TLC6C5712-Q1 [TI]
汽车类 12 位恒流 LED 灌流驱动器;型号: | TLC6C5712-Q1 |
厂家: | TEXAS INSTRUMENTS |
描述: | 汽车类 12 位恒流 LED 灌流驱动器 驱动 驱动器 |
文件: | 总69页 (文件大小:2174K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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TLC6C5712-Q1
ZHCSEM2A –AUGUST 2015–REVISED AUGUST 2015
TLC6C5712-Q1 具有 8 位点校正功能的 12 通道全套诊断、恒定灌电流
LED 驱动器
1 特性
3 说明
1
•
适用于汽车电子 应用
在汽车仪表板及其他安全性能至关重要的 LED 驱动器
应用中,为了确保 LED 亮度与色温的一致性,针对多
通道 LED 的性能需求日益提升。系统级安全考量因素
要求检测各种故障情况,因此会加深系统的复杂程度。
•
符合 AEC-Q100 标准
–
–
–
器件温度等级 1:环境运行温度范围为 -40°C
至 125°C
器件人体放电模式 (HBM) 静电放电 (ESD) 分类
等级 H3A
TLC6C5712-Q1 器件是一款 12 通道恒定灌电流 LED
驱动器。凭借 8 位点校正功能和高精度输出电
流,TLC6C5712-Q1 器件成为校正 LED 亮度和色温变
化的理想解决方案。该器件针对每个组件提供高级保护
和诊断功能,可提升系统级稳定性并简化面向安全的设
计。六个具有可编程映射功能的 PWM 输入支持多种
LED 颜色调光配置并提供高调光比率。具有诊断功能
的 16 位串行外设接口 (SPI) 支持以菊花链方式连接多
个器件并简化系统级设计。
器件组件充电模式 (CDM) ESD 分类等级 C4B
•
12 条功率双扩散金属氧化物半导体 (DMOS) 晶体
管输出通道
–
最大恒定电流高达 75mA,可通过外部电阻进行
编程
–
–
最高输出电压高达 7V
最高压降电压:
–
–
50mA 时为 0.75V/通道
75mA 时为 1.2V/通道
器件信息(1)
•
出色的输出恒流精度:
器件型号
封装
封装尺寸(标称值)
–
–
–
通道间的差异:< ±3%(最大值)
器件间的差异:< ±3%(最大值)
每通道 8 位、256 步长线性点校正
TLC6C5712-Q1
HTSSOP (28)
4.40mm x 9.70mm
(1) 要了解所有可用封装,请见数据表末尾的可订购产品附录。
典型应用电路原理图
•
•
支持灵活的外部脉宽调制 (PWM) 调光
3-V to 5.5-V
Supply Voltage
–
–
6 个具有频率监控功能的 PWM 输入
V(SUPPLY)
VCC
通过串行外设接口 (SPI) 实现可编程通道映射
ERR
LATCH
SCK
SENSE
保护和诊断
–
–
相邻引脚短路检测
OUT0
OUT1
在激活和禁用状态下可检测开路负载、短接至地
以及发光二极管 (LED) 短路
SDI
SDO
–
–
–
–
–
–
热预警与热关断
开漏错误报告
VF
TLC6C5712-Q1
LED 弱电源诊断
PWM0
OUT9
参考电阻开路或短路检测与保护
通过 SPI 寄存器锁定实现内容保护
SPI 完整性诊断的强制错误
OUT10
OUT11
PWM5
IREF
R(IREF)
•
小型热有效的 28 引脚散热薄型小外形尺寸
(HTSSOP) 封装 PowerPAD™封装
GND
2 应用范围
•
•
•
•
•
仪表板信号装置指示灯
面板及按钮背光照明
条形图 LED
变速器 PRNDL 档位指示灯
连续转向指示灯
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
English Data Sheet: SLVSCO9
TLC6C5712-Q1
ZHCSEM2A –AUGUST 2015–REVISED AUGUST 2015
www.ti.com.cn
目录
7.3 Feature Description................................................. 12
7.4 Device Functional Modes........................................ 21
7.5 Register Maps......................................................... 22
Application and Implementation ........................ 55
8.1 Application Information............................................ 55
8.2 Typical Applications ................................................ 55
Power Supply Recommendations...................... 58
1
2
3
4
5
6
特性.......................................................................... 1
应用范围................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 5
6.5 Electrical Characteristics........................................... 5
6.6 Timing Requirements................................................ 7
6.7 Switching Characteristics.......................................... 7
6.8 Typical Characteristics.............................................. 9
Detailed Description ............................................ 11
7.1 Overview ................................................................. 11
7.2 Functional Block Diagram ....................................... 11
8
9
10 Layout................................................................... 58
10.1 Layout Guidelines ................................................. 58
10.2 Layout Example .................................................... 59
11 器件和文档支持 ..................................................... 60
11.1 文档支持................................................................ 60
11.2 社区资源................................................................ 60
11.3 商标....................................................................... 60
11.4 静电放电警告......................................................... 60
11.5 Glossary................................................................ 60
12 机械、封装和可订购信息....................................... 60
7
4 修订历史记录
注:之前版本的页码可能与当前版本有所不同。
Changes from Original (December 2014) to Revision A
Page
•
已发布完整版数据表 ............................................................................................................................................................... 1
2
Copyright © 2015, Texas Instruments Incorporated
TLC6C5712-Q1
www.ti.com.cn
ZHCSEM2A –AUGUST 2015–REVISED AUGUST 2015
5 Pin Configuration and Functions
PWP Package
28-Pin HTSSOP PowerPAD Package
Top View
1
28
27
26
25
24
23
22
21
20
19
18
17
16
15
SCK
SDI
GND
VCC
2
3
LATCH
SDO
IREF
4
PGND
SENSE
OUT11
OUT10
OUT9
5
ERR
6
OUT0
OUT1
OUT2
OUT3
OUT4
OUT5
PWM0
PWM1
PWM2
7
Thermal
Pad
8
9
OUT8
10
11
12
13
14
OUT7
OUT6
PWM5
PWM4
PWM3
Pin Functions
PIN
I/O
DESCRIPTION
NAME
ERR
NO.
5
O
—
I
Error output, open-drain output, active-low
Device ground
GND
28
26
3
IREF
Connect an external resistor to GND for setting the full-scale current.
Latch enable
LATCH
OUT0
OUT1
OUT2
OUT3
OUT4
OUT5
OUT6
OUT7
OUT8
OUT9
OUT10
OUT11
PGND
PWM0
PWM1
PWM2
PWM3
PWM4
PWM5
SCK
I
6
O
O
O
O
O
O
O
O
O
O
O
O
—
I
Open-drain output
7
Open-drain output
8
Open-drain output
9
Open-drain output
10
11
18
19
20
21
22
23
25
12
13
14
15
16
17
1
Open-drain output
Open-drain output
Open-drain output
Open-drain output
Open-drain output
Open-drain output
Open-drain output
Open-drain output
Ground for output power
PWM dimming input 0
PWM dimming input 1
PWM dimming input 2
PWM dimming input 3
PWM dimming input 4
PWM dimming input 5
SPI clock
I
I
I
I
I
I
SDI
2
I
Serial-data input
SDO
4
O
I
Serial-data output
SENSE
VCC
24
27
Sense input (LED supply-voltage monitor)
Power supply
I
Copyright © 2015, Texas Instruments Incorporated
3
TLC6C5712-Q1
ZHCSEM2A –AUGUST 2015–REVISED AUGUST 2015
www.ti.com.cn
6 Specifications
6.1 Absolute Maximum Ratings
over operating ambient temperature range. Voltages referenced with respect to GND (unless otherwise noted)(1)(2)
MIN
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–40
MAX
7
UNIT
VCC
Input voltage
IREF, LATCH, PWMx, SCK, SDI
VCC
10
V
SENSE
ERR open-drain output
7
Output voltage
Ground
OUTx power DMOS drain-to-source voltage
10
V
SDO
VCC
0.3
125
150
150
PGND
V
Operating ambient temperature, TA
Operating junction temperature, TJ
Storage temperature range, Tstg
°C
°C
°C
–40
–55
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are measured relative to GND.
6.2 ESD Ratings
VALUE
±2000
±500
UNIT
Human body model (HBM), per AEC Q100-002(1)
Charged device model (CDM), per AEC Q100-011
V
Electrostatic
discharge
V(ESD)
All pins
V
Corner pins (1, 14, 15, and 28)
±750
(1) AEC Q100-002 indicates HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX UNIT
VCC
VI
Supply input voltage
Input voltage
3
0
5.5
5.5
7
V
LATCH, PWMx, SCK, SDI, SDO
ERR, SENSE
V
0
VO
VIL
VIH
TA
TJ
Output voltage
OUTx for x = 0 to 11
0.5
7
V
V
Input logic-low voltage
Input logic-high voltage
Ambient operating temperature
Junction operating temperature
LATCH, PWMx, SCK, SDI
LATCH, PWMx, SCK, SDI
0.28 VCC
0.38 VCC
–40
0.3 VCC
0.4 VCC
0.33 VCC
0.43 VCC
125
V
ºC
ºC
–40
150
4
Copyright © 2015, Texas Instruments Incorporated
TLC6C5712-Q1
www.ti.com.cn
ZHCSEM2A –AUGUST 2015–REVISED AUGUST 2015
6.4 Thermal Information
TLC6C5712-Q1
THERMAL METRIC(1)
PWP (HTSSOP)
UNIT
28 PINS
39
RθJA
Junction-to-ambient thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
RθJC(top)
RθJB
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
19.5
16.1
0.5
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
ψJB
15.9
1.7
RθJC(bot)
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6.5 Electrical Characteristics
TA = 25°C, over recommended operating conditions (unless otherwise specified)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
POWER SUPPLIES (VCC, PGND, GND)
VCC = 5 V, PWM = H, RREF = 20.5 kΩ
VCC = 3.3 V
3
2.5
2.6
2.4
4.5
4
ICC
Supply current
mA
V(POR-rising)
V(POR-falling)
V(POR-hyst)
Power-on reset voltage, rising
Power-on reset voltage, falling
POR threshold hysteresis
Rising threshold
2.7
2.5
0.2
2.8
2.6
V
V
V
Falling threshold
LOGIC INPUTS (PWMx, SDI, LATCH, SCK)
V(HYS)
Ilkg
Input logic hysterisis
Input leakage current
PWM pullup resistance
VCC = 5 V or 3.3 V
VI = VCC
0.1 VCC
150
V
–1
1
µA
kΩ
RPU
105
230
CONTROL OUTPUTS (ERR, IREF, SDO)
V(ERR)
ERR pin open-drain voltage drop
I(ERR) = 4 mA, VCC = 3.3 V–5 V
V(ERR) = 5 V
0.1 VCC
3
V
µA
V
Ilkg(ERR)
V(IREF)
VOH(SDO)
VOL(SDO)
ERR leakage current
IREF voltage
R(IREF) = 20.5 kΩ
I(SDO) = –4 mA
1.204
1.229
1.254
SDO output-high voltage
SDO output-low voltage
0.9 VCC
V
I(SDO) = 4 mA
0.1 VCC
V
OUTPUT STAGE (OUTx)
V(OUTx) = 0.75 V, R(IREF) = 12.2 kΩ,
Dot correction = 255
50
75
I(OUTx,max)
Constant output current
mA
V(OUTx) = 1.2 V, R(IREF) = 8.13 kΩ,
Dot correction = 255
V(OUTx) = 0.75 V, RREF = 12.2 kΩ,
dot correction = 255
I(OUTx,min)
Minimum current-sink capability
Constant output current
0.15
7.5
0.165
10
0.18
14
mA
mA
V(OUTx) = 0.75 V, reference fault detected,
Dot correction = 255
I(OUTx,default)
VCC = 3.3 V, R(IREF) = 12.2 kΩ, dot correction = 255
VCC = 5 V, R(IREF) = 12.2 kΩ, dot correction = 255
VCC = 5 V, R(IREF) = 8.13 kΩ, dot correction = 255
0.75
0.5
V(OUT,min)
Minimum output voltage
V
1.2
VCC = 5 V, R(IREF) = 12.2 kΩ, (50-mA maximum output
current)
–0.6
–0.08
–3%
0.6
0.08
3%
Output-current dot-correction
differential nonlinearity
DNL
mA
VCC = 5 V, R(IREF) = 61 kΩ, (10-mA maximum output
current)
V(OUTx) = 0.75 V, R(IREF) = 12.2 kΩ (50 mA), dot
correction = 255
V(OUTx) = 0.75 V, R(IREF) = 20.5 kΩ (30 mA), dot
correction = 255
–3%
3%
Output current absolute error
percentage
ΔI(OUTx)
V(OUTx) = 0.75 V, R(IREF) = 61 kΩ (10 mA), dot
correction = 255
–7.5%
–3%
7.5%
3%
V(OUTx) = 1.2 V, R(IREF) = 8.13 kΩ (75 mA), dot
correction = 255
Copyright © 2015, Texas Instruments Incorporated
5
TLC6C5712-Q1
ZHCSEM2A –AUGUST 2015–REVISED AUGUST 2015
www.ti.com.cn
Electrical Characteristics (continued)
TA = 25°C, over recommended operating conditions (unless otherwise specified)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Output current dependency on OUTx V(OUTx) = 0.75 V, R(IREF) = 12.2 kΩ (50 mA),
ΔI(OUT_VOUT)
–0.5%
0.5%
voltage
ΔI(OUT_VOUT) = (I(OUT_7V) – I(OUT_1V) / I(IDEAL)) × 100
Ratio of output current to IREF
current, K = I(OUTx) / I(IREF)
K(OUT)
Dot correction = 255
500
mA/mA
[CH_EN_MASKx] = 1, [DIS_OFF_FAULT_DIAG] = 1,
V(OUTx) = 6.7 V, V(SENSE) = 7 V, TA = 125°C
Ilkg(OUTx)
Output leakage current
0.5
10
15
µA
µA
µA
Ilkg(SENSE)
I(IREF_octh)
I(IREF_octh,hyst)
I(IREF_scth)
I(IREF_scth,hyst)
I(OUT_PULLUP)
Leakage current at SENSE pin
VCC = 0, V(SENSE) = 5 V
VCC = 5 V
IREF resistor open-circuit detection
threshold
4.5
IREF resistor open-circuit detection-
threshold hysteresis
VCC = 5 V
2
µA
µA
µA
µA
IREF resistor short-circuit detection
threshold
VCC = 5 V
160
260
IREF resistor short-circuit detection-
threshold hysteresis
VCC = 5 V
20
50
Channel pullup current during
deactivated state
VCC = 5 V, V(OUTx) = 1 V
PROTECTION CIRCUITS
Weak LED supply-detection threshold
voltage
V(WLS)
[WLS_TH] = 0
[WLS_TH] = 0
[WLS_TH] = 1
[WLS_TH] = 1
4.1
2.7
4.2
0.1
4.3
V
V
V
V
V(WLS_hyst)
V(WLS_OPT)
V(WLS_hyst_OPT)
Weak LED supply hysteresis
Weak LED supply detection-threshold
voltage
2.77
0.1
2.85
Weak LED supply hysteresis
Short circuit-to-V(SENSE) detection
threshold, voltage difference between
V(SENSE) and V(OUTx)
V(SC_th)
0.5
0.7
0.1
0.9
0.3
V
V
Short circuit-to-V(SENSE) detection
hysteresis
V(SC_hyst)
V(OC_th)
Open-circuit detection threshold
Open-circuit-detection hysteresis
0.1
0.2
V
V
V(OC_hyst)
0.05
Thermal-shutdown junction
temperature
T(TSD)
T(HYS)
T(PTW)
150
165
15
ºC
ºC
ºC
Thermal shutdown or warning
junction temperature hysteresis
Pre-thermal warning junction-
temperature threshold
125
135
150
6
Copyright © 2015, Texas Instruments Incorporated
TLC6C5712-Q1
www.ti.com.cn
ZHCSEM2A –AUGUST 2015–REVISED AUGUST 2015
6.6 Timing Requirements
MIN
NOM
MAX
UNIT
MHz
ns
f(SCK)
Clock frequency, cascade operation
1
10
tc(SCK)
SCK cycle time
100
380
50
tw(LAH), tw(WLAH)
tw(CKH), tw(WCKH)
tw(CKL), tw(WCKL)
tw(SEW), tw(WDI)
tsu(SEST)
Pulse duration, LATCH
SCK high pulse duration
SCK low pulse duration
SDI high and low pulse duration
SDI setup time prior to SCK rise
SDI hold time after SCK rise
Output rise time (SCK)
Output fall time (SCK)
ns
ns
50
ns
150
75
ns
ns
th(SEHD)
75
ns
tr
50
50
ns
tf
ns
6.7 Switching Characteristics
TA = –40°C to 105°C, VCC = 3 V to 5.5 V
PARAMETER
TEST CONDITIONS
Cascade operation
MIN
TYP
MAX
UNIT
MHz
ns
f(SCK)
Clock frequency
10
3000
1000
3000
td(LAH)
tpd(SOH)
tpd(SOL)
Latch switching delay
SDO propagation delay time (L to H)
SDO propagation delay (H to L)
ns
ns
High to low propagation delay time
(LATCH – OUT)
tpd(LAOL)
750
3000
ns
ns
ns
ns
Low-to-high propagation delay time
(SCK – LATCH)
tpd(CKLAH)
tpd(CKDOH)
tpd(CKDOHL)
200
Low-to-high propagation delay time
(SCK – SDO)
30
30
75
75
High-to-low propagation delay time
(SCK – SDO)
tr(o)
tf(o)
Rise time, outputs (OFF) SDO
Fall time, outputs (ON) SDO
50
50
ns
ns
PWMx falling threshold from 0.4 VCC
to I(OUTx) rising threshold 10% of
I(OUTx,max)
Output delay time from PWMx to
I(OUTx)
td(PWM_ON)
0.09
0.09
0.13
0.13
0.2
0.2
0.3
0.8
0.3
µs
µs
PWMx rising threshold from 0.4 VCC
to I(OUTx) falling threshold 90% of
I(OUTx,max)
td(PWM_OFF) Output delay time PWMx to IOUTx
Default slew rate, rise time from
10% to 90% current, 30-pF loading
capacitance
tr
Output rise time
µs
µs
With slow-slew-rate register option,
rise time from 10% to 90% current,
30-pF loading capacitance
Default slew rate, fall time from 90%
to 10% current, 30-pF loading
capacitance
tf
Output fall time
With slow-slew-rate register option,
fall time from 90% to 10% current,
30-pF loading capacitance
0.8
3
t(DEG)
Output open or short degllitch time
1
2
µs
µs
Reference open or short deglitch
time
t(REF_DEG)
100
Timer length for PWM edge
detection
t(PWM)
PWM edge detection timer
17
20
23
ms
Copyright © 2015, Texas Instruments Incorporated
7
TLC6C5712-Q1
ZHCSEM2A –AUGUST 2015–REVISED AUGUST 2015
www.ti.com.cn
VCC
LATCH
40%
0 V
td(LAH)
V(supply)
OUTPUT
50%
OUT0– OUT11
0.5 V
VCC
SCK
30%
30%
0 V
td(SOH)
td(SOL)
VCC
SDO
50%
50%
0 V
图 1. Input Signal Timing Diagram Showing Absolute Minimal Timing
VCC
LATCH
40%
0 V
td(LAH)
V(supply)
OUTPUT
OUT0– OUT11
50%
0.5 V
VCC
SCK
30%
30%
0 V
td(SOH)
td(SOL)
VCC
SDO
50%
50%
0 V
图 2. Output Signal Delay Time
8
版权 © 2015, Texas Instruments Incorporated
TLC6C5712-Q1
www.ti.com.cn
ZHCSEM2A –AUGUST 2015–REVISED AUGUST 2015
6.8 Typical Characteristics
100.05%
100%
60
50
40
30
20
10
0
Ratio_CH0
Ratio_CH5
Ratio_CH6
Ratio_CH11
99.95%
99.9%
99.85%
99.8%
99.75%
0
1
2
3
4
5
6
0
1
2
3
4
5
6
7
8
V(OUTx) (V)
V(OUTx) (V)
D013
D001
VCC = 3.3 V
R(IREF) = 12.2 kΩ
TA = 25ºC
VCC = 5.5 V
TA = 25ºC
R(IREF) = 12.2 kΩ
Dot correction = 255
Dot correction = 255
图 3. Output Current vs Output Voltage
