TAS5780MDCA [TI]
20W 立体声、40W 单声道、4.5V 至 26.4V 电源电压、数字输入 D 类音频放大器 | DCA | 48 | -25 to 85;![TAS5780MDCA](http://pdffile.icpdf.com/pdf2/p00361/img/icpdf/TAS5780MDCA_2214196_icpdf.jpg)
型号: | TAS5780MDCA |
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描述: | 20W 立体声、40W 单声道、4.5V 至 26.4V 电源电压、数字输入 D 类音频放大器 | DCA | 48 | -25 to 85 放大器 音频放大器 |
文件: | 总205页 (文件大小:3760K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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TAS5780M
ZHCSFY4 –DECEMBER 2016
TAS5780M 采用 96kHz 处理架构的数字输入、闭环 D 类放大器
1 特性
2 应用
1
•
灵活的音频 I/O 配置
•
液晶显示屏 (LCD)、发光二极管 (LED) TV 和多用
途监视器
–
–
–
支持 I2S、TDM、LJ 和 RJ 数字输入
•
•
条形音箱、扩展坞和 PC 音频
无线低音炮、蓝牙扬声器和有源扬声器
支持采样速率
立体声桥接负载 (BTL) 或单声道并行桥接负载
(PBTL) 运行
3 说明
–
–
1SPW 放大器调制
TAS5780M 器件是一款高性能、立体声闭环 D 类放大
器,集成采用 96kHz 架构的音频处理器。为实现数模
转换,该器件采用了应用 Burr-Brown™技术的高性能
数模转换器 (DAC) 该器件仅需两个电源:一个是用于
低压电路的 DVDD,另一个是用于高压电路的
PVDD。它采用标准的 I2C 通信软件控制端口实现控
制。
支持三线制数字音频接口(无需 MCLK)
•
•
高性能闭环架构(PVDD = 12V,RSPK
8Ω,SPK_GAIN = 20dB)
=
–
–
–
空闲声道噪声 = 62μVRMS (A-Wtd)
总谐波失真 + 噪声 (THD+N) = 0.2% (1W/1kHz)
信噪比 (SNR) = 100dB A-Wtd(以THD+N =
1% 为基准)
固定功能处理 特性
输出金属氧化物半导体场效应晶体管 (MOSFET) 的
90mΩ rDS(on) 兼顾散热性能与器件成本,二者相得益
彰。此外,该器件采用耐热增强型 48 引脚薄型小外形
尺寸 (TSSOP),在现代消费类电子器件的较高工作环
境温度下展现出优异的性能。
–
–
12 个 BiQuad
–
12 个 BiQuad 实现快速变换的内部存储区切
换
双波段高级动态范围压缩 (DRC) + 自动增益限
制 (AGL)
器件信息(1)
–
–
动态参数均衡 (DPEQ)
采样速率转换器 (SRC) 支持的频率包括
32kHz、44.1kHz、48kHz、88.2kHz、96kHz
器件型号
TAS5780M
封装
封装尺寸(标称值)
TSSOP (48)
12.50mm x 6.10mm
–
96kHz 处理器采样
(1) 要了解所有可用封装,请参见数据表末尾的可订购产品附录。
•
•
通信 特性
–
–
通过 I2C 端口实现软件模式控制
两个地址选择引脚 – 多达 4 个器件
兼具稳定性 和可靠性
–
–
时钟误差和短路保护
过热和过流保护
简化框图
10% THD+N 时的功率与 PVDD 间的关系 (1)
DVDD
PVDD
80
High Voltage
Supply Domain
8 W Load Peak
6 W Load Peak
4 W Load Peak
6 W Load Continous
4 W Load Continous
Low-Voltage Supply Domain
Fixed-Function
Processing
High Performance
Stereo DAC
Closed Loop Stereo
Class D Amplifier
60
40
20
0
Serial
Audio In
001100
1101
Analog
Audio Out
PWM
Modulator
Power
Stage
Serial Audio
Out
µCDSP Core
TI
Burr-Brown Audio
Hardware
Control Port
Software Control Port
I²C Communication
GPIO/Status
Copyright © 2016, Texas Instruments Incorporated
5
10
15
Supply Voltage (V)
20
24
D002
(1) 在 TAS5780MEVM 电路板中进行了测试。
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
English Data Sheet: SLASEG7
TAS5780M
ZHCSFY4 –DECEMBER 2016
www.ti.com.cn
目录
9.3 Feature Description................................................. 32
9.4 Device Functional Modes........................................ 54
9.5 Programming........................................................... 55
10 Application and Implementation........................ 67
10.1 Application Information.......................................... 67
10.2 Typical Applications ............................................. 69
11 Power Supply Recommendations ..................... 78
11.1 Power Supplies ..................................................... 78
12 Layout................................................................... 80
12.1 Layout Guidelines ................................................. 80
12.2 Layout Example .................................................... 82
13 Register Maps...................................................... 88
13.1 Registers - Page 0 ................................................ 88
13.2 Registers - Page 1 .............................................. 149
13.3 Registers - Page 253 .......................................... 156
13.4 DSP Memory Map............................................... 189
14 器件和文档支持 ................................................... 198
14.1 器件支持.............................................................. 198
14.2 接收文档更新通知 ............................................... 198
14.3 社区资源.............................................................. 199
14.4 商标..................................................................... 199
14.5 静电放电警告....................................................... 199
14.6 Glossary.............................................................. 199
15 机械、封装和可订购信息..................................... 199
1
2
3
4
5
6
特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
Device Comparison Table..................................... 3
Pin Configuration and Functions......................... 3
6.1 Internal Pin Configurations........................................ 5
Specifications......................................................... 8
7.1 Absolute Maximum Ratings ...................................... 8
7.2 ESD Ratings.............................................................. 8
7.3 Recommended Operating Conditions....................... 9
7.4 Thermal Information.................................................. 9
7.5 Electrical Characteristics......................................... 10
7.6 Power Dissipation Characteristics .......................... 14
7.7 MCLK Timing ......................................................... 19
7.8 Serial Audio Port Timing – Slave Mode.................. 19
7.9 Serial Audio Port Timing – Master Mode................ 20
7.10 I2C Bus Timing – Standard ................................... 20
7.11 I2C Bus Timing – Fast........................................... 20
7.12 SPK_MUTE Timing .............................................. 21
7.13 Typical Characteristics.......................................... 23
Parametric Measurement Information ............... 30
Detailed Description ............................................ 31
9.1 Overview ................................................................. 31
9.2 Functional Block Diagram ....................................... 31
7
8
9
4 修订历史记录
日期
修订版本
注释
2016 年 12 月
*
最初发布。
2
Copyright © 2016, Texas Instruments Incorporated
TAS5780M
www.ti.com.cn
ZHCSFY4 –DECEMBER 2016
5 Device Comparison Table
DEVICE NAME
MODULATION STYLE
PROCESSING TYPE
TAS5780MDCA
1SPW (Ternary)
100 MIPs, Fixed-Function (Uses single ROM image of process flow)
50 MIPs, HybridFlow (Uses mixture of RAM and ROM components to
create several process flows)
TAS5754MDCA
TAS5756MDCA
1SPW (Ternary)
50 MIPs, HybridFlow (Uses mixture of RAM and ROM components to
create several process flows)
BD Modulation
6 Pin Configuration and Functions
DCA Package
48-Pin TSSOP with PowerPAD™
Top View
1
2
3
4
5
6
7
8
9
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
BSTRPA–
SPK_OUTA–
PGND
BSTRPB–
SPK_OUTB–
PGND
SPK_OUTA+
BSTRPA+
PVDD
SPK_OUTB+
BSTRPB+
PVDD
PVDD
PVDD
GVDD_REG
SPK_GAIN/FREQ
AGND
PVDD
SPK_FAULT
PGND
10
11
12
13
14
15
16
17
SPK_INA–
SPK_INA+
DAC_OUTA
AVDD
SPK_INB–
SPK_INB+
DAC_OUTB
CPVSS
AGND
CN
SDA
GND
SCL
CP
PowerPADTM
18
19
GPIO0
CPVDD
DVDD
RESET
20
21
22
23
24
29
28
27
26
25
ADR1
DGND
GPIO2
DVDD_REG
SPK_MUTE
ADR0
MCLK
SCLK
SDIN
LRCK/FS
Pin Functions
PIN
INTERNAL
TERMINATION
TYPE(1)
DESCRIPTION
NAME
ADR0
ADR1
NO.
26
20
10
15
14
Sets the LSB of the I2C address to 0 if pulled to GND, to 1 if pulled to DVDD
DI
DI
Sets the second LSB of the I2C address to 0 if pulled to GND, to 1 if pulled to DVDD
AGND
AVDD
G
P
—
Ground reference for analog circuitry(2)
Power supply for internal analog circuitry
Figure 2
(1) AI = Analog input, AO = Analog output, DI = Digital Input, DO = Digital Output, DI/O = Digital Bi-directional (input and output), P =
Power, G = Ground (0 V)
(2) This pin should be connected to the system ground.
Copyright © 2016, Texas Instruments Incorporated
3
TAS5780M
ZHCSFY4 –DECEMBER 2016
www.ti.com.cn
Pin Functions (continued)
PIN
INTERNAL
TERMINATION
TYPE(1)
DESCRIPTION
NAME
NO.
Connection point for the SPK_OUTA– bootstrap capacitor which is used to create a power supply for
the high-side gate drive for SPK_OUTA–
BSTRPA–
1
P
P
P
P
Connection point for the SPK_OUTA+ bootstrap capacitor which is used to create a power supply for
the high-side gate drive for SPK_OUTA+
BSTRPA+
BSTRPB–
BSTRPB+
5
Figure 3
Connection point for the SPK_OUTB– bootstrap capacitor which is used to create a power supply for
the high-side gate drive for SPK_OUTB–
48
44
Connection point for the SPK_OUTB+ bootstrap capacitor which is used to create a power supply for
the high-side gate drive for SPK_OUTB+
CN
34
32
31
35
13
36
29
30
P
P
Figure 14
Figure 13
Figure 2
Negative pin for capacitor connection used in the line-driver charge pump
Positive pin for capacitor connection used in the line-driver charge pump
Power supply for charge pump circuitry
CP
CPVDD
CPVSS
DAC_OUTA
DAC_OUTB
DGND
P
P
Figure 14
–3.3-V supply generated by charge pump for the DAC
Single-ended output for Channel A of the DAC
AO
AO
G
Figure 8
Single-ended output for Channel B of the DAC
—
Ground reference for digital circuitry. Connect this pin to the system ground.
Power supply for the internal digital circuitry
DVDD
P
Figure 2
Voltage regulator derived from DVDD supply for use for internal digital circuitry. This pin is provided
as a connection point for filtering capacitors for this supply and must not be used to power any
external circuitry.
DVDD_REG
28
P
Figure 15
—
GND
33
18
21
G
Ground pin for device. This pin should be connected to the system ground.
GPIO0
GPIO2
DI/O
General purpose input/output pins (GPIOx). Refer to GPIO registers for configuration.
Voltage regulator derived from PVDD supply to generate the voltage required for the gate drive of
output MOSFETs. This pin is provided as a connection point for filtering capacitors for this supply and
must not be used to power any external circuitry.
GVDD_REG
8
P
Figure 5
Word select clock for the digital signal that is active on the serial port's input data line. In I2S, LJ, and
RJ, this corresponds to the left channel and right channel boundary. In TDM mode, this corresponds
to the frame sync boundary.
LRCK/FS
MCLK
25
DI/O
DI
Figure 11
22
3
Master clock used for internal clock tree and sub-circuit and state machine clocking
PGND
39
46
6
G
—
Ground reference for power device circuitry. Connect this pin to the system ground.
7
PVDD
41
42
43
19
17
23
16
24
11
12
38
37
40
P
Figure 1
Power supply for internal power circuitry
RESET
DI
DI
Figure 17
Figure 10
Figure 11
Figure 9
Device reset input. Pull down to reset, pull up to activate device.
I2C serial control port clock
SCL
SCLK
DI/O
DI/O
D1
AI
Bit clock for the digital signal that is active on the input data line of the serial data port
I2C serial control port data
SDA
SDIN
Figure 11
Data line to the serial data port
SPK_INA–
SPK_INA+
SPK_INB–
SPK_INB+
SPK_FAULT
Negative pin for differential speaker amplifier input A
Positive pin for differential speaker amplifier input A
Negative pin for differential speaker amplifier input B
Positive pin for differential speaker amplifier input B
Fault pin which is pulled low when an overcurrent or overtemperature fault occurs
AI
Figure 7
AI
AI
DO
Figure 16
Figure 6
SPK_GAIN/F
REQ
9
AI
Sets the gain and switching frequency of the speaker amplifier, latched in upon start-up of the device.
SPK_OUTA–
SPK_OUTA+
SPK_OUTB–
SPK_OUTB+
2
4
AO
AO
AO
AO
Negative pin for differential speaker amplifier output A
Positive pin for differential speaker amplifier output A
Negative pin for differential speaker amplifier output B
Positive pin for differential speaker amplifier output B
Figure 4
47
45
4
Copyright © 2016, Texas Instruments Incorporated
TAS5780M
www.ti.com.cn
ZHCSFY4 –DECEMBER 2016
Pin Functions (continued)
PIN
INTERNAL
TERMINATION
TYPE(1)
DESCRIPTION
NAME
NO.
Speaker amplifier mute which must be pulled low (connected to DGND) to mute the device and
pulled high (connected to DVDD) to unmute the device.
SPK_MUTE
PowerPAD
27
I
Figure 12
—
Provides both electrical and thermal connection from the device to the board. A matching ground pad
must be provided on the PCB and the device connected to it through solder. For proper electrical
operation, this ground pad must be connected to the system ground.
—
G
6.1 Internal Pin Configurations
DVDD
PVDD
3.3 V ESD
30 V ESD
/opyright © 2016, Çexas Lnstruments Lncorporated
/opyright © 2016, Çexas Lnstruments Lncorporated
Figure 1. PVDD Pins
Figure 2. AVDD, DVDD and CPVDD Pins
PVDD
GVDD
PVDD
BSTRPxx
7 V ESD
SPK_OUTxx
SPK_OUTxx
/opyright © 2016, Çexas Lnstruments Lncorporated
/opyright © 2016, Çexas Lnstruments Lncorporated
Figure 3. BSTRPxx Pins
Figure 4. SPK_OUTxx Pins
Copyright © 2016, Texas Instruments Incorporated
5
TAS5780M
ZHCSFY4 –DECEMBER 2016
www.ti.com.cn
Internal Pin Configurations (continued)
GVDD
PVDD
10 Ω
GVDD
10 kΩ
SPK_GAIN/FREQ
7 V ESD
7 V ESD
/opyright © 2016, Çexas Lnstruments Lncorporated
/opyright © 2016, Çexas Lnstruments Lncorporated
Figure 5. GVDD_REG Pin
Figure 6. SPK_GAIN/FREQ Pin
AVDD
SPK_INxx
7 V ESD
Gain Switch
CPVSS
DAC_OUTA
/opyright © 2016, Çexas Lnstruments Lncorporated
/opyright © 2016, Çexas Lnstruments Lncorporated
Figure 7. SPK_INxx Pins
Figure 8. DAC_OUTx Pins
DVDD
SDA
DVDD
SCL
3.3 V
ESD
3.3 V
ESD
/opyright © 2016, Çexas Lnstruments Lncorporated
/opyright © 2016, Çexas Lnstruments Lncorporated
Figure 9. SDA Pin
Figure 10. SCL Pin
6
Copyright © 2016, Texas Instruments Incorporated
TAS5780M
www.ti.com.cn
ZHCSFY4 –DECEMBER 2016
Internal Pin Configurations (continued)
DVDD
DVDD
MCLK
SCLK
SPK_MUTE
3.3 V
ESD
SDIN
3.3 V
ESD
LRCK/FS
/opyright © 2016, Çexas Lnstruments Lncorporated
/opyright © 2016, Çexas Lnstruments Lncorporated
Figure 11. SCLK, BCLK, SDIN, and LRCK/FS Pins
Figure 12. SPK_MUTE Pin
CVPDD
GND
CN
3.3 V
ESD
CP
3.3 V
ESD
CPVSS
3.3 V
ESD
/opyright © 2016, Çexas Lnstruments Lncorporated
/opyright © 2016, Çexas Lnstruments Lncorporated
Figure 13. CP Pin
Figure 14. CN and CPVSS Pins
DVDD
100 Ω
SPK_FAULT
DVDD_REG
28 V
ESD
1.8 V
ESD
/opyright © 2016, Çexas Lnstruments Lncorporated
/opyright © 2016, Çexas Lnstruments Lncorporated
Figure 15. DVDD_REG Pin
Figure 16. SPK_FAULT Pin
Copyright © 2016, Texas Instruments Incorporated
7
TAS5780M
ZHCSFY4 –DECEMBER 2016
www.ti.com.cn
Internal Pin Configurations (continued)
DVDD
RESET
3.3 V
ESD
/opyright © 2016, Çexas Lnstruments Lncorporated
Figure 17. RESET Pin
7 Specifications
7.1 Absolute Maximum Ratings
Free-air room temperature 25°C (unless otherwise noted)(1)
MIN
MAX
UNIT
DVDD, AVDD,
Low-voltage digital, analog, charge pump supply
CPVDD
–0.3
3.9
V
PVDD
PVDD supply
–0.3
–0.3
–0.5
–0.3
–0.3
–25
–40
–40
–40
30
V
V
VI(AmpCtrl)
VI(DigIn)
VI(SPK_INxx)
VI(SPK_OUTxx)
Input voltage for SPK_GAIN/FREQ and SPK_FAULT pins
DVDD referenced digital inputs(2)
VGVDD + 0.3
VDVDD + 0.5
V
Analog input into speaker amplifier
Voltage at speaker output pins
6.3
32
V
V
Ambient operating temperature, TA
Operating junction temperature, digital die
Operating junction temperature, power die
Storage temperature
85
°C
°C
°C
°C
125
165
125
TJ
Tstg
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) DVDD referenced digital pins include: ADR0, ADR1, GPIO0, GPIO2, LRCK/FS, MCLK, RESET, SCL, SCLK, SDA, SDIN, and
SPK_MUTE.
7.2 ESD Ratings
VALUE
±2000
±500
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
Electrostatic
discharge
V(ESD)
V
(1) JEDEC document JEP155 states that 2000-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 500-V CDM allows safe manufacturing with a standard ESD control process.
8
Copyright © 2016, Texas Instruments Incorporated
TAS5780M
www.ti.com.cn
ZHCSFY4 –DECEMBER 2016
7.3 Recommended Operating Conditions
Free-air room temperature 25°C (unless otherwise noted)
MIN
NOM
MAX
3.63
26.4
UNIT
DVDD, AVDD, CPVDD
2.9
V(POWER)
Power supply inputs
V
PVDD
4.5
BTL Mode
PBTL Mode
3
2
Ω
Ω
V
V
RSPK
Minimum speaker load
VIH(DigIn)
VIL(DigIn)
Input logic high for DVDD referenced digital inputs(1)(2)
Input logic low for DVDD referenced digital inputs(1)(3)
0.9 × VDVDD
VDVDD
VDVDD
0
0.1 × VDVDD
Minimum inductor value in LC filter under short-circuit
condition
LOUT
1
4.7
µH
(1) DVDD referenced digital pins include: ADR0, ADR1, GPIO0, GPIO2, LRCK/FS, MCLK, RESET, SCL, SCLK, SDA, SDIN, and
SPK_MUTE.
(2) The best practice for driving the input pins of the TAS5780M device is to power the drive circuit or pullup resistor from the same supply
which provides the DVDD power supply.
(3) The best practice for driving the input pins of the TAS5780M device low is to pull them down, either actively or through pulldown
resistors to the system ground.
7.4 Thermal Information
TAS5780M
DCA (TSSOP)
48 PINS
THERMAL METRIC(1)
UNIT
JEDEC
STANDARD
2-LAYER PCB
JEDEC
STANDARD
4-LAYER PCB
TAS5780MEVM
4-LAYER PCB
RθJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
41.8
14.4
9.4
27.6
14.4
9.4
19.4
14.4
9.4
2
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
RθJC(top)
RθJB
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
0.6
0.6
ψJB
8.1
9.3
4.8
N/A
RθJC(bot)
N/A
N/A
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
Copyright © 2016, Texas Instruments Incorporated
9
TAS5780M
ZHCSFY4 –DECEMBER 2016
www.ti.com.cn
7.5 Electrical Characteristics
Free-air room temperature 25°C (unless otherwise noted) Measurements were made using TAS5780MEVM board and Audio
Precision System 2722 with Analog Analyzer filter set to 40 kHz brickwall filter. The device output PWM frequency was set to
768 kHz unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
DIGITAL I/O
Input logic high current level
for DVDD referenced digital
input pins(1)
|IIH|1
VIN(DigIn) = VDVDD
10
µA
µA
Input logic low current level
for DVDD referenced digital
input pins(1)
|IIL|1
VIH1
VIL1
VIN(DigIn) = 0 V
–10
Input logic high threshold for
DVDD referenced digital
inputs(1)
70%
80%
VDVDD
Input logic low threshold for
DVDD referenced digital
inputs(1)
30%
VDVDD
Output logic high voltage
level(1)
VOH(DigOut)
VOL(DigOut)
IOH = 4 mA
VDVDD
VDVDD
Output logic low voltage
level(1)
IOH = –4 mA
22%
0.8
Output logic low voltage level
for SPK_FAULT
VOL(SPK_FAULT)
GVDD_REG
With 100-kΩ pullup resistor
V
V
GVDD regulator voltage
7
I2C CONTROL PORT
Allowable load capacitance
for each I2C Line
CL(I2C)
400
pF
fSCL(fast)
fSCL(slow)
Support SCL frequency
Support SCL frequency
No wait states, fast mode
No wait states, slow mode
400
100
kHz
kHz
Noise margin at High level for
each connected device
(including hysteresis)
VNH
0.2 × VDD
V
MCLK AND PLL SPECIFICATIONS
DMCLK Allowable MCLK duty cycle
fMCLK Supported MCLK frequencies Up to 50 MHz
40%
128
60%
512
(2)
fS
Clock divider uses fractional divide
D > 0, P = 1
6.7
1
20
20
fPLL
PLL input frequency
MHz
Clock divider uses integer divide
D = 0, P = 1
SERIAL AUDIO PORT
Required LRCK/FS to SCLK
rising edge delay
tDLY
5
ns
DSCLK
fS
fSCLK
fSCLK
Allowable SCLK duty cycle
Supported input sample rates
Supported SCLK frequencies
SCLK frequency
40%
8
60%
96
kHz
(2)
32
64
fS
Either master mode or slave mode
24.576
MHz
SPEAKER AMPLIFIER (ALL OUTPUT CONFIGURATIONS)
SPK_GAIN/FREQ voltage < 3 V,
see Adjustable Amplifier Gain and Switching
20
Frequency Selection
AV(SPK_AMP)
Speaker amplifier gain
dBV
dBV
SPK_GAIN/FREQ voltage > 3.3 V,
see Adjustable Amplifier Gain and Switching
Frequency Selection
26
±1
Typical variation of speaker
amplifier gain
ΔAV(SPK_AMP)
(1) DVDD referenced digital pins include: ADR0, ADR1, GPIO0, GPIO2, LRCK/FS, MCLK,RESET, SCL, SCLK, SDA, SDIN, and
SPK_MUTE.
(2) A unit of fS indicates that the specification is the value listed in the table multiplied by the sample rate of the audio used in the
TAS5780M device.
10
Copyright © 2016, Texas Instruments Incorporated
TAS5780M
www.ti.com.cn
ZHCSFY4 –DECEMBER 2016
Electrical Characteristics (continued)
Free-air room temperature 25°C (unless otherwise noted) Measurements were made using TAS5780MEVM board and Audio
Precision System 2722 with Analog Analyzer filter set to 40 kHz brickwall filter. The device output PWM frequency was set to
768 kHz unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Switching frequency depends on voltage
presented at SPK_GAIN/FREQ pin and the
clocking arrangement, including the incoming
sample rate, see Adjustable Amplifier Gain and
Switching Frequency Selection
Switching frequency of the
speaker amplifier
fSPK_AMP
176.4
768
kHz
Injected Noise = 50 Hz to 60 Hz, 200 mVP-P, Gain
= 26 dB, input audio signal = digital zero
KSVR
Power supply rejection ratio
60
dB
VPVDD = 24 V, I(SPK_OUT) = 500 mA, TJ = 25°C,
includes PVDD/PGND pins, leadframe, bondwires
and metallization layers.
Drain-to-source on resistance
of the individual output
MOSFETs
120
rDS(on)
mΩ
VPVDD = 24 V, I(SPK_OUT) = 500 mA, TJ = 25°C
90
SPK_OUTxx overcurrent
error threshold
OCETHRES
OTETHRES
7.5
A
Overtemperature error
threshold
165
1.3
°C
Time required to clear
overcurrent error after error
condition is removed.
OCECLRTIME
s
s
Time required to clear
overtemperature error after
error condition is removed.
OTECLRTIME
1.3
PVDD overvoltage error
threshold
OVETHRES(PVDD)
UVETHRES(PVDD)
27
V
V
PVDD undervoltage error
threshold
4.3
SPEAKER AMPLIFIER (STEREO BTL)
Measured differentially with zero input data,
SPK_GAIN/FREQ pin configured for 20 dB gain,
VPVDD = 12 V
2
5
|VOS
|
Amplifier offset voltage
mV
Measured differentially with zero input data,
SPK_GAIN/FREQ pin configured for 26 dB gain,
VPVDD = 24 V
15
VPVDD = 12 V, SPK_GAIN = 20 dB, RSPK = 8 Ω, A-
Weighted
49
59
81
82
14
8
VPVDD = 15 V, SPK_GAIN = 20 dB, RSPK = 8 Ω, A-
Weighted
ICN(SPK)
Idle channel noise
µVRMS
VPVDD = 19 V, SPK_GAIN = 26 dB, RSPK = 8 Ω, A-
Weighted
VPVDD = 24 V, SPK_GAIN = 26 dB, RSPK = 8 Ω, A-
Weighted
VPVDD = 12 V, SPK_GAIN = 20 dB, RSPK = 4 Ω,
THD+N = 0.1%
VPVDD = 12 V, SPK_GAIN = 20 dB, RSPK = 8 Ω,
THD+N = 0.1%
VPVDD = 15 V, SPK_GAIN = 26 dB, RSPK = 4 Ω,
THD+N = 0.1%
23
13
34
20
40
33
VPVDD = 15 V, SPK_GAIN = 26 dB, RSPK = 8 Ω,
THD+N = 0.1%
PO(SPK)
Output Power (Per Channel)
W
VPVDD = 19 V, SPK_GAIN = 26 dB, RSPK = 4 Ω,
THD+N = 0.1%
VPVDD = 19 V, SPK_GAIN = 26 dB, RSPK = 8 Ω,
THD+N = 0.1%
VPVDD = 24 V, SPK_GAIN = 26 dB, RSPK = 4 Ω,
THD+N = 0.1%
VPVDD = 24 V, SPK_GAIN = 26 dB, RSPK = 8 Ω,
THD+N = 0.1%
Copyright © 2016, Texas Instruments Incorporated
11
TAS5780M
ZHCSFY4 –DECEMBER 2016
www.ti.com.cn
Electrical Characteristics (continued)
Free-air room temperature 25°C (unless otherwise noted) Measurements were made using TAS5780MEVM board and Audio
Precision System 2722 with Analog Analyzer filter set to 40 kHz brickwall filter. The device output PWM frequency was set to
768 kHz unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VPVDD = 12 V, SPK_GAIN = 20 dB, RSPK = 8 Ω, A-
Weighted, –120 dBFS Input
103
VPVDD = 15 V, SPK_GAIN = 26 dB, RSPK = 8 Ω, A-
Weighted, –120 dBFS Input
102
103
Signal-to-noise ratio
(referenced to 0 dBFS input
signal)
SNR
dB
VPVDD = 19 V, SPK_GAIN = 26 dB, RSPK = 8 Ω, A-
Weighted, –120 dBFS Input
VPVDD = 24 V, SPK_GAIN = 26 dB, RSPK = 8 Ω, A-
Weighted, –120 dBFS Input
105
VPVDD = 12 V, SPK_GAIN = 20 dB, RSPK = 4 Ω,
PO = 1 W, f = 1kHz
0.021%
0.022%
0.02%
0.037%
0021%
0.028%
0.027%
0.038%
VPVDD = 12 V, SPK_GAIN = 20 dB, RSPK = 8 Ω,
PO = 1 W, f = 1kHz
VPVDD = 15 V, SPK_GAIN = 26 dB, RSPK = 4 Ω,
PO = 1 W, f = 1kHz
VPVDD = 15 V, SPK_GAIN = 26 dB, RSPK = 8 Ω,
PO = 1 W, f = 1kHz
Total harmonic distortion and
noise
THD+NSPK
VPVDD = 19 V, SPK_GAIN = 26 dB, RSPK = 4 Ω,
PO = 1 W, f = 1kHz
VPVDD = 19 V, SPK_GAIN = 26 dB, RSPK = 8 Ω,
PO = 1 W, f = 1kHz
VPVDD = 24 V, SPK_GAIN = 26 dB, RSPK = 4 Ω,
PO = 1 W, f = 1kHz
VPVDD = 24 V, SPK_GAIN = 26 dB, RSPK = 8 Ω,
PO = 1 W, f = 1kHz
VPVDD = 12 V, SPK_GAIN = 20 dB, RSPK = 8 Ω,
Input Signal 250 mVrms,
1-kHz Sine, across f(S)
–90
–102
–93
VPVDD = 15 V, SPK_GAIN = 26 dBV, RSPK = 8 Ω,
Input Signal 250 mVrms,
1-kHz Sine, across f(S)
Cross-talk (worst case
between left-to-right and
right-to-left coupling)
X-talkSPK
dB
VPVDD = 19 V, SPK_GAIN = 26 dBV, RSPK = 8 Ω,
Input Signal 250 mVrms,
1-kHz Sine, across f(S)
VPVDD = 24 V, SPK_GAIN = 26 dBV, RSPK = 8 Ω,
Input Signal 250 mVrms,
–93
1-kHz Sine, across f(S)
SPEAKER AMPLIFIER (MONO PBTL)
Measured differentially with zero input data,
SPK_GAIN/FREQ pin configured for 20 dB gain,
VPVDD = 12 V
0.7
4
|VOS
|
Amplifier offset voltage
mV
Measured differentially with zero input data,
SPK_GAIN/FREQ pin configured for 26 dB gain,
VPVDD = 24 V
VPVDD = 12 V, SPK_GAIN = 20 dB, RSPK = 8 Ω, A-
Weighted
48
49
83
82
VPVDD = 15 V, SPK_GAIN = 20 dB, RSPK = 8 Ω,
A-Weighted
ICN
Idle channel noise
µVRMS
VPVDD = 19 V, SPK_GAIN = 26 dB, RSPK = 8 Ω,
A-Weighted
VPVDD = 24 V, SPK_GAIN = 26 dB, RSPK = 8 Ω, A-
Weighted
12
Copyright © 2016, Texas Instruments Incorporated
TAS5780M
www.ti.com.cn
ZHCSFY4 –DECEMBER 2016
Electrical Characteristics (continued)
Free-air room temperature 25°C (unless otherwise noted) Measurements were made using TAS5780MEVM board and Audio
Precision System 2722 with Analog Analyzer filter set to 40 kHz brickwall filter. The device output PWM frequency was set to
768 kHz unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VPVDD = 12 V, SPK_GAIN = 20 dB, RSPK = 2 Ω,
THD+N = 0.1%, Unless otherwise noted
30
VPVDD = 12 V, SPK_GAIN = 20 dB, RSPK = 4 Ω,
THD+N = 0.1%, Unless otherwise noted
16
9
VPVDD = 12 V, SPK_GAIN = 20 dB, RSPK = 8 Ω,
THD+N = 0.1%
VPVDD = 15 V, SPK_GAIN = 26 dB, RSPK = 2 Ω,
THD+N = 0.1%, Unless otherwise noted
44
VPVDD = 15 V, SPK_GAIN = 26 dB, RSPK = 4 Ω,
THD+N = 0.1%, Unless otherwise noted
22
VPVDD = 15 V, SPK_GAIN = 26 dB, RSPK = 8 Ω,
THD+N = 0.1%
13
PO
Output power (per channel)
W
VPVDD = 19 V, SPK_GAIN = 26 dB, RSPK = 2 Ω,
THD+N = 0.1%, Unless otherwise noted
50
VPVDD = 19 V, SPK_GAIN = 26 dB, RSPK = 4 Ω,
THD+N = 0.1%, Unless otherwise noted
36
VPVDD = 19 V, SPK_GAIN = 26 dB, RSPK = 8 Ω,
THD+N = 0.1%
20
VPVDD = 24 V, SPK_GAIN = 26 dB, RSPK = 2 Ω,
THD+N = 0.1%, Unless otherwise noted
40
VPVDD = 24 V, SPK_GAIN = 26 dB, RSPK = 4 Ω,
THD+N = 0.1%, Unless otherwise noted
61
VPVDD = 24 V, SPK_GAIN = 26 dB, RSPK = 8 Ω,
THD+N = 0.1%
34
VPVDD = 12 V, SPK_GAIN = 20 dB, RSPK = 8 Ω, A-
Weighted, –120 dBFS Input
105
VPVDD = 15 V, SPK_GAIN = 26 dB, RSPK = 8 Ω, A-
Weighted, –120 dBFS Input
104
Signal-to-noise ratio
(referenced to 0 dBFS input
signal)
SNR
dB
VPVDD = 19 V, SPK_GAIN = 26 dB, RSPK = 8 Ω, A-
Weighted, –120 dBFS Input
105
VPVDD = 24 V, SPK_GAIN = 26 dB, RSPK = 8 Ω, A-
Weighted, –120 dBFS Input
107
VPVDD = 12 V, SPK_GAIN = 20 dB, RSPK = 2 Ω,
PO = 1 W, f = 1kHz
0.014%
0.011%
0.014%
0.015%
0.013%
0.015%
VPVDD = 12 V, SPK_GAIN = 20 dB, RSPK = 4 Ω,
PO = 1 W, f = 1kHz
VPVDD = 12 V, SPK_GAIN = 20 dB, RSPK = 8 Ω,
PO = 1 W, f = 1kHz
VPVDD = 15 V, SPK_GAIN = 26 dB, RSPK = 2 Ω,
PO = 1 W, f = 1kHz
VPVDD = 15 V, SPK_GAIN = 26 dB, RSPK = 4 Ω,
PO = 1 W, f = 1kHz
VPVDD = 15 V, SPK_GAIN = 26 dB, RSPK = 8 Ω,
PO = 1 W, f = 1kHz
Total harmonic distortion and
noise
THD+N
VPVDD = 19 V, SPK_GAIN = 26 dB, RSPK = 2 Ω,
0.018%
0.012%
0.020%
PO = 1 W, f = 1kHz
V, RSPK = 4 Ω, PO = 1 W, f = 1kHz
VPVDD = 19 V, SPK_GAIN = 26 dB, RSPK = 8 Ω,
PO = 1 W, f = 1kHz
VPVDD = 24 V, SPK_GAIN = 26 dB, RSPK = 2 Ω,
PO = 1 W, f = 1kHz
0.028%
0.02%
VPVDD = 24 V, SPK_GAIN = 26 dB, RSPK = 4 Ω,
PO = 1 W, f = 1kHz
VPVDD = 24 V, SPK_GAIN = 26 dB, RSPK = 8 Ω,
PO = 1 W, f = 1kHz
0.027%
Copyright © 2016, Texas Instruments Incorporated
13
TAS5780M
ZHCSFY4 –DECEMBER 2016
www.ti.com.cn
7.6 Power Dissipation Characteristics
Free-air room temperature 25°C (unless otherwise noted)
(4)
(5)
VPVDD
(V)
SPK_GAIN(1)(2)(3)
(dBV)
fSPK_AMP
(kHz)
STATE OF
OPERATION
RSPK
(Ω)
IPVDD
IDVDD
PDISS
(W)
(mA)
21.30
21.33
21.30
21.33
21.34
21.36
2.08
(mA)
59.70
59.68
59.70
58.82
58.81
58.81
12.41
12.41
12.41
0.730
0.740
0.740
59.7
4
6
8
4
6
8
4
6
8
4
6
8
4
6
8
4
6
8
4
6
8
4
6
8
0.355
0.355
0.355
0.352
0.352
0.352
0.056
0.057
0.057
0.017
0.018
0.018
0.400
0.401
0.378
0.398
0.398
0.398
0.056
0.056
0.057
0.018
0.018
0.018
Idle
Mute
384
Standby
Powerdown
Idle
2.11
2.17
2.03
2.04
2.06
7.4
20
27.48
27.49
24.46
27.50
27.51
27.52
2.04
59.73
59.72
58.8
Mute
58.8
58.81
12.41
12.41
12.41
0.73
768
Standby
Powerdown
2.08
2.11
2.06
2.07
0.74
2.08
0.74
(1) Mute: B0-P0-R3-D0,D4 = 1
(2) Standby: B0-P0-R2-D4 = 1
(3) Power down: B0-P0-R2-D0 = 1
(4) IPVDD refers to all current that flows through the PVDD supply for the DUT. Any other current sinks not directly related to the DUT current
draw were removed.
(5) IDVDD refers to all current that flows through the DVDD (3.3-V) supply for the DUT. Any other current sinks not directly related to the
DUT current draw were removed.
14
Copyright © 2016, Texas Instruments Incorporated
TAS5780M
www.ti.com.cn
ZHCSFY4 –DECEMBER 2016
Power Dissipation Characteristics (continued)
Free-air room temperature 25°C (unless otherwise noted)
(4)
(5)
VPVDD
(V)
SPK_GAIN(1)(2)(3)
(dBV)
fSPK_AMP
(kHz)
STATE OF
OPERATION
RSPK
(Ω)
IPVDD
IDVDD
PDISS
(W)
(mA)
24.33
24.32
24.36
24.36
24.32
24.37
3.58
(mA)
59.74
59.74
59.70
58.81
58.82
58.84
12.40
12.41
12.42
0.74
4
6
8
4
6
8
4
6
8
4
6
8
4
6
8
4
6
8
4
6
8
4
6
8
0.467
0.467
0.467
0.464
0.464
0.465
0.081
0.081
0.081
0.042
0.042
0.042
0.538
0.537
0.537
0.528
0.535
0.535
0.080
0.080
0.081
0.042
0.042
0.042
Idle
Mute
384
Standby
Powerdown
Idle
3.57
3.58
3.52
3.52
0.74
3.54
0.74
11.1
20
30.70
30.65
30.67
3.072
30.69
30.69
3.54
59.70
59.72
59.71
58.80
58.81
58.81
12.40
12.41
12.42
0.74
Mute
768
Standby
Powerdown
3.54
3.58
3.53
3.53
0.74
3.55
0.74
Copyright © 2016, Texas Instruments Incorporated
15
TAS5780M
ZHCSFY4 –DECEMBER 2016
www.ti.com.cn
Power Dissipation Characteristics (continued)
Free-air room temperature 25°C (unless otherwise noted)
(4)
(5)
VPVDD
(V)
SPK_GAIN(1)(2)(3)
(dBV)
fSPK_AMP
(kHz)
STATE OF
OPERATION
RSPK
(Ω)
IPVDD
IDVDD
PDISS
(W)
(mA)
25.07
25.08
25.10
25.12
25.08
25.11
3.92
(mA)
59.72
59.73
59.71
58.84
58.82
58.82
12.40
12.41
12.41
0.75
4
6
8
4
6
8
4
6
8
4
6
8
4
6
8
4
6
8
4
6
8
4
6
8
0.498
0.498
0.498
0.496
0.495
0.495
0.088
0.088
0.088
0.049
0.049
0.049
0.573
0.573
0.573
0.570
0.570
0.570
0.087
0.088
0.088
0.049
0.049
0.049
Idle
Mute
384
Standby
Powerdown
Idle
3.93
3.94
3.87
3.85
0.74
3.87
0.75
12
20
31.31
31.29
31.31
31.31
31.33
31.32
3.88
59.72
59.71
59.74
58.80
58.81
58.81
12.40
12.41
12.41
0.75
Mute
768
Standby
Powerdown
3.90
3.91
3.89
3.91
0.74
3.88
0.75
16
Copyright © 2016, Texas Instruments Incorporated
TAS5780M
www.ti.com.cn
ZHCSFY4 –DECEMBER 2016
Power Dissipation Characteristics (continued)
Free-air room temperature 25°C (unless otherwise noted)
(4)
(5)
VPVDD
(V)
SPK_GAIN(1)(2)(3)
(dBV)
fSPK_AMP
(kHz)
STATE OF
OPERATION
RSPK
(Ω)
IPVDD
IDVDD
PDISS
(W)
(mA)
27.94
27.91
27.75
27.98
27.94
27.88
5.09
(mA)
59.73
59.75
59.69
58.84
58.87
58.85
12.41
12.41
12.41
0.74
4
6
8
4
6
8
4
6
8
4
6
8
4
6
8
4
6
8
4
6
8
4
6
8
0.616
0.616
0.613
0.614
0.613
0.612
0.117
0.118
0.119
0.078
0.078
0.080
0.693
0.693
0.693
0.690
0.690
0.690
0.117
0.117
0.118
0.078
0.078
0.079
Idle
Mute
384
Standby
Powerdown
Idle
5.12
5.19
5.02
5.06
0.74
5.14
0.74
15
26
33.05
33.03
33.08
33.03
33.04
33.05
5.07
59.7
59.72
59.68
58.81
58.81
58.80
12.41
12.41
12.41
0.74
Mute
768
Standby
Powerdown
5.09
5.14
5.02
5.04
0.74
5.09
0.74
Copyright © 2016, Texas Instruments Incorporated
17
TAS5780M
ZHCSFY4 –DECEMBER 2016
www.ti.com.cn
Power Dissipation Characteristics (continued)
Free-air room temperature 25°C (unless otherwise noted)
(4)
(5)
VPVDD
(V)
SPK_GAIN(1)(2)(3)
(dBV)
fSPK_AMP
(kHz)
STATE OF
OPERATION
RSPK
(Ω)
IPVDD
IDVDD
PDISS
(W)
(mA)
32.27
32.19
32.08
32.27
32.24
32.22
6.95
(mA)
59.77
59.76
59.75
58.85
58.87
58.86
12.40
12.42
12.41
0.74
4
6
8
4
6
8
4
6
8
4
6
8
4
6
8
4
6
8
4
6
8
4
6
8
0.830
0.828
0.826
0.827
0.826
0.826
0.177
0.177
0.178
0.137
0.138
0.139
0.883
0.882
0.882
0.879
0.880
0.879
0.177
0.177
0.178
0.137
0.137
0.138
Idle
Mute
384
Standby
Powerdown
Idle
6.93
7.00
6.89
6.90
0.74
6.96
0.73
19.6
26
34.99
34.95
34.97
34.96
34.98
34.96
6.93
59.74
59.74
59.71
58.85
58.83
58.81
12.40
12.42
12.41
0.74
Mute
768
Standby
Powerdown
6.93
6.98
6.84
6.89
0.74
6.90
0.73
18
Copyright © 2016, Texas Instruments Incorporated
TAS5780M
www.ti.com.cn
ZHCSFY4 –DECEMBER 2016
Power Dissipation Characteristics (continued)
Free-air room temperature 25°C (unless otherwise noted)
(4)
(5)
VPVDD
(V)
SPK_GAIN(1)(2)(3)
(dBV)
fSPK_AMP
(kHz)
STATE OF
OPERATION
RSPK
(Ω)
IPVDD
IDVDD
PDISS
(W)
(mA)
36.93
36.87
36.77
36.94
36.89
36.85
8.73
(mA)
59.80
59.81
59.76
58.91
58.89
58.90
12.40
12.40
12.40
0.74
4
6
8
4
6
8
4
6
8
4
6
8
4
6
8
4
6
8
4
6
8
4
6
8
1.084
1.082
1.080
1.081
1.080
1.079
0.250
0.250
0.250
0.210
0.210
0.211
1.081
1.082
1.081
1.079
1.078
1.078
0.249
0.249
0.250
0.210
0.210
0.210
Idle
Mute
384
Standby
Powerdown
Idle
8.72
8.71
8.64
8.66
0.74
8.69
0.73
24
26
36.84
36.86
36.83
36.85
36.84
36.82
8.66
59.73
59.76
59.78
58.85
58.84
58.83
12.40
12.40
12.40
0.74
Mute
768
Standby
Powerdown
8.68
8.71
8.63
8.64
0.74
8.65
0.73
7.7 MCLK Timing
See Figure 18.
MIN
20
9
NOM
MAX
UNIT
tMCLK
tMCLKH MCLK pulse width, high
tMCLKL MCLK pulse width, low
MCLK period
1000
ns
ns
ns
9
7.8 Serial Audio Port Timing – Slave Mode
See Figure 19.
MIN
1.024
40
16
16
8
NOM
MAX
UNIT
MHz
ns
fSCLK
tSCLK
tSCLKL
tSCLKH
tSL
SCLK frequency
SCLK period
SCLK pulse width, low
ns
SCLK pulse width, high
ns
SCLK rising to LRCK/FS edge
LRCK/FS Edge to SCLK rising edge
Data setup time, before SCLK rising edge
Data hold time, after SCLK rising edge
Data delay time from SCLK falling edge
ns
tLS
8
ns
tSU
8
ns
tDH
8
ns
tDFS
15
ns
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7.9 Serial Audio Port Timing – Master Mode
See Figure 20.
