SN74LVC1G29YZPR [TI]
2-OF-3 DECODER/DEMULTIPLEXER; 2 -OF- 3解码器/解复用器型号: | SN74LVC1G29YZPR |
厂家: | TEXAS INSTRUMENTS |
描述: | 2-OF-3 DECODER/DEMULTIPLEXER |
文件: | 总14页 (文件大小:325K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SN74LVC1G29
2-OF-3 DECODER/DEMULTIPLEXER
www.ti.com
SCES569A–JUNE 2004–REVISED SEPTEMBER 2006
FEATURES
•
Available in the Texas Instruments
NanoStar™ and NanoFree™ Packages
•
•
•
Ioff Supports Partial-Power-Down Mode
Operation
•
•
•
•
•
•
Supports 5-V VCC Operation
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
Inputs Accept Voltages to 5.5 V
Max tpd of 5.1 ns at 3.3 V
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
Low Power Consumption, 10-µA Max ICC
±24-mA Output Drive at 3.3 V
– 1000-V Charged-Device Model (C101)
Typical VOLP (Output Ground Bounce) <0.8 V
at VCC = 3.3 V, TA = 25°C
•
Typical VOHV (Output VOH Undershoot) >2 V at
VCC = 3.3 V, TA = 25°C
DCT PACKAGE
(TOP VIEW)
DCU PACKAGE
(TOP VIEW)
YEP OR YZP PACKAGE
(BOTTOM VIEW)
4 5
GND
A0
Y2
A1
VCC
Y0
A1
Y2
1
2
3
4
8
7
6
5
G
Y1
VCC
Y0
A1
Y2
1
2
3
4
8
7
6
5
G
Y1
3 6
2 7
1 8
Y1
Y0
A0
VCC
G
GND
A0
GND
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
This decoder is designed for 1.65-V to 5.5-V VCC operation.
The SN74LVC1G29 is a 2-of-3 decoder/demultiplexer. When the enable (G) input signal is low, only one of the
outputs is in the low state, depending on the input levels of A0 and A1. When G is high, Y0, Y1, and Y2 are
high, regardless of the input states.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disable the outputs,
preventing damaging current backflow through the device when it is powered down.
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar, NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2004–2006, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
SN74LVC1G29
2-OF-3 DECODER/DEMULTIPLEXER
www.ti.com
SCES569A–JUNE 2004–REVISED SEPTEMBER 2006
ORDERING INFORMATION
(1)
(2)
TA
PACKAGE
NanoStar™– WCSP (DSBGA)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
SN74LVC1G29YEPR
0.23-mm Large Bump – YEP
Reel of 3000
_ _ _D9_
NanoFree™– WCSP (DSBGA)
SN74LVC1G29YZPR
0.23-mm Large Bump – YZP (Pb-free)
SSOP – DCT
–40°C to 85°C
Reel of 3000
Reel of 250
Reel of 3000
Reel of 250
SN74LVC1G29DCTR
SN74LVC1G29DCTT
SN74LVC1G29DCUR
SN74LVC1G29DCUT
C29_ _ _
C29_
VSSOP – DCU
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.
DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
FUNCTION TABLE
INPUTS
OUTPUTS
G
L
A1
L
A0
X
Y0
L
Y1
H
L
Y2
H
H
L
L
H
H
X
L
H
H
H
L
H
X
H
H
H
H
LOGIC DIAGRAM (POSITIVE LOGIC)
1
6
G
7
Y0
A1
2
5
Y1
Y2
3
A0
2
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SN74LVC1G29
2-OF-3 DECODER/DEMULTIPLEXER
www.ti.com
SCES569A–JUNE 2004–REVISED SEPTEMBER 2006
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
MIN
–0.5
–0.5
–0.5
–0.5
MAX
6.5
UNIT
V
VCC
VI
Supply voltage range
(2)
Input voltage range
6.5
V
VO
VO
IIK
Voltage range applied to any output in the high-impedance or power-off state(2)
Voltage range applied to any output in the high or low state(2)(3)
6.5
V
VCC + 0.5
–50
V
Input clamp current
VI < 0
mA
mA
mA
mA
IOK
IO
Output clamp current
VO < 0
–50
Continuous output current
Continuous current through VCC or GND
±50
±100
220
DCT package
θJA
Package thermal impedance(4)
DCU package
227
°C/W
°C
YEP/YZP package
102
Tstg
Storage temperature range
–65
150
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
(3) The value of VCC is provided in the recommended operating conditions table.
(4) The package thermal impedance is calculated in accordance with JESD 51-7.