图 4. Output Current Ratio vs Output Voltage
60
50
40
30
20
10
0
55
50
45
40
35
30
25
20
15
10
5
CH0
CH1
CH2
CH3
CH4
CH5
CH6
CH7
CH8
CH9
CH10
CH11
CH0
CH1
CH2
CH3
CH4
CH5
CH6
CH7
CH8
CH9
CH10
CH11
0
20
40
60
80
100
120
0
20
40
60
80
100
120
Reference Current (mA)
Reference Current (mA)
D002
D003
VCC = 5.5 V
TA = 25ºC
Dot correction = 255
VCC = 5.5 V
TA = –40ºC
Dot correction = 255
图 5. Output Current vs Reference Current
图 6. Output Current vs Reference Current
55
50
45
40
35
30
25
20
15
10
5
55
50
45
40
35
30
25
20
15
10
5
CH0
CH1
CH2
CH3
CH4
CH5
CH6
CH7
CH8
CH9
CH10
CH11
-40èC
25èC
125èC
0
20
40
60
80
100
120
0
20
40
60
80
100
120
Reference Current (mA)
Input Reference Current (mA)
D004
D005
VCC = 5.5 V
TA = 125ºC
Dot correction = 255
VCC = 5.5 V
Channel = IOUT5
Dot correction = 255
图 7. Output Current vs Reference Current
图 8. Output Current vs Reference Current
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Typical Characteristics (接下页)
60
50
40
30
20
10
0
1%
51 mA
46 mA
41 mA
36 mA
31 mA
26 mA
21 mA
16 mA
11 mA
5 mA
0.5%
0
-0.5%
-1%
0 mA
-1.5%
-2%
-40èC Current Error to 25èC
125èC Current Error to 25èC
-2.5%
0
10
20
30
40
50
60
0
1
2
3
4
5
6
7
8
9
10
Output Current (mA)
VOUT(V)
D006
D007
VCC = 5.5 V
TA = 25ºC
Dot correction = 255
VCC = 5.5 V
TA = 25ºC
Dot correction = 255
图 9. Output Temperature Error vs Output Current
图 10. Output Current vs Output Voltage
60
50
40
30
20
10
0
60
50
40
30
20
10
0
3 V
5.5 V
0
20
40
60
80
100
120
0
20
40
60
80
100
120
Reference Resistor (kW)
Reference Current (mA)
D008
D009
VCC = 5.5 V
TA = 25ºC
VO = 0.7 V
Dot correction = 255
VO = 0.7 V
TA = 25ºC
Dot correction = 255
图 11. Output Current vs Reference Resistor
图 12. Output Current vs Reference Current
60
50
40
30
20
10
0
60
50
40
30
20
10
0
51.4 mA
30.8 mA
10.5 mA
-40èC
25èC
125èC
0
50
100
150
200
250
0
50
100
150
200
250
Dot Correction - Decimal
Dot Correction - Decimal
D010
D011
VO = 0.7 V
IO = 51.4 mA
VO = 0.7 V
TA = 25ºC
图 13. Output Current vs Dot Correction
图 14. Output Current vs Dot Correction
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7 Detailed Description
7.1 Overview
The TLC6C5712-Q1 device is a 12-channel constant-current-sink LED driver. At the TLC6C5712-Q1 output
stage, 12 regulated current channels provide uniform and constant current for driving LEDs within a wide range
of forward-voltage variations.
Users can adjust output current from 10 mA to 75 mA through an external resistor, R(IREF), which provides
flexibility in controlling the light intensity of the LEDs. The maximum constant-current value (full-scale range) of
all 12 channels is set by a single external resistor. The current of each individual output can be programmed in
256 linear steps, allowing further calibration. The design of the TLC6C5712-Q1 device supports up to 7 V at the
output ports. The serial communication interface is designed for high-throughput data transmission with
cascaded devices. The device has six PWM input channels and 12 output channels that can be mapped
arbitrarily to any of the 6 PWM inputs.
The TLC6C5712-Q1 device has advanced diagnostics, LED open-load detection, shorted-LED detection, short-
circuit to ground detection, reference resistor open and short protection, PWM input-frequency supervision,
adjacent-pin short diagnostics, thermal pre-warning and thermal protection. LED open-and-short and output
short-to-ground detection is available even when an LED channel is off. The diagnostic functions and errors can
be activated or de-activated individually by functions or channels. Users can configure the open-drain error
output to signalize various types of errors.
7.2 Functional Block Diagram
VCC
OUT0
OUT1
OUT10 OUT11
IREF
IO Regulator
VCC
R(PU)
SENSE
PWM0
Output Driver
and
Error Detection
PWM
MUX
VCC
R(PU)
12
12
12
PWM5
LATCH
12-Bit Output
Latch
Configuration
Latches
Open-Drain
Error Output
ERR
SPI
and
Control
Logic
SCK
SDI
12
16-Bit Shift
Register
SDO
GND
PGND
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7.3 Feature Description
7.3.1 Power-On Reset (POR)
The device supports two types of POR, start-up or UVLO POR and software POR, with software reset capability.
7.3.1.1 Start-Up or UVLO POR
When power is applied to VCC, or when VCC is undervoltage (VCC < V(POR)), an internal power-on reset (POR)
holds the TLC6C5712-Q1 device in a reset condition with the following conditions until VCC reaches VPOR.
During RESET:
•
•
•
The device cannot receive data.
The SDO pin is held LOW, so the device cannot transmit data.
The ERR open-drain output is pulled down.
During POR, communication between the controller and the device is lost. Any data transmitted during this
period is lost. The state machine inside the device is undefined. After POR, the reset status is released, the
TLC6C5712-Q1 registers and SPI state machine are re-initialized to default states (see the Default column in 表
2). [POR_ERR_FLAG] is set to HIGH during start-up or UVLO POR.
7.3.1.2 Software POR
A software reset command (<SOFTWARE_POR>) resets all internal register settings to default values. The
command executes on a LATCH rising edge. All fault bits and diagnostic status are cleared and set to their
default values. The <SOFTWARE_POR> command also executes the RESET_STATUS] command. The
[POR_ERR_FLAG] bit in the <READ_STATUS0> register is set to HIGH on a software POR.
7.3.1.3 Reset POR
Either start-up or a UVLO POR or a software POR sets [POR_ERR_FLAG] to HIGH. when the device enters
POR status, the [POR_ERR_FLAG] bit is latched HIGH. To clear the [POR_ERR_FLAG], a RESET_POR
command must be issued.
If [POR_ERR_FLAG] is set either by start-up, UVLO, or software, and the device is not in any UVLO state,
[POR_ERR_FLAG] is latched and does not block any operation.
7.3.1.4 POR Masking
[POR_ERR_FLAG] reporting to the ERR output can be masked by the [POR_MASK] bit. If a POR event happens
when [POR_MASK] is set HIGH, POR events do not trigger the ERR
̅
output, and [POR_ERR_FLAG] is set
HIGH.
POR_MASK
ERR
Start-Up and
UVLO POR
POR_ERROR_FLAG
SOFTWARE_POR
Other Faults
图 15. POR Error Report Topology
See the following addresses in 表 2: 61h, 62h, 63h, and A2h.
7.3.2 Error Feedback
The TLC6C5712-Q1 device supports an active-low open-drain output for error information through the ERR pin
for the MCU error-monitor interrupt. If any FLAG bit is set to HIGH in the <READ_STATUS0> register, and is not
masked by a corresponding mask bit in the <WRITE_ERROR_MASK> register, the ERR pin pulls low to indicate
an ERROR scenario. The MCU should immediately execute the error monitor routine.
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Feature Description (接下页)
7.3.2.1 Recovery From Error
When any fault occurs, all FAULT information can be read in separate FAULT registers, for example,
<READ_OPEN_FAULT0>. When the error condition recovers, the register information is still latched and the
ERR pin remains low until the fault is masked or the RESET_STATUS command has been issued. However, if
the error condition still exists after issuing the RESET_STATUS command, the ERR pin pulls low again and the
corresponding FAULT register is set HIGH.
7.3.2.2 RESET_STATUS Command
The RESET_STATUS command clears all flags in the following registers:
<READ_ADJSHORT0>
<READ_ADJSHORT1>
<READ_SHORT_FAULT0>
<READ_SHORT_FAULT1>
<READ_SHORT_GND_FAULT0>
<READ_SHORT_GND_FAULT1>
<READ_OPEN_FAULT0>
<READ_OPEN_FAULT1>
<READ_PWM_FAULT>
<READ_STATUS0>, excluding the [POR_ERR_FLAG] bit.
As mentioned in the POR section, only the RESET_POR command can clear the [POR_ERR_FLAG] bit.
[POR_ERR_FLAG] bit: Read only (R) bit. HIGH: A POR error has occurred. To reset this flag, issue a
RESET_POR command.
[POR_MASK] bit: Read and write (R/W) bit. HIGH: A POR error is stored in the [POR_ERR_FLAG] bit
and is not reported to ERR.
RESET_POR: A command to reset [POR_ERR_FLAG].
SOFTWARE_POR: A command to generate a POR. It also clears STATUS flags.
See the following addresses in 表 2: 62h, 9Ah through A2h, A8h, and A9h.
7.3.3 PWM Input
The TLC6C5712-Q1 device has six PWM inputs with independently configurable mapping to modulate any of the
12 channels for external PWM dimming. A PWM monitor can be used to supervise PWM input-signal integrity.
7.3.3.1 PWM Dimming
PWM dimming is supported on all 12 channels by six PWM inputs. The input PWMx signal is active-low. Due to
the minimal pulse duration needed for diagnostics, at 200 Hz the minimum achievable duty cycle is 0.1%, or 5 µs
minimal on-time. Similarly, the maximum achievable duty cycle is 99.2%, or 40 µs minimum off-time. The setting
of this boundary allows enough time for diagnostic functions. In the case of 0% or 100% PWM, diagnostics are
not reported.
7.3.3.2 PWM Monitor
Independent rising-edge triggered timers are implemented as PWM monitors for each PWMx input channel.
when the timer length reaches the threshold tPWM, [PWM_FAULTx] is set to HIGH. If the corresponding masking
register [PWM_FAULT_MASKx] is also set HIGH, the fault is stored in [PWM_FAULTx] and is not reported to the
[ANY_PWM_FAULT_FLAG] register. [ANY_PWM_FAULT_FLAG] is set to HIGH and the ERR pin is pulled LOW
if any of the PWM monitors reported a fault and the mask register [PWM_MASK] is disabled. The PWM rising
edge resets the timer and restarts counting from 0. For 0% or 100% PWM, the [PWM_FAULTx] registers should
be independently masked for each PWMx input via the [PWM_FAULT_MASKx] registers.
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Feature Description (接下页)
PWM_FAULT_MASK x
PWM_MASK
ERR
PWM
Monitor x
PWM_FAULT x
ANY_PWM_
FAULT_FLAG
Other PWM Faults
Other Faults
图 16. PWM Fault Report Topology
After being set HIGH, [PWM_FAULTx] FAULT_PWMx is latched even if the corresponding PWM input toggling
has recovered. The RESET_STATUS command must be issued to clear the [ANY_PWM_FAULT_FLAG] bit.
7.3.3.3 PWM Mapping
Each of the 12 output channels has a 3-bit [PWM_MAP_CH] field to assign to one PWMx input. All output
channels are assigned to PWM0 by default. 表 1 lists the mapping for each PWMx input..
表 1. PWMx Mapping
BIT 2
BIT 1
BIT 0
PWMx
PWM0
PWM1
PWM2
PWM3
PWM4
PWM5
PWM0
PWM0
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
7.3.3.4 PWM MAP Register Lock
To avoid unintended modification of the <PWM MAPx> registers, the <PWM MAPx> registers can be locked via
the LOCK_MAP command and unlocked via the UNLOCK_MAP command. For details, see the Register
Protection feature.
See the following addresses in 表 2: 40h through 45h, 60h, 62h, 66h through 68h, 6Ch, A0h through A3h, A6h,
and A7h.
[PWM_MAP_CH] field:
[PWM_FAULT_MASKx] bit:
[PWM_MASK] bit:
R/W. 3 bits. Mapping output channel PWM source to PWMx input.
R/W. Active-high. Mask the PWM fault flag PWMx.
R/W. Active-high. Disable the ANY_PWM_FAULT_FLAG from reporting to
ERR.
[PWM_FAULTx] bit:
R only. Active-high. HIGH: PWM monitor timer has triggered for PWMx.
[ANY_PWM_FAULT_FLAG] bit: R only. Active-high. HIGH: One or more PWMx inputs have triggered the
PWM monitor.
[SLOW_SLEW_RATE] bit:
R/W. Active-high. HIGH: Slow slew rate.
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7.3.4 Constant-Current Output
The TLC6C5712-Q1 device has 12 constant-current output channels. An external resistor, R(IREF), sets the
maximum current of all channels globally. The current of each channel is individually configurable by
independent 8-bit current digital-to-analog converters to support dot-correction capability, also known as
calibration capability. Dot correction can be used to calibrate out brightness differences introduced by LED bin-to-
bin differences or plastic transmittance variation by software instead of manually selecting matching resistors.
7.3.4.1 Global Current Reference
Maximum channel output current (dot-correction register [OUTPUT_DC_CHx] is set at full range, FFh) is globally
set by reference resistor R(IREF). The V(IREF) voltage biases external reference resistor R(IREF), generating
reference current I(IREF). I(IREF) is sensed and amplified by the ratio of K(OUT) as the maximum output current.
Choose the external resistor R(IREF) value using 公式 1, based on maximum current I(OUT,MAX|DC=255
.
V(IREF)
R(IREF)
=
´K(OUT)
I(OUT)max |Dot Correction = 255
(1)
7.3.4.2 Current Reference Monitor and Protection
The TLC6C5712-Q1 device implements a current-reference monitor for current-reference resistor open-and-short
diagnostic and protection. The device monitors the current I(IREF) flowing out of the IREF pin. If I(IREF) is higher
than I(IREF_scth), a reference-short condition is asserted, limiting the I(IREF) output current for short protection. If the
I(IREF) current is smaller than II(IREF_octh), a reference-open condition is asserted.
To maintain output function when the IREF resistor is in a short or open condition, device switches to a fail-safe
current source. In fail-safe mode, the maximum output current is defined as I(OUTx_default). when the external fault
condition is removed, the external resistor sets the I(IREF) current.
V
(IREF)
I(IREF)
=
R(IREF)
(2)
To avoid switching into default current unintentionally, the device implements a digital deglitch filter on the
reference open and short diagnostics. The filter length is defined as t(REF_deg). On assertion of the reference
open-or-short fault, the [REF_FAULT_FLAG] bit is set. The [REF_MASK] bit can be used to mask the reference
fault output to the ERR pin. If [REF_MASK] is enabled, a reference fault is not reported to the ERR output. If
[REF_MASK] is enabled, a reference fault is not reported to the ERR output. Clearing the [REF_FAULT_FLAG]
bit requires issuing the RESET_STATUS command.
REF_MASK
ERR
IREF Short
REF_FAULT_FLAG
IREF Open
Other Faults
图 17. Reference Fault Report Topology
7.3.4.3 Channel Activation Control
[CH_ON_MASKx] are the channel activation mask bits which control each channel output ACTIVATED-
DEACTIVATED. Logic LOW stands for channel ACTIVATED status.
DEACTIVTING a channel output does not clear the diagnostics registers.
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7.3.4.4 Individual Dot Correction Control
Each channel has an internal 8-bit linear-current digital-to-analog converter for individual dot correction control.
The 8-bit [OUTPUT_DC_CHx] fields are used to control DAC output current according to 公式 3. Note that the
minimum current is 1 / 256 of IOUT,MAX. If absolutely zero current is required in some scenarios, the channel can
be disabled by setting the corresponding channel-enable [CH_ON_MASKx] bit HIGH.
