TLC5628INE4 [TI]

OCTAL, SERIAL INPUT LOADING, 10us SETTLING TIME, 8-BIT DAC, PDIP16, PLASTIC, DIP-16;
TLC5628INE4
型号: TLC5628INE4
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

OCTAL, SERIAL INPUT LOADING, 10us SETTLING TIME, 8-BIT DAC, PDIP16, PLASTIC, DIP-16

输入元件 光电二极管 转换器
文件: 总15页 (文件大小:240K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
TLC5628C, TLC5628I  
OCTAL 8-BIT DIGITAL-TO-ANALOG CONVERTERS  
SLAS089E – NOVEMBER 1994 – REVISED APRIL 1997  
N OR DW PACKAGE  
(TOP VIEW)  
Eight 8-Bit Voltage Output DACs  
5-V Single-Supply Operation  
Serial Interface  
DACC  
DACD  
REF1  
DACB  
DACA  
GND  
1
2
3
4
5
6
7
8
16  
15  
14  
High-Impedance Reference Inputs  
Programmable 1 or 2 Times Output Range  
Simultaneous Update Facility  
Internal Power-On Reset  
13 LDAC  
12 LOAD  
DATA  
CLK  
11  
10  
9
REF2  
DACH  
DACG  
V
DD  
Low-Power Consumption  
DACE  
DACF  
Half-Buffered Output  
applications  
Programmable Voltage Sources  
Digitally Controlled Amplifiers/Attenuators  
Mobile Communications  
Automatic Test Equipment  
Process Monitoring and Control  
Signal Synthesis  
description  
The TLC5628C and TLC5628I are octal 8-bit voltage output digital-to-analog converters (DACs) with buffered  
reference inputs (high impedance). The DACs produce an output voltage that ranges between either one or two  
times the reference voltages and GND and are monotonic. The device is simple to use, running from a single  
supply of 5 V. A power-on reset function is incorporated to ensure repeatable start-up conditions.  
Digital control of the TLC5628C and TLC5628I are over a simple three-wire serial bus that is CMOS compatible  
and easily interfaced to all popular microprocessor and microcontroller devices. The 12-bit command word  
comprises eight bits of data, three DAC select bits, and a range bit, the latter allowing selection between the  
times 1 or times 2 output range. The DAC registers are double buffered, allowing a complete set of new values  
tobewrittentothedevice, thenallDACoutputsareupdatedsimultaneouslythroughcontrolofLDAC. Thedigital  
inputs feature Schmitt triggers for high-noise immunity.  
The 16-terminal small-outline (D) package allows digital control of analog functions in space-critical  
applications. The TLC5628C is characterized for operation from 0°C to 70°C. The TLC5628I is characterized  
for operation from 40°C to 85°C. The TLC5628C and TLC5628I do not require external trimming.  
AVAILABLE OPTIONS  
PACKAGE  
SMALL OUTLINE  
(DW)  
PLASTIC DIP  
(N)  
T
A
0°C to 70°C  
TLC5628CDW  
TLC5628IDW  
TLC5628CN  
TLC5628IN  
40°C to 85°C  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Copyright 1997, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLC5628C, TLC5628I  
OCTAL 8-BIT DIGITAL-TO-ANALOG CONVERTERS  
SLAS089E – NOVEMBER 1994 – REVISED APRIL 1997  
functional block diagram  
14  
REF1  
+
DAC  
2
+
DACA  
× 2  
9
8
Latch  
Latch  
DAC  
DAC  
15  
7
+
DACD  
DACE  
× 2  
× 2  
8
8
Latch  
Latch  
Latch  
Latch  
11  
REF2  
+
+
DAC  
10  
+
DACH  
× 2  
8
Latch  
Latch  
5
CLK  
DATA  
LOAD  
Power-On  
Reset  
4
Serial  
Interface  
13  
LDAC  
12  
Terminal Functions  
TERMINAL  
NAME NO.  