3
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SN74LVC1G29
2-OF-3 DECODER/DEMULTIPLEXER
www.ti.com
SCES569A–JUNE 2004–REVISED SEPTEMBER 2006
Recommended Operating Conditions(1)
MIN
1.65
MAX
UNIT
Operating
5.5
VCC Supply voltage
V
Data retention only
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 3.0 V to 3.6 V
VCC = 4.5 V to 5.5 V
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 3.0 V to 3.6 V
VCC = 4.5 V to 5.5 V
1.5
0.65 × VCC
1.7
VIH
High-level input voltage
Low-level input voltage
V
2
0.7 × VCC
0.35 × VCC
0.7
VIL
V
0.8
0.3 × VCC
5.5
VCC
–4
VI
Input voltage
0
0
V
V
VO
Output voltage
VCC = 1.65 V
VCC = 2.3 V
–8
IOH
High-level output current
Low-level output current
–16
–24
–32
4
mA
mA
VCC = 3 V
VCC = 4.5 V
VCC = 1.65 V
VCC = 2.3 V
8
IOL
16
VCC = 3 V
24
VCC = 4.5 V
32
VCC = 1.8 V ± 0.15 V, 2.5 V ± 0.2 V
VCC = 3.3 V ± 0.3 V
VCC = 5 V ± 0.5 V
20
∆t/∆v Input transition rise or fall rate
10
ns/V
5
TA
Operating free-air temperature
–40
85
°C
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
4
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SN74LVC1G29
2-OF-3 DECODER/DEMULTIPLEXER
www.ti.com
SCES569A–JUNE 2004–REVISED SEPTEMBER 2006
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
1.65 V to 5.5 V
1.65 V
MIN
VCC – 0.1
1.2
TYP(1)
MAX
UNIT
IOH = –100 µA
IOH = –4 mA
IOH = –8 mA
IOH = –16 mA
IOH = –24 mA
IOH = –32 mA
IOL = 100 µA
IOL = 4 mA
2.3 V
1.9
VOH
V
2.4
3 V
2.3
4.5 V
1.65 V to 5.5 V
1.65 V
3.8
0.1
0.45
0.3
IOL = 8 mA
2.3 V
VOL
V
IOL = 16 mA
0.4
3 V
IOL= 24 mA
0.55
0.55
±1
IOL= 32 mA
4.5 V
0 to 5.5 V
0
II
Ioff
VI = 5.5 V or GND
VI or VO = 5.5 V
VI = 5.5 V or GND,
µA
µA
µA
µA
pF
±10
10
ICC
∆ICC
Ci
IO = 0
1.65 V to 5.5 V
3 V to 5.5 V
3.3 V
One input at VCC – 0.6 V,
VI = VCC or GND
Other inputs at VCC or GND
500
3.5
(1) All typical values are at VCC = 3.3 V, TA = 25°C.
5
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SN74LVC1G29
2-OF-3 DECODER/DEMULTIPLEXER
www.ti.com
SCES569A–JUNE 2004–REVISED SEPTEMBER 2006
Switching Characteristics
over recommended operating free-air temperature range, CL = 15 pF (unless otherwise noted) (see Figure 1)
VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V
VCC = 5 V
± 0.5 V
FROM
(INPUT)
TO
(OUTPUT)
± 0.15 V
MIN MAX MIN MAX
2.5 15.4 1.5 7.1
± 0.2 V
± 0.3 V
PARAMETER
UNIT
MIN MAX
MIN MAX
0.5 4.2
tpd
A or G
Y
1
5.1
ns
Switching Characteristics
over recommended operating free-air temperature range, CL = 30 pF or 50 pF (unless otherwise noted) (see Figure 2)
VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V
VCC = 5 V
± 0.5 V
FROM
(INPUT)
TO
(OUTPUT)
± 0.15 V
± 0.2 V
± 0.3 V
PARAMETER
UNIT
MIN MAX MIN MAX
MIN MAX
MIN MAX
tpd
A or G
Y
2.5
15.8
1.5
7.5
1
6.1
0.5
5.1
ns
Operating Characteristics
TA = 25°C
VCC = 1.8 V
VCC = 2.5 V
VCC = 3.3 V
VCC = 5 V
TYP
TEST
CONDITIONS
PARAMETER
UNIT
TYP
17
TYP
17
TYP
18
G to Y1
A1 to Yn
19
Power dissipation
capacitance
Cpd
f = 10 MHz
pF
33
33
33
35
6
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SN74LVC1G29
2-OF-3 DECODER/DEMULTIPLEXER
www.ti.com
SCES569A–JUNE 2004–REVISED SEPTEMBER 2006
PARAMETER MEASUREMENT INFORMATION
VLOAD
Open
S1
RL
From Output
Under Test
TEST
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
S1
GND
Open
VLOAD
GND
CL
(see Note A)
RL
LOAD CIRCUIT
INPUTS
VCC
VM