Dot Correction +1
I(OUT) = I(OUT)max ´
256
(3)
7.3.4.5 Output Slew-Rate Adjustment
To accommodate different slew rate requirements for EMC optimization, the [SLOW_SLEW_RATE] bit is
provided. Setting [SLOW_SLEW_RATE] HIGH makes both the rising and falling times, tr and tf, longer.
7.3.4.6 Register Lock
To avoid unintended modification of registers, the [OUTPUT_DC_CHx] fields can be locked with the
LOCK_CORR command and unlocked with the UNLOCK_CORR command. The [CH_ON_MASKx] bits can be
locked with the LOCK_MASK command and unlocked with the UNLOCK_MASK command. For details, see the
Register Protection section.
7.3.4.7 Deactivated-Channel Internal Pullup
To avoid floating outputs on a deactivated channel, optional pullup current to the SENSE node I(OUT_PULLUP) is
provided. The pullup current is disabled by default and can be enabled by setting the [DIS_PULL_UP_CHx] bit
HIGH.
See the following addresses in 表 2: 46h through 43h, 69h, 6Ah, 6Dh, 6Eh, and 86h through 93h.
[OUTPUT_DC_CHx] field: R/W. 8-bit. Dot correction current DAC setting register for channel x.
[CH_ON_MASKx]:
R/W. HIGH: Channel output disabled; LOW: Channel output enabled
7.3.5 Advanced Diagnostics
The TLC6C5712-Q1 device supports a variety of diagnostic features, including:
•
•
•
•
•
•
•
•
•
Pre-thermal warning and thermal shutdown protection
LED short-to-supply detection
LED short-to-GND detection
LED open-load detection
Deactivated-channel LED-open or -short detection
Weak-LED-supply detection
Adjacent-pin short detection
Reference resistor open or short detection and protection
PWM frequency monitor
7.3.5.1 Pre-Thermal Warning and Thermal Shutdown Protection
When the junction temperature exceeds the pre-thermal-warning threshold T(PTW), [PRE_TSD_FLAG] in the
<READ_STATUS0> register is set HIGH to signal the pre-thermal warning. The ERR̅ open-drain output is also
pulled down. The microcontroller should respond to the fault warning and take actions to prevent junction
temperature rising.
If junction temperature continues to rise and exceeds thermal-shutdown threshold T(TSD), the overtemperature
fault bit [TSD_FLAG] in the <READ_STATUS0> register is set HIGH to signal thermal shutdown, the ERR open-
drain output is also pulled down, and all output channels are turned off for protection.
[PRE_TSD_FLAG] and [TSD_FLAG] are latched when triggered. To clear either of the flags, issue the
RESET_STATUS command.
[TSD_FLAG] is latched after having been set. After the die temperature falls below T(TSD) – T(HYS), the LED
outputs are activated using the previous settings without re-initializing.
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The flag bits can be individually masked by [PRE_TSD_MASK] and [TSD_MASK]. [PRE_TSD_MASK] prevents
the ERR open-drain output. [TSD_MASK] prevents the ERR open-drain output and thermal shutdown of all
channels. Even if the faults are masked, the fault status can still be read in the registers.
̅
̅
PRE_TSD_MASK
PRE_TSD_FLAG
TSD_FLAG
ERR
Pre-Thermal
Detector
Thermal Shutdown
Detector
Other Faults
Thermal
Shutdown
TSD_MASK
图 18. Thermal Fault Report Topology
7.3.5.2 LED Short-to-Supply Detection
The device has independent LED short-to-supply detection for each channel. Whether the channel PWM source
is HIGH or LOW, the voltage difference between the SENSE and OUTx pins is monitored.
If an LED short to the supply is detected, the [SHORT_FAULT_CHx] bit of the channel is set HIGH and the
[ANY_SHORT_FLAG] bit is set HIGH The [ANY_SHORT_FLAG] also pulls down the ERR̅ open-drain output.
The LED short-to-supply fault does not disable the corresponding channel output. when the fault condition is
removed, the LED should resume normal operation. Fault conditions are latched in the [SHORT_FAULT_CHx]
bits. To clear the [SHORT_FAULT_CHx] bits, issue the RESET_STATUS command.
The [SHORT_FAULT_CHx] bits can be masked independently for each channel by the [SHORT_MASK_CHx]
bits. when the [SHORT_MASK_CHx] bit of any channel is set HIGH, the short-to-supply fault on the specific
channel is not reported to [ANY_SHORT_FLAG].
7.3.5.3 LED Short-to-GND Detection
The TLC6C5712-Q1 device is able to distinguish an LED short-to-GND condition from an LED open-detection
condition by having an internal pullup current to the SENSE node. The pullup is enabled during the PWM OFF
state or channel-deactivated state.
If an LED short-to-GND is detected, the [SG_FAULT_CHx] bit for the channel is set HIGH, and the
[ANY_SHORT_FLAG] bit is also set HIGH. [ANY_SHORT_FLAG] also pulls down the ERR̅ open-drain output.
An LED short-to-GND fault does not disable the corresponding channel output. when a fault condition is
removed, the LED should resume normal operation. Fault conditions are latched in the [SG_FAULT_CHx] fault
bits. Issue a RESET_STATUS command to clear the [SG_FAULT_CHx] fault bits.
The [SG_FAULT_CHx] channel-fault bits can be masked independently by [SG_MASK_CHx]. when the
[SG_MASK_CHx] bit of any channel is set HIGH, the short-to-GND fault on the specific channel is not reported to
[ANY_SHORT_FLAG].
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SG_MASK_CHx
SG_FAULT_CHx
SHORT_MASK
ERR
ANY_SHORT_FLAG
SHORT_FAULT_CHx
SHORT_MASK_CHx
Other Faults
图 19. Short Fault Report Topology
7.3.5.4 LED Open-Load Detection
The device has independent LED open-load detection for each channel. If an LED open-load condition is
detected, the [OPEN_FAULT_CHx] bit for the channel is set HIGH, and the [ANY_OPEN_FLAG] bit also is set
HIGH. [ANY_OPEN_FLAG] also pulls down the ERR open-drain output.
An LED open-load fault does not disable the corresponding channel output. when a fault condition is removed,
the LED should resume normal operation. Fault conditions are latched in the [OPEN_FAULT_CHx] fault bits.
Issue a RESET_STATUS command to clear the [OPEN_FAULT_CHx] fault bits.
The [OPEN_FAULT_CHx] channel-fault bits can be masked independently by the [OPEN_MASK_CHx] bits.
when the [OPEN_MASK_CHx] bit of any channel is set HIGH, the open-load fault on the specific channel is not
reported to the [ANY_OPEN_FLAG] bit.
[ANY_OPEN_FLAG] is the indicator for open-load detectors. [ANY_OPEN_FLAG] can be masked by
[OPEN_MASK] to avoid pulling down the ERR̅ open-drain output.
OPEN_MASK_CHx
OPEN_FAULT_CHx
OPEN_MASK
ERR
ANY_OPEN_FLAG
Other Channels
Other Faults
图 20. Open Fault Report Topology
7.3.5.5 Deactivated-Channel LED Open or Short Detection
Deactivating a channel by setting [CH_ON_MASKx] automatically enables detection of an off-state LED open
load, short to the supply, or short to GND. If a fault is detected when the pullup is enabled, the respective fault
register is set and the ERR̅ open-drain output is pulled down.
To clear the fault, issue the RESET_STATUS command, the same as for activated-state diagnostics. The fault-
masking mechanism is also the same as for activated-state diagnostics.
If an application allows absolutely no current during the channel disabled state, disable the off-state LED open-
or-short detection feature using the [DIS_OFF_FAULT_DIAG] bit.
There is a provision for pulling each channel up to SENSE to avoid a floating node during off-state. This function
can be enabled by setting the [DIS_PULL_UP_CHx] bit to HIGH. If any [DIS_PULL_UP_CHx] bit is set HIGH, the
[DIS_PULL_UP_FLAG] bit is also set HIGH.
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7.3.5.6 Weak LED Supply (WLS) Detection
The TLC6C5712-Q1 device provides weak-LED-supply detection to avoid reporting false faults due to supply
failure. Implementation of weak-LED-supply detection is by monitoring the V(SENSE) voltage using the internal
threshold voltage V(WLS) as a reference.
The default threshold V(WLS) is set for a 5-V supply. If a 3.3-V LED supply is needed, the threshold voltage can
be tuned to V(WLS_OPT) by setting the [WLS_TH] bit HIGH.
when a fault is detected, the [WLS_FAULT_FLAG] bit is set if the [WLS_MASK] masking bit is not active. The
[WLS_FAULT_FLAG] bit remains latched even if the voltage recovers. To clear the fault, issue the
RESET_STATUS command.
WLS_MASK
ERR
WLS_FAULT_FLAG
Other Faults
图 21. Weak-LED-Supply Fault-Report Topology
7.3.5.6.1 Adjacent-Pin Short Detection
On-demand adjacent-pin short detection is provided. This feature requires off-line diagnostics when the outputs
are disabled. Otherwise, interruptions in normal operation and visual brightness glitches may result.
To start adjacent-pin short detection, set the [ADJ_DIAG_START] bit to HIGH. This bit automatically returns to
LOW when the adjacent pin diagnostic procedure is finished.
After [ADJ_DIAG_START] has been set to HIGH and back to LOW, if any two adjacent pins are shorted, the
[ADJ_FLAG_CHx] bit for the faulty channel is set HIGH. The microcontroller can read [ADJ_FLAG_CHx] to
determine which two adjacent pins are shorted.
Deactivating all the channels by using the [CH_ON_MASKx] bits is suggested before starting adjacent-pin
diagnostics.
when the [ADJ_FLAG_CHx] bit is set, it can only be cleared by issuing the RESET_STATUS command.
7.3.5.6.2 Force Error
To validate the ERR pulldown feedback without a real fault, the [FORCE_ERR] bit is provided to enable an ERR
force-down to simulate a faulty scenario. When [FORCE_ERR] is HIGH, the ERR open-drain output is pulled
down. To clear the fault, issue the RESET_STATUS command.
7.3.5.6.3 Reference Resistor Open and Short Detection
See the Constant-Current Output section.
7.3.5.6.4 PWM Monitor
See the PWM Input section.
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7.3.6 Register Protection
To avoid an unintended change of critical registers, register locking and unlocking functions are provided. when
the registers are locked, they cannot be overwritten until an unlock command is issued. When the registers are
locked, they are still available for reading. Critical registers include:
Dot correction register
PWM mapping register
Masking registers
<WRITE_CORRx>, x = 0–11
<WRITE_MAPx>, x = 0–5
<WRITE_CH_ON_MASK0>
<WRITE_CH_ON_MASK1>
<WRITE_SHORT_MASK0>
<WRITE_SHORT_MASK1>
<WRITE_SHORT_GND_MASK0>
<WRITE_SHORT_GND_MASK1>
<WRITE_OPEN_MASK0>
<WRITE_OPEN_MASK1>
<WRITE_PWM_FAULT_MASK>
<WRITE_ERROR_MASK>
Miscellaneous register
<WRITE_MISC_CMD>
7.3.6.1 Dot Correction Register Lock and Unlock
The <WRITE_CORRx> dot correction register can be locked via the LOCK_CORRcommand. When it is locked,
no data in the <WRITE_CORRx> registers can be altered. To unlock, issue the UNLOCK_CORR command.
7.3.6.2 PWM Mapping Register Lock and Unlock
The <WRITE_MAPx> dot correction register can be locked via the LOCK_MAP command. When it is locked, no
data in the <WRITE_MAPx> registers can be altered. To unlock, issue the UNLOCK_MAP command.
7.3.6.3 Masking Register Lock and Unlock
Masking registers can be locked via LOCK_MASK command. When it is locked, no data in the masking registers
listed in the Register Protection section can be altered. To unlock, issue the UNLOCK_MASK command.
7.3.6.4 Miscellaneous Register Lock and Unlock
Miscellaneous registers can be locked via the LOCK_MISC command. When it is locked, no data in the
miscellaneous register listed in the Register Protection section can be altered. To unlock, issue the
UNLOCK_MISC command.
7.3.6.5 Lock Flag Indication
The status of all lock registers is stored in the [LOCK_CORR_FLAG], [LOCK_MASK_FLAG],
[LOCK_MAP_FLAG] and [LOCK_MISC_FLAG] bits of the <READ_STATUS1> register.
7.3.7 Serial Interface – SPI
The serial port is used to write data to, read diagnostic status from and configure settings of the TLC6C5712-Q1
device by transferring the input data to the desired address. During normal operation, an 8-bit serial address and
8-bit serial data are written into the 16-bit shift register. On an SCK rising-edge input, data is sampled. Data is
shifted on a SCK falling edge and the shift registers advance, converting the 16 most-recent inputs to parallel
signals on the LATCH rising edge.
At the rising edge on the LATCH input, a decoder which controls data transfer between shift and storage
registers interprets the addresses. Depending on the address, valid data is conveyed from or to the appropriate
latch or a command is interpreted. On latching a read address, data is read out from a storage register and
shifted out of SDO to the microcontroller or daisy chained TLC6C5712-Q1 device.
20
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Because for each address the TLC6C5712-Q1 device shifts out a fixed amount of data at the end of a write-read
cycle, it is possible to send different address codes to each IC in a daisy chain.
For a number N of daisy-chained devices, a communication cycle comprises 16 × N SCK cycles with the
corresponding data, transferred from shift registers to latches or from latches to shift registers on the rising edge
of LATCH. The falling edge of LATCH indicates the end of a communication cycle.
The TLC6C5712-Q1 device supports multiple devices in cascaded daisy-chain mode. Each communication
sequence must only have one LATCH rising edge, and therefore cannot be split into multiple smaller sequences.
CLK
W1
d15
W1
d14
W1
d13
W1
d12
W1
d2
W1
d1
W1
d0
W2
d15
W2
d14
SDI
LATCH
SDO
D/C
TLADZ
Write,
Read
W1
d14
W1
d13
W1
d12
W1
d11
W0
d0
W1
d15
W1
d0
W2
d15
SHRN (18)
图 22. Write-Access Data for a Typical Use Case
7.3.8 Thermal Information
TLC6C5712-Q1 has internal thermal shutdown (TSD) protection from device overheating. For continuous
operation, the junction temperature should not exceed thermal-shutdown threshold. If TSD is not disabled by
register and junction temperature exceeds thermal shutdown threshold, all outputs are turned off for protection.
When the junction temperature falls below the thermal threshold minus hysteresis, outputs resume.
Use 公式 4 to estimate the device power.
11
V
(IREF)
PD(tot) = VCC ´ ICC
+
V
(
´ I(OUTx) -
)
(OUTx)
å
2
R(IREF)
x=0
where
•
•
•
•
•
PD(tot) = Total power dissipation of the device
V(OUTx) = Voltage drop for channel x
I(OUTx) = Average LED current for channel x
V(IREF) = Reference voltage
R(IREF) = Reference resistor
(4)
7.4 Device Functional Modes
7.4.1 Operation With VCC < 2.8 V (Power-On-Reset Threshold)
The TLC6C5712-Q1 device might not work properly with VCC below 2.8 V. When POR is triggered, the device
latches a POR fault and reports it through the ERR output. If VCC continuous to drop, the content of the registers
could be reset to their default value, with all outputs shutting down by default.
7.4.2 Operation With VCC ≥ 2.8 V (Power-On-Reset Threshold)
The TLC6C5712-Q1 device is fully functional with VCC at or above 2.8 V. The output current depends on the
channel output voltage, V(OUTx). Given enough headroom for output transistors, the device should sink current as
programmed. If the headroom voltage is not enough, the output current could be lower than programmed.