CLK  
I/O  
DESCRIPTION  
5
I
Serialinterface clock. The input digital data is shifted into the serial interface register on the falling edge of the clock  
applied to the CLK terminal.  
DACA  
DACB  
DACC  
DACD  
DACE  
DACF  
DACG  
DACH  
DATA  
2
1
O
O
O
O
O
O
O
O
I
DAC A analog output  
DAC B analog output  
DAC C analog output  
DAC D analog output  
DAC E analog output  
DAC F analog output  
DAC G analog output  
DAC H analog output  
16  
15  
7
8
9
10  
4
Serial interface digital data input. The digital code for the DAC is clocked into the serial interface register serially.  
Each data bit is clocked into the register on the falling edge of the clock signal.  
GND  
3
I
I
Ground return and reference terminal  
LDAC  
13  
Load DAC. When LDAC is high, no DAC output updates occur when the input digital data is read into the serial  
interface. The DAC outputs are only updated when LDAC is taken from high to low.  
LOAD  
12  
I
Serial interface load control. When LDAC is low, the falling edge of the LOAD signal latches the digital data into  
the output latch and immediately produces the analog voltage at the DAC output terminal.  
REF1  
REF2  
14  
11  
6
I
I
I
Reference voltage input to DAC A B C D. This voltage defines the analog output range.  
Reference voltage input to DAC E F G H. This voltage defines the analog output range.  
Positive supply voltage  
V
DD  
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLC5628C, TLC5628I  
OCTAL 8-BIT DIGITAL-TO-ANALOG CONVERTERS  
SLAS089E – NOVEMBER 1994 – REVISED APRIL 1997  
detailed description  
The TLC5628 is implemented using eight resistor-string DACs. The core of each DAC is a single resistor with  
256 taps, corresponding to the 256 possible codes listed in Table 1. One end of each resistor string is connected  
to GND and the other end is fed from the output of the reference input buffer. Monotonicity is maintained by use  
of the resistor strings. Linearity depends upon the matching of the resistor segments and upon the performance  
of the output buffer. Since the inputs are buffered, the DACs always present a high-impedance load to the  
reference sources. There are two input reference terminals; REF1 is used for DACA through DACD and REF2  
is used by DACE through DACH.  
EachDAC output is buffered by a configurable-gain output amplifier, that can be programmed to times 1 or times  
2 gain.  
On power up, the DACs are reset to CODE 0.  
Each output voltage is given by:  
CODE  
V (DACA|B|C|D|E|F|G|H)  
REF  
(1 RNG bit value)  
O
256  
where CODE is in the range 0 to 255 and the range (RNG) bit is a 0 or 1 within the serial control word.  
Table 1. Ideal Output Transfer  
D7  
0
0
D6  
0
0
D5  
0
0
D4  
0
0
D3  
0
0
D2  
0
0
D1  
0
0
D0  
0
1
OUTPUT VOLTAGE  
GND  
(1/256) × REF (1+RNG)  
0
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
(127/256) × REF (1+RNG)  
(128/256) × REF (1+RNG)  
1
1
1
1
1
1
1
1
(255/256) × REF (1+RNG)  
data interface  
With LOAD high, data is clocked into the DATA terminal on each falling edge of CLK. Once all data bits have  
been clocked in, LOAD is pulsed low to transfer the data from the serial input register to the selected DAC as  
shown in Figure 1. When LDAC is low, the selected DAC output voltage is updated when LOAD goes low. When  
LDAC is high during serial programming, the new value is stored within the device and can be transferred to  
the DAC output at a later time by pulsing LDAC low as shown in Figure 2. Data is entered most significant bit  
(MSB) first. Data transfers using two 8-clock cycle periods are shown in Figures 3 and 4.  
