TCAN1162-Q1 [TI]
具有集成 5V 电源的汽车类 CAN-FD 收发器;
| 型号： | TCAN1162-Q1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有集成 5V 电源的汽车类 CAN-FD 收发器 |
| 文件： | 总15页 (文件大小：1804K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TCAN1162-Q1
ZHCSNI3 – MAY 2021
TCAN1162-Q1 具有睡眠模式的汽车自供电 CAN FD 收发器
1 特性
2 应用
•
•
•
符合面向汽车应用的 AEC Q100（1 级）标准
•
•
•
•
高级驾驶辅助系统 (ADAS)
车身电子装置与照明
符合 ISO 11898-2:2016 的要求
宽工作输入电压范围：
汽车信息娱乐系统与仪表组
混合动力、电动和动力总成系统
– VSUP 范围：5.5V 至 28V
•
•
为 CAN 收发器供电的集成 LDO
支持高达 8Mbps 的传统 CAN 和 CAN FD
– 具有较短的对称传播延迟时间和快速循环次数，
可增加时序裕量
3 说明
TCAN1162-Q1 是一款高速控制器局域网 (CAN) 收发
器，满足 ISO 11898-2:2016 高速 CAN 规范的物理层
要求。TCAN1162-Q1 支持传统 CAN 和 CAN FD 网络
（数据速率高达 8 兆位/秒 (Mbps)）。
– 在有负载 CAN 网络中实现更快的数据速率
VIO 电平转换支持：1.7V 至 5.5V
工作模式
•
•
TCAN1162-Q1 集成了一个具有宽输入工作电压范围的
LDO，可为 CAN 收发器提供 5V 电压，从而无需由外
部电压源提供 5V 电压。
– 正常模式
– 具有 INH 输出以及本地和远程唤醒请求功能的
待机模式
TCAN1162-Q1 可通过 INH 输出引脚选择性启用节点
上可能存在的各种电源，从而在整个系统级别减少电池
电流消耗。这使得在超低电流睡眠模式中，功率传送到
除 TCAN1162-Q1 以外的所有系统元件，而该器件则
仍然处于低功耗状态，并对 CAN 总线进行监控。检测
到唤醒事件时，TCAN1162-Q1 通过将 INH 输出驱动
至高电平来启动节点。
– 具有 INH 输出以及本地和远程唤醒请求的低功
耗睡眠模式
•
•
优化了未上电时的性能
– 总线和逻辑终端为高阻抗（运行总线或应用上无
负载）
– 支持热插拔：在总线和 RXD 输出上可实现上电/
断电无干扰运行
保护特性：±58V 总线容错、VSUP 上支持 42V 负载
突降、IEC ESD 保护、欠压保护、过压保护、热关
断保护、TXD 显性状态超时
器件信息
器件型号
封装(1)
封装尺寸（标称值）
TCAN1162-Q1
VSON (14)
4.5mm x 3.00mm
•
•
结温范围：–40°C 至 150°C
采用 4.5mm x 3.0mm 无引线 VSON (14) 封装，具
有改进的自动光学检查 (AOI) 功能
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附
录。
3.3V Voltage Regulator
(e.g. TPSxxxx)
EN
VBAT
LED Driver
0.1ꢀF
0.1ꢀF
10ꢀF
3.3kΩ
33kΩ
VSUP
10
VIO
VFLT
5
3
0.1nF
9
7
WAKE
CANH
VIN
13
INH
TCAN1162
nSLP
TS
14
6
CAN FD
Controller
nRST
TXD
11
1
CANL
12
Optional:
Terminating
Node
RXD
4
Optional:
Filtering,
Transient and
ESD
2
GND
简化版原理图
本文档旨在为方便起见，提供有关 TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问
www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SLLSFN0
TCAN1162-Q1
ZHCSNI3 – MAY 2021
www.ti.com.cn
4 说明（续）
TCAN1162-Q1 支持超低功耗待机模式；在该模式下，高速发送器和普通接收器均关闭，而低功耗唤醒接收器会通
过 ISO 11898-2:2016 定义的唤醒模式 (WUP) 来实现远程唤醒。
TCAN1162-Q1 包括通过 VIO 端子实现的内部逻辑电平转换功能，允许直接连接到 1.8V、2.5V、3.3V 或 5V 控制