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7.5 Register Maps
表 2. Register Map
Register Name
Addr
40h
41h
42h
43h
44h
45h
46h
47h
48h
49h
4Ah
4Bh
4Ch
4Dh
4Eh
4Fh
50h
51h
52h
53h
54h
55h
56h
57h
58h
59h
D7
D6
D5
D4
D3
D2
D1
D0
Default
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
3Fh
3Fh
WRITE_MAP0
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
PWM_MAP_CH1[2:0]
PWM_MAP_CH3[2:0]
PWM_MAP_CH5[2:0]
PWM_MAP_CH7[2:0]
PWM_MAP_CH9[2:0]
PWM_MAP_CH11[2:0]
PWM_MAP_CH0[2:0]
PWM_MAP_CH2[2:0]
PWM_MAP_CH4[2:0]
PWM_MAP_CH6[2:0]
PWM_MAP_CH8[2:0]
PWM_MAP_CH10[2:0]
WRITE_MAP1
WRITE_MAP2
WRITE_MAP3
WRITE_MAP4
WRITE_MAP5
WRITE_CORR0
OUTPUT_DC_CH0[7:0]
OUTPUT_DC_CH1[7:0]
OUTPUT_DC_CH2[7:0]
OUTPUT_DC_CH3[7:0]
OUTPUT_DC_CH4[7:0]
OUTPUT_DC_CH5[7:0]
OUTPUT_DC_CH6[7:0]
OUTPUT_DC_CH7[7:0]
OUTPUT_DC_CH8[7:0]
OUTPUT_DC_CH9[7:0]
OUTPUT_DC_CH10[7:0]
OUTPUT_DC_CH11[7:0]
CH_ON_MASK3
WRITE_CORR1
WRITE_CORR2
WRITE_CORR3
WRITE_CORR4
WRITE_CORR5
WRITE_CORR6
WRITE_CORR7
WRITE_CORR8
WRITE_CORR9
WRITE_CORR10
WRITE_CORR11
WRITE_CH_ON_MASK0
WRITE_CH_ON_MASK1
WRITE_SHORT_MASK0
WRITE_SHORT_MASK1
WRITE_SHORT_GND_MASK0
WRITE_SHORT_GND_MASK1
WRITE_OPEN_MASK0
WRITE_OPEN_MASK1
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
CH_ON_MASK5
CH_ON_MASK11
SHORT_MASK_CH5
SHORT_MASK_CH11
SG_MASK_CH5
CH_ON_MASK4
CH_ON_MASK2
CH_ON_MASK8
CH_ON_MASK1
CH_ON_MASK7
CH_ON_MASK0
CH_ON_MASK6
CH_ON_MASK10
SHORT_MASK_CH4
SHORT_MASK_CH10
SG_MASK_CH4
CH_ON_MASK9
SHORT_MASK_CH3
SHORT_MASK_CH9
SG_MASK_CH3
SHORT_MASK_CH2
SHORT_MASK_CH8
SG_MASK_CH2
SHORT_MASK_CH1
SHORT_MASK_CH7
SG_MASK_CH1
SHORT_MASK_CH0
SHORT_MASK_CH6
SG_MASK_CH0
3Fh
3Fh
3Fh
3Fh
3Fh
3Fh
SG_MASK_CH11
OPEN_MASK_CH5
OPEN_MASK_CH11
SG_MASK_CH10
SG_MASK_CH9
SG_MASK_CH8
SG_MASK_CH7
SG_MASK_CH6
OPEN_MASK_CH4
OPEN_MASK_CH10
OPEN_MASK_CH3
OPEN_MASK_CH9
OPEN_MASK_CH2
OPEN_MASK_CH8
OPEN_MASK_CH1
OPEN_MASK_CH7
OPEN_MASK_CH0
OPEN_MASK_CH6
5Ah–
5Fh
—
RESERVED
00h
WRITE_PWM_FAULT_MASK
RESET_POR
60h
61h
62h
63h
64h
65h
66h
RESERVED
PWM_FAULT_MASK5
PWM_FAULT_MASK4 PWM_FAULT_MASK3 PWM_FAULT_MASK2
RESET_POR command is issued if data = 69h
PWM_FAULT_MASK1
PWM_FAULT_MASK0
3Fh
00h
00h
00h
00h
00h
00h
RESET_STATUS
RESET_STATUS command is issued if data = 66h
SOFTWARE_POR
SOFTWARE_POR command is issued if data = 99h
WRITE_DIS_PULL_UP_0
WRITE_DIS_PULL_UP_1
WRITE_ERROR_MASK
RESERVED
RESERVED
DIS_PULL_UP_CH5
DIS_PULL_UP_CH11
OPEN_MASK
DIS_PULL_UP_CH4
DIS_PULL_UP_CH10
SHORT_MASK
DIS_PULL_UP_CH3
DIS_PULL_UP_CH9
PWM_MASK
DIS_PULL_UP_CH2
DIS_PULL_UP_CH8
WLS_MASK
DIS_PULL_UP_CH1
DIS_PULL_UP_CH7
PRE_TSD_MASK
DIS_PULL_UP_CH0
DIS_PULL_UP_CH6
TSD_MASK
REF_MASK
POR_MASK
DIS_OFF_FAULT_
DI AG
WRITE_MISC_CMD
67h
RESERVED
ADJ_DIAG_START
SLOW_SLEW_RAT E
FORCE_ERR
WLS_TH
00h
LOCK_MAP
68h
69h
LOCK_MAP command is issued if data = A5h
LOCK_CORR command is issued if data = 55h
00h
00h
LOCK_CORR
22
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ZHCSEM2A –AUGUST 2015–REVISED AUGUST 2015
Register Maps (接下页)
表 2. Register Map (接下页)
Register Name
LOCK_MASK
Addr
6Ah
6Bh
6Ch
6Dh
6Eh
6Fh
D7
D6
D5
D4
D3
D2
D1
D0
Default
00h
LOCK_MASK command is issued if data = AAh
UNLOCK_MISC command is issued if data = 5Ah
UNLOCK_MAP command is issued if data = CCh
UNLOCK_CORR command is issued if data = 33h
UNLOCK_MASK command is issued if data = 3Ch
UNLOCK_MISC command is issued if data = C3h
LOCK_MISC
00h
UNLOCK_MAP
UNLOCK_CORR
UNLOCK_MASK
UNLOCK_MISC
00h
00h
00h
00h
70h–
7Fh
—
RESERVED
00h
READ_MAP0
80h
81h
82h
83h
84h
85h
86h
87h
88h
89h
8Ah
8Bh
8Ch
8Dh
8Eh
8Fh
90h
91h
92h
93h
94h
95h
96h
97h
98h
99h
9Ah
9Bh
9Ch
9Dh
9Eh
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
PWM_MAP_CH1[2:0]
PWM_MAP_CH0[2:0]
PWM_MAP_CH2[2:0]
PWM_MAP_CH4[2:0]
PWM_MAP_CH6[2:0]
PWM_MAP_CH8[2:0]
PWM_MAP_CH10[2:0]
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
3Fh
3Fh
3Fh
3Fh
3Fh
3Fh
3Fh
3Fh
00h
00h
00h
00h
00h
READ_MAP1
PWM_MAP_CH3[2:0]
PWM_MAP_CH5[2:0]
PWM_MAP_CH7[2:0]
PWM_MAP_CH9[2:0]
PWM_MAP_CH11[2:0]
READ_MAP2
READ_MAP3
READ_MAP4
READ_MAP5
READ_CORR0
OUTPUT_DC_CH0[7:0]
READ_CORR1
OUTPUT_DC_CH1[7:0]
OUTPUT_DC_CH2[7:0]
OUTPUT_DC_CH3[7:0]
OUTPUT_DC_CH4[7:0]
OUTPUT_DC_CH5[7:0]
OUTPUT_DC_CH6[7:0]
OUTPUT_DC_CH7[7:0]
OUTPUT_DC_CH8[7:0]
OUTPUT_DC_CH9[7:0]
OUTPUT_DC_CH10[7:0]
OUTPUT_DC_CH11[7:0]
CH_ON_MASK3
READ_CORR2
READ_CORR3
READ_CORR4
READ_CORR5
READ_CORR6
READ_CORR7
READ_CORR8
READ_CORR9
READ_CORR10
READ_CORR11
READ_CH_ON_MASK0
READ_CH_ON_MASK1
READ_SHORT_MASK0
READ_SHORT_MASK1
READ_SHORT_GND_MASK0
READ_SHORT_GND_MASK1
READ_OPEN_MASK0
READ_OPEN_MASK1
READ_SHORT_FAULT0
READ_SHORT_FAULT1
READ_SHORT_GND_FAULT0
READ_SHORT_GND_FAULT1
READ_OPEN_FAULT0
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
CH_ON_MASK5
CH_ON_MASK11
CH_ON_MASK4
CH_ON_MASK2
CH_ON_MASK8
CH_ON_MASK1
CH_ON_MASK7
CH_ON_MASK0
CH_ON_MASK6
CH_ON_MASK10
SHORT_MASK_CH4
SHORT_MASK_CH10
SG_MASK_CH4
CH_ON_MASK9
SHORT_MASK_CH3
SHORT_MASK_CH9
SG_MASK_CH6
SHORT_MASK_CH5
SHORT_MASK_CH11
SG_MASK_CH5
SHORT_MASK_CH2
SHORT_MASK_CH8
SG_MASK_CH5
SHORT_MASK_CH1
SHORT_MASK_CH7
SG_MASK_CH7
SHORT_MASK_CH0
SHORT_MASK_CH6
SG_MASK_CH6
SG_MASK_CH11
SG_MASK_CH10
SG_MASK_CH9
SG_MASK_CH8
SG_MASK_CH7
SG_MASK_CH6
OPEN_MASK_CH5
OPEN_MASK_CH11
SHORT_FAULT_CH5
SHORT_FAULT_CH11
SG_FAULT_CH5
OPEN_MASK_CH4
OPEN_MASK_CH10
SHORT_FAULT_CH4
OPEN_MASK_CH3
OPEN_MASK_CH9
SHORT_FAULT_CH3
OPEN_MASK_CH2
OPEN_MASK_CH8
SHORT_FAULT_CH2
SHORT_FAULT_CH8
SG_FAULT_CH2
OPEN_MASK_CH1
OPEN_MASK_CH7
SHORT_FAULT_CH1
SHORT_FAULT_CH7
SG_FAULT_CH1
OPEN_MASK_CH0
OPEN_MASK_C H6
SHORT_FAULT_CH0
SHORT_FAULT_CH6
SG_FAULT_CH0
SHORT_FAULT_CH10 SHORT_FAULT_CH9
SG_FAULT_CH4
SG_FAULT_CH10
OPEN_FAULT_CH4
SG_FAULT_CH3
SG_FAULT_CH9
OPEN_FAULT_CH3
SG_FAULT_CH11
OPEN_FAULT_CH5
SG_FAULT_CH8
SG_FAULT_CH7
SG_FAULT_CH6
OPEN_FAULT_CH2
OPEN_FAULT_CH1
OPEN_FAULT_CH0
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Register Maps (接下页)
表 2. Register Map (接下页)
Register Name
Addr
9Fh
D7
D6
D5
D4
D3
D2
D1
D0
Default
READ_OPEN_FAULT1
READ_PWM_FAULT_MASK
READ_PWM_FAULT
RESERVED
RESERVED
RESERVED
OPEN_FAULT_CH11
PWM_FAULT_MASK5
FAULT_PWM5
OPEN_FAULT_CH10
OPEN_FAULT_CH9
OPEN_FAULT_CH8
OPEN_FAULT_CH7
PWM_FAULT_MASK1
FAULT_PWM1
OPEN_FAULT_CH6
PWM_FAULT_MASK0
FAULT_PWM0
00h
3Fh
00h
A0h
A1h
PWM_FAULT_MASK4 PWM_FAULT_MASK3 PWM_FAULT_MASK2
FAULT_PWM4
FAULT_PWM3
FAULT_PWM2
REF_FAULT_
FLAG
POR_ERR_
FLAG
ANY_PWM_
FAULT_FLAG
READ_STATUS0
A2h
ANY_OPEN_FLAG
ANY_SHORT_FLAG
WLS_FAULT_FLAG
PRE_TSD_FLAG
TSD_FLAG
40h
READ_STATUS1
A3h
A4h
A5h
A6h
RESERVED
DIS_PULL_UP_FLAG
DIS_PULL_UP_CH4
DIS_PULL_UP_CH10
SHORT_MASK
LOCK_MISC_FLAG
DIS_PULL_UP_CH3
DIS_PULL_UP_CH9
PWM_MASK
LOCK_MAP_FLAG
DIS_PULL_UP_CH2
DIS_PULL_UP_CH8
WLS_MASK
LOCK_MASK_FLAG
DIS_PULL_UP_C H1
DIS_PULL_UP_C H7
PRE_TSD_MASK
LOCK_CORR_FLAG
DIS_PULL_UP_CH0
DIS_PULL_UP_CH6
TSD_MASK
00h
00h
00h
00h
READ_DIS_PULL_UP0
READ_DIS_PULL_UP1
READ_ERROR_MASK
RESERVED
RESERVED
REF_MASK POR_MASK
DIS_PULL_UP_CH5
DIS_PULL_UP_CH11
OPEN_MASK
DIS_OFF_FAULT_
DIAG
READ_MISC_CMD
A7h
RESERVED
ADJ_DIAG_START
SLOW_SLEW_RATE
FORCE_ERR
WLS_TH
00h
READ_ADSHORT0
READ_ADSHORT1
A8h
A9h
RESERVED
RESERVED
AD_FLAG_CH5
AD_FLAG_CH11
AD_FLAG_CH4
AD_FLAG_CH10
AD_FLAG_CH3
AD_FLAG_CH9
AD_FLAG_CH2
AD_FLAG_CH8
AD_FLAG_CH1
AD_FLAG_CH7
AD_FLAG_CH0
AD_FLAG_CH6
00h
00h
24
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ZHCSEM2A –AUGUST 2015–REVISED AUGUST 2015
7.5.1 WRITE_MAP0 Register (address = 40h) [reset = 00h]
图 23. WRITE_MAP0 Register, Address 40h
7
6
5
4
PWM_MAP_CH1[2:0]
R/W
3
2
1
PWM_MAP_CH0[2:0]
R/W
0
RESERVED
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
表 3. WRITE_MAP0 Register Field Descriptions
Bit
7–6
5–3
2–0
Field
Type
R
Reset
0h
Description
RESERVED
PWM_MAP_CH1
PWM_MAP_CH0
R/W
R/W
0h
Select PWM mapping for channel 1
Select PWM mapping for channel 0
0h
7.5.2 WRITE_MAP1 Register (address = 41h) [reset = 00h]
图 24. WRITE_MAP1 Register, Address 41h
7
6
5
4
PWM_MAP_CH3[2:0]
R/W
3
2
1
PWM_MAP_CH2[2:0]
R/W
0
RESERVED
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
表 4. WRITE_MAP1 Register Field Descriptions
Bit
7–6
5–3
2–0
Field
Type
R
Reset
0h
Description
RESERVED
PWM_MAP_CH3
PWM_MAP_CH2
R/W
R/W
0h
Select PWM mapping for channel 3
Select PWM mapping for channel 2
0h
7.5.3 WRITE_MAP2 Register (address = 42h) [reset = 00h]
图 25. WRITE_MAP2 Register, Address 42h
7
6
5
4
PWM_MAP_CH5[2:0]
R/W
3
2
1
PWM_MAP_CH4[2:0]
R/W
0
RESERVED
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
表 5. WRITE_MAP2 Register Field Descriptions
Bit
7–6
5–3
2–0
Field
Type
R
Reset
0h
Description
RESERVED
PWM_MAP_CH5
PWM_MAP_CH4
R/W
R/W
0h
Select PWM mapping for channel 5
Select PWM mapping for channel 4
0h
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25
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www.ti.com.cn
7.5.4 WRITE_MAP3 Register (address = 43h) [reset = 00h]
图 26. WRITE_MAP3 Register, Address 43h
7
6
5
4
PWM_MAP_CH7[2:0]
R/W
3
2
1
PWM_MAP_CH6[2:0]
R/W
0
RESERVED
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
表 6. WRITE_MAP3 Register Field Descriptions
Bit
7–6
5–3
2–0
Field
Type
R
Reset
0h
Description
RESERVED
PWM_MAP_CH7
PWM_MAP_CH6
R/W
R/W
0h
Select PWM mapping for channel 7
Select PWM mapping for channel 6
0h
7.5.5 WRITE_MAP4 Register (address = 44h) [reset = 00h]
图 27. WRITE_MAP4 Register, Address 44h
7
6
5
4
PWM_MAP_CH9[2:0]
R/W
3
2
1
PWM_MAP_CH8[2:0]
R/W
0
RESERVED
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
表 7. WRITE_MAP4 Register Field Descriptions
Bit
7–6
5–3
2–0
Field
Type
R
Reset
0h
Description
RESERVED
PWM_MAP_CH9
PWM_MAP_CH8
R/W
R/W
0h
Select PWM mapping for channel 9
Select PWM mapping for channel 8
0h
7.5.6 WRITE_MAP5 Register (address = 45h) [reset = 00h]
图 28. WRITE_MAP5 Register, Address 45h
7
6
5
4
PWM_MAP_CH11[2:0]
R/W
3
2
1
PWM_MAP_CH10[2:0]
R/W
0
RESERVED
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
表 8. WRITE_MAP5 Register Field Descriptions
Bit
7–6
5–3
2–0
Field
Type
R
Reset
0h
Description
RESERVED
PWM_MAP_CH11
PWM_MAP_CH10
R/W
R/W
0h
Select PWM mapping for channel 11
Select PWM mapping for channel 10
0h
26
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TLC6C5712-Q1
www.ti.com.cn
ZHCSEM2A –AUGUST 2015–REVISED AUGUST 2015
7.5.7 WRITE_CORR0 Register (address = 46h) [reset = 00h]
图 29. WRITE_CORR0 Register, Address 46h
7
6
5
4
3
2
1
0
OUTPUT_DC_CH0[7:0]
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
表 9. WRITE_CORR0 Register Field Descriptions
Bit
Field
Type
Reset
Description
7–0
OUTPUT_DC_CH0
R/W
00h
Dot correction register for channel 0
7.5.8 WRITE_CORR1 Register (address = 47h) [reset = 00h]
图 30. WRITE_CORR1 Register, Address 47h
7
6
5
4
3
2
1
0
OUTPUT_DC_CH1[7:0]
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
表 10. WRITE_CORR1 Register Field Descriptions
Bit
Field
Type
Reset
Description
7–0
OUTPUT_DC_CH1
R/W
00h
Dot correction register for channel 1
7.5.9 WRITE_CORR2 Register (address = 48h) [reset = 00h]
图 31. WRITE_CORR2 Register, Address 48h
7
6
5
4
3
2
1
0
OUTPUT_DC_CH2[7:0]
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
表 11. WRITE_CORR2 Register Field Descriptions
Bit
Field
Type
Reset
Description
7–0
OUTPUT_DC_CH2
R/W
00h
Dot correction register for channel 2
7.5.10 WRITE_CORR3 Register (address = 49h) [reset = 00h]
图 32. WRITE_CORR3 Register, Address 49h
7
6
5
4
3
2
1
0
OUTPUT_DC_CH3[7:0]
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
表 12. WRITE_CORR3 Register Field Descriptions
Bit
Field
Type
Reset
Description
7–0
OUTPUT_DC_CH3
R/W
00h
Dot correction register for channel 3
版权 © 2015, Texas Instruments Incorporated
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TLC6C5712-Q1
ZHCSEM2A –AUGUST 2015–REVISED AUGUST 2015
www.ti.com.cn
7.5.11 WRITE_CORR4 Register (address = 4Ah) [reset = 00h]
图 33. WRITE_CORR4 Register, Address 4Ah
7
6
5
4
3
2
1
0
OUTPUT_DC_CH4[7:0]
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
表 13. WRITE_CORR4 Register Field Descriptions
Bit
Field
Type
Reset
Description
7–0
OUTPUT_DC_CH4
R/W
00h
Dot correction register for channel 4
7.5.12 WRITE_CORR5 Register (address = 4Bh) [reset = 00h]
图 34. WRITE_CORR5 Register, Address 4Bh
7
6
5
4
3
2
1
0
0
0
OUTPUT_DC_CH5[7:0]
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
表 14. WRITE_CORR5 Register Field Descriptions
Bit
Field
Type
Reset
Description
7–0
OUTPUT_DC_CH5
R/W
00h
Dot correction register for channel 5
7.5.13 WRITE_CORR6 Register (address = 4Ch) [reset = 00h]
图 35. WRITE_CORR6 Register, Address 4Ch
7
6
5
4
3
2
1
OUTPUT_DC_CH6[7:0]
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
表 15. WRITE_CORR6 Register Field Descriptions
Bit
Field
Type
Reset
Description
7–0
OUTPUT_DC_CH6
R/W
00h
Dot correction register for channel 6
7.5.14 WRITE_CORR7 Register (address = 4Dh) [reset = 00h]
图 36. WRITE_CORR7 Register, Address 4Dh
7
6
5
4
3
2
1
OUTPUT_DC_CH7[7:0]
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
表 16. WRITE_CORR7 Register Field Descriptions
Bit
Field
Type
Reset
Description
7–0
OUTPUT_DC_CH7
R/W
00h
Dot correction register for channel 7
28
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www.ti.com.cn
ZHCSEM2A –AUGUST 2015–REVISED AUGUST 2015
7.5.15 WRITE_CORR8 Register (address = 4Eh) [reset = 00h]
图 37. WRITE_CORR8 Register, Address 4Eh
7
6
5
4
3
2
1
0
OUTPUT_DC_CH8[7:0]
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
表 17. WRITE_CORR8 Register Field Descriptions
Bit
Field
Type
Reset
Description
7–0
OUTPUT_DC_CH8
R/W
00h
Dot correction register for channel 8
7.5.16 WRITE_CORR9 Register (address = 4Fh) [reset = 00h]
图 38. WRITE_CORR9 Register, Address 4Fh
7
6
5
4
3
2
1
0
OUTPUT_DC_CH9[7:0]
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
表 18. WRITE_CORR9 Register Field Descriptions
Bit
Field
Type
Reset
Description
7–0
OUTPUT_DC_CH9
R/W
00h
Dot correction register for channel 9
7.5.17 WRITE_CORR10 Register (address = 50h) [reset = 00h]
图 39. WRITE_CORR10 Register, Address 50h
7
6
5
4
3
2
1
0
OUTPUT_DC_CH10[7:0]
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
表 19. WRITE_CORR10 Register Field Descriptions
Bit
Field
Type
Reset
Description
7–0
OUTPUT_DC_CH10
R/W
00h
Dot correction register for channel 10
7.5.18 WRITE_CORR11 Register (address = 51h) [reset = 00h]
图 40. WRITE_CORR11 Register, Address 51h
7
6
5
4
3
2
1
0
OUTPUT_DC_CH11[7:0]
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
表 20. WRITE_CORR11 Register Field Descriptions
Bit
Field
Type
Reset
Description
7–0
OUTPUT_DC_CH11
R/W
00h
Dot correction register for channel 11
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ZHCSEM2A –AUGUST 2015–REVISED AUGUST 2015
www.ti.com.cn
7.5.19 WRITE_CH_ON_MASK0 Register (address = 52h) [reset = 3Fh]
图 41. WRITE_CH_ON_MASK0, Address 52h
7
6
5
4
3
2
1
0
RESERVED
R
CH_ON_MASK CH_ON_MASK CH_ON_MASK CH_ON_MASK CH_ON_MASK CH_ON_MASK
5
4
3
2
1
0
R/W
R/W
R/W
R/W
R/W
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
表 21. WRITE_CH_ON_MASK0 Field Descriptions
Bit
7–6
5
Field
Type
R
Reset
0h
Description
RESERVED
CH_ON_MASK5
R/W
1h
Channel-activate mask register for channel 5. Active-low. HIGH:
Channel output deactivated. LOW: Channel output activated
4
3
2
1
0
CH_ON_MASK4
CH_ON_MASK3
CH_ON_MASK2
CH_ON_MASK1
CH_ON_MASK0
R/W
R/W
R/W
R/W
R/W
1h
1h
1h
1h
1h
Channel-activate mask register for channel 4. Active-low. HIGH:
Channel output deactivated. LOW: Channel output activated
Channel-activate mask register for channel 3. Active-low. HIGH:
Channel output deactivated. LOW: Channel output activated
Channel-activate mask register for channel 2. Active-low. HIGH:
Channel output deactivated. LOW: Channel output activated
Channel-activate mask register for channel 1. Active-low. HIGH:
Channel output deactivated. LOW: Channel output activated
Channel-activate mask register for channel 0. Active-low. HIGH:
Channel output deactivated. LOW: Channel output activated
7.5.20 WRITE_CH_ON_MASK1 Register (address = 53h) [reset = 3Fh]
图 42. WRITE_CH_ON_MASK1, Address 53h
7
6
5
4
3
2
1
0
RESERVED
R
CH_ON_MASK CH_ON_MASK CH_ON_MASK CH_ON_MASK CH_ON_MASK CH_ON_MASK
11
10
9
8
7
6
R/W
R/W
R/W
R/W
R/W
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
表 22. WRITE_CH_ON_MASK1 Field Descriptions
Bit
7–6
5
Field
Type
R
Reset
0h
Description
RESERVED
CH_ON_MASK11
R/W
1h
Channel-activate mask register for channel 11. Active-low.