CLK  
t
su(DATA-CLK)  
t
su(LOAD-CLK)  
D2 D1  
su(CLK-LOAD)  
t
v(DATA-CLK)  
DATA  
LOAD  
A2  
A1 A0  
RNG  
D7  
D6  
D5  
D4  
D0  
t
t
w(LOAD)  
DAC Update  
Figure 1. LOAD-Controlled Update (LDAC = Low)  
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLC5628C, TLC5628I  
OCTAL 8-BIT DIGITAL-TO-ANALOG CONVERTERS  
SLAS089E – NOVEMBER 1994 – REVISED APRIL 1997  
data interface (continued)  
CLK  
t
su(DATA-CLK)  
t
v(DATA-CLK)  
DATA  
A2  
A1 A0  
RNG  
D7  
D6  
D5  
D4  
D2  
D1  
D0  
t
su(LOADLDAC)  
LOAD  
LDAC  
t
w(LDAC)  
DAC Update  
Figure 2. LDAC-Controlled Update  
CLK Low  
CLK  
A2  
A1  
A0  
RNG  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
DATA  
LOAD  
LDAC  
Figure 3. Load-Controlled Update Using 8-Bit Serial Word (LDAC = Low)  
CLK Low  
CLK  
A2  
A1  
A0  
RNG  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
DATA  
LOAD  
LDAC  
Figure 4. LDAC-Controlled Update Using 8-Bit Serial Word  
Table 2 lists the A2, A1, and A0 bits and the selection of the updated DACs. The RNG bit controls the DAC output  
range. When RNG = low, the output range is between the applied reference voltage and GND, and when  
RNG = high, the range is between twice the applied reference voltage and GND.  
Table 2. Serial Input Decode  
A2  
0
A1  
0
A0  
0
DAC UPDATED  
DACA  
0
0
1
DACB  
0
1
0
DACC  
0
1
1
DACD  
1
0
0
DACE  
1
0
1
DACF  
1
1
0
DACG  
1
1
1
DACH  
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLC5628C, TLC5628I  
OCTAL 8-BIT DIGITAL-TO-ANALOG CONVERTERS  
SLAS089E – NOVEMBER 1994 – REVISED APRIL 1997  
linearity, offset, and gain error using single-end supplies  
When an amplifier is operated from a single supply, the voltage offset can still be either positive or negative. With  
a positive offset voltage, the output voltage changes on the first code change. With a negative offset the output  
voltage may not change with the first code depending on the magnitude of the offset voltage.  
The output amplifier, therefore, attempts to drive the output to a negative voltage. However, because the most  
negative supply rail is ground, the output cannot drive below ground.  
The output voltage remains at 0 V until the input code value produces a sufficient output voltage to overcome  
the inherent negative offset voltage, resulting in the transfer function shown in Figure 5.  
Output  
Voltage  
0 V  
DAC Code  
Negative  
Offset  
Figure 5. Effect of Negative Offset (Single Supply)  
This offset error, not the linearity error, produces the breakpoint. The transfer function would have followed the  
dotted line if the output buffer could drive below ground.  
For a DAC, linearity is measured between the zero-input code (all inputs are 0) and the full-scale code (all inputs  
are 1) after offset and full scale are adjusted out or accounted for in some way. However, single-supply operation  
does not allow for adjustment when the offset is negative due to the breakpoint in the transfer function. So the  
linearity in the unipolar mode is measured between full-scale code and the lowest code that produces a positive  
output voltage.  
The code is calculated from the maximum specification for the negative offset voltage.  
