TCAN1044VDRQ1 [TI]
具有待机和 1.8V I/O 支持的汽车类故障保护高速 CAN 收发器 | D | 8 | -40 to 125;
| 型号： | TCAN1044VDRQ1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有待机和 1.8V I/O 支持的汽车类故障保护高速 CAN 收发器 | D | 8 | -40 to 125 |
| 文件： | 总43页 (文件大小：2109K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TCAN1044-Q1, TCAN1044V-Q1
ZHCSIP6B –AUGUST 2019 –REVISED OCTOBER 2021
具有1.8V I/O 支持和
故障保护功能的TCAN1044V-Q1 汽车类CAN FD 收发器
1 特性
3 说明
• AEC-Q100 标准：符合汽车应用要求
TCAN1044-Q1 是一款符合 ISO 11898-2:2016 高速
CAN 规范物理层要求的高速控制器局域网 (CAN) 收发
器。
– 温度等级1：–40°C 至125°C TA
• 符合ISO 11898-2:2016 和ISO 11898-5:2007 物理
层标准的要求
TCAN1044-Q1 收发器支持传统 CAN 和 CAN FD 网络
（数据速率高达 8 兆位/秒 (Mbps)）。TCAN1044-Q1
包括通过VIO 端子实现的内部逻辑电平转换功能，允许
将收发器 I/O 直接连接到 1.8V、2.5V、3.3V 或 5V 逻
辑 I/O。该收发器支持低功耗待机模式，并且可通过符
合 ISO 11898-2:2016 所定义唤醒模式 (WUP) 的 CAN
来唤醒。此外，TCAN1044-Q1 收发器还包括保护和诊
断功能，支持热关断 (TSD)、TXD 显性超时 (DTO)、
电源欠压检测和高达
• 提供功能安全
– 可帮助进行功能安全系统设计的文档
• 支持传统CAN 和经优化的CAN FD 性能（数据速
率为2、5 和8Mbps）
– 具有较短的对称传播延迟时间，可增加时序裕量
– 在有负载CAN 网络中实现更快的数据速率
• I/O 电压范围支持1.7V 至5.5V
– 支持1.8V、2.5V、3.3V 和5V 应用
• 保护特性：
±58V 的总线故障保护。
– 总线故障保护：±58V
– 欠压保护
– TXD 显性超时(DTO)
器件信息
封装(1)
SOT (DDF) (8)
VSON (DRB) (8)
SOIC (D) (8)
封装尺寸（标称值）
2.90mm x 1.60mm
3.00mm x 3.00mm
4.90mm x 3.91mm
器件型号
• 数据速率低至9.2kbps
– 热关断保护(TSD)
• 工作模式：
TCAN1044-Q1
TCAN1044V-Q1
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附
录。
– 正常模式
– 支持远程唤醒请求功能的低功耗待机模式
• 优化了未上电时的性能
– 总线和逻辑引脚为高阻抗（运行总线或应用上无
负载）
– 支持热插拔：在总线和RXD 输出上可实现上电/
断电无干扰运行
• 结温范围：–40°C 至150°C
• 接收器共模输入电压：±12V
• 采用SOIC (8)、SOT23 (8) 封装
(2.9mm x 1.60mm) 和无引线VSON (8) 封装
(3.0mm x 3.0mm)，具有改进的自动光学检查(AOI)
功能
简化版原理图
2 应用
• 汽车和运输
– 车身控制模块
– 汽车网关
– 高级驾驶辅助系统(ADAS)
– 信息娱乐系统
本文档旨在为方便起见，提供有关TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问
www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SLLSF17
TCAN1044-Q1, TCAN1044V-Q1
ZHCSIP6B –AUGUST 2019 –REVISED OCTOBER 2021
www.ti.com.cn
Table of Contents
7 Parameter Measurement Information.......................... 11
8 Detailed Description......................................................14
8.1 Overview...................................................................14
8.2 Functional Block Diagram.........................................15
8.3 Feature Description...................................................16
8.4 Device Functional Modes..........................................20
9 Application and Implementation..................................23
9.1 Application Information............................................. 23
9.2 Typical Application.................................................... 23
9.3 System Examples..................................................... 26
10 Power Supply Recommendations..............................26
11 Device and Documentation Support..........................28
11.1 接收文档更新通知................................................... 28
11.2 支持资源..................................................................28
11.3 Trademarks............................................................. 28
11.4 Electrostatic Discharge Caution..............................28
11.5 术语表..................................................................... 28
1 特性................................................................................... 1
2 应用................................................................................... 1
3 说明................................................................................... 1
4 Revision History.............................................................. 2
5 Pin Configuration and Functions...................................3
Pin Functions.................................................................... 3
6 Specifications.................................................................. 4
6.1 Absolute Maximum Ratings........................................ 4
6.2 ESD Ratings............................................................... 4
6.3 ESD Ratings............................................................... 4
6.4 Recommended Operating Conditions.........................4
6.5 Thermal Characteristics..............................................5
6.6 Supply Characteristics................................................ 5
6.7 Dissipation Ratings..................................................... 6
6.8 Electrical Characteristics.............................................6
6.9 Switching Characteristics............................................8
6.10 Typical Characteristics............................................10
4 Revision History
注：以前版本的页码可能与当前版本的页码不同
Changes from Revision A (December 2019) to Revision B (October 2021)
Page
• 添加了特性“提供功能安全型”........................................................................................................................ 1
• 更改了简化版原理图.......................................................................................................................................... 1
• Changed 图9-2 ............................................................................................................................................... 24
Changes from Revision * (August 2019) to Revision A (December 2019)
Page
• 首次公开发布数据表........................................................................................................................................... 1
• Added SAE j2962-2 ESD....................................................................................................................................4
• Changed footnote to Tested according to IEC 62228-3:2019 CAN Transceivers, Section 6.3; standard pulses
parameters defined in ISO 7637-2 (2011)...........................................................................................................4
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5 Pin Configuration and Functions
TXD
GND
VCC
1
2
3
4
8
7
6
5
STB
TXD
GND
VCC
1
2
3
4
8
7
6
5
STB
CANH
CANL
NC, VIO
CANH
CANL
NC, VIO
RXD
RXD
Not to scale
Not to scale
DDF Package TCAN1044(V)-Q1, 8-Pin SOT, Top
View
D Package TCAN1044(V)-Q1, 8-Pin SOIC, Top View
TXD
GND
VCC
1
2
3
4
8
7
6
5
STB
CANH
CANL
NC,VIO
Thermal
Pad
RXD
Not to scale
DRB Package TCAN1044(V)-Q1, 8-Pin VSON , Top View
Pin Functions
Pins
Type
Description
Name
TXD
GND
VCC
No.
1
Digital Input CAN transmit data input
2
GND
Ground connection
5-V supply voltage
3
Supply
RXD
NC
4
Digital Output CAN receive data output, tri-state when powered off
No Connect (not internally connected); Devices without VIO
I/O supply voltage
—
5
VIO
Supply
Bus IO
Bus IO
CANL
CANH
STB
6
7
8
Low-level CAN bus input/output line
High-level CAN bus input/output line
Digital Input Standby input for mode control, integrated pull up
Electrically connected to GND, connect the thermal pad to the printed circuit board (PCB)
ground plane for thermal relief
Thermal Pad (VSON only)
—
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1) (2)
MIN
–0.3
–0.3
–58
–45
–0.3
–0.3
–8
MAX
6
UNIT
V
VCC
Supply voltage
VIO
Supply voltage I/O level shifter
CAN Bus IO voltage CANH and CANL
Max differential voltage between CANH and CANL
Logic input terminal voltage
6
V
VBUS
VDIFF
VLogic_Input
VRXD
IO(RXD)
TJ
58
45
6
V
V
V
RXD output terminal voltage range
RXD output current
6
V
8
mA
°C
°C
Operating virtual junction temperature range
Storage temperature
150
150
–40
–65
TSTG
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
(2) All voltage values, except differential IO bus voltages, are with respect to ground terminal.