HIGH: Channel output deactivated. LOW: Channel output
activated
4
CH_ON_MASK10
R/W
1h
Channel-activate mask register for channel 10. Active-low.
HIGH: Channel output deactivated. LOW: Channel output
activated
3
2
1
0
CH_ON_MASK9
CH_ON_MASK8
CH_ON_MASK7
CH_ON_MASK6
R/W
R/W
R/W
R/W
1h
1h
1h
1h
Channel-activate mask register for channel 9. Active-low. HIGH:
Channel output deactivated. LOW: Channel output activated
Channel-activate mask register for channel 8. Active-low. HIGH:
Channel output deactivated. LOW: Channel output activated
Channel-activate mask register for channel 7. Active-low. HIGH:
Channel output deactivated. LOW: Channel output activated
Channel-activate mask register for channel 6. Active-low. HIGH:
Channel output deactivated. LOW: Channel output activated
30
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TLC6C5712-Q1
www.ti.com.cn
ZHCSEM2A –AUGUST 2015–REVISED AUGUST 2015
7.5.21 WRITE_SHORT_MASK0 Register (address = 54h) [reset = 3Fh]
图 43. SLVSCO9WRITE_SHORT_MASK0, Address 54h
7
6
5
4
3
2
1
0
RESERVED
R
SHORT_MASK SHORT_MASK SHORT_MASK SHORT_MASK SHORT_MASK SHORT_MASK
_CH5
_CH4
_CH3
_CH2
_CH1
_CH0
R/W
R/W
R/W
R/W
R/W
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
表 23. WRITE_SHORT_MASK0 Field Descriptions
Bit
7–6
5
Field
Type
R
Reset
0h
Description
RESERVED
SHORT_MASK_CH5
R/W
1h
Short-to-supply fault mask register for channel 5. Active-high.
HIGH: Short-to-supply fault masked. LOW: Short-to-supply fault
not masked
4
3
2
1
0
SHORT_MASK_CH4
SHORT_MASK_CH3
SHORT_MASK_CH2
SHORT_MASK_CH1
SHORT_MASK_CH0
R/W
R/W
R/W
R/W
R/W
1h
1h
1h
1h
1h
Short-to-supply fault mask register for channel 4. Active-high.
HIGH: Short-to-supply fault masked. LOW: Short-to-supply fault
not masked
Short-to-supply fault mask register for channel 3. Active-high.
HIGH: Short-to-supply fault masked. LOW: Short-to-supply fault
not masked
Short-to-supply fault mask register for channel 2. Active-high.
HIGH: Short-to-supply fault masked. LOW: Short-to-supply fault
not masked
Short-to-supply fault mask register for channel 1. Active-high.
HIGH: Short-to-supply fault masked. LOW: Short-to-supply fault
not masked
Short-to-supply fault mask register for channel 0. Active-high.
HIGH: Short-to-supply fault masked. LOW: Short-to-supply fault
not masked
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7.5.22 WRITE_SHORT_MASK1 Register (address = 55h) [reset = 3Fh]
图 44. WRITE_SHORT_MASK1, Address 55h
7
6
5
4
3
2
1
0
RESERVED
R
SHORT_MASK SHORT_MASK SHORT_MASK SHORT_MASK SHORT_MASK SHORT_MASK
_CH11
_CH10
_CH9
_CH8
_CH7
_CH6
R/W
R/W
R/W
R/W
R/W
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
表 24. WRITE_SHORT_MASK1 Field Descriptions
Bit
7–6
5
Field
Type
R
Reset
0h
Description
RESERVED
SHORT_MASK_CH11
R/W
1h
Short-to-supply fault mask register for channel 11. Active-high.
HIGH: Short-to-supply fault masked. LOW: Short-to-supply fault
not masked
4
3
2
1
0
SHORT_MASK_CH10
SHORT_MASK_CH9
SHORT_MASK_CH8
SHORT_MASK_CH7
SHORT_MASK_CH6
R/W
R/W
R/W
R/W
R/W
1h
1h
1h
1h
1h
Short-to-supply fault mask register for channel 10. Active-high.
HIGH: Short-to-supply fault masked. LOW: Short-to-supply fault
not masked
Short-to-supply fault mask register for channel 9. Active-high.
HIGH: Short-to-supply fault masked. LOW: Short-to-supply fault
not masked
Short-to-supply fault mask register for channel 8. Active-high.
HIGH: Short-to-supply fault masked. LOW: Short-to-supply fault
not masked
Short-to-supply fault mask register for channel 7. Active-high.
HIGH: Short-to-supply fault masked. LOW: Short-to-supply fault
not masked
Short-to-supply fault mask register for channel 6. Active-high.
HIGH: Short-to-supply fault masked. LOW: Short-to-supply fault
not masked
32
版权 © 2015, Texas Instruments Incorporated
TLC6C5712-Q1
www.ti.com.cn
ZHCSEM2A –AUGUST 2015–REVISED AUGUST 2015
7.5.23 WRITE_SHORT_GND_MASK0 Register (address = 56h) [reset = 3Fh]
图 45. WRITE_SHORT_GND_MASK0, Address 56h
7
6
5
4
3
2
1
0
RESERVED
R
SG_MASK_CH SG_MASK_CH SG_MASK_CH SG_MASK_CH SG_MASK_CH SG_MASK_CH
5
4
3
2
1
0
R/W
R/W
R/W
R/W
R/W
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
表 25. WRITE_SHORT_GND_MASK0 Field Descriptions
Bit
7–6
5
Field
Type
R
Reset
0h
Description
RESERVED
SG_MASK_CH5
R/W
1h
Short-to-GND fault mask register for channel 5. Active-high. HIGH:
Short-to-GND fault masked. LOW: Short-to-GND fault not masked
4
3
2
1
0
SG_MASK_CH4
SG_MASK_CH3
SG_MASK_CH2
SG_MASK_CH1
SG_MASK_CH0
R/W
R/W
R/W
R/W
R/W
1h
1h
1h
1h
1h
Short-to-GND fault mask register for channel 4. Active-high. HIGH:
Short-to-GND fault masked. LOW: Short-to-GND fault not masked
Short-to-GND fault mask register for channel 3. Active-high. HIGH:
Short-to-GND fault masked. LOW: Short-to-GND fault not masked
Short-to-GND fault mask register for channel 2. Active-high. HIGH:
Short-to-GND fault masked. LOW: Short-to-GND fault not masked
Short-to-GND fault mask register for channel 1. Active-high. HIGH:
Short-to-GND fault masked. LOW: Short-to-GND fault not masked
Short-to-GND fault mask register for channel 0. Active-high. HIGH:
Short-to-GND fault masked. LOW: Short-to-GND fault not masked
7.5.24 WRITE_SHORT_GND_MASK1 Register (address = 57h) [reset = 3Fh]
图 46. WRITE_SHORT_GND_MASK1, Address 57h
7
6
5
4
3
2
1
0
RESERVED
R
SG_MASK_CH SG_MASK_CH SG_MASK_CH SG_MASK_CH SG_MASK_CH SG_MASK_CH
11
10
9
8
7
6
R/W
R/W
R/W
R/W
R/W
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
表 26. WRITE_SHORT_GND_MASK1 Field Descriptions
Bit
7–6
5
Field
Type
R
Reset
0h
Description
RESERVED
SG_MASK_CH11
R/W
1h
Short-to-GND fault mask register for channel 11. Active-high. HIGH:
Short-to-GND fault masked. LOW: Short-to-GND fault not masked
4
3
2
1
0
SG_MASK_CH10
SG_MASK_CH9
SG_MASK_CH8
SG_MASK_CH7
SG_MASK_CH6
R/W
R/W
R/W
R/W
R/W
1h
1h
1h
1h
1h
Short-to-GND fault mask register for channel 10. Active-high. HIGH:
Short-to-GND fault masked. LOW: Short-to-GND fault not masked
Short-to-GND fault mask register for channel 9. Active-high. HIGH:
Short-to-GND fault masked. LOW: Short-to-GND fault not masked
Short-to-GND fault mask register for channel 8. Active-high. HIGH:
Short-to-GND fault masked. LOW: Short-to-GND fault not masked
Short-to-GND fault mask register for channel 7. Active-high. HIGH:
Short-to-GND fault masked. LOW: Short-to-GND fault not masked
Short-to-GND fault mask register for channel 6. Active-high. HIGH:
Short-to-GND fault masked. LOW: Short-to-GND fault not masked
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7.5.25 WRITE_OPEN_MASK0 Register (address = 58h) [reset = 3Fh]
图 47. WRITE_OPEN_MASK0, Address 58h
7
6
5
4
3
2
1
0
RESERVED
R
OPEN_MASK_ OPEN_MASK_ OPEN_MASK_ OPEN_MASK_ OPEN_MASK_ OPEN_MASK_
CH5
CH4
CH3
CH2
CH1
CH0
R/W
R/W
R/W
R/W
R/W
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
表 27. WRITE_OPEN_MASK0 Field Descriptions
Bit
7–6
5
Field
Type
R
Reset
0h
Description
RESERVED
OPEN_MASK_CH5
R/W
1h
Open-fault mask register for channel 5. Active-high. HIGH: Open
fault masked. LOW: Open fault not masked
4
3
2
1
0
OPEN_MASK_CH4
OPEN_MASK_CH3
OPEN_MASK_CH2
OPEN_MASK_CH1
OPEN_MASK_CH0
R/W
R/W
R/W
R/W
R/W
1h
1h
1h
1h
1h
Open-fault mask register for channel 4. Active-high. HIGH: Open
fault masked. LOW: Open fault not masked
Open-fault mask register for channel 3. Active-high. HIGH: Open
fault masked. LOW: Open fault not masked
Open-fault mask register for channel 2. Active-high. HIGH: Open
fault masked. LOW: Open fault not masked
Open-fault mask register for channel 1. Active-high. HIGH: Open
fault masked. LOW: Open fault not masked
Open-fault mask register for channel 0. Active-high. HIGH: Open
fault masked. LOW: Open fault not masked
7.5.26 WRITE_OPEN_MASK1 Register (address = 59h) [reset = 3Fh]
图 48. WRITE_OPEN_MASK1, Address 59h
7
6
5
4
3
2
1
0
RESERVED
R
OPEN_MASK_ OPEN_MASK_ OPEN_MASK_ OPEN_MASK_ OPEN_MASK_ OPEN_MASK_
CH11
CH10
CH9
CH8
CH7
CH6
R/W
R/W
R/W
R/W
R/W
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
表 28. WRITE_OPEN_MASK1 Field Descriptions
Bit
7–6
5
Field
Type
R
Reset
0h
Description
RESERVED
OPEN_MASK_CH11
R/W
1h
Open-fault mask register for channel 11. Active-high. HIGH:
Open fault masked. LOW: Open fault not masked
4
3
2
1
0
OPEN_MASK_CH10
OPEN_MASK_CH9
OPEN_MASK_CH8
OPEN_MASK_CH7
OPEN_MASK_CH6
R/W
R/W
R/W
R/W
R/W
1h
1h
1h
1h
1h
Open-fault mask register for channel 10. Active-high. HIGH:
Open fault masked. LOW: Open fault not masked
Open-fault mask register for channel 9. Active-high. HIGH: Open
fault masked. LOW: Open fault not masked
Open-fault mask register for channel 8. Active-high. HIGH: Open
fault masked. LOW: Open fault not masked
Open-fault mask register for channel 7. Active-high. HIGH: Open
fault masked. LOW: Open fault not masked
Open-fault mask register for channel 6. Active-high. HIGH: Open
fault masked. LOW: Open fault not masked
34
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TLC6C5712-Q1
www.ti.com.cn
ZHCSEM2A –AUGUST 2015–REVISED AUGUST 2015
7.5.27 WRITE_PWM_FAULT_MASK Register (address = 60h) [reset = 3Fh]
图 49. WRITE_PWM_FAULT_MASK Register, Address 60h
7
6
5
4
3
2
1
0
RESERVED
R
PWM_FAULT_ PWM_FAULT_ PWM_FAULT_ PWM_FAULT_ PWM_FAULT_ PWM_FAULT_
MASK5
MASK4
MASK3
MASK2
MASK1
MASK0
R/W
R/W
R/W
R/W
R/W
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
表 29. WRITE_PWM_FAULT_MASK Field Descriptions
Bit
7–6
5
Field
Type
R
Reset
0h
Description
RESERVED
PWM_FAULT_MASK5
R/W
1h
PWM-fault mask register for input PWM channel 5. Active-high.
HIGH: PWM fault masked. LOW: PWM fault not masked
4
3
2
1
0
PWM_FAULT_MASK4
PWM_FAULT_MASK3
PWM_FAULT_MASK2
PWM_FAULT_MASK1
PWM_FAULT_MASK0
R/W
R/W
R/W
R/W
R/W
1h
1h
1h
1h
1h
PWM-fault mask register for input PWM channel 4. Active-high.
HIGH: PWM fault masked. LOW: PWM fault not masked
PWM-fault mask register for input PWM channel 3. Active-high.
HIGH: PWM fault masked. LOW: PWM fault not masked
PWM-fault mask register for input PWM channel 2. Active-high.
HIGH: PWM fault masked. LOW: PWM fault not masked
PWM-fault mask register for input PWM channel 1. Active-high.