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLC5628C, TLC5628I  
OCTAL 8-BIT DIGITAL-TO-ANALOG CONVERTERS  
SLAS089E – NOVEMBER 1994 – REVISED APRIL 1997  
equivalent of inputs and outputs  
INPUT CIRCUIT  
OUTPUT CIRCUIT  
V
DD  
V
DD  
_
+
Input from  
Decoded DAC  
Register String  
DAC  
Voltage Output  
V
ref  
Input  
× 1  
84 k  
Output  
Range  
Select  
To DAC  
Resistor  
String  
I
× 2  
SINK  
60 µA  
Typical  
84 kΩ  
GND  
GND  
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)  
Supply voltage (V  
Digital input voltage range, V  
Reference input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . GND – 0.3 V to V  
Operating free-air temperature range, T : TLC5628C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C  
– GND) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V  
DD  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . GND – 0.3 V to V  
+ 0.3 V  
+ 0.3 V  
ID  
DD  
DD  
A
TLC5628I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40°C to 85°C  
Storage temperature range, T  
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50°C to 150°C  
stg  
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
recommended operating conditions  
MIN  
NOM  
MAX  
UNIT  
V
Supply voltage, V  
DD  
4.75  
5.25  
High-level voltage, V  
IH  
0.8 V  
V
DD  
Low-level voltage, V  
0.8  
V
IL  
Reference voltage, V [A|B|C|D|E|F|G|H]  
V
DD  
1.5  
V
ref  
Analog full-scale output voltage, R = 10 kΩ  
3.5  
V
L
Load resistance, R  
10  
kΩ  
ns  
L
Setup time, data input, t  
(see Figures 1 and 2)  
50  
50  
su(DATA-CLK)  
Valid time, data input valid after CLK, t  
(see Figures 1 and 2)  
ns  
ns  
ns  
ns  
ns  
ns  
v(DATA-CLK)  
Setup time, CLK eleventh falling edge to LOAD, t  
(see Figure 1)  
50  
su(CLK-LOAD)  
(see Figure 1)  
Setup time, LOADto CLK, t  
50  
su(LOAD-CLK)  
Pulse duration, LOAD, t  
Pulse duration, LDAC, t  
(see Figure 1)  
(see Figure 2)  
250  
250  
0
w(LOAD)  
w(LDAC)  
Setup time, LOADto LDAC, t  
(see Figure 2)  
su(LOAD-LDAC)  
CLK frequency  
1
70  
85  
MHz  
°C  
TLC5628C  
TLC5628I  
0
Operating free-air temperature, T  
A
40  
°C  
6
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLC5628C, TLC5628I  
OCTAL 8-BIT DIGITAL-TO-ANALOG CONVERTERS  
SLAS089E – NOVEMBER 1994 – REVISED APRIL 1997  
electrical characteristics over recommended operating free-air temperature range, V = 5 V ± 5%,  
DD  
V
= 2 V, × 1 gain output range (unless otherwise noted)  
ref  
PARAMETER  
High-level input current  
Low-level input current  
Output sink current  
TEST CONDITIONS  
MIN  
TYP  
MAX  
±10  
±10  
UNIT  
µA  
I
I
I
I
V = V  
I DD  
IH  
V = 0 V  
I
µA  
IL  
20  
2
µA  
O(sink)  
O(source)  
Each DAC output  
Output source current  
mA  
Input capacitance  
15  
15  
C
pF  
i
Reference input capacitance  
Supply current  
I
I
V
V
= 5 V  
= 5 V,  
= 2 V,  
= 2 V,  
= 2 V,  
= 2 V,  
= 2 V,  
= 2 V,  
4
±10  
±1  
mA  
µA  
DD  
DD  
Reference input current  
Linearity error (end point corrected)  
Differential-linearity error  
Zero-scale error  
V
= 2 V  
ref  
DD  
ref  
E
E
E
V
ref  
× 2 gain (see Note 1)  
× 2 gain (see Note 2)  
× 2 gain (see Note 3)  
× 2 gain (see Note 4)  
× 2 gain (see Note 5)  
× 2 gain (see Note 6)  
LSB  
LSB  
mV  
L
V
ref  
±0.9  
30  
D
V
ref  
0
ZS  
Zero-scale-error temperature coefficient  
Full-scale error  
V
ref  
10  
µV/°C  
mV  
E
FS  
V
ref  
±60  
Full-scale-error temperature coefficient  
Power supply rejection ratio  
V
ref  
±25  
µV/°C  
mV/V  
PSRR  
See Notes 7 and 8  
0.5  
NOTES: 1. Integral nonlinearity (INL) is the maximum deviation of the output from the line between zero and full scale (excluding the effects  
of zero code and full-scale errors).  