MIN NOM
MAX
UNIT
ns
tSCLK
tSCLKL
tSCLKH
tLRD
SCLK period
40
16
16
–10
8
SCLK pulse width, low
ns
SCLK pulse width, high
ns
LRCK/FS delay time from to SCLK falling edge
Data setup time, before SCLK rising edge
Data hold time, after SCLK rising edge
Data delay time from SCLK falling edge
20
15
ns
tSU
ns
tDH
8
ns
tDFS
ns
7.10 I2C Bus Timing – Standard
MIN
MAX
UNIT
kHz
µs
fSCL
SCL clock frequency
100
tBUF
Bus free time between a STOP and START condition
Low period of the SCL clock
4.7
tLOW
4.7
µs
tHI
High period of the SCL clock
4
4.7
µs
tRS-SU
tS-HD
tD-SU
tD-HD
tSCL-R
tSCL-R1
tSCL-F
tSDA-R
tSDA-F
tP-SU
Setup time for (repeated) START condition
Hold time for (repeated) START condition
Data setup time
µs
4
µs
250
ns
Data hold time
0
900
1000
1000
1000
1000
1000
ns
Rise time of SCL signal
20 + 0.1CB
20 + 0.1CB
20 + 0.1CB
20 + 0.1CB
20 + 0.1CB
4
ns
Rise time of SCL signal after a repeated START condition and after an acknowledge bit
Fall time of SCL signal
ns
ns
Rise time of SDA signal
ns
Fall time of SDA signal
ns
Setup time for STOP condition
µs
7.11 I2C Bus Timing – Fast
See Figure 21.
MIN
MAX
UNIT
kHz
µs
µs
ns
fSCL
SCL clock frequency
400
tBUF
Bus free time between a STOP and START condition
Low period of the SCL clock
1.3
1.3
tLOW
tHI
High period of the SCL clock
600
tRS-SU
tRS-HD
tD-SU
tD-HD
tSCL-R
tSCL-R1
tSCL-F
tSDA-R
tSDA-F
tP-SU
tSP
Setup time for (repeated)START condition
Hold time for (repeated)START condition
Data setup time
600
ns
600
ns
100
ns
Data hold time
0
900
300
300
300
300
300
ns
Rise time of SCL signal
20 + 0.1CB
20 + 0.1CB
20 + 0.1CB
20 + 0.1CB
20 + 0.1CB
600
ns
Rise time of SCL signal after a repeated START condition and after an acknowledge bit
Fall time of SCL signal
ns
ns
Rise time of SDA signal
ns
Fall time of SDA signal
ns
Setup time for STOP condition
Pulse width of spike suppressed
ns
50
ns
20
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ZHCSFY4 –DECEMBER 2016
7.12 SPK_MUTE Timing
See Figure 22.
MIN
MAX
20
UNIT
ns
tr
tf
Rise time
Fall time
20
ns
t
MCLKH
"H"
0.7 × V
DVDD
0.3 × V
DVDD
"L"
t
t
MCLKL
MCLK
Figure 18. Timing Requirements for MCLK Input
LRCK/FS
(Input)
0.5 × DVDD
0.5 × DVDD
t
t
SCLKL
SCLKH
t
LS
SCLK
(Input)
t
t
SL
SCLK
DATA
(Input)
0.5 × DVDD
0.5 × DVDD
t
t
DH
SU
t
DFS
DATA
(Output)
Figure 19. MCLK Timing Diagram in Slave Mode
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t
BCL
t
SCLK.
SCLK
(Input)
0.5 × DVDD
0.5 × DVDD
t
t
LRD
SCLK
LRCK/FS
(Input)
t
DFS
DATA
(Input)
0.5 × DVDD
t
t
DH
SU
DATA
(Output)
0.5 × DVDD
Figure 20. MCLK Timing Diagram in Master Mode
Repeated
START
START
STOP
t
t
t
t
P-SU
t
D-SU
D-HD
SDA-F
SDA-R
t
BUF.
SDA
t
t
t
SP
SCL-R.
RS-HD
t
LOW.
SCL
t
HI.
t
RS-SU
t
t
SCL-F.
S-HD.
Figure 21. I2C Communication Port Timing Diagram
0.9 × DV
0.1 × DV
DD
DD
SPK_MUTE
t
r
t
f
< 20 ns
< 20 ns
Figure 22. SPK_MUTE Timing Diagram for Soft Mute Operation via Hardware Pin
22
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7.13 Typical Characteristics
All performance plots were taken using the TAS5780MEVM Board at room temperature, unless otherwise noted.
The term "traditional LC filter" refers to the output filter that is present by default on the TAS5780MEVM Board.
Table 1. Quick Reference Table
OUTPUT
CONFIGURATIONS
PLOT TITLE
FIGURE NUMBER
Frequency Response
Figure 34
Figure 23
Figure 24
Figure 25
Figure 26
Figure 27
Figure 28
Figure 29
Figure 30
Figure 31
Figure 32
Figure 33
Figure 34
Figure 35
Figure 36
Figure 37
Figure 38
Figure 39
Figure 40
Figure 41
Figure 43
Figure 44
Figure 45
Figure 46
Figure 47
Figure 48
Figure 49
Figure 50
Figure 51
Figure 52
Figure 53
Output Power vs PVDD
THD+N vs Frequency, VPVDD = 12 V
THD+N vs Frequency, VPVDD = 15 V
THD+N vs Frequency, VPVDD = 18 V
THD+N vs Frequency, VPVDD = 24 V
THD+N vs Power, VPVDD = 12 V
THD+N vs Power, VPVDD = 15 V
THD+N vs Power, VPVDD = 18 V
THD+N vs Power, VPVDD = 24 V
Idle Channel Noise vs PVDD
Efficiency vs Output Power
Bridge Tied Load (BTL)
Configuration Curves
Efficiency vs Output Power
Efficiency vs Output Power
Idle Current Draw (Filterless) vs PVDD
Crosstalk vs. Frequency
PVDD PSRR vs Frequency
DVDD PSRR vs Frequency
AVDD PSRR vs Frequency
CPVDD PSRR vs Frequency
Output Power vs PVDD
THD+N vs Frequency, VPVDD = 12 V
THD+N vs Frequency, VPVDD = 15 V
THD+N vs Frequency, VPVDD = 18 V
THD+N vs Frequency, VPVDD = 24 V
THD+N vs Power, VPVDD = 12 V
THD+N vs Power, VPVDD = 15 V
THD+N vs Power, VPVDD = 18 V
THD+N vs Power, VPVDD = 24 V
Idle Channel Noise vs PVDD
Efficiency vs Output Power
Parallel Bridge Tied
Load (PBTL)
Configuration
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7.13.1 Bridge Tied Load (BTL) Configuration Curves
Free-air room temperature 25°C (unless otherwise noted) Measurements were made using TAS5780MEVM
board and Audio Precision System 2722 with Analog Analyzer filter set to 40-kHz brickwall filter. All
measurements taken with audio frequency set to 1 kHz and device PWM frequency set to 768 kHz, unless
otherwise noted. For both the BTL plots and the PBTL plots, the LC filter used was 4.7 µH / 0.68 µF. Return to
Quick Reference Table.
80
60
40
20
0
10
8 W Load Peak
4 W Load
6 W Load
8 W Load
6 W Load Peak
4 W Load Peak
6 W Load Continous
4 W Load Continous
1
0.1
0.01
0.001
5
10
15
20
24
20
100
1k
10k
40k
Supply Voltage (V)
Frequency (Hz)
D002
D003
AV(SPK_AMP) = 26 dBV
AV(SPK_AMP) = 20 dBV
PO = 1 W
VPVDD = 12 V
Figure 23. Output Power vs PVDD – BTL
Figure 24. THD+N vs Frequency – BTL
10
1
10
1
4 W Load
6 W Load
8 W Load
4 W Load
6 W Load
8 W Load
0.1
0.1
0.01
0.01
0.001
0.001
20
100
1k
10k
40k
20
100
1k
10k
40k
Frequency (Hz)
Frequency (Hz)
D004
D005
AV(SPK_AMP) = 20 dBV
PO = 1 W
VPVDD = 15 V
AV(SPK_AMP) = 26 dBV
PO = 1 W
VPVDD = 18 V
Figure 25. THD+N vs Frequency – BTL
Figure 26. THD+N vs Frequency – BTL
24
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ZHCSFY4 –DECEMBER 2016
10
10
1
4 W Load
6 W Load
8 W Load
4 W Load
6 W Load
8 W Load
1
0.1
0.1
0.01
0.01
0.001
20
0.001
100
1k
10k
40k
10m
100m
1
10
30
Frequency (Hz)
Output Power (W)
D006
D007
AV(SPK_AMP) = 26 dBV
PO = 1 W
VPVDD = 24 V
AV(SPK_AMP) = 20 dBV
VPVDD = 12 V
Figure 27. THD+N vs Frequency – BTL
Figure 28. THD+N vs Power – BTL
10
1
10
1
4 W Load
6 W Load
8 W Load
4 W Load
6 W Load
8 W Load
0.1
0.1
0.01
0.01
0.001
0.001
10m
100m
1
10
40
10m
100m
1
10
50
Output Power (W)
Output Power (W)
D008
D009
AV(SPK_AMP) = 20
dBV
VPVDD = 15 V
AV(SPK_AMP) = 26
dBV
VPVDD =
18 V
Figure 29. THD+N vs Power – BTL
Figure 30. THD+N vs Power – BTL
10
100
90
80
70
60
50
40
30
20
10
0
4 W Load
6 W Load
8 W Load
1
0.1
0.01
Gain = 20 dB, PWM Freq = 384 kHz
Gain = 26 dB, PWM Freq = 384 kHz
Gain = 20 dB, PWM Freq = 768 kHz
Gain = 26 dB, PWM Freq = 768 kHz
0.001
10m
100m
1
10
50
10
15
20
Output Power (W)
Supply Voltage (V)
D010
D011
AV(SPK_AMP) = 26 dBV
VPVDD = 24 V
RSPK = 4 Ω
Figure 31. THD+N vs Power – BTL
Figure 32. Idle Channel Noise vs PVDD – BTL
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100
90
80
70
60
50
40
30
20
10
0
100
90
80
70
60
50
40
30
20
10
0
PVDD = 12 V
PVDD = 15 V
PVDD = 18 V
PVDD = 24 V
PVDD = 12 V
PVDD = 15 V
PVDD = 18 V
PVDD = 24 V
0
20
40
60
80
0
20
40
60
80
Output Power (W)
Output Power (W)
D012
D013
RSPK = 4 Ω
RSPK = 6 Ω
Figure 33. Efficiency vs Output Power – BTL
Figure 34. Efficiency vs Output Power – BTL
100
90
80
70
60
50
40
30
20
10
0
60
50
40
30
20
10
0
PVDD = 12 V
PVDD = 15 V
PVDD = 18 V
PVDD = 24 V
0
20
40
60
80
5
10
15
20
25
Output Power (W)
Supply Voltage (V)
D014
D015
RSPK = 8 Ω
fSPK_AMP = 768 kHz
RSPK = 8 Ω
Figure 35. Efficiency vs Output Power – BTL
Figure 36. Idle Current Draw (Filterless) vs VPVDD – BTL
0
0
Ch 1 to Ch 2
Ch 2 to Ch 1
Left Channel
Right Channel
-20
-40
-20
-40
-60
-80
-60
-80
-100
-120
-100
20
20
100
1k
10k
40k
100
1k
10k
40k
Frequency (Hz)
Frequency
D016
D017
AV(SPK_AMP) = 26 dBV
VPVDD = 24 V
AV(SPK_AMP) = 26 dBV
VPVDD = 24 V + 250 mVac
Figure 37. Crosstalk vs Frequency – BTL
Figure 38. PVDD PSRR vs Frequency – BTL
26
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ZHCSFY4 –DECEMBER 2016
0
0
-20
Left Channel
Right Channel
Left Channel
Right Channel
-20
-40
-60
-80
-40
-60
-80
-100
20
-100
100
1k
10k
40k
20
100
1k
10k
40k
Frequency
Frequency
D018
D019
AV(SPK_AMP) = 26 dBV
VPVDD = 24 V
AV(SPK_AMP) = 26 dBV
VPVDD = 24 V
VDVDD = 3.3 V + 250 mVac
VAVDD = 3.3 V + 250 mVac
Figure 39. DVDD PSRR vs Frequency – BTL
Figure 40. AVDD PSRR vs Frequency – BTL
0
-20
28
24
20
16
12
Left Channel
Right Channel
-40
-60
-80
-100
20
100
1k
10k
40k
20
100
1k
10k
40k
Frequency
Frequency (Hz)
D020
D001
AV(SPK_AMP) = 26 dBV
VPVDD = 24 V
AV(SPK_AMP) = 20 dB
PVDD = 12 V
VCPVDD = 3.3 V + 250 mVac
Figure 41. CPVDD PSRR vs Frequency – BTL
Figure 42. Frequency Response
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7.13.2 Parallel Bridge Tied Load (PBTL) Configuration
Return to Quick Reference Table.
160
10
1
4 W Load Peak
2 W Load
3 W Load
4 W Load
3 W Load Peak
140
120
100
80
2 W Load Peak
3 W Load Continous
2 W Load Continous
0.1
60
40
0.01
20
0
0.001
5
10
15
Supply Voltage (V)
20
24
20
100
1k
10k
40k
Frequency (Hz)
D021
D022
AV(SPK_AMP) = 26 dBV
AV(SPK_AMP) = 20 dBV
PO = 1 W
VPVDD = 12 V
Figure 43. Output Power vs PVDD – PBTL
Figure 44. THD+N vs Frequency – PBTL
10
1
10
1
2 W Load
3 W Load
4 W Load
2 W Load
3 W Load
4 W Load
0.1
0.1
0.01
0.01
0.001
0.001
20
100
1k
10k
40k
20
100
1k
10k
40k
Frequency (Hz)
Frequency (Hz)
D023
D024
AV(SPK_AMP) = 20 dBV
PO = 1 W
VPVDD = 15 V
AV(SPK_AMP) = 26 dBV
PO = 1 W
VPVDD = 18 V
Figure 45. THD+N vs Frequency – PBTL
Figure 46. THD+N vs Frequency – PBTL
10
1
10
1
2 W Load
3 W Load
4 W Load
2 W Load
3 W Load
4 W Load
0.1
0.1
0.01
0.01
0.001
0.001
20
100
1k
10k
40k
10m
100m
1
10
50
Frequency (Hz)
Output Power (W)
D025
D026
AV(SPK_AMP) = 26 dBV
PO = 1 W
VPVDD = 24 V
AV(SPK_AMP) = 20 dBV
VPVDD = 12 V
Figure 47. THD+N vs Frequency – PBTL
Figure 48. THD+N vs Power – PBTL
28
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ZHCSFY4 –DECEMBER 2016
10
10
1
2 W Load
3 W Load
4 W Load
2 W Load
3 W Load
4 W Load
1
0.1
0.1
0.01
0.01
0.001
10m
0.001
100m
1
10
80
10m
100m
1
10
100
Output Power (W)
Output Power (W)
D027
D028
AV(SPK_AMP) = 20 dBV
VPVDD = 15 V
AV(SPK_AMP) = 26 dBV
VPVDD = 18 V
Figure 49. THD+N vs Power – PBTL
Figure 50. THD+N vs Power – PBTL
100
90
80
70
60
50
40
30
20
10
0
10
1
2 W Load
3 W Load
4 W Load
0.1
0.01
Gain = 20 dB, PWM Freq = 384 kHz
Gain = 26 dB, PWM Freq = 384 kHz
Gain = 20 dB, PWM Freq = 768 kHz
Gain = 26 dB, PWM Freq = 768 kHz
0.001
10m
100m
1
10
150
5
10
15
20
25
Output Power (W)
Supply Voltage (V)
D029
D030
AV(SPK_AMP) = 20 dBV
VPVDD = 24 V
RSPK = 4 Ω
Figure 51. THD+N vs Power – PBTL
Figure 52. Idle Channel Noise vs PVDD – PBTL
100
90
80
70
60
50
40
30
20
10
0
90
80
70
60
50
40
30
20
10
0
PVDD = 12 V
PVDD = 12 V
PVDD = 15 V
PVDD = 18 V
PVDD = 24 V
PVDD = 15 V
PVDD = 18 V
PVDD = 24 V
0
20
40
60
80
100
0
20
40
60
80
100
Output Power (W)
Output Power (W)
D031
D032
AV(SPK_AMP) = 26
dBV
RSPK = 2 Ω
AV(SPK_AMP) = 20
dBV
RSPK = 3 Ω
Figure 53. Efficiency vs Output Power – PBTL
Figure 54. Efficiency vs Output Power
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100
90
80
70
60
50
40
30
20
10
0
PVDD = 12 V
PVDD = 15 V
PVDD = 18 V
PVDD = 24 V
0
20
40
60
80
Output Power (W)
D033
AV(SPK_AMP) = 20 dBV
RSPK = 4 Ω
Figure 55. Efficiency vs Output Power
8 Parametric Measurement Information
PARAMETER
Stereo BTL
Mono PBTL
FIGURE
图 84
图 85
30
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ZHCSFY4 –DECEMBER 2016
9 Detailed Description
9.1 Overview
The TAS5780M device integrates 4 main building blocks together into a single cohesive device that maximizes
sound quality, flexibility, and ease of use. The 4 main building blocks are listed below:
•
•
•
A stereo audio DAC, boasting a strong Burr-Brown heritage with a highly flexible serial audio port.
A µCDSP audio processing core, with a pre-programmed ROM image.
A flexible closed-loop amplifier capable of operating in stereo or mono, at several different switching
frequencies, and with a variety of output voltages and loads.
An I2C control port for communication with the device
•
The device requires only two power supplies for proper operation. A DVDD supply is required to power the low-
voltage digital and analog circuitry. Another supply, called PVDD, is required to provide power to the output stage
of the audio amplifier. The operating range for these supplies is shown in the Recommended Operating
Conditions table.
Communication with the device is accomplished through the I2C control port. A speaker amplifier fault line is also
provided to notify a system controller of the occurrence of an overtemperature, overcurrent, overvoltage, or
undervoltage. Two digital GPIO pins are available for use. In the fixed function ROM image of the TAS5780M,
the GPIO2 pin is used as an SDOUT terminal. The other GPIO is unused.
The µCDSP audio processing core is pre-programmed with a configurable DSP program. The RD GUI provides a
means by which to manipulate the controls associated with that Process Flow.
9.2 Functional Block Diagram
Internal
Voltage
Supplies
Charge
Pump
Internal Gate
Drive Regulator
1.8-V
Regulator
Internal Voltage
Supplies
Closed Loop Class D Amplifier
Gate
SPK_OUTA+
SPK_OUTA-
SPK_OUTB+
SPK_OUTB-
Full Bridge
Power
Stage A
µCDSP
Output
Current
Monitoring
and
Analog
to
Drives
MCLK
SCLK
Fixed-
Function
ROMProcess
Flow
PWM
Modulator
Full Bridge
Power
Stage B
Gate
Drives
Protection
DAC
Serial
Audio
Port
LRCK/FS
SDIN
Clock Monitoring
and Error Protection
Die Temperature
Monitoring and Protection
Error Reporting
SDOUT
Internal Control Registers and State Machines
GPIO0 RESET GPIO2
SPK_GAIN/FREQ
SCL
SDA
ADR0
ADR1
SPK_MUTE
SPK_SD SPK_FAULT
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9.3 Feature Description
9.3.1 Power-on-Reset (POR) Function
The TAS5780M device has a power-on reset function. The power-on reset feature resets all of the registers to
their default configuration as the device is powering up. When the low-voltage power supply used to power
DVDD, AVDD, and CPVDD exceeds the POR threshold, the device sets all of the internal registers to their
default values and holds them there until the device receives valid MCLK, SCLK, and LRCK/FS toggling for a
period of approximately 4 ms. After the toggling period has passed, the internal reset of the registers is removed
and the registers can be programmed via the I2C Control Port.
9.3.2 Device Clocking
The TAS5780M devices have flexible systems for clocking. Internally, the device requires a number of clocks,
mostly at related clock rates to function correctly. All of these clocks can be derived from the Serial Audio
Interface in one form or another.
fS
(24-bit)
16 fS
(24-bit)
128 fS
(~8-bit)
Serial Audio
Interface
(Input)
µCDSP
(including
interpolator)
Delta
Sigma
Modulator
I to V
Line
Driver
Current
Segments
+
Audio
In
Audio
Out
Charge Pump
CPCK
DSPCK
OSRCK
DACCK
LRCK/FS
Figure 56. Audio Flow with Respective Clocks
Figure 56 shows the basic data flow at basic sample rate (fS). When the data is brought into the serial audio
interface, the data is processed, interpolated and modulated to 128 × fS before arriving at the current segments
for the final digital to analog conversion.
Figure 57 shows the clock tree.
32
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Feature Description (continued)
PLLEN
(P0-R4)
MCLK
SREF
Divider
(P0-R13)
DDSP (P0-R27)
SCLK
GPIO
MCLK
SDAC
(P0-R14)
PLL
K × R/P
PLLCKIN
PLLCK
K = J.D
J = 1,2,3,…..,62,63
D= 0000,0001,….,9998,9999
R= 1,2,3,4,….,15,16
DACCK (DAC Clock )
MCLK
GPIO
Divider
CPCK (Charge Pump Clock )
DNCP (P0-R29)
P= 1,2,….,127,128
DDAC
(P0-R28)
Divider
OSRCK
(Oversampling
Ratio Clock )
Divider
MUX
DOSR
(P0-R30)
Divide
by 2
I16E (P0-R34)
Figure 57. TAS5780M Clock Distribution Tree
The Serial Audio Interface typically has 4 connection pins which are listed as follows:
•
•
•
•
•
•
MCLK (System Master Clock)
SCLK (Bit Clock)
LRCK/FS (Left Right Word Clock and Frame Sync)
SDIN (Input Data)
The output data, SDOUT, is presented on one of the GPIO pins.
See the GPIO Port and Hardware Control Pins section)
The device has an internal PLL that is used to take either MCLK or SCLK and create the higher rate clocks
required by the DSP and the DAC clock.
In situations where the highest audio performance is required, bringing MCLK to the device along with SCLK and
LRCK/FS is recommended. The device should be configured so that the PLL is only providing a clock source to
the DSP. All other clocks are then a division of the incoming MCLK. To enable the MCLK as the main source
clock, with all others being created as divisions of the incoming MCLK, set the DAC CLK source Mux (SDAC in
Figure 57) to use MCLK as a source, rather than the output of the MCLK/PLL Mux.
9.3.3 Serial Audio Port
9.3.3.1 Clock Master Mode from Audio Rate Master Clock
In Master Mode, the device generates bit clock and left-right and frame sync clock and outputs them on the
appropriate pins. To configure the device in master mode, first put the device into reset, then use registers
SCLKO and LRKO (P0-R9). Then reset the LRCK/FS and SCLK divider counters using bits RSCLK and RLRK
(P0-R12). Finally, exit reset.
Figure 58 shows a simplified serial port clock tree for the device in master mode.
Copyright © 2016, Texas Instruments Incorporated
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TAS5780M
ZHCSFY4 –DECEMBER 2016
www.ti.com.cn
Feature Description (continued)
Audio Related System Clock (MCLK)
MCLK
SCLK
SCLKO (Bit Clock Output In Master Mode)
Divider
Q1 = 1...128
LRCK/FS (LR Clock or Frame Sync Output In
Master Mode
Divider
LRCK/FS
Q1 = 1...128
Figure 58. Simplified Clock Tree for MCLK Sourced Master Mode
In master mode, MCLK is an input and SCLK and LRCK/FS are outputs. SCLK and LRCK/FS are integer
divisions of MCLK. Master mode with a non-audio rate master clock source requires external GPIO’s to use the
PLL in standalone mode. The PLL should be configured to ensure that the on-chip processor can be driven at
the maximum clock rate. The master mode of operation is described in the Clock Master from a Non-Audio Rate
Master Clock section.
When used with audio rate master clocks, the register changes that should be done include switching the device
into master mode, and setting the divider ratio. An example of the master mode of operations is using 24.576
MHz MCLK as a master clock source and driving the SCLK and LRCK/FS with integer dividers to create 48 kHz
sample rate clock output. In master mode, the DAC section of the device is also running from the PLL output.
The TAS5780M device is able to meet the specified audio performance while using the internal PLL. However,
using the MCLK CMOS oscillator source will have less jitter than the PLL.
To switch the DAC clocks (SDAC in the Figure 57) the following registers should be modified
•
•
Clock Tree Flex Mode (P253-R63 and P253-R64)
DAC and OSR Source Clock Register (P0-R14). Set to 0x30 (MCLK input, and OSR is set to whatever the
DAC source is)
•
The DAC clock divider should be 16 fS.
–
–
–
16 × 48 kHz = 768 kHz
24.576 MHz (MCLK in) / 768 kHz = 32
Therefore, the divide ratio for register DDAC (P0-R28) should be set to 32. The register mapping gives
0x00 = 1, therefore 32 must be converter to 0x1F (31dec).
9.3.3.2 Clock Master from a Non-Audio Rate Master Clock
The classic example here is running a 96-kHz sampling system. Given the clock tree for the device (shown in
Figure 57), a non-audio clock rate cannot be brought into the MCLK to the PLL in master mode. Therefore, the
PLL source must be configured to be a GPIO pin, and the output brought back into another GPIO pin.
34
Copyright © 2016, Texas Instruments Incorporated
TAS5780M
www.ti.com.cn
ZHCSFY4 –DECEMBER 2016
Feature Description (continued)
Non-Audio MCLK
GPOIx
PLL
GPOIy
New
Audio
MCLK
MCLK
Master Mode
SLCK Integer
Divider
SCLK
Out
SCLK
Master Mode
LRCK/FS
Integer Divider
LRCK/FS
Out
LRCK/FS
Figure 59. Generating Audio Clocks Using Non-Audio Clock Sources
The clock flow through the system is shown in Figure 59. The newly generated MCLK must be brought out of the
device on a GPIO pin, then brought into the MCLK pin for integer division to create SCLK and LRCK/FS outputs.
NOTE
Pull-up resistors should be used on SCLK and LRCK/FS in master mode to ensure the
device remains out of sleep mode.
9.3.3.3 Clock Slave Mode with 4-Wire Operation (SCLK, MCLK, LRCK/FS, SDIN)
The TAS5780M device requires a system clock to operate the digital interpolation filters and advanced segment
DAC modulators. The system clock is applied at the MCLK input and supports up to 50 MHz. The TAS5780M
device system-clock detection circuit automatically senses the system-clock frequency. Common audio sampling
frequencies in the bands of 32 kHz, (44.1 – 48 kHz), (88.2 – 96 kHz) are supported.
NOTE
Values in the parentheses are grouped when detected, for example, 88.2 kHz and 96 kHz
are detected as double rate, 32 kHz, 44.1 kHz and 48 kHz are detected as single rate and
so on.
In the presence of a valid bit MCLK, SCLK and LRCK/FS, the device automatically configures the clock tree and
PLL to drive the µCDSP as required.
The sampling frequency detector sets the clock for the digital filter, Delta Sigma Modulator (DSM) and the
Negative Charge Pump (NCP) automatically. Table 2 shows examples of system clock frequencies for common
audio sampling rates.
MCLK rates that are not common to standard audio clocks, between 1 MHz and 50 MHz, are supported by
configuring various PLL and clock-divider registers directly. In slave mode, auto clock mode should be disabled
using P0-R37. Additionally, the user can be required to ignore clock error detection if external clocks are not
available for some time during configuration or if the clocks presented on the pins of the device are invalid. The
extended programmability allows the device to operate in an advanced mode in which the device becomes a
clock master and drive the host serial port with LRCK/FS and SCLK, from a non-audio related clock (for
example, using a setting of 12 MHz to generate 44.1 kHz [LRCK/FS] and 2.8224 MHz [SCLK]).
Copyright © 2016, Texas Instruments Incorporated
35
TAS5780M
ZHCSFY4 –DECEMBER 2016
www.ti.com.cn
Feature Description (continued)
Table 2 shows the timing requirements for the system clock input. For optimal performance, use a clock source
with low phase jitter and noise. For MCLK timing requirements, refer to the Serial Audio Port Timing – Master
Mode section.
Table 2. System Master Clock Inputs for Audio Related Clocks
SYSTEM CLOCK FREQUENCY (fMCLK) (MHz)
SAMPLING
FREQUENCY
64 fS
128 fS
1.024(2)
2.048(2)
4.096(2)
5.6488(2)
6.144(2)
11.2896(2)
12.288(2)
192 fS
1.536(2)
3.072(2)
6.144(2)
8.4672(2)
9.216(2)
16.9344
18.432
256 fS
2.048
384 fS
3.072
512 fS
4.096
8 kHz
16 kHz
32 kHz
44.1 kHz
48 kHz
88.2 kHz
96 kHz
4.096
6.144
8.192
8.192
12.288
16.9344
18.432
33.8688
36.864
16.384
22.5792
24.576
45.1584
49.152
See(1)
11.2896
12.288
22.5792
24.576
(1) This system clock rate is not supported for the given sampling frequency.
(2) This system clock rate is supported by PLL mode.
9.3.3.4 Clock Slave Mode with SCLK PLL to Generate Internal Clocks (3-Wire PCM)
9.3.3.4.1 Clock Generation using the PLL
The TAS5780M device supports a wide range of options to generate the required clocks as shown in Figure 57.
The clocks for the PLL require a source reference clock. This clock is sourced as the incoming SCLK or MCLK, a
GPIO can also be used.
The source reference clock for the PLL reference clock is selected by programming the SRCREF value on P0-
R13, D[6:4]. The TAS5780M device provides several programmable clock dividers to achieve a variety of
sampling rates. See Figure 57.
If PLL functionality is not required, set the PLLEN value on P0-R4, D[0] to 0. In this situation, an external master
clock is required.
Table 3. PLL Configuration Registers
CLOCK MULTIPLEXER
REGISTER
SREF
FUNCTION
PLL Reference
BITS
B0-P0-R13-D[6:4]
DDSP
Clock divider
B0-P0-R27-D[6:0]
B0-P0-R32-D[6:0]
B0-P0-R33-D[7:0]
DSCLK
DLRK
External SCLK Div
External LRCK/FS Div
36
Copyright © 2016, Texas Instruments Incorporated
TAS5780M
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ZHCSFY4 –DECEMBER 2016
9.3.3.4.2 PLL Calculation
The TAS5780M device has an on-chip PLL with fractional multiplication to generate the clock frequency required
by the Digital Signal Processing blocks. The programmability of the PLL allows operation from a wide variety of
clocks that may be available in the system. The PLL input (PLLCKIN) supports clock frequencies from 1 MHz to
50 MHz and is register programmable to enable generation of required sampling rates with fine precision.
The PLL is enabled by default. The PLL can be enabled by writing to P0-R4, D[0]. When the PLL is enabled, the
PLL output clock PLLCK is given by Equation 1:
PLLCKIN x R x J.D
P
PLLCKIN x R x K
P
PLLCK =
or PLLCK =
where
•
•
•
•
R = 1, 2, 3,4, ... , 15, 16
J = 4,5,6, . . . 63, and D = 0000, 0001, 0002, . . . 9999
K = [J value].[D value]
P = 1, 2, 3, ... 15
(1)
R, J, D, and P are programmable. J is the integer portion of K (the numbers to the left of the decimal point), while
D is the fractional portion of K (the numbers to the right of the decimal point, assuming four digits of precision).
9.3.3.4.2.1 Examples:
•
•
•
•
If K = 8.5, then J = 8, D = 5000
If K = 7.12, then J = 7, D = 1200
If K = 14.03, then J = 14, D = 0300
If K = 6.0004, then J = 6, D = 0004
When the PLL is enabled and D = 0000, the following conditions must be satisfied:
•
•
•
1 MHz ≤ ( PLLCKIN / P ) ≤ 20 MHz
64 MHz ≤ (PLLCKIN x K x R / P ) ≤ 100 MHz
1 ≤ J ≤ 63
When the PLL is enabled and D ≠ 0000, the following conditions must be satisfied:
•
•
•
•
6.667 MHz ≤ PLLCLKIN / P ≤ 20 MHz
64 MHz ≤ (PLLCKIN x K x R / P ) ≤ 100 MHz
4 ≤ J ≤ 11
R = 1
When the PLL is enabled,
•
•
fS = (PLLCLKIN × K × R) / (2048 × P)
The value of N is selected so that fS × N = PLLCLKIN x K x R / P is in the allowable range.
Example: MCLK = 12 MHz and fS = 44.1 kHz, (N=2048)
Select P = 1, R = 1, K = 7.5264, which results in J = 7, D = 5264
Example: MCLK = 12 MHz and fS = 48.0 kHz, (N=2048)
Select P = 1, R = 1, K = 8.192, which results in J = 8, D = 1920
Values are written to the registers in Table 4.
Table 4. PLL Registers
DIVIDER
PLLE
FUNCTION
PLL enable
PLL P
BITS
P0-R4, D[0]
PPDV
PJDV
P0-R20, D[3:0]
P0-R21, D[5:0]
P0-R22, D[5:0]
P0-R23, D[7:0]
P0-R24, D[3:0]
PLL J
PDDV
PRDV
PLL D
PLL R
Copyright © 2016, Texas Instruments Incorporated
37
TAS5780M
ZHCSFY4 –DECEMBER 2016
www.ti.com.cn
Table 5. PLL Configuration Recommendations
EQUATIONS
fS (kHz)
DESCRIPTION
Sampling frequency
RMCLK
Ratio between sampling frequency and MCLK frequency (MCLK frequency = RMCLK x sampling frequency)
System master clock frequency at MCLK input (pin 20)
MCLK (MHz)
PLL VCO (MHz) PLL VCO frequency as PLLCK in Figure 57
One of the PLL coefficients in Equation 1
PLL REF (MHz) Internal reference clock frequency which is produced by MCLK / P
P
M = K × R
K = J.D
R
The final PLL multiplication factor computed from K and R as described in Equation 1
One of the PLL coefficients in Equation 1
One of the PLL coefficients in Equation 1
PLL fS
DSP fS
NMAC
Ratio between fS and PLL VCO frequency (PLL VCO / fS)
Ratio between operating clock rate and fS (PLL fS / NMAC)
The clock divider value in Table 3
DSP CLK (MHz) The operating frequency as DSPCK in Figure 57
MOD fS
Ratio between DAC operating clock frequency and fS (PLL fS / NDAC)
MOD f (kHz)
NDAC
DAC operating frequency as DACCK in
DAC clock divider value in Table 3
OSR clock divider value in Table 3 for generating OSRCK in Figure 57. DOSR must be chosen so that MOD fS / DOSR =
16 for correct operation.
DOSR
NCP
CP f
NCP (negative charge pump) clock divider value in Table 3
Negative charge pump clock frequency (fS × MOD fS / NCP)
Percentage of error between PLL VCO / PLL fS and fS (mismatch error).
% Error
•
•
This value is typically zero but can be non-zero especially when K is not an integer (D is not zero).
This value can be non-zero only when the TAS5780M device acts as a master.
The previous equations explain how to calculate all necessary coefficients and controls to configure the PLL.
Table 6 provides for easy reference to the recommended clock divider settings for the PLL as a Master Clock.
38
Copyright © 2016, Texas Instruments Incorporated
TAS5780M
www.ti.com.cn
ZHCSFY4 –DECEMBER 2016
Table 6. Recommended Clock Divider Settings for PLL as Master Clock
fS
MCLK
(MHz)
PLL VCO
(MHz)
PLL REF
(MHz)
DSP CLK
(MHz)
MOD f
(kHz)
CP f
(kHz)
RMCLK
(kHz)
P
M = K×R
K = J×D
R
PLL fS
DSP fS
NMAC
MOD fS
NDAC
DOSR
% ERROR
NCP
128
192
256
384
512
1.024
1.536
98.304
98.304
98.304
98.304
98.304
98.304
98.304
98.304
98.304
98.304
98.304
90.3168
90.3168
90.3168
90.3168
90.3168
90.3168
90.3168
90.3168
90.3168
90.3168
90.3168
98.304
98.304
98.304
98.304
98.304
98.304
98.304
98.304
98.304
98.304
98.304
98.304
1
1
1
3
3
3
3
9
9
9
9
1
3
1
3
3
3
3
9
9
9
9
1
1
1
1
3
3
3
3
3
9
9
9
1.024
1.536
2.048
1.024
1.365
2.048
2.731
1.024
1.365
1.82
96
64
48
96
72
48
36
96
72
54
36
64
128
32
64
48
32
24
64
48
36
24
96
48
32
24
48
36
24
18
16
36
27
18
48
32
48
48
36
48
36
48
36
54
36
32
32
32
32
48
32
24
32
48
36
24
48
48
32
24
48
36
24
18
16
36
27
18
2
2
1
2
2
1
1
2
2
1
1
2
4
1
2
1
1
1
2
1
1
1
2
1
1
1
1
1
1
1
1
1
1
1
12288
12288
12288
12288
12288
12288
12288
12288
12288
12288
12288
8192
8192
8192
8192
8192
8192
8192
8192
8192
8192
8192
6144
6144
6144
6144
6144
6144
6144
6144
6144
6144
6144
6144
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
12
12
12
12
12
12
12
12
12
12
12
8
8.192
8.192
768
768
768
768
768
768
768
768
768
768
768
512
512
512
512
512
512
512
512
512
512
512
384
384
384
384
384
384
384
384
384
384
384
384
6144
6144
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
48
48
48
48
48
48
48
48
48
48
48
32
32
32
32
32
32
32
32
32
32
32
24
24
24
24
24
24
24
24
24
24
24
24
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
1536
1536
2.048
8.192
6144
1536
3.072
8.192
6144
1536
4.096
8.192
6144
1536
8
768
1024
1152
1536
2048
3072
128
6.144
8.192
6144
1536
8.192
8.192
6144
1536
9.216
8.192
6144
1536
12.288
16.384
24.576
1.4112
2.1168
2.8224
4.2336
5.6448
8.4672
11.2896
12.7008
16.9344
22.5792
33.8688
1.024
8.192
6144
1536
8.192
6144
1536
2.731
1.411
0.706
2.822
1.411
1.882
2.822
3.763
1.411
1.882
2.509
3.763
1.024
2.048
3.072
4.096
2.048
2.731
4.096
5.461
6.144
2.731
3.641
5.461
8.192
6144
1536
11.2896
11.2896
11.2896
11.2896
11.2896
11.2896
11.2896
11.2896
11.2896
11.2896
11.2896
16.384
16.384
16.384
16.384
16.384
16.384
16.384
16.384
16.384
16.384
16.384
16.384
5644.8
5644.8
5644.8
5644.8
5644.8
5644.8
5644.8
5644.8
5644.8
5644.8
5644.8
6144
1411.2
1411.2
1411.2
1411.2
1411.2
1411.2
1411.2
1411.2
1411.2
1411.2
1411.2
1536
192
8
256
8
384
8
512
8
11.025
768
8
1024
1152
1536
2048
3072
64
8
8
8
8
8
6
128
2.048
6
6144
1536
192
3.072
6
6144
1536
256
4.096
6
6144
1536
384
6.144
6
6144
1536
512
8.192
6
6144
1536
16
768
12.288
16.384
18.432
24.576
32.768
49.152
6
6144
1536
1024
1152
1536
2048
3072
6
6144
1536
6
6144
1536
6
6144
1536
6
6144
1536
6
6144
1536
Copyright © 2016, Texas Instruments Incorporated
39
TAS5780M
ZHCSFY4 –DECEMBER 2016
www.ti.com.cn
Table 6. Recommended Clock Divider Settings for PLL as Master Clock (continued)
fS
(kHz)
MCLK
(MHz)
PLL VCO
(MHz)
PLL REF
(MHz)
DSP CLK
(MHz)
MOD f
(kHz)
CP f
RMCLK
P
M = K×R
K = J×D
R
PLL fS
DSP fS
NMAC
MOD fS
NDAC
DOSR
% ERROR
NCP
(kHz)
1411.2
1411.2
1411.2
1411.2
1411.2
1411.2
1411.2
1411.2
1411.2
1411.2
1411.2
1536
64
128
192
256
384
512
768
1024
1152
1536
2048
32
1.4112
2.8224
4.2336
5.6448
8.4672
11.2896
16.9344
22.5792
25.4016
33.8688
45.1584
1.024
90.3168
90.3168
90.3168
90.3168
90.3168
90.3168
90.3168
90.3168
90.3168
90.3168
90.3168
98.304
1
1
3
1
3
3
3
3
9
9
9
1
1
1
1
3
2
3
3
3
3
9
6
1
1
1
3
2
3
3
3
3
1.411
2.822
1.411
5.645
2.822
3.763
5.645
7.526
2.822
3.763
5.018
1.024
1.536
2.048
4.096
2.048
4.096
4.096
5.461
8.192
10.923
4.096
8.192
1.411
2.822
5.645
2.822
5.645
5.645
7.526
11.29
15.053
64
32
64
16
32
24
16
12
32
24
18
96
64
48
24
48
24
24
18
12
9
32
32
32
16
32
24
16
12
32
24
18
48
16
24
24
48
24
24
18
12
9
2
1
2
1
1
1
1
1
1
1
1
2
4
2
1
1
1
1
1
1
1
1
1
2
2
1
1
1
1
1
1
1
4096
4096
4096
4096
4096
4096
4096
4096
4096
4096
4096
3072
3072
3072
3072
3072
3072
3072
3072
3072
3072
3072
3072
2048
2048
2048
2048
2048
2048
2048
2048
2048
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
4
4
4
4
4
4
4
4
4
4
4
3
3
3
3
3
3
3
3
3
3
3
3
2
2
2
2
2
2
2
2
2
22.5792
22.5792
22.5792
22.5792
22.5792
22.5792
22.5792
22.5792
22.5792
22.5792
22.5792
32.768
256
256
256
256
256
256
256
256
256
256
256
192
192
192
192
192
192
192
192
192
192
192
192
128
128
128
128
128
128
128
128
128
5644.8
5644.8
5644.8
5644.8
5644.8
5644.8
5644.8
5644.8
5644.8
5644.8
5644.8
6144
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
12
12
12
12
12
12
12
12
12
12
12
12
8
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
22.05
48
1.536
98.304
32.768
6144
1536
64
2.048
98.304
32.768
6144
1536
128
192
256
384
512
768
1024
1152
1536
32
4.096
98.304
32.768
6144
1536
6.144
98.304
32.768
6144
1536
8.192
98.304
32.768
6144
1536
32
12.288
16.384
24.576
32.768
36.864
49.152
1.4112
2.8224
5.6448
8.4672
11.2896
16.9344
22.5792
33.8688
45.1584
98.304
32.768
6144
1536
98.304
32.768
6144
1536
98.304
32.768
6144
1536
98.304
32.768
6144
1536
98.304
24
12
64
32
16
32
16
16
12
8
24
12
32
16
16
32
16
16
12
8
32.768
6144
1536
98.304
32.768
6144
1536
90.3168
90.3168
90.3168
90.3168
90.3168
90.3168
90.3168
90.3168
90.3168
45.1584
45.1584
45.1584
45.1584
45.1584
45.1584
45.1584
45.1584
45.1584
5644.8
5644.8
5644.8
5644.8
5644.8
5644.8
5644.8
5644.8
5644.8
1411.2
1411.2
1411.2
1411.2
1411.2
1411.2
1411.2
1411.2
1411.2
64
8
128
192
256
384
512
768
1024
8
8
44.1
8
8
8
8
6
6
8
40
Copyright © 2016, Texas Instruments Incorporated
TAS5780M
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ZHCSFY4 –DECEMBER 2016
Table 6. Recommended Clock Divider Settings for PLL as Master Clock (continued)
fS
MCLK
(MHz)
PLL VCO
(MHz)
PLL REF
(MHz)
DSP CLK
(MHz)
MOD f
(kHz)
CP f
RMCLK
(kHz)
P
M = K×R
K = J×D
R
PLL fS
DSP fS
NMAC
MOD fS
NDAC
DOSR
% ERROR
NCP
(kHz)
1536
1536
1536
1536
1536
1536
1536
1536
1536
1536
1536
1536
1536
1536
1536
1536
1536
32
64
1.536
3.072
98.304
98.304
98.304
98.304
98.304
98.304
98.304
98.304
98.304
98.304
98.304
98.304
98.304
98.304
98.304
98.304
98.304
1
1
1
3
2
3
3
3
3
1
3
1
2
3
4
6
8
1.536
3.072
6.144
3.072
6.144
6.144
8.192
12.288
16.384
3.072
1.536
6.144
6.144
6.144
6.144
6.144
6.144
64
32
16
32
16
16
12
8
32
16
16
32
16
16
12
8
2
2
1
1
1
1
1
1
1
2
2
2
1
1
1
1
1
2048
2048
2048
2048
2048
2048
2048
2048
2048
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
512
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
49.152
49.152
49.152
49.152
49.152
49.152
49.152
49.152
49.152
49.152
49.152
49.152
49.152
49.152
49.152
49.152
49.152
128
128
128
128
128
128
128
128
128
64
6144
6144
6144
6144
6144
6144
6144
6144
6144
6144
6144
6144
6144
6144
6144
6144
6144
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
8
8
8
8
8
8
8
8
8
4
4
4
4
4
4
4
4
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
128
192
6.144
9.216
48
256
384
512
768
1024
32
12.288
18.432
24.576
36.864
49.152
3.072
6
6
32
64
16
16
16
16
16
16
16
32
8
48
4.608
512
64
64
6.144
512
64
128
192
256
384
512
12.288
18.432
24.576
36.864
49.152
16
16
16
16
16
512
64
96
512
64
512
64
512
64
512
64
Copyright © 2016, Texas Instruments Incorporated
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9.3.3.5 Serial Audio Port – Data Formats and Bit Depths
The serial audio interface port is a 3-wire serial port with the signals LRCK/FS (pin 25), SCLK (pin 23), and SDIN
(pin 24). SCLK is the serial audio bit clock, used to clock the serial data present on SDIN into the serial shift
register of the audio interface. Serial data is clocked into the TAS5780M device on the rising edge of SCLK. The
LRCK/FS pin is the serial audio left/right word clock or frame sync when the device is operated in TDM Mode.