6.2 ESD Ratings
VALUE
UNIT
HBM classification level 3A for
all pins
±3000
V
Human-body model (HBM), per AEC Q100-002(1)
HBM classification level 3B for
global pins CANH & CANL
VESD
Electrostatic discharge
±10000
±750
V
V
Charged-device model (CDM), per AEC Q100-011
CDM classification level C5 for all pins
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
6.3 ESD Ratings
VALUE
UNIT
SAE J2962-2 per ISO 10650
Powered Contact Discharge
±8000
V
V
VESD
System Level Electro-Static Discharge (ESD)(3)
CAN bus terminals (CANH, CANL) to GND
SAE J2962-2 per ISO 10650
Powered Air Discharge
±15000
Pulse 1
V
V
V
V
V
–100
75
Pulse 2a
ISO 7637 ISO Pulse Transients(1)
ISO 7637 Slow transients pulse(2)
CAN bus terminals (CANH, CANL)
VTran
Pulse 3a
–150
100
Pulse 3b
CAN bus terminals (CANH, CANL) to GND
DCC slow transient pulse
±85
(1) Tested according to IEC 62228-3:2019 CAN Transceivers, Section 6.3; standard pulses parameters defined in ISO 7637-2 (2011)
(2) Tested according to ISO 7637-3 (2017); Electrical transient transmission by capacitive and inductive coupling via lines other than
supply lines
(3) Results given here are specific to the SAE J2962-2 Communication Transceivers Qualification Requirements - CAN. Testing performed
by OEM approved independent 3rd party, EMC report available upon request.
6.4 Recommended Operating Conditions
MIN
4.5
NOM
MAX
5.5
UNIT
V
VCC
Supply voltage
5
VIO
Supply voltage for I/O level shifter
RXD terminal high level output current
RXD terminal low level output current
Operating ambient temperature
1.7
5.5
V
IOH(RXD)
IOL(RXD)
TA
mA
mA
–2
2
125
–40
℃
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6.5 Thermal Characteristics
THERMAL METRIC(1)
TCAN1044x-Q1
UNIT
D (SOIC)
DDF (SOT)
DRB (VSON)
RΘJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
128.1
68.3
71.6
19.7
70.8
-
119.9
61.8
39.7
2.1
49.9
58.2
23.9
1.7
℃/W
℃/W
℃/W
℃/W
℃/W
℃/W
RΘJC(top)
RΘJB
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
ΨJT
39.5
–
23.8
6.4
ΨJB
RΘJC(bot)
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.6 Supply Characteristics
Over recommended operating conditions with TA = -40℃to 125℃(unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
TXD = 0 V, STB = 0 V, RL = 60 Ω, CL
=
=
open
45
70
mA
See 图7-1
Dominant
TXD = 0 V, STB = 0 V, RL = 50 Ω, CL
open
See 图7-1
49
80
mA
mA
Supply current
Normal mode
ICC
TXD = VCC, STB = 0 V, RL = 50 Ω, CL
open
=
Recessive
4.5
7.5
See 图7-1
TXD = 0 V, STB = 0 V, CANH = CANL =
±25 V, RL = open, CL = open
See 图7-1
Dominant with
bus fault
130
1
mA
µA
µA
Supply current
Standby mode
Devices with VIO
TXD = STB = VIO, RL = 50 Ω, CL = open
See 图7-1
ICC
0.2
Supply current
TXD = STB = VCC, RL = 50 Ω, CL = open
See 图7-1
ICC
Standby mode
14.5
Devices without VIO
I/O supply current
Normal mode
TXD = 0 V, STB= 0 V
RXD floating
IIO
IIO
IIO
Dominant
Recessive
125
25
300
48
µA
µA
µA
I/O supply current
Normal mode
TXD = 0 V, STB = 0 V
RXD floating
I/O supply current
Standby mode
TXD = 0 V, STB = VIO
RXD floating
8.5
13.5
UVVCC
UVVCC
UVVIO
UVVIO
Rising under voltage detection on VCC for protected mode
Falling under voltage detection on VCC for protected mode
4.2
4
4.4
4.25
1.65
1.59
V
V
V
V
3.5
1.4
Rising under voltage detection on VIO (Devices with VIO
)
1.56
1.51
Falling under voltage detection on VIO (Devices with VIO
)
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6.7 Dissipation Ratings
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VCC = 5 V, VIO = 1.8 V, TJ= 27°C, RL = 60Ω,
TXD input = 250 kHz 50% duty cycle square
wave, CL_RXD = 15 pF
110
mW
VCC = 5 V, VIO = 3.3 V, TJ= 27°C, RL = 60Ω,
TXD input = 250 kHz 50% duty cycle square
wave, CL_RXD = 15 pF
110
110
120
120
120
mW
mW
mW
mW
VCC = 5 V, VIO = 5 V, TJ= 27°C, RL = 60Ω, TXD
input = 250 kHz 50% duty cycle square wave,
CL_RXD = 15 pF
Average power dissipation
Normal mode
PD
VCC = 5.5 V, VIO = 1.8 V, TA= 125°C, RL = 60Ω,
TXD input = 2.5 MHz 50% duty cycle square
wave, CL_RXD = 15 pF
VCC = 5.5 V, VIO = 3.3 V, TA= 125°C, RL = 60Ω,
TXD input = 2.5 MHz 50% duty cycle square
wave, CL_RXD = 15 pF
VCC = 5.5 V, VIO = 5 V, TA= 125°C, RL = 60Ω,
TXD input = 2.5 MHz 50% duty cycle square
wave, CL_RXD = 15 pF
mW
°C
TTSD
Thermal shutdown temperature
192
10
TTSD_HYS Thermal shutdown hysteresis
6.8 Electrical Characteristics
Over recommended operating conditions with TA = -40℃to 125℃(unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
Driver Electrical Characteristics
CANH
CANL
2.75
0.5
4.5
V
V
TXD = 0 V, STB = 0 V , 50 Ω ≤RL ≤65
Ω, CL = open, RCM = open
See 图7-2 and 图8-3,
Dominant output voltage
Normal mode
VO(DOM)
2.25
TXD = VIO, STB = 0 V , RL = open (no
load), RCM = open
See 图7-2 and 图8-3
Recessive output voltage
Normal mode
VO(REC)
CANH and CANL
2
0.5 VCC
3
V
STB = 0 V , RL = 60 Ω, CSPLIT = 4.7 nF, CL
= open, RCM = open, TXD = 250 kHz, 1
MHz, 2.5 MHz
Driver symmetry
(VO(CANH) + VO(CANL))/VCC
VSYM
0.9
1.1 V/V
400 mV
See 图7-2 and 图9-2
DC output symmetry
(VCC - VO(CANH) - VO(CANL)
STB = 0 V , RL = 60 Ω, CL = open
See 图7-2 and 图8-3
VSYM_DC
–400
)
TXD = 0 V, STB = 0 V , 50 Ω ≤RL ≤65
Ω, CL = open
See 图7-2 and 图8-3
1.5
3
3.3
5
V
V
V
Differential output voltage
Normal mode
TXD = 0 V, STB = 0 V , 45 Ω ≤RL ≤70
Ω, CL = open
See 图7-2 and 图8-3
VOD(DOM)
CANH - CANL
1.4
1.5
Dominant
TXD = 0 V, STB = 0 V , RL = 2240 Ω, CL
open
=
See 图7-2 and 图8-3
TXD = VIO, STB = 0 V , RL = 60 Ω, CL
open
See 图7-2 and 图8-3
=
=
12 mV
50 mV
–120
–50