2. Differentialnonlinearity (DNL) is the difference between the measured and ideal 1 LSB amplitude change of any two adjacent codes.  
Monotonic means the output voltage changes in the same direction (or remains constant) as a change in the digital input code.  
3. Zero-scale error is the deviation from zero voltage output when the digital input code is zero.  
6
4. Zero-scale-error temperature coefficient is given by: ZSETC = [ZSE(T  
) – ZSE(T  
)]/V × 10 /(T  
– T  
).  
max  
min ref max  
min  
5. Full-scale error is the deviation from the ideal full-scale output (V – 1 LSB) with an output load of 10 k.  
ref  
6
6. Full-scale error temperature coefficient is given by: FSETC = [FSE(T  
max  
) – FSE (T  
)]/V × 10 /(T  
– T  
).  
min  
min  
ref max  
7. Zero-scale-error rejection ratio (ZSE RR) is measured by varying the V  
this signal imposed on the zero-code output voltage.  
from 4.5 V to 5.5 V dc and measuring the proportion of  
DD  
8. Full-scale-error rejection ratio (FSE RR) is measured by varying the V  
this signal imposed on the full-scale output voltage.  
from 4.5 V to 5.5 V dc and measuring the proportion of  
DD  
operating characteristics over recommended operating free-air temperature range, V = 5 V ± 5%,  
DD  
V
= 2 V, × 1 gain output range (unless otherwise noted)  
ref  
TEST CONDITIONS  
MIN  
TYP  
1
MAX  
UNIT  
V/µs  
µs  
Output slew rate  
C
= 100 pF,  
R
C
= 10 kΩ  
L
L
L
Output settling time  
To ±0.5 LSB,  
= 100 pF,  
R
= 10 k, See Note 9  
10  
L
Large signal bandwidth  
Digital crosstalk  
Measured at 3 dB point  
100  
50  
60  
60  
100  
kHz  
dB  
CLK = 1-MHz square wave measured at DACA-DACD  
Reference feedthrough  
Channel-to-channel isolation  
Reference input bandwidth  
See Note 10  
See Note 11  
See Note 12  
dB  
dB  
kHz  
NOTES: 9. Settling time is the time between a LOAD falling edge and the DAC output reaching full-scale voltage within ±0.5 LSB starting from  
an initial output voltage equal to zero.  
10. Reference feedthrough is measured at any DAC output with an input code = 00 hex with a V input = 1 V dc + 1 V at 10 kHz.  
ref pp  
11. Channel-to-channel isolation is measured by setting the input code of one DAC to FF hex and the code of all other DACs to 00 hex  
with V input = 1 V dc + 1 V at 10 kHz.  
ref pp  
12. Reference bandwidth is the –3 dB bandwidth with an input at V = 1.25 V dc + 2 V and with a full-scale digital input code.  