Table 7. TAS5780M Audio Data Formats, Bit Depths and Clock Rates
MAXIMUM LRCK/FS
FREQUENCY (kHz)
FORMAT
DATA BITS
MCLK RATE (fS)
SCLK RATE (fS)
I2S/LJ/RJ
32, 24, 20, 16
Up to 96
128 to 3072 (≤ 50 MHz)
128 to 3072
64, 48, 32
125, 256
125, 256
Up to 48
TDM
32, 24, 20, 16
96
128 to 512
The TAS5780M device requires the synchronization of LRCK/FS and system clock, but does not require a
specific phase relation between LRCK/FS and system clock.
If the relationship between LRCK/FS and system clock changes more than ±5 MCLK, internal operation is
initialized within one sample period and analog outputs are forced to the bipolar zero level until re-
synchronization between LRCK/FS and system clock is completed.
If the relationship between LRCK/FS and SCLK are invalid more than 4 LRCK/FS periods, internal operation is
initialized within one sample period and analog outputs are forced to the bipolar zero level until re-
synchronization between LRCK/FS and SCLK is completed.
9.3.3.5.1 Data Formats and Master/Slave Modes of Operation
The TAS5780M device supports industry-standard audio data formats, including standard I2S and left-justified.
Data formats are selected via Register (P0-R40). All formats require binary two's complement, MSB-first audio
data; up to 32-bit audio data is accepted. The data formats are detailed in Figure 60 through Figure 65.
The TAS5780M device also supports right-justified, and TDM data. I2S, LJ, RJ, and TDM are selected using
Register (P0-R40). All formats require binary 2s complement, MSB-first audio data. Up to 32 bits are accepted.
Default setting is I2S and 24 bit word length. The I2S slave timing is shown in Figure 20.
shows a detailed timing diagram for the serial audio interface.
In addition to acting as a I2S slave, the TAS5780M device can act as an I2S master, by generating SCLK and
LRCK/FS as outputs from the MCLK input. Table 8 lists the registers used to place the device into Master or
Slave mode. Please refer to the Serial Audio Port Timing – Master Mode section for serial audio Interface timing
requirements in Master Mode. For Slave Mode timing, please refer to the Serial Audio Port Timing – Slave Mode
section.
Table 8. I2S Master Mode Registers
REGISTER
FUNCTION
P0-R9-B0, B4, and B5
P0-R32-D[6:0]
I2S Master mode select
SCLK divider and LRCK/FS divider
P0-R33-D[7:0]
42
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ZHCSFY4 –DECEMBER 2016
1 tS .
Right-channel
Left-channel
LRCK/FS
SLCK
…
…
…
…
…
…
…
Audio data word = 16-bit, SLCK = 32, 48, 64fS
…
1
2
15 16
1
1
2
15 16
DATA
LSB
LSB
MSB
MSB
Audio data word = 24-bit, SLCK = 48, 64fS
…
…
2
1
2
24
2
23 24
DATA
LSB
LSB
MSB
MSB
Audio data word = 32-bit, SLCK = 64fS
…
…
1
2
31 32
1
2
31 32
DATA
MSB
LSB
MSB
LSB
Figure 60. Left Justified Audio Data Format
1 tS .
LRCK/FS
SLCK
Left-channel
Right-channel
…
…
…
…
…
…
Audio data word = 16-bit, SLCK = 32, 48, 64fS
…
…
1
2
15 16
1
1
2
15 16
DATA
LSB
LSB
MSB
MSB
Audio data word = 24-bit, SLCK = 48, 64fS
…
…
2
2
23 24
1
23 24
DATA
LSB
MSB
LSB
MSB
Audio data word = 32-bit, SLCK = 64fS
…
…
1
2
31 32
1
2
31 32
DATA
MSB
LSB
MSB
LSB
I2S Data Format; L-channel = LOW, R-channel = HIGH
Figure 61. I2S Audio Data Format
Copyright © 2016, Texas Instruments Incorporated
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TAS5780M
ZHCSFY4 –DECEMBER 2016
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The following data formats are only available in software mode.
1 /fS .
Right-channel
Left-channel
LRCK/FS
SLCK
…
…
…
…
…
…
Audio data word = 16-bit, SLCK = 32, 48, 64fS
DATA
…
…
1
2
15 16
1
2
15 16
LSB
LSB
MSB
MSB
Audio data word = 24-bit, SLCK = 48, 64fS
…
…
2
1
2
24
1
2
23 24
DATA
MSB
LSB
MSB
LSB
Audio data word = 32-bit, SLCK = 64fS
…
…
1
2
31 32
1
2
31 32
DATA
MSB
LSB
MSB
LSB
Right Justified Data Format; L-channel = HIGH, R-channel = LOW
Figure 62. Right Justified Audio Data Format
1 /fS .
LRCK/FS
SLCK
…
…
…
…
…
…
Audio data word = 16-bit, Offset = 0
…
1
2
15 16
1
2
15 16
1
1
1
DATA
Data Slot 1
Data Slot 2
LSB
MSB
LSB
MSB
Audio data word = 24-bit, Offset = 0
-
,
…
…
1
2
23 24
1
2
23 24
LSB
DATA
Data Slot 1
LSB
MSB
MSB
Audio data word = 32-bit, Offset = 0
…
…
1
2
31 32
LSB
1
2
31 32
LSB
DATA
MSB
TDM Data Format with OFFSET = 0
In TDM Modes, Duty Cycle of LRCK/FS should be 1x SCLK at minimum. Rising edge is considered frame start.
Figure 63. TDM 1 Audio Data Format
44
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ZHCSFY4 –DECEMBER 2016
1 /fS .
OFFSET = 1
LRCK/FS
SLCK
…
…
…
…
…
Audio data word = 16-bit, Offset = 1
…
…
1
2
15 16
1
2
15 16
1
1
1
DATA
Data Slot 1
LSB
Data Slot 2
LSB
MSB
MSB
Audio data word = 24-bit, Offset = 1
…
…
1
2
23 24
1
2
23 24
LSB
DATA
Data Slot 1
Data Slot 2
LSB
MSB
MSB
Audio data word = 32-bit, Offset = 1
…
…
1
2
31 32
LSB
1
2
31 32
DATA
Data Slot 1
Data Slot 2
LSB
MSB
TDM Data Format with OFFSET = 1
In TDM Modes, Duty Cycle of LRCK/FS should be 1x SCLK at minimum. Rising edge is considered frame start.
Figure 64. TDM 2 Audio Data Format
1 /fS .
OFFSET = n
LRCK/FS
SLCK
…
…
…
…
…
Audio data word = 16-bit, Offset = n
…
…
1
2
15 16
1
2
15 16
DATA
Data Slot 1
LSB
Data Slot 2
LSB
MSB
MSB
Audio data word = 24-bit, Offset = n
…
…
1
2
23 24
1
2
23 24
LSB
DATA
Data Slot 1
Data Slot 2
LSB
MSB
MSB
Audio data word = 32-bit, Offset = n
…
…
1
2
31 32
LSB
1
2
31 32
LSB
DATA
Data Slot 1
Data Slot 2
MSB
TDM Data Format with OFFSET = N
In TDM Modes, Duty Cycle of LRCK/FS should be 1x SCLK at minimum. Rising edge is considered frame start.
Figure 65. TDM 3 Audio Data Format
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9.3.3.6 Input Signal Sensing (Power-Save Mode)
The TAS5780M device has a zero-detect function. The zero-detect function can be applied to both channels of
data as an AND function or an OR function, via controls provided in the control port in P0-R65-D[2:1].Continuous
Zero data cycles are counted by LRCK/FS, and the threshold of decision for analog mute can be set by P0-R59,
D[6:4] for the data which is clocked in on the left frame of an I2S signal or Slot 1 of a TDM signal and P0-R59,
D[2:0] for the data which is clocked in on the right frame of an I2S signal or Slot 2 of a TDM signal as shown in
Table 10. Default values are 0 for both channels.
In Hardware mode, the device uses default values.
Table 9. Zero Detection Mode
ATMUTECTL
VALUE
FUNCTION
Zero data triggers for the two channels for zero detection are
ORed together.
0
Bit : 2
Zero data triggers for the two channels for zero detection are
ANDed together.
1 (Default)
0
Zero detection and analog mute are disabled for the data
clocked in on the right frame of an I2S signal or Slot 2 of a
TDM signal.
Bit : 1
Bit : 0
Zero detection analog mute are enabled for the data clocked in
on the right frame of an I2S signal or Slot 2 of a TDM signal.
1 (Default)
0
Zero detection analog mute are disabled for the data clocked
in on the left frame of an I2S signal or Slot 1 of a TDM signal.
Zero detection analog mute are enabled for the data clocked in
on the left frame of an I2S signal or Slot 1 of a TDM signal.
1 (Default)
Table 10. Zero Data Detection Time
ATMUTETIML OR ATMA
NUMBER OF LRCK/FS CYCLES
TIME at 48 kHz
21 ms
0 0 0
0 0 1
0 1 0
0 1 1
1 0 0
1 0 1
1 1 0
1 1 1
1024
5120
106 ms
10240
25600
51200
102400
256000
512000
213 ms
533 ms
1.066 secs
2.133 secs
5.333 secs
10.66 secs
9.3.4 Enable Device
To play audio after the device is powered up or reset the device must be enabled by writing book 0x00, page
0x00, register 0x02 to 0x00.
9.3.4.1 Example
The following is a sample script for enabling the device:
#Enable DUT
w 90 00 00 #Go to page 0
w 90 7f 00 #Go to book 0
w 90 02 00 #Enable device
46
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ZHCSFY4 –DECEMBER 2016
9.3.5 Volume Control
9.3.5.1 DAC Digital Gain Control
A basic DAC digital gain control with range between 24 dB and –103 dB and mute is available on each channels
by P0-R61-D[7:0] for SPK_OUTB± and P0-R62-D[7:0] for SPK_OUTA±. These volume controls all have 0.5 dB
step programmability over most gain and attenuation ranges. Table 11 lists the detailed gain versus programmed
setting for the basic volume control. Volume can be changed for both SPK_OUTB± and SPK_OUTA± at the
same time or independently by P0-R61-D[1:0] . When D[1:0] set 00 (default), independent control is selected.
When D[1:0] set 01, SPK_OUTA± accords with SPK_OUTB± volume. When D[1:0] set 10, SPK_OUTA± volume
controls the volume for both channels. To set D[1:0] to 11 is prohibited.
Table 11. DAC Digital Gain Control Settings
GAIN
SETTING
GAIN
(dB)
BINARY DATA
COMMENTS
0
1
0000-0000
0000-0001
24.0
23.5
Positive maximum
.
.
.
.
.
.
.
.
.
46
47
48
49
50
51
0010-1110
0010-1111
0011-0000
0011-0001
0011-0010
0011-0011
1.0
0.5
0.0
No attenuation (default)
–0.5
–1.0
–1.5
.
.
.
.
.
.
.
.
.
253
254
255
1111-1101
1111-1110
1111-1111
–102.5
–103
Negative maximum
–
Negative infinite (Mute)
Ramp-up frequency and ramp-down frequency can be controlled by P0-R63, D[7:6] and D[3:2] as shown in
Table 12. Also ramp-up step and ramp-down step can be controlled by P0-R63, D[5:4] and D[1:0] as shown in
Table 13.
Table 12. Ramp Up or Down Frequency
RAMP UP
SPEED
RAMP DOWN
FREQUENCY
EVERY N fS
COMMENTS
EVERY N fS
COMMENTS
00
01
10
11
1
Default
00
01
10
11
1
Default
2
2
4
4
Direct change
Direct change
Table 13. Ramp Up or Down Step
RAMP UP
STEP
RAMP DOWN
COMMENTS
STEP dB
STEP dB
COMMENTS
STEP
00
01
10
11
4.0
2.0
1.0
0.5
00
01
–4.0
–2.0
–1.0
–0.5
Default
10
11
Default
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9.3.5.1.1 Emergency Volume Ramp Down
Emergency ramp down of the volume is provided for situations such as I2S clock error and power supply failure.
Ramp-down speed is controlled by P0-R64-D[7:6]. Ramp-down step can be controlled by P0-R64-D[5:4]. Default
is ramp-down by every fS cycle with –4dB step.
9.3.6 Adjustable Amplifier Gain and Switching Frequency Selection
The voltage divider between the GVDD_REG pin and the SPK_GAIN/FREQ pin is used to set the gain and
switching frequency of the amplifier. Upon start-up of the device, the voltage presented on the SPK_GAIN/FREQ
pin is digitized and then decoded into a 3-bit word which is interpreted inside the TAS5780M device to
correspond to a given gain and switching frequency. In order to change the SPK_GAIN or switching frequency of
the amplifier, the PVDD must be cycled off and on while the new voltage level is present on the
SPK_GAIN/FREQ pin.
Because the amplifier adds gain to both the signal and the noise present in the audio signal, the lowest gain
setting that can meet voltage-limited output power targets should be used. Using the lowest gain setting ensures
that the power target can be reached while minimizing the idle channel noise of the system. The switching
frequency selection affects three important operating characteristics of the device. The three affected
characteristics are the power dissipation in the device, the power dissipation in the inductor, and the target output
filter for the application.
Higher switching frequencies typically result in slightly higher power dissipation in the TAS5780M device and
lower dissipation in the inductor in the system, due to decreased ripple current through the inductor and
increased charging and discharging current in device and parasitic capacitances. Switching at the higher of the
available switching frequencies will result in lower overall dissipation in the system and lower operating
temperature of the inductors. However, the thermally limited power output of the device can be decreased in this
situation, because some of the TAS5780M device thermal headroom will be absorbed by the higher switching
frequency. Conversely inductor heating can be reduced by using the higher switching frequency to reduce the
ripple current.
Another advantage of increasing the switching frequency is that the higher frequency carrier signal can be filtered
by an L-C filter with a higher corner frequency, leading to physically smaller components. Use the highest
switching frequency that continues to meet the thermally limited power targets for the application. If thermal
constraints require heat reduction in the TAS5780M device, use a lower switching rate.
The switching frequency of the speaker amplifier is dependent on an internal synchronizing signal, (fSYNC), which
is synchronous with the sample rate. The rate of the synchronizing signal is also dependent on the sample rate.
Refer to Table 14 below for details regarding how the sample rates correlate to the synchronizing signal.
Table 14. Sample Rates vs Synchronization Signal
SAMPLE RATE
[kHz]
fSYNC
[kHz]
8
16
32
96
48
96
192
11.025
22.05
44.1
88.2
88.2
Table 15 summarizes the de-code of the voltage presented to the SPK_GAIN/FREQ pin. The voltage presented
to the SPK_GAIN/FREQ pin is latched in upon startup of the device. Subsequent changes require power cycling
the device. A gain setting of 20 dB is recommended for nominal supply voltages of 13 V and lower, while a gain
of 26 dB is recommended for supply voltages up to 26.4 V. Table 15 shows the voltage required at the
SPK_GAIN/FREQ pin for various gain and switching scenarios as well some example resistor values for meeting
the voltage range requirements.
48
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ZHCSFY4 –DECEMBER 2016
Table 15. Amplifier Switching Mode vs. SPK_GAIN/FREQ Voltage
VSPK_GAIN/FREQ (V)
RESISTOR EXAMPLES
AMPLIFIER
SWITCHING
FREQUENCY MODE
R100 (kΩ): RESISTOR TO
GROUND
R101 (kΩ): RESISTOR TO
GVDD_REG
GAIN MODE
MIN
MAX
6.61
5.44
7
Reserved
Reserved
Reserved
8 × fSYNC
R100 = 750
R101 = 150
6.6
R100 = 390
R101 = 150
4.67
3.89
3.11
2.33
1.56
0.78
0
5.43
4.66
3.88
3.1
6 × fSYNC
5 × fSYNC
4 × fSYNC
8 × fSYNC
6 × fSYNC
5 × fSYNC
4 × fSYNC
26 dBV
R100 = 220
R101 = 150
R100 = 150
R101 = 150
R100 = 100
R101 = 150
R100 = 56
R101 = 150
2.32
1.55
0.77
20 dBV
R100 = 33
R101 = 150
R100 = 8.2
R101 = 150
9.3.7 Error Handling and Protection Suite
9.3.7.1 Device Overtemperature Protection
The TAS5780M device continuously monitors die temperature to ensure the temperature does not exceed the
OTETHRES level specified in the Recommended Operating Conditions table. If an OTE event occurs, the
SPK_FAULT line is pulled low and the SPK_OUTxx outputs transition to high impedance, signifying a fault. This
is a non-latched error and the device will attempt to self clear after OTECLRTIME has passed.
9.3.7.2 SPK_OUTxx Overcurrent Protection
The TAS5780M device continuously monitors the output current of each amplifier output to ensure the output
current does not exceed the OCETHRES level specified in the Recommended Operating Conditions table. If an
OCE event occurs, the SPK_FAULT line is pulled low and the SPK_OUTxx outputs transition to high impedance,
signifying a fault. This is a non-latched error and the device will attempt to self clear after OCECLRTIME has
passed.
9.3.7.3 Internal VAVDD Undervoltage-Error Protection
The TAS5780M device internally monitors the AVDD net to protect against the AVDD supply dropping
unexpectedly. To enable this feature, P1-R5-B0 is used.
9.3.7.4 Internal VPVDD Undervoltage-Error Protection
If the voltage presented on the PVDD supply drops below the UVETHRES(PVDD) value listed in the Recommended
Operating Conditions table, the SPK_OUTxx outputs transition to high impedance. This is a self-clearing error,
which means that once the PVDD level drops below the level listed in the Recommended Operating Conditions
table, the device resumes normal operation.
9.3.7.5 Internal VPVDD Overvoltage-Error Protection
If the voltage presented on the PVDD supply exceeds the OVETHRES(PVDD) value listed in the Recommended
Operating Conditions table, the SPK_OUTxx outputs will transition to high impedance. This is a self-clearing
error, which means that once the PVDD level drops below the level listed in the Recommended Operating
Conditions table, the device will resume normal operation.
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NOTE
The voltage presented on the PVDD supply only protects up to the level described in the
Recommended Operating Conditions table for the PVDD voltage. Exceeding the absolute
maximum rating may cause damage and possible device failure, because the levels
exceed that which can be protected by the OVE protection circuit.
9.3.7.6 External Undervoltage-Error Protection
The SPK_MUTE pin can also be used to monitor a system voltage, such as a LCD TV backlight, a battery pack
in portable device, by using a voltage divider created with two resistors (see Figure 66).
•
If the SPK_MUTE pin makes a transition from 1 to 0 over 6 ms or more, the device switches into external
undervoltage protection mode, which uses two trigger levels.
•
•
When the SPK_MUTE pin level reaches 2 V, soft mute process begins.
When the SPK_MUTE pin level reaches 1.2 V, analog output mute engages, regardless of digital audio level,
and analog output shutdown begins.
Figure 67 shows a timing diagram for external undervoltage error protection.
NOTE
The SPK_MUTE input pin voltage range is provided in the Recommended Operating
Conditions table. The ratio of external resistors must produce a voltage within the provided
input range. Any increase in power supply (such as power supply positive noise or ripple)
can pull the SPK_MUTE pin higher than the level specified in the Recommended
Operating Conditions table, potentially causing damage to or failure of the device.
Therefore, any monitored voltage (including all ripple, power supply variation, resistor
divider variation, transient spikes, and others) must be scaled by the resistor divider
network to never drive the voltage on the SPK_MUTE pin higher than the maximum level
specified in the Recommended Operating Conditions table.
When the divider is set correctly, any DC voltage can be monitored. Figure 66 shows a 12-V example of how the
SPK_MUTE is used for external undervoltage error protection.
VDD
12 V
7.25 kΩ
SPK_MUTE
2.75 kΩ
Figure 66. SPK_MUTE Used in External Undervoltage Error Protection
50
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Digital attenuation followed by analog mute
Analog mute
SPK_MUTE
0.9 × DV
DD
2.0 V
1.2 V
0.1 × DV
DD
t
f
Figure 67. SPK_MUTE Timing for External Undervoltage Error Protection
9.3.7.7 Internal Clock Error Notification (CLKE)
When a clock error is detected on the incoming data clock, the TAS5780M device switches to an internal
oscillator and continues to the drive the DAC, while attenuating the data from the last known value. Once this
process is complete, the DAC outputs will be hard muted to the ground and the class D PWM output will stop
switching. The clock error can be monitored at B0-P0-R94 and R95. The clock error status bits are non-latching,
except for MCLK halted B0-P0-R95-D[4] and CERF B0-P0-R95-D[0] which are cleared when read.
9.3.8 GPIO Port and Hardware Control Pins
Internal Data
(P0-R82)
GPIOx Output Enable
P0-R8
GPIOx Output Inversion
P0-R87
GPIOx Output Selection
P0-R82
Off (low)
DSP GPIOx output
Register GPIOx output (P0-R86)
Auto mute flag (Both A and B)
Auto mute flag (Channel B)
Auto mute flag (Channel A)
Clock invalid flag
Mux
GPIOx
Mux
Serial Audio Data Output
Analog mute flag for B
Analog mute flag for A
PLL lock flag
Charge Pump Clock
Under voltage flag 1
Under voltage flag 2
PLL output/4
GPIOx Input State
Monitoring
(P0-R119)
To µCDSP
To Clock Tree
Figure 68. GPIO Port
9.3.9 I2C Communication Port
The TAS5780M device supports the I2C serial bus and the data transmission protocol for standard and fast mode
as a slave device. Because the TAS5780M register map spans several books and pages, the user must select
the correct book and page before writing individual register bits or bytes. Changing from book to book is
accomplished by first changing to page 0x00 by writing 0x00 to register 0x00 and then writing the book number
to register 0x7f of page 0. Changing from page to page is accomplished via register 0x00 on each page. The
register value selects the register page, from 0 to 255.
9.3.9.1 Slave Address
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Table 16. I2C Slave Address
MSB
1
LSB
0
0
1
1
ADR2
ADR1
R/ W
The TAS5780M device has 7 bits for the slave address. The first five bits (MSBs) of the slave address are
factory preset to 10011 (0x9x). The next two bits of the address byte are the device select bits which can be
user-defined by the ADR1 and ADR0 terminals. A maximum of four devices can be connected on the same bus
at one time, which gives a range of 0x90, 0x92, 0x94 and 0x96, as detailed in Table 17. Each TAS5780M device
responds when it receives the slave address.
Table 17. I2C Address Configuration via ADR0 and ADR1 Pins
ADR1
ADR0
I2C SLAVE ADDRESS [R/W]
0
0
1
1
0
1
0
1
0x90
0x92
0x94
0x96
9.3.9.2 Register Address Auto-Increment Mode
Auto-increment mode allows multiple sequential register locations to be written to or read back in a single
operation, and is especially useful for block write and read operations. The TAS5780M device supports auto-
increment mode automatically. Auto-increment stops at page boundaries.
9.3.9.3 Packet Protocol
A master device must control packet protocol, which consists of start condition, slave address, read/write bit,
data if write or acknowledge if read, and stop condition. The TAS5780M device supports only slave receivers and
slave transmitters.
SDA
SCL
9
1–7
8
9
1–8
9
1–8
9
Sp
St
Slave address
R/W
ACK
DATA
ACK
DATA
ACK
ACK
Start
condition
Stop
condition
R/W: Read operation if 1; otherwise, write operation
ACK: Acknowledgement of a byte if 0
DATA: 8 bits (byte)
Figure 69. Packet Protocol
Table 18. Write Operation - Basic I2C Framework
Transmitter
Data Type
M
M
M
S
M
S
M
S
S
M
St
slave address
R/
ACK
DATA
ACK
DATA
ACK
ACK
Sp
Table 19. Read Operation - Basic I2C Framework
Transmitter
Data Type
M
M
M
S
S
M
S
M
M
M
St
slave address
R/
ACK
DATA
ACK
DATA
ACK
NACK
Sp
M = Master Device; S = Slave Device; St = Start Condition Sp = Stop Condition
9.3.9.4 Write Register
A master can write to any TAS5780M device registers using single or multiple accesses. The master sends a
TAS5780M device slave address with a write bit, a register address, and the data. If auto-increment is enabled,
the address is that of the starting register, followed by the data to be transferred. When the data is received
properly, the index register is incremented by 1 automatically. When the index register reaches 0x7F, the next
value is 0x0. Table 20 shows the write operation.
52
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Table 20. Write Operation
Transmitter
Data Type
M
M
M
S
M
S
M
S
M
S
S
M
reg
addr
write
data 1
write
data 2
St
slave addr
W
ACK
inc
ACK
ACK
ACK
ACK
Sp
M = Master Device; S = Slave Device; St = Start Condition Sp = Stop Condition; W = Write; ACK = Acknowledge
9.3.9.5 Read Register
A master can read the TAS5780M device register. The value of the register address is stored in an indirect index
register in advance. The master sends a TAS5780M device slave address with a read bit after storing the
register address. Then the TAS5780M device transfers the data which the index register points to. When auto-
increment is enabled, the index register is incremented by 1 automatically. When the index register reaches
0x7F, the next value is 0x0. Table 21 lists the read operation.
Table 21. Read Operation
Transmitter
Data Type
M
M
M
S
M
S
M
M
M
S
S
M
M
M
slave
addr
reg
addr
slave
addr
St
W
ACK
inc
ACK
Sr
R
ACK
data
ACK
NACK
Sp
M = Master Device; S = Slave Device; St = Start Condition; Sr = Repeated start condition; Sp = Stop Condition;
W = Write; R = Read; NACK = Not acknowledge
9.3.9.6 DSP Book, Page, and Register Update
The DSP memory is arranged in books, pages, and registers. Each book has several pages and each page has
several registers.
9.3.9.6.1 Book and Page Change
To change the book, the user must be on page 0x00. In register 0x7f on page 0x00 you can change the book.
On page 0x00 of each book, register 0x7f is used to change the book. Register 0x00 of each page is used to
change the page. To change a book first write 0x00 to register 0x00 to switch to page 0 then write the book
number to register 0x7f on page 0. To change between pages in a book, simply write the page number to
register 0x00.
9.3.9.6.2 Swap Flag
The swap flag is used to copy the audio coefficient from the host memory to the DSP memory. The swap flag
feature is important to maintain the stability of the BQs. A BQ is a closed-loop system with 5 coefficients. To
avoid instability in the BQ in an update transition between two different filters, update all five parameters within
one audio sample. The internal swap flag insures all 5 coefficients for each filter are transferred from host
memory to DSP memory occurs within an audio sample. The swap flag stays high until the full host buffer is
transferred to DSP memory. Updates to the Host buffer should not be made while the swap flag is high.
All writes to book 0x8C from page 0x1B and register 0x58 through page 0x22 and register 0x1C require the swap
flag. The swap flag is located in book 0x8C, page 0x01, and register 0x10 and must be set to 0x00 00 00 01 for
a swap.
9.3.9.6.3 Example Use
The following is a sample script for using the DSP host memory to change the fine volume on the device on I2C
slave address 0x90 to the default value of 0 dB:
w 90 00 00 #Go to page 0
w 90 7f 8C #Change the book to 0x8C
w 90 00 21 #Go to page 0x21
w 90 21 48 00 00 00 #Fine volume Left
w 90 21 4C 00 00 00 #Fine volume Right
#Run the swap flag for the DSP to work on the new coefficients
w 90 00 00 #Go to page 0
w 90 7f 8C #Change the book to 0x8C
w 90 00 01 #Go to page 0x01
w 90 10 00 00 00 01 #Swap flag
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9.4 Device Functional Modes
Because the TAS5780M device is a highly configurable device, numerous modes of operation can exist for the
device. For the sake of succinct documentation, these modes are divided into two modes:
•
•
Fundamental operating modes
Secondary usage modes
Fundamental operating modes are the primary modes of operation that affect the major operational
characteristics of the device, which are the most basic configurations that are chosen to ensure compatibility with
the intended application or the other components that interact with the device in the final system. Some
examples of the operating modes are the communication protocol used by the control port, the output
configuration of the amplifier, or the Master/Slave clocking configuration.
The fundamental operating modes are described starting in the Serial Audio Port Operating Modes section.
Secondary usage modes are best described as modes of operation that are used after the fundamental operating
modes are chosen to fine tune how the device operates within a given system. These secondary usage modes
can include selecting between left justified and right justified Serial Audio Port data formats, or enabling some
slight gain/attenuation within the DAC path. Secondary usage modes are accomplished through manipulation of
the registers and controls in the I2C control port. Those modes of operation are described in their respective
register/bit descriptions and, to avoid redundancy, are not included in this section.
9.4.1 Serial Audio Port Operating Modes
The serial audio port in the TAS5780M device supports industry-standard audio data formats, including I2S, Time
Division Multiplexing (TDM), Left-Justified (LJ), and Right-Justified (RJ) formats. To select the data format that
will be used with the device, controls are provided on P0-R40. The timing diagrams for the serial audio port are
shown in the Serial Audio Port Timing – Slave Mode section, and the data formats are shown in the Serial Audio
Port – Data Formats and Bit Depths section.
9.4.2 Communication Port Operating Modes
The TAS5780M device is configured via an I2C communication port. The device does not support a hardware
only mode of operation, nor Serial Peripheral Interface (SPI) communication. The I2C Communication Protocol is
detailed in the I2C Communication Port section. The I2C timing requirements are described in the I2C Bus
Timing – Standard and I2C Bus Timing – Fast sections.
9.4.3 Speaker Amplifier Operating Modes
The TAS5780M device can be used in two different amplifier configurations:
•
•
Stereo Mode
Mono Mode
9.4.3.1 Stereo Mode
The familiar stereo mode of operation uses the TAS5780M device to amplify two independent signals, which
represent the left and right portions of a stereo signal. These amplified left and right audio signals are presented
on differential output pairs shown as SPK_OUTA± and SPK_OUTB±. The routing of the audio data which is
presented on the SPK_OUTxx outputs can be changed according to the Audio Process Flow which is used and
the configuration of registers P0-R42-D[5:4] and P0-R42-D[1:0]. The familiar stereo mode of operation is shown
in .
By default, the TAS5780M device is configured to output the Right frame of a I2S input on the Channel A output
and the left frame on the Channel B output.
9.4.3.2 Mono Mode
The mono mode of operation is used to describe operation in which the two outputs of the device are placed in
parallel with one another to increase the power sourcing capabilities of the audio output channel. This is also
known as Parallel Bridge Tied Load (PBTL).
54
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TAS5780M
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Device Functional Modes (continued)
On the output side of the TAS5780M device, the summation of the devices can be done before the filter in a
configuration called Pre-Filter PBTL. However, the two outputs may be required to merge together after the
inductor portion of the output filter. Doing so does require two additional inductors, but allows smaller, less
expensive inductors to be used because the current is divided between the two inductors. This process is called
Post-Filter PBTL. Both variants of mono operation are shown in Figure 70 and Figure 71.
[
CL[Ç
[
{tY_hÜÇ!+
CL[Ç
{tY_hÜÇ!+
/
CL[Ç
/
CL[Ç
{tY_hÜÇ!-
[
CL[Ç
{tY_hÜÇ!-
/
CL[Ç
{tY_hÜÇ.+
/
CL[Ç
[
CL[Ç
{tY_hÜÇ.-
/
CL[Ç
/opyrigꢀꢁ © 2016, Çexas Lnsꢁrumenꢁs Lncorporaꢁed
{tY_hÜÇ.+
[
CL[Ç
[
CL[Ç
{tY_hÜÇ.-
/
CL[Ç
/opyrigꢀꢁ © 2016, Çexas Lnsꢁrumenꢁs Lncorporaꢁed
Figure 70. Pre-Filter PBTL
Figure 71. Post-Filter PBTL
On the input side of the TAS5780M device, the input signal to the mono amplifier can be selected from the any
slot in a TDM stream or the left or right frame from an I2S, LJ, or RJ signal. The TAS5780M device can also be
configured to amplify some mixture of two signals, as in the case of a subwoofer channel which mixes the left
and right channel together and sends the mixture through a low-pass filter to create a mono, low-frequency
signal.
The mono mode of operation is shown in the Mono (PBTL) Systems section.
9.4.3.3 Master and Slave Mode Clocking for Digital Serial Audio Port
The digital audio serial port in the TAS5780M device can be configured to receive clocks from another device as
a serial audio slave device. The slave mode of operation is described in the Clock Slave Mode with SCLK PLL to
Generate Internal Clocks (3-Wire PCM) section. If no system processor is available to provide the audio clocks,
the TAS5780M device can be placed into Master Mode. In master mode, the TAS5780M device provides the
clocks to the other audio devices in the system. For more details regarding the Master and Slave mode operation
within the TAS5780M device, see the Serial Audio Port Operating Modes section.
9.5 Programming
9.5.1 Audio Processing Features
The TAS5780M device includes audio processing to optimize the audio performance of the audio system into
which they are integrated. The TAS5780M device has 12 Biquad Filters for speaker response tuning, One dual
band DPEQ to dynamically adjust the equalization curve that is applied to low-level signal and the curve that is
applied to high level signals. A 2-band advanced DRC + AGL structure limits the output power of the amplifier for
two regions while controlling the peaking that can occur in the crossover region during compression. A fine
volume control is provided to finely adjust the output level of the amplifier based upon the system level
considerations faced by the product development engineer.
The TAS5780M device has two signal monitoring options available, the level meter and the serial data out signal.
The level meter monitors the signal level through an alpha filter and presents the signal in an I²C register. The
level meter signal is taken before the 4x interpolation which occurs before the digital-to-analog conversion.
The SDOUT signal can be presented on any one of the GPIOx pins. Customarily, as is the case in all of the TI
evaluation hardware for the TAS5780M device, GPIO2 is used.
The details of the audio processing flow, including the I²C control port registers associated with each block, are
shown in .
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Programming (continued)
Audio Path
32 Bit Data Path & Coefficients
High level
BQ
Band-Split
High (1BQ)
Input Scale
& Mix
SRC
Main EQ
12 BQs
Adv.
DRC
Gain
Analog
DAC w/
Audio Input
from Serial
Port
1.31
32/48k
to
96kHz
1.31
5.27
Gain
Scale
DPEQ
Control
THD
Boost
Fine
Volume
4x
Int.
Sense
BQ
Out to
Amp
AGL
L&R or
L+R
2
Gain Cntrl
+
+
Dual bank
Log.
Style
Band-Split
Low (1BQ)
Gain
Low level
BQ
I²C
Register
Level
Meter
Bypass
Mux
Mux
Audio Out to
Serial Port
Figure 72. Fixed-Function Process Flow found in the TAS5780M
9.5.2 Processing Block Description
The processing block shown in the above is comprised of the following major blocks:
•
•
•
•
•
•
•
•
•
•
Input scale and mixer
Sample Rate Converter (SRC)
Parametric Equalizers (PEQs)
BQs Gain Scale
Dynamic Parametric Equalizer (DPEQ)
Two-Band Dynamic Ranger Control (DRC)
Automatic Gain Limiter (AGL)
Fine Volume
Level Meter
THD Management
9.5.2.1 Input Scale and Mixer
The input mixer can be used to mix the left and right channel input signals as shown in Figure 73. The input
mixer has four coefficients, which control the mixing and gains of the input signals. When mixing and scaling the
input signals, ensure that at maximum input level the input mixer outputs don't exceed 0 dBFS, which will
overdrive the SRC inputs.
L2L
Gain
Audio left in
Audio left out
+
L2R
Gain
R2L
Gain
R2R
Gain
Audio right in
Audio right out
+
Figure 73. Input Scale and Mixer
56
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Programming (continued)
9.5.2.1.1 Example
The following is a sample script for setting up the both left and right channels for (½L + ½R) or (L + R) / 2:
w 90 00 00 # Go to page 0
w 90 7f 8C #Change the book to 0x8C
w 90 00 21 #Go to page 0x21
w 90 50 00 40 26 E7 #Input mixer left in to left out gain
w 90 54 00 40 26 E7 #Input mixer right in to left out gain
w 90 58 00 40 26 E7 #Input mixer left in to right out gain
w 90 5C 00 40 26 E7 #Input mixer right in to right out gain
#Run the swap flag for the DSP to work on the new coefficients
w 90 00 00 #Go to page 0
w 90 7f 8C #Change the book to 0x8C
w 90 00 01 #Go to page 0x05
w 90 10 00 00 00 01 #Swap flag
9.5.2.2 Sample Rate Converter
The sample rate converter supports 32 kHz, 44.1 kHz, 48 kHz, 88.2 kHz and 96 kHz input sample rates. These
input sample rates are converted to 88.2 or 96 kHz sample rate. The sample rate detection doesn’t distinguish
between sample rates from 32 to 48 kHz. These sample rates are treated as 48 kHz by the sample rate
converter. The detected sample rate can be read at book 0x78 page 0x0C register 0x5C. The input sample rate
is 88.2 or 96 kHz at register 0x5C which reads 0x00 00 00 01. The input sample rate is 32 to 48 kHz at register
0x5C which reads 0x00 00 00 02. Input sample rate 32 kHz requires changing the interpolation setting from 2x to
3x by writing B0-P0-R37-D7 to 1. The device must be placed in standby mode for this change to take effect.
Table 22. Sample Rate Detection
SAMPLING RATE (KHZ)
B0-P0-R91-D[6:4]
8
001
010
011
100
16
32 – 48
88.2 – 96
Even though the sample rate converter supports 32 kHz, 44.1 kHz, 48 kHz, 88.2 kHz and 96 kHz input sample
rates, the TAS5780M device supports all input sample rates shown in Table 22 in 1x interpolation mode, base
rate processing.
The SRC input should not be overdriven. Making the maximum signal level into the SRC –0.5dBFs is
recommended to prevent overdriving the SRC and causing audio artifacts. The input scale and mixer can be
used to attenuate or boost the maximum input signal to –0.5dBFs. The processing block has several blocks after
the SRC where the signal can be compensate for any gain attenuation done in the input mixer and scale block to
prevent over driving the SRC.
9.5.2.3 Parametric Equalizers (PEQ)
The device supports 12 individual tuned PEQs for left channel and 12 individual tuned PEQs for the right
channel. The PEQs are implemented using cascaded “direct form 1” BQs structures as shown in Figure 74.
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Inst1_B0
Inst2_B0
X
Inst3_B0
BIQUADIN_D
X
X
+
+
+
2*Inst1_B1
2*Inst1_A1
2*Inst2_B1
X
2*Inst2_A1
2*Inst3_B1
z-1
z-1
z-1
X
X
X
X
z-1
z-1
z-1
Inst1_B2
Inst1_A2
Inst2_B2
X
Inst2_A2
Inst3_B2
X
X
X
X
Instance 1
Instance 2
Figure 74. Cascaded BQ Structure
Instance 3
b0 + b Z-1 + b2Z-2
a0 + a1Z-1 + a2Z-2
1
H(z) =
(2)
All BQ coefficients are normalized with a0 to insure that a0 is equal to 1. The structure requires 5 BQ coefficients
as shown in Table x. Any BQ with coefficients greater than 1 undergoes gain scaling as described in BQ Gain
Scale.
Table 23. BQ Coefficients Normalization
BQ COEFFICIENT FOR TAS5780M
COEFFICIENT CALCULATION
B0_DSP
B1_DSP
B2_DSP
A1_DSP
A2_DSP
b0 / a0
b1 / (a0 × 2)
b2 / a0
–a1 / (a0 × 2)
–a2 / a0
9.5.2.4 BQ Gain Scale
Main EQ
12 BQs
Gain
Scale
Figure 75. PEQs and BQs Gain Scale Block
The BQ coefficients format is as follows: The first BQ has B0 = 5.x, B1 = 6.x, B2 = 5.x, A1 = 2.x, and A2 = 1.x.
The rest of the BQ have this format: B0 = 1.x, B1 = 2.x, B2 = 1.x, A1 = 2.x, and A2 = 1.x. This formatting
maintains the highest possible resolution and noise performance. The 1.31 format restricts the ability to do high
gains within the BQs and as a result requires gain compensation for the restriction. When generating BQ
coefficients, ensure none of the BQ coefficients is greater than 1 by implementing gain compensation. The Gain
compensation reduces the BQ coefficients gain to ensure all BQ coefficients are less than 1. The reduced gain is
then reapplied in the subsequent gain scale block.
Gain compensation takes the maximum value of B0_DSP, B1_DSP, and B2_DSP after the BQ normalization
shown in Table 23 is implemented. All the B coefficients are divided by maximum B coefficient value then
multiplied by 0.999999999534339 (the nearest two’s complement 32-bit number to 1). The following calculations
are done for each BQ in the PEQ block:
Max _ k = max(B0 _ DSP, B1_ DSP, B2 _ DSP)
(3)
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k _ BQX = Max _ k
B0 _ DSP
(4)
(5)
(6)
(7)
B0 _ DSP =
B1_ DSP =
B2 _ DSP =
k _ BQX
B1_ DSP
k _ BQX
B2 _ DSP
k _ BQX
The calculations above insure all DSP BQ coefficients are in a 1.31 format. The reduced gains in the BQ 1.31
format is compensation for in the gain scale block. The following calculation is done for each channel.
k_BQ = k_BQ1 × k_BQ2 × k_BQ3 × k_BQ4 × k_BQ5 × k_BQ6 × k_BQ7 × k_BQ8 × k_BQ9 × k_BQ10 × k_BQ11 ×
k_BQ12
(8)
The calculated k_BQ compensation value is then applied to the BQ gain scale in an 8.24 format. The BQ gain
scale can also be used for volume control before the DRCs. The block can be considered as BQ gain scale and
volume gain block. When the BQ gain scale block is used for volume control the coefficient value must be
calculated as follows:
Volume
20
Gain _ BQ _V =10
´k _ BQ
where
•
Volume is in dB
(9)
The BQ gain scale coefficients are located in book 0x8C, page 0x1F register 0x58 for left and register 0x5C for
right.
The Bypass EQ Mux allows the user to bypass all processing. The Bypass EQ mux is at Page 0x21, Register
0x64. The Gang Left / Right mux forces the left processing to be the same as the right processing. The Gang
Left / Right Mux is located at Page 0x21, Register 0x68.
9.5.2.5 Dynamic Parametric Equalizer (DPEQ)
The dynamic parametric equalizer mixes the audio signals routed through two paths containing one BQ each
based upon the signal level detected by the sense path, as shown in Figure 76. The sense path contains one
BQ, which can be used to focus the DPEQ sensing on a specific frequency bandwidth. An alpha filter structure is
used to sense the energy in the sense path and setting the dynamic mixing ratios.
High level
BQ
DPEQ
Sense
Control
+
BQ
Low level
BQ
Figure 76. DPEQ Signal Path
The dynamic mixing is controlled by offset, gain, and alpha coefficients in a 1.31 format. The alpha coefficient
controls the average time constant in ms of the signal data in the sense path. The offset and gain coefficients
control the dynamic mixing thresholds shown in Figure 77.
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GAIN
Low Path Mix
1
0
High Path Mix
T1
T2
FS
SENSE LEVEL
Figure 77. Dynamic Mixing
The offset, gain and alpha coefficients are calculated as follows:
T1
T1_ Linear =1020
(10)
(11)
T 2-6
20
T2 _ Linear =10
where
•
T2 ≥ –20 dB
T 2
T2 _ Linear =1020
where
•
T2 < –20 dB
(12)
(13)
Offset = -T1_ Linear
1
Gain =
32(T2 _ Linear -T1_ Linear)
-1000
(14)
Alpha =1- etime constant´Fs
where
•
•
T1 and T2 are in dB
The time constant is in ms
(15)
The DPEQ control coefficients are located in book 0x8C, page0x20. Register 0x58 is alpha coefficient, register
0x5C is gain coefficient and register 0x60 is offset coefficient.
The high level path BQ, low level path BQ, and sense path BQ coefficients use a 1.31 format as shown in
Table 25. The DPEQ BQs don't have a gain scale to compensate for any BQ gain reduction due to the
requirements of the 1.31 format. During tuning, the reduced gain can be compensated by using the BQ gain
scale or the DRC offset coefficient.
The DPEQ sense gain scale is located in the sensing path. The DPEQ sense gain scale can be used to shift the
dynamic mixing thresholds by changing the signal level in the sensing path. A positive dB gain shifts the dynamic
mixing thresholds down by the gain amount and a negative dB gain shifts the dynamic mixing thresholds up by
the gain amount.
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9.5.2.6 Two-Band Dynamic Range Control
The Dynamic Range Control (DRC) is a feed-forward mechanism that can be used to automatically control the
audio signal amplitude or the dynamic range within specified limits. The dynamic range control is done by
sensing the audio signal level using an estimate of the alpha filter energy then adjusting the gain based on the
region and slope parameters that are defined. The Dynamic Range Control is shown in Figure 78.
Adv.
DRC
Mixer
gain
Band-Split
High (1BQ)
+
Log.
Style
Band-Split
Low (1BQ)
Mixer
gain
Figure 78. Dynamic Range Control
The DRCs have seven programmable transfer function parameters each: k0, k1, k2, T1, T2, OFF1, and OFF2.
The T1 and T2 parameters specify thresholds or boundaries of the three compression or expansion regions in
terms of input level. The Parameters k0, k1, and k2 define the gains or slopes of curves for each of the three
regions. The parameters OFF1 and OFF2 specify the offset shift relative 1:1 transfer function curve at the
thresholds T1 and T2 respectively shown in Figure 79.
0
OFF2
-25
K2
K1
OFF1
-50
K0
-75
-100
T1
T2
-125
-100
-75
-50
-25
0
Input (dB)
Figure 79. DRC Transfer Function Example Plot
The two-band dynamic range control is comprised of two DRCs that can be spilt into two bands using the BQ at
the input of each band. The frequency where the two bands are spilt is referred to as the crossover frequency.