HIGH: PWM fault masked. LOW: PWM fault not masked
PWM-fault mask register for input PWM channel 0. Active-high.
HIGH: PWM fault masked. LOW: PWM fault not masked
7.5.28 RESET_POR Register (address = 61h) [reset = 00h]
图 50. RESET_POR Register, Address 61h
7
6
5
4
3
2
1
0
RESET_POR
W
LEGEND: R/W = Read/Write; R = Read only; W = Write only; -n = value after reset
表 30. RESET_POR Field Descriptions
Bit
Field
Type
Reset
Description
7–0
RESET_POR
W
00h
A RESET_POR command is issued if the register content = 69h.
The register content is automatically cleared.
7.5.29 RESET_STATUS Register (address = 62h) [reset = 00h]
图 51. RESET_STATUS Register, Address 62h
7
6
5
4
3
2
1
0
RESET_STATUS
W
LEGEND: R/W = Read/Write; R = Read only; W = Write only; -n = value after reset
表 31. RESET_STATUS Field Descriptions
Bit
Field
Type
Reset
Description
7–0
RESET_STATUS
W
00h
A RESET_STATUS command is issued if the register content =
66h. The register content is automatically cleared.
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7.5.30 SOFTWARE_POR Register (address = 63h) [reset = 00h]
图 52. SOFTWARE_POR Register, Address 63h
7
6
5
4
3
2
1
0
SOFTWARE_POR
W
LEGEND: R/W = Read/Write; R = Read only; W = Write only; -n = value after reset
表 32. SOFTWARE_POR Field Descriptions
Bit
Field
Type
Reset
Description
7–0
SOFTWARE_POR
W
00h
A SOFTWARE_POR command is issued if the register content =
99h. The register content is automatically cleared.
7.5.31 WRITE_DIS_PULL_UP_0 Register (address = 64h) [reset = 00h]
图 53. WRITE_DIS_PULL_UP_0 Register, Address 64h
7
6
5
4
3
2
1
0
RESERVED
DIS_PULL_UP DIS_PULL_UP DIS_PULL_UP DIS_PULL_UP DIS_PULL_UP DIS_PULL_UP
_CH5
_CH4
_CH3
_CH2
_CH1
_CH0
R
R/W
R/W
R/W
R/W
R/W
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
表 33. WRITE_DIS_PULL_UP_0 Field Descriptions
Bit
7–6
5
Field
Type
R
Reset
0h
Description
RESERVED
DIS_PULL_UP_CH5
R/W
0h
Disable deactivated-channel internal pullup register for channel
5. Active-high. HIGH: internal pullup disabled; LOW: internal
pullup enabled.
4
3
2
1
0
DIS_PULL_UP_CH4
DIS_PULL_UP_CH3
DIS_PULL_UP_CH2
DIS_PULL_UP_CH1
DIS_PULL_UP_CH0
R/W
R/W
R/W
R/W
R/W
0h
0h
0h
0h
0h
Disable deactivated-channel internal pullup register for channel
4. Active-high. HIGH: internal pullup disabled; LOW: internal
pullup enabled.
Disable deactivated-channel internal pullup register for channel
3. Active-high. HIGH: internal pullup disabled; LOW: internal
pullup enabled.
Disable deactivated-channel internal pullup register for channel
2. Active-high. HIGH: internal pullup disabled; LOW: internal
pullup enabled.
Disable deactivated-channel internal pullup register for channel
1. Active-high. HIGH: internal pullup disabled; LOW: internal
pullup enabled.
Disable deactivated-channel internal pullup register for channel
0. Active-high. HIGH: internal pullup disabled; LOW: internal
pullup enabled.
36
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7.5.32 WRITE_DIS_PULL_UP_1 Register (address = 65h) [reset = 00h]
图 54. WRITE_DIS_PULL_UP_1 Register, Address 65h
7
6
5
4
3
2
1
0
RESERVED
R
DIS_PULL_UP DIS_PULL_UP DIS_PULL_UP DIS_PULL_UP DIS_PULL_UP DIS_PULL_UP
_CH11
_CH10
_CH9
_CH8
_CH7
_CH6
R/W
R/W
R/W
R/W
R/W
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
表 34. WRITE_DIS_PULL_UP_1 Field Descriptions
Bit
7–6
5
Field
Type
R
Reset
0h
Description
RESERVED
DIS_PULL_UP_CH11
R/W
0h
Disable deactivated-channel internal pullup register for channel
11. Active-high. HIGH: internal pullup disabled; LOW: internal
pullup enabled.
4
3
2
1
0
DIS_PULL_UP_CH10
DIS_PULL_UP_CH9
DIS_PULL_UP_CH8
DIS_PULL_UP_CH7
DIS_PULL_UP_CH6
R/W
R/W
R/W
R/W
R/W
0h
0h
0h
0h
0h
Disable deactivated-channel internal pullup register for channel
10. Active-high. HIGH: internal pullup disabled; LOW: internal
pullup enabled.
Disable deactivated-channel internal pullup register for channel
9. Active-high. HIGH: internal pullup disabled; LOW: internal
pullup enabled.
Disable deactivated-channel internal pullup register for channel
8. Active-high. HIGH: internal pullup disabled; LOW: internal
pullup enabled.
Disable deactivated-channel internal pullup register for channel
7. Active-high. HIGH: internal pullup disabled; LOW: internal
pullup enabled.
Disable deactivated-channel internal pullup register for channel
6. Active-high. HIGH: internal pullup disabled; LOW: internal
pullup enabled.
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7.5.33 WRITE_ERROR_MASK Register (address = 66h) [reset = 00h]
图 55. WRITE_ERROR_MASK Register, Address 66h
7
6
5
4
3
2
1
0
REF_MASK
POR_MASK
OPEN_MASK SHORT_MASK
PWM_MASK
WLS_MASK
PRE_TSD_
MASK
TSD_MASK
R/W
R/W
R/W R/W
R/W
R/W
R/W
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
表 35. WRITE_ERROR_MASK Field Descriptions
Bit
Field
Type
Reset
Description
7
REF_MASK
R/W
0h
Reference fault mask bit. Active-high. HIGH: Reference fault is
masked; LOW: Reference fault is not masked.
6
5
4
3
2
1
0
POR_MASK
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0h
0h
0h
0h
0h
0h
0h
Power-on-reset fault mask bit Active-high. HIGH: POR fault is
masked; LOW: POR fault is not masked.
OPEN_MASK
SHORT_MASK
PWM_MASK
WLS_MASK
Open fault mask bit. Active-high. HIGH: Open fault is masked;
LOW: Open fault is not masked.
Short fault mask bit. Active-high. HIGH: Short fault is masked;
LOW: Short fault is not masked.
PWM fault mask bit. Active-high. HIGH: PWM fault is masked;
LOW: PWM fault is not masked.
Weak-LED-supply (WLS) fault mask bit. Active-high. HIGH: WLS
fault is masked; LOW: WLS fault is not masked.
PRE_TSD_MASK
TSD_MASK
Pre-thermal-warning fault mask bit. Active-high. HIGH:
PRE_TSD fault is masked; LOW: PRE_TSD fault is not masked.
Thermal-shutdown fault mask bit. Active-high. HIGH: TSD fault
is masked; LOW: TSD fault is not masked.
7.5.34 WRITE_MISC_CMD Register (address = 67h) [reset = 00h]
图 56. WRITE_MISC_CMD Register, Address 67h
7
6
5
4
3
2
1
0
RESERVED
DIS_OFF_
FAULT_DIAG
ADJ_DIAG_
START
SLOW_SLEW_ FORCE_ERR
RATE
WLS_TH
R
R/W
R/W
R/W
R/W
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
表 36. WRITE_MISC_CMD Field Descriptions
Bit
7–5
4
Field
Type
R
Reset
0h
Description
RESERVED
DIS_OFF_FAULT_DIAG
R/W
0h
Off-state output fault diagnostics control bit. Active-high. HIGH:
Off-state fault diagnostics disabled; LOW: Off-state fault
diagnostics enabled
3
2
ADJ_DIAG_START
SLOW_SLEW_RATE
R/W
R/W
0h
0h
Adjacent-pin diagnostics start control bit. Active-high, returns low
when adjacent-pin diagnostic procedure is concluded.
HIGH: Start adjacent-pin diagnostics or adjacent-pin diagnostics
are ongoing; LOW: Adjacent-pin diagnostics are not running.
Slow slew rate control bit. Active-high. HIGH: Output-current
slew rate is in slow mode. LOW: Output-current slew rate is in
normal mode.
1
0
FORCE_ERR
WLS_TH
R/W
R/W
0h
0h
Force error control bit. Active-high. HIGH: ERR output is forced
low. LOW: ERR output is not forced low.
Weak-LED-supply threshold-control bit. Active-high. HIGH: WLS
threshold is set to 3.3-V mode. LOW: WLS threshold is set to 5-
V mode.
38
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7.5.35 LOCK_MAP Register (address = 68h) [reset = 00h]
图 57. LOCK_MAP Register, Address 68h
7
6
5
4
3
2
1
0
LOCK_MAP
W
LEGEND: R/W = Read/Write; R = Read only; W = Write only; -n = value after reset
表 37. LOCK_MAP Field Descriptions
Bit
Field
Type
Reset
Description
7–0
LOCK_MAP
W
00h
A LOCK_MAP command is issued if the register content = A5h.
The register content is automatically cleared.
7.5.36 LOCK_CORR Register (address = 69h) [reset = 00h]
图 58. LOCK_CORR Register, Address 69h
7
6
5
4
3
2
1
0
LOCK_CORR
W
LEGEND: R/W = Read/Write; R = Read only; W = Write only; -n = value after reset
表 38. LOCK_CORR Field Descriptions
Bit
Field
Type
Reset
Description
7–0
LOCK_CORR
W
00h
A LOCK_CORR command is issued if the register content =
55h. The register content is automatically cleared.
7.5.37 LOCK_MASK Register (address = 6Ah) [reset = 00h]
图 59. LOCK_MASK Register, Address 6Ah
7
6
5
4
3
2
1
0
LOCK_MASK
W
LEGEND: R/W = Read/Write; R = Read only; W = Write only; -n = value after reset
表 39. LOCK_MASK Field Descriptions
Bit
Field
Type
Reset
Description
7–0
LOCK_MASK
W
00h
A LOCK_MASK command is issued if the register content =
AAh. The register content is automatically cleared.
7.5.38 LOCK_MISC Register (address = 6Bh) [reset = 00h]
图 60. LOCK_MISC Register, Address 6Bh
7
6
5
4
3
2
1
0
LOCK_MISC
W
LEGEND: R/W = Read/Write; R = Read only; W = Write only; -n = value after reset
表 40. LOCK_MISC Field Descriptions
Bit
Field
Type
Reset
Description
7–0
LOCK_MISC
W
00h
A LOCK_MISC command is issued if the register content = 5Ah.
The register content is automatically cleared.
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7.5.39 UNLOCK_MAP Register (address = 6Ch) [reset = 00h]
图 61. UNLOCK_MAP Register, Address 6Ch
7
6
5
4
3
2
1
0
UNLOCK_MAP
W
LEGEND: R/W = Read/Write; R = Read only; W = Write only; -n = value after reset
表 41. UNLOCK_MAP Field Descriptions
Bit
Field
Type
Reset
Description
7–0
UNLOCK_MAP
W
00h
An UNLOCK_MAP command is issued if the register content =
CCh. The register content is automatically cleared.
7.5.40 UNLOCK_CORR Register (address = 6Dh) [reset = 00h]
图 62. UNLOCK_CORR Register, Address 6Dh
7
6
5
4
3
2
1
0
UNLOCK_CORR
W
LEGEND: R/W = Read/Write; R = Read only; W = Write only; -n = value after reset
表 42. UNLOCK_CORR Field Descriptions
Bit
Field
Type
Reset
Description
7–0
UNLOCK_CORR
W
00h
An UNLOCK_CORR command is issued if the register content =
33h. The register content is automatically cleared.
7.5.41 UNLOCK_MASK Register (address = 6Eh) [reset = 00h]
图 63. UNLOCK_MASK Register, Address 6Eh
7
6
5
4
3
2
1
0
UNLOCK_MASK
W
LEGEND: R/W = Read/Write; R = Read only; W = Write only; -n = value after reset
表 43. UNLOCK_MASK Field Descriptions
Bit
Field
Type
Reset
Description
7–0
UNLOCK_MASK
W
00h
An UNLOCK_MASK command is issued if the register content =
3Ch. The register content is automatically cleared.
7.5.42 UNLOCK_MISC Register (address = 6Fh) [reset = 00h]
图 64. UNLOCK_MISC Register, Address 6Fh
7
6
5
4
3
2
1
0
UNLOCK_MISC
W
LEGEND: R/W = Read/Write; R = Read only; W = Write only; -n = value after reset
表 44. UNLOCK_MISC Field Descriptions
Bit
Field
Type
Reset
Description
7–0
UNLOCK_MISC
W
00h
An UNLOCK_MISC command is issued if the register content =
C3h. The register content is automatically cleared.
40
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ZHCSEM2A –AUGUST 2015–REVISED AUGUST 2015
7.5.43 READ_MAP0 Register (address = 80h) [reset = 00h]
Address 40h is used for writing the MAP0 data using the register pseudonym WRITE_MAP0, and address 80h is
used for reading the MAP0 data using the register pseudonym READ_MAP0. See the WRITE_MAP0 Register
(address = 40h) [reset = 00h] section for a description of the register contents.
图 65. READ_MAP0 Register, Address 80h
7
6
5
4
PWM_MAP_CH1[2:0]
R/W
3
2
1
PWM_MAP_CH0[2:0]
R/W
0
RESERVED
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
7.5.44 READ_MAP1 Register (address = 81h) [reset = 00h]
Address 41h is used for writing the MAP1 data using the register pseudonym WRITE_MAP1, and address 81h is
used for reading the MAP1 data using the register pseudonym READ_MAP1. See the WRITE_MAP1 Register
(address = 41h) [reset = 00h] section for a description of the register contents.
图 66. READ_MAP1 Register, Address 81h
7
6
5
4
PWM_MAP_CH3[2:0]
R/W
3
2
1
PWM_MAP_CH2[2:0]
R/W
0
RESERVED
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
7.5.45 READ_MAP2 Register (address = 82h) [reset = 00h]
Address 42h is used for writing the MAP2 data using the register pseudonym WRITE_MAP2, and address 82h is
used for reading the MAP2 data using the register pseudonym READ_MAP2. See the WRITE_MAP2 Register
(address = 42h) [reset = 00h] section for a description of the register contents.
图 67. READ_MAP2 Register, Address 82h
7
6
5
4
PWM_MAP_CH5[2:0]
R/W
3
2
1
PWM_MAP_CH4[2:0]
R/W
0
RESERVED
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
7.5.46 READ_MAP3 Register (address = 83h) [reset = 00h]
Address 43h is used for writing the MAP3 data using the register pseudonym WRITE_MAP3, and address 83h is
used for reading the MAP3 data using the register pseudonym READ_MAP3. See the WRITE_MAP3 Register
(address = 43h) [reset = 00h] section for a description of the register contents.
图 68. READ_MAP3 Register, Address 83h
7
6
5
4
PWM_MAP_CH7[2:0]
R/W
3
2
1
PWM_MAP_CH6[2:0]
R/W
0
RESERVED
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
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7.5.47 READ_MAP4 Register (address = 84h) [reset = 00h]
Address 44h is used for writing the MAP4 data using the register pseudonym WRITE_MAP4, and address 84h is
used for reading the MAP4 data using the register pseudonym READ_MAP4. See the WRITE_MAP4 Register
(address = 44h) [reset = 00h] section for a description of the register contents.
图 69. READ_MAP4 Register, Address 84h
7
6
5
4
PWM_MAP_CH9[2:0]
R/W
3
2
1
PWM_MAP_CH8[2:0]
R/W
0
RESERVED
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
7.5.48 READ_MAP5 Register (address = 85h) [reset = 00h]
Address 45h is used for writing the MAP5 data using the register pseudonym WRITE_MAP5, and address 85h is
used for reading the MAP5 data using the register pseudonym READ_MAP5. See the WRITE_MAP5 Register
(address = 45h) [reset = 00h] section for a description of the register contents.
图 70. READ_MAP5 Register, Address 85h
7
6
5
4
PWM_MAP_CH11[2:0]
R/W
3
2
1
PWM_MAP_CH10[2:0]
R/W
0
RESERVED
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
7.5.49 READ_CORR0 Register (address = 86h) [reset = 00h]
Address 46h is used for writing the CORR0 data using the register pseudonym WRITE_CORR0, and address
86h is used for reading the CORR0 data using the register pseudonym READ_CORR0. See the WRITE_CORR0
Register (address = 46h) [reset = 00h] section for a description of the register contents.
图 71. READ_CORR0 Register, Address 86h
7
6
5
4
3
2
1
0
OUTPUT_DC_CH0[7:0]
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
7.5.50 READ_CORR1 Register (address = 87h) [reset = 00h]
Address 47h is used for writing the CORR1 data using the register pseudonym WRITE_CORR1, and address
86h is used for reading the CORR1 data using the register pseudonym READ_CORR1. See the WRITE_CORR1
Register (address = 47h) [reset = 00h] section for a description of the register contents.
图 72. READ_CORR1 Register, Address 87h
7
6
5
4
3
2
1
0
OUTPUT_DC_CH1[7:0]
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
42
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ZHCSEM2A –AUGUST 2015–REVISED AUGUST 2015
7.5.51 READ_CORR2 Register (address = 88h) [reset = 00h]
Address 48h is used for writing the CORR2 data using the register pseudonym WRITE_CORR2, and address
88h is used for reading the CORR2 data using the register pseudonym READ_CORR2. See the WRITE_CORR2
Register (address = 48h) [reset = 00h] section for a description of the register contents.
图 73. READ_CORR2 Register, Address 88h
7
6
5
4
3
2
1
0
OUTPUT_DC_CH2[7:0]
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
7.5.52 READ_CORR3 Register (address = 89h) [reset = 00h]
Address 49h is used for writing the CORR3 data using the register pseudonym WRITE_CORR3, and address
89h is used for reading the CORR3 data using the register pseudonym READ_CORR3. See the WRITE_CORR3
Register (address = 49h) [reset = 00h] section for a description of the register contents.
