIPTION
This decoder is designed for 1.65-V to 5.5-V VCC
operation.
2
•
Available in the Texas Instruments
NanoFree™ Package
The
SN74LVC1G29
device
is
a
2-of-3
•
•
•
•
•
•
•
Supports 5-V VCC Operation
decoder/demultiplexer. When the enable (G) input
signal is low, only one of the outputs is in the low
state, depending on the input levels of A0 and A1.
When G is high, Y0, Y1, and Y2 are high, regardless
of the input states.
Inputs Accept Voltages to 5.5 V
Supports Down Translation to VCC
Max tpd of 5.1 ns at 3.3 V
Low Power Consumption, 10-µA Max ICC
±24-mA Output Drive at 3.3 V
This device is fully specified for partial-power-down
applications using Ioff. The Ioff circuitry disable the
outputs, preventing damaging current backflow
through the device when it is powered down.
Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C
•
•
•
•
Typical VOHV (Output VOH Undershoot)
>2 V at VCC = 3.3 V, TA = 25°C
NanoFree™ package technology is
breakthrough in IC packaging concepts, using the die
as the package.
a
major
Ioff Supports Live Insertion, Partial-Power-
Down Mode, and Back-Drive Protection
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
–
–
–
2000-V Human-Body Model (A114-A)
200-V Machine Model (A115-A)
1000-V Charged-Device Model (C101)
YZP PACKAGE
(BOTTOM VIEW)
DCU PACKAGE
(TOP VIEW)
4 5
GND
A0
Y2
A1
VCC
Y0
A1
Y2
1
2
3
4
8
7
6
5
G
Y1
3 6
2 7
1 8
Y1
Y0
VCC
G
A0
GND
DCT PACKAGE
(TOP VIEW)
VCC
Y0
A1
Y2
1
8
7
6
5
G
Y1
2
3
4
A0
GND
See mechanical drawings for dimensions.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2004–2014, Texas Instruments Incorporated
SN74LVC1G29
SCES569C –JUNE 2004–REVISED JANUARY 2014
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Function Table
INPUTS
OUTPUTS
G
L
A1
L
A0
X
Y0
L
Y1
H
L
Y2
H
H
L
L
H
H
X
L
H
H
H
L
H
X
H
H
H
H
Logic Diagram (Positive Logic)
1
6
G
7
Y0
A1
2
5
Y1
Y2
3
A0
Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
–0.5
–0.5
–0.5
–0.5
MAX
6.5
UNIT
VCC
VI
Supply voltage range
Input voltage range(2)
Voltage range applied to any output in the high-impedance or power-off state(2)
Voltage range applied to any output in the high or low state(2)(3)
V
V
6.5
VO
VO
IIK
6.5
V
VCC + 0.5
–50
V
Input clamp current
VI < 0
mA
mA
mA
mA
IOK
IO
Output clamp current
VO < 0
–50
Continuous output current
Continuous current through VCC or GND
±50
±100
220
DCT package
DCU package
YZP package
θJA
Package thermal impedance(4)
227
°C/W
°C
102
Tstg
Storage temperature range
–65
150
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
(3) The value of VCC is provided in the Recommended Operating Conditions table.
(4) The package thermal impedance is calculated in accordance with JESD 51-7.
2
Submit Documentation Feedback
Copyright © 2004–2014, Texas Instruments Incorporated
Product Folder Links :SN74LVC1G29
SN74LVC1G29
www.ti.com
SCES569C –JUNE 2004–REVISED JANUARY 2014
Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)(1)
MIN
1.65
MAX
UNIT
Operating
VCC Supply voltage
5.5
V
Data retention only
1.5
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
0.65 × VCC
1.7
VIH
High-level input voltage
Low-level input voltage
V
V
VCC = 3.0 V to 3.6 V
VCC = 4.5 V to 5.5 V
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 3.0 V to 3.6 V
VCC = 4.5 V to 5.5 V
2
0.7 × VCC
0.35 × VCC
0.7
VIL
0.8
0.3 × VCC
5.5
VCC
–4
VI
Input voltage
0
0
V
V
VO
Output voltage
VCC = 1.65 V
VCC = 2.3 V
–8
IOH
High-level output current
Low-level output current
–16
–24
–32
4
mA
mA
VCC = 3 V
VCC = 4.5 V
VCC = 1.65 V
VCC = 2.3 V
8
IOL
16
VCC = 3 V
24
VCC = 4.5 V
32
VCC = 1.8 V ± 0.15 V, 2.5 V ± 0.2 V
VCC = 3.3 V ± 0.3 V
VCC = 5 V ± 0.5 V
20
Δt/Δv Input transition rise or fall rate
10
ns/V
°C
5
TA
Operating free-air temperature
–40
85
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
Copyright © 2004–2014, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Links :SN74LVC1G29
SN74LVC1G29
SCES569C –JUNE 2004–REVISED JANUARY 2014
www.ti.com
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP(1)
MAX
UNIT
IOH = –100 µA
IOH = –4 mA
IOH = –8 mA
IOH = –16 mA
IOH = –24 mA
IOH = –32 mA
IOL = 100 µA
IOL = 4 mA
1.65 V to 5.5 V VCC – 0.1
1.65 V
2.3 V
1.2
1.9
2.4
2.3
3.8
VOH
V
3 V
4.5 V
1.65 V to 5.5 V
1.65 V
0.1
0.45
0.3
IOL = 8 mA
2.3 V
VOL
V
IOL = 16 mA
0.4
3 V
IOL= 24 mA
0.55
0.55
±1
IOL= 32 mA
4.5 V
0 to 5.5 V
0
II
Ioff
VI = 5.5 V or GND
VI or VO = 5.5 V
VI = 5.5 V or GND,
µA
µA
µA
µA
pF
±10
10
ICC
ΔICC
CI
IO = 0
1.65 V to 5.5 V
3 V to 5.5 V
3.3 V
One input at VCC – 0.6 V, Other inputs at VCC or GND
VI = VCC or GND
500
3.5
(1) All typical values are at VCC = 3.3 V, TA = 25°C.