The crossover frequency is the cut off frequency for the low pass filter used to create the low band and the cut
off frequency for the high pass filter used to create the high band.
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Attack
time
Decay
time
Gain
t1
t2
Figure 80. DRC Attack and Decay
The DRC in each band is equipped with individual energy, attack, and decay time constants. The DRC time
constants control the transition time of changes and decisions in the DRC gain during compression or expansion.
The energy, attack, and decay time constants affect the sensitivity level of the DRC. The shorter the time
constant, the more aggressive the DRC response and vice versa.
9.5.2.7 Automatic Gain Limiter
The Automatic Gain Limiter (AGL) is a feedback mechanism that can be used to automatically control the audio
signal amplitude or dynamic range within specified limits. The automatic gain limiting is done by sensing the
audio signal level using an alpha filter energy structure shown in Figure 82 at the output of the AGL then
adjusting the gain based on the whether the signal level is above or below the defined threshold. Three decisions
made by the AGL are engage, disengage, or do nothing. The rate at which the AGL engages or disengages
depends on the attack and release settings, respectively.
1:1 Transfer Function
Implemented Transfer Function
T
Input Level (dB)
M0091-04
Figure 81. AGL Transfer Function Example Plot
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Alpha Filter Structure
S
α
–1
ω
Z
Figure 82. AGL Alpha Filter Structure
9.5.2.7.1 Softening Filter Alpha (AEA)
•
•
•
•
AEA = 1 – e–1000 / (fs × User_AE)
e ≈ 2.718281828
Fs = sampling frequency
User_AE = user input step size
9.5.2.7.2 Softening Filter Omega (AEO)
•
AEO = 1 – AEA
9.5.2.7.3 Attack Rate
•
•
•
Attack rate = 2 (AA + Release rate)
AA = 1000 × User_Ad / Fs
User_Ad = user input attack step size
9.5.2.7.4 Release Rate
•
•
Release rate = 1000 × User_Rd / Fs
User_Rd = user input release step size
NOTE
The release duration (User_Rd) should be longer than the attack duration (User_Ad).
9.5.2.7.5 Attack Threshold
•
Attack Threshold = user input level in dB
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Threshold
INPUT
Threshold
OUTPUT
Attack Rate
Release Rate
W0003-01
Figure 83. AGL Attack and Release
The Attack Threshold AGL coefficients are shown in .
9.5.2.8 Fine Volume
The fine volume block after the AGL can be used to provide additional fine volume steps from –192 dB to 6 dB in
a 2.30 format. The Fine Coefficients are shown in .
9.5.2.9 THD Boost
A boost scalar and fine volume together can be used for clipping. The THD boost block allows the user to
programmatically increase the THD by clipping at an operating point earlier than that defined by the supply rails.
9.5.2.10 Level Meter
The level meter uses an energy estimator with a programmable time constant to adjust the sensitivity level based
on signal frequency and desired accuracy level. The level meter outputs of both left and right channels are
written to a 32-bit sub address location in a 1.31 format as shown in . The BypassToLevelMeter Bit in Book 8C,
Page 0x21, Register 0x70 can be used to switch the input to the Level Meter from the audio before processing to
audio post-processing.
9.5.3 Other Processing Block Features
9.5.3.1 Number Format
The data processing path is 32 bits with 32-bit coefficients. The coefficients use the two’s complement digital
number format.
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Table 24. Two’s Complement Format
BITS
TWO'S COMPLEMENT VALUE
0111 1111
0111 1110
0000 0010
0000 0001
0000 0000
1111 1111
1111 1110
1000 0010
1000 0001
1000 0000
127
126
2
1
0
–1
–2
–126
–127
–128
9.5.3.1.1 Coefficient Format Conversion
The device uses 32 bit two’s complement number formats. The calculated 4 byte register values are shown
below in an 8 digit hex value.
Table 25. Sample Calculations for 1.31 Format
dB
0
Linear
1
Decimal
Hex (1.31 Format)
7FFFFFFF
2147483648
1073741824
214748364
–6
–20
0.5
40000000
0.1
0CCCCCCC
D = 231 × L, D < 231
x
L = 10(x/20)
Dec2Hex(D, 8)(1)
D = 231, D ≥ 231
(1) Dec2Hex(D, 8), where 8 represents 8 nibbles or 38 bits.
Please note that for a 1.31 format the linear value cannot be greater than 1 or decimal value 232.
Table 26. Sample Calculations for B.A Format
dB
Linear
Decimal
Hex (1.31 Format)
D = 2A × L, D < 2(B + A - 1)
x
L = 10(x/20)
Dec2Hex(D, 8)
D = 2(B + A - 1), D ≥ 2(B + A - 1)
9.5.4 Checksum
The TAS5780M device supports two different check sum schemes, a cyclic redundancy check (CRC) checksum
and an Exclusive (XOR) checksum. Both checksums work on every register write, except for book switch register
and page switching register, 0x7F and 0x00, respectively. Register reads do not change checksum, but writes to
even nonexistent registers will change the checksum. Both checksums are 8-bit checksums and both are
available together simultaneously. The checksums can be reset by writing a starting value (eg. 0x 00 00 00 00)
to their respective 4-byte register locations.
9.5.4.1 Cyclic Redundancy Check (CRC) Checksum
The 8-bit CRC checksum used is the 0x7 polynomial (CRC-8-CCITT I.432.1; ATM HEC, ISDN HEC and cell
delineation, (1 + x1 + x2 + x8). A major advantage of the CRC checksum is that it is input order sensitive.
The CRC supports all I2C transactions, excluding book and page switching. The CRC checksum is read from
register 0x7E on any page of book 0x00 (B0_Page x_Reg 126). If the book isn’t Book 0, the CRC checksum is
only valid on page 0x00 register 0x7E (Page 0_Reg 126). The CRC checksum can be reset by writing 0x00 00
00 00 to the same register locations where the CRC checksum is valid.
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9.5.4.2 Exclusive or (XOR) Checksum
The Xor checksum is a simpler checksum scheme. It performs sequential XOR of each register byte write with
the previous 8-bit checksum register value. XOR supports only YMEM, which is located in Book 0x8C and
excludes page switching and all registers in Page 0x00 of Book 0x8C. XOR checksum is read from location
register 0x7D on page 0x00 of book 0x8C (B140_Page 0_Reg 125). The XOR Checksum can be reset by writing
0x00 00 00 00 to the same register location where it is read.
Table 27. XOR Truth Table
INPUT
OUTPUT
A
0
0
1
1
B
0
1
0
1
0
1
1
0
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10 Application and Implementation
注
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
10.1 Application Information
This section details the information required to configure the device for several popular configurations and
provides guidance on integrating the TAS5780M device into the larger system.
10.1.1 External Component Selection Criteria
The Supporting Component Requirements table in each application description section lists the details of the
supporting required components in each of the System Application Schematics.
Where possible, the supporting component requirements have been consolidated to minimize the number of
unique components which are used in the design. Component list consolidation is a method to reduce the
number of unique part numbers in a design, to ease inventory management, and to reduce the manufacturing
steps during board assembly. For this reason, some capacitors are specified at a higher voltage than what would
normally be required. An example of this is a 50-V capacitor may be used for decoupling of a 3.3-V power supply
net.
In this example, a higher voltage capacitor can be used even on the lower voltage net to consolidate all caps of
that value into a single component type. Similarly, several unique resistors that have all the same size and value
but different power ratings can be consolidated by using the highest rated power resistor for each instance of that
resistor value.
While this consolidation can seem excessive, the benefits of having fewer components in the design can far
outweigh the trivial cost of a higher voltage capacitor. If lower voltage capacitors are already available elsewhere
in the design, they can be used instead of the higher voltage capacitors. In all situations, the voltage rating of the
capacitors must be at least 1.45 times the voltage of the voltage which appears across them. The power rating of
the capacitors should be 1.5 times to 1.75 times the power dissipated in it during normal use case.
10.1.2 Component Selection Impact on Board Layout, Component Placement, and Trace Routing
Because the layout is important to the overall performance of the circuit, the package size of the components
shown in the component list was intentionally chosen to allow for proper board layout, component placement,
and trace routing. In some cases, traces are passed in between two surface mount pads or ground plane
extensions from the TAS5780M device and into to the surrounding copper for increased heat-sinking of the
device. While components may be offered in smaller or larger package sizes, it is highly recommended that the
package size remain identical to the size used in the application circuit as shown. This consistency ensures that
the layout and routing can be matched very closely, which optimizes thermal, electromagnetic, and audio
performance of the TAS5780M device in circuit in the final system.
10.1.3 Amplifier Output Filtering
The TAS5780M device is often used with a low-pass filter, which is used to filter out the carrier frequency of the
PWM modulated output. This filter is frequently referred to as the L-C Filter, due to the presence of an inductive
element L and a capacitive element C to make up the 2-pole filter.
The L-C filter removes the carrier frequency, reducing electromagnetic emissions and smoothing the current
waveform which is drawn from the power supply. The presence and size of the L-C filter is determined by several
system level constraints. In some low-power use cases that have no other circuits which are sensitive to EMI, a
simple ferrite bead or a ferrite bead plus a capacitor can replace the traditional large inductor and capacitor that
are commonly used. In other high-power applications, large toroid inductors are required for maximum power and
film capacitors can be used due to audio characteristics. Refer to the application report Class-D LC Filter Design
(SLOA119) for a detailed description on the proper component selection and design of an L-C filter based upon
the desired load and response.
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Application Information (接下页)
10.1.4 Programming the TAS5780M
The TAS5780M device includes an I2C compatible control port to configure the internal registers of the
TAS5780M device. The control console software provided by TI is required to configure the device. More details
regarding programming steps, and a few important notes are available below and also in the design examples
that follow.
10.1.4.1 Resetting the TAS5780M Registers and Modules
The TAS5780M device has several methods by which the device can reset the register, interpolation filters, and
DAC modules. The registers offer the flexibility to do these in or out of shutdown as well as in or out of standby.
However, there can be issues if the reset bits are toggled in certain illegal operation modes.
Any of the following routines can be used with no issue:
•
•
•
•
•
•
•
Reset Routine 1
–
–
Place device in Standby
Reset modules
Reset Routine 2
–
–
Place device in Standby + Power Down
Reset registers
Reset Routine 3
–
–
Place device in Power Down
Reset registers
Reset Routine 4
–
–
Place device in Standby
Reset registers
Reset Routine 5
–
–
Place device in Standby + Power Down
Reset modules + Reset registers
Reset Routine 6
–
–
Place device in Power Down
Reset modules + Reset registers
Reset Routine 7
–
–
Place device in Standby
Reset modules + Reset registers
Two reset routines are not supported and should be avoided. If used, they can cause the device to become
unresponsive. These unsupported routines are shown below.
•
Unsupported Reset Routine 1 (do not use)
–
–
Place device in Standby + Power Down
Reset modules
•
Unsupported Reset Routine 2 (do not use)
–
–
Place device in Power Down
Reset modules
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10.2 Typical Applications
10.2.1 2.0 (Stereo BTL) System
For the stereo (BTL) PCB layout, see 图 89.
A 2.0 system refers to a system in which there are two full range speakers without a separate amplifier path for
the speakers which reproduce the low-frequency content. In this system, two channels are presented to the
amplifier via the digital input signal. These two channels are amplified and then sent to two separate speakers. In
some cases, the amplified signal is further separated based upon frequency by a passive crossover network after
the L-C filter. Even so, the application is considered 2.0.
Most commonly, the two channels are a pair of signals called a stereo pair, with one channel containing the
audio for the left channel and the other channel containing the audio for the right channel. While certainly the two
channels can contain any two audio channels, such as two surround channels of a multi-channel speaker
system, the most popular occurrence in two channels systems is a stereo pair.
图 84 shows the 2.0 (Stereo BTL) system application.
PVDD
R100
750k
R101
150k
C103
1µF
C100
0.1µF
C101
22µF
C102
22µF
GND
GND
GND
GND
GND
C104
To System Processor
3.3V
0.22µF
L100
L101
2.0-SDA
2.0-SCL
2.0-SPK_OUTA+
2.0-GPIO0
2.0_RESET
2.0-SDOUT
2.0-MCLK
2.0-SCLK
2.0-SDIN
2.0-OUTA+
2.0-OUTA-
C105
1µF
C106
2.2µF
C107
2.2µF
3.3V
2.0-SPK_OUTA-
C108
C109
0.1µF
C110
0.1µF
0.22µF
GND
U100
TAS5780M
GND
GND
PAD
GND
C111
2.0-LRCK/FS
0.22µF
L102
L103
GND
GND
GND
GND
GND
2.0-SPK_OUTB-
2.0-OUTB-
2.0-OUTB+
C112
1µF
C113
2.2µF
C114
2.2µF
3.3V
2.0-SPK_OUTB+
C115
C116
0.1µF
C117
0.1µF
C118
1µF
C119
1µF
C120
1µF
GND
PVDD
0.22µF
GND
GND
2.0-SPK_MUTE
2.0-SPK_FAULT
GND
GND
GND
C121
0.1µF
C122
22µF
C123
22µF
GND
GND
GND
Copyright © 2016, Texas Instruments Incorporated
图 84. 2.0 (Stereo BTL) System Application Schematic
10.2.1.1 Design Requirements
•
Power supplies:
–
–
3.3-V supply
5-V to 24-V supply
Communication: host processor serving as I2C compliant master
External memory (such as EEPROM and flash) used for coefficients
•
•
The requirements for the supporting components for the TAS5780M device in a Stereo 2.0 (BTL) system is
provided in 表 28.
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表 28. Supporting Component Requirements for Stereo 2.0 (BTL) Systems
REFERENCE
DESIGNATOR
VALUE
SIZE
DETAILED DESCRIPTION
U100
TAS5780M
48 Pin TSSOP
0402
Digital-input, closed-loop class-D amplifier
1%, 0.063 W
R100
See the Adjustable
Amplifier Gain and
Switching Frequency
Selection section
R101
0402
1%, 0.063 W
L100, L101, L102,
L103
See the Amplifier Output Filtering section
Ceramic, 0.1 µF, ±10%, X7R
Voltage rating must be > 1.45 × VPVDD
C100, C121
0.1 µF
0.22 µF
0.68 µF
0402
0603
C104, C108, C111,
C115
Ceramic, 0.22 µF, ±10%, X7R
Voltage rating must be > 1.45 × VPVDD
C109, C110, C116,
C117
Ceramic, 0.68 µF, ±10%, X7R
Voltage rating must be > 1.8 × VPVDD
0805
0603
(this body size
chosen to aid in trace Voltage rating must be > 16 V
routing)
Ceramic, 1 µF, ±10%, X7R
C103
1 µF
1 µF
C105, C118, C119,
C120
0402
Ceramic, 1 µF, 6.3V, ±10%, X5R
Ceramic, 2.2 µF, ±10%, X5R
At a minimum, voltage rating must be > 10V, however higher
voltage caps have been shown to have better stability under DC
bias. Refer to the guidance provided in the TAS5780M for
suggested values.
C106, C107, C113,
C114
2.2 µF
22 µF
0402
0805
C101, C102, C122,
C123
Ceramic, 22 µF, ±20%, X5R
Voltage rating must be > 1.45 × VPVDD
10.2.1.2 Detailed Design Procedure
10.2.1.2.1 Step One: Hardware Integration
•
•
Using the Typical Application Schematic as a guide, integrate the hardware into the system schematic.
Following the recommended component placement, board layout, and routing given in the example layout
above, integrate the device and its supporting components into the system PCB file.
–
The most critical sections of the circuit are the power supply inputs, the amplifier output signals, and the
high-frequency signals, all of which go to the serial audio port. Constructing these signals to ensure they
are given precedent as design trade-offs are made is recommended.
–
For questions and support go to the E2E forums (e2e.ti.com). If deviating from the recommended layout is
necessary, go to the E2E forum to request a layout review.
10.2.1.2.2 Step Two: System Level Tuning
•
•
Use the TAS5780MEVM evaluation module and the PPC3 app to configure the desired device settings.
Tune the end equipment by following the instructions in SLAU694
10.2.1.2.3 Step Three: Software Integration
•
•
Use the End System Integration feature of the PPC3 app to generate a baseline configuration file.
Generate additional configuration files based upon operating modes of the end-equipment and integrate static
configuration information into initialization files.
•
Integrate dynamic controls (such as volume controls, mute commands, and mode-based EQ curves) into the
main system program.
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10.2.1.3 Application Curves
表 29 shows the application specific performance plots for Stereo 2.0 (BTL) systems.
表 29. Relevant Performance Plots
PLOT TITLE
Output Power vs PVDD
FIGURE NUMBER
Figure 23
Figure 24
Figure 25
Figure 26
Figure 27
Figure 28
Figure 29
Figure 30
Figure 31
Figure 32
Figure 33
Figure 39
Figure 40
Figure 41
THD+N vs Frequency, VPVDD = 12 V
THD+N vs Frequency, VPVDD = 15 V
THD+N vs Frequency, VPVDD = 18 V
THD+N vs Frequency, VPVDD = 24 V
THD+N vs Power, VPVDD = 12 V
THD+N vs Power, VPVDD = 15 V
THD+N vs Power, VPVDD = 18 V
THD+N vs Power, VPVDD = 24 V
Idle Channel Noise vs PVDD
Efficiency vs Output Power
DVDD PSRR vs. Frequency
AVDD PSRR vs. Frequency
CPVDD PSRR vs. Frequency
10.2.2 Mono (PBTL) Systems
For the mono (PBTL) PCB layout, see 图 91.
A mono system refers to a system in which the amplifier is used to drive a single loudspeaker. Parallel Bridge
Tied Load (PBTL) indicates that the two full-bridge channels of the device are placed in parallel and drive the
loudspeaker simultaneously using an identical audio signal. The primary benefit of operating the TAS5780M
device in PBTL operation is to reduce the power dissipation and increase the current sourcing capabilities of the
amplifier output. In this mode of operation, the current limit of the audio amplifier is approximately doubled while
the on-resistance is approximately halved.
The loudspeaker can be a full-range transducer or one that only reproduces the low-frequency content of an
audio signal, as in the case of a powered subwoofer. Often in this use case, two stereo signals are mixed
together and sent through a low-pass filter to create a single audio signal which contains the low frequency
information of the two channels. Conversely, advanced digital signal processing can create a low-frequency
signal for a multichannel system, with audio processing which is specifically targeted on low-frequency effects.
Because low-frequency signals are not perceived as having a direction (at least to the extent of high-frequency
signals) it is common to reproduce the low-frequency content of a stereo signal that is sent to two separate
channels. This configuration pairs one device in Mono PBTL configuration and another device in Stereo BTL
configuration in a single system called a 2.1 system. The Mono PBTL configuration is detailed in the 2.1 (Stereo
BTL + External Mono Amplifier) Systems section. shows the Mono (PBTL) system application
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PVDD
R200
750k
R201
150k
C204
390µF
C200
1µF
C201
0.1µF
C202
1µF
C203
22µF
GND
GND
GND
GND
GND
GND
To System Processor
3.3V
MONO-SDA
MONO-SCL
C208
MONO-GPIO0
MONO_RESET
MONO-SDOUT
MONO-MCLK
MONO-SCLK
MONO-SDIN
0.22µF
L200
C205
1µF
C206
2.2µF
C207
2.2µF
MONO-SPK_OUTA
C209
MONO_OUT+
C220
0.1µF
0.22µF
GND
U200
TAS5780M
GND
PAD
GND
C214
MONO-LRCK/FS
0.22µF
L201
GND
GND
GND
GND
GND
MONO-SPK_OUTB
C215
MONO_OUT-
C210
1µF
R202
49.9k
C221
0.1µF
3.3V
0.22µF PVDD
C211
1µF
C212
1µF
C213
1µF
GND
C219
390µF
C216
0.1µF
C217
1µF
C218
22µF
MONO-SPK_MUTE
MONO-SPK_FAULT
GND
GND
GND
GND
GND
GND
GND
Copyright © 2016, Texas Instruments Incorporated
图 85. Mono (PBTL) System Application Schematic
10.2.2.1 Design Requirements
•
Power supplies:
–
–
3.3-V supply
5-V to 24-V supply
Communication: Host processor serving as I2C compliant master
External memory (EEPROM, flash, and others) used for coefficients.
•
•
The requirements for the supporting components for the TAS5780M device in a Mono (PBTL) system is provided
in 表 30.
表 30. Supporting Component Requirements for Mono (PBTL) Systems
REFERENCE
DESIGNATOR
VALUE
SIZE
DETAILED DESCRIPTION
U200
TAS5780M
48 Pin TSSOP
0402
Digital-input, closed-loop class-D amplifier with 96kHz processing
R200
See the Adjustable
Amplifier Gain and
Switching Frequency
Selection section
1%, 0.063 W
1%, 0.063 W
1%, 0.063 W
R201
0402
R202
0402
L200, L201
See theAmplifier Output Filtering section
Ceramic, 0.1 µF, ±10%, X7R
Voltage rating must be > 1.45 × VPVDD
C216, C201
0.1 µF
0.22 µF
0.68 µF
0402
0603
0805
C208, C209, C214,
C215
Ceramic, 0.22 µF, ±10%, X7R
Voltage rating must be > 1.45 × VPVDD
Ceramic, 0.68 µF, ±10%, X7R
Voltage rating must be > 1.8 × VPVDD
C220, C221
72
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表 30. Supporting Component Requirements for Mono (PBTL) Systems (接下页)
REFERENCE
DESIGNATOR
VALUE
SIZE
DETAILED DESCRIPTION
0603
(this body size
chosen to aid in trace Voltage rating must be > 16 V
routing)
Ceramic, 1 µF, ±10%, X7R
C200
1 µF
C205, C211, C213,
C212
1 µF
0402
Ceramic, 1 µF, 6.3 V, ±10%, X5R
0805
C202, C217, C352,
C367
(this body size
Ceramic, 1 µF, ±10%, X5R
1 µF
chosen to aid in trace Voltage rating must be > 1.45 × VPVDD
routing)
Ceramic, 2.2 µF, ±10%, X5R
At a minimum, voltage rating must be > 10V, however higher
C206, C207
C203, C218
2.2 µF
0402
voltage caps have been shown to have better stability under DC
bias please follow the guidance provided in the TAS5780M for
suggested values.
22 µF
0805
Ceramic, 22 µF, ±20%, X5R
Voltage rating must be > 1.45 × VPVDD
390 µF
10 × 10
Aluminum, 390 µF, ±20%, 0.08-Ω
Voltage rating must be > 1.45 × VPVDD Anticipating that this
application circuit would be followed for higher power subwoofer
applications, these capacitors are added to provide local current
sources for low-frequency content. These capacitors can be
reduced or even removed based upon final system testing, including
critical listening tests when evaluating low-frequency designs.
C204, C219
10.2.2.2 Detailed Design Procedure
10.2.2.2.1 Step One: Hardware Integration
•
•
Using the Typical Application Schematic as a guide, integrate the hardware into the system schematic.
Following the recommended component placement, board layout, and routing given in the example layout
above, integrate the device and its supporting components into the system PCB file.
–
The most critical sections of the circuit are the power supply inputs, the amplifier output signals, and the
high-frequency signals, all of which go to the serial audio port. Constructing these signals to ensure they
are given precedent as design trade-offs are made is recommended.
–
For questions and support go to the E2E forums (e2e.ti.com). If deviating from the recommended layout is
necessary, go to the E2E forum to request a layout review.
10.2.2.2.2 Step Two: System Level Tuning
•
Use the TAS5780MEVM evaluation module and the PPC3 app to configure the desired device settings.
10.2.2.2.3 Step Three: Software Integration
•
•
Use the End System Integration feature of the PPC3 app to generate a baseline configuration file.
Generate additional configuration files based upon operating modes of the end-equipment and integrate static
configuration information into initialization files.
•
Integrate dynamic controls (such as volume controls, mute commands, and mode-based EQ curves) into the
main system program.
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10.2.2.3 Application Specific Performance Plots for Mono (PBTL) Systems
表 31 shows the application specific performance plots for Mono (PBTL) Systems
表 31. Relevant Performance Plots
PLOT TITLE
Output Power vs PVDD
FIGURE NUMBER
Figure 43
Figure 44
Figure 45
Figure 46
Figure 47
Figure 48
Figure 49
Figure 50
Figure 51
Figure 52
Figure 53
THD+N vs Frequency, VPVDD = 12 V
THD+N vs Frequency, VPVDD = 15 V
THD+N vs Frequency, VPVDD = 18 V
THD+N vs Frequency, VPVDD = 24 V
THD+N vs Power, VPVDD = 12 V
THD+N vs Power, VPVDD = 15 V
THD+N vs Power, VPVDD = 18 V
THD+N vs Power, VPVDD = 24 V
Idle Channel Noise vs PVDD
Efficiency vs Output Power
10.2.3 2.1 (Stereo BTL + External Mono Amplifier) Systems
图 93 shows the PCB Layout for the 2.1 System.
To increase the low-frequency output capabilities of an audio system, a single subwoofer can be added to the
system. Because the spatial clues for audio are predominately higher frequency than that reproduced by the
subwoofer, often a single subwoofer can be used to reproduce the low frequency content of several other
channels in the system. This is frequently referred to as a dot one system. A stereo system with a subwoofer is
referred to as a 2.1 (two-dot-one), a 3 channel system with subwoofer is referred to as a 3.1 (three-dot-one), a
popular surround system with five speakers and one subwoofer is referred to as a 5.1, and so on.
10.2.3.1 Advanced 2.1 System (Two TAS5780M devices)
In higher performance systems, the subwoofer output can be enhanced using digital audio processing as was
done in the high-frequency channels. To accomplish this, two TAS5780M devices are used — one for the high
frequency left and right speakers and one for the mono subwoofer speaker. In this system, the audio signal can
be sent from the TAS5780M device through the SDOUT pin. Alternatively, the subwoofer amplifier can accept
the same digital input as the stereo, which might come from a central systems processor. 图 86 shows the 2.1
(Stereo BTL + External Mono Amplifier) system application.
74
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ZHCSFY4 –DECEMBER 2016
PVDD
R300
750k
R301
150k
C303
1µF
C300
0.1µF
C301
22µF
C302
22µF
GND
GND
GND
GND
GND
C304
To System Processor
3.3V
0.22µF
L300
L301
2.1-SDA
2.1-SCL
2.1-SPK_OUT1A+
2.1-GPIO0_HF
2.1_RESET
2.1-HF_OUTA+
2.1-HF_OUTA-
C305
1µF
C306
2.2µF
C307
2.2µF
2.1-MCLK
2.1-SCLK
2.1-SDIN
3.3V
2.1-SPK_OUT1A-
C308
C309
0.1µF
C310
0.1µF
0.22µF
GND
U300
TAS5780M
GND
GND
PAD
GND
C311
2.1-LRCK/FS
0.22µF
L302
GND
GND
GND
GND
GND
2.1-SPK_OUT1B-
2.1-HF_OUTB-
2.1-HF_OUTB+
L303
C312
1µF
C313
2.2µF
C314
2.2µF
3.3V
2.1-SPK_OUT1B+
C315
C316
0.1µF
C317
0.1µF
C318
1µF
C319
1µF
C320
1µF
GND
PVDD
0.22µF
GND
GND
2.1-SPK_MUTE
2.1-SPK_FAULT
GND
GND
GND
C321
0.1µF
C322
22µF
C323
22µF
GND
GND
GND
PVDD
R350
750k
R351
150k
C354
390µF
C350
1µF
C351
0.1µF
C352
1µF
C353
22µF
GND
GND
GND
GND
GND
GND
3.3V
C358
2.1-GPIO0_LF
2.1_RESET
2.1-SDOUT_LF
0.22µF
L350
C355
1µF
C356
2.2µF
C357
2.2µF
2.1-SPK_OUT2A
C359
2.1_LF+
C370
0.1µF
0.22µF
GND
U301
TAS5780M
GND
PAD
GND
C364
0.22µF
2.1-SPK_OUT2B
C365
L351
GND
GND
GND
GND
GND
2.1_LF-
C360
1µF
R352
49.9k
C371
0.1µF
3.3V
0.22µF PVDD
C361
1µF
C362
1µF
C363
1µF
GND
C369
390µF
C366
0.1µF
C367
1µF
C368
22µF
GND
GND
GND
GND
GND
GND
GND
Copyright © 2016, Texas Instruments Incorporated
图 86. 2.1 (Stereo BTL + External Mono Amplifier) Application Schematic
10.2.3.2 Design Requirements
•
Power supplies:
–
–
3.3-V supply
5-V to 24-V supply
Communication: Host processor serving as I2C compliant master
External memory (EEPROM, flash, and others) used for coefficients.
•
•
The requirements for the supporting components for the TAS5780M device in a 2.1 (Stereo BTL + External Mono
Amplifier) system is provided in 表 32.
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表 32. Supporting Component Requirements for 2.1 (Stereo BTL + External Mono Amplifier) Systems
REFERENCE
DESIGNATOR
VALUE
SIZE
DETAILED DESCRIPTION
U300
TAS5780M
48 Pin TSSOP
0402
Digital-input, closed-loop class-D amplifier 96kHz Processing
R300, R350
R301, R351
R352
See the Adjustable
Amplifier Gain and
Switching Frequency
Selection section
1%, 0.063 W
1%, 0.063 W
1%, 0.063 W
0402
0402
L300, L301, L302,
L303
See the Amplifier Output Filtering section
L350, L351
C394, C395, C396,
C397, C398, C399
0.01 µF
0.1 µF
0603
0402
Ceramic, 0.01 µF, 50 V, +/-10%, X7R
C300, C321, C351,
C366
Ceramic, 0.1 µF, ±10%, X7R
Voltage rating must be > 1.45 × VPVDD
C304, C308, C311,
C315, C358, C359,
C364, C365
Ceramic, 0.22 µF, ±10%, X7R
Voltage rating must be > 1.45 × VPVDD
0.22 µF
0603
C309, C310, C316,
C317, C370, C371
Ceramic, 0.68 µF, ±10%, X7R
Voltage rating must be > 1.8 × VPVDD
0.68 µF
1 µF
0805
0603
C303, C350, C312,
C360
Ceramic, 1 µF, ±10%, X7R
Voltage rating must be > 1.45 × VPVDD
C305, C318, C319,
C320, C355, C361,
C363, C312, C362
1 µF
0402
Ceramic, 1 µF, 6.3V, ±10%, X5R
Ceramic, 1 µF, ±10%, X7R
Voltage rating must be > 1.45 × VPVDD
C352, C367
1 µF
2.2 µF
22 µF
390 µF
0805
0402
0805
C306, C307, C313,
C314, C356, C357,
Ceramic, 2.2 µF, ±10%, X5R
Voltage rating must be > 1.45 × VPVDD
C301, C302, C322,
C323, C353, C368
Ceramic, 22 µF, ±20%, X5R
Voltage rating must be > 1.45 × VPVDD
Aluminum, 390 µF, ±20%, 0.08 Ω
Voltage rating must be > 1.45 × VPVDD
C354, C369
10 × 10
76
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TAS5780M
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ZHCSFY4 –DECEMBER 2016
10.2.3.3 Application Specific Performance Plots for 2.1 (Stereo BTL + External Mono Amplifier) Systems
表 33 shows the application specific performance plots for 2.1 (Stereo BTL + External Mono Amplifier) Systems
表 33. Relevant Performance Plots
DEVICE
PLOT TITLE
FIGURE NUMBER
Figure 23
Figure 24
Figure 25
Figure 26
Figure 27
Figure 28
Figure 29
Figure 30
Figure 31
Figure 32
Figure 33
Figure 38
Figure 43
Figure 44
Figure 45
Figure 46
Figure 47
Figure 48
Figure 49
Figure 50
Figure 51
Figure 52
Figure 53
Figure 39
Figure 40
Figure 41
Figure 43
Output Power vs PVDD
THD+N vs Frequency, VPVDD = 12 V
THD+N vs Frequency, VPVDD = 15 V
THD+N vs Frequency, VPVDD = 18 V
THD+N vs Frequency, VPVDD = 24 V
THD+N vs Power, VPVDD = 12 V
THD+N vs Power, VPVDD = 15 V
THD+N vs Power, VPVDD = 18 V
THD+N vs Power, VPVDD = 24 V
Idle Channel Noise vs PVDD
U300
Efficiency vs Output Power
PVDD PSRR vs Frequency
Output Power vs PVDD
THD+N vs Frequency, VPVDD = 12 V
THD+N vs Frequency, VPVDD = 15 V
THD+N vs Frequency, VPVDD = 18 V
THD+N vs Frequency, VPVDD = 24 V
THD+N vs Power, VPVDD = 12 V
THD+N vs Power, VPVDD = 15 V
THD+N vs Power, VPVDD = 18 V
THD+N vs Power, VPVDD = 24 V
Idle Channel Noise vs PVDD
U301
Efficiency vs Output Power
DVDD PSRR vs. Frequency
U300
and
U301
AVDD PSRR vs. Frequency
CPVDD PSRR vs. Frequency
Powerdown Current Draw vs. PVDD
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11 Power Supply Recommendations
11.1 Power Supplies
The TAS5780M device requires two power supplies for proper operation. A high-voltage supply called PVDD is
required to power the output stage of the speaker amplifier and its associated circuitry. Additionally, one low-
voltage power supply which is called DVDD is required to power the various low-power portions of the device.
The allowable voltage range for both the PVDD and the DVDD supply are listed in the Recommended Operating
Conditions table. The two power supplies do not have a required powerup sequence. The power supplies can be
powered on in any order. TI recommends waiting 100 ms to 240 ms for the DVDD power supplies to stabilize
before starting I2C communication and providing stable I2S clock before enabling the device outputs.
AVDD
Internal Analog Circuitry
Internal Mixed
Signal Circuitry
Internal Digital
Circuitry
+
DVDD
DVDD
DVDD_REG
External Filtering/Decoupling
œ
LDO
CPVDD
CPVSS
External Filtering/Decoupling
Charge
Pump
DAC Output Stage
(Positive)
DAC Output Stage
(Negative)
Output Stage
Power Supply
Gate Drive
Voltage
PVDD
GVDD_REG
External Filtering/Decoupling
Linear
Regulator
+
PVDD
œ
图 87. Power Supply Functional Block Diagram
11.1.1 DVDD Supply
The DVDD supply that is required from the system is used to power several portions of the device. As shown in
图 87, it provides power to the DVDD pin, the CPVDD pin, and the AVDD pin. Proper connection, routing, and
decoupling techniques are highlighted in the Application and Implementation section and the Layout Example
section) and must be followed as closely as possible for proper operation and performance. Deviation from the
guidance offered in the TAS5780M device Application and Implementation section can result in reduced
performance, errant functionality, or even damage to the TAS5780M device.
Some portions of the device also require a separate power supply that is a lower voltage than the DVDD supply.
To simplify the power supply requirements for the system, the TAS5780M device includes an integrated low-
dropout (LDO) linear regulator to create this supply. This linear regulator is internally connected to the DVDD
supply and its output is presented on the DVDD_REG pin, providing a connection point for an external bypass
capacitor. It is important to note that the linear regulator integrated in the device has only been designed to
support the current requirements of the internal circuitry, and should not be used to power any additional external
circuitry. Additional loading on this pin could cause the voltage to sag, negatively affecting the performance and
operation of the device.
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TAS5780M
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Power Supplies (接下页)
The outputs of the high-performance DACs used in the TAS5780M device are ground centered, requiring both a
positive low-voltage supply and a negative low-voltage supply. The positive power supply for the DAC output
stage is taken from the AVDD pin, which is connected to the DVDD supply provided by the system. A charge
pump is integrated in the TAS5780M device to generate the negative low-voltage supply. The power supply input
for the charge pump is the CPVDD pin. The CPVSS pin is provided to allow the connection of a filter capacitor
on the negative low-voltage supply. As is the case with the other supplies, the component selection, placement,
and routing of the external components for these low voltage supplies are shown in the TAS5780M and should
be followed as closely as possible to ensure proper operation of the device.
11.1.2 PVDD Supply
The output stage of the speaker amplifier drives the load using the PVDD supply. This is the power supply which
provides the drive current to the load during playback. Proper connection, routing, and decoupling techniques are
highlighted in the TAS5780MEVM and must be followed as closely as possible for proper operation and
performance. Due to the high-voltage switching of the output stage, it is particularly important to properly
decouple the output power stages in the manner described in the TAS5780M deviceApplication and
Implementation . Lack of proper decoupling, like that shown in the Application and Implementation , results in
voltage spikes which can damage the device.
A separate power supply is required to drive the gates of the MOSFETs used in the output stage of the speaker
amplifier. This power supply is derived from the PVDD supply via an integrated linear regulator. A GVDD_REG
pin is provided for the attachment of decoupling capacitor for the gate drive voltage regulator. It is important to
note that the linear regulator integrated in the device has only been designed to support the current requirements
of the internal circuitry, and should not be used to power any additional external circuitry. Additional loading on
this pin could cause the voltage to sag, negatively affecting the performance and operation of the device.
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12 Layout
12.1 Layout Guidelines
12.1.1 General Guidelines for Audio Amplifiers
Audio amplifiers which incorporate switching output stages must have special attention paid to their layout and
the layout of the supporting components used around them. The system level performance metrics, including
thermal performance, electromagnetic compliance (EMC), device reliability, and audio performance are all
affected by the device and supporting component layout.
Ideally, the guidance provided in the applications section with regard to device and component selection can be
followed by precise adherence to the layout guidance shown in Layout Example. These examples represent
exemplary baseline balance of the engineering trade-offs involved with laying out the device. These designs can
be modified slightly as needed to meet the needs of a given application. In some applications, for instance,
solution size can be compromised to improve thermal performance through the use of additional contiguous
copper near the device. Conversely, EMI performance can be prioritized over thermal performance by routing on
internal traces and incorporating a via picket-fence and additional filtering components. In all cases, it is
recommended to start from the guidance shown in the Layout Example section and work with TI field application
engineers or through the E2E community to modify it based upon the application specific goals.
12.1.2 Importance of PVDD Bypass Capacitor Placement on PVDD Network
Placing the bypassing and decoupling capacitors close to supply has long been understood in the industry. This
applies to DVDD, AVDD, CPVDD, and PVDD. However, the capacitors on the PVDD net for the TAS5780M
device deserve special attention.
The small bypass capacitors on the PVDD lines of the DUT must be placed as close to the PVDD pins as
possible. Not only does placing these devices far away from the pins increase the electromagnetic interference in
the system, but doing so can also negatively affect the reliability of the device. Placement of these components
too far from the TAS5780M device can cause ringing on the output pins that can cause the voltage on the output
pin to exceed the maximum allowable ratings shown in the Absolute Maximum Ratings table, damaging the
device. For that reason, the capacitors on the PVDD net must be no further away from their associated PVDD
pins than what is shown in the example layouts in the Layout Example section
12.1.3 Optimizing Thermal Performance
Follow the layout examples shown in the Layout Example section of this document to achieve the best balance
of solution size, thermal, audio, and electromagnetic performance. In some cases, deviation from this guidance
can be required due to design constraints which cannot be avoided. In these instances, the system designer
should ensure that the heat can get out of the device and into the ambient air surrounding the device.
Fortunately, the heat created in the device naturally travels away from the device and into the lower temperature
structures around the device.
12.1.3.1 Device, Copper, and Component Layout
Primarily, the goal of the PCB design is to minimize the thermal impedance in the path to those cooler structures.
These tips should be followed to achieve that goal:
•
Avoid placing other heat producing components or structures near the amplifier (including above or below in
the end equipment).
•
If possible, use a higher layer count PCB to provide more heat sinking capability for the TAS5780M device
and to prevent traces and copper signal and power planes from breaking up the contiguous copper on the top
and bottom layer.
•
•
Place the TAS5780M device away from the edge of the PCB when possible to ensure that heat can travel
away from the device on all four sides.
Avoid cutting off the flow of heat from the TAS5780M device to the surrounding areas with traces or via
strings. Instead, route traces perpendicular to the device and line up vias in columns which are perpendicular
to the device.
•
Unless the area between two pads of a passive component is large enough to allow copper to flow in
between the two pads, orient it so that the narrow end of the passive component is facing the TAS5780M
device.
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Layout Guidelines (接下页)
•
Because the ground pins are the best conductors of heat in the package, maintain a contiguous ground plane
from the ground pins to the PCB area surrounding the device for as many of the ground pins as possible.
12.1.3.2 Stencil Pattern
The recommended drawings for the TAS5780M device PCB foot print and associated stencil pattern are shown
at the end of this document in the package addendum. Additionally, baseline recommendations for the via
arrangement under and around the device are given as a starting point for the PCB design. This guidance is
provided to suit the majority of manufacturing capabilities in the industry and prioritizes manufacturability over all
other performance criteria. In elevated ambient temperatures or under high-power dissipation use-cases, this
guidance may be too conservative and advanced PCB design techniques may be used to improve thermal
performance of the system.
注
The customer must verify that deviation from the guidance shown in the package
addendum, including the deviation explained in this section, meets the customer’s quality,
reliability, and manufacturability goals.
12.1.3.2.1 PCB footprint and Via Arrangement
The PCB footprint (also known as a symbol or land pattern) communicates to the PCB fabrication vendor the
shape and position of the copper patterns to which the TAS5780M device will be soldered. This footprint can be
followed directly from the guidance in the package addendum at the end of this data sheet. It is important to
make sure that the thermal pad, which connects electrically and thermally to the PowerPAD of the TAS5780M
device, be made no smaller than what is specified in the package addendum. This ensures that the TAS5780M
device has the largest interface possible to move heat from the device to the board.
The via pattern shown in the package addendum provides an improved interface to carry the heat from the
device through to the layers of the PCB, because small diameter plated vias (with minimally-sized annular rings)
present a low thermal-impedance path from the device into the PCB. Once into the PCB, the heat travels away
from the device and into the surrounding structures and air. By increasing the number of vias, as shown in the
Layout Example section, this interface can benefit from improved thermal performance.
注
Vias can obstruct heat flow if they are not constructed properly.
More notes on the construction and placement of vias as as follows:
•
•
Remove thermal reliefs on thermal vias, because they impede the flow of heat through the via.
Vias filled with thermally conductive material are best, but a simple plated via can be used to avoid the
additional cost of filled vias.
•
The diameter of the drull must be 8 mm or less. Also, the distance between the via barrel and the surrounding
planes should be minimized to help heat flow from the via into the surrounding copper material. In all cases,
minimum spacing should be determined by the voltages present on the planes surrounding the via and
minimized wherever possible.
•
•
Vias should be arranged in columns, which extend in a line radially from the heat source to the surrounding
area. This arrangement is shown in the Layout Example section.
Ensure that vias do not cut off power current flow from the power supply through the planes on internal
layers. If needed, remove some vias that are farthest from the TAS5780M device to open up the current path
to and from the device.
12.1.3.2.1.1 Solder Stencil
During the PCB assembly process, a piece of metal called a stencil on top of the PCB and deposits solder paste
on the PCB wherever there is an opening (called an aperture) in the stencil. The stencil determines the quantity
and the location of solder paste that is applied to the PCB in the electronic manufacturing process. In most
cases, the aperture for each of the component pads is almost the same size as the pad itself.
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Layout Guidelines (接下页)
However, the thermal pad on the PCB is large and depositing a large, single deposition of solder paste would
lead to manufacturing issues. Instead, the solder is applied to the board in multiple apertures, to allow the solder
paste to outgas during the assembly process and reduce the risk of solder bridging under the device. This
structure is called an aperture array, and is shown in the Layout Example section. It is important that the total
area of the aperture array (the area of all of the small apertures combined) covers between 70% and 80% of the
area of the thermal pad itself.
12.2 Layout Example
12.2.1 2.0 (Stereo BTL) System
图 88. 2.0 (Stereo BTL) 3-D View
82
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Layout Example (接下页)
图 89. 2.0 (Stereo BTL) Top Copper View
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Layout Example (接下页)
12.2.2 Mono (PBTL) System
图 90. Mono (PBTL) 3-D View
84
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Layout Example (接下页)
图 91. Mono (PBTL) Top Copper View
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Layout Example (接下页)
12.2.3 2.1 (Stereo BTL + Mono PBTL) Systems
图 92. 2.1 (Stereo BTL + Mono PBTL) 3-D View
86
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Layout Example (接下页)
图 93. 2.1 (Stereo BTL + Mono PBTL) Top Copper View
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13 Register Maps
13.1 Registers - Page 0
13.1.1 Register 1 (0x01)
Figure 94. Register 1 (0x01)
7
6
5
4
3
2
1
0
Reserved
R/W
RSTM
R/W
Reserved
R/W
RSTR
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 34. Register 1 (0x01) Field Descriptions
Bit
7-5
4
Field
Type
Reset
Description
Reserved
RSTM
Reserved
R/W
0
Reset Modules – This bit resets the interpolation filter and the DAC modules. Since the
DSP is also reset, the coeffient RAM content will also be cleared by the DSP. This bit
is auto cleared and can be set only in standby mode.
0: Normal
1: Reset modules
3-1
0
Reserved
RSTR
Reserved
R/W
0
Reset Registers – This bit resets the mode registers back to their initial values. The
RAM content is not cleared, but the execution source will be back to ROM. This bit is
auto cleared and must be set only when the DAC is in standby mode (resetting
registers when the DAC is running is prohibited and not supported).
0: Normal
1: Reset mode registers
13.1.2 Register 2 (0x02)
Figure 95. Register 2 (0x02)
7
6
5
4
3
2
1
0
DSPR
R/W
Reserved
R/W
RQST
R/W
Reserved
R/W
RQPD
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 35. Register 2 (0x02) Field Descriptions
Bit
Field
Type
Reset
Description
7
DSPR
R/W
1
DSP reset – When the bit is made 0, DSP will start powering up and send out data.
This needs to be made 0 only after all the input clocks are (ASI,MCLK,PLLCLK) are
settled so that DMA channels do not go out of sync.