图 74. READ_CORR3 Register, Address 89h
7
6
5
4
3
2
1
0
OUTPUT_DC_CH3[7:0]
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
7.5.53 READ_CORR4 Register (address = 8Ah) [reset = 00h]
Address 4Ah is used for writing the CORR4 data using the register pseudonym WRITE_CORR4, and address
8Ah is used for reading the CORR4 data using the register pseudonym READ_CORR4. See the WRITE_CORR4
Register (address = 4Ah) [reset = 00h] section for a description of the register contents.
图 75. READ_CORR4 Register, Address 8Ah
7
6
5
4
3
2
1
0
OUTPUT_DC_CH4[7:0]
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
7.5.54 READ_CORR5 Register (address = 8Bh) [reset = 00h]
Address 4Bh is used for writing the CORR5 data using the register pseudonym WRITE_CORR5, and address
8Bh is used for reading the CORR5 data using the register pseudonym READ_CORR5. See the WRITE_CORR5
Register (address = 4Bh) [reset = 00h] section for a description of the register contents.
图 76. READ_CORR5 Register, Address 8Bh
7
6
5
4
3
2
1
0
OUTPUT_DC_CH5[7:0]
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
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7.5.55 READ_CORR6 Register (address = 8Ch) [reset = 00h]
Address 4Ch is used for writing the CORR6 data using the register pseudonym WRITE_CORR6, and address
8Ch is used for reading the CORR6 data using the register pseudonym READ_CORR6. See the
WRITE_CORR6 Register (address = 4Ch) [reset = 00h] section for a description of the register contents.
图 77. READ_CORR6 Register, Address 8Ch
7
6
5
4
3
2
1
0
OUTPUT_DC_CH6[7:0]
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
7.5.56 READ_CORR7 Register (address = 8Dh) [reset = 00h]
Address 4Dh is used for writing the CORR7 data using the register pseudonym WRITE_CORR7, and address
8Dh is used for reading the CORR7 data using the register pseudonym READ_CORR7. See the
WRITE_CORR7 Register (address = 4Dh) [reset = 00h] section for a description of the register contents.
图 78. READ_CORR7 Register, Address 8Dh
7
6
5
4
3
2
1
0
OUTPUT_DC_CH7[7:0]
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
7.5.57 READ_CORR8 Register (address = 8Eh) [reset = 00h]
Address 4Eh is used for writing the CORR8 data using the register pseudonym WRITE_CORR8, and address
8Eh is used for reading the CORR8 data using the register pseudonym READ_CORR8. See the WRITE_CORR8
Register (address = 4Eh) [reset = 00h] section for a description of the register contents.
图 79. READ_CORR8 Register, Address 8Eh
7
6
5
4
3
2
1
0
OUTPUT_DC_CH8[7:0]
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
7.5.58 READ_CORR9 Register (address = 8Fh) [reset = 00h]
Address 4Fh is used for writing the CORR9 data using the register pseudonym WRITE_CORR9, and address
8Fh is used for reading the CORR9 data using the register pseudonym READ_CORR9. See the WRITE_CORR9
Register (address = 4Fh) [reset = 00h] section for a description of the register contents.
图 80. READ_CORR9 Register, Address 8Fh
7
6
5
4
3
2
1
0
OUTPUT_DC_CH9[7:0]
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
44
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ZHCSEM2A –AUGUST 2015–REVISED AUGUST 2015
7.5.59 READ_CORR10 Register (address = 90h) [reset = 00h]
Address 50h is used for writing the CORR10 data using the register pseudonym WRITE_CORR10, and address
90h is used for reading the CORR10 data using the register pseudonym READ_CORR10. See the
WRITE_CORR10 Register (address = 50h) [reset = 00h] section for a description of the register contents.
图 81. READ_CORR10 Register, Address 90h
7
6
5
4
3
2
1
0
OUTPUT_DC_CH10[7:0]
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
7.5.60 READ_CORR11 Register (address = 91h) [reset = 00h]
Address 51h is used for writing the CORR11 data using the register pseudonym WRITE_CORR11, and address
91h is used for reading the CORR11 data using the register pseudonym READ_CORR11. See the
WRITE_CORR11 Register (address = 51h) [reset = 00h] section for a description of the register contents.
图 82. READ_CORR11 Register, Address 91h
7
6
5
4
3
2
1
0
OUTPUT_DC_CH11[7:0]
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
7.5.61 READ_CH_ON_MASK0 Register (address = 92h) [reset = 3Fh]
Address 52h is used for writing the CH_ON_MASK0 data using the register pseudonym
WRITE_CH_ON_MASK0, and address 92h is used for reading the CH_ON_MASK0 data using the register
pseudonym READ_CH_ON_MASK0. See the WRITE_CH_ON_MASK0 Register (address = 52h) [reset = 3Fh]
section for a description of the register contents.
图 83. READ_CH_ON_MASK0, Address 92h
7
6
5
4
3
2
1
0
RESERVED
R
CH_ON_MASK CH_ON_MASK CH_ON_MASK CH_ON_MASK CH_ON_MASK CH_ON_MASK
5
4
3
2
1
0
R/W
R/W
R/W
R/W
R/W
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
7.5.62 READ_CH_ON_MASK1 Register (address = 93h) [reset = 3Fh]
Address 53h is used for writing the CH_ON_MASK1 data using the register pseudonym
WRITE_CH_ON_MASK1, and address 93h is used for reading the CH_ON_MASK1 data using the register
pseudonym READ_CH_ON_MASK1. See the WRITE_CH_ON_MASK1 Register (address = 53h) [reset = 3Fh]
section for a description of the register contents.
图 84. READ_CH_ON_MASK1, Address 93h
7
6
5
4
3
2
1
0
RESERVED
R
CH_ON_MASK CH_ON_MASK CH_ON_MASK CH_ON_MASK CH_ON_MASK CH_ON_MASK
11
10
9
8
7
6
R/W
R/W
R/W
R/W
R/W
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
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45
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ZHCSEM2A –AUGUST 2015–REVISED AUGUST 2015
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7.5.63 READ_SHORT_MASK0 Register (address = 94h) [reset = 3Fh]
Address 54h is used for writing the SHORT_MASK0 data using the register pseudonym
WRITE_SHORT_MASK0, and address 94h is used for reading the SHORT_MASK0 data using the register
pseudonym READ_SHORT_MASK0. See the WRITE_SHORT_MASK0 Register (address = 54h) [reset = 3Fh]
section for a description of the register contents.
图 85. READ_SHORT_MASK0, Address 94h
7
6
5
4
3
2
1
0
RESERVED
R
SHORT_MASK SHORT_MASK SHORT_MASK SHORT_MASK SHORT_MASK SHORT_MASK
_CH5
_CH4
_CH3
_CH2
_CH1
_CH0
R/W
R/W
R/W
R/W
R/W
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
7.5.64 READ_SHORT_MASK1 Register (address = 95h) [reset = 3Fh]
Address 55h is used for writing the SHORT_MASK1 data using the register pseudonym
WRITE_SHORT_MASK1, and address 95h is used for reading the SHORT_MASK1 data using the register
pseudonym READ_SHORT_MASK1. See the WRITE_SHORT_MASK1 Register (address = 55h) [reset = 3Fh]
section for a description of the register contents.
图 86. READ_SHORT_MASK1, Address 95h
7
6
5
4
3
2
1
0
RESERVED
R
SHORT_MASK SHORT_MASK SHORT_MASK SHORT_MASK SHORT_MASK SHORT_MASK
_CH11
_CH10
_CH9
_CH8
_CH7
_CH6
R/W
R/W
R/W
R/W
R/W
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
7.5.65 READ_SHORT_GND_MASK0 Register (address = 96h) [reset = 3Fh]
Address 56h is used for writing the SHORT_GND_MASK0 data using the register pseudonym
WRITE_SHORT_GND_MASK0, and address 96h is used for reading the SHORT_GND_MASK0 data using the
register pseudonym READ_SHORT_GND_MASK0. See the WRITE_SHORT_GND_MASK0 Register (address =
56h) [reset = 3Fh] section for a description of the register contents.
图 87. READ_SHORT_GND_MASK0, Address 96h
7
6
5
4
3
2
1
0
RESERVED
R
SG_MASK_CH SG_MASK_CH SG_MASK_CH SG_MASK_CH SG_MASK_CH SG_MASK_CH
5
4
3
2
1
0
R/W
R/W
R/W
R/W
R/W
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
7.5.66 READ_SHORT_GND_MASK1 Register (address = 97h) [reset = 3Fh]
Address 57h is used for writing the SHORT_GND_MASK1 data using the register pseudonym
WRITE_SHORT_GND_MASK1, and address 97h is used for reading the SHORT_GND_MASK1 data using the
register pseudonym READ_SHORT_GND_MASK1. See the WRITE_SHORT_GND_MASK1 Register (address =
57h) [reset = 3Fh] section for a description of the register contents.
图 88. READ_SHORT_GND_MASK1, Address 97h
7
6
5
4
3
2
1
0
RESERVED
R
SG_MASK_CH SG_MASK_CH SG_MASK_CH SG_MASK_CH SG_MASK_CH SG_MASK_CH
11
10
9
8
7
6
R/W
R/W
R/W
R/W
R/W
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
46
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ZHCSEM2A –AUGUST 2015–REVISED AUGUST 2015
7.5.67 READ_OPEN_MASK0 Register (address = 98h) [reset = 3Fh]
Address 58h is used for writing the OPEN_MASK0 data using the register pseudonym WRITE_OPEN_MASK0,
and address 98h is used for reading the OPEN_MASK0 data using the register pseudonym
READ_OPEN_MASK0. See the WRITE_OPEN_MASK0 Register (address = 58h) [reset = 3Fh] section for a
description of the register contents.
图 89. READ_OPEN_MASK0, Address 98h
7
6
5
4
3
2
1
0
RESERVED
R
OPEN_MASK_ OPEN_MASK_ OPEN_MASK_ OPEN_MASK_ OPEN_MASK_ OPEN_MASK_
CH5
CH4
CH3
CH2
CH1
CH0
R/W
R/W
R/W
R/W
R/W
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
7.5.68 READ_OPEN_MASK1 Register (address = 99h) [reset = 3Fh]
Address 59h is used for writing the OPEN_MASK1 data using the register pseudonym WRITE_OPEN_MASK1,
and address 99h is used for reading the OPEN_MASK1 data using the register pseudonym
READ_OPEN_MASK1. See the WRITE_OPEN_MASK1 Register (address = 59h) [reset = 3Fh] section for a
description of the register contents.
图 90. READ_OPEN_MASK1, Address 99h
7
6
5
4
3
2
1
0
RESERVED
R
OPEN_MASK_ OPEN_MASK_ OPEN_MASK_ OPEN_MASK_ OPEN_MASK_ OPEN_MASK_
CH11
CH10
CH9
CH8
CH7
CH6
R/W
R/W
R/W
R/W
R/W
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
7.5.69 READ_SHORT_FAULT0 (address = 9Ah) [reset = 00h]
图 91. READ_SHORT_FAULT0, Address 9Ah
7
6
5
4
3
2
1
0
RESERVED
R
SHORT_
FAULT5
SHORT_
FAULT4
SHORT_
FAULT3
SHORT_
FAULT2
SHORT_
FAULT1
SHORT_
FAULT0
R
R
R
R
R
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
表 45. READ_SHORT_FAULT0 Register Field Descriptions
Bit
7–6
5
Field
Type
R
Reset
0h
Description
RESERVED
SHORT_FAULT5
R
0h
Channel 5 LED short-to-supply fault flag. Active-high. HIGH:
LED short-to-supply detected; LOW: LED short-to-supply not
detected.
4
3
2
1
0
SHORT_FAULT4
SHORT_FAULT3
SHORT_FAULT2
SHORT_FAULT1
SHORT_FAULT0
R
R
R
R
R
0h
0h
0h
0h
0h
Channel 4 LED short-to-supply fault flag. Active-high. HIGH:
LED short-to-supply detected; LOW: LED short-to-supply not
detected.
Channel 3 LED short-to-supply fault flag. Active-high. HIGH:
LED short-to-supply detected; LOW: LED short-to-supply not
detected.
Channel 2 LED short-to-supply fault flag. Active-high. HIGH:
LED short-to-supply detected; LOW: LED short-to-supply not
detected.
Channel 1 LED short-to-supply fault flag. Active-high. HIGH:
LED short-to-supply detected; LOW: LED short-to-supply not
detected.
Channel 0 LED short-to-supply fault flag. Active-high. HIGH:
LED short-to-supply detected; LOW: LED short-to-supply not
detected.
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7.5.70 READ_SHORT_FAULT1 (address = 9Bh) [reset = 00h]
图 92. READ_SHORT_FAULT1, Address 9Bh
7
6
5
4
3
2
1
0
RESERVED
R
SHORT_
FAULT11
SHORT_
FAULT10
SHORT_
FAULT9
SHORT_
FAULT8
SHORT_
FAULT7
SHORT_
FAULT6
R
R
R
R
R
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
表 46. READ_SHORT_FAULT1 Register Field Descriptions
Bit
7–6
5
Field
Type
R
Reset
0h
Description
RESERVED
SHORT_FAULT11
R
0h
Channel 11 LED short-to-supply fault flag. Active-high. HIGH:
LED short-to-supply detected; LOW: LED short-to-supply not
detected.
4
3
2
1
0
SHORT_FAULT10
SHORT_FAULT9
SHORT_FAULT8
SHORT_FAULT7
SHORT_FAULT6
R
R
R
R
R
0h
0h
0h
0h
0h
Channel 10 LED short-to-supply fault flag. Active-high. HIGH:
LED short-to-supply detected; LOW: LED short-to-supply not
detected.
Channel 9 LED short-to-supply fault flag. Active-high. HIGH:
LED short-to-supply detected; LOW: LED short-to-supply not
detected.
Channel 8 LED short-to-supply fault flag. Active-high. HIGH:
LED short-to-supply detected; LOW: LED short-to-supply not
detected.
Channel 7 LED short-to-supply fault flag. Active-high. HIGH:
LED short-to-supply detected; LOW: LED short-to-supply not
detected.
Channel 6 LED short-to-supply fault flag. Active-high. HIGH:
LED short-to-supply detected; LOW: LED short-to-supply not
detected.
7.5.71 READ_SHORT_GND_FAULT0 (address = 9Ch) [reset = 00h]
图 93. READ_SHORT_GND_FAULT0, Address 9Ch
7
6
5
SG_FAULT5
R
4
SG_FAULT4
R
3
SG_FAULT3
R
2
SG_FAULT2
R
1
SG_FAULT1
R
0
SG_FAULT0
R
RESERVED
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
表 47. READ_SHORT_GND_FAULT0 Register Field Descriptions
Bit
7–6
5
Field
Type
R
Reset
0h
Description
RESERVED
SG_FAULT5
R
0h
Channel 5 LED short-to-GND fault flag. Active-high. HIGH: LED
short-to-GND detected; LOW: LED short-to-GND not detected.
4
3
2
1
0
SG_FAULT4
SG_FAULT3
SG_FAULT2
SG_FAULT1
SG_FAULT0
R
R
R
R
R
0h
0h
0h
0h
0h
Channel 4 LED short-to-GND fault flag. Active-high. HIGH: LED
short-to-GND detected; LOW: LED short-to-GND not detected.
Channel 3 LED short-to-GND fault flag. Active-high. HIGH: LED
short-to-GND detected; LOW: LED short-to-GND not detected.
Channel 2 LED short-to-GND fault flag. Active-high. HIGH: LED
short-to-GND detected; LOW: LED short-to-GND not detected.
Channel 1 LED short-to-GND fault flag. Active-high. HIGH: LED
short-to-GND detected; LOW: LED short-to-GND not detected.
Channel 0 LED short-to-GND fault flag. Active-high. HIGH: LED
short-to-GND detected; LOW: LED short-to-GND not detected.
48
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TLC6C5712-Q1
www.ti.com.cn
ZHCSEM2A –AUGUST 2015–REVISED AUGUST 2015
7.5.72 READ_SHORT_GND_FAULT1 (address = 9Dh) [reset = 00h]
图 94. READ_SHORT_GND_FAULT1, Address 9Dh
7
6
5
4
3
SG_FAULT9
R
2
SG_FAULT8
R
1
SG_FAULT7
R
0
SG_FAULT6
R
RESERVED
R
SG_FAULT11
R
SG_FAULT10
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
表 48. READ_SHORT_GND_FAULT1 Register Field Descriptions
Bit
7–6
5
Field
Type
R
Reset
0h
Description
RESERVED
SG_FAULT11
R
0h
Channel 11 LED short-to-GND fault flag. Active-high. HIGH: LED
short-to-GND detected; LOW: LED short-to-GND not detected.
4
3
2
1
0
SG_FAULT10
SG_FAULT9
SG_FAULT8
SG_FAULT7
SG_FAULT6
R
R
R
R
R
0h
0h
0h
0h
0h
Channel 10 LED short-to-GND fault flag. Active-high. HIGH: LED
short-to-GND detected; LOW: LED short-to-GND not detected.
Channel 9 LED short-to-GND fault flag. Active-high. HIGH: LED
short-to-GND detected; LOW: LED short-to-GND not detected.
Channel 8 LED short-to-GND fault flag. Active-high. HIGH: LED
short-to-GND detected; LOW: LED short-to-GND not detected.
Channel 7 LED short-to-GND fault flag. Active-high. HIGH: LED
short-to-GND detected; LOW: LED short-to-GND not detected.
Channel 6 LED short-to-GND fault flag. Active-high. HIGH: LED
short-to-GND detected; LOW: LED short-to-GND not detected.