Switching Characteristics
over recommended operating free-air temperature range, CL = 15 pF (unless otherwise noted) (see Figure 1)
VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V
VCC = 5 V
± 0.5 V
FROM
(INPUT)
TO
(OUTPUT)
± 0.15 V
± 0.2 V
± 0.3 V
PARAMETER
UNIT
MIN MAX MIN
MAX
MIN MAX
MIN MAX
0.5 4.2
tpd
A or G
Y
2.5 15.4 1.5
7.1
1
5.1
ns
Switching Characteristics
over recommended operating free-air temperature range, CL = 30 pF or 50 pF (unless otherwise noted) (see Figure 2)
VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V
VCC = 5 V
± 0.5 V
FROM
(INPUT)
TO
(OUTPUT)
± 0.15 V
± 0.2 V
± 0.3 V
PARAMETER
UNIT
MIN MAX MIN MAX
MIN MAX
MIN
MAX
5.1
tpd
A or G
Y
2.5
15.8
1.5
7.5
1
6.1
0.5
ns
Operating Characteristics
TA = 25°C
VCC = 1.8 V
VCC = 2.5 V
VCC = 3.3 V
VCC = 5 V
TYP
TEST
CONDITIONS
PARAMETER
UNIT
TYP
17
TYP
17
TYP
18
G to Y1
A1 to Yn
19
Power dissipation
capacitance
Cpd
f = 10 MHz
pF
33
33
33
35
4
Submit Documentation Feedback
Copyright © 2004–2014, Texas Instruments Incorporated
Product Folder Links :SN74LVC1G29
SN74LVC1G29
www.ti.com
SCES569C –JUNE 2004–REVISED JANUARY 2014
Parameter Measurement Information
VLOAD
Open
S1
RL
From Output
Under Test
TEST
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
S1
GND
Open
VLOAD
GND
CL
(see Note A)
RL
LOAD CIRCUIT
INPUTS
VCC
VM
VLOAD
CL
RL
V
D
VI
tr/tf
VCC
VCC
3 V
VCC
1.8 V ± 0.15 V
2.5 V ± 0.2 V
3.3 V ± 0.3 V
5 V ± 0.5 V
£2 ns
£2 ns
VCC/2
VCC/2
1.5 V
VCC/2
2 × VCC
2 × VCC
6 V
15 pF
15 pF
15 pF
15 pF
1 MW
0.15 V
0.15 V
0.3 V
1 MW
1 MW
1 MW
£2.5 ns
£2.5 ns
2 × VCC
0.3 V
VI
Timing Input
Data Input
VM
0 V
tW
tsu
th
VI
VI
Input
VM
VM
VM
VM
0 V
0 V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VI
VI
Output
Control
VM
VM
Input
VM
VM
0 V
0 V
tPZL
tPLZ
tPLH
tPHL
VM
Output
Waveform 1
S1 at VLOAD
VOH
VOL
VLOAD/2
VOL
VM
VM
Output
Output
VOL + V
D
(see Note B)
tPHL
tPLH
tPZH
tPHZ
VOH
VOL
Output
Waveform 2
S1 at GND
VOH
VOH – V
D
VM
VM
VM
»0 V
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR £ 10 MHz, ZO = 50 W.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
Copyright © 2004–2014, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Links :SN74LVC1G29
SN74LVC1G29
SCES569C –JUNE 2004–REVISED JANUARY 2014
www.ti.com
Parameter Measurement Information (continued)
VLOAD
Open
GND
S1
RL
From Output
Under Test
TEST
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
S1
Open
VLOAD
GND
CL
(see Note A)
RL
LOAD CIRCUIT
INPUTS
VCC
VM
VLOAD
CL
RL
V
D
VI
tr/tf
VCC
VCC
3 V
VCC
1.8 V ± 0.15 V
2.5 V ± 0.2 V
3.3 V ± 0.3 V
5 V ± 0.5 V
£2 ns
£2 ns
VCC/2
VCC/2
1.5 V
VCC/2
2 × VCC
2 × VCC
6 V
30 pF
30 pF
50 pF
50 pF
1 kW
0.15 V
0.15 V
0.3 V
500 W
500 W
500 W
£2.5 ns
£2.5 ns
2 × VCC
0.3 V
VI
Timing Input
Data Input
VM
0 V
tW
tsu
th
VI
VI
Input
VM
VM
VM
VM
0 V
0 V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VI
VI
Output
Control
VM
VM
Input
VM
VM
0 V
0 V
tPZL
tPLZ
tPLH
tPHL
VM
Output
Waveform 1
S1 at VLOAD
VOH
VOL
VLOAD/2
VOL
VM
VM
Output
Output
VOL + V
D
(see Note B)
tPHL
tPLH
tPZH
tPHZ
VOH
VOL
Output
Waveform 2
S1 at GND
VOH
VOH – V
D
VM
VM
VM
»0 V
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR £ 10 MHz, ZO = 50 W.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 2. Load Circuit and Voltage Waveforms
6
Submit Documentation Feedback