Differential output voltage
Normal mode
Recessive
VOD(REC)
CANH - CANL
TXD = VIO, STB = 0 V , RL = open, CL
open
See 图7-2 and 图8-3
CANH
-0.1
-0.1
-0.2
0.1
0.1
0.2
V
V
V
STB = VIO , RL = open (no load)
See 图7-2 and 图8-3
Bus output voltage
Standby mode
VO(STB)
CANL
CANH - CANL
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6.8 Electrical Characteristics (continued)
Over recommended operating conditions with TA = -40℃to 125℃(unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
STB = 0 V , V(CANH) = -15 V to 40 V, CANL
= open, TXD = 0 V
See 图7-7 and 图8-3
mA
–115
Short-circuit steady-state output current,
dominant
Normal mode
IOS(SS_DOM)
STB = 0 V , V(CAN_L) = -15 V to 40 V,
CANH = open, TXD = 0 V
See 图7-7 and 图8-3
115 mA
Short-circuit steady-state output current,
recessive
Normal mode
STB = 0 V , –27 V ≤VBUS ≤32 V,
where VBUS = CANH = CANL, TXD = VIO
See 图7-7 and 图8-3
IOS(SS_REC)
5
mA
–5
Receiver Electrical Characteristics
Input threshold voltage
Normal mode
STB = 0 V , -12 V ≤VCM ≤12 V
See 图7-3, 表7-1, and 表8-6
VIT
500
400
0.9
-4
900 mV
Input threshold
VIT(STB)
STB = VIO , -12 V ≤VCM ≤12 V
See 图7-3, 表7-1, and 表8-6
1150 mV
Standby mode
Dominant state differential input voltage range
Normal mode
STB = 0 V , -12 V ≤VCM ≤12 V
See 图7-3, 表7-1, and 表8-6
VDOM
9
0.5
9
V
V
Recessive state differential input voltage range
Normal mode
STB = 0 V , -12 V ≤VCM ≤12 V
See 图7-3, 表7-1, and 表8-6
VREC
Dominant state differential input voltage range
Standby mode
STB = VIO , -12 V ≤VCM ≤12 V
See 图7-3, 表7-1, and 表8-6
VDOM(STB)
VREC(STB)
VHYS
1.15
-4
V
Recessive state differential input voltage range
Standby mode
STB = VIO , -12 V ≤VCM ≤12 V
See 图7-3, 表7-1, and 表8-6
0.4
V
Hysteresis voltage for input threshold
Normal mode
STB = 0 V , -12 V ≤VCM ≤12 V
See 图7-3, 表7-1, and 表8-6
100
mV
Common mode range
Normal and standby modes
VCM
12
5
V
See 图7-3 and 表8-6 表8-6
–12
ILKG(IOFF)
CI
Unpowered bus input leakage current
Input capacitance to ground (CANH or CANL)
Differential input capacitance
CANH = CANL = 5 V, VCC = VIO = GND
µA
20 pF
10 pF
(1)
TXD = VIO
CID
RID
Differential input resistance
40
20
90
45
kΩ
kΩ
TXD = VIO(1), STB = 0 V , -12 V ≤VCM
12 V
≤
Single ended input resistance
(CANH or CANL)
RIN
Input resistance matching
[1 –(RIN(CANH) / RIN(CANL))] × 100 %
RIN(M)
V(CAN_H) = V(CAN_L) = 5 V
1
%
–1
TXD Terminal (CAN Transmit Data Input)
VIH
VIH
VIL
High-level input voltage
High-level input voltage
Low-level input voltage
Low-level input voltage
High-level input leakage current
Low-level input leakage current
Unpowered leakage current
Input Capacitance
Devices without VIO
0.7 VCC
0.7 VIO
V
V
Devices with VIO
Devices without VIO
0.3 VCC
0.3 VIO
1
V
VIL
Devices with VIO
V
IIH
TXD = VCC = VIO = 5.5 V
TXD = 0 V, VCC = VIO = 5.5 V
TXD = 5.5 V, VCC = VIO = 0 V
0
-100
0
µA
µA
µA
pF
–2.5
–200
–1
IIL
–20
ILKG(OFF)
CI
1
VIN = 0.4×sin(2×π×2×106×t)+2.5 V
5
RXD Terminal (CAN Receive Data Output)
IO = –2 mA, Devices without VIO
See 图7-3
VOH
VOH
VOL
High-level output voltage
High-level output voltage
Low-level output voltage
0.8 VCC
0.8 VIO
V
V
V
IO = –2 mA, Devices with VIO
See 图7-3
IO = 2 mA, Devices without VIO
See 图7-3
0.2 VCC
IO = –2 mA, Devices with VIO
See 图7-3
VOL
Low-level output voltage
0.2 VIO
1
V
ILKG(OFF)
Unpowered leakage current
RXD = 5.5 V, VCC = VIO = 0 V
0
µA
–1
STB Terminal (Standby Mode Input)
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6.8 Electrical Characteristics (continued)
Over recommended operating conditions with TA = -40℃to 125℃(unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
0.7 VCC
0.7 VIO
TYP
MAX UNIT
VIH
High-level input voltage
Devices without VIO
V
V
VIH
High-level input voltage
Devices with VIO
VIL
Low-level input voltage
Devices without VIO
0.3 VCC
0.3 VIO
2
V
VIL
Low-level input voltage
Devices with VIO
V
IIH
High-level input leakage current
Low-level input leakage current
Unpowered leakage current
VCC = VIO = STB = 5.5 V
VCC = VIO = 5.5 V, STB = 0 V
STB = 5.5V, VCC = VIO = 0 V
µA
µA
µA
–2
–20
–1
IIL
–2
ILKG(OFF)
0
1
(1) VIO = VCC in non-V variants of device
6.9 Switching Characteristics
Over recommended operating conditions with TA = -40℃to 125℃(unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
125
165
150
180
MAX
210
255
210
UNIT
ns
Device Switching Characteristics
Normal mode, RL = 60 Ω, CL = 100 pF,
CL(RXD) = 15 pF
VIO = 2.8 V to 5.5 V
Total loop delay, driver input (TXD) to receiver
output (RXD), recessive to dominant
tPROP(LOOP1)
tPROP(LOOP1)
tPROP(LOOP2)
See 图7-4
Normal mode, RL = 60 Ω, CL = 100 pF,
CL(RXD) = 15 pF
VIO = 1.7 V
Total loop delay, driver input (TXD) to receiver
output (RXD), recessive to dominant
ns
See 图7-4
Normal mode, RL = 60 Ω, CL = 100 pF,
CL(RXD) = 15 pF
VIO = 2.8 V to 5.5 V
Total loop delay, driver input (TXD) to receiver
output (RXD), dominant to recessive
ns
See 图7-4
Normal mode, RL = 60 Ω, CL = 100 pF,
CL(RXD) = 15 pF
VIO = 1.7 V
Total loop delay, driver input (TXD) to receiver
output (RXD), dominant to recessive
tPROP(LOOP2)
255
20
ns
µs
See 图7-4
Mode change time, from normal to standby or from
standby to normal
tMODE
See 图7-5
tWK_FILTER
Filter time for a valid wake-up pattern
Bus wake-up timeout
0.5
0.8
1.8
6
µs
See 图8-5
See 图8-5
tWK_TIMEOUT
ms
Driver Switching Characteristics
Propagation delay time, high TXD to driver
tpHR
80
70
ns
ns
recessive (dominant to recessive)
Propagation delay time, low TXD to driver dominant
(recessive to dominant)
tpLD
STB = 0 V , RL = 60 Ω, CL = 100 pF