ref  
pp  
7
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLC5628C, TLC5628I  
OCTAL 8-BIT DIGITAL-TO-ANALOG CONVERTERS  
SLAS089E – NOVEMBER 1994 – REVISED APRIL 1997  
PARAMETER MEASUREMENT INFORMATION  
TLC5628  
DACA  
DACB  
10 kΩ  
C
= 100 pF  
L
DACH  
Figure 6. Slew, Settling Time, and Linearity Measurements  
TYPICAL CHARACTERISTICS  
POSITIVE RISE AND SETTLING TIME  
NEGATIVE FALL AND SETTLING TIME  
LDAC  
LDAC  
6
4
2
6
4
2
V
T
= 5 V  
DD  
= 25°C  
V
= 5 V  
DD  
= 25°C  
A
T
A
Code FF to 00 Hex  
Code 00 to FF Hex  
Range = ×2  
Range = ×2  
V
= 2 V  
ref  
V
ref  
= 2 V  
0
0
0
2
4
6
8
10 12  
14  
16  
18  
0
2
4
6
8
10 12  
14  
16  
18  
t – Time – µs  
t – Time – µs  
Figure 7  
Figure 8  
8
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLC5628C, TLC5628I  
OCTAL 8-BIT DIGITAL-TO-ANALOG CONVERTERS  
SLAS089E – NOVEMBER 1994 – REVISED APRIL 1997  
TYPICAL CHARACTERISTICS  
DAC OUTPUT VOLTAGE  
vs  
DAC OUTPUT VOLTAGE  
vs  
OUTPUT LOAD  
OUTPUT LOAD  
4
3.5  
3
5
4.8  
4.6  
4.4  
4.2  
4
2.5  
2
3.8  
3.6  
1.5  
1
V
V
= 5 V,  
= 2.5 V,  
DD  
ref  
V
= 5 V,  
= 3.5 V,  
3.4  
3.2  
3
DD  
Range = 2x  
V
ref  
0.5  
0
Range = 1x  
0
10 20 30 40 50 60 70 80 90 100  
0
10 20 30 40 50 60 70 80 90 100  
R
– Output Load – kΩ  
R
– Output Load – kΩ  
L
L
Figure 9  
Figure 10  
SUPPLY CURRENT  
vs  
TEMPERATURE  
OUTPUT SOURCE CURRENT  
vs  
OUTPUT VOLTAGE  
1.2  
1.15  
1.1  
8
7
6
5
4
3
2
V
= 5 V  
DD  
= 25°C  
T
A
V
ref  
= 2 V  
Range = ×2  
Input Code = 255  
V
= 5 V  
= 2V  
DD  
V
ref  
Range = ×2  
Input Code = 255  
1.05  
1
0.95  
0.9  
0.85  
0.8  
1
0
50  
0
50  
100  
0
1
2
3
4
5
t – Temperature – °C  
V
O
– Output Voltage – V  
Figure 11  
Figure 12  
9
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLC5628C, TLC5628I  
OCTAL 8-BIT DIGITAL-TO-ANALOG CONVERTERS  
SLAS089E – NOVEMBER 1994 – REVISED APRIL 1997  
TYPICAL CHARACTERISTICS  
RELATIVE GAIN  
vs  
FREQUENCY  
RELATIVE GAIN  
vs  
FREQUENCY  
10  
0
0
–2  
–4  
10  
–6  
–8  
20  
30  
40  
10  
12  
14  
16  
V
= 5 V  
DD  
= 25°C  
T
A
V
= 2 Vdc + 0.5 V  
ref  
Input Code = 255  
pp  
V
= 5 V  
DD  
= 25°C  
T
A
50  
60  
V
ref  
= 1.25 Vdc + 2 V  
pp  
18  
20  
Input Code = 255  
1
10  
100  
1000  
10000  
1
10  
100  
1000  
f – Frequency – kHz  
f – Frequency – kHz  
Figure 13  
Figure 14  
APPLICATION INFORMATION  
_
+
TLC5628  
V
O
DACA  
DACB  
R
DACH  
NOTE A: Resistor R  
10 kΩ  
Figure 15. Output Buffering Scheme  
10  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLC5628C, TLC5628I  
OCTAL 8-BIT DIGITAL-TO-ANALOG CONVERTERS  
SLAS089E – NOVEMBER 1994 – REVISED APRIL 1997  
MECHANICAL DATA  
DW (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE PACKAGE  
16 PIN SHOWN  
PINS **  
0.050 (1,27)  
16  
20  
24  
28  
DIM  
0.020 (0,51)  
0.014 (0,35)  
0.010 (0,25)  
M
0.410  
0.510  
0.610  
0.710  
A MAX  
(10,41) (12,95) (15,49) (18,03)  
16  
9
0.400  
0.500  
0.600  
0.700  
A MIN  
(10,16) (12,70) (15,24) (17,78)  
0.419 (10,65)  
0.400 (10,15)  
0.010 (0,25) NOM  
0.299 (7,59)  
0.293 (7,45)  
Gage Plane  
0.010 (0,25)  
1
8
0°8°  
0.050 (1,27)  
0.016 (0,40)  
A
Seating Plane  
0.004 (0,10)  
0.012 (0,30)  
0.004 (0,10)  
0.104 (2,65) MAX  
4040000/B 03/95  
NOTES: A. All linear dimensions are in inches (millimeters).  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).  