0: Normal operation
1: Reset the DSP
6-5
4
Reserved
RQST
R/W
R/W
Reserved
0
Standby Request – When this bit is set, the DAC will be forced into a system standby
mode, which is also the mode the system enters in the case of clock errors. In this
mode, most subsystems will be powered down but the charge pump and digital power
supply.
0: Normal operation
1: Standby mode
3-1
Reserved
R/W
Reserved
88
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Table 35. Register 2 (0x02) Field Descriptions (continued)
Bit
Field
RQPD
Type
Reset
Description
0
R/W
0
Powerdown Request – When this bit is set, the DAC will be forced into powerdown
mode, in which the power consumption would be minimum as the charge pump is also
powered down. However, it will take longer to restart from this mode. This mode has
higher precedence than the standby mode, i.e. setting this bit along with bit 4 for
standby mode will result in the DAC going into powerdown mode.
0: Normal operation
1: Powerdown mode
13.1.3 Register 3 (0x03)
Figure 96. Register 3 (0x03)
7
6
5
4
3
2
1
0
SYNC
RO
SDZE
RO
SDZS
RO
RQML
R/W
Reserved
R/W
RQMR
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 36. Register 3 (0x03) Field Descriptions
Bit
Field
Type
Reset
Description
7
SYNC
RO
sync_sig_to_dig – This is the clock signal to BackEnd. The clock frequency when
device is running is 98.304 Mhz/1024 = 96 ksps
6
5
4
SDZE
SDZS
RQML
RO
RO
R/W
sdz_oe_to_dig – Backend IO buffer tristate signal. Will be asserted when LDO input
and LDO output PORs are both detected
0: SYNC and SDZ buffers are tristated
1: SYNC and SDZ buffers are enabled
sdz_sig_to_dig – Backend Power up signal. Will be asserted when AVDD & CPVDD
PORs are detected and Line amplifiers are unmuted
0: BackEnd is shutdown
1: BackEnd is powered up
0
0
Mute Left Channel – This bit issues soft mute request for the left channel. The volume
will be smoothly ramped down/up to avoid pop/click noise.
0: Normal volume
1: Mute
3-1
0
Reserved
RQMR
R/W
R/W
Reserved
Mute Right Channel – This bit issues soft mute request for the right channel. The
volume will be smoothly ramped down/up to avoid pop/click noise.
0: Normal volume
1: Mute
13.1.4 Register 4 (0x04)
Figure 97. Register 4 (0x04)
7
6
5
4
PLCK
R
3
2
1
0
PLLE
R
Reserved
R/W
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 37. Register 4 (0x04) Field Descriptions
Bit
7-5
4
Field
Type
R/W
R
Reset
Description
Reserved
PLCK
Reserved
0
PLL Lock Flag – This bit indicates whether the PLL is locked or not. When the PLL is
disabled this bit always shows that the PLL is not locked.
0: The PLL is locked
1: The PLL is not locked
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Table 37. Register 4 (0x04) Field Descriptions (continued)
Bit
3-1
0
Field
Type
R/W
R
Reset
Description
Reserved
PLLE
Reserved
1
PLL Enable – This bit enables or disables the internal PLL. When PLL is disabled, the
master clock will be switched to the MCLK.
0: Disable PLL
1: Enable PLL
13.1.5 Register 5 (0x05)
Figure 98. Register 5 (0x05)
7
6
5
4
3
2
1
0
Reserved
R/W
OSSL
RO
OSPD
RO
Reserved
R/W
OSAD
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 38. Register 5 (0x05) Field Descriptions
Bit
7-6
5
Field
Type
R/W
RO
Reset
Description
Reserved
OSSL
Reserved
Oscillator Clock Selected – This bit, when set, indicates that the internal oscillator is
being selected as the master clock and that the system is in emergency state where
the normal system clock is not available/reliable.
0: Oscillator clock is not selected
1: Oscillator clock is being selected
4
OSPD
RO
Oscillator Powerdown Status – This bit, when set, indicates that the oscillator is being
powered down, as a result of setting the oscillator to auto disable mode and the
oscillator clock is not needed/selected.
0: Oscillator is active
1: Oscillator is powered down
3-1
0
Reserved
OSAD
R/W
R/W
Reserved
1
Oscillator Auto Disable – This bit sets the oscillator to auto disable mode, in which the
oscillator is powered down when it is not needed anymore. By disabling the oscillator,
both power consumption and potential interference is reduced.
0: Oscillator is always active
1: Oscillator is auto disabled (Powered down when not in use)
13.1.6 Register 6 (0x06)
Figure 99. Register 6 (0x06)
7
6
5
4
3
2
1
0
Reserved
R/W
OI2C
R/W
DBPG
R/W
FRMD
R/W
FSMI
R/W
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 39. Register 6 (0x06) Field Descriptions
Bit
7-5
4
Field
Type
Reset
Description
Reserved
OI2C
Reserved
R/W
0
old_i2c_mode_reg_r – In Hans, I2C is always in auto increment mode. In old device
MSB during control word decides whether is auto-increment mode or not. Writing this
bit as 1 enables the older mode.
0: Register Auto increment enabled by default
1: Register auto increment mode enabled based on the MSB value sent during address
portion of I2C protocol
90
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Table 39. Register 6 (0x06) Field Descriptions (continued)
Bit
Field
Type
Reset
Description
3
DBPG
R/W
0
Page auto increment disable – Disable page auto increment mode. for non -zero
books. When end of page is reached it goes back to 8th address location of next page
when this bit is 0. When this bit is 1 it goes to 0 th location of current page itself like in
older part.
0: Enable Page auto increment
1: Disable Page auto increment
2
FRMD
R/W
0
SPI register read frame delay – When reading non-zero memory locations there is 1
frame delay between address and actual data. Which is read. By making this bit even
for book0 register read there will be 1 frame delay to make it consistent across all
books
0: No frame delay for SPI read for Book0 registers.
1: 1 frame delay for SPI read for Book0 registers.
1
0
FSMI
R/W
R/W
0
0
SPI MISO function sel:
00: SPI_MISO
01: GPIO3 Others: Reserved (Do not set)
Reserved
These bits select the function of the SPI_MISO pin when in SPI mode. If the pin is set
as GPIO, register readout via SPI is not possible.
13.1.7 Register 7 (0x07)
Figure 100. Register 7 (0x07)
7
6
5
4
3
2
1
0
Reserved
R/W
DEMP
R/W
Reserved
R/W
SDSL
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 40. Register 7 (0x07) Field Descriptions
Bit
7-5
4
Field
Type
R/W
R/W
Reset
Description
Reserved
DEMP
Reserved
0
De-Emphasis Enable – This bit enables or disables the de-emphasis filter. The default
coefficients are for 44.1 kHz sampling rate, but can be changed by reprogramming the
appropriate coeffients in RAM.
0: De-emphasis filter is disabled
1: De-emphasis filter is enabled
3-1
0
Reserved
SDSL
R/W
R/W
Reserved
0
SDOUT Select – This bit selects what is being output as SDOUT via GPIO pins.
0: SDOUT is the DSP output (post-processing)
1: SDOUT is the DSP input (pre-processing)
13.1.8 Register 8 (0x08)
Figure 101. Register 8 (0x08)
7
6
5
4
3
2
1
0
Reserved
R/W
G2OE
R/W
MUTEOE
R/W
G0OE
R/W
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
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Table 41. Register 8 (0x08) Field Descriptions
Bit
7-6
5
Field
Type
R/W
R/W
Reset
Description
Reserved
G2OE
Reserved
0
GPIO2 Output Enable – This bit sets the direction of the GPIO2
pin
0: GPIO2 is input
1: GPIO2 is output
4
3
MUTEOE
G0OE
R/W
R/W
0
0
MUTE Control Enable – This bit sets an enable of MUTE control
from PCM to TPA
0: MUTE control disable
1: MUTE control enable
GPIO0 Output Enable – This bit sets the direction of the GPIO0
pin
0: GPIO0 is input
1: GPIO0 is output
Reserved
2
Reserved
Reserved
R/W
R/W
0
0
1-0
Reserved
13.1.9 Register 9 (0x09)
Figure 102. Register 9 (0x09)
7
6
5
4
3
2
1
0
Reserved
R/W
SCLKP
R/W
SCLKO
R/W
Reserved
R/W
LRCLKFSO
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 42. Register 9 (0x09) Field Descriptions
Bit
7-6
5
Field
Type
Reset
Description
Reserved
SCLKP
Reserved
R/W
0
SCLK Polarity – This bit sets the inverted SCLK mode. In inverted SCLK mode, the
DAC assumes that the LRCLK and DIN edges are aligned to the rising edge of the
SCLK. Normally they are assumed to be aligned to the falling edge of the SCLK.
0: Normal SCLK mode
1: Inverted SCLK mode
4
SCLKO
R/W
0
SCLK Output Enable – This bit sets the SCLK pin direction to output for I2S master
mode operation. In I2S master mode the PCM51xx outputs the reference SCLK and
LRCLK, and the external source device provides the DIN according to these clocks.
Use P0-R32 to program the division factor of the MCLK to yield the desired SCLK rate
(normally 64 FS)
0: SCLK is input (I2S slave mode)
1: SCLK is output (I2S master mode)
3-1
0
Reserved
LRKO
Reserved
R/W
0
LRCLK Output Enable – This bit sets the LRCLK pin direction to output for I2S master
mode operation. In I2S master mode the PCM51xx outputs the reference SCLK and
LRCLK, and the external source device provides the DIN according to these clocks.
Use P0-R33 to program the division factor of the SCLK to yield 1 FS for LRCLK.
0: LRCLK is input (I2S slave mode)
1: LRCLK is output (I2S master mode)
13.1.10 Register 10 (0x0A)
92
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Figure 103. Register 10 (0x0A)
7
6
5
4
3
2
1
0
DSPG
R/W
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 43. Register 10 (0x0A) Field Descriptions
Bit
Field
Type
Reset
Description
7
DSPG
R/W
0
DSP GPIO Input – this 8 bit bus reaches the DSP input port.
DSP s/w can access these bits for getting any direct
control/input from host ny means of this register write
6-0
Reserved
R/W
0
Reserved
13.1.11 Register 12 (0x0C)
Figure 104. Register 12 (0x0C)
7
6
5
4
3
2
1
0
Reserved
R/W
RDSP
R/W
RDAC
R/W
RNCP
R/W
ROSR
R/W
RSYN
R/W
RSCLK
R/W
RLRK
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 44. Register 12 (0x0C) Field Descriptions
Bit
7
Field
Type
R/W
R/W
Reset
Description
Reserved
RDSP
Reserved
6
1
RST uCDSP clock – This bit, when set to 0 will reset the DSP clock divider and thus,
halt the DSP clock.
0: DSP clock divider is reset
1: DSP clock divider is functional
5
4
3
RDAC
RNCP
ROSR
R/W
R/W
R/W
1
1
1
RST DAC clock – This bit, when set to 0 will reset the DAC clock divider and thus, halt
the DAC clock and its derivatives.
0: DAC clock divider is reset
1: DAC clock divider is functional
RST NCP clock – This bit, when set to 0 will reset the OSR clock divider and thus, halt
the OSR clock.
0: OSR clock divider is reset
1: OSR clock divider is functional
RSTOSR clock – This bit, when set to 0 will reset the clock synchronizer and thus, halt
the DAC clock and its derivatives. When this bit is set to 1, the dividers un-reset will
take place synchronized to the beginning of audio frame.
0: DAC clock and its derivatives are stopped asynchronously
1: DAC clock and its derivatives started synchronized to the beginning of audio frame
2
1
0
RSYN
RSCLK
RLRK
R/W
R/W
R/W
1
0
1
RST clock sync – This bit, when set to 0 will reset the clock synchronizer and thus, halt
the DAC clock and its derivatives. When this bit is set to 1, the dividers un-reset will
take place synchronized to the beginning of audio frame.
0: DAC clock and its derivatives are stopped asynchronously
1: DAC clock and its derivatives started synchronized to the beginning of audio frame
Master Mode SCLK Divider Reset – This bit, when set to 0, will reset the MCLK divider
to generate SCLK clock for I2S master mode. To use I2S master mode, the divider
must be enabled and programmed properly.
0: Master mode SCLK clock divider is reset
1: Master mode SCLK clock divider is functional
Master Mode LRCLK Divider Reset – This bit, when set to 0, will reset the SCLK
divider to generate LRCLK clock for I2S master mode. To use I2S master mode, the
divider must be enabled and programmed properly.
0: Master mode LRCLK clock divider is reset
1: Master mode LRCLK clock divider is functional
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13.1.12 Register 13 (0x0D)
Figure 105. Register 13 (0x0D)
7
6
5
4
3
2
1
0
Reserved
R/W
SREF
R/W
SREF
R/W
Reserved
R/W
SDSP
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 45. Register 13 (0x0D) Field Descriptions
Bit
7
Field
Type
R/W
R/W
R/W
Reset
Description
Reserved
Reserved
SREF
6-5
4
0
0
PLL Reference:
SREF
DSP clock source – This bit select the source clock for internal PLL. This bit is ignored
and overriden in clock auto set mode.
0: The PLL reference clock is MCLK
1: The PLL reference clock is SCLK
010: The PLL reference clock is oscillator clock
011: The PLL reference clock is GPIO (selected using P0-R18)
Others: Reserved (PLL reference is muted)
3
Reserved
SDSP
R/W
R/W
Reserved
2-0
0
DAC clock source – These bits select the source clock for DSP clock divider.
000: Master clock (PLL/MCLK and OSC auto-select)
001: PLL clock
010: OSC clock
011: MCLK clock
100: SCLK clock
101: GPIO (selected using P0-R16)
Others: Reserved (muted)
94
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13.1.13 Register 14 (0x0E)
Figure 106. Register 14 (0x0E)
7
6
5
4
3
2
1
0
Reserved
R/W
SDAC
R/W
Reserved
R/W
SOSR
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 46. Register 14 (0x0E) Field Descriptions
Bit
7
Field
Type
R/W
R/W
Reset
Description
Reserved
SDAC
0
0
Reserved
6-4
DAC clock source – These bits select the source clock for DAC clock divider.
000: Master clock (PLL/MCLK and OSC auto-select)
001: PLL clock 010: OSC clock
011: MCLK clock
100: SCLK clock
101: GPIO (selected using P0-R16)
Others: Reserved (muted)
3
Reserved
SOSR
R/W
R/W
0
0
Reserved
2-0
OSR clock source – These bits select the source clock for OSR clock divider.
000: DAC clock
001: Master clock (PLL/MCLK and OSC auto-select)
010: PLL clock
011: OSC clock
100: MCLK clock
101: SCLK clock
110: GPIO (selected using P0-R17)
Others: Reserved (muted)
13.1.14 Register 15 (0x0F)
Figure 107. Register 15 (0x0F)
7
6
5
4
3
2
1
0
Reserved
R/W
SNCP
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 47. Register 15 (0x0F) Field Descriptions
Bit
7-3
2-0
Field
Type
R/W
R/W
Reset
Description
Reserved
SNCP
Reserved
0
NCP clock source – These bits select the source clock for CP clock divider.
000: DAC clock
001: Master clock (PLL/MCLK and OSC auto-select)
010: PLL clock
011: OSC clock
100: MCLK clock
101: SCLK clock
110: GPIO (selected using P0-R17)
Others: Reserved (muted)
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13.1.15 Register 16 (0x10)
Figure 108. Register 16 (0x10)
7
6
5
4
3
2
1
0
Reserved
R/W
GDSP
R/W
Reserved
R/W
GDAC
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 48. Register 16 (0x10) Field Descriptions
Bit
7
Field
Type
R/W
R/W
Reset
Description
Reserved
GDSP
0
0
Reserved
6-4
GPIO Source for uCDSP clk – These bits select the GPIO pins as clock input source
when GPIO is selected as DSP clock divider source.
000: N/A
001: N/A
010: N/A
011: GPIO0
100: N/A
101: GPIO2
Others: Reserved (muted)
3
Reserved
GDAC
R/W
R/W
0
0
Reserved
2-0
GPIO Source for DAC clk – These bits select the GPIO pins as clock input source
when GPIO is selected as DAC clock divider source.
000: N/A
001: N/A
010: N/A
011: GPIO0
100: N/A
101: GPIO2
Others: Reserved (muted)
96
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13.1.16 Register 17 (0x11)
Figure 109. Register 17 (0x11)
7
6
5
4
3
2
1
0
Reserved
R/W
GNCP
R/W
Reserved
R/W
GOSR
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 49. Register 17 (0x11) Field Descriptions
Bit
7
Field
Type
R/W
R/W
Reset
Description
Reserved
GNCP
0
0
Reserved
6-4
GPIO Source for NCP clk – These bits select the GPIO pins as clock input source
when GPIO is selected as CP clock divider source
000: N/A
001: N/A
010: Reserved
011: GPIO0
100: N/A
101: GPIO2
Others: Reserved (muted)
3
Reserved
GOSR
R/W
R/W
0
0
Reserved
2-0
GPIO Source for OSR clk – These bits select the GPIO pins as clock input source
when GPIO is selected as OSR clock divider source.
000: N/A
001: N/A
010: Reserved
011: GPIO0
100: N/A
101: GPIO2
Others: Reserved (muted)
13.1.17 Register 18 (0x12)
Figure 110. Register 18 (0x12)
7
6
5
4
3
2
1
0
Reserved
R/W
GREF
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 50. Register 18 (0x12) Field Descriptions
Bit
7-3
2-0
Field
Type
R/W
R/W
Reset
Description
Reserved
GREF
0
0
Reserved
GPIO Source for PLL reference clk – These bits select the GPIO pins as clock input
source when GPIO is selected as the PLL reference clock source.
000: N/A
001: N/A
010: Reserved
011: GPIO0
100: N/A
101: GPIO2
Others: Reserved (muted)
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13.1.18 Register 19 (0x13)
Figure 111. Register 19 (0x13)
7
6
5
4
3
2
1
0
Reserved
R/W
AREN
R/W
Reserved
R/W
RQSY
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 51. Register 19 (0x13) Field Descriptions
Bit
7-5
4
Field
Type
R/W
R/W
Reset
Description
Reserved
AREN
Reserved
1
Auto resync enable – This bits enables or disables the DAC/CP clock auto
resynchronization with the beginning of audio frame. When enabled, the
resynchronization is carried out just before the DAC transitions from standby mode to
normal operation mode.
0: Auto resynchronization is disabled
1: Auto resynchronization is enabled
3-1
0
Reserved
RQSY
R/W
R/W
Reserved
0
This bit, when set to 1 will issue the clock resynchronization by synchronously resets
the DAC, CP and OSR clocks.
The actual clock resynchronization takes place when this bit is set back to 0, where the
DAC, CP and OSR clocks are resumed at the beginning of the audio frame.
0: Resume DAC, CP and OSR clocks synchronized to the beginning of audio frame
1: Halt DAC, CP and OSR clocks as the beginning of resynchronization process
13.1.19 Register 20 (0x14)
Figure 112. Register 20 (0x14)
7
6
5
4
3
2
1
0
Reserved
R/W
PPDV
R/W
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 52. Register 20 (0x14) Field Descriptions
Bit
7
Field
Type
R/W
R/W
Reset
Description
Reserved
PPDV
0
0
Reserved
6-3
PLL P – These bits set the PLL divider P factor. These bits are ignored in clock auto
set mode.
0000: P=1
0001: P=2
...
1110: P=15
1111: Prohibited (do not set this value)
2-1
0
Reserved
Reserved
R/W
R/W
0
1
Reserved
Reserved
98
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13.1.20 Register 21 (0x15)
Figure 113. Register 21 (0x15)
7
6
5
4
3
2
1
0
Reserved
R/W
PJDV
R/W
Reserved
R/W
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 53. Register 21 (0x15) Field Descriptions
Bit
7-6
5-4
Field
Type
Reset
Description
Reserved
PJDV
0
0
Reserved
P/W
PLL J – These bits set the J part of the overall PLL multiplication factor J.D * R.
These bits are ignored in clock auto set mode.
000000: Prohibited (do not set this value)
000001: J=1
000010: J=2
...
111111: J=63
3
P/W
P/W
1
0
Reserved
Reserved
2-0
13.1.21 Register 22 (0x16)
Figure 114. Register 22 (0x16)
7
6
5
4
3
2
1
0
Reserved
R/W
PDDV
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 54. Register 22 (0x16) Field Descriptions
Bit
7-6
5-0
Field
Type
R/W
R/W
Reset
Description
Reserved
PDDV
Reserved
0
PLL D (MSB) – These bits set the D part of the overall PLL multiplication factor J.D * R.
These bits are ignored in clock auto set mode.
0 (in decimal): D=0000
1 (in decimal): D=0001
...
9999 (in decimal): D=9999
Others: Prohibited (do not set)
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13.1.22 Register 23 (0x17)
Figure 115. Register 23 (0x17)
7
6
5
4
3
2
1
0
PDDV
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 55. Register 23 (0x17) Field Descriptions
Bit
Field
Type
Reset
Description
7-0
PDDV
R/W
0
PLL D (LSB) – These bits set the D part of the overall PLL multiplication factor J.D * R.
These bits are ignored in clock auto set mode.
0 (in decimal): D=0000
1 (in decimal): D=0001
...
9999 (in decimal): D=9999
Others: Prohibited (do not set)
13.1.23 Register 24 (0x18)
Figure 116. Register 24 (0x18)
7
6
5
4
3
2
1
0
Reserved
R/W
PRDV
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 56. Register 24 (0x18) Field Descriptions
Bit
7-4
3-0
Field
Type
R/W
R/W
Reset
Description
Reserved
PRDV
Reserved
0
PLL R – These bits set the R part of the overall PLL multiplication factor J.D * R. These
bits are ignored in clock auto set mode.
0000: R=1
0001: R=2
...
1111: R=16
100
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13.1.24 Register 25 (0x19)
Figure 117. Register 25 (0x19)
7
6
5
4
3
2
1
0
PLCT
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 57. Register 25 (0x19) Field Descriptions
Bit
Field
Type
Reset
Description
7-0
PLCT
R/W
0
PLL Lock Count – These bits set the number of consecutive PLL lock flags counted by
the feedback clock before PLL is declared locked.
The count value is updated when addr 26 is written, so it is recommended to update
addr 25 first and then addr 26.
13.1.25 Register 26 (0x1A)
Figure 118. Register 26 (0x1A)
7
6
5
4
3
2
1
0
PLCT
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 58. Register 26 (0x1A) Field Descriptions
Bit
7
Field
Type
R/W
R/W
Reset
Description
PLCT
1
0
PLL Lock Count – These bits set the number of consecutive PLL lock flags counted by
the feedback clock before PLL is declared locked.
6-0
The count value is updated when addr 26 is written, so it is recommended to update
addr 25 first and then addr 26.
13.1.26 Register 27 (0x1B)
Figure 119. Register 27 (0x1B)
7
6
5
4
3
2
1
0
Reserved
R/W
DDSP
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 59. Register 27 (0x1B) Field Descriptions
Bit
7
Field
Type
R/W
R/W
Reset
Description
Reserved
DDSP
Reserved
6-0
0
DSP Clock Divider – These bits set the source clock divider value for the DSP clock.
These bits are ignored in clock auto set mode.
0000000: Divide by 1
0000001: Divide by 2
...
1111111: Divide by 128
13.1.27 Register 28 (0x1C)
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Figure 120. Register 28 (0x1C)
7
6
5
4
3
2
1
0
Reserved
R/W
DDAC
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 60. Register 28 (0x1C) Field Descriptions
Bit
7
Field
Type
Reset
Description
Reserved
DDAC
Reserved
6-4
3-0
R/W
R/W
0
1
DAC Clock Divider – These bits set the source clock divider value for the DAC clock.
These bits are ignored in clock auto set mode.
0000000: Divide by 1
0000001: Divide by 2
...
1111111: Divide by 128
13.1.28 Register 29 (0x1D)
Figure 121. Register 29 (0x1D)
7
6
5
4
3
2
1
0
Reserved
R/W
DNCP
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 61. Register 29 (0x1D) Field Descriptions
Bit
7
Field
Type
Reset
Description
Reserved
DNCP
Reserved
6-2
1-0
R/W
R/W
0
1
NCP Clock Divider – These bits set the source clock divider value for the CP clock.
These bits are ignored in clock auto set mode.
0000000: Divide by 1
0000001: Divide by 2
...
1111111: Divide by 128
13.1.29 Register 30 (0x1E)
Figure 122. Register 30 (0x1E)
7
6
5
4
3
2
1
0
Reserved
R/W
DOSR
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 62. Register 30 (0x1E) Field Descriptions
Bit
7
Field
Type
Reset
Description
Reserved
DOSR
Reserved
6-4
5-0
R/W
R/W
0
1
OSR Clock Divider – These bits set the source clock divider value for the OSR clock.
These bits are ignored in clock auto set mode.
0000000: Divide by 1
0000001: Divide by 2
...
1111111: Divide by 128
102
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13.1.30 Register 31 (0x1F)
Figure 123. Register 31 (0x1F)
7
6
5
4
3
2
1
0
Reserved
R/W
DOFS
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 63. Register 31 (0x1F) Field Descriptions
Bit
7
Field
Type
Reset
Description
Reserved
DOFS
Reserved
6-3
2
R/W
R/W
R/W
0
1
0
Offset calibrator clock div – These bits set the source clock divider value for the offset
calibrator
0000000: Divide by 1
0000001: Divide by 2
...
1-0
1111111: Divide by 128
13.1.31 Register 32 (0x20)
Figure 124. Register 32 (0x20)
7
6
5
4
3
2
1
0
Reserved
R/W
DSCLK
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 64. Register 32 (0x20) Field Descriptions
Bit
7
Field
Type
R/W
R/W
Reset
Description
Reserved
DSCLK
Reserved
6-0
0
Master Mode SCLK Divider – These bits set the MCLK divider value to generate I2S
master SCLK clock.
0000000: Divide by 1
0000001: Divide by 2
...
1111111: Divide by 128
13.1.32 Register 33 (0x21)
Figure 125. Register 33 (0x21)
7
6
5
4
3
2
1
0
DLRK
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 65. Register 33 (0x21) Field Descriptions
Bit
Field
Type
Reset
Description
7-0
DLRK
R/W
0
Master Mode LRCLK Divider – These bits set the I2S master SCLK clock divider value
to generate I2S master LRCLK clock
00000000: Divide by 1
00000001: Divide by 2
...
11111111: Divide by 256
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13.1.33 Register 34 (0x22)
Figure 126. Register 34 (0x22)
7
6
5
4
3
2
1
0
Reserved
R/W
I16E
R/W
Reserved
R/W
FSSP
R/W
FSSP
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 66. Register 34 (0x22) Field Descriptions
Bit
7-5
4
Field
Type
R/W
R/W
Reset
Description
Reserved
I16E
Reserved
0
16x Interpolation – This bit enables or disables the 16x interpolation mode
0: 8x interpolation
1: 16x interpolation
3
2
Reserved
FSSP
R/W
R/W
R/W
Reserved
1
0
FS Speed Mode – These bits select the FS operation mode, which must be set
according to the current audio sampling rate. These bits are ignored in clock auto set
mode.
1-0
000: Reserved
001: Reserved
010: Reserved
011: 48 kHz
100: 88.2-96 kHz
101: Reserved
110: Reserved
111: 32kHz
13.1.34 Register 35 (0x23)
Figure 127. Register 35 (0x23)
7
6
5
4
3
2
1
0
INTFLAG
R
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 67. Register 35 (0x23) Field Descriptions
Bit
7-1
0
Field
Type
R/W
R
Reset
Description
Reserved
0
0
Reserved
Pin interrupt sticky flag – Sticky flag that reflects the pin interrupt value. Once read pin
interrupt and this register will automatically reset to 0. To mask which all faults/errors
can generate this interrupt use B0_P0_R45.
0: interrupt de-asserted
1: interrupt asserted
104
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13.1.35 Register 37 (0x25)
Figure 128. Register 37 (0x25)
7
6
5
4
3
2
1
0
Reserved
R/W
IDFS
R/W
IDBK
R/W
IDSK
R/W
IDCH
R/W
IDCM
R/W
DCAS
R/W
IPLK
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 68. Register 37 (0x25) Field Descriptions
Bit
7
Field
Type
R/W
R/W
Reset
Description
Reserved
IDFS
Reserved
6
0
Ignore FS Detection – This bit controls whether to ignore the FS detection. When
ignored, FS error will not cause a clock error.
0: Regard FS detection
1: Ignore FS detection
5
4
3
2
IDBK
IDSK
IDCH
IDCM
R/W
R/W
R/W
R/W
0
0
0
0
Ignore SCLK Detection – This bit controls whether to ignore the SCLK detection
against LRCLK. The SCLK must be stable between 32 FS and 256 FS inclusive or an
error will be reported. When ignored, a SCLK error will not cause a clock error.
0: Regard SCLK detection
1: Ignore SCLK detection
Ignore MCLK Detection – This bit controls whether to ignore the MCLK detection
against LRCLK. Only some certain MCLK ratios within some error margin are allowed.
When ignored, an MCLK error will not cause a clock error.
0: Regard MCLK detection
1: Ignore MCLK detection
Ignore Clock Halt Detection – This bit controls whether to ignore the MCLK halt (static
or frequency is lower than acceptable) detection. When ignored an MCLK halt will not
cause a clock error.
0: Regard MCLK halt detection
1: Ignore MCLK halt detection
Ignore LRCLK/SCLK Missing Detection – This bit controls whether to ignore the
LRCLK/SCLK missing detection. The LRCLK/SCLK need to be in low state (not only
static) to be deemed missing. When ignored an LRCLK/SCLK missing will not cause
the DAC go into powerdown mode.
0: Regard LRCLK/SCLK missing detection
1: Ignore LRCLK/SCLK missing detection
1
DCAS
R/W
0
Disable Clock Divider Autoset – This bit enables or disables the clock auto set mode.
When dealing with uncommon audio clock configuration, the auto set mode must be
disabled and all clock dividers must be set manually.
Addtionally, some clock detectors might also need to be disabled. The clock autoset
feature will not work with PLL enabled in VCOM mode. In this case this feature has to
be disabled and the clock dividers must be set manually.
0: Enable clock auto set
1: Disable clock auto set
0
IPLK
R/W
0
Ignore PLL Lock Detection – This bit controls whether to ignore the PLL lock detection.
When ignored, PLL unlocks will not cause a clock error. The PLL lock flag at P0-R4, bit
4 is always correct regardless of this bit.
0: PLL unlocks raise clock error
1: PLL unlocks are ignored
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13.1.36 Register 38 (0x26)
Figure 129. Register 38 (0x26)
7
6
5
4
3
2
1
0
BKCG
R/W
BKCB
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 69. Register 38 (0x26) Field Descriptions
Bit
Field
Type
Reset
Description
7-4
BKCG
R/W
1
BCLK count to good – These bits specify the number of consecutive valid SCLK counts
in LRCLK until the SCLK is deemed good. To be valid, the SCLK counts in LRCLK
should be between 32 and 256 inclusive and match the count at previous audio frame.
0000: One consecutive LRCLK
0001: Two consecutive LRCLKs
...
1111: 16 consecutive LRCLKs
3-2
1-0
BKCB
R/W
R/W
0
1
BCLK count to bad – These bits specify the number of consecutive invalid SCLK
counts in LRCLK until the SCLK is deemed bad. To be valid, the SCLK counts in
LRCLK should be between 32 and 256 inclusive and match the count at previous audio
frame.
0000: One consecutive LRCLK
0001: Two consecutive LRCLKs
...
1111: 16 consecutive LRCLKs
13.1.37 Register 39 (0x27)
Figure 130. Register 39 (0x27)
7
6
5
4
3
2
1
0
Reserved
R/W
MCLKT
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 70. Register 39 (0x27) Field Descriptions
Bit
7-5
4-3
2
Field
Type
R/W
R/W
R/W
R/W
Reset
Description
Reserved
MCLKT
Reserved
0
1
0
MCLK tolerance – These bits specify the tolerance for MCLK counts in LRCLK. When
the MCLK count in LRCLK matches any valid ratio within this tolerance, it will be
deemed good
1-0
00000: tolerate ± 0 count
00001: tolerate ± 1 count
…
11111: tolerate ± 31 counts
106
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13.1.38 Register 40 (0x28)
Figure 131. Register 40 (0x28)
7
6
5
4
3
2
1
0
Reserved
R/W
AFMT
R/W
Reserved
R/W
ALEN
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 71. Register 40 (0x28) Field Descriptions
Bit
7-6
5-4
Field
–
Type
Reset
Description
AFMT
R/W
0
I2S Data Format – These bits control both input and output audio interface formats for
DAC operation.
00: I2S
01: DSP
10: RTJ
11: LTJ
3-2
1
Reserved
ALEN
R/W
R/W
R/W
Reserved
1
0
I2S Word Length – These bits control both input and output audio interface sample
word lengths for DAC operation.
0
00: 16 bits
01: 20 bits
10: 24 bits
11: 32 bits
13.1.39 Register 41 (0x29)
Figure 132. Register 41 (0x29)
7
6
5
4
3
2
1
0
AOFS
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 72. Register 41 (0x29) Field Descriptions
Bit
Field
Type
Reset
Description
7-0
AOFS
R/W
0
I2S Shift – These bits control the offset of audio data in the audio frame for both input
and output. The offset is defined as the number of SCLK from the starting (MSB) of
audio frame to the starting of the desired audio sample.
00000000: offset = 0 SCLK (no offset)
00000001: ofsset = 1 SCLK
00000010: offset = 2 SCLKs
…
11111111: offset = 256 SCLKs
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13.1.40 Register 42 (0x2A)
Figure 133. Register 42 (0x2A)
7
6
5
4
3
2
1
0
Reserved
R/W
AUPL
R/W
Reserved
R/W
AUPR
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 73. Register 42 (0x2A) Field Descriptions
Bit
7-6
5
Field
Type
R/W
R/W
R/W
Reset
Description
Reserved
AUPL
Reserved
0
1
Left DAC Data Path – These bits control the left channel audio data path connection.
00: Zero data (mute)
01: Left channel data
10: Right channel data
11: Reserved (do not set)
4
3-2
1
Reserved
AUPR
R/W
R/W
R/W
Reserved
0
1
Right DAC Data Path – These bits control the right channel audio data path
connection.
0
00: Zero data (mute)
01: Right channel data
10: Left channel data
11: Reserved (do not set)
13.1.41 Register 43 (0x2B)
Figure 134. Register 43 (0x2B)
7
6
5
4
3
2
1
0
Reserved
R/W
PSEL
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 74. Register 43 (0x2B) Field Descriptions
Bit
7-5
4-1
0
Field
Type
R/W
R/W
R/W
Reset
Description
Reserved
PSEL
Reserved
0
1
DSP Program Selection – These bits select the DSP program to use for audio
processing.
00000: Reserved
00001: Rom Mode 1
00010: Reserved
00011: Reserved
108
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13.1.42 Register 44 (0x2C)
Figure 135. Register 44 (0x2C)
7
6
5
4
3
2
1
0
Reserved
R/W
CLKM
R/W
CMDP
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 75. Register 44 (0x2C) Field Descriptions
Bit
7-4
3
Field
Type
Reset
Description
Reserved
CLKM
Reserved
R/W
1
clk_missing_mode_hans_reg_r – Fallback option to change clock missing detection to
older PCM device. In Hans clock missing is detected whenever either BCLK or LRCLK
go missing. In older PCM device clock missing is detected whenever LRCLK or BCLK
are stuck to 1.
0 : Old mode of ASI clock missing detection
1: Hans mode of ASI clock missing detect
2-0
CMDP
R/W
0
Clock Missing Detection Period – These bits set how long both SCLK and LRCLK keep
low before the audio clocks deemed missing and the DAC transitions to powerdown
mode.
000: about 1 second
001: about 2 seconds
010: about 3 seconds
...
111: about 8 seconds
13.1.43 Register 45 (0x2D)
Figure 136. Register 45 (0x2D)
7
6
5
4
3
2
1
0
MSKP
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 76. Register 45 (0x2D) Field Descriptions
Bit
Field
Type
Reset
Description
7-0
MSKP
R/W
1
Mask for Pin interrupt generated by device (?)
To mask and selectively use the required faults alone to generate the interrupt
0 : No interrupt generated
1 : Allow interrupt to be generated
1 : No interrupt generated
1 : Allow interrupt to be generated
2 : No interrupt generated
1 : Allow interrupt to be generated
3 : No interrupt generated
1 : Allow interrupt to be generated
4 : No interrupt generated
1 : Allow interrupt to be generated
5 : No interrupt generated
1 : Allow interrupt to be generated
Mask for Pin interrupt generated by device (short-flag)
6 : No interrupt generated
1 : Allow interrupt to be generated
Mask for Pin interrupt generated by device (dsp_interrupt)
7 : No interrupt generated
1 : Allow interrupt to be generated
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13.1.44 Register 46 (0x2E)
Figure 137. Register 46 (0x2E)
7
6
5
4
3
2
1
0
Reserved
R/W
SDZF
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 77. Register 46 (0x2E) Field Descriptions
Bit
7-1
0
Field
Type
R/W
R/W
Reset
Description
Reserved
SDZF
Reserved
1
Disable Force shutdown of Backend – This controls the Backed device shutdown
signal. When it is programmed 0 backend devi ce will be shutdown.
0 : Force shutdown of Backend
1 : Disable force shutdown of Backend
13.1.45 Register 47 (0x2F)
Figure 138. Register 47 (0x2F)
7
6
5
4
3
2
1
0
Reserved
R/W
DLSH
R/W
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 78. Register 47 (0x2F) Field Descriptions
Bit
7-6
5
Field
Type
R/W
R/W
Reset
Description
Reserved
DLSH
Reserved
0
Disable Last Sample Hold – This bit controls whether to hold the last sample at audio
interface in the event of clock error. The last known good sample is held to prevent
errorneous samples to flow through the DAC.
0: Enable last sample hold
1: Disable last sample hold
4-0
Reserved
R/W
Reserved
110
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ZHCSFY4 –DECEMBER 2016
13.1.46 Register 48 (0x30)
Figure 139. Register 48 (0x30)
7
6
5
4
3
2
1
0
Reserved
R/W
EDINT
R/W
INTSTAT
R/W
INTGPIO
R/W
DBCLK
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 79. Register 48 (0x30) Field Descriptions
Bit
7
Field
Type
Reset
Description
Reserved
EDINT
Reserved
6
R/W
1
Edge detection of pin interrupt input – this bit controls whether to detect a positive edge
and send interrupt to dsp or reflect the pin value at the dsp_interrupt port
0: disable positive edge detect
1: enable positive edge detect
5
INTSTAT
INTGPIO
R/W
R/W
0
0
Enable active low for input pin interrupt – This controls whether input pin interrupt is
active low or active high.
0 : input pin interrupt is active high
1 : input pin interrupt is active low
4-2
GPIO for input pin interrupt – these bits control which GPIO to be used as the input pin
interrupt
000: pin interrupt disabled
001: pin interrupt = Input from RESERVED
010: pin interrupt = Input from RESERVED
011: Reserved
100: pin interrupt = Input from GPIO0
101: pin interrupt = Input from RESERVED
110: pin interrupt = Input from GPIO2
111: reserved
1-0
DBCLK
R/W
0
Pin debounce clock select – selects the clk frequency to be used for deboucing glitches
on pin before detecting a flip on the pin ( debouncing is done for 4 clock cycles of this
selected clock)
00: approx 1 ms clk used for debouncing
01: approx 500 µs clk used for debouncing
10: approx 125 µs clk used for debouncing
11: oscillator clk used for debouncing
13.1.47 Register 49 (0x31)
Figure 140. Register 49 (0x31)
7
6
5
4
3
2
1
0
Reserved
R/W
GSPGPI2
R/W
Reserved
R/W
GSPGPI0
R/W
GSPGPI1
R/W
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 80. Register 49 (0x31) Field Descriptions
Bit
7
Field
Type
R/W
R/W
Reset
Description
Reserved
GSPGPI2
0
0
Reserved
6
Enable GPIO2 value to propagate to DSP – Each bit when set high allows the
corresponding GPIO pin value to propagate to DSP as an input port bus
0 : GPIO2 value will not propagate to DSP
1 : GPIO2 value is allowed to propagate to DSP
5
4
Reserved
GSPGPI0
R/W
R/W
Reserved
0
Enable GPIO0 value to propagate to DSP – Each bit when set high allows the
corresponding GPIO pin value to propagate to DSP as an input port bus
0 : GPIO0 value will not propagate to DSP
1 : GPIO0 value is allowed to propagate to DSP
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Table 80. Register 49 (0x31) Field Descriptions (continued)
Bit
Field
Type
Reset
Description
3-0
Reserved
R/W
Reserved
13.1.48 Register 50 (0x32)
Figure 141. Register 50 (0x32)
7
6
5
4
3
2
1
0
Reserved
R/W
DSPMEM
R/W
DSPCOEF
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 81. Register 50 (0x32) Field Descriptions
Bit
7-2
1
Field
Type
R/W
R/W
Reset
Description
Reserved
DSPMEM
0
0
Reserved
DSP boots from IRAM – When set DSP will boot from IRAM instead of IROM
0: boot DSP from IROM
1: boot DSP from IRAM
0
DSPCOEF
R/W
Use default coefficients from ZROM – This bit controls whether to use default
coefficients from ZROM or use the non-default coefficients downloaded to device by
the Host
0 : don't use default coefficients from ZROM
1 : use default coefficents from ZROM
112
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ZHCSFY4 –DECEMBER 2016
13.1.49 Register 51 (0x33)
Figure 142. Register 51 (0x33)
7
6
5
4
3
2
1
0
Reserved
R/W
DSPINT
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 82. Register 51 (0x33) Field Descriptions
Bit
7-1
0
Field
Type
R/W
R/W
Reset
Description
Reserved
DSPINT
Reserved
Interrupt DSP – This bit can be set to generate an interrupt to DSP. Once the DSP
acknowledges this interrupt this bit will be automatically cleared
0: normal
1 : generate interrupt to DSP
13.1.50 Register 52 (0x34)
Figure 143. Register 52 (0x34)
7
6
5
4
3
2
1
0
Reserved
R/W
DSPRMEM
R/W
MEMCRYP
R/W
MEMCRC
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 83. (Register 52 (0x34) Field Descriptions
Bit
7-4
3
Field
Type
R/W
R/W
Reset
Description
Reserved
DSPRMEM
0
0
Reserved
Enable read from IRAM,IROM,ZROM – This bit controls whether to allow reads to
IRAM, IROM and ZROM . When this bit is zero , read request to these memories will
give out a 0
0 : dis-allow read from IRAM,IROM and ZROM
1 : all reads from IRAM, IROM and ZROM
2
MEMCRYP
MEMCRC
R/W
R/W
0
0
Disable decryption – This bit controls whether to disable or enable decryption on the
content that is downloaded by Host into IRAM
0 : enable decryption
1 : disable decryption
1-0
CRC seed selection for Decryption – These bits control which seed to use for CRC
based decryption logic.
00 : use A5 hex as seed
01 : use B6 hex as seed
10 : use 94 hex as seed
11 : use E2 hex as seed
13.1.51 Register 53 (0x35)
Figure 144. Register 53 (0x35)
7
6
5
4
3
2
1
0
Reserved
R/W
RSTD
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
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Table 84. Register 53 (0x35) Field Descriptions
Bit
7-1
0
Field
Type
R/W
WO
Reset
Description
Reserved
RSTD
Reserved
0
Reset decryption block – Setting this bit to '1' resets the decryption block and
reinitializes the CRC with the CRC seed. It is a self clearing bit.
'1' -> reset the decryption block
'0' -> decryption block is not reset
13.1.52 Register 59 (0x3B)
Figure 145. Register 59 (0x3B)
7
6
5
4
3
2
1
0
Reserved
R/W
AMTL
R/W
Reserved
R/W
AMTR
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 85. Register 59 (0x3B) Field Descriptions
Bit
7
Field
Type
R/W
R/W
Reset
Description
Reserved
AMTL
Reserved
6-4
0
Auto Mute Time for Left Channel – These bits specify the length of consecutive zero
samples at left channel before the channel can be auto muted. The times shown are
for 96 kHz sampling rate and will scale with other rates.
000: 11.5 ms
001: 53 ms
010: 106.5 ms
011: 266.5 ms
100: 0.535 sec
101: 1.065 sec
110: 2.665 sec
111: 5.33 sec
3
Reserved
AMTR
R/W
R/W
Reserved
2-0
0
Auto Mute Time for Right Channel – These bits specify the length of consecutive zero
samples at right channel before the channel can be auto muted. The times shown are
for 96 kHz sampling rate and will scale with other rates.
000: 11.5 ms
001: 53 ms
010: 106.5 ms
011: 266.5 ms
100: 0.535 sec
101: 1.065 sec
110: 2.665 sec
111: 5.33 sec
13.1.53 Register 60 (0x3C)
Figure 146. Register 60 (0x3C)
7
6
5
4
3
2
1
0
Reserved
R/W
PCTL
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
114
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ZHCSFY4 –DECEMBER 2016
Table 86. Register 60 (0x3C) Field Descriptions
Bit
7-2
1-0
Field
Type
R/W
R/W
Reset
Description
Reserved
PCTL
0
0
Reserved
Digital Volume Control – These bits control the behavior of the digital volume.
00: The volume for Left and right channels are independent
01: Right channel volume follows left channel setting
13.1.54 Register 61 (0x3D)
Figure 147. Register 61 (0x3D)
7
6
5
4
3
2
1
0
VOLL
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 87. Register 61 (0x3D) Field Descriptions
Bit
Field
Type
Reset
Description
7-0
VOLL
R/W
0001000 Left Digital Volume – These bits control the left channel digital volume. The digital
0
volume is 24 dB to –103 dB in –0.5 dB step.