See 图7-2 and 图7-6
tsk(p)
Pulse skew (|tpHR - tpLD|)
Differential output signal rise time
Differential output signal fall time
Dominant timeout
20
30
50
ns
ns
ns
ms
tR
tF
tTXD_DTO
1.2
4.0
Receiver Switching Characteristics
Propagation delay time, bus recessive input to high
output (dominant to recessive)
tpRH
tpDL
90
65
ns
ns
Propagation delay time, bus dominant input to low
output (recessive to dominant)
STB = 0 V , CL(RXD) = 15 pF
See 图7-3
tR
tF
RXD output signal rise time
RXD output signal fall time
10
10
ns
ns
FD Timing Characteristics
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6.9 Switching Characteristics (continued)
Over recommended operating conditions with TA = -40℃to 125℃(unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Bit time on CAN bus output pins
tBIT(TXD) = 500 ns
tBIT(BUS)
tBIT(BUS)
tBIT(RXD)
tBIT(RXD)
tREC
450
530
ns
Bit time on CAN bus output pins
tBIT(TXD) = 200 ns
155
400
120
-50
-45
210
550
220
20
ns
ns
ns
ns
ns
Bit time on RXD output pins
tBIT(TXD) = 500 ns
STB = 0 V, RL = 60 Ω, CL = 100 pF,
CL(RXD) = 15 pF
ΔtREC = tBIT(RXD) - tBIT(BUS)
See 图7-4
Bit time on RXD output pins
tBIT(TXD) = 200 ns
Receiver timing symmetry
tBIT(TXD) = 500 ns
Receiver timing symmetry
tBIT(TXD) = 200 ns
tREC
15
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6.10 Typical Characteristics
4
3.5
3
3
2.5
2
2.5
2
1.5
1
1.5
1
0.5
0
0.5
0
4.5
4.6
4.7
4.8
4.9
5
5.1
5.2
5.3
5.4
5.5
-40
-25
-10
5
20
35
50
65
80
95
110
125
VCC (V)
Temperature (èC)
VOD(
VOD(
Temp = 25°C
VCC = 5 V
VIO = 3.3 V
RL = 60 Ω
RL = 60 Ω
图6-2. VOD(DOM) vs VCC
图6-1. VOD(DOM) vs Temperature
1
15
13
11
9
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
7
5
-40
-25
-10
5
20
35
50
65
80
95
110
125
-40
-25
-10
5
20
35
50
65
80
95
110
125
Temperature (èC)
Temperature (èC)
D_IC
D_II
VCC = 5 V
VIO = 3.3 V
VCC = 5 V
VIO = 3.3 V
RL = 60 Ω
RL = 60 Ω
图6-3. ICC Standby vs Temperature
图6-4. IIO Standby vs Temperature
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7 Parameter Measurement Information
CANH
TXD
RL
CL
CANL
图7-1. ICC Test Circuit
RCM
CANH
50%
50%
TXD
TXD
RL
CL
VOD
VCM
VCC
VO(CANH)
tpLD
tpHR
90%
10%
0V
CANL
RCM
0.9V
VO(CANL)
VOD
0.5V
tR
tF
图7-2. Driver Test Circuit and Measurement
CANH
1.5V
0.9V
VID
IO
RXD
0.5V
0V
VID
tpDL
tpRH
VOH
VO
CL_RXD
CANL
90%
VO(RXD)
50%
10%
VOL
tF
tR
图7-3. Receiver Test Circuit and Measurement
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表7-1. Receiver Differential Input Voltage Threshold Test
Output
Input (See 图7-3)
VCANH
-11.5 V
12.5 V
-8.55 V
9.45 V
-8.75 V
9.25 V
-11.8 V
12.2 V
Open
VCANL
|VID|
1000 mV
1000 mV
900 mV
900 mV
500 mV
500 mV
400 mV
400 mV
X
RXD
-12.5 V
11.5 V
Low
VOL
-9.45 V
8.55 V
-9.25 V
8.75 V
-12.2 V
11.8 V
High
VOH
Open
TXD
VI
70%
tLOOP2
30%
30%
CANH
0V
TXD
5 x tBIT(TXD)
tBIT(TXD)
VI
RL
CL
CANL
STB
tBIT(BUS)
0V
900mV
500mV
RXD
VDIFF
VO
CL_RXD
RXD
VOH
70%
30%
tBIT(RXD)
VOL
tLOOP1
图7-4. Transmitter and Receiver Timing Test Circuit and Measurement
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CANH
VIH
TXD
STB
CL
0V
RL
STB
50%
CANL
VI
0V
tMODE
RXD
VOH
VO
CL_RXD
RXD
50%
VOL
图7-5. tMODE Test Circuit and Measurement
VIH
CANH
TXD
TXD
0V
RL
CL
VOD
VOD(D)
CANL
0.9V
VOD
0.5V
0V
tTXD_DTO
图7-6. TXD Dominant Timeout Test Circuit and Measurement
200 ꢀs
IOS
CANH
TXD
VBUS
IOS
CANL
VBUS
VBUS
0V
or
0V
VBUS
VBUS
图7-7. Driver Short-Circuit Current Test and Measurement
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8 Detailed Description
8.1 Overview
The TCAN1044-Q1 meets or exceeds the specifications of the ISO 11898-2:2016 high speed CAN (Controller
Area Network) physical layer standard. The device has been certified to the requirements of ISO 11898-2:2016
and ISO 11898-5:2007 physical layer requirements according to the GIFT/ICT high speed CAN test specification.
The transceiver provides a number of different protection features making it ideal for the stringent automotive
system requirements while also supporting CAN FD data rates up to 8 Mbps.
The TCAN1044-Q1 conforms to the following CAN standards:
• CAN transceiver physical layer standards:
– ISO 11898-2:2016 High speed medium access unit
– ISO 11898-5:2007 High speed medium access unit with low-power mode
– SAE J2284-1: High Speed CAN (HSC) for Vehicle Applications at 125 kbps
– SAE J2284-2: High Speed CAN (HSC) for Vehicle Applications at 250 kbps
– SAE J2284-3: High Speed CAN (HSC) for Vehicle Applications at 500 kbps
– SAE J2284-4: High-Speed CAN (HSC) for Vehicle Applications at 500 kbps with CAN FD Data at 2 Mbps
– SAE J2284-5: High-Speed CAN (HSC) for Vehicle Applications at 500 kbps with CAN FD Data at 5 Mbps
– ARINC 825-4 General Standardization of CAN (Controller Area Network) Bus Protocol For Airborne Use
• EMC requirements:
– VeLIO (Vehicle LAN Interoperability and Optimization) CAN and CAN-FD Transceiver Requirements
– SAE J2962-2 Communication Transceivers Qualification Requirements –CAN
• Conformance test requirements:
– ISO 16845-2 Road vehicles –Controller area network (CAN) conformance test plan Part 2: High-speed
medium access unit conformance test plan
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8.2 Functional Block Diagram
图8-1. Block Diagram
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8.3 Feature Description
8.3.1 Pin Description
8.3.1.1 TXD
The TXD input is a logic-level signal, referenced to either VCC or VIO from a CAN controller to the TCAN1044-Q1
transceivers.