D. Falls within JEDEC MS-013  
11  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLC5628C, TLC5628I  
OCTAL 8-BIT DIGITAL-TO-ANALOG CONVERTERS  
SLAS089E – NOVEMBER 1994 – REVISED APRIL 1997  
MECHANICAL DATA  
N (R-PDIP-T**)  
PLASTIC DUAL-IN-LINE PACKAGE  
16 PIN SHOWN  
PINS **  
14  
16  
18  
20  
DIM  
0.775  
(19,69)  
0.775  
(19,69)  
0.920  
(23.37)  
0.975  
(24,77)  
A MAX  
A
16  
9
0.745  
(18,92)  
0.745  
(18,92)  
0.850  
(21.59)  
0.940  
(23,88)  
A MIN  
0.260 (6,60)  
0.240 (6,10)  
1
8
0.070 (1,78) MAX  
0.020 (0,51) MIN  
0.310 (7,87)  
0.290 (7,37)  
0.035 (0,89) MAX  
0.200 (5,08) MAX  
Seating Plane  
0.125 (3,18) MIN  
0.100 (2,54)  
0°15°  
0.021 (0,53)  
0.015 (0,38)  
0.010 (0,25)  
M
0.010 (0,25) NOM  
14/18 PIN ONLY  
4040049/C 08/95  
NOTES: A. All linear dimensions are in inches (millimeters).  
B. This drawing is subject to change without notice.  
C. Falls within JEDEC MS-001 (20-pin package is shorter than MS-001)  
12  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
PACKAGE OPTION ADDENDUM  
www.ti.com  
24-Feb-2006  
PACKAGING INFORMATION  
Orderable Device  
TLC5628CDW  
TLC5628CDWG4  
TLC5628CDWR  
TLC5628CDWRG4  
TLC5628CN  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SOIC  
DW  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOIC  
SOIC  
SOIC  
PDIP  
PDIP  
SOIC  
SOIC  
SOIC  
SOIC  
PDIP  
PDIP  
DW  
DW  
DW  
N
Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
Pb-Free  
(RoHS)  
CU NIPD  
N / A for Pkg Type  
TLC5628CNE4  
TLC5628IDW  
N
Pb-Free  
(RoHS)  
CU NIPD  
N / A for Pkg Type  
DW  
DW  
DW  
DW  
N
Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TLC5628IDWG4  
TLC5628IDWR  
TLC5628IDWRG4  
TLC5628IN  
Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
Pb-Free  
(RoHS)  
CU NIPD  
N / A for Pkg Type  
TLC5628INE4  
N
Pb-Free  
(RoHS)  
CU NIPD  
N / A for Pkg Type  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
24-Feb-2006  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 2  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,  
enhancements, improvements, and other changes to its products and services at any time and to discontinue  
any product or service without notice. Customers should obtain the latest relevant information before placing  
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms  
and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI  
deems necessary to support this warranty. Except where mandated by government requirements, testing of all  
parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for  
their products and applications using TI components. To minimize the risks associated with customer products  
and applications, customers should provide adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,  
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process  
in which TI products or services are used. Information published by TI regarding third-party products or services  
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.  
Use of such information may require a license from a third party under the patents or other intellectual property  
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Resale of TI products or services with statements different from or beyond the parameters stated by TI for that  
product or service voids all express and any implied warranties for the associated TI product or service and  
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Applications  
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Amplifiers  
amplifier.ti.com  
www.ti.com/audio  
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dataconverter.ti.com  
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dsp.ti.com  
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Military  
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www.ti.com/digitalcontrol  
www.ti.com/military  
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Logic  
interface.ti.com  
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Microcontrollers  
power.ti.com  
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Security  
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Copyright 2006, Texas Instruments Incorporated  

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