00000000: +24.0 dB
00000001: +23.5 dB
…
00101111: +0.5 dB
00110000: 0.0 dB
00110001: –0.5 dB
...
11111110: –103 dB
11111111: Mute
13.1.55 Register 62 (0x3E)
Figure 148. Register 62 (0x3E)
7
6
5
4
3
2
1
0
VOLR
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 88. Register 62 (0x3E) Field Descriptions
Bit
Field
Type
Reset
Description
7-0
VOLR
R/W
0011000 Right Digital Volume – These bits control the right channel digital volume. The digital
0
volume is 24 dB to –103 dB in –0.5 dB step.
00000000: +24.0 dB
00000001: +23.5 dB
…
00101111: +0.5 dB
00110000: 0.0 dB
00110001: –0.5 dB
...
11111110: –103 dB
11111111: Mute
13.1.56 Register 63 (0x3F)
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Figure 149. Register 63 (0x3F)
7
6
5
4
3
2
1
0
VNDF
R/W
VNDS
R/W
VNUF
R/W
VNUS
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 89. Register 63 (0x3F) Field Descriptions
Bit
Field
Type
Reset
Description
7-6
VNDF
R/W
0
Digital Volume Normal Ramp Down Frequency – These bits control the frequency of
the digital volume updates when the volume is ramping down. The setting here is
applied to soft mute request, asserted by XSMUTE pin or P0-R3.
00: Update every 1 FS period
01: Update every 2 FS periods
10: Update every 4 FS periods
11: Directly set the volume to zero (Instant mute)
5-4
3-2
1-0
VNDS
VNUF
VNUS
R/W
R/W
R/W
1
0
1
Digital Volume Normal Ramp Down Step – These bits control the step of the digital
volume updates when the volume is ramping down.
The setting here is applied to soft mute request, asserted by XSMUTE pin or P0-R3.
00: Decrement by 4 dB for each update
01: Decrement by 2 dB for each update
10: Decrement by 1 dB for each update
11: Decrement by 0.5 dB for each update
Digital Volume Normal Ramp Up Frequency – These bits control the frequency of the
digital volume updates when the volume is ramping up.
The setting here is applied to soft unmute request, asserted by XSMUTE pin or P0-R3.
00: Update every 1 FS period
01: Update every 2 FS periods
10: Update every 4 FS periods
11: Directly restore the volume (Instant unmute)
Digital Volume Normal Ramp Up Step – These bits control the step of the digital
volume updates when the volume is ramping up.
The setting here is applied to soft unmute request, asserted by XSMUTE pin or P0-R3.
00: Increment by 4 dB for each update
01: Increment by 2 dB for each update
10: Increment by 1 dB for each update
11: Increment by 0.5 dB for each update
116
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13.1.57 Register 64 (0x40)
Figure 150. Register 64 (0x40)
7
6
5
4
3
2
1
0
VEDF
R/W
VEDS
R/W
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 90. Register 64 (0x40) Field Descriptions
Bit
Field
Type
Reset
Description
7-6
VEDF
R/W
0
Digital Volume Emergency Ramp Down Frequency – These bits control the frequency
of the digital volume updates when the volume is ramping down due to clock error or
power outage, which usually needs faster ramp down compared to normal soft mute.
00: Update every 1 FS period
01: Update every 2 FS periods
10: Update every 4 FS periods
11: Directly set the volume to zero (Instant mute)
5-4
3-0
VEDS
R/W
R/W
1
Digital Volume Emergency Ramp Down Step – These bits control the step of the digital
volume updates when the volume is ramping down due to clock error or power outage,
which usually needs faster ramp down compared to normal soft mute.
00: Decrement by 4 dB for each update
01: Decrement by 2 dB for each update
10: Decrement by 1 dB for each update
11: Decrement by 0.5 dB for each update
Reserved
Reserved
13.1.58 Register 65 (0x41)
Figure 151. Register 65 (0x41)
7
6
5
4
3
2
1
0
Reserved
R/W
ACTL
R/W
AMLE
R/W
AMRE
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 91. Register 65 (0x41) Field Descriptions
Bit
7-3
2
Field
Type
R/W
R/W
Reset
Description
Reserved
ACTL
Reserved
1
Auto Mute Control**NOBUS** – This bit controls the behavior of the auto mute upon
zero sample detection. The time length for zero detection is set with P0-R59.
0: Auto mute left channel and right channel independently.
1: Auto mute left and right channels only when both channels are about to be auto
muted.
1
0
AMLE
AMRE
R/W
R/W
1
1
Auto Mute Left Channel**NOBUS** – This bit enables or disables auto mute on right
channel. Note that when right channel auto mute is disabled and the P0-R65, bit 2 is
set to 1, the left channel will also never be auto muted.
0: Disable right channel auto mute
1: Enable right channel auto mute
Auto Mute Right Channel**NOBUS** – This bit enables or disables auto mute on left
channel. Note that when left channel auto mute is disabled and the P0-R65, bit 2 is set
to 1, the right channel will also never be auto muted.
0: Disable left channel auto mute
1: Enable left channel auto mute
13.1.59 Register 66 (0x42)
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Figure 152. Register 66 (0x42)
7
6
5
4
3
2
1
0
ADLY
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 92. Register 66 (0x42) Field Descriptions
Bit
Field
Type
Reset
Description
7-0
ADLY
R/W
0001100 AMUTE Delay – These bits control the delay before the complete digital mute to the
1
assertion of analog mute. This is to allow the non-mute audio samples to completely
flow out through analog parts before the assertion of the analog mute.
00000000: No delay
00000001: 1 LRCLK delay
00000010: 2 LRCLK delay
…
11111111: 255 LRCLK delay
13.1.60 Register 67 (0x43)
Figure 153. Register 67 (0x43)
7
6
5
4
3
2
1
0
DLPA
R/W
DRPA
R/W
DLPM
R/W
DRPM
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 93. Register 67 (0x43) Field Descriptions
Bit
Field
Type
Reset
Description
7-6
DLPA
R/W
0
Left DAC primary AC dither gain – These bits control the AC dither gain for left channel
primary DAC modulator.
00: AC dither gain = 0.125
01: AC dither gain = 0.25
5-4
3-2
DRPA
DLPM
R/W
R/W
0
0
Right DAC primary AC dither gain – These bits control the AC dither gain for right
channel primary DAC modulator.
00: AC dither gain = 0.125
01: AC dither gain = 0.25
Left DAC primary DEM dither gain – These bits control the dither gain for left channel
primary Galton DEM.
00: DEM dither gain = 0.5
01: DEM dither gain = 1.0
Others: Reserved (do not set)
1-0
DRPM
R/W
0
Right DAC primary DEM dither gain – These bits control the dither gain for right
channel primary Galton DEM.
00: DEM dither gain = 0.5
01: DEM dither gain = 1.0
Others: Reserved (do not set)
13.1.61 Register 68 (0x44)
Figure 154. Register 68 (0x44)
7
6
5
4
3
2
1
0
Reserved
R/W
DLPD
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
118
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ZHCSFY4 –DECEMBER 2016
Table 94. Register 68 (0x44) Field Descriptions
Bit
7-3
2-0
Field
Type
R/W
R/W
Reset
Description
Reserved
DLPD
Reserved
0
Left DAC primary DC dither – These bits control the DC dither amount to be added to
the lower part of the left channel primary DAC modulator. The DC dither is expressed
is Q0.11 format, with 1.0 equals to 1/32 fullscale modulator input.
00000000000 : No DC dither
00000000001 : 2-11 × 1/32 FS
00000000010 : 2-10 × 1/32 FS
13.1.62 Register 69 (0x45)
Figure 155. Register 69 (0x45)
7
6
5
4
3
2
1
0
DLPD
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 95. Register 69 (0x45) Field Descriptions
Bit
Field
Type
Reset
Description
7-0
DLPD
R/W
0
Left DAC primary DC dither – These bits control the DC dither amount to be added to
the lower part of the left channel primary DAC modulator. The DC dither is expressed
is Q0.11 format, with 1.0 equals to 1/32 fullscale modulator input.
00000000000 : No DC dither
00000000001 : 2-11 × 1/32 FS
00000000010 : 2-10 × 1/32 FS
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13.1.63 Register 70 (0x46)
Figure 156. Register 70 (0x46)
7
6
5
4
3
2
1
0
DRPD
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 96. Register 70 (0x46) Field Descriptions
Bit
Field
Type
Reset
Description
7-0
DRPD
R/W
0
Right DAC primary DC dither – These bits control the DC dither amount to be added to
the lower part of the right channel primary DAC modulator. The DC dither is expressed
is Q0.11 format, with 1.0 equals to 1/32 fullscale modulator input.
00000000000 : No DC dither
00000000001 : 2-11 × 1/32 FS
00000000010 : 2-10 × 1/32 FS
13.1.64 Register 71 (0x47)
Figure 157. Register 71 (0x47)
7
6
5
4
3
2
1
0
DRPD
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 97. Register 71 (0x47) Field Descriptions
Bit
Field
Type
Reset
Description
7-0
DRPD
R/W
0
Right DAC primary DC dither – These bits control the DC dither amount to be added to
the lower part of the right channel primary DAC modulator. The DC dither is expressed
is Q0.11 format, with 1.0 equals to 1/32 fullscale modulator input.
00000000000 : No DC dither
00000000001 : 2-11 × 1/32 FS
00000000010 : 2-10 × 1/32 FS
120
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ZHCSFY4 –DECEMBER 2016
13.1.65 Register 72 (0x48)
Figure 158. Register 72 (0x48)
7
6
5
4
3
2
1
0
DLSA
R/W
DRSA
R/W
DLSM
R/W
RSM
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 98. Register 72 (0x48) Field Descriptions
Bit
Field
Type
Reset
Description
7-6
DLSA
R/W
01
Left DAC secondary AC dither gain – These bits control the AC dither gain for left
channel secondary DAC.
00: AC dither gain = 0.125
01: AC dither gain = 0.25
5-4
DRSA
R/W
01
Right DAC secondary AC dither gain – These bits control the AC dither gain for right
channel secondary DAC modulator.
00: AC dither gain = 0.125
01: AC dither gain = 0.25
10: AC dither gain = 0.5
11: no AC dither
3-2
1-0
DLSM
DRSM
R/W
R/W
01
01
Left DAC secondary DEM dither gain – These bits control the dither gain for left
channel secondary Galton DEM.
00: DEM dither gain = 0.5
01: DEM dither gain = 1.0
Others: Reserved (do not set)
Right DAC secondary DEM dither gain – These bits control the dither gain for right
channel secondary Galton DEM.
00: DEM dither gain = 0.5
01: DEM dither gain = 1.0
Others: Reserved (do not set)
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13.1.66 Register 73 (0x49)
Figure 159. Register 73 (0x49)
7
6
5
4
3
2
1
0
DLSD
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 99. Register 73 (0x49) Field Descriptions
Bit
Field
Type
Reset
Description
7-0
DLSD
R/W
0
Left DAC secondary DC dither – These bits control the DC dither amount to be added
to the lower part of the left channel secondary DAC modulator. The DC dither is
expressed is Q0.11 format, with 1.0 equals to 1/32 fullscale modulator input.
00000000000 : No DC dither
00000000001 : 2–11 × 1/32 FS
00000000010 : 2–10 × 1/32 FS
13.1.67 Register 74 (0x4A)
Figure 160. Register 74 (0x4A)
7
6
5
4
3
2
1
0
DLSD
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 100. Register 74 (0x4A) Field Descriptions
Bit
Field
Type
Reset
Description
7-0
DLSD
R/W
0
Left DAC secondary DC dither – These bits control the DC dither amount to be added
to the lower part of the left channel secondary DAC modulator. The DC dither is
expressed is Q0.11 format, with 1.0 equals to 1/32 fullscale modulator input.
00000000000 : No DC dither
00000000001 : 2–11 × 1/32 FS
00000000010 : 2–10 × 1/32 FS
122
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ZHCSFY4 –DECEMBER 2016
13.1.68 Register 75 (0x4B)
Figure 161. Register 75 (0x4B)
7
6
5
4
3
2
1
0
DRSD
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 101. Register 75 (0x4B) Field Descriptions
Bit
Field
Type
Reset
Description
7-0
DRSD
R/W
0000000 Right DAC secondary DC dither – These bits control the DC dither amount to be added
0
to the lower part of the right channel secondary DAC modulator. The DC dither is
expressed is Q0.11 format, with 1.0 equals to 1/32 fullscale modulator input.
00000000000 : No DC dither
00000000001 : 2–11 × 1/32 FS
00000000010 : 2–10 × 1/32 FS
13.1.69 Register 76 (0x4C)
Figure 162. Register 76 (0x4C)
7
6
5
4
3
2
1
0
DRSD
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 102. Register 76 (0x4C) Field Descriptions
Bit
Field
Type
Reset
Description
7-0
DRSD
R/W
0000000 Right DAC secondary DC dither – These bits control the DC dither amount to be added
0
to the lower part of the right channel secondary DAC modulator. The DC dither is
expressed is Q0.11 format, with 1.0 equals to 1/32 fullscale modulator input.
00000000000 : No DC dither
00000000001 : 2–11 × 1/32 FS
00000000010 : 2–10 × 1/32 FS
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13.1.70 Register 78 (0x4E)
Figure 163. Register 78 (0x4E)
7
6
5
4
3
2
1
0
OLOF
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 103. Register 78 (0x4E) Field Descriptions
Bit
Field
Type
Reset
Description
7-0
OLOF
R/W
0000000 Left OFSCAL offset – These bits controls the amount of manual DC offset to be added
0
to the left channel DAC output. The additional offset would be approximately the
negative of the decimal value of this register divided by 4 in mV.
01111111 : –31.75 mV
01111110 : –31.50 mV
…
00000010 : –0.50 mV
00000001 : –0.25 mV
00000000 : 0.0 mV
11111111 : +0.25 mV
11111110 : +0.50 mV
…
10000000 : +32.0 mV
13.1.71 Register 79 (0x4F)
Figure 164. Register 79 (0x4F)
7
6
5
4
3
2
1
0
OROF
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 104. Register 79 (0x4F) Field Descriptions
Bit
Field
Type
Reset
Description
7-0
OROF
R/W
0
Right OFSCAL offset – These bits controls the amount of manual DC offset to be
added to the right channel DAC output. The additional offset would be approximately
the negative of the decimal value of this register divided by 4 in mV.
01111111 : –31.75 mV
01111110 : –31.50 mV
…
00000010 : –0.50 mV
00000001 : –0.25 mV
00000000 : 0.0 mV
11111111 : +0.25 mV
11111110 : +0.50 mV
…
10000000 : +32.0 mV
124
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13.1.72 Register 80 (0x50)
Figure 165. Register 80 (0x50)
7
6
5
4
3
2
1
0
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 105. Register 80 (0x50) Field Descriptions
Bit
Field
Type
Reset
Description
7-0
Reserved
R/W
0
Reserved
13.1.73 Register 81 (0x51)
Figure 166. Register 81 (0x51)
7
6
5
4
3
2
1
0
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 106. Register 81 (0x51) Field Descriptions
Bit
Field
Type
Reset
Description
7-0
Reserved
R/W
0
Reserved
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13.1.74 Register 82 (0x52)
Figure 167. Register 82 (0x52)
7
6
5
4
3
2
1
0
Reserved
R/W
G1SL
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 107. Register 82 (0x52) Field Descriptions
Bit
Field
Type
Reset
Description
7-0
Reserved
R/W
Reserved
126
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13.1.75 Register 83 (0x53)
Figure 168. Register 83 (0x53)
7
6
5
4
3
2
1
0
Reserved
R/W
G0SL
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 108. Register 83 (0x53) Register Field Descriptions
Bit
7-5
4-0
Field
Type
R/W
R/W
Reset
Description
Reserved
G0SL
Reserved
0
GPIO0 Output Selection – These bits select the signal to output to GPIO0. To actually
output the selected signal, the GPIO0 must be set to output mode at P0-R8.
0110: Clock invalid flag (clock error or clock changing or clock missing)
0111: Serial audio interface data output (SDOUT)
1000: Analog mute flag for left channel (low active)
1001: Analog mute flag for right channel (low active) 1010: PLL lock flag
1011: Charge pump clock
1100: Reserved
1101: Reserved
1110: Under voltage flag, asserted when XSMUTE voltage is higher than 0.7 DVDD
1111: Under voltage flag, asserted when XSMUTE voltage is higher than 0.3 DVDD **
INTERNAL **
1100: Short detection flag for left channel
1101: Short detection flag for right channel
10000: PLL clock/4
10001: Oscillator clock/4
10010: Impedance sense flag for left channel
10011: Impedance sense flag for right channel
10100: Internal UVP flag, becomes low when VDD falls below roughly 2.7V
10101: Offset calibration flag, asserted when the system is offset calibrating itself.
10110: Clock error flag
10111: Clock changing flag
11000: Clock missing flag
11001: Clock halt detection flag
11010: DSP boot done flag
11011: Charge pump voltage output valid flag (low active)
Others: N/A (zero)
13.1.76 Register 84 (0x54)
Figure 169. Register 84 (0x54)
7
6
5
4
3
2
1
0
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 109. Register 84 (0x54) Register Field Descriptions
Bit
Field
Type
Reset
Description
7-0
Reserved
R/W
0
Reserved
13.1.77 Register 85 (0x55)
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Figure 170. Register 85 (0x55)
7
6
5
4
3
2
1
0
Reserved
R/W
G2SL
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 110. Register 85 (0x55) Register Field Descriptions
Bit
7-5
4-0
Field
Type
R/W
R/W
Reset
Description
Reserved
G2SL
0
0
Reserved
GPIO2 Output Selection – These bits select the signal to output to GPIO2. To actually
output the selected signal, the GPIO2 must be set to output mode at P0-R8.
0000: off (low)
0001: DSP GPIO2 output
0010: Register GPIO2 output (P0-R86, bit 5)
0011: Auto mute flag (asserted when both L and R channels are auto muted)
0100: Auto mute flag for left channel
0101: Auto mute flag for right channel
0110: Clock invalid flag (clock error or clock changing or clock missing)
0111: Serial audio interface data output (SDOUT)
1000: Analog mute flag for left channel (low active)
1001: Analog mute flag for right channel (low active)
1010: PLL lock flag
1011: Charge pump clock
1100: Reserved
1101: Reserved
1110: Under voltage flag, asserted when XSMUTE voltage is higher than 0.7 DVDD
1111: Under voltage flag, asserted when XSMUTE voltage is higher than 0.3 DVDD **
INTERNAL **
1100: Short detection flag for left channel
1101: Short detection flag for right channel
10000: PLL clock/4 10001: Oscillator clock/4
10010: Impedance sense flag for left channel
10011: Impedance sense flag for right channel
10100: Internal UVP flag, becomes low when VDD falls below roughly 2.7V
10101: Offset calibration flag, asserted when the system is offset calibrating itself.
10110: Clock error flag
10111: Clock changing flag
11000: Clock missing flag
11001: Clock halt detection flag
11010: DSP boot done flag
11011: Charge pump voltage output valid flag (low active)
Others: N/A (zero)
128
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13.1.78 Register 86 (0x56)
Figure 171. Register 86 (0x56)
7
6
5
4
3
2
1
0
Reserved
R/W
GOUT2
R/W
MUTE
R/W
GOUT0
R/W
Reserved
R/W
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 111. Register 86 (0x56) Register Field Descriptions
Bit
7-6
5
Field
Type
R/W
R/W
Reset
Description
Reserved
GOUT2
0
0
Reserved
GPIO Output Control – This bit controls the GPIO2 output when the selection at P0-
R85 is set to 0010 (register output)
0: Output low
1: Output high
4
3
MUTE
R/W
R/W
R/W
0
0
0
This bit controls the MUTE output when the selection at P0-R84 is set to 0010 (register
output).
0: Output low
1: Output high
GOUT0
Reserved
This bit controls the GPIO0 output when the selection at P0-R83 is set to 0010 (register
output)
0: Output low
1: Output high
2-0
Reserved
13.1.79 Register 87 (0x57)
Figure 172. Register 87 (0x57)
7
6
5
4
3
2
1
0
Reserved
R/W
GINV2
R/W
MUTE
R/W
GINV0
R/W
Reserved
R/W
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 112. Register 87 (0x57) Field Descriptions
Bit
7-6
5
Field
Type
R/W
R/W
Reset
Description
Reserved
GINV2
0
0
Reserved
GPIO Output Inversion – This bit controls the polarity of GPIO2 output. When set to 1,
the output will be inverted for any signal being selected.
0: Non-inverted
1: Inverted
4
3
MUTE
R/W
R/W
R/W
0
0
0
This bit controls the polarity of MUTE output. When set to 1, the output will be inverted
for any signal being selected.
0: Non-inverted
1: Inverted
GINV0
This bit controls the polarity of GPIO0 output. When set to 1, the output will be inverted
for any signal being selected.
0: Non-inverted
1: Inverted
2-0
Reserved
Reserved
13.1.80 Register 88 (0x58)
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Figure 173. Register 88 (0x58)
7
6
5
4
3
2
1
0
DIEI
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 113. Register 88 (0x58) Field Descriptions
Bit
Field
Type
Reset
Description
7-0
DIEI
RO
0x84
Die ID, Device ID = 0x84
13.1.81 Register 89 (0x59)
Figure 174. Register 89 (0x59)
7
6
5
VSTL
R
4
VENTL
R
3
2
1
VSTR
R
0
VENR
R
Reserved
R/W
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 114. Register 89 (0x59) Field Descriptions
Bit
7-6
5
Field
Type
R/W
R
Reset
Description
Reserved
VSTL
0
0
Reserved
Left Digital Volume Status – This bit indicates the status of the left channel digital
volume.
0: Digital volume is not changing
1: Digital volume is changing
4
VENTL
R
0
Left Digital Volume Complete Flag – This bit indicates whether the left channel digital
volume has reached its target volume.
0: The digital volume has not reached the target volume
1: The digital volume has reached the target volume
3-2
1
Reserved
VSTR
R/W
R
0
0
Reserved
Right Digital Volume Status – This bit indicates the status of the right channel digital
volume.
0: Digital volume is not changing
1: Digital volume is changing
0
VENR
R
0
Right Digital Volume Complete Flag – This bit indicates whether the right channel
digital volume has reached its target volume.
0: The digital volume has not reached the target volume
1: The digital volume has reached the target volume
13.1.82 Register 91 (0x5B)
Figure 175. Register 91 (0x5B)
7
6
5
DTFS
R
4
3
2
1
0
Reserved
R/W
DTSR
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
130
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ZHCSFY4 –DECEMBER 2016
Table 115. Register 91 (0x5B) Field Descriptions
Bit
7
Field
Type
R/W
R
Reset
Description
Reserved
DTFS
0
0
Reserved
6-4
Detected FS – These bits indicate the currently detected audio sampling rate.
000: Error (Out of valid range)
001: 8 kHz
010: 16 kHz
011: 32-48 kHz
100: 88.2-96 kHz
101: 176.4-192 kHz
110: 384 kHz
3-0
DTSR
R
0
Detected MCLK Ratio – These bits indicate the currently detected MCLK ratio. Note
that even if the MCLK ratio is not indicated as error, clock error might still be flagged
due to incompatible combination with the sampling rate. Specifically the MCLK ratio
must be high enough to allow enough DSP cycles for minimal audio processing when
PLL is disabled. The absolute MCLK frequency must also be lower than 50 MHz.
0000: Ratio error (The MCLK ratio is not allowed)
0001: MCLK = 32 FS
0010: MCLK = 48 FS
0011: MCLK = 64 FS
0100: MCLK = 128 FS
0101: MCLK = 192 FS
0110: MCLK = 256 FS
0111: MCLK = 384 FS
1000: MCLK = 512 FS
1001: MCLK = 768 FS
1010: MCLK = 1024 FS
1011: MCLK = 1152 FS
1100: MCLK = 1536 FS
1101: MCLK = 2048 FS
1110: MCLK = 3072 FS
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13.1.83 Register 92 (0x5C)
Figure 176. Register 92 (0x5C)
7
6
5
4
3
2
1
0
Reserved
R/W
DTBR
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 116. Register 92 (0x5C) Field Descriptions
Bit
7
Field
Type
R/W
R
Reset
Description
Reserved
DTBR
0
0
Reserved
1
Detected SCLK Ratio (MSB)
13.1.84 Register 93 (0x5D)
Figure 177. Register 93 (0x5D)
7
DTBR
R
6
5
4
3
2
1
0
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 117. Register 93 (0x5D) Field Descriptions
Bit
Field
Type
Reset
Description
7
DTBR
R
Detected SCLK Ratio (LSB) – These bits indicate the currently detected SCLK ratio,
i.e. the number of SCLK clocks in one audio frame. Note that for extreme case of
SCLK = 1 FS (which is not usable anyway), the detected ratio will be unreliable
6-0
Reserved
R/W
0
Reserved
132
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13.1.85 Register 94 (0x5E)
Figure 178. Register 94 (0x5E)
7
6
CDST6
R
5
CDST5
R
4
CDST4
R
3
CDST3
R
2
CDST2
R
1
CDST1
R
0
CDST0
R
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 118. Register 94 (0x5E) Field Descriptions
Bit
7
Field
Type
R/W
R
Reset
Description
Reserved
CDST6
0
Reserved
6
Clock Detector Status – This bit indicates whether the MCLK clock is present or not.
0: MCLK is present
1: MCLK is missing (halted)
5
CDST5
R
This bit indicates whether the PLL is locked or not. The PLL will be reported as
unlocked when it is disabled.
0: PLL is locked
1: PLL is unlocked
4
3
CDST4
CDST3
R
R
This bit indicates whether the both LRCLK and SCLK are missing (tied low) or not.
0: LRCLK and/or SCLK is present 1: LRCLK and SCLK are missing
This bit indicates whether the combination of current sampling rate and MCLK ratio is
valid for clock auto set.
0: The combination of FS/MCLK ratio is valid
1: Error (clock auto set is not possible)
2
CDST2
R
This bit indicates whether the MCLK is valid or not. The MCLK ratio must be detectable
to be valid. There is a limitation with this flag, that is, when the low period of LRCLK is
less than or equal to five SCLKs, this flag will be asserted (MCLK invalid reported).
0: MCLK is valid
1: MCLK is invalid
1
0
CDST1
CDST0
R
R
This bit indicates whether the SCLK is valid or not. The SCLK ratio must be stable and
in the range of 32-256FS to be valid.
0: SCLK is valid
1: SCLK is invalid
This bit indicated whether the audio sampling rate is valid or not. The sampling rate
must be detectable to be valid. There is a limitation with this flag, that is when this flag
is asserted and P0-R37 is set to ignore all asserted error flags such that the DAC
recovers, this flag will be de-asserted (sampling rate invalid not reported anymore).
0: Sampling rate is valid
1: Sampling rate is invalid
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13.1.86 Register 95 (0x5F)
Figure 179. Register 95 (0x5F)
7
6
5
4
LTSH
R
3
2
CKMF
R
1
CSRF
R
0
CERF
R
Reserved
R/W
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 119. Register 95 (0x5F) Field Descriptions
Bit
7-5
4
Field
Type
R/W
R
Reset
Description
Reserved
LTSH
0
Reserved
Latched Clock Halt – This bit indicates whether MCLK halt has occurred. The bit is
cleared when read.
0: MCLK halt has not occurred
1: MCLK halt has occurred since last read
3
2
Reserved
CKMF
R/W
R
0
Reserved
Clock Missing – This bit indicates whether the LRCLK and SCLK are missing (tied low).
0: LRCLK and/or SCLK is present
1: LRCLK and SCLK are missing
1
0
CSRF
CERF
R
R
Clock Resync Request – This bit indicates whether the clock resynchronization is in
progress.
0: Not resynchronizing
1: Clock resynchronization is in progress
Clock Error – This bit indicates whether a clock error has occurred. The bit is cleared
when read
0: Clock error has not occurred
1: Clock error has occurred.
134
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13.1.87 Register 96 (0x60)
Figure 180. Register 96 (0x60)
7
6
5
4
3
PDPM
R
2
1
0
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 120. Register 96 (0x60) Field Descriptions
Bit
7
Field
Type
R/W
RO
Reset
Description
Reserved
PDPM
0
Reserved
6-0
PLL P Monitor – These bits indicate the actually used value for PLL divider P. The
actual value is the auto set one when clock auto set is active and register set one when
clock auto set is disabled.
0000000: P = 1
0000001: P = 2
...
1111111: P = 128
13.1.88 Register 97 (0x61)
Figure 181. Register 97 (0x61)
7
6
5
4
3
2
1
0
Reserved
R/W
PDJM
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 121. Register 97 (0x61) Field Descriptions
Bit
7-6
5-0
Field
Type
R/W
R
Reset
Description
Reserved
PDJM
0
Reserved
PLL J Monitor – These bits indicate the actually used value for PLL multiplication factor
J of the overall J.D × R. The actual value is the auto set one when clock auto set is
active and register set one when clock auto set is disabled.
000000: Error
000001: J = 1
000010: J = 2
...
111111: J = 63
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13.1.89 Register 98 (0x62)
Figure 182. Register 98 (0x62)
7
6
5
PDDM
R
4
3
2
1
0
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 122. Register 98 (0x62) Field Descriptions
Bit
7-6
5-0
Field
Type
R/W
R
Reset
Description
Reserved
PDDM
0
Reserved
PLL D Monitor (MSB) – These bits indicate the actually used value for PLL
multiplication factor D of the overall J.D × R. The actual value is the auto set one when
clock auto set is active and register set one when clock auto set is disabled.
0 (in decimal): D=0000
1 (in decimal): D=0001
....
9999 (in decimal): D=9999
Others: Error
13.1.90 Register 99 (0x63)
Figure 183. Register 99 (0x63)
7
6
5
4
3
2
1
0
Reserved
R/W
PDDM
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 123. Register 99 (0x63) Field Descriptions
Bit
7-6
5
Field
Type
R/W
R
Reset
Description
Reserved
PDDM
0
Reserved
PLL D Monitor (LSB) – These bits indicate the actually used value for PLL
multiplication factor D of the overall J.D × R. The actual value is the auto set one when
clock auto set is active and register set one when clock auto set is disabled.
0 (in decimal): D=0000
1 (in decimal): D=0001
....
9999 (in decimal): D=9999
Others: Error
136
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13.1.91 Register 100 (0x64)
Figure 184. Register 100 (0x64)
7
6
5
4
3
2
1
0
Reserved
R/W
PDRM
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 124. Register 100 (0x64)Field Descriptions
Bit
7-4
3-0
Field
Type
R/W
R
Reset
Description
Reserved
PDRM
0
Reserved
PLL R Monitor – These bits indicate the actually used value for PLL multiplication factor
R of the overall J.D × R. The actual value is the auto set one when clock auto set is
active and register set one when clock auto set is disabled.
0000: R = 1
0001: R = 2
...
1111: R = 16
13.1.92 Register 101 (0x65)
Figure 185. Register 101 (0x65)
7
6
5
4
3
DDSM
R
2
1
0
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 125. Register 101 (0x65) Field Descriptions
Bit
7
Field
Type
R/W
R
Reset
Description
Reserved
DDSM
0
Reserved
6-0
DSP clock divider monitor – These bits indicate the actually used value of the DSP
clock divider ratio. The actual value is the auto set one when clock auto set is active
and register set one when clock auto set is disabled.
0000000: Divide by 1
0000001: Divide by 2
...
1111111: Divide by 128
13.1.93 Register 102 (0x66)
Figure 186. Register 102 (0x66)
7
6
5
4
3
DDAM
R
2
1
0
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
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Table 126. Register 102 (0x66) Field Descriptions
Bit
7
Field
Type
R/W
R
Reset
Description
Reserved
DDAM
0
Reserved
6-0
DAC clock divider monitor – These bits indicate the actually used value of the DAC
clock divider ratio. The actual value is the auto set one when clock auto set is active
and register set one when clock auto set is disabled.
0000000: Divide by 1
0000001: Divide by 2
...
1111111: Divide by 128
13.1.94 Register 103 (0x67)
Figure 187. Register 103 (0x67)
7
6
5
4
3
DCPM
R
2
1
0
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 127. Register 103 (0x67) Field Descriptions
Bit
7
Field
Type
R/W
R
Reset
Description
Reserved
DCPM
0
Reserved
6-0
NCP clock divider monitor – These bits indicate the actually used value of the CP clock
divider ratio. The actual value is the auto set one when clock auto set is active and
register set one when clock auto set is disabled.
0000000: Divide by 1
0000001: Divide by 2
...
1111111: Divide by 128
13.1.95 Register 104 (0x68)
Figure 188. Register 104 (0x68)
7
6
5
4
3
DOSM
R
2
1
0
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 128. Register 104 (0x68) Field Descriptions
Bit
7
Field
Type
R/W
R
Reset
Description
Reserved
DOSM
0
Reserved
6-0
OSR clock divider monitor – These bits indicate the actually used value of the OSR
clock divider ratio. The actual value is the auto set one when clock auto set is active
and register set one when clock auto set is disabled.
0000000: Divide by 1
0000001: Divide by 2
...
1111111: Divide by 128
13.1.96 Register 105 (0x69)
138
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Figure 189. Register 105 (0x69)
7
6
5
4
PENM
R
3
2
PRFM
R
1
0
Reserved
R/W
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 129. Register 105 (0x69) Field Descriptions
Bit
7-5
4
Field
Type
R/W
R
Reset
Description
Reserved
PENM
Reserved
PLL enable monitor – This bit indicates whether the PLL is currently enabled.
0: PLL is disabled
1: PLL is enabled
3
Reserved
PRFM
R/W
R
Reserved
2-0
PLL Reference Monitor – These bits indicate the actual source for the PLL. The source
is auto set when clock auto set is active and register set when clock auto set is
disabled.
000: MCLK
001: SCLK
010: OSC
011: GPIO
Others: Reserved (mute)
13.1.97 Register 106 (0x6A)
Figure 190. Register 106 (0x6A)
7
CPPM
R
6
RFPM
R
5
LDPM
R
4
LBPM
R
3
LCPM
R
2
LOPM
R
1
ROPM
R
0
DAPM
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 130. Register 106 (0x6A) Field Descriptions
Bit
Field
Type
Reset
Description
7
CPPM
R
CP PWRDN monitor – This bit is a monitor for CP powerdown status.
0: Powered down
1: Active
6
5
4
3
RFPM
LDPM
LBPM
LCPM
R
R
R
R
REF PWRDN monitor – This bit is a monitor for analog reference powerdown status.
0: Powered down
1: Active
Line Driver PWRDN monitor – This bit is a monitor for line driver powerdown status.
0: Powered down
1: Active
Line Bias PWRDN monitor – This bit is a monitor for line bias powerdown status.
0: Powered down
1: Active
Line CMFB2 PWRDN monitor – This bit is a monitor for line common feedback
powerdown status.
0: Powered down
1: Active
2
LOPM
R
L Output Stage PWRDN monitor – This bit is a monitor for left channel output stage
powerdown status.
0: Powered down
1: Active
Copyright © 2016, Texas Instruments Incorporated
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Table 130. Register 106 (0x6A) Field Descriptions (continued)
Bit
Field
Type
Reset
Description
1
ROPM
R
R Output Stage PWRDN monitor – This bit is a monitor for right channel output stage
powerdown status..
0: Powered down
1: Active
0
DAPM
R
DAC PWRDN monitor – This bit is a monitor for DAC powerdown status.
0: Powered down
1: Active
140
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13.1.98 Register 107 (0x6B)
Figure 191. Register 107 (0x6B)
7
OFPM
R
6
SSPM
R
5
ISPM
R
4
IWPM
R
3
LSPM
R
2
RSPM
R
1
DSRM
R
0
DERM
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 131. Register 107 (0x6B) Field Descriptions
Bit
Field
Type
Reset
Description
7
OFPM
R
OFSCOMP PWRDN monitor – This bit is a monitor for offset compensator powerdown
status.
0: Powered down
1: Active
6
5
4
3
2
SSPM
ISPM
R
R
R
R
R
Short Protection PWRDN monitor – This bit is a monitor for short protector powerdown
status.
0: Powered down
1: Active
IMP sense PWRDN monitor – This bit is a monitor for impedance sensor powerdown
status.
0: Powered down
1: Active
IWPM
LSPM
RSPM
IMP whole PWRDN monitor – This bit is a monitor for whole impedance sensor circuitry
powerdown status.
0: Powered down
1: Active
L Short Protection RST monitor – This bit is a monitor for left channel short protector
reset status.
0: Reset
1: Active
R Short Protection RST monitor – This bit is a monitor for right channel short protector
reset status.
0: Reset
1: Active
1
0
DSRM
DERM
R
R
DSM RST monitor – This bit is a monitor for DAC modulator reset status.
0: Reset
1: Active
DEM RST monitor – This bit is a monitor for DAC DEM reset status.
0: Reset
1: Active
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13.1.99 Register 108 (0x6C)
Figure 192. Register 108 (0x6C)
7
6
5
ADLM
R
4
ADRM
R
3
2
1
AMLM
R
0
AMRM
R
Reserved
R/W
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 132. Register 108 (0x6C) Field Descriptions
Bit
7-6
5
Field
Type
R/W
R
Reset
Description
Reserved
ADLM
0
Reserved
AMUTE dummy left monitor – This bit is a monitor for left channel dummy output
analog mute status.
0: Mute
1: Unmute
4
ADRM
R
AMUTE dummy right monitor – This bit is a monitor for right channel dummy output
analog mute status.
0: Mute
1: Unmute
3-2
1
Reserved
AMLM
R/W
R
0
Reserved
Left Analog Mute Monitor – This bit is a monitor for left channel analog mute status.
0: Mute
1: Unmute
0
AMRM
R
Right Analog Mute Monitor – This bit is a monitor for right channel analog mute status.
0: Mute
1: Unmute
13.1.100 Register 109 (0x6D)
Figure 193. Register 109 (0x6D)
7
6
5
4
SDTM
R
3
2
1
0
SHTM
R
Reserved
R/W
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 133. Register 109 (0x6D) Field Descriptions
Bit
7-5
4
Field
Type
R/W
R
Reset
Description
Reserved
SDTM
0
Reserved
Short detect monitor – This bit indicates whether line output short is occuring.
0: Normal (No short)
1: Line output is being shorted
3-1
0
Reserved
SHTM
R/W
R
0
Reserved
Short detected monitor – This bit indicates whether line output short has occurred since
last read. This bit is sticky and is cleared when read.
0: No short
1: Line output short occurred
142
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13.1.101 Register 110 (0x6E)
Figure 194. Register 110 (0x6E)
7
6
5
4
3
2
1
0
DLCM
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 134. Register 110 (0x6E) Field Descriptions
Bit
Field
Type
Reset
Description
7-0
DLCM
R
Left DIFF control monitor – These bits indicate the final control value of the left channel
differential offset compensator. The value approximates the magnitude of the original
offset before calibration.
0000000: 0 mV
0000001: 0.25 mV
0000010: 0.50 mV
0000011: 0.75 mV
…
1111111: 63.75 mV
13.1.102 Register 111 (0x6F)
Figure 195. Register 111 (0x6F)
7
6
5
4
3
2
1
0
DRCM
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 135. Register 111 (0x6F) Field Descriptions
Bit
Field
Type
Reset
Description
7-0
DRCM
R
Right DIFF control monitor – These bits indicate the final control value of the right
channel differential offset compensator. The value approximates the magnitude of the
original offset before calibration.
0000000: 0 mV
0000001: 0.25 mV
0000010: 0.50 mV
0000011: 0.75 mV
…
1111111: 63.75 mV
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13.1.103 Register 112 (0x70)
Figure 196. Register 112 (0x70)
7
DLCS
R
6
5
4
3
2
CLCM
R
1
0
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 136. Register 112 (0x70) Field Descriptions
Bit
Field
Type
Reset
Description
7
DLCS
R
Left DIFF control sign – This bit indicates the polarity of DC offset at left channel before
calibration (the magnitude is indicated in R0/P110).
0: Negative
1: Positive
6-5
4-0
Reserved
CLCM
R/W
R
0
Reserved
Left CMFB control monitor – These bits indicate the final control value of the left
channel common feedback offset compensator. The value approximates the magnitude
of the original offset before calibration.
00000: 0 mV
00001: 0.25 mV
00010: 0.50 mV
…
11111: 7.75 mV
13.1.104 Register 113 (0x71)
Figure 197. Register 113 (0x71)
7
DRCS
R
6
5
4
3
2
CRCM
R
1
0
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 137. Register 113 (0x71) Field Descriptions
Bit
Field
Type
Reset
Description
7
DRCS
R
Right DIFF control sign – This bit indicates the polarity of DC offset at right channel
before calibration (the magnitude is indicated in R0-P111)
0: Negative
1: Positive
6-5
4-0
Reserved
CRCM
R/W
R
0
Reserved
Right CMFB control monitor – These bits indicate the final control value of the right
channel common feedback offset compensator. The value approximates the magnitude
of the original offset before calibration.
00000: 0 mV
00001: 0.25 mV
00010: 0.50 mV
…
11111: 7.75 mV
144
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13.1.105 Register 114 (0x72)
Figure 198. Register 114 (0x72)
7
6
5
4
3
2
1
0
Reserved
R/W
MTST
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 138. Register 114 (0x72) Field Descriptions
Bit
7-2
1-0
Field
Type
R/W
R
Reset
Description
Reserved
MTST
0
Reserved
MUTE status – These bits indicate the output of the XSMUTE level decoder for
monitoring purpose.
11: 0.7 VDD ≤ XSMUTE
01: 0.3 VDD ≤ XSMUTE < 0.7 VDD
00: 0.3 VDD > XSMUTE
13.1.106 Register 115 (0x73)
Figure 199. Register 115 (0x73)
7
6
5
4
3
2
1
FSMM
R
0
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 139. Register 115 (0x73) Field Descriptions
Bit
7-3
2-0
Field
Type
R/W
R
Reset
Description
Reserved
FSMM
0
Reserved
FS Speed Mode Monitor – These bits indicate the actual FS operation mode being
used. The actual value is the auto set one when clock auto set is active and register
set one when clock auto set is disabled.
In Auto set,
000: error
001: 8 kHz
010: 16 kHz
011: 32-48 kHz
100: 88.2-96 kHz
101: 176.4-192 kHz
110: 384 kHz
111: reserved
In register set mode,
000: reserved
001: 8 kHz
010: 16 kHz
011: 48 kHz
100: 88.2-96 kHz
101: 176.4-192 kHz
110: 384 kHz
111: 32 kHz
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13.1.107 Register 118 (0x76)
Figure 200. Register 118 (0x76)
7
BOTM
R
6
5
4
3
2
1
0
Reserved
R/W
PSTM
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 140. Register 118 (0x76) Field Descriptions
Bit
Field
Type
Reset
Description
7
BOTM
R
DSP Boot Done Flag – This bit indicates whether the DSP boot is completed.
0: DSP is booting
1: DSP boot completed
6-4
3-0
Reserved
PSTM
R/W
R
Reserved
Power State – These bits indicate the current power state of the DAC.
000: Powerdown
0001: Wait for CP voltage valid
0010: Common feedback offset calibration
0011: Differential mode offset calibration
0100: Volume ramp up
0101: Run (Playing)
0110: Line output short and Low impedance
0111: Volume ramp down
1000: Standby
13.1.108 Register 119 (0x77)
Figure 201. Register 119 (0x77)
7
6
5
GPIN2
R
4
MUTE
R
3
GPIN0
R
2
Reserved
R
1
Reserved
R
0
Reserved
R
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 141. Register 119 (0x77) Field Descriptions
Bit
7-6
5
Field
Type
R/W
RO
Reset
Description
Reserved
GPIN2
0
Reserved
GPIO Input States – This bit indicates the logic level at GPIO2 pin.
0: Low
1: High
4
3
2
1
0
MUTE
GPIN0
RO
RO
RO
RO
RO
This bit indicates the logic level at MUTE pin.
0: Low
1: High
This bit indicates the logic level at GPIO0 pin.
0: Low
1: High
N/A
0: Low
1: High
N/A
0: Low
1: High
N/A
0: Low
1: High
146
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13.1.109 Register 120 (0x78)
Figure 202. Register 120 (0x78)
7
6
5
4
AMFL
R
3
2
1
0
AMFR
R
Reserved
R/W
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 142. Register 120 (0x78) Field Descriptions
Bit
7-5
4
Field
Type
R/W
R
Reset
Description
Reserved
AMFL
0
Reserved
Auto Mute Flag for Left Channel – This bit indicates the auto mute status for left
channel.
0: Not auto muted
1: Auto muted
3-1
0
Reserved
AMFR
R/W
R
0
Reserved
Auto Mute Flag for Right Channel – This bit indicates the auto mute status for right
channel.
0: Not auto muted
1: Auto muted
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13.1.110 Register 121 (0x79)
Figure 203. Register 121 (0x79)
7
6
5
4
3
2
1
0
Reserved
R/W
DWAO
R/W
Reserved
R/W
DAMD
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 143. Register 121 (0x79) Field Descriptions
Bit
7-5
4
Field
Type
R/W
R/W
Reset
Description
Reserved
DWAO
0
0
Reserved
DWA off – This bit controls the DWA rotation.
0: DWA is active (Rotation active)
1: DWA is disabled (No rotation)
3-2
1-0
Reserved
DAMD
R/W
R/W
0
0
Reserved
DAC Mode – This bit controls the DAC mode.