8.3.1.2 GND
GND is the ground pin of the transceiver, it must be connected to the PCB ground.
8.3.1.3 VCC
VCC provides the 5-V power supply to the CAN transceiver.
8.3.1.4 RXD
The RXD output is a logic-level signal, referenced to either VCC or VIO, from the TCAN1044-Q1 transceivers to
the CAN controller. RXD is only driven once VIO is present.
When a wake event takes place RXD is driven low.
8.3.1.5 VIO
The VIO pin provides the digital I/O voltage to match the CAN controller voltage thus avoiding the requirement for
a level shifter. It supports voltages from 1.7 V to 5.5 V providing the widest range of controller support.
8.3.1.6 CANH and CANL
These are the CAN high and CAN low differential bus pins. These pins are connected to the CAN transceiver
and the low-voltage WUP CAN receiver.
8.3.1.7 STB (Standby)
The STB pin is an input pin used for mode control of the transceiver. The STB pin can be supplied from either
the system processor or from a static system voltage source. If normal mode is the only intended mode of
operation than the STB pin can be tied directly to GND.
8.3.2 CAN Bus States
The CAN bus has two logical states during operation: recessive and dominant. See 图8-2 and 图8-3.
A dominant bus state occurs when the bus is driven differentially and corresponds to a logic low on the TXD and
RXD pins. A recessive bus state occurs when the bus is biased to VCC/2 via the high-resistance internal input
resistors RIN) of the receiver and corresponds to a logic high on the TXD and RXD pins.
A dominant state overwrites the recessive state during arbitration. Multiple CAN nodes may be transmitting a
dominant bit at the same time during arbitration, and in this case the differential voltage of the bus is greater than
the differential voltage of a single driver.
The TCAN1044-Q1 transceiver implements a low-power standby (STB ) mode which enables a third bus state
where the bus pins are weakly biased to ground via the high resistance internal resistors of the receiver. See 图
8-2 and 图8-3.
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Normal Mode
Standby Mode
CANH
VDIFF
VDIFF
CANL
Recessive
Dominant
Recessive
Time, t
图8-2. Bus States
CANH
2.5V
GND
A
B
RXD
Bias
Unit
CANL
A. Normal Mode
B. Standby Mode
图8-3. Simplified Recessive Common Mode Bias Unit and Receiver
8.3.3 TXD Dominant Timeout (DTO)
During normal mode, the only mode where the CAN driver is active, the TXD DTO circuit prevents the local node
from blocking network communication in the event of a hardware or software failure where TXD is held dominant
longer than the timeout period tTXD_DTO. The TXD DTO circuit is triggered by a falling edge on TXD. If no rising
edge is seen before the timeout period of the circuit, tTXD_DTO, the CAN driver is disabled. This frees the bus for
communication between other nodes on the network. The CAN driver is reactivated when a recessive signal is
seen on the TXD pin, thus clearing the dominant time out. The receiver remains active and biased to VCC/2 and
the RXD output reflects the activity on the CAN bus during the TXD DTO fault.
The minimum dominant TXD time allowed by the TXD DTO circuit limits the minimum possible transmitted data
rate of the device. The CAN protocol allows a maximum of eleven successive dominant bits (on TXD) for the
worst case, where five successive dominant bits are followed immediately by an error frame. The minimum
transmitted data rate may be calculated using 方程式1.
Minimum Data Rate = 11 bits / tTXD_DTO = 11 bits / 1.2 ms = 9.2 kbps
(1)
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Fault is repaired & transmission capability
restored
TXD fault stuck dominant: example PCB failure or bad software
tTXD_DTO
TXD (driver)
Driver disabled freeing bus for other nodes
Normal CAN communication
Bus would be —stuck dominant“ blocking communication for the whole network but TXD DTO
prevents this and frees the bus for communication after the time tTXD_DTO
.
CAN Bus Signal
tTXD_DTO
Communication from other bus node(s)
Communication from repaired node
RXD (receiver)
Communication from local node
Communication from other bus node(s)
Communication from repaired local node
图8-4. Example Timing Diagram for TXD Dominant Timeout
8.3.4 CAN Bus Short Circuit Current Limiting
The TCAN1044-Q1 has several protection features that limit the short circuit current when a CAN bus line is
shorted. These include CAN driver current limiting in the dominant and recessive states and TXD dominant state
timeout which prevents permanently having the higher short circuit current of a dominant state in case of a
system fault. During CAN communication the bus switches between the dominant and recessive states, thus the
short circuit current may be viewed as either the current during each bus state or as a DC average current.
When selecting termination resistors or a common mode choke for the CAN design the average power rating,
IOS(AVG), should be used. The percentage dominant is limited by the TXD DTO and the CAN protocol which has
forced state changes and recessive bits due to bit stuffing, control fields, and interframe space. These ensure
there is a minimum amount of recessive time on the bus even if the data field contains a high percentage of
dominant bits.
The average short circuit current of the bus depends on the ratio of recessive to dominant bits and their
respective short circuit currents. The average short circuit current may be calculated using 方程式2.
IOS(AVG) = % Transmit x [(% REC_Bits x IOS(SS)_REC) + (% DOM_Bits x IOS(SS)_DOM)] + [% Receive x IOS(SS)_REC
]
(2)
Where:
• IOS(AVG) is the average short circuit current
• % Transmit is the percentage the node is transmitting CAN messages
• % Receive is the percentage the node is receiving CAN messages
• % REC_Bits is the percentage of recessive bits in the transmitted CAN messages
• % DOM_Bits is the percentage of dominant bits in the transmitted CAN messages
• IOS(SS)_REC is the recessive steady state short circuit current
• IOS(SS)_DOM is the dominant steady state short circuit current
This short circuit current and the possible fault cases of the network should be taken into consideration when
sizing the power supply used to generate the transceivers VCC supply.
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8.3.5 Thermal Shutdown (TSD)
If the junction temperature of the TCAN1044-Q1 exceeds the thermal shutdown threshold, TTSD, the device turns
off the CAN driver circuitry and blocks the TXD to bus transmission path. The shutdown condition is cleared
when the junction temperature of the device drops below TTSD. The CAN bus pins are biased to VCC/2 during a
TSD fault and the receiver to RXD path remains operational. The TCAN1044-Q1 TSD circuit includes hysteresis
which prevents the CAN driver output from oscillating during a TSD fault.
8.3.6 Undervoltage Lockout
The supply pins, VCC and VIO, have undervoltage detection that places the device into a protected state. This
protects the bus during an undervoltage event on either supply pin.
表8-1. Undervoltage Lockout - TCAN1044-Q1
VCC
DEVICE STATE
BUS
RXD PIN
> UVVCC
Normal
Per TXD
Mirrors bus
High impedance
< UVVCC
Protected
High impedance
Weak pull-down to ground(1)
(1) VCC = GND, see ILKG(OFF)
表8-2. Undervoltage Lockout - TCAN1044-Q1V
VCC
VIO
DEVICE STATE
BUS
RXD PIN
Mirrors bus
> UVVCC
> UVVIO
Normal
Per TXD
STB = VIO: standby mode
STB = GND: Protected
Protected
VIO: Remote wake request(2)
< UVVCC
> UVVIO
High impedance
Weak pull-down to
ground(1)
Recessive
> UVVCC
< UVVCC
< UVVIO
< UVVIO
High impedance
High impedance
Protected
(1) VCC = GND, see ILKG(OFF)
(2) See 节8.4.3.1
Once the undervoltage condition is cleared and tMODE has expired the TCAN1044-Q1 transitions to normal mode
and the host controller can send and receive CAN traffic again.