器。该收发器包括许多保护和诊断功能，如欠压检测、过压检测、热关断 (TSD)、驱动器显性超时 (TXD DTO) 和
高达 ±58V 的总线故障保护。
TCAN1162-Q1 可通过 INH 输出引脚选择性启用节点上可能存在的各种电源，从而在整个系统级别减少电池电
流消耗。这使得在超低电流睡眠状态中，功率传送到除 TCAN1162-Q1 以外的所有系统元件，而该器件则仍然
处于低功耗状态，并对 CAN 总线进行监控。在总线上检测到唤醒模式或通过 WAKE 输入请求本地唤醒时，
TCAN1162-Q1 通过将 INH 输出驱动至高电平来启动节点。
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ZHCSNI3 – MAY 2021
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5 Device and Documentation Support
TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device,
generate code, and develop solutions are listed below.
5.1 Documentation Support
5.1.1 Related Documentation
5.2 接收文档更新通知
要接收文档更新通知，请导航至 ti.com 上的器件产品文件夹。点击订阅更新 进行注册，即可每周接收产品信息更
改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
5.3 支持资源
TI E2E™ 支持论坛是工程师的重要参考资料，可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解
答或提出自己的问题可获得所需的快速设计帮助。
链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅 TI
的《使用条款》。
5.4 Trademarks
TI E2E™ is a trademark of Texas Instruments.
所有商标均为其各自所有者的财产。
5.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
5.6 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
Mechanical, Packaging, and Orderable Information
The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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6.1 Tape and Reel Information
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
Reel
Diameter
(mm)
Reel
Width W1
(mm)
Package
Type
Package
Drawing
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
Device
Pins
SPQ
PTCAN1162DMTRQ1
VSON
DMT
14
3000
330.0
12.4
3.3
4.8
1.2
8.0
12.0
Q1
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TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
Device
PTCAN1162DMTRQ1
Package Type
Package Drawing Pins
DMT 14
SPQ
Length (mm) Width (mm)
367.0 367.0
Height (mm)
VSON
3000
35.0
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6.2 Mechanical Data
PACKAGE OUTLINE
DMT0014B
VSON - 1 mm max height
SCALE 3.200
PLASTIC SMALL OUTLINE - NO LEAD
3.1
2.9
A
B
PIN 1 INDEX AREA
4.6
4.4
0.1 MIN
(0.13)
1.0
0.8
S
C
A
L
E
3
0
.