0: Mode1
1: Mode2
** INTERNAL ** (Mode1: Cascaded Galton,
Mode2: Cascaded DWA)
10: Non-cascaded Galton
11: Non-cascaded DWA
148
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13.2 Registers - Page 1
13.2.1 Register 1 (0x01)
Figure 204. Register 1 (0x01)
7
6
5
4
3
2
1
0
Reserved
R/W
REXT
R/W
Reserved
R/W
OSEL
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 144. Register 1 (0x01) Field Descriptions
Bit
Field
Type
Reset
Description
7-5
Reserved
R/W
0
Reserved
REF BG Ext - This bit controls what is output from the VCOM pin
0: AVDD divided voltage
1: Bandgap reference voltage
4
REXT
R/W
R/W
0
0
3-1
Reserved
Reserved
Output Amplitude Type - This bit selects the output amplitude type. The clock autoset
feature will not work with PLL enabled in VCOM mode.
In this case this feature has to be disabled via P0-R37 and the clock dividers must be
set manually.
0
OSEL
R/W
0
0: VREF mode (Constant output amplitude against AVDD variation)
1: VCOM mode (Output amplitude is proportional to AVDD variation)
13.2.2 Register 2 (0x02)
Figure 205. Register 2 (0x02)
7
6
5
4
3
2
1
0
Reserved
R/W
LAGN
R/W
Reserved
R/W
RAGN
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 145. Register 2 (0x02) Field Descriptions
Bit
Field
Type
Reset
Description
7-5
Reserved
R/W
0
Reserved
Analog Gain Control for Left Channel - This bit controls the left channel analog gain.
4
3-1
0
LAGN
R/W
R/W
R/W
0
0
0
0: 0 dB
1: -6 dB
Reserved
RAGN
Reserved
Analog Gain Control for Right Channel - This bit controls the right channel analog gain.
0: 0 dB
1: -6 dB
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13.2.3 Register 3 (0x03)
Figure 206. Register 3 (0x03)
7
6
5
4
3
2
1
0
Reserved
R/W
CPDY
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 146. Register 3 (0x03) Field Descriptions
Bit
Field
Type
Reset
Description
7-3
Reserved
R/W
0
Reserved
CP Delay -These bits control the delay of charge pump clock.
000: 65 ns
001: 90 ns
010: 115 ns
011: 140 ns
100: 165 ns
101: 190 ns
110: 215 ns
111: 240 ns
2-0
CPDY
R/W
0
13.2.4 Register 4 (0x04)
Figure 207. Register 4 (0x04)
7
6
5
4
3
2
1
0
Reserved
R/W
OPWR
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 147. Register 4 (0x04) Field Descriptions
Bit
Field
Type
Reset
Description
7-2
Reserved
R/W
0
Reserved
Output Power - These bits control the power of output driver.
00: Normal power
1-0
OPWR
R/W
1
01: Increased power
10: More increased power
11: Maximum power
150
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13.2.5 Register 5 (0x05)
Figure 208. Register 5 (0x05)
7
6
5
4
3
2
1
0
Reserved
R/W
UEPD
R/W
UIPD
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 148. Register 5 (0x05) Field Descriptions
Bit
Field
Type
Reset
Description
7-2
Reserved
R/W
0
Reserved
External UVP Control - This bit enables or disables detection of power supply drop via
XSMUTE pin (External Under Voltage Protection).
0: Enabled
1: Disabled
1
0
UEPD
UIPD
R/W
R/W
0
0
Internal UVP Control - This bit enables or disables internal detection of AVDD voltage
drop (Internal Under Voltage Protection).
0: Enabled
1: Disabled
13.2.6 Register 6 (0x06)
Figure 209. Register 6 (0x06)
7
6
5
4
3
2
1
0
Reserved
R/W
AMCT
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 149. Register 6 (0x06) Field Descriptions
Bit
Field
Type
Reset
Description
7-1
Reserved
R/W
0
Reserved
Analog Mute Control -This bit enables or disables analog mute following digital mute.
0
AMCT
R/W
1
0: Disabled
1: Enabled
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13.2.7 Register 7 (0x07)
Figure 210. Register 7 (0x07)
7
6
5
4
3
2
1
0
Reserved
R/W
AGBL
R/W
Reserved
R/W
AGBR
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 150. Register 7 (0x07) Field Descriptions
Bit
Field
Type
Reset
Description
7-5
Reserved
R/W
0
Reserved
Analog +10% Gain for Left Channel - This bit enables or disables amplitude boost
mode for left channel.
0: Normal amplitude
4
3-1
0
AGBL
R/W
R/W
R/W
0
0
1
1: +10% (+0.8 dB) boosted amplitude
Reserved
AGBR
Reserved
Analog +10% Gain for Right Channel - This bit enables or disables amplitude boost
mode for right channel.
0: Normal amplitude
1: +10% (+0.8 dB) boosted amplitude
13.2.8 Register 8 (0x08)
Figure 211. Register 8 (0x08)
7
6
5
4
3
2
1
0
Reserved
R/W
RBGF
R/W
Reserved
R/W
RCMF
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 151. Register 8 (0x08) Field Descriptions
Bit
Field
Type
Reset
Description
7-5
Reserved
R/W
0
Reserved
REF BG Fast - This bit controls the bandgap voltage ramp up speed.
0: Normal ramp up, ~50 ms with external capacitance = 1 µF
1: Fast ramp up, ~1 ms with external capacitance = 1 µF
4
3-1
0
RBGF
R/W
R/W
R/W
0
0
1
Reserved
RCMF
Reserved
VCOM Reference Ramp Up - This bit controls the VCOM voltage ramp up speed.
0: Normal ramp up, ~600 ms with external capacitance = 1 µF
1: Fast ramp up, ~3 ms with external capacitance = 1 µF
152
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ZHCSFY4 –DECEMBER 2016
13.2.9 Register 9 (0x09)
Figure 212. Register 9 (0x09)
7
6
5
4
3
2
1
0
Reserved
R/W
DEME
R/W
VCPD
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 152. Register 9 (0x09) Field Descriptions
Bit
Field
Type
Reset
Description
7-2
Reserved
R/W
0
Reserved
VCOM Pin as De-emphasis Control - This bit controls whether to use the
DEEMP/VCOM pin as De-emphasis control.
0: Disabled (DEEMP/VCOM is not used to control De-emphasis)
1: Enabled (DEEMP/VCOM is used to control De-emphasis)
1
0
DEME
VCPD
R/W
R/W
0
1
Power down control for VCOM - This bit controls VCOM powerdown switch.
0: VCOM is powered on
1: VCOM is powered down
13.2.10 Register 10 (0x0A)
Figure 213. Register 10 (0x0A)
7
6
5
4
3
2
1
0
Reserved
R/W
LBBG
R/W
Reserved
R/W
LBVC
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 153. Register 10 (0x0A) Field Descriptions
Bit
Field
Type
Reset
Description
7-6
Reserved
R/W
0
Reserved
Line 1st stage bias ctrl<1> at BG mode - Applied when LSB of 0x01 at Page1=0
5-4
3-2
1-0
LBBG
R/W
R/W
R/W
1
0
1
0: low
1: high
Reserved
LBVC
Reserved
Line 1st stage bias ctrl<1> at COM mode - Applied when LSB of 0x01 at Page1=1
0: low
1: high
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13.2.11 Register 11 (0x0B)
Figure 214. Register 11 (0x0B)
7
6
5
4
3
2
1
0
Reserved
R/W
CBBG
R/W
Reserved
R/W
CBVC
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 154. Register 11 (0x0B) Field Descriptions
Bit
Field
Type
Reset
Description
7-6
Reserved
R/W
0
Reserved
CMFB bias ctrl<1> at BG mode - Applied when LSB of 0x01 at Page1=0
5-4
3-2
1-0
CBBG
R/W
R/W
R/W
1
0
0
0: low
1: high
Reserved
CBVC
Reserved
CMFB bias ctrl<1> at COM mode - Applied when LSB of 0x01 at Page1=1
0: low
1: high
13.2.12 Register 12 (0x0C)
Figure 215. Register 12 (0x0C)
7
6
5
4
3
2
1
0
Reserved
R/W
SSBG
R/W
Reserved
R/W
SSVC
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 155. Register 12 (0x0C) Field Descriptions
Bit
Field
Type
Reset
Description
7-6
Reserved
R/W
0
Reserved
Short protection sink ref current ctrl<1> at BG mode - Applied when LSB of 0x01at
Page1=0
0: low
1: high
5-4
3-2
1-0
SSBG
R/W
R/W
R/W
0
0
0
Reserved
SSVC
Reserved
Short protection sink ref current ctrl<1> at COM mode - Applied when LSB of 0x01 at
Page1=1
0: low
1: high
154
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13.2.13 Register 13 (0x0D)
Figure 216. Register 13 (0x0D)
7
6
5
4
3
2
1
0
Reserved
R/W
SRBG
R/W
SRVC
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 156. Register 13 (0x0D) Field Descriptions
Bit
7-6
5
Field
Type
R/W
R/W
Reset
Description
Reserved
0
0
Reserved
Short protection source ref current ctrl<1> at BG mode - Applied when LSB of 0x01 at
Page1=0
0: low
1: high
SRBG
SRVC
4-2
1
R/W
R/W
R/W
1
0
1
Short protection source ref current ctrl<1> at COM mode - Applied when LSB of 0x01
at Page1=1
0: low
0
1: high
13.2.14 Register 14 (0x0E)
Figure 217. Register 14 (0x0E)
7
6
5
4
3
2
1
0
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 157. Register 14 (0x0E) Field Descriptions
Bit
Field
Type
Reset
Description
7-0
Reserved
R/W
0
Reserved
13.2.15 Register 15 (0x0F)
Figure 218. Register 15 (0x0F)
7
6
5
4
3
2
1
0
Reserved
R/W
CPCP
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 158. Register 15 (0x0F) Field Descriptions
Bit
Field
Type
Reset
Description
7-1
Reserved
R/W
0
Reserved
NCP clock digital delay control - This bit controls the CP clock phase delay against the
DAC clock.
0: 0 degree (no delay)
1: 180 degree delay
0
CPCP
R/W
1
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13.3 Registers - Page 253
13.3.1 Register 1 (0x01)
Figure 219. Register 1 (0x01)
7
6
5
4
3
2
1
1
1
1
0
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 159. Register 1 (0x01) Field Descriptions
Bit
Field
Type
Reset
Description
7-0
Reserved
R/W
0
Reserved
13.3.2 Register 2 (0x02)
Figure 220. Register 2 (0x02)
7
6
5
4
3
2
0
0
0
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 160. Register 2 (0x02) Field Descriptions
Bit
Field
Type
Reset
Description
7-0
Reserved
R/W
0
Reserved
13.3.3 Register 3 (0x03)
Figure 221. Register 3 (0x03)
7
6
5
4
3
2
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 161. Register 3 (0x03 Field Descriptions)
Bit
Field
Type
Reset
Description
7-0
Reserved
R/W
0
Reserved
13.3.4 Register 4 (0x04)
Figure 222. Register 4 (0x04)
7
6
5
4
3
2
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 162. Register 4 (0x04) Field Descriptions
Bit
Field
Type
Reset
Description
7-0
Reserved
R/W
0
Reserved
156
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13.3.5 Register 5 (0x05)
Figure 223. Register 5 (0x05)
7
6
5
4
3
2
1
0
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 163. Register 5 (0x05) Field Descriptions
Bit
Field
Type
Reset
Description
7-0
Reserved
R/W
0
Reserved
13.3.6 Register 6 (0x06)
Figure 224. Register 6 (0x06)
7
6
5
4
3
2
1
0
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 164. Register 6 (0x06) Field Descriptions
Bit
Field
Type
Reset
Description
7-0
Reserved
R/W
0
Reserved
13.3.7 Register 7 (0x07)
Figure 225. Register 7 (0x07)
7
6
5
4
3
2
1
0
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 165. Register 7 (0x07) Field Descriptions
Bit
Field
Type
Reset
Description
7-0
Reserved
R/W
0
Reserved
13.3.8 Register 8 (0x08)
Figure 226. Register 8 (0x08)
7
6
5
4
3
2
1
0
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 166. Register 8 (0x8) Field Descriptions
Bit
Field
Type
Reset
Description
7-0
Reserved
R/W
0
Reserved
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13.3.9 Register 9 (0x09)
Figure 227. Register 9 (0x09)
7
6
5
4
3
2
1
0
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 167. Register 9 (0x9) Field Descriptions
Bit
Field
Type
Reset
Description
7-0
Reserved
R/W
0
Reserved
13.3.10 Register 10 (0x0A)
Figure 228. Register 10 (0x0A)
7
6
5
4
3
2
1
0
DRSV
R/W
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 168. Register 10 (0xA) Field Descriptions
Bit
7
Field
Type
R/W
R/W
Reset
Description
Dither Reserved - Performance adjustment dither setting when "RESERVED" bond
option is selected
DRSV
0
0
6-0
Reserved
Reserved
13.3.11 Register 11 (0x0B)
Figure 229. Register 11 (0x0B)
7
6
5
4
3
2
1
0
D100
R/W
Reserved
R/W
OFSCAL0
R/W
OFSCAL1
R/W
OFSCAL2
R/W
OFSCAL3
R/W
OFSCAL4
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 169. Register 11 (0xB) Field Descriptions
Bit
7
Field
Type
R/W
R/W
Reset
Description
Dither Reserved - Performance adjustment dither setting when "RESERVED" bond
option is selected
D100
0
0
6-5
Reserved
Reserved
Ofscal Bypass Filter - Select whether to bypass the front-end filter.
0: Front-end filter used.
4
OFSCAL0
R/W
0
1: Front-end filter bypassed.
Ofscal Full Span - Select whether to activate front-end filter half period (good for
majority type) or full period (good for averaging type).
0: Front-end filter is active last half of control period.
3
OFSCAL1
R/W
0
1: Front-end filter is active the whole control period.
Ofscal Average Filtering - Select the type of front-end filter.
0: Front-end filter is majority decision type
1: Front-end filter is averaging type
2
1
OFSCAL2
OFSCAL3
R/W
R/W
0
0
Ofscal Disable Fine Calibration - Select whether to do fine calibration.
0: Do 64-step coarse calibration followed by 32-step fine calibration.
1: Do 96-step coarse calibration only (no fine calibration).
Ofscal Disable Post Averaging - Select whether to use post-averaging on the integrator
output.
0: Final calibration control source is post-averaging result.
1: Final calibration control source is integrator output.
0
OFSCAL4
R/W
0
158
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13.3.12 Register 12 (0x0C)
Figure 230. Register 12 (0x0C)
7
6
5
4
3
2
1
0
D105
R/W
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 170. Register 12 (0x0C) Field Descriptions
Bit
7
Field
Type
R/W
R/W
Reset
Description
Dither 105 dB - Performance adjustment dither setting when "105dB" bond option is
selected
D105
0
0
6-0
Reserved
Reserved
13.3.13 Register 13 (0x0D)
Figure 231. Register 13 (0x0D)
7
6
5
4
3
2
1
0
D110
R/W
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 171. Register 13 (0x0D) Field Descriptions
Bit
7
Field
Type
R/W
R/W
Reset
Description
Dither 115 dB - Performance adjustment dither setting when "110dB" bond option is
selected
D110
0
0
6-0
Reserved
Reserved
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13.3.14 Register 14 (0x0E)
Figure 232. Register 14 (0x0E)
7
6
5
4
3
2
1
0
Reserved
R/W
SUMD
R/W
Reserved
R/W
SUAS
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 172. Register 14 (0x0E) Field Descriptions
Bit
7-5
4
Field
Type
R/W
R/W
R/W
R/W
Reset
Description
Reserved
SUMD
0
0
0
0
Reserved
SpeedUp CLK missing detection
Reserved
3-1
0
Reserved
SUAS
SpeedUp Analog Sequence
13.3.15 Register 15 (0x0F)
Figure 233. Register 15 (0x0F)
7
6
5
4
3
2
1
0
Reserved
R/W
SDEN
R/W
Reserved
R/W
DSOC
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 173. Register 15 (0x0F) Field Descriptions
Bit
Field
Type
Reset
Description
7-5
Reserved
R/W
0
Reserved
Short Detection Enable
0: Short detection enable
1: Short detection disable
4
SDEN
R/W
1
3-1
0
Reserved
DSOC
R/W
R/W
0
0
Reserved
Disable Subsequent Offset Cancellation
160
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13.3.16 Register 16 (0x10)
Figure 234. Register 16 (0x10)
7
6
5
4
3
2
1
0
Reserved
R/W
SWDA
R/W
Reserved
R/W
DPOL
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 174. Register 16 (0x10) Field Descriptions
Bit
Field
Type
Reset
Description
7-6
Reserved
0
Reserved
Shuffle DWA of Galton - Shuffle DWA Outputs of Galton DEM
0,3: No shuffle
5
R/W
R/W
1
SDWA
1: Shuffle Internally
2: Global Shuffle
4
3-1
0
0
0
0
Reserved
DPOL
Reserved
Select DC dither polarity for the secandary DAC. Select DC dither polarity +4.0% or
-4.0% for the secondary DAC.
R/W
13.3.17 Register 17 (0x11)
Figure 235. Register 17 (0x11)
7
6
5
4
3
2
1
0
DLSC
R/W
Reserved
R/W
DRSC
R/W
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 175. Register 17 (0x11) Field Descriptions
Bit
7
Field
Type
R/W
R/W
R/W
R/W
Reset
Description
DLSC
0
0
0
0
Left DAC Primary/Secondary Scale - Secondary to Primary scaling factor for left DAC
6-4
3
Reserved
DRSC
Reserved
Right DAC Primary/Secondary Scale - See DAC digital design spec
Reserved
2-0
Reserved
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13.3.18 Register 18 (0x12)
Figure 236. Register 18 (0x12)
7
6
5
4
3
2
1
0
LPA0
R/W
LPB1
R/W
LPB2
R/W
LPB3
R/W
RPA0
R/W
RPB1
R/W
RPB2
R/W
RPB3
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 176. Register 18 (0x12) Field Descriptions
Bit
Field
Type
Reset
Description
Left DAC primary a0 zero - Left DAC primary modulator coeff tweaks.
7
LPA0
R/W
0
0: normal
1: zero
Left DAC primary b1 zero
0: normal
1: zero
6
5
4
3
2
1
0
LPB1
LPB2
LPB3
RPA0
RPB1
RPB2
RPB3
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0
0
0
0
0
0
0
Left DAC primary b2 zero
0: normal
1: zero
Left DAC primary b3 zero
0: normal
1: zero
Right DAC primary a0 zero - Right DAC primary modulator coeff tweaks
0: normal
1: zero
Right DAC primary b1 zero
0: normal
1: zero
Right DAC primary b2 zero
0: normal
1: zero
Right DAC primary b3 zero
0: normal
1: zero
162
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13.3.19 Register 19 (0x13)
Figure 237. Register 19 (0x13)
7
6
5
4
3
2
1
0
LPG1
R/W
Reserved
R/W
LPUB
R/W
Reserved
R/W
RPG1
R/W
Reserved
R/W
RPUB
R/W
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 177. Register 19 (0x13) Field Descriptions
Bit
7
Field
Type
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Reset
Description
LPG1
0
0
0
0
0
0
0
0
Left DAC primary g1 gain. Left DAC primary local loop gain
6
Reserved
LPUB
Reserved
5
Left DAC primary upper bits. Number of left DAC primary upper bits
4
Reserved
RPG1
Reserved
3
Right DAC primary g1 gain. Right DAC primary local loop gain
2
Reserved
RPUB
Reserved
1
Right DAC primary upper bits. Number of right DAC primary upper bits
Reserved
0
Reserved
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13.3.20 Register 20 (0x14)
Figure 238. Register 20 (0x14)
7
6
5
4
3
2
1
0
LSA0
R/W
LSB1
R/W
LSB2
R/W
LSB3
R/W
RSA0
R/W
RSB1
R/W
RSB2
R/W
RSB3
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 178. Register 20 (0x14) Field Descriptions
Bit
Field
Type
Reset
Description
Left DAC secondary a0 zero. Left DAC secondary modulator coeff tweaks.
7
LSA0
R/W
0
0: normal
1: zero
Left DAC secondary b1 zero
0: normal
1: zero
6
5
4
3
2
1
0
LSB1
LSB2
LSB3
RSA0
RSB1
RSB2
RSB3
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0
0
0
0
0
0
0
Left DAC secondary b2 zero
0: normal
1: zero
Left DAC secondary b3 zero
0: normal
1: zero
Right DAC secondary a0 zero. Right DAC seconday modulator coeff tweaks.
0: normal
1: zero
Right DAC secondary b1 zero
0: normal
1: zero
Right DAC secondary b2 zero
0: normal
1: zero
Right DAC secondary b3 zero
0: normal
1: zero
164
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13.3.21 Register 21 (0x15)
Figure 239. Register 21 (0x15)
7
6
5
4
3
2
1
0
LSG1
R/W
Reserved
R/W
LSUB
R/W
Reserved
R/W
RSG1
R/W
Reserved
R/W
RSUB
R/W
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 179. Register 21 (0x15) Field Descriptions
Bit
7
Field
Type
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Reset
Description
LSG1
0
0
0
0
0
0
0
0
Left DAC secondary g1 gain. Left DAC secondary local loop gain
6
Reserved
LSUB
Reserved
5
Left DAC secondary upper bits. Number of left DAC secondary upper bits
4
Reserved
RSG1
Reserved
3
Right DAC secondary g1 gain. Right DAC secondary local loop gain
Reserved
2
Reserved
RSUB
1
Right DAC secondary upper bits. Number of right DAC secondary upper bits
Reserved
0
Reserved
13.3.22 Register 2 (0x16)
Figure 240. Register 22 (0x16)
7
6
5
4
3
2
1
0
Reserved
R/W
CPHY
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 180. Register 22 (0x16) Field Descriptions
Bit
7-2
1-0
Field
Type
R/W
R/W
Reset
Description
Reserved
CPHY
0
1
Reserved
CP Hysterisis - Hysterisis control of VNEG Detector
13.3.23 Register 23 (0x17)
Figure 241. Register 23 (0x17)
7
6
5
4
3
2
1
0
Reserved
R/W
CPHY
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 181. Register 23 (0x17) Field Descriptions
Bit
7-2
1-0
Field
Type
R/W
R/W
Reset
Description
Reserved
CPHY
0
1
Reserved
CP Hysterisis - Hysterisis control of VNEG Detector
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13.3.24 Register 24 (0x18)
Figure 242. Register 24 (0x18)
7
6
5
4
3
2
1
0
Reserved
R/W
OT33
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 182. Register 24 (0x18) Field Descriptions
Bit
7-3
2
Field
Type
R/W
R/W
R/W
R/W
Reset
Description
Reserved
0
1
0
0
Reserved
1
OT33
Bias current trimming for internal 3.3V oscillator. Bias current 00-111: ?-?uA
0
13.3.25 Register 25 (0x19)
Figure 243. Register 25 (0x19)
7
6
5
4
3
2
1
0
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 183. Register 25 (0x19) Field Descriptions
Bit
Field
Type
Reset
Description
7-0
Reserved
R/W
0
Reserved
13.3.26 Register 26 (0x1A)
Figure 244. Register 26 (0x1A)
7
6
5
4
3
2
1
0
RBTR
R/W
RCTR
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 184. Register 26 (0x1A) Field Descriptions
Bit
7
Field
Type
R/W
R/W
R/W
R/W
R/W
Reset
Description
0
1
0
0
0
6
RBTR
RCTR
REF BTrim. Trimming of bandgap reference voltage.
REF CTrim. Trimming of common voltage dividing AVDD.
5
4
3-0
166
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13.3.27 Register 27 (0x1B)
Figure 245. Register 27 (0x1B)
7
6
5
4
3
2
1
0
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 185. Register 27 (0x1B) Field Descriptions
Bit
Field
Type
Reset
Description
7-0
Reserved
R/W
0
Reserved
13.3.28 Register 28 (0x1C)
Figure 246. Register 28 (0x1C)
7
6
5
4
3
2
1
0
Reserved
R/W
PLLR
R/W
Reserved
R/W
PTST
R/W
PVC1
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 186. Register 28 (0x1C) Field Descriptions
Bit
Field
Type
Reset
Description
7-5
Reserved
R/W
0
Reserved
PLL RST - Reset counter of all divider.
0: Reset
1: Normal operation
4
3-2
1
PLLR
R/W
R/W
R/W
1
0
0
Reserved
PTST
Reserved
PLL IREF TEST. IREF test mode enable/disable.
0: normal
1: test mode
PLL VCIC.
0
PVCI
R/W
0
0: Normal operation
1: Brings higher free-running frequency
13.3.29 Register 29 (0x1D)
Figure 247. Register 29 (0x1D)
7
6
5
4
3
2
1
0
PLL IREF
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 187. Register 29 (0x1D) Field Descriptions
Bit
Field
Type
Reset
Description
Reference current control on test-mode.
00000000-11111111: ?? -??A
7-0
PLL IREF
R/W
0
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13.3.30 Register 30 (0x1E)
Figure 248. Register 30 (0x1E)
7
6
5
4
3
2
1
0
Reserved
R/W
PLLT
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 188. Register 30 (0x1E) Field Descriptions
Bit
Field
Type
Reset
Description
7-1
Reserved
R/W
0
Reserved
PLL TEST - Power up/down control for PFD in PLL at test mode.
0
PLLT
R/W
0
0: Power up
1: Power down
13.3.31 Register 31 (0x1F)
Figure 249. Register 31 (0x1F)
7
6
5
4
3
2
1
0
Reserved
R/W
LSFG
R/W
Reserved
R/W
LSPD
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 189. Register 31 (0x1F) Field Descriptions
Bit
Field
Type
Reset
Description
7-5
Reserved
R/W
0
Reserved
LDO_SCPZ - LDO short flag.
0: Short state
1: Not short state
4
3-1
0
LSFG
R/W
R/W
R/W
0
0
0
Reserved
LSPD
Reserved
LDO SCPD - LDO power down behavior at short condition.
0: LDO is automatically power down if short state detects
1: Disable
168
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13.3.32 Register 32 (0x20)
Figure 250. Register 32 (0x20)
7
6
5
4
3
2
1
0
Reserved
R/W
UTM1
R/W
UTM2
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 190. Register 32 (0x20) Field Descriptions
Bit
Field
Type
Reset
Description
7-2
Reserved
R/W
0
Reserved
UVP TEST mode 1 - Change external threshold voltage.
0: VH=0.7xDVDD, VL=0.3xDVDD
1: VH=0.67xDVDD, VL=0.33xDVDD
1
0
UTM1
UTM2
R/W
R/W
UVP TEST mode 2 - Change reference source for internal AVDD detection.
0: Divided LDO_1p8 by resistor
0
1: Bandgap reference of UVP
13.3.33 Register 33 (0x21)
Figure 251. Register 33 (0x21)
7
6
5
4
3
2
1
0
Reserved
R/W
TST1
R/W
TST2
R/W
TST3
R/W
TST4
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 191. Register 33 (0x21) Field Descriptions
Bit
Field
Type
Reset
Description
7-4
Reserved
R/W
0
Reserved
Analog test mode 1 - Line first stage load ctrl <0>
3
2
1
TST1
TST2
TST3
R/W
R/W
R/W
0
0
1
0: Disable
1: Enable
Analog test mode 2 - Line first stage load ctrl <1>0: Disable
1: Enable
Analog test mode 3 - Line slew rate ctrl <0>
0: Disable
1: Enable
Analog test mode 4 - Line slew rate ctrl <1>
0
TST4
R/W
1
0: Disable
1: Enable
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13.3.34 Register 34 (0x22)
Figure 252. Register 34 (0x22)
7
6
5
4
3
2
1
0
Reserved
R/W
RFPO
R/W
DLPO
R/W
LLPO
R/W
BLPO
R/W
CLPO
R/W
OLPO
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 192. Register 34 (0x22) Field Descriptions
Bit
Field
Type
Reset
Description
7-6
Reserved
R/W
0
Reserved
REF PWRDN override. Power up/down control for whole bias current.
5
4
3
2
1
RFPO
DLPO
LLPO
BLPO
CLPO
R/W
R/W
R/W
R/W
R/W
0
0
0
0
0
0: normal
1: override
Lch DAC PWRDN override. Power up/down control for Lch current DAC.
0: normal
1: override
Lch Line Driver PWRDN override. Power up/down control for Lch line driver
0: normal
1: override
Lch Line Bias PWRDN override. Power up/down control for bais block of Lch line driver
0: normal
1: override
Lch Line CMFB2 PWRDN override. Power up/down control for CMFB of Lch line driver
0: normal
1: override
Lch Output Stage PWRDN override. Power up/down control for output stage of Lch line
driver
0: normal
1: override
0
OLPO
R/W
0
170
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13.3.35 Register 35 (0x23)
Figure 253. Register 35 (0x23)
7
6
5
4
3
2
1
0
GLPO
R/W
ALPO
R/W
ULPO
R/W
CPPO
R/W
FLPO
R/W
SLPO
R/W
ILPO
R/W
WLPO
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 193. Register 35 (0x23) Field Descriptions
Bit
Field
Type
Reset
Description
Lch Gain control PWRDN override. Power up/down control for Lch gain control
7
GLPO
R/W
0
0: normal
1: override
Lch AMUTE override. Lch Analog Mute control.
6
5
4
ALPO
ULPO
CPPO
R/W
R/W
R/W
0
0
0
0: normal
1: override
Lch AMUTE dummy override. Lch Analog Mute control.
0: normal
1: override
CP PWRDN override. Power up/down control for negative charge pump.
0: normal
1: override
Lch OFSCOMP PWRDN override. Power up/down control for offset calibration block for
Lch line driver.
0: normal
1: override
3
2
1
0
FLPO
SLPO
ILPO
R/W
R/W
R/W
R/W
0
0
0
0
Lch Short Protection PWRDN override. Power up/down control for short protection of
Lch line driver.
0: normal
1: override
Lch IMP sense PWRDN override. Power up/down control for impedance sensing circuit
of Lch line driver.
0: normal
1: override
Lch IMP whole PWRDN override. Power up/down control for impedance sensing circuit
of Lch line driver at whole analog power down.
0: normal
WLPO
1: override
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13.3.36 Register 36 (0x24)
Figure 254. Register 36 (0x24)
7
6
5
4
3
2
1
0
Reserved
R/W
RFPS
R/W
DLPS
R/W
LLPS
R/W
BLPS
R/W
CLPS
R/W
OLPS
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 194. Register 36 (0x24) Field Descriptions
Bit
Field
Type
Reset
Description
7-6
Reserved
R/W
0
Reserved
REF PWRDN state. Power up/down control for whole bias current.
5
4
3
2
1
RFPS
DLPS
LLPS
BLPS
CLPS
R/W
R/W
R/W
R/W
R/W
0
0
0
0
0
0: Power down
1: Power up
Lch DAC PWRDN state. Power up/down control for Lch current DAC.
0: Power down
1: Power up
Lch Line Driver PWRDN state. Power up/down control for Lch line driver.
0: Power down
1: Power up
Lch Line Bias PWRDN state .Power up/down control for bais block of Lch line driver.
0: Power down
1: Power up
Lch Line CMFB2 PWRDN state. Power up/down control for CMFB of Lch line driver.
0: Power down
1: Power up
Lch Output Stage PWRDN state. Power up/down control for output stage of Lch line
driver.
0: Power down
1: Power up
0
OLPS
R/W
0
172
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13.3.37 Register 37 (0x25)
Figure 255. Register 37 (0x25)
7
6
5
4
3
2
1
0
GLPS
R/W
ALPS
R/W
ULPS
R/W
CPPS
R/W
FLPS
R/W
SLPS
R/W
ILPS
R/W
WLPS
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 195. Register 37 (0x25) Field Descriptions
Bit
Field
Type
Reset
Description
Lch Gain control PWRDN state. Power up/down control for Lch gain control.
7
GLPS
R/W
0
0: Power down
1: Power up
Lch AMUTE state. Lch Analog Mute control.
0: Power down
1: Power up
6
5
4
ALPS
ULPS
CPPS
R/W
R/W
R/W
0
0
0
Lch AMUTE dummy state. Lch Analog Mute control.
0: Power down
1: Power up
CP PWRDN state. Power up/down control for negative charge pump.
0: Power down
1: Power up
Lch OFSCOMP PWRDN state. Power up/down control for offset calibration block for
Lch line driver.
0: Power down
1: Power up
3
2
1
0
FLPS
SLPS
ILPS
R/W
R/W
R/W
R/W
0
0
0
0
Lch Short Protection PWRDN state. Power up/down control for short protection of Lch
line driver.
0: Power down
1: Power up
Lch IMP sense PWRDN state. Power up/down control for impedance sensing circuit of
Lch line driver.
0: Power down
1: Power up
Lch IMP whole PWRDN state. Power up/down control for impedance sensing circuit of
Lch line driver at whole analog power down.
0: Power down
WLPS
1: Power up
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13.3.38 Register 38 (0x26)
Figure 256. Register 38 (0x26)
7
6
5
4
3
2
1
0
Reserved
R/W
DRPO
R/W
LRPO
R/W
BRPO
R/W
CRPO
R/W
ORPO
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 196. Register 38 (0x26) Field Descriptions
Bit
Field
Type
Reset
Description
7-5
Reserved
R/W
0
Reserved
Rch DAC PWRDN override. Power up/down control for Rch current DAC.
4
3
DRPO
LRPO
R/W
R/W
0
0
0: normal
1: override
Rch Line Driver PWRDN override. Power up/down control for Rch line driver.
0: normal
1: override
Rch Line Bias PWRDN override. Power up/down control for bais block of Rch line
driver.
0: normal
1: override
2
1
0
BRPO
CRPO
ORPO
R/W
R/W
R/W
0
0
0
Rch Line CMFB2 PWRDN override. Power up/down control for CMFB of Rch line
driver.
0: normal
1: override
Rch Output Stage PWRDN override. Power up/down control for output stage of Rch
line driver.
0: normal
1: override
174
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13.3.39 Register 39 (0x27)
Figure 257. Register 39 (0x27)
7
6
5
4
3
2
1
0
GRPO
R/W
ARPO
R/W
URPO
R/W
Reserved
R/W
FRPO
R/W
SRPO
R/W
IRPO
R/W
WRPO
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 197. Register 39 (0x27) Field Descriptions
Bit
Field
Type
Reset
Description
Rch Gain control PWRDN override. Power up/down control for Rch gain control.
7
GRPO
R/W
0
0: normal
1: override
Rch AMUTE override. Rch Analog Mute control.
6
ARPO
R/W
0
0: normal
1: override
Rch AMUTE dummy override. Rch Analog Mute control.
5
4
URPO
R/W
R/W
0
0
0: normal
1: override
Reserved
Reserved
Rch OFSCOMP PWRDN override. Power up/down control for offset calibration block
for Rch line driver.
0: normal
1: override
3
2
1
0
FRPO
SRPO
IRPO
R/W
R/W
R/W
R/W
0
0
0
0
Rch Short Protection PWRDN override. Power up/down control for short protection of
Rch line driver.
0: normal
1: override
Rch IMP sense PWRDN override. Power up/down control for impedance sensing circuit
of Rch line driver.
0: normal
1: override
Rch IMP whole PWRDN override. Power up/down control for Rch impedance sensing
circuit of Rch line driver at whole analog power down.
0: normal
WRPO
1: override
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13.3.40 Register 40 (0x28)
Figure 258. Register 40 (0x28)
7
6
5
4
3
2
1
0
Reserved
R/W
DRPS
R/W
LRPS
R/W
BRPS
R/W
CRPS
R/W
ORPS
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 198. Register 40 (0x28) Field Descriptions
Bit
Field
Type
Reset
Description
7-5
Reserved
R/W
0
Reserved
Rch DAC PWRDN state. Power up/down control for Rch current DAC.
4
3
2
1
DRPS
LRPS
BRPS
CRPS
R/W
R/W
R/W
R/W
0
0
0
0
0: Power down
1: Power up
Rch Line Driver PWRDN state. Power up/down control for Rch line driver.
0: Power down
1: Power up
Rch Line Bias PWRDN state. Power up/down control for bais block of Rch line driver.
0: Power down
1: Power up
Rch Line CMFB2 PWRDN state. Power up/down control for CMFB of Rch line driver.
0: Power down
1: Power up
Rch Output Stage PWRDN state. Power up/down control for output stage of Rch line
driver.
0: Power down
1: Power up
0
ORPS
R/W
0
176
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13.3.41 Register 41 (0x29)
Figure 259. Register 41 (0x29)
7
6
5
4
3
2
1
0
GRPS
R/W
ARPS
R/W
URPS
R/W
Reserved
R/W
FRPS
R/W
SRPS
R/W
IRPS
R/W
WRPS
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 199. Register 41 (0x29) Field Descriptions
Bit
Field
Type
Reset
Description
Rch Gain control PWRDN state. Power up/down control for Rch gain control.
7
GRPS
R/W
0
0: Power down
1: Power up
Rch AMUTE state. Rch Analog Mute control.
0: Power down
6
ARPS
R/W
0
1: Power up
Rch AMUTE dummy state. Rch Analog Mute control.
5
4
URPS
R/W
R/W
0
0
0: Power down
1: Power up
Reserved
Reserved
Rch OFSCOMP PWRDN state. Power up/down control for offset calibration block for
Rch line driver.
0: Power down
1: Power up
3
2
1
0
FRPS
SRPS
IRPS
R/W
R/W
R/W
R/W
0
0
0
0
Rch Short Protection PWRDN state. Power up/down control for short protection of Rch
line driver.
0: Power down
1: Power up
Rch IMP sense PWRDN state. Power up/down control for impedance sensing circuit of
Rch line driver.
0: Power down
1: Power up
Rch IMP whole PWRDN state. Power up/down control for Rch impedance sensing
circuit of Rch line driver at whole analog power down.
0: Power down
1: Power up
WRPS
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13.3.42 Register 42 (0x2A)
Figure 260. Register 42 (0x2A)
7
6
5
4
3
2
1
0
Reserved
R/W
CMEN
R/W
Reserved
R/W
CMSL
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 200. Register 42 (0x2A) Field Descriptions
Bit
Field
Type
Reset
Description
7-5
Reserved
R/W
0
Reserved
CP operation mode control enable. Enable/Disable for charge pump mode select.
4
3-1
0
CMEN
R/W
R/W
R/W
0
0
1
0: Disable
1: Enable
Reserved
CMSL
Reserved
CP operation mode select. Charge pump mode select by register.
0: Normal operation
1: Constant current mode
13.3.43 Register 43 (0x2B)
Figure 261. Register 43 (0x2B)
7
6
5
4
3
2
1
0
Reserved
R/W
CHDP
R/W
Reserved
R/W
CHI4
R/W
HDEN
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 201. Register 43 (0x2B) Field Descriptions
Bit
Field
Type
Reset
Description
7-5
Reserved
R/W
0
Reserved
CHD power up/down control. Power up/down control for clock halt detector.
4
3-2
1
CHDP
R/W
R/W
R/W
1
0
0
0: Power down
1: Power up
Reserved
CHI4
Reserved
CHD current control override. x4 current control for clock halt detector.
0: Normal operation
1: x4 current operation
CHD detector enable/disable control. Enable/disable control for clock halt detector. At
'disable', output shows "1".
0: Enable
0
HDEN
R/W
0
1: Disable
178
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13.3.44 Register 44 (0x2C)
Figure 262. Register 44 (0x2C)
7
6
5
4
3
2
1
0
Reserved
R/W
LBPD
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 202. Register 44 (0x2C) Field Descriptions
Bit
Field
Type
Reset
Description
7-1
Reserved
R/W
0
Reserved
LDO bandgap power up/down control. LDO bandgap power/up down control on Test
mode.
0: Power down
1: Power up
0
LBPD
R/W
0
13.3.45 Register 63 (0x3F)
Figure 263. Register 63 (0x3F)
7
6
5
4
3
2
1
0
PWD1
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 203. Register 63 (0x3F) Field Descriptions
Bit
Field
Type
Reset
Description
Password1
First word of password.
Both words of password must be correctly set in order to unlock test registers.
7-0
PWD1
R/W
0
When locked, writing to test registers are inhibited and reading them will return 0.
13.3.46 Register 64 (0x40)
Figure 264. Register 64 (0x40)
7
6
5
4
3
2
1
0
PWD2
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 204. Register 64 (0x40) Field Descriptions
Bit
Field
Type
Reset
Description
Password2
First word of password.
Both words of password must be correctly set in order to unlock test registers.
When locked, writing to test registers are inhibited and reading them will return 0.
7-0
PWD2
R/W
0
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13.3.47 Register 65 (0x41)
Figure 265. Register 65 (0x41)
7
6
5
4
3
1
0
Reserved
R/W
TSEL
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 205. Register 65 (0x41) Field Descriptions
Bit
Field
Type
Reset
Description
7-4
Reserved
R/W
0
Reserved
Test Mode Selection (No longer need)
0: Normal
1:SCAN
2:IDDQ
3:VOH
4:VOL
3-0
TSEL
R/W
0
5: VIL
6:VIH
7:HI-Z
13.3.48 Register 70 (0x46)
Figure 266. Register 70 (0x46)
7
6
5
4
3
1
0
Left Channel DIFF Manual Offset (Q5.2)
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 206. Register 70 (0x46) Field Descriptions
Bit
Field
Type
Reset
Description
Add manual offset to the left channel DIFF offset compensator.
Observed offset delta:
0111111 : -15.75 mV
0111110 : -15.50 mV
0111101 : -15.25 mV
…
0000001 : -0.25 mV
0000000 : 0.0 mV
1111111 : 0.25 mV
…
Left Channel
DIFF Manual
Offset (Q5.2)
7-0
R/W
0
1000010 : 15.50 mV
1000001 : 15.75 mV
1000000 : 16.0 mV
180
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TAS5780M
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ZHCSFY4 –DECEMBER 2016
13.3.49 Register 71 (0x47)
Figure 267. Register 71 (0x47)
7
6
5
4
3
1
0
Left Channel CMFB Manual Offset (Q6.2)
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 207. Register 71 (0x47) Field Descriptions
Bit
Field
Type
Reset
Description
Add manual offset to the left channel CMFB offset compensator.
Observed offset delta:
0111111 : -31.75 mV
0111110 : -31.50 mV
0111101 : -31.25 mV
…
0000001 : -0.25 mV
0000000 : 0.0 mV
1111111 : 0.25 mV
…
Left Channel
CMFB Manual
Offset (Q6.2)
7-0
R/W
0
1000010 : 31.50 mV
1000001 : 31.75 mV
1000000 : 32.0 mV
13.3.50 Register 72 (0x48)
Figure 268. Register 72 (0x48)
7
6
5
4
3
1
0
Right Channel DIFF Manual Offset (Q5.2)
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 208. Register 72 (0x48) Field Descriptions
Bit
Field
Type
Reset
Description
Add manual offset to the right channel DIFF offset compensator.
Observed offset delta:
0111111 : -15.75 mV
0111110 : -15.50 mV
0111101 : -15.25 mV
…
0000001 : -0.25 mV
0000000 : 0.0 mV
1111111 : 0.25 mV
…
Right Channel
DIFF Manual
Offset (Q5.2)
7-0
R/W
0
1000010 : 15.50 mV
1000001 : 15.75 mV
1000000 : 16.0 mV
Copyright © 2016, Texas Instruments Incorporated
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13.3.51 Register 73 (0x49)
Figure 269. Register 73 (0x49)
7
6
5
4
3
1
0
Right Channel CMFB Manual Offset (Q6.2)
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 209. Register 73 (0x49) Field Descriptions
Bit
Field
Type
Reset
Description
Add manual offset to the right channel CMFB offset compensator.
Observed offset delta:
0111111 : -31.75 mV
0111110 : -31.50 mV
0111101 : -31.25 mV
…
0000001 : -0.25 mV
0000000 : 0.0 mV
1111111 : 0.25 mV
…
Right Channel
CMFB Manual
Offset (Q6.2)
7-0
R/W
0
1000010 : 31.50 mV
1000001 : 31.75 mV
1000000 : 32.0 mV
13.3.52 Register 74 (0x4A)
Figure 270. Register 74 (0x4A)
7
6
5
4
3
1
0
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 210. Register 74 (0x4A) Field Descriptions
Bit
Field
Type
Reset
Description
7-0
Reserved
R/W
0
Reserved
13.3.53 Register 75 (0x4B)
Figure 271. Register 75 (0x4B)
7
6
5
4
3
1
0
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 211. Register 75 (0x4B) Field Descriptions
Bit
Field
Type
Reset
Description
7-0
Reserved
R/W
0
Reserved
182
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ZHCSFY4 –DECEMBER 2016
13.3.54 Register 76 (0x4C)
Figure 272. Register 76 (0x4C)
7
6
5
4
3
1
0
Reserved
Left Channel
DIFF Monitor(8)
R/W
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 212. Register 76 (0x4C) Field Descriptions
Bit
Field
Type
Reset
Description
7-1
Reserved
R/W
0
Reserved
This register shows the approximation of original / compensated left channel DIFF
offset.
Observed offset delta:
0111111 : 63.75 mV
0111110 : 63.50 mV
0111101 : 63.25 mV
…
0000001 : 0.25 mV
0000000 : 0.0 mV
1111111 : -0.25 mV
…
Left Channel DIFF
Monitor(8)
0
R
1000010 : -63.50 mV
1000001 : -63.75 mV
1000000 : -64.0 mV
13.3.55 Register 77 (0x4D)
Figure 273. Register 77 (0x4D)
7
6
5
4
3
1
0
Left Channel DIFF Monitor(7:0)
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 213. Register 77 (0x4D) Field Descriptions
Bit
Field
Type
Reset
Description
This register shows the approximation of original / compensated left channel DIFF
offset.
Observed offset delta:
0111111 : 63.75 mV
0111110 : 63.50 mV
0111101 : 63.25 mV
…
0000001 : 0.25 mV
0000000 : 0.0 mV
1111111 : -0.25 mV
…
Left Channel
DIFF Monitor(7:0)
7-0
R
1000010 : -63.50 mV
1000001 : -63.75 mV
1000000 : -64.0 mV
Copyright © 2016, Texas Instruments Incorporated
183
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13.3.56 Register 78 (0x4E)
Figure 274. Register 78 (0x4E)
7
6
5
4
3
1
0
Reserved
R/W
I048
RW
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 214. Register 78 (0x4E) Field Descriptions
Bit
Field
Type
Reset
Description
7-5
Reserved
R/W
0
Reserved
FS Det 48 kHz Min Range . Minimum OSC count in LRCLK for 48 kHz detection.