8.3.7 Unpowered Device
The TCAN1044-Q1 is designed to be an ideal passive or no load to the CAN bus if the device is unpowered. The
bus pins were designed to have low leakage currents when the device is unpowered, so they do not load the
bus. This is critical if some nodes of the network are unpowered while the rest of the of network remains
operational.
The logic pins also have low leakage currents when the device is unpowered, so they do not load other circuits
which may remain powered.
8.3.8 Floating pins
The TCAN1044-Q1 has internal pull-ups on critical pins which place the device into known states if the pin floats.
This internal bias should not be relied upon by design though, especially in noisy environments, but instead
should be considered a failsafe protection feature.
When a CAN controller supporting open-drain outputs is used an adequate external pull-up resistor must be
chosen. This ensures that the TXD output of the CAN controller maintains acceptable bit time to the input of the
CAN transceiver. See 表8-3 for details on pin bias conditions.
表8-3. Pin Bias
Pin
Pull-up or Pull-down
Comment
Weakly biases TXD towards recessive to prevent bus blockage or
TXD DTO triggering
TXD
Pull-up
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表8-3. Pin Bias (continued)
Pin
Pull-up or Pull-down
Comment
Weakly biases STB towards low-power standby mode to prevent
excessive system power
STB
Pull-up
8.4 Device Functional Modes
8.4.1 Operating Modes
The TCAN1044-Q1 has two main operating modes; normal mode and standby mode. Operating mode selection
is made by applying a high or low level to the STB pin on the TCAN1044-Q1.
表8-4. Operating Modes
STB
High
Low
Device Mode
Driver
Disabled
Enabled
Receiver
RXD Pin
High (recessive) until valid WUP
is received
Low current standby mode with
bus wake-up
Low-power receiver and bus
monitor enable
See section 8.3.3.1
Normal Mode
Enabled
Mirrors bus state
8.4.2 Normal Mode
This is the normal operating mode of the TCAN1044-Q1. The CAN driver and receiver are fully operational and
CAN communication is bi-directional. The driver is translating a digital input on the TXD input to a differential
output on the CANH and CANL bus pins. The receiver is translating the differential signal from CANH and CANL
to a digital output on the RXD output.
8.4.3 Standby Mode
This is the low-power mode of the TCAN1044-Q1. The CAN driver and main receiver are switched off and bi-
directional CAN communication is not possible. The low-power receiver and bus monitor circuits are enabled to
allow for RXD wake-up requests via the CAN bus. A wake-up request is output to RXD as shown in 图 8-5. The
local CAN protocol controller should monitor RXD for transitions (high-to-low) and reactivate the device to normal
mode by pulling the STB pin low . The CAN bus pins are weakly pulled to GND in this mode; see 图 8-2 and 图
8-3.
In standby mode, only the VIO supply is required therefore the VCC may be switched off for additional system
level current savings.
8.4.3.1 Remote Wake Request via Wake-Up Pattern (WUP) in Standby Mode
The TCAN1044-Q1 supports a remote wake-up request that is used to indicate to the host controller that the bus
is active and the node should return to normal operation.
The device uses the multiple filtered dominant wake-up pattern (WUP) from the ISO 11898-2:2016 standard to
qualify bus activity. Once a valid WUP has been received, the wake request is indicated to the controller by a
falling edge and low period corresponding to a filtered dominant on the RXD output of the TCAN1044-Q1.
The WUP consists of a filtered dominant pulse, followed by a filtered recessive pulse, and finally by a second
filtered dominant pulse. The first filtered dominant initiates the WUP, and the bus monitor then waits on a filtered
recessive; other bus traffic does not reset the bus monitor. Once a filtered recessive is received the bus monitor
is waiting for a filtered dominant and again, other bus traffic does not reset the bus monitor. Immediately upon
reception of the second filtered dominant the bus monitor recognizes the WUP and drives the RXD output low
every time an additional filtered dominant signal is received from the bus.
For a dominant or recessive to be considered filtered, the bus must be in that state for more than the tWK_FILTER
time. Due to variability in tWK_FILTER the following scenarios are applicable. Bus state times less than
tWK_FILTER(MIN) are never detected as part of a WUP and thus no wake request is generated. Bus state times
between tWK_FILTER(MIN) and tWK_FILTER(MAX) may be detected as part of a WUP and a wake-up request may be
generated. Bus state times greater than tWK_FILTER(MAX) are always detected as part of a WUP, and thus a wake
request is always generated. See 图8-5 for the timing diagram of the wake-up pattern.
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The pattern and tWK_FILTER time used for the WUP prevents noise and bus stuck dominant faults from causing
false wake-up requests while allowing any valid message to initiate a wake-up request.
The ISO 11898-2:2016 standard has defined times for a short and long wake-up filter time. The tWK_FILTER timing
for the device has been picked to be within the minimum and maximum values of both filter ranges. This timing
has been chosen such that a single bit time at 500 kbps, or two back-to-back bit times at 1 Mbps triggers the
filter in either bus state. Any CAN frame at 500 kbps or less would contain a valid WUP.
For an additional layer of robustness and to prevent false wake-ups, the device implements a wake-up timeout
feature. For a remote wake-up event to successfully occur, the entire WUP must be received within the timeout
value t ≤ tWK_TIMEOUT. If not, the internal logic is reset and the transceiver remains in its current state without
waking up. The full pattern must then be transmitted again, conforming to the constraints mentioned in this
section. See 图8-5 for the timing diagram of the wake-up pattern with wake timeout feature.
Bus Wake via RXD
Wake Up Pattern (WUP) received in t < tWK_Timeout
Request
Filtered
Dominant
Filtered
Dominant
Filtered
Recessive
Waiting for
Filtered
Dominant
Waiting for
Filtered
Recessive
Bus
Bus VDiff
RXD
≥ tWK_FILTER
≥ tWK_FILTER
≥ tWK_FILTER
≥ tWK_FILTER
Filtered Dominant RXD Output
Bus Wake Via RXD Requests
图8-5. Wake-Up Pattern (WUP) with tWK_TIMEOUT
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8.4.4 Driver and Receiver Function
The digital logic input and output levels for the TCAN1044-Q1 are CMOS levels with respect to either VCC for 5 V
systems or VIO for compatible with MCUs having 1.8 V, 2.5 V, 3.3 V, or 5 V systems.
表8-5. Driver Function Table
Bus Outputs
Device Mode
TXD Input(1)
Driven Bus State(2)
CANH
High
CANL
Low
Low
High or open
X
Dominant
Normal
High impedance
High impedance
High impedance
High impedance
Biased recessive
Biased to ground
Standby
(1) X = irrelevant
(2) For bus state and bias see 图8-2 and 图8-3
表8-6. Receiver Function Table Normal and Standby Mode
CAN Differential Inputs
VID = VCANH –VCANL
Device Mode
Bus State
RXD Pin
Dominant
Undefined
Recessive
Dominant
Undefined
Recessive
Open
Low
Undefined
High
VID ≥0.9 V
0.5 V < VID < 0.9 V
VID ≤0.5 V
Normal
High
Low if a remote wake event
occurred
VID ≥1.15 V
Standby
Any
0.4 V < VID < 1.15 V
VID ≤0.4 V
See 图8-5
High
Open (VID ≈0 V)
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9 Application and Implementation
Note
以下应用部分中的信息不属于TI 器件规格的范围，TI 不担保其准确性和完整性。TI 的客 户应负责确定
器件是否适用于其应用。客户应验证并测试其设计，以确保系统功能。
9.1 Application Information
9.2 Typical Application
The TCAN1044-Q1 transceiver can be used in applications with a host controller or FPGA that includes the link
layer portion of the CAN protocol. 图 9-1 shows a typical configuration for 5 V controller applications. The bus
termination is shown for illustrative purposes.