Copyright © 2004–2014, Texas Instruments Incorporated
Product Folder Links :SN74LVC1G29
SN74LVC1G29
www.ti.com
SCES569C –JUNE 2004–REVISED JANUARY 2014
REVISION HISTORY
Changes from Revision B (January 2007) to Revision C
Page
•
•
•
•
Updated document to new TI data sheet format. ................................................................................................................. 1
Deleted Ordering Information table. ...................................................................................................................................... 1
Updated Features. ................................................................................................................................................................ 1
Added ESD warning. ............................................................................................................................................................ 2
Copyright © 2004–2014, Texas Instruments Incorporated
Submit Documentation Feedback
7
Product Folder Links :SN74LVC1G29
PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2014
PACKAGING INFORMATION
Orderable Device
SN74LVC1G29DCTR
SN74LVC1G29DCUR
SN74LVC1G29DCUT
SN74LVC1G29YZPR
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
ACTIVE
SM8
US8
DCT
8
8
8
8
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
SNAGCU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
C29
Z
ACTIVE
ACTIVE
ACTIVE
DCU
DCU
YZP
3000
250
Green (RoHS
& no Sb/Br)
-40 to 85
C29R
US8
Green (RoHS
& no Sb/Br)
-40 to 85
C29R
DSBGA
3000
Green (RoHS
& no Sb/Br)
-40 to 85
(D97 ~ D9N)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2014
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
7-Nov-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
SN74LVC1G29DCUR
SN74LVC1G29YZPR
US8
DCU
YZP
8
8
3000
3000
180.0
178.0
8.4
9.2
2.25
1.02
3.35
2.02
1.05
0.63
4.0
4.0
8.0
8.0
Q3
Q1
DSBGA
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
7-Nov-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
SN74LVC1G29DCUR
SN74LVC1G29YZPR
US8
DCU
YZP
8
8
3000
3000
202.0
220.0
201.0
220.0
28.0
35.0
DSBGA
Pack Materials-Page 2
MECHANICAL DATA
MPDS049B – MAY 1999 – REVISED OCTOBER 2002
DCT (R-PDSO-G8)
PLASTIC SMALL-OUTLINE PACKAGE
0,30
0,15
M
0,13
0,65
8
5
0,15 NOM
2,90
2,70
4,25
3,75
Gage Plane
PIN 1
INDEX AREA
0,25
1
4
0° – 8°
0,60
0,20
3,15
2,75
1,30 MAX
Seating Plane
0,10
0,10
0,00
4188781/C 09/02
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion
D. Falls within JEDEC MO-187 variation DA.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
D: Max = 1.918 mm, Min =1.858 mm
E: Max = 0.918 mm, Min =0.858 mm
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Automotive and Transportation www.ti.com/automotive
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/industrial
www.ti.com/medical
Medical
Logic
Security
www.ti.com/security
Power Mgmt
Microcontrollers
RFID
power.ti.com
Space, Avionics and Defense
Video and Imaging
www.ti.com/space-avionics-defense
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/omap
OMAP Applications Processors
Wireless Connectivity
TI E2E Community
e2e.ti.com
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2014, Texas Instruments Incorporated
相关型号：
©2020 ICPDF网 联系我们和版权申明