0
0
0
SECTION A-A
TYPICAL
C
SEATING PLANE
0.08 C
0.05
0.00
1.6 0.1
SYMM
EXPOSED
THERMAL PAD
(0.2) TYP
7
8
(0.19) TYP
A
A
2X
15
SYMM
3.9
4.2 0.1
14
1
12X 0.65
0.35
0.25
14X
0.45
0.35
PIN 1 ID
(OPTIONAL)
14X
0.1
C A B
0.05
C
4225087/B 01/2021
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
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EXAMPLE BOARD LAYOUT
DMT0014B
VSON - 1 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
(1.6)
14X (0.6)
14X (0.3)
SYMM
1
14
2X
(1.85)
12X (0.65)
SYMM
15
(4.2)
(0.69)
TYP
(
0.2) VIA
TYP
8
7
(R0.05) TYP
(0.55) TYP
(2.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
0.07 MAX
ALL AROUND
0.07 MIN
ALL AROUND
EXPOSED METAL
EXPOSED METAL
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL
METAL UNDER
SOLDER MASK
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4225087/B 01/2021
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
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EXAMPLE STENCIL DESIGN
DMT0014B
VSON - 1 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
(1.47)
15
14X (0.6)
1
14
14X (0.3)
(1.18)
12X (0.65)
SYMM
(1.38)
(R0.05) TYP
METAL
TYP
8
7
SYMM
(2.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD 15
77.4% PRINTED SOLDER COVERAGE BY AREA
SCALE:20X
4225087/B 01/2021
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
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重要声明和免责声明
TI 提供技术和可靠性数据（包括数据表）、设计资源（包括参考设计）、应用或其他设计建议、网络工具、安全信息和其他资源，不保证没
有瑕疵且不做出任何明示或暗示的担保，包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担保。
这些资源可供使用 TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任：(1) 针对您的应用选择合适的 TI 产品，(2) 设计、验
证并测试您的应用，(3) 确保您的应用满足相应标准以及任何其他安全、安保或其他要求。这些资源如有变更，恕不另行通知。TI 授权您仅可
将这些资源用于研发本资源所述的 TI 产品的应用。严禁对这些资源进行其他复制或展示。您无权使用任何其他 TI 知识产权或任何第三方知
识产权。您应全额赔偿因在这些资源的使用中对 TI 及其代表造成的任何索赔、损害、成本、损失和债务，TI 对此概不负责。
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提供这些资源并不会扩展或以其他方式更改 TI 针对 TI 产品发布的适用的担保或担保免责声明。重要声明
邮寄地址：Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2021，德州仪器 (TI) 公司
PACKAGE OPTION ADDENDUM
www.ti.com
18-Dec-2021
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TCAN1162DMTRQ1
ACTIVE
VSON
DMT
14
3000 RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 150
1162
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
GENERIC PACKAGE VIEW
DMT 14
3 x 4.5, 0.65 mm pitch
VSON - 0.9 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4225088/A
www.ti.com
PACKAGE OUTLINE
DMT0014B
VSON - 1 mm max height
SCALE 3.200
PLASTIC SMALL OUTLINE - NO LEAD
3.1
2.9
A
B
PIN 1 INDEX AREA
4.6
4.4
0.1 MIN
(0.13)
1.0
0.8
SECTION A-A
SCALE 30.000
SECTION A-A
TYPICAL
C
SEATING PLANE
0.08 C
0.05
0.00
1.6 0.1
SYMM
EXPOSED
THERMAL PAD
(0.2) TYP
7
8
(0.19) TYP
A
A
2X
3.9
15
SYMM
4.2 0.1
14
1
12X 0.65
0.35
0.25
14X
0.45
0.35
PIN 1 ID
14X
0.1
C A B
(OPTIONAL)
0.05
C
4225087/B 01/2021
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
DMT0014B
VSON - 1 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
(1.6)
14X (0.6)
14X (0.3)
SYMM
1
14
2X
(1.85)
12X (0.65)
SYMM
15
(4.2)
(0.69)
TYP
(
0.2) VIA
TYP
8
7
(R0.05) TYP
(0.55) TYP
(2.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
0.07 MAX
ALL AROUND
0.07 MIN
ALL AROUND
EXPOSED METAL
EXPOSED METAL
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL
METAL UNDER
SOLDER MASK
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4225087/B 01/2021
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
DMT0014B
VSON - 1 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
(1.47)
15
14X (0.6)
1
14
14X (0.3)
(1.18)
12X (0.65)
SYMM
(1.38)
(R0.05) TYP
METAL
TYP
8
7
SYMM
(2.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD 15
77.4% PRINTED SOLDER COVERAGE BY AREA
SCALE:20X
4225087/B 01/2021
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
重要声明和免责声明
TI“按原样”提供技术和可靠性数据（包括数据表）、设计资源（包括参考设计）、应用或其他设计建议、网络工具、安全信息和其他资源，
不保证没有瑕疵且不做出任何明示或暗示的担保，包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担
保。
这些资源可供使用 TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任：(1) 针对您的应用选择合适的 TI 产品，(2) 设计、验
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