VOUT
VIN
VIN
5V Voltage
Regulator
(e.g. TPSxxxx)
VCC
VDD
CANH
3
7
STB
Port x
8
CAN FD Controller
TCAN1044
RXD
TXD
RXD
TXD
4
1
CANL
6
5
2
NC
GND
Optional:
Terminating
Node
Optional:
Filtering,
Transient and
ESD
图9-1. Transceiver Application Using 5 V I/O Connections
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9.2.1 Design Requirements
9.2.1.1 CAN Termination
Termination may be a single 120-Ω resistor at each end of the bus, either on the cable or in a terminating node.
If filtering and stabilization of the common-mode voltage of the bus is desired then split termination may be used,
see 图 9-2. Split termination improves the electromagnetic emissions behavior of the network by filtering higher-
frequency common-mode noise that may be present on the differential signal lines.
Standard Termination
Split Termination
CANH
CANH
RTERM/2
RTERM
TCAN Transceiver
TCAN Transceiver
CSPLIT
RTERM/2
CANL
CANL
图9-2. CAN Bus Termination Concepts
9.2.2 Detailed Design Procedures
9.2.2.1 Bus Loading, Length and Number of Nodes
A typical CAN application may have a maximum bus length of 40 meters and maximum stub length of 0.3 m.
However, with careful design, users can have longer cables, longer stub lengths, and many more nodes to a
bus. A high number of nodes requires a transceiver with high input impedance such as the TCAN1044-Q1.
Many CAN organizations and standards have scaled the use of CAN for applications outside the original ISO
11898-2 standard. They made system level trade off decisions for data rate, cable length, and parasitic loading
of the bus. Examples of these CAN systems level specifications are ARINC 825, CANopen, DeviceNet, SAE
J2284, SAE J1939, and NMEA 2000.
A CAN network system design is a series of tradeoffs. In the ISO 11898-2:2016 specification the driver
differential output is specified with a bus load that can range from 50 Ω to 65 Ω where the differential output
must be greater than 1.5 V. The TCAN1044-Q1 family is specified to meet the 1.5 V requirement down to 50 Ω
and is specified to meet 1.4 V differential output at 45Ω bus load. The differential input resistance of the
TCAN1044-Q1 is a minimum of 40 kΩ. If 100 TCAN1044-Q1 transceivers are in parallel on a bus, this is
equivalent to a 400-Ω differential load in parallel with the nominal 60 Ω bus termination which gives a total bus
load of approximately 52 Ω. Therefore, the TCAN1044-Q1 family theoretically supports over 100 transceivers on
a single bus segment. However, for a CAN network design margin must be given for signal loss across the
system and cabling, parasitic loadings, timing, network imbalances, ground offsets and signal integrity thus a
practical maximum number of nodes is often lower. Bus length may also be extended beyond 40 meters by
careful system design and data rate tradeoffs. For example, CANopen network design guidelines allow the
network to be up to 1 km with changes in the termination resistance, cabling, less than 64 nodes and
significantly lowered data rate.
This flexibility in CAN network design is one of the key strengths of the various extensions and additional
standards that have been built on the original ISO 11898-2 CAN standard. However, when using this flexibility,
the CAN network system designer must take the responsibility of good network design to ensure robust network
operation.
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Node n
(with termination)
Node 1
Node 2
Node 3
MCU or DSP
MCU or DSP
MCU or DSP
MCU or DSP
CAN Controller
CAN Controller
CAN Controller
CAN Controller
TCAN1044V-Q1
RTERM
TCAN1044-Q1
TCAN1042-Q1
TCAN1043-Q1
RTERM
图9-3. Typical CAN Bus
9.2.3 Application Curves
VCC = 5 V
VIO = 3.3 V
VCC = 5 V
VIO = 3.3 V
RL = 60 Ω
RL = 60 Ω
图9-4. tPROP(LOOP1)
图9-5. tPROP(LOOP2)
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9.3 System Examples
The TCAN1044-Q1 CAN transceiver is typically used in applications with a host controller or FPGA that includes
the link layer portion of the CAN protocol. A 1.8 V, 2.5 V, or 3.3 V application is shown in 图 9-6. The bus
termination is shown for illustrative purposes.
图9-6. Typical Transceiver Application Using 1.8 V, 2.5 V, 3.3 V IO Connections
10 Power Supply Recommendations
The TCAN1044-Q1 transceiver is designed to operate with a main VCC input voltage supply range between 4.5
V and 5.5 V. The TCAN1044-Q1V implements an IO level shifting supply input, VIO, designed for a range
between 1.8 V and 5.5 V. Both supply inputs must be well regulated. A decoupling capacitance, typically 100 nF,
should be placed near the CAN transceiver's main VCC supply pin in addition to bypass capacitors. A decoupling
capacitor, typically 100 nF, should be placed near the CAN transceiver's VIO supply pin in addition to bypass
capacitors.
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Layout
Robust and reliable CAN node design may require special layout techniques depending on the application and
automotive design requirements. Since transient disturbances have high frequency content and a wide
bandwidth, high-frequency layout techniques should be applied during PCB design.
11.1 Layout Guidelines
• Place the protection and filtering circuitry close to the bus connector, J1, to prevent transients, ESD, and
noise from propagating onto the board. This layout example shows an optional transient voltage suppression
(TVS) diode, D1, which may be implemented if the system-level requirements exceed the specified rating of
the transceiver. This example also shows optional bus filter capacitors C4 and C5.
• Design the bus protection components in the direction of the signal path. Do not force the transient current to
divert from the signal path to reach the protection device.
• Decoupling capacitors should be placed as close as possible to the supply pins VCC and VIO of transceiver.
• Use at least two vias for supply and ground connections of bypass capacitors and protection devices to
minimize trace and via inductance.
Note
High frequency current follows the path of least impedance and not the path of least resistance.
• This layout example shows how split termination could be implemented on the CAN node. The termination is
split into two resistors, R6 and R7, with the center or split tap of the termination connected to ground via
capacitor C3. Split termination provides common mode filtering for the bus. See 节9.2.1.1, 节8.3.4, and 方程
式2 for information on termination concepts and power ratings needed for the termination resistor(s).
• To limit current of digital lines series resistors may be used. Examples are R2, R3 and R4.
• Pin 1 is shown for the TXD input of the device with R1 as an optional pull-up resistor. If an open drain host
controller is used this is mandatory to ensure the bit timing into the device is met.
• Pin 8 is shown with R4 assuming the mode pin STB, is used. If the device is used in normal mode only, R4 is
not needed and the pads of C4 could be used for the pull down resistor R5 to GND.
11.2 Layout Example
STB
VCC or VIO
GND
R1
R2
TXD
GND
R6
R7
GND
U1
TCAN1044(V)
C3
VCC
GND
VIO
R3
RXD
GND
图11-1. Layout Example
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11 Device and Documentation Support
11.1 接收文档更新通知
要接收文档更新通知，请导航至 ti.com 上的器件产品文件夹。点击订阅更新 进行注册，即可每周接收产品信息更
改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
11.2 支持资源
TI E2E™ 支持论坛是工程师的重要参考资料，可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解
答或提出自己的问题可获得所需的快速设计帮助。
链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅
TI 的《使用条款》。
11.3 Trademarks
TI E2E™ is a trademark of Texas Instruments.