Decimal Value 863.
4-0
I048
R/W
0
13.3.57 Register 79 (0x4F)
Figure 275. Register 79 (0x4F)
7
6
5
4
3
1
0
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 215. Register 79 (0x4F) Field Descriptions
Bit
Field
Type
Reset
Description
7-0
Reserved
R/W
0
Reserved
13.3.58 Register 80 (0x50)
Figure 276. Register 80 (0x50)
7
6
5
4
3
1
0
Reserved
R/W
X048
RW
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 216. Register 80 (0x50) Field Descriptions
Bit
Field
Type
Reset
Description
7-5
Reserved
R/W
0
Reserved
FS Det 48 kHz Max Range. Minimum OSC count in LRCLK for 48 kHz detection.
Decimal Value 2479.
4-0
X048
R/W
0
13.3.59 Register 81 (0x51)
Figure 277. Register 81 (0x51)
7
6
5
4
3
1
0
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 217. Register 81 (0x51) Field Descriptions
Bit
Field
Type
Reset
Description
7-0
Reserved
R/W
0
Reserved
184
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ZHCSFY4 –DECEMBER 2016
13.3.60 Register 82 (0x52)
Figure 278. Register 82 (0x52)
7
6
5
4
3
1
0
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 218. Register 82 (0x52) Field Descriptions
Bit
Field
Type
Reset
Description
7-0
Reserved
R/W
0
Reserved
13.3.61 Register 83 (0x53)
Figure 279. Register 83 (0x53)
7
6
5
4
3
1
0
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 219. Register 83 (0x53) Field Descriptions
Bit
Field
Type
Reset
Description
7-0
Reserved
R/W
0
Reserved
13.3.62 Register 84 (0x54)
Figure 280. Register 84 (0x54)
7
6
5
4
3
1
0
Reserved
Left Channel
CMFB Monitor
(8)
R/W
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 220. Register 84 (0x54) Field Descriptions
Bit
Field
Type Reset
R/W
Description
7-1
Reserved
0
Reserved
This register shows the approximation of original / compensated left channel CMFB
offset.
Observed offset delta:
0111111 : 63.75 mV
0111110 : 63.50 mV
0111101 : 63.25 mV
…
0000001 : 0.25 mV
0000000 : 0.0 mV
1111111 : -0.25 mV
…
Left Channel CMFB
Monitor(8)
0
R
1000010 : -63.50 mV
1000001 : -63.75 mV
1000000 : -64.0 mV
Copyright © 2016, Texas Instruments Incorporated
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13.3.63 Register 85 (0x55)
Figure 281. Register 85 (0x55)
7
6
5
4
3
1
0
Left Channel CMFB Monitor (7:0)
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 221. Register 85 (0x55) Field Descriptions
Bit
Field
Type
Reset
Description
This register shows the approximation of original / compensated left channel CMFB
offset.
Observed offset delta:
0111111 : 63.75 mV
0111110 : 63.50 mV
0111101 : 63.25 mV
…
0000001 : 0.25 mV
0000000 : 0.0 mV
1111111 : –0.25 mV
…
Left Channel
CMFB Monitor
(7:0)
7-0
R
1000010 : –63.50 mV
1000001 : –63.75 mV
1000000 : –64.0 mV
13.3.64 Register 86 (0x56)
Figure 282. Register 86 (0x56)
7
6
5
4
3
1
0
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 222. Register 86 (0x56) Field Descriptions
Bit
Field
Type
Reset
Description
7-0
Reserved
R/W
0
Reserved
13.3.65 Register 87 (0x57)
Figure 283. Register 87 (0x57)
7
6
5
4
3
1
0
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 223. Register 87 (0x57) Field Descriptions
Bit
Field
Type
Reset
Description
7-0
Reserved
R/W
0
Reserved
186
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ZHCSFY4 –DECEMBER 2016
13.3.66 Register 88 (0x58)
Figure 284. Register 88 (0x58)
7
6
5
4
3
1
0
Reserved
Right Channel
DIFF Monitor
(8)
R/W
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 224. Register 88 (0x58) Field Descriptions
Bit
Field
Type
Reset
Description
7-1
Reserved
R/W
0
Reserved
This register shows the approximation of original / compensated right channel DIFF
offset.
Observed offset delta:
0111111 : 63.75 mV
0111110 : 63.50 mV
0111101 : 63.25 mV
…
0000001 : 0.25 mV
0000000 : 0.0 mV
1111111 : -0.25 mV
…
Right Channel
DIFF Monitor (8)
0
R
1000010 : -63.50 mV
1000001 : -63.75 mV
1000000 : -64.0 mV
13.3.67 Register 89 (0x59)
Figure 285. Register 89 (0x59)
7
6
5
4
3
1
0
Right Channel DIFF Monitor (7:0)
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 225. Register 89 (0x59) Field Descriptions
Bit
Field
Type
Reset
Description
This register shows the approximation of original / compensated right channel DIFF
offset.
Observed offset delta:
0111111 : 63.75 mV
0111110 : 63.50 mV
0111101 : 63.25 mV
…
0000001 : 0.25 mV
0000000 : 0.0 mV
1111111 : -0.25 mV
…
Right Channel
DIFF Monitor
(7:0)
7-0
R
1000010 : -63.50 mV
1000001 : -63.75 mV
1000000 : -64.0 mV
Copyright © 2016, Texas Instruments Incorporated
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13.3.68 Register 90 (0x5A)
Figure 286. Register 90 (0x5A)
7
6
5
4
3
1
0
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 226. Register 90 (0x5A) Field Descriptions
Bit
Field
Type
Reset
Description
7-0
Reserved
R/W
0
Reserved
13.3.69 Register 91 (0x5B)
Figure 287. Register 91 (0x5B)
7
6
5
4
3
1
0
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 227. Register 91 (0x5B) Field Descriptions
Bit
Field
Type
Reset
Description
7-0
Reserved
R/W
0
Reserved
13.3.70 Register 92 (0x5C)
Figure 288. Register 92 (0x5C)
7
6
5
4
3
1
0
Reserved
Right Channel
CMFB Monitor
(8)
R/W
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 228. Register 92 (0x5C) Field Descriptions
Bit
Field
Type
Reset
Description
7-1
Reserved
R/W
0
Reserved
This register shows the approximation of original / compensated right channel CMFB
offset.
Observed offset delta:
0111111 : 63.75 mV
0111110 : 63.50 mV
0111101 : 63.25 mV
…
0000001 : 0.25 mV
0000000 : 0.0 mV
1111111 : –0.25 mV
…
Right Channel
CMFB Monitor(8)
0
R
1000010 : –63.50 mV
1000001 : –63.75 mV
1000000 : –64.0 mV
188
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ZHCSFY4 –DECEMBER 2016
13.3.71 Register 93 (0x5D)
Figure 289. Register 93 (0x5D)
7
6
5
4
3
1
0
Right Channel CMFB Monito r(7:0)
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 229. Register 93 (0x5D) Field Descriptions
Bit
Field
Type
Reset
Description
This register shows the approximation of original / compensated right channel CMFB
offset.
Observed offset delta:
0111111 : 63.75 mV
0111110 : 63.50 mV
0111101 : 63.25 mV
…
0000001 : 0.25 mV
0000000 : 0.0 mV
1111111 : –0.25 mV
…
Right Channel
CMFB Monitor
(7:0)
7-0
R
1000010 : –63.50 mV
1000001 : –63.75 mV
1000000 : –64.0 mV
13.4 DSP Memory Map
Table 230. Memory Map — Book 0x78 (120)(1)
SUB
ADDRESS
NUMBER OF BYTES /
PAGE
REGISTER NAME
DEFAULT VALUE
DESCRIPTION
FORMAT
LEVEL METER
4 / 1.31
0x54
0x58
0x0C
0x0C
Level Meter Left Output
0x000000--
0x000000--
Level Meter Left Output
Level Meter Right
Output
Level Meter Right
Output
4 / 1.31
SECONDARY EQ LEFT 12 BQS
4 / 5.27
0x08
0x0C
0x10
0x14
0x18
0x1C
0x20
0x24
0x28
0x2C
0x30
0x34
0x38
0x3C
0x40
0x44
0x48
0x4C
0x50
0x15
0x15
0x15
0x15
0x15
0x15
0x15
0x15
0x15
0x15
0x15
0x15
0x15
0x15
0x15
0x15
0x15
0x15
0x15
CH-L BQ 1 B0
CH-L BQ 1 B1
CH-L BQ 1 B2
CH-L BQ 1 A1
CH-L BQ 1 A2
CH-L BQ 2 B0
CH-L BQ 2 B1
CH-L BQ 2 B2
CH-L BQ 2 A1
CH-L BQ 2 A2
CH-L BQ 3 B0
CH-L BQ 3 B1
CH-L BQ 3 B2
CH-L BQ 3 A1
CH-L BQ 3 A2
CH-L BQ 4 B0
CH-L BQ 4 B1
CH-L BQ 4 B2
CH-L BQ 4 A1
0x7FFFFFFF
0x00000000
0x00000000
0x00000000
0x00000000
0x7FFFFFFF
0x00000000
0x00000000
0x00000000
0x00000000
0x7FFFFFFF
0x00000000
0x00000000
0x00000000
0x00000000
0x7FFFFFFF
0x00000000
0x00000000
0x00000000
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
4 / 6.26
4 / 5.27
4 / 2.30
4 / 1.31
4 / 1.31
4 / 2.30
4 / 1.31
4 / 2.30
4 / 1.31
4 / 1.31
4 / 2.30
4 / 1.31
4 / 2.30
4 / 1.31
4 / 1.31
4 / 2.30
4 / 1.31
4 / 2.30
(1) The registers in this table do not require the swap flag to work
Copyright © 2016, Texas Instruments Incorporated
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ZHCSFY4 –DECEMBER 2016
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DSP Memory Map (continued)
Table 230. Memory Map — Book 0x78 (120)(1) (continued)
SUB
ADDRESS
NUMBER OF BYTES /
FORMAT
PAGE
REGISTER NAME
DEFAULT VALUE
DESCRIPTION
0x54
0x58
0x5C
0x60
0x64
0x68
0x6C
0x70
0x74
0x78
0x7C
0x08
0x0C
0x10
0x14
0x18
0x1C
0x20
0x24
0x28
0x2C
0x30
0x34
0x38
0x3C
0x40
0x44
0x48
0x4C
0x50
0x54
0x58
0x5C
0x60
0x64
0x68
0x6C
0x70
0x74
0x78
0x7C
0x15
0x15
0x15
0x15
0x15
0x15
0x15
0x15
0x15
0x15
0x15
0x16
0x16
0x16
0x16
0x16
0x16
0x16
0x16
0x16
0x16
0x16
0x16
0x16
0x16
0x16
0x16
0x16
0x16
0x16
0x16
0x16
0x16
0x16
0x16
0x16
0x16
0x16
0x16
0x16
0x16
CH-L BQ 4 A2
CH-L BQ 5 B0
CH-L BQ 5 B1
CH-L BQ 5 B2
CH-L BQ 5 A1
CH-L BQ 5 A2
CH-L BQ 6 B0
CH-L BQ 6 B1
CH-L BQ 6 B2
CH-L BQ 6 A1
CH-L BQ 6 A2
CH-L BQ 7 B0
CH-L BQ 7 B1
CH-L BQ 7 B2
CH-L BQ 7 A1
CH-L BQ 7 A2
CH-L BQ 8 B0
CH-L BQ 8 B1
CH-L BQ 8 B2
CH-L BQ 8 A1
CH-L BQ 8 A2
CH-L BQ 9 B0
CH-L BQ 9 B1
CH-L BQ 9 B2
CH-L BQ 9 A1
CH-L BQ 9 A2
CH-L BQ 10 B0
CH-L BQ 10 B1
CH-L BQ 10 B2
CH-L BQ 10 A1
CH-L BQ 10 A2
CH-L BQ 11 B0
CH-L BQ 11 B1
CH-L BQ 11 B2
CH-L BQ 11 A1
CH-L BQ 11 A2
CH-L BQ 12 B0
CH-L BQ 12 B1
CH-L BQ 12 B2
CH-L BQ 12 A1
CH-L BQ 12 A2
4 / 1.31
4 / 1.31
0x00000000
0x7FFFFFFF
0x00000000
0x00000000
0x00000000
0x00000000
0x7FFFFFFF
0x00000000
0x00000000
0x00000000
0x00000000
0x7FFFFFFF
0x00000000
0x00000000
0x00000000
0x00000000
0x7FFFFFFF
0x00000000
0x00000000
0x00000000
0x00000000
0x7FFFFFFF
0x00000000
0x00000000
0x00000000
0x00000000
0x7FFFFFFF
0x00000000
0x00000000
0x00000000
0x00000000
0x7FFFFFFF
0x00000000
0x00000000
0x00000000
0x00000000
0x7FFFFFFF
0x00000000
0x00000000
0x00000000
0x00000000
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
4 / 2.30
4 / 1.31
4 / 2.30
4 / 1.31
4 / 1.31
4 / 2.30
4 / 1.31
4 / 2.30
4 / 1.31
4 / 1.31
4 / 2.30
4 / 1.31
4 / 2.30
4 / 1.31
4 / 1.31
4 / 2.30
4 / 1.31
4 / 2.30
4 / 1.31
4 / 1.31
4 / 2.30
4 / 1.31
4 / 2.30
4 / 1.31
4 / 1.31
4 / 2.30
4 / 1.31
4 / 2.30
4 / 1.31
4 / 1.31
4 / 2.30
4 / 1.31
4 / 2.30
4 / 1.31
4 / 1.31
4 / 2.30
4 / 1.31
4 / 2.30
4 / 1.31
SECONDARY EQ RIGHT 12 BQS
4 / 5.27
0x08
0x0C
0x10
0x17
0x17
0x17
CH-R BQ 1 B0
CH-R BQ 1 B1
CH-R BQ 1 B2
0x7FFFFFFF
0x00000000
0x00000000
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
4 / 6.26
4 / 5.27
190
Copyright © 2016, Texas Instruments Incorporated
TAS5780M
www.ti.com.cn
ZHCSFY4 –DECEMBER 2016
DSP Memory Map (continued)
Table 230. Memory Map — Book 0x78 (120)(1) (continued)
SUB
ADDRESS
NUMBER OF BYTES /
FORMAT
PAGE
REGISTER NAME
DEFAULT VALUE
DESCRIPTION
0x14
0x18
0x1C
0x20
0x24
0x28
0x2C
0x30
0x34
0x38
0x3C
0x40
0x44
0x48
0x4C
0x50
0x54
0x58
0x5C
0x60
0x64
0x68
0x6C
0x70
0x74
0x78
0x7C
0x08
0x0C
0x10
0x14
0x18
0x1C
0x20
0x24
0x28
0x2C
0x30
0x34
0x38
0x3C
0x40
0x44
0x48
0x4C
0x17
0x17
0x17
0x17
0x17
0x17
0x17
0x17
0x17
0x17
0x17
0x17
0x17
0x17
0x17
0x17
0x17
0x17
0x17
0x17
0x17
0x17
0x17
0x17
0x17
0x17
0x17
0x18
0x18
0x18
0x18
0x18
0x18
0x18
0x18
0x18
0x18
0x18
0x18
0x18
0x18
0x18
0x18
0x18
0x18
CH-R BQ 1 A1
CH-R BQ 1 A2
CH-R BQ 2 B0
CH-R BQ 2 B1
CH-R BQ 2 B2
CH-R BQ 2 A1
CH-R BQ 2 A2
CH-R BQ 3 B0
CH-R BQ 3 B1
CH-R BQ 3 B2
CH-R BQ 3 A1
CH-R BQ 3 A2
CH-R BQ 4 B0
CH-R BQ 4 B1
CH-R BQ 4 B2
CH-R BQ 4 A1
CH-R BQ 4 A2
CH-R BQ 5 B0
CH-R BQ 5 B1
CH-R BQ 5 B2
CH-R BQ 5 A1
CH-R BQ 5 A2
CH-R BQ 6 B0
CH-R BQ 6 B1
CH-R BQ 6 B2
CH-R BQ 6 A1
CH-R BQ 6 A2
CH-R BQ 7 B0
CH-R BQ 7 B1
CH-R BQ 7 B2
CH-R BQ 7 A1
CH-R BQ 7 A2
CH-R BQ 8 B0
CH-R BQ 8 B1
CH-R BQ 8 B2
CH-R BQ 8 A1
CH-R BQ 8 A2
CH-R BQ 9 B0
CH-R BQ 9 B1
CH-R BQ 9 B2
CH-R BQ 9 A1
CH-R BQ 9 A2
CH-R BQ 10 B0
CH-R BQ 10 B1
CH-R BQ 10 B2
4 / 2.30
4 / 1.31
4 / 1.31
4 / 2.30
4 / 1.31
4 / 2.30
4 / 1.31
4 / 1.31
4 / 2.30
4 / 1.31
4 / 2.30
4 / 1.31
4 / 1.31
4 / 2.30
4 / 1.31
4 / 2.30
4 / 1.31
4 / 1.31
4 / 2.30
4 / 1.31
4 / 2.30
4 / 1.31
4 / 1.31
4 / 2.30
4 / 1.31
4 / 2.30
4 / 1.31
4 / 1.31
4 / 2.30
4 / 1.31
4 / 2.30
4 / 1.31
4 / 1.31
4 / 2.30
4 / 1.31
4 / 2.30
4 / 1.31
4 / 1.31
4 / 2.30
4 / 1.31
4 / 2.30
4 / 1.31
4 / 1.31
4 / 2.30
4 / 1.31
0x00000000
0x00000000
0x7FFFFFFF
0x00000000
0x00000000
0x00000000
0x00000000
0x7FFFFFFF
0x00000000
0x00000000
0x00000000
0x00000000
0x7FFFFFFF
0x00000000
0x00000000
0x00000000
0x00000000
0x7FFFFFFF
0x00000000
0x00000000
0x00000000
0x00000000
0x7FFFFFFF
0x00000000
0x00000000
0x00000000
0x00000000
0x7FFFFFFF
0x00000000
0x00000000
0x00000000
0x00000000
0x7FFFFFFF
0x00000000
0x00000000
0x00000000
0x00000000
0x7FFFFFFF
0x00000000
0x00000000
0x00000000
0x00000000
0x7FFFFFFF
0x00000000
0x00000000
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Copyright © 2016, Texas Instruments Incorporated
191
TAS5780M
ZHCSFY4 –DECEMBER 2016
www.ti.com.cn
DSP Memory Map (continued)
Table 230. Memory Map — Book 0x78 (120)(1) (continued)
SUB
ADDRESS
NUMBER OF BYTES /
FORMAT
PAGE
REGISTER NAME
DEFAULT VALUE
DESCRIPTION
0x50
0x54
0x58
0x5C
0x60
0x64
0x68
0x6C
0x70
0x74
0x78
0x7C
0x18
0x18
0x18
0x18
0x18
0x18
0x18
0x18
0x18
0x18
0x18
0x18
CH-R BQ 10 A1
CH-R BQ 10 A2
CH-R BQ 11 B0
CH-R BQ 11 B1
CH-R BQ 11 B2
CH-R BQ 11 A1
CH-R BQ 11 A2
CH-R BQ 12 B0
CH-R BQ 12 B1
CH-R BQ 12 B2
CH-R BQ 12 A1
CH-R BQ 12 A2
4 / 2.30
4 / 1.31
4 / 1.31
4 / 2.30
4 / 1.31
4 / 2.30
4 / 1.31
4 / 1.31
4 / 2.30
4 / 1.31
4 / 2.30
4 / 1.31
0x00000000
0x00000000
0x7FFFFFFF
0x00000000
0x00000000
0x00000000
0x00000000
0x7FFFFFFF
0x00000000
0x00000000
0x00000000
0x00000000
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
SECONDARY BQ GAIN SCALE AND VOLUME
0x08
0x0C
0x19
0x19
Left Gain
4 / 8.24
Gain
Gain
Right Gain
4 / 8.24
BANK SWITCH
0x08
0x14
Left Gain
4 / 32.0
0x00000000
Needs swap flag to run -
Table 231. Memory Map — Book 0x8C (140)(1)
SUB
ADDRESS
NUMBER OF BYTES /
PAGE
REGISTER NAME
DEFAULT VALUE
DESCRIPTION
FORMAT
DSP MEMORY UPDATE
4 / 32.0
0x10
0x01
DSP Memory Swap Flag
0x00000000
DSP Memory Swap Flag
MAIN EQ LEFT 12 BQS
4 / 5.27
0x58
0x5C
0x60
0x64
0x68
0x6C
0x70
0x74
0x78
0x7C
0x08
0x0C
0x10
0x14
0x18
0x1C
0x20
0x24
0x1B
0x1B
0x1B
0x1B
0x1B
0x1B
0x1B
0x1B
0x1B
0x1B
0x1C
0x1C
0x1C
0x1C
0x1C
0x1C
0x1C
0x1C
CH-L BQ 1 B0
CH-L BQ 1 B1
CH-L BQ 1 B2
CH-L BQ 1 A1
CH-L BQ 1 A2
CH-L BQ 2 B0
CH-L BQ 2 B1
CH-L BQ 2 B2
CH-L BQ 2 A1
CH-L BQ 2 A2
CH-L BQ 3 B0
CH-L BQ 3 B1
CH-L BQ 3 B2
CH-L BQ 3 A1
CH-L BQ 3 A2
CH-L BQ 4 B0
CH-L BQ 4 B1
CH-L BQ 4 B2
0x7FFFFFFF
0x00000000
0x00000000
0x00000000
0x00000000
0x7FFFFFFF
0x00000000
0x00000000
0x00000000
0x00000000
0x7FFFFFFF
0x00000000
0x00000000
0x00000000
0x00000000
0x7FFFFFFF
0x00000000
0x00000000
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
4 / 6.26
4 / 5.27
4 / 2.30
4 / 1.31
4 / 1.31
4 / 2.30
4 / 1.31
4 / 2.30
4 / 1.31
4 / 1.31
4 / 2.30
4 / 1.31
4 / 2.30
4 / 1.31
4 / 1.31
4 / 2.30
4 / 1.31
(1) Will be set to default anytime a DSP reset, CP error or device standby occurs. Clock errors and frequency changes cause DSP reset.
The clocks should be stable when using these mux in non-default state. Always poll muxes status and set muxes prior to use in
application. TI recommends that these muxes are repeatedly polled and refreshed during application in the event a DSP reset occurred
that cleared the muxes.
192
Copyright © 2016, Texas Instruments Incorporated
TAS5780M
www.ti.com.cn
ZHCSFY4 –DECEMBER 2016
Table 231. Memory Map — Book 0x8C (140)(1) (continued)
SUB
ADDRESS
NUMBER OF BYTES /
PAGE
REGISTER NAME
DEFAULT VALUE
DESCRIPTION
FORMAT
4 / 2.30
4 / 1.31
4 / 1.31
4 / 2.30
4 / 1.31
4 / 2.30
4 / 1.31
4 / 1.31
4 / 2.30
4 / 1.31
4 / 2.30
4 / 1.31
4 / 1.31
4 / 2.30
4 / 1.31
4 / 2.30
4 / 1.31
4 / 1.31
4 / 2.30
4 / 1.31
4 / 2.30
4 / 1.31
4 / 1.31
4 / 2.30
4 / 1.31
4 / 2.30
4 / 1.31
4 / 1.31
4 / 2.30
4 / 1.31
4 / 2.30
4 / 1.31
4 / 1.31
4 / 2.30
4 / 1.31
4 / 2.30
4 / 1.31
4 / 1.31
4 / 2.30
4 / 1.31
4 / 2.30
4 / 1.31
MAIN EQ RIGHT 12 BQS
4 / 5.27
4 / 6.26
4 / 5.27
4 / 2.30
0x28
0x2C
0x30
0x34
0x38
0x3C
0x40
0x44
0x48
0x4C
0x50
0x54
0x58
0x5C
0x60
0x64
0x68
0x6C
0x70
0x74
0x78
0x7C
0x08
0x0C
0x10
0x14
0x18
0x1C
0x20
0x24
0x28
0x2C
0x30
0x34
0x38
0x3C
0x40
0x44
0x48
0x4C
0x50
0x54
0x1C
0x1C
0x1C
0x1C
0x1C
0x1C
0x1C
0x1C
0x1C
0x1C
0x1C
0x1C
0x1C
0x1C
0x1C
0x1C
0x1C
0x1C
0x1C
0x1C
0x1C
0x1C
0x1D
0x1D
0x1D
0x1D
0x1D
0x1D
0x1D
0x1D
0x1D
0x1D
0x1D
0x1D
0x1D
0x1D
0x1D
0x1D
0x1D
0x1D
0x1D
0x1D
CH-L BQ 4 A1
CH-L BQ 4 A2
CH-L BQ 5 B0
CH-L BQ 5 B1
CH-L BQ 5 B2
CH-L BQ 5 A1
CH-L BQ 5 A2
CH-L BQ 6 B0
CH-L BQ 6 B1
CH-L BQ 6 B2
CH-L BQ 6 A1
CH-L BQ 6 A2
CH-L BQ 7 B0
CH-L BQ 7 B1
CH-L BQ 7 B2
CH-L BQ 7 A1
CH-L BQ 7 A2
CH-L BQ 8 B0
CH-L BQ 8 B1
CH-L BQ 8 B2
CH-L BQ 8 A1
CH-L BQ 8 A2
CH-L BQ 9 B0
CH-L BQ 9 B1
CH-L BQ 9 B2
CH-L BQ 9 A1
CH-L BQ 9 A2
CH-L BQ 10 B0
CH-L BQ 10 B1
CH-L BQ 10 B2
CH-L BQ 10 A1
CH-L BQ 10 A2
CH-L BQ 11 B0
CH-L BQ 11 B1
CH-L BQ 11 B2
CH-L BQ 11 A1
CH-L BQ 11 A2
CH-L BQ 12 B0
CH-L BQ 12 B1
CH-L BQ 12 B2
CH-L BQ 12 A1
CH-L BQ 12 A2
0x00000000
0x00000000
0x7FFFFFFF
0x00000000
0x00000000
0x00000000
0x00000000
0x7FFFFFFF
0x00000000
0x00000000
0x00000000
0x00000000
0x7FFFFFFF
0x00000000
0x00000000
0x00000000
0x00000000
0x7FFFFFFF
0x00000000
0x00000000
0x00000000
0x00000000
0x7FFFFFFF
0x00000000
0x00000000
0x00000000
0x00000000
0x7FFFFFFF
0x00000000
0x00000000
0x00000000
0x00000000
0x7FFFFFFF
0x00000000
0x00000000
0x00000000
0x00000000
0x7FFFFFFF
0x00000000
0x00000000
0x00000000
0x00000000
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
Left BQ coefficient
0x58
0x5C
0x60
0x64
0x1D
0x1D
0x1D
0x1D
CH-R BQ 1 B0
CH-R BQ 1 B1
CH-R BQ 1 B2
CH-R BQ 1 A1
0x7FFFFFFF
0x00000000
0x00000000
0x00000000
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Copyright © 2016, Texas Instruments Incorporated
193
TAS5780M
ZHCSFY4 –DECEMBER 2016
www.ti.com.cn
Table 231. Memory Map — Book 0x8C (140)(1) (continued)
SUB
PAGE
NUMBER OF BYTES /
REGISTER NAME
DEFAULT VALUE
DESCRIPTION
ADDRESS
FORMAT
4 / 1.31
4 / 1.31
4 / 2.30
4 / 1.31
4 / 2.30
4 / 1.31
4 / 1.31
4 / 2.30
4 / 1.31
4 / 2.30
4 / 1.31
4 / 1.31
4 / 2.30
4 / 1.31
4 / 2.30
4 / 1.31
4 / 1.31
4 / 2.30
4 / 1.31
4 / 2.30
4 / 1.31
4 / 1.31
4 / 2.30
4 / 1.31
4 / 2.30
4 / 1.31
4 / 1.31
4 / 2.30
4 / 1.31
4 / 2.30
4 / 1.31
4 / 1.31
4 / 2.30
4 / 1.31
4 / 2.30
4 / 1.31
4 / 1.31
4 / 2.30
4 / 1.31
4 / 2.30
4 / 1.31
4 / 1.31
4 / 2.30
4 / 1.31
4 / 2.30
4 / 1.31
4 / 1.31
0x68
0x6C
0x70
0x74
0x78
0x7C
0x08
0x8C
0x10
0x14
0x18
0x1C
0x20
0x24
0x28
0x2C
0x30
0x34
0x38
0x3C
0x40
0x44
0x48
0x4C
0x50
0x54
0x58
0x5C
0x60
0x64
0x68
0x6C
0x70
0x74
0x78
0x7C
0x08
0x0C
0x10
0x14
0x18
0x1C
0x20
0x24
0x28
0x2C
0x30
0x1D
0x1D
0x1D
0x1D
0x1D
0x1D
0x1E
0x1E
0x1E
0x1E
0x1E
0x1E
0x1E
0x1E
0x1E
0x1E
0x1E
0x1E
0x1E
0x1E
0x1E
0x1E
0x1E
0x1E
0x1E
0x1E
0x1E
0x1E
0x1E
0x1E
0x1E
0x1E
0x1E
0x1E
0x1E
0x1E
0x1F
0x1F
0x1F
0x1F
0x1F
0x1F
0x1F
0x1F
0x1F
0x1F
0x1F
CH-R BQ 1 A2
CH-R BQ 2 B0
CH-R BQ 2 B1
CH-R BQ 2 B2
CH-R BQ 2 A1
CH-R BQ 2 A2
CH-R BQ 3 B0
CH-R BQ 3 B1
CH-R BQ 3 B2
CH-R BQ 3 A1
CH-R BQ 3 A2
CH-R BQ 4 B0
CH-R BQ 4 B1
CH-R BQ 4 B2
CH-R BQ 4 A1
CH-R BQ 4 A2
CH-R BQ 5 B0
CH-R BQ 5 B1
CH-R BQ 5 B2
CH-R BQ 5 A1
CH-R BQ 5 A2
CH-R BQ 6 B0
CH-R BQ 6 B1
CH-R BQ 6 B2
CH-R BQ 6 A1
CH-R BQ 6 A2
CH-R BQ 7 B0
CH-R BQ 7 B1
CH-R BQ 7 B2
CH-R BQ 7 A1
CH-R BQ 7 A2
CH-R BQ 8 B0
CH-R BQ 8 B1
CH-R BQ 8 B2
CH-R BQ 8 A1
CH-R BQ 8 A2
CH-R BQ 9 B0
CH-R BQ 9 B1
CH-R BQ 9 B2
CH-R BQ 9 A1
CH-R BQ 9 A2
CH-R BQ 10 B0
CH-R BQ 10 B1
CH-R BQ 10 B2
CH-R BQ 10 A1
CH-R BQ 10 A2
CH-R BQ 11 B0
0x00000000
0x7FFFFFFF
0x00000000
0x00000000
0x00000000
0x00000000
0x7FFFFFFF
0x00000000
0x00000000
0x00000000
0x00000000
0x7FFFFFFF
0x00000000
0x00000000
0x00000000
0x00000000
0x7FFFFFFF
0x00000000
0x00000000
0x00000000
0x00000000
0x7FFFFFFF
0x00000000
0x00000000
0x00000000
0x00000000
0x7FFFFFFF
0x00000000
0x00000000
0x00000000
0x00000000
0x7FFFFFFF
0x00000000
0x00000000
0x00000000
0x00000000
0x7FFFFFFF
0x00000000
0x00000000
0x00000000
0x00000000
0x7FFFFFFF
0x00000000
0x00000000
0x00000000
0x00000000
0x7FFFFFFF
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
194
Copyright © 2016, Texas Instruments Incorporated
TAS5780M
www.ti.com.cn
ZHCSFY4 –DECEMBER 2016
Table 231. Memory Map — Book 0x8C (140)(1) (continued)
SUB
ADDRESS
NUMBER OF BYTES /
PAGE
REGISTER NAME
DEFAULT VALUE
DESCRIPTION
FORMAT
4 / 2.30
4 / 1.31
4 / 2.30
4 / 1.31
4 / 1.31
4 / 2.30
4 / 1.31
4 / 2.30
4 / 1.31
0x34
0x38
0x3C
0x40
0x44
0x48
0x4C
0x50
0x54
0x1F
0x1F
0x1F
0x1F
0x1F
0x1F
0x1F
0x1F
0x1F
CH-R BQ 11 B1
CH-R BQ 11 B2
CH-R BQ 11 A1
CH-R BQ 11 A2
CH-R BQ 12 B0
CH-R BQ 12 B1
CH-R BQ 12 B2
CH-R BQ 12 A1
CH-R BQ 12 A2
0x00000000
0x00000000
0x00000000
0x00000000
0x7FFFFFFF
0x00000000
0x00000000
0x00000000
0x00000000
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
Right BQ coefficient
MAIN BQ GAIN SCALE AND VOLUME
0x58
0x5C
0x1F
0x1F
Left Gain
4 / 8.24
0x01000000
0x01000000
Gain
Gain
Right Gain
4 / 8.24
DPEQ SENSE BQ
DPEQ sense BQ
coefficient
0x6C
0x70
0x74
0x78
0x7C
0x1F
0x1F
0x1F
0x1F
0x1F
BQ B0
BQ B1
BQ B2
BQ A1
BQ A2
4 / 1.31
4 / 1.31
4 / 1.31
4 / 1.31
0x7FFFFFFF
0x00000000
0x00000000
0x00000000
0x00000000
DPEQ sense BQ
coefficient
DPEQ sense BQ
coefficient
DPEQ sense BQ
coefficient
DPEQ sense BQ
coefficient
4 / 1.31
DPEQ HIGH LEVEL PATH BQ
4 / 1.31
DPEQ high BQ
coefficient
0x08
0x0C
0x10
0x14
0x18
0x20
0x20
0x20
0x20
0x20
BQ B0
BQ B1
BQ B2
BQ A1
BQ A2
0x7FFFFFFF
0x00000000
0x00000000
0x00000000
0x00000000
DPEQ high BQ
coefficient
4 / 1.31
4 / 1.31
4 / 1.31
DPEQ high BQ
coefficient
DPEQ high BQ
coefficient
DPEQ high BQ
coefficient
4 / 1.31
DPEQ LOW LEVEL PATH BQ
4 / 1.31
DPEQ low BQ
coefficient
0x1C
0x20
0x24
0x28
0x2C
0x20
0x20
0x20
0x20
0x20
BQ B0
BQ B1
BQ B2
BQ A1
BQ A2
0x7FFFFFFF
0x00000000
0x00000000
0x00000000
0x00000000
DPEQ low BQ
coefficient
4 / 1.31
4 / 1.31
4 / 1.31
4 / 1.31
DPEQ low BQ
coefficient
DPEQ low BQ
coefficient
DPEQ low BQ
coefficient
DRC 1 BQ
4 / 1.31
0x30
0x34
0x38
0x3C
0x40
0x20
0x20
0x20
0x20
0x20
BQ B0
BQ B1
BQ B2
BQ A1
BQ A2
0x9D8E8900
0x007BFC00
0x007BFC00
0x7040C300
0x9D8E8900
DRC 1 BQ coefficient
DRC 1 BQ coefficient
DRC 1 BQ coefficient
DRC 1 BQ coefficient
DRC 1 BQ coefficient
4 / 1.31
4 / 1.31
4 / 1.31
4 / 1.31
Copyright © 2016, Texas Instruments Incorporated
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Table 231. Memory Map — Book 0x8C (140)(1) (continued)
SUB
PAGE
NUMBER OF BYTES /
REGISTER NAME
DEFAULT VALUE
DESCRIPTION
ADDRESS
FORMAT
DRC 2 BQ
0x44
0x48
0x4C
0x50
0x54
0x20
0x20
0x20
0x20
0x20
BQ B0
4 / 1.31
4 / 1.31
0x70BCBF00
0x007BFC00
0x007BFC00
0x7040C300
0x9D8E8900
DRC 2 BQ coefficient
DRC 2 BQ coefficient
DRC 2 BQ coefficient
DRC 2 BQ coefficient
DRC 2 BQ coefficient
BQ B1
BQ B2
BQ A1
BQ A2
4 / 1.31
4 / 1.31
4 / 1.31
DPEQ CONTROL
DPEQ Sense Energy
Time constant
0x58
0x20
Alpha
4 / 1.31
0x02DEAD00
0x5C
0x60
0x20
0x20
Gain
4 / 1.31
0x74013901
0x0020C49B
DPEQ Threshold Gain
DPEQ Threshold Offset
Offset
4 / 1.31
LEVER METER
Level meter Energy
Time constant
0x64
0x20
Level Meter Alpha
4 / 1.31
0x00A7264A
DRC SUM
4 / 1.31
0x68
0x6C
0x20
0x20
DRC 1 sum
DRC 2 sum
0x7FFFFFFF
0x00000000
DRC1 Mixer Gain
DRC2 Mixer Gain
4 / 1.31
DRC 1
DRC1 Energy Time
constant
0x70
0x74
0x78
0x7C
0x08
0x0C
0x20
0x20
0x20
0x20
0x21
0x21
DRC1 Energy
DRC1 Attack
DRC1 Decay
K0_1
4 / 1.31
4 / 1.31
4 / 1.31
4 / 9.23
4 / 9.23
4 / 9.23
0x7FFFFFFF
0x7FFFFFFF
0x7FFFFFFF
0x00000000
0x00000000
0x00000000
DRC1 Attack Time
constant
DRC1 Decay Time
constant
DRC1 Region 1 Slope
(comp/Exp)
DRC1 Region 2 Slope
(comp/Exp)
K1_1
DRC1 Region 3 Slope
(comp/Exp)
K2_1
0x10
0x14
0x18
0x1C
0x21
0x21
0x21
0x21
T1_1
4 / 9.23
4 / 9.23
4 / 9.23
4 / 9.23
DRC 2
0xE7000000
0xFE800000
0x00000000
0x00000000
DRC1 Threshold 1
DRC1 Threshold 2
DRC1 Offset 1
T2_1
Offset 1
Offset 2
DRC1 Offset 2
DRC2 Energy Time
constant
0x20
0x24
0x28
0x2C
0x30
0x34
0x21
0x21
0x21
0x21
0x21
0x21
DRC2 Energy
DRC2 Attack
DRC2 Decay
K0_1
4 / 1.31
4 / 1.31
4 / 1.31
4 / 9.23
4 / 9.23
4 / 9.23
0x7FFFFFFF
0x7FFFFFFF
0x7FFFFFFF
0x00000000
0x00000000
0x00000000
DRC2 Attack Time
constant
DRC2 Decay Time
constant
DRC2 Region 1 Slope
(comp/Exp)
DRC2 Region 2 Slope
(comp/Exp)
K1_1
DRC2 Region 3 Slope
(comp/Exp)
K2_1
0x38
0x3C
0x40
0x44
0x21
0x21
0x21
0x21
T1_1
4 / 9.23
4 / 9.23
4 / 9.23
4 / 9.23
0xE7000000
0xFE800000
0x00000000
0x00000000
DRC2 Threshold 1
DRC2 Threshold 2
DRC2 Offset 1
T2_1
Offset 1
Offset 2
DRC2 Offset 2
196
Copyright © 2016, Texas Instruments Incorporated
TAS5780M
www.ti.com.cn
ZHCSFY4 –DECEMBER 2016
Table 231. Memory Map — Book 0x8C (140)(1) (continued)
SUB
ADDRESS
NUMBER OF BYTES /
PAGE
REGISTER NAME
DEFAULT VALUE
DESCRIPTION
FORMAT
FINE VOLUME OUTPUT
Left Channel Fine
Volume Gain
0x48
0x4C
0x21
0x21
Fine volume left
Fine volume right
4 / 2.30
0x3FFFFFFF
0x3FFFFFFF
Right Channel Fine
Volume Gain
4 / 2.30
INPUT MIXER
4 / 9.23
Left Channel Mixer Left
Input Gain
0x50
0x54
0x58
0x5C
0x21
0x21
0x21
0x21
Left in to left out
Right in to left out
Left in to right out
Right in to right out
0x00800000
0x00000000
0x00000000
0x00800000
Left Channel Mixer Right
Input Gain
4 / 9.23
4 / 9.23
Right Channel Mixer Left
Input Gain
Right Channel Mixer
Right Input Gain
4 / 9.23
DPEQ GAIN SCALE
4 / 6.26
DPEQ Sense Input Gain
Scale
0x60
0x21
DPEQ sense scale
0x40000000
BYPASS EQ MUX
0x64
0x68
0x6C
0x70
0x74
0x21
0x21
0x21
0x21
0x21
4 / 32.0
0x00000000
0x00000000
0x00000000
0x00000000
0x00400000
GANG LEFT / RIGHT EQ
4 / 32.0
BYPASS WORKLOAD TO SDOUT
4 /32.0
BYPASS TO LEVEL METER BIT
4 / 32.0
THD BOOST
4 / 9.23
AGL
0x78
0x7C
0x21
0x21
Attack Threshold
4 / 5.27
0x40000000
0x06153BD1
Threshold linear
AGL Alpha Time
constant
Softening Filter Alpha
4 / 1.31
4 / 1.31
AGL Attack Time
constant
0x08
0x22
Attack Rate
0x0001B4E8
0x0C
0x10
0x22
0x22
AGL Enable
Chomp
4 / 1.31
4 / 1.31
0x40000000
0x0020C49C
AGL Enable Mux
AGL Omega Time
constant
0x14
0x18
0x22
0x22
Softening Filter Omega
Release Rate
4 / 1.31
4 / 1.31
0x79EAC42F
0x00002BB1
AGL Release Time
constant
0x1C
0x22
Volume
4 / 1.31
0x7FFFFFFF
AGL Volume
版权 © 2016, Texas Instruments Incorporated
197
TAS5780M
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14 器件和文档支持
14.1 器件支持
14.1.1 器件命名规则
Glossary部分列出的术语是根据多项德州仪器
(TI)
计划定义的通用术语(包括常用的缩写和单词),符合
JEDEC、IPC、IEEE 等行业标准。本部分提供的术语定义了特定于本产品和文档、附属产品、或本产品使用的支
持工具和软件的单词、短语和缩写。如对定义和术语有其他疑问,请访问e2e 音频放大器论坛。
桥接负载 (BTL) 是一种输出配置,其中扬声器的两端分别连接一个半桥。
DUT 是指被测器件,用于区分其他器件。
闭环架构是一种拓扑结构,其中放大器监视输出引脚、对比输出信号与输入信号,并尝试修正输出信号的非线性。
动态控件是指系统或最终用户在正常使用时可更改的控件。
GPIO 是通用输入/输出引脚。该引脚是一个高度可配置的双向数字引脚,可执行系统所需的多种功能。
主机处理器(也称系统处理器、标量、主机或系统控制器)是指用作中央系统控制器的器件,可为其连接的器件提
供控制信息,从其上游器件采集音频源数据后分配给其他器件。该器件通常配置音频路径中音频处理器件(如
TAS5780M)的控件,从而根据频率响应、时间校准、目标声压级、系统安全工作区域和用户偏好优化扬声器的音
频输出。
HybridFlow 通过搭配使用 RAM 内置的元件和 ROM 内置的元件构成一款可配置器件,与完全可编程器件相比更
加易于使用,而且还能保持足够的灵活性以适应多种 应用
最大持续输出功率是指放大器在 25°C 工作环境温度下可持续(不关断)提供的最大输出功率。测试该参数时,当
放大器温度达到热平衡点并且不再升高时停止测试
并行桥接负载 (PBTL) 是一种输出配置,其中扬声器的两端分别连接一对并行放置的半桥。
rDS(on) 是指放大器输出级中所用 MOSFET 的导通电阻。
静态控制/静态配置是指系统正常使用时不发生变化的控件。
过孔是指 PCB 中的镀铜通孔。
14.1.2 开发支持
有关 RDGUI 软件,请咨询当地的现场支持工程师。
14.2 接收文档更新通知
如需接收文档更新通知,请访问 www.ti.com.cn 网站上的器件产品文件夹。点击右上角的提醒我 (Alert me) 注册
后,即可每周定期收到已更改的产品信息。有关更改的详细信息,请查阅已修订文档中包含的修订历史记录。
198
版权 © 2016, Texas Instruments Incorporated
TAS5780M
www.ti.com.cn
ZHCSFY4 –DECEMBER 2016
14.3 社区资源
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
14.4 商标
Burr-Brown, PowerPAD, E2E are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
14.5 静电放电警告
这些装置包含有限的内置 ESD 保护。 存储或装卸时,应将导线一起截短或将装置放置于导电泡棉中,以防止 MOS 门极遭受静电损
伤。
14.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
15 机械、封装和可订购信息
以下页中包括机械、封装和可订购信息。这些信息是针对指定器件可提供的最新数据。这些数据会在无通知且不对
本文档进行修订的情况下发生改变。欲获得该数据表的浏览器版本,请查阅左侧的导航栏。
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199
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TAS5780MDCA
ACTIVE
HTSSOP
HTSSOP
DCA
48
48
40
RoHS & Green
NIPDAU
Level-3-260C-168 HR
Level-3-260C-168 HR
-25 to 85
-25 to 85
BURR-BROWN
TAS5780M
TAS5780MDCAR
ACTIVE
DCA
2000 RoHS & Green
NIPDAU
BURR-BROWN
TAS5780M
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
Addendum-Page 2
GENERIC PACKAGE VIEW
DCA 48
12.5 x 6.1, 0.5 mm pitch
HTSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4224608/A
www.ti.com
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