VLOAD
CL
RL
V
D
VI
tr/tf
VCC
VCC
3 V
VCC
1.8 V ± 0.15 V
2.5 V ± 0.2 V
3.3 V ± 0.3 V
5 V ± 0.5 V
£2 ns
£2 ns
VCC/2
VCC/2
1.5 V
VCC/2
2 × VCC
2 × VCC
6 V
15 pF
15 pF
15 pF
15 pF
1 MW
0.15 V
0.15 V
0.3 V
1 MW
1 MW
1 MW
£2.5 ns
£2.5 ns
2 × VCC
0.3 V
VI
Timing Input
Data Input
VM
0 V
tW
tsu
th
VI
VI
Input
VM
VM
VM
VM
0 V
0 V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VI
VI
Output
Control
VM
VM
Input
VM
VM
0 V
0 V
tPZL
tPLZ
tPLH
tPHL
VM
Output
Waveform 1
S1 at VLOAD
VOH
VOL
VLOAD/2
VOL
VM
VM
Output
Output
VOL + V
D
(see Note B)
tPHL
tPLH
tPZH
tPHZ
VOH
VOL
Output
Waveform 2
S1 at GND
VOH
VOH – V
D
VM
VM
VM
»0 V
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR £ 10 MHz, ZO = 50 W.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
7
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SN74LVC1G29
2-OF-3 DECODER/DEMULTIPLEXER
www.ti.com
SCES569A–JUNE 2004–REVISED SEPTEMBER 2006
PARAMETER MEASUREMENT INFORMATION (continued)
VLOAD
Open
S1
RL
From Output
Under Test
TEST
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
S1
GND
Open
VLOAD
GND
CL
(see Note A)
RL
LOAD CIRCUIT
INPUTS
VCC
VM
VLOAD
CL
RL
V
D
VI
tr/tf
VCC
VCC
3 V
VCC
1.8 V ± 0.15 V
2.5 V ± 0.2 V
3.3 V ± 0.3 V
5 V ± 0.5 V
£2 ns
£2 ns
VCC/2
VCC/2
1.5 V
VCC/2
2 × VCC
2 × VCC
6 V
30 pF
30 pF
50 pF
50 pF
1 kW
0.15 V
0.15 V
0.3 V
500 W
500 W
500 W
£2.5 ns
£2.5 ns
2 × VCC
0.3 V
VI
Timing Input
Data Input
VM
0 V
tW
tsu
th
VI
VI
Input
VM
VM
VM
VM
0 V
0 V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VI
VI
Output
Control
VM
VM
Input
VM
VM
0 V
0 V
tPZL
tPLZ
tPLH
tPHL
VM
Output
Waveform 1
S1 at VLOAD
VOH
VOL
VLOAD/2
VM
VM
Output
Output
VOL + V
D
VOL
(see Note B)
tPHL
tPLH
tPZH
tPHZ
VOH
VOL
Output
Waveform 2
S1 at GND
VOH
VOH – V
D
VM
VM
VM
»0 V
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR £ 10 MHz, ZO = 50 W.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 2. Load Circuit and Voltage Waveforms
8
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PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
PACKAGING INFORMATION
Orderable Device
SN74LVC1G29DCTR
SN74LVC1G29DCTRE4
Status (1)
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SM8
DCT
8
3000
3000
250
Pb-Free
(RoHS)
CU NIPDAU Level-1-260C-UNLIM
SM8
DCT
8
Pb-Free
(RoHS)
CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G29DCTT
SN74LVC1G29DCUR
PREVIEW
ACTIVE
SM8
US8
DCT
DCU
8
8
TBD
Call TI
Call TI
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LVC1G29DCURE4
SN74LVC1G29DCUT
SN74LVC1G29DCUTE4
ACTIVE
ACTIVE
ACTIVE
US8
US8
US8
DCU
DCU
DCU
8
8
8
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LVC1G29YEPR
SN74LVC1G29YZPR
NRND
WCSP
WCSP
YEP
YZP
8
8
3000
TBD
SNPB
Level-1-260C-UNLIM
Level-1-260C-UNLIM
ACTIVE
3000 Green (RoHS &
no Sb/Br)
SNAGCU
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
MPDS049B – MAY 1999 – REVISED OCTOBER 2002
DCT (R-PDSO-G8)
PLASTIC SMALL-OUTLINE PACKAGE
0,30
0,15
M
0,13
0,65
8
5
0,15 NOM
2,90
2,70
4,25
3,75
Gage Plane
PIN 1
INDEX AREA
0,25
1
4
0° – 8°
0,60
0,20
3,15
2,75
1,30 MAX
Seating Plane
0,10
0,10
0,00
4188781/C 09/02
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion
D. Falls within JEDEC MO-187 variation DA.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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