所有商标均为其各自所有者的财产。
11.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
11.5 术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。
Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
www.ti.com
18-Aug-2021
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TCAN1044DRBRQ1
TCAN1044DRQ1
ACTIVE
ACTIVE
SON
DRB
D
8
8
8
8
8
3000 RoHS & Green
2500 RoHS & Green
3000 RoHS & Green
3000 RoHS & Green
2500 RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-2-260C-1 YEAR
Level-1-260C-UNLIM
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
1044
1044
26SF
SOIC
NIPDAU
NIPDAU
NIPDAU
NIPDAU
TCAN1044VDDFRQ1
TCAN1044VDRBRQ1
TCAN1044VDRQ1
ACTIVE SOT-23-THIN
DDF
DRB
D
ACTIVE
ACTIVE
SON
1044V
1044V
SOIC
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
18-Aug-2021
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TCAN1044V-Q1 :
Catalog : TCAN1044V
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Apr-2023
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TCAN1044DRBRQ1
TCAN1044DRQ1
SON
DRB
D
8
8
8
3000
2500
3000
330.0
330.0
180.0
12.4
12.4
8.4
3.3
6.4
3.2
3.3
5.2
3.2
1.1
2.1
1.4
8.0
8.0
4.0
12.0
12.0
8.0
Q1
Q1
Q3
SOIC
TCAN1044VDDFRQ1 SOT-23-
THIN
DDF
TCAN1044VDRBRQ1
TCAN1044VDRQ1
SON
DRB
D
8
8
3000
2500
330.0
330.0
12.4
12.4
3.3
6.4
3.3
5.2
1.1
2.1
8.0
8.0
12.0
12.0
Q1
Q1
SOIC
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Apr-2023
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TCAN1044DRBRQ1
TCAN1044DRQ1
SON
SOIC
DRB
D
8
8
8
8
8
3000
2500
3000
3000
2500
367.0
356.0
210.0
367.0
356.0
367.0
356.0
185.0
367.0
356.0
35.0
35.0
35.0
35.0
35.0
TCAN1044VDDFRQ1
TCAN1044VDRBRQ1
TCAN1044VDRQ1
SOT-23-THIN
SON
DDF
DRB
D
SOIC
Pack Materials-Page 2
PACKAGE OUTLINE
DDF0008A
SOT-23 - 1.1 mm max height
S
C
A
L
E
4
.
0
0
0
PLASTIC SMALL OUTLINE
C
2.95
2.65
SEATING PLANE
TYP
PIN 1 ID
AREA
0.1 C
A
6X 0.65
8
1
2.95
2.85
NOTE 3
2X
1.95
4
5
0.38
0.22
8X
0.1
C A B
1.65
1.55
B
1.1 MAX
0.20
0.08
TYP
SEE DETAIL A
0.25
GAGE PLANE
0.1
0.0
0 - 8
0.6
0.3
DETAIL A
TYPICAL
4222047/C 10/2022
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
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EXAMPLE BOARD LAYOUT
DDF0008A
SOT-23 - 1.1 mm max height
PLASTIC SMALL OUTLINE
8X (1.05)
SYMM
1
8
8X (0.45)
SYMM
6X (0.65)
5
4
(R0.05)
TYP
(2.6)
LAND PATTERN EXAMPLE
SCALE:15X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4222047/C 10/2022
NOTES: (continued)
4. Publication IPC-7351 may have alternate designs.
5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
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EXAMPLE STENCIL DESIGN
DDF0008A
SOT-23 - 1.1 mm max height
PLASTIC SMALL OUTLINE
8X (1.05)
SYMM
(R0.05) TYP
8
1
8X (0.45)
SYMM
6X (0.65)
5
4
(2.6)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:15X
4222047/C 10/2022
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
7. Board assembly site may have different recommendations for stencil design.
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PACKAGE OUTLINE
D0008A
SOIC - 1.75 mm max height
SCALE 2.800
SMALL OUTLINE INTEGRATED CIRCUIT
C
SEATING PLANE
.228-.244 TYP
[5.80-6.19]
.004 [0.1] C
A
PIN 1 ID AREA
6X .050
[1.27]
8
1
2X
.189-.197
[4.81-5.00]
NOTE 3
.150
[3.81]
4X (0 -15 )
4
5
8X .012-.020
[0.31-0.51]
B
.150-.157
[3.81-3.98]
NOTE 4
.069 MAX
[1.75]
.010 [0.25]
C A B
.005-.010 TYP
[0.13-0.25]
4X (0 -15 )
SEE DETAIL A
.010
[0.25]
.004-.010
[0.11-0.25]
0 - 8
.016-.050
[0.41-1.27]
DETAIL A
TYPICAL
(.041)
[1.04]
4214825/C 02/2019
NOTES:
1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.
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EXAMPLE BOARD LAYOUT
D0008A
SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
8X (.061 )
[1.55]
SYMM
SEE
DETAILS
1
8
8X (.024)
[0.6]
SYMM
(R.002 ) TYP
[0.05]
5
4
6X (.050 )
[1.27]
(.213)
[5.4]
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:8X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
EXPOSED
METAL
EXPOSED
METAL
.0028 MAX
[0.07]
.0028 MIN
[0.07]
ALL AROUND
ALL AROUND
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4214825/C 02/2019
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
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EXAMPLE STENCIL DESIGN
D0008A
SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
8X (.061 )
[1.55]
SYMM
1
8
8X (.024)
[0.6]
SYMM
(R.002 ) TYP
[0.05]
5
4
6X (.050 )
[1.27]
(.213)
[5.4]
SOLDER PASTE EXAMPLE
BASED ON .005 INCH [0.125 MM] THICK STENCIL
SCALE:8X
4214825/C 02/2019
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
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PACKAGE OUTLINE
VSON - 1 mm max height
DRB0008J
PLASTIC QUAD FLAT PACK- NO LEAD
3.1
2.9
B
A
PIN 1 INDEX AREA
3.1
2.9
0.1 MIN
(0.13)
SECTION A-A
TYPICAL
1 MAX
C
SEATING PLANE
0.08 C
0.05
0.00
1.75
1.55
(0.2) TYP
6X 0.65
(0.19)
4
5
SYMM
9
2.5
2.3
1.95
1
8
0.36
0.26
8X
PIN 1 ID
(OPTIONAL)
0.1
0.05
C A B
C
SYMM
0.5
0.3
8X
4225036/A 06/2019
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
VSON - 1 mm max height
DRB0008J
PLASTIC QUAD FLAT PACK- NO LEAD
(2.8)
(1.65)
8X (0.6)
8X (0.31)
SYMM
1
8
6X (0.65)
SYMM
9
(1.95) (2.4)
(0.95)
(R0.05) TYP
4
5
(Ø 0.2) VIA
TYP
(0.575)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 20X
0.07 MAX
ALL AROUND
0.07 MIN
ALL AROUND
METAL
SOLDER MASK
OPENING
EXPOSED METAL
EXPOSED METAL
SOLDER MASK
OPENING
METAL
NON- SOLDER MASK
SOLDER MASK
DEFINED
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4225036/A 06/2019
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
VSON - 1 mm max height
DRB0008J
PLASTIC QUAD FLAT PACK- NO LEAD
(2.8)
2X
(1.51)
8X (0.6)
8X (0.31)
SYMM
1
8
2X
(1.06)
6X (0.65)
SYMM
(1.95)
(0.63)
9
(R0.05) TYP
4
5
METAL
TYP
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD
81% PRINTED COVERAGE BY AREA
SCALE: 20X
4225036/A 06/2019
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
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