7.5.73 READ_OPEN_FAULT0 (address = 9Eh) [reset = 00h]
图 95. READ_OPEN_FAULT0, Address 9Eh
7
6
5
4
3
2
1
0
RESERVED
R
OPEN_FAULT_ OPEN_FAULT_ OPEN_FAULT_ OPEN_FAULT_ OPEN_FAULT_ OPEN_FAULT_
CH5
CH4
CH3
CH2
CH1
CH0
R
R
R
R
R
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
表 49. READ_OPEN_FAULT0 Register Field Descriptions
Bit
7–6
5
Field
Type
R
Reset
0h
Description
RESERVED
OPEN_FAULT_CH5
R
0h
Channel 5 LED-open fault flag. Active-high. HIGH: LED open
detected; LOW: LED open not detected.
4
3
2
1
0
OPEN_FAULT_CH4
OPEN_FAULT_CH3
OPEN_FAULT_CH2
OPEN_FAULT_CH1
OPEN_FAULT_CH0
R
R
R
R
R
0h
0h
0h
0h
0h
Channel 4 LEDopen fault flag. Active-high. HIGH: LED open
detected; LOW: LED open not detected.
Channel 3 LED-open fault flag. Active-high. HIGH: LED open
detected; LOW: LED open not detected.
Channel 2 LED-open fault flag. Active-high. HIGH: LED open
detected; LOW: LED open not detected.
Channel 1 LED-open fault flag. Active-high. HIGH: LED open
detected; LOW: LED open not detected.
Channel 0 LED-open fault flag. Active-high. HIGH: LED open
detected; LOW: LED open not detected.
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7.5.74 READ_OPEN_FAULT1 (address = 9Fh) [reset = 00h]
图 96. READ_OPEN_FAULT1, Address 9Fh
7
6
5
4
3
2
1
0
RESERVED
R
OPEN_FAULT_ OPEN_FAULT_ OPEN_FAULT_ OPEN_FAULT_ OPEN_FAULT_ OPEN_FAULT_
CH11
CH10
CH9
CH8
CH7
CH6
R
R
R
R
R
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
表 50. READ_OPEN_FAULT1 Register Field Descriptions
Bit
7–6
5
Field
Type
R
Reset
0h
Description
RESERVED
OPEN_FAULT_CH11
R
0h
Channel 11 LED open fault flag. Active-high. HIGH: LED open
detected; LOW: LED open not detected.
4
3
2
1
0
OPEN_FAULT_CH10
OPEN_FAULT_CH9
OPEN_FAULT_CH8
OPEN_FAULT_CH7
OPEN_FAULT_CH6
R
R
R
R
R
0h
0h
0h
0h
0h
Channel 10 LED open fault flag. Active-high. HIGH: LED open
detected; LOW: LED open not detected.
Channel 9 LED open fault flag. Active-high. HIGH: LED open
detected; LOW: LED open not detected.
Channel 8 LED open fault flag. Active-high. HIGH: LED open
detected; LOW: LED open not detected.
Channel 7 LED open fault flag. Active-high. HIGH: LED open
detected; LOW: LED open not detected.
Channel 6 LED open fault flag. Active-high. HIGH: LED open
detected; LOW: LED open not detected.
7.5.75 READ_PWM_FAULT_MASK Register (address = A1h) [reset = 3Fh]
Address 60h is used for writing the PWM_FAULT_MASK data using the register pseudonym
WRITE_PWM_FAULT_MASK, and address A0h is used for reading the PWM_FAULT_MASK data using the
register pseudonym READ_PWM_FAULT_MASK. See the WRITE_PWM_FAULT_MASK Register (address =
60h) [reset = 3Fh] section for a description of the register contents.
图 97. READ_PWM_FAULT_MASK, Address A1h
7
6
5
4
3
2
1
0
RESERVED
R
PWM_FAULT_ PWM_FAULT_ PWM_FAULT_ PWM_FAULT_ PWM_FAULT_ SG_MASK_CH
MASK5
MASK4
MASK3
MASK2
MASK1
0
R/W
R/W
R/W
R/W
R/W
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
50
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www.ti.com.cn
ZHCSEM2A –AUGUST 2015–REVISED AUGUST 2015
7.5.76 READ_STATUS0 (address = A2h) [reset = 40h]
图 98. READ_STATUS0, Address A2h
7
6
5
4
3
2
1
0
REF_FAULT_
FLAG
POR_ERR_
FLAG
ANY_OPEN_
FLAG
ANY_SHORT_
FLAG
ANY_PWM_
FAULT_FLAG
WLS_FAULT_
FLAG
PRE_TSD_
FLAG
TSD_FLAG
R
R
R
R
R
R
R
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
表 51. READ_STATUS0 Register Field Descriptions
Bit
Field
Type
Reset
Description
7
REF_FAULT_FLAG
R
0h
Reference-resistor fault flag. Active-high. HIGH: Reference fault
detected; LOW: Reference fault not detected.
6
5
POR_ERR_FLAG
ANY_OPEN_FLAG
R
R
1h
0h
Power-on-reset error flag. Active-high. HIGH: POR error
detected; LOW: POR error not detected.
Any-channel-open fault flag. Active-high. HIGH: One or more
channels has an open fault; LOW: an open fault is not detected
or an open fault is masked.
4
3
2
1
0
ANY_SHORT_FLAG
ANY_PWM_FAULT_FLAG
WLS_FAULT_FLAG
PRE_TSD_FLAG
R
R
R
R
R
0h
0h
0h
0h
0h
Any channel short-to-supply fault flag. Active-high. HIGH: One or
more channels has a short-to-supply fault; LOW: a short-to-
supply fault is not detected or a short-to-supply fault is masked.
Any-input PWM-fault flag. Active-high. HIGH: One or more PWM
channels has a fault; LOW: a PWM fault is not detected or a
PWM fault is masked.
Weak-LED-supply fault flag. Active-high. HIGH: WLS fault
detected; LOW: a WLS fault is not detected or a WLS fault is
masked.
PRE-TSD warning flag. Active-high. HIGH: a PRE TSD warning
is detected; LOW: a PRE-TSD warning is not detected or a
PRE_TSD warning is masked.
TSD_FLAG
Thermal shutdown flag. Active-high. HIGH: a thermal shutdown
has been triggered; LOW: a thermal shutdown is not triggered or
it is masked.
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7.5.77 READ_STATUS1 (address = A3h) [reset = 00h]
See the PWM MAP Register Lock section for a list of miscellaneous (MISC), mapping (MAP), masking (MASK),
and correction (CORR) registers.
图 99. READ_STATUS1, Address A3h
7
6
5
4
3
2
1
0
RESERVED
DIS_PULL_
UP_FLAG
LOCK_MISC_
FLAG
LOCK_MAP_
FLAG
LOCK_MASK_ LOCK_CORR_
FLAG
FLAG
R
R
R
R
R
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
表 52. READ_STATUS1 Register Field Descriptions
Bit
7–5
4
Field
Type
R
Reset
0h
Description
RESERVED
DIS_PULL_UP_FLAG
R
0h
Off-state pullup disabled flag. Active-high. HIGH: One or more
channels have off-state pullup disabled. LOW: No channel has
off-state pullup disabled.
3
2
1
0
LOCK_MISC_FLAG
LOCK_MAP_FLAG
LOCK_MASK_FLAG
LOCK_CORR_FLAG
R
R
R
R
0h
0h
0h
0h
LOCK_MISC status flag. Active-high. HIGH: MISC registers are
locked. LOW: MISC registers are not locked.
LOCK_MAP status flag. Active-high. HIGH: MAP registers are
locked. LOW: MAP registers are not locked.
LOCK_MASK status flag. Active-high. HIGH: MASK registers
are locked. LOW: MASK registers are not locked.
LOCK_CORR status flag. Active-high. HIGH: CORR registers
are locked. LOW: CORR registers are not locked.
7.5.78 READ_DIS_PULL_UP_0 Register (address = A4h) [reset = 00h]
Address 64h is used for writing the DIS_PULL_UP_0 data using the register pseudonym
WRITE_DIS_PULL_UP_0, and address A4h is used for reading the DIS_PULL_UP_0 data using the register
pseudonym READ_DIS_PULL_UP_0. See the WRITE_DIS_PULL_UP_0 Register (address = 64h) [reset = 00h]
section for a description of the register contents.
图 100. READ_DIS_PULL_UP_0 Register, Address A4h
7
6
5
4
3
2
1
0
RESERVED
R
DIS_PULL_
UP_CH5
DIS_PULL_
UP_CH4
DIS_PULL_
UP_CH3
DIS_PULL_
UP_CH2
DIS_PULL_
UP_CH1
DIS_PULL_
UP_CH0
R/W
R/W
R/W
R/W
R/W
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
7.5.79 READ_DIS_PULL_UP_1 Register (address = A5h) [reset = 00h]
Address 65h is used for writing the DIS_PULL_UP_1 data using the register pseudonym
WRITE_DIS_PULL_UP_1, and address A5h is used for reading the DIS_PULL_UP_1 data using the register
pseudonym READ_DIS_PULL_UP_1. See the WRITE_DIS_PULL_UP_1 Register (address = 65h) [reset = 00h]
section for a description of the register contents.
图 101. READ_DIS_PULL_UP_1 Register, Address A5h
7
6
5
4
3
2
1
0
RESERVED
R
DIS_PULL_
UP_CH11
DIS_PULL_
UP_CH10
DIS_PULL_
UP_CH9
DIS_PULL_
UP_CH8
DIS_PULL_
UP_CH7
DIS_PULL_
UP_CH6
R/W
R/W
R/W
R/W
R/W
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
52
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7.5.80 READ_ERROR_MASK (address = A6h) [reset = 00h]
Address 66h is used for writing the ERROR_MASK data using the register pseudonym WRITE_ERROR_MASK,
and address A6h is used for reading the ERROR_MASK data using the register pseudonym
READ_ERROR_MASK. See the WRITE_ERROR_MASK Register (address = 66h) [reset = 00h] section for a
description of the register contents.
图 102. READ_ERROR_MASK, Address A6h
7
6
5
4
3
2
1
0
REF_MASK
POR_MASK
OPEN_MASK SHORT_MASK
PWM_MASK
WLS_MASK
PRE_TSD_
MASK
TSD_MASK
R/W
R/W
R/W R/W
R/W
R/W
R/W
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
7.5.81 READ_MISC_CMD Register (address = A7h) [reset = 00h]
Address 67h is used for writing the MISC_CMD data using the register pseudonym WRITE_MISC_CMD, and
address A7h is used for reading the MISC_CMD data using the register pseudonym READ_MISC_CMD. See the
WRITE_MISC_CMD Register (address = 67h) [reset = 00h] section for a description of the register contents.
图 103. READ_MISC_CMD Register, Address A7h
7
6
5
4
3
2
1
0
RESERVED
R
RESERVED
DIS_OFF_
FAULT_DIAG
ADJ_DIAG_
START
SLOW_SLEW_ FORCE_ERR
RATE
WLS_TH
R
R/W
R/W
R/W
R/W
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
版权 © 2015, Texas Instruments Incorporated
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7.5.82 READ_ADSHORT0 (address = A8h) [reset = 00h]
图 104. READ_ADSHORT0, Address A8h
7
6
5
4
3
2
1
0
RESERVED
R
AD_FLAG_
CH11
AD_FLAG_
CH10
AD_FLAG_CH9 AD_FLAG_CH8 AD_FLAG_CH7 AD_FLAG_CH6
R
R
R
R
R
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
表 53. READ_ADSHORT0 Register Field Descriptions
Bit
7–6
5
Field
Type
R
Reset
0h
Description
RESERVED
AD_FLAG_CH11
R
0h
Adjacent-pin short fault flag for channel 11. Active-high. HIGH:
Adjacent-pin short detected; LOW: adjacent-pin short not detected.
4
3
2
1
0
AD_FLAG_CH10
AD_FLAG_CH9
AD_FLAG_CH8
AD_FLAG_CH7
AD_FLAG_CH6
R
R
R
R
R
0h
0h
0h
0h
0h
Adjacent-pin short fault flag for channel 10. Active-high. HIGH:
Adjacent-pin short detected; LOW: adjacent-pin short not detected.
Adjacent-pin short fault flag for channel 9. Active-high. HIGH:
Adjacent-pin short detected; LOW: adjacent-pin short not detected.
Adjacent-pin short fault flag for channel 8. Active-high. HIGH:
Adjacent-pin short detected; LOW: adjacent-pin short not detected.
Adjacent-pin short fault flag for channel 7. Active-high. HIGH:
Adjacent-pin short detected; LOW: adjacent-pin short not detected.
Adjacent-pin short fault flag for channel 6. Active-high. HIGH:
Adjacent-pin short detected; LOW: adjacent-pin short not detected.
7.5.83 READ_ADSHORT1 (address = A9h) [reset = 00h]
图 105. READ_ADSHORT1, Address A9h
7
6
5
4
3
2
1
0
RESERVED
R
AD_FLAG_CH5 AD_FLAG_CH4 AD_FLAG_CH3 AD_FLAG_CH2 AD_FLAG_CH1 AD_FLAG_CH0
R
R
R
R
R
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
表 54. READ_ADSHORT1 Register Field Descriptions
Bit
7–6
5
Field
Type
R
Reset
0h
Description
RESERVED
AD_FLAG_CH5
R
0h
Adjacent-pin short fault flag for channel 5. Active-high. HIGH:
Adjacent-pin short detected; LOW: adjacent-pin short not detected.
4
3
2
1
0
AD_FLAG_CH4
AD_FLAG_CH3
AD_FLAG_CH2
AD_FLAG_CH1
AD_FLAG_CH0
R
R
R
R
R
0h
0h
0h
0h
0h
Adjacent-pin short fault flag for channel 4. Active-high. HIGH:
Adjacent-pin short detected; LOW: adjacent-pin short not detected.
Adjacent-pin short fault flag for channel 3. Active-high. HIGH:
Adjacent-pin short detected; LOW: adjacent-pin short not detected.
Adjacent-pin short fault flag for channel 2. Active-high. HIGH:
Adjacent-pin short detected; LOW: adjacent-pin short not detected.
Adjacent-pin short fault flag for channel 1. Active-high. HIGH:
Adjacent-pin short detected; LOW: adjacent-pin short not detected.
Adjacent-pin short fault flag for channel 0. Active-high. HIGH:
Adjacent-pin short detected; LOW: adjacent-pin short not detected.
54
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8 Application and Implementation
注
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The TLC6C5712-Q1 device is capable of driving different numbers of LEDs with accurate current driving and the
most-advanced diagnostics. The device is suitable for automotive cluster tell-tale lighting, gear-shifter PRNDL
indicators, and other safety-critical LED applications.
8.2 Typical Applications
8.2.1 Multiple Devices Connected in Cascade
The TLC6C5712-Q1 design supports multiple devices in cascaded daisy-chain mode. Each communication
sequence must only have one LATCH rising edge and, therefore, cannot be split into multiple smaller sequences.
VSUPPLY
OUT0
OUT11
SENSE
OUT0
OUT11
VCC
VCC
VCC
VCC
VCC
TLC6C5712-Q1
TLC6C5712-Q1
GND
GND
PGND
PGND
MOSI
SDI
SDO
SDI
SDO
ERR
SCK
ERR
ERR
SCK
SCK
LATCH
PWM0
PWM1
PWM2
PWM3
PWM4
PWM5
MISO
LATCH
PWM0
PWM1
PWM2
PWM3
PWM4
PWM5
LATCH
PWM0
PWM1
PWM2
PWM3
PWM4
PWM5
Controller
IREF
RIREF
RIREF
图 106. Application Schematic for TLC6C5712-Q1 Devices Connected in Cascade
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Typical Applications (接下页)
8.2.1.1 Design Requirements
For this design example, use the parameters listed in 表 55.
表 55. Design Parameters
DESIGN PARAMETER
EXAMPLE VALUE
20 mA
(1)
I(LED_FULLRANGE)
(2)
I(LED)
16 mA
(1) I(LED_FULLRANGE) is the maximum LED current allowed.
(2) I(LED) is the required output driving current for this application.
8.2.1.2 Detailed Design Procedure
This design has multiple TLC6C5712-Q1 devices connected by a SPI daisy chain. Use 公式 5 to calculate the
reference resistor value.
V
1.229 V
0.02 A
(IREF)
R(IREF)
=
´K(OUT)
=
´ 500 = 30.725 kW
I(LED _FULLRANGE)
(5)
(6)
Use 公式 6 to calculate the dot correction for each channel.
16
Dot correction =
´ 256 -1= 204, (0xCC)
20
8.2.1.3 Application Curves
图 107. PWM Delay and Output Rise Time
图 108. PWM Delay and Output Fall Time
CH3: PWM0, CH4: OUT0
CH3: PWM0, CH4: OUT0
8.2.2 Parallel Channels for Driving Higher Current
In some applications, capability to drive higher current is needed. To deliver higher current while maintaining
adjacent-short detection capability, channels with odd numbers can be shorted together; similarly, channels with
even numbers can be shorted together. If odd and even numbers are shorted together, the device reports a false
error during adjacent-pin short detection.
56
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VSUPPLY
OUT9 OUT11
OUT9 OUT11
OUT0 OUT2 OUT1 OUT3
VCC
OUT0 OUT2 OUT1OUT3
VCC
VCC
VCC
VCC
SENSE
TLC6C5712-Q1
TLC6C5712-Q1
GND
GND
PGND
PGND
MOSI
SDI
SDO
SDI
SDO
ERR
SCK
ERR
ERR
SCK
SCK
LATCH
PWM0
PWM1
PWM2
PWM3
PWM4
PWM5
MISO
LATCH
PWM0
PWM1
PWM2
PWM3
PWM4
PWM5
LATCH
PWM0
PWM1
PWM2
PWM3
PWM4
PWM5
Controller
IREF
RIREF
RIREF
图 109. Application Schematic for TLC6C5712-Q1 Devices With Parallel Outputs
8.2.2.1 Design Requirements
For this design example, use the parameters listed in 表 56.
表 56. Design Parameters
DESIGN PARAMETER
EXAMPLE VALUE
(1)
I(LED_FULLRANGE)
20 mA
16 mA
2
(2)
I(LED)
Channels in parallel
(1) I(LED_FULLRANGE) is the maximum LED current allowed.
(2) I(LED) is the required output driving current for this application.
8.2.2.2 Detailed Design Procedure
This design has multiple TLC6C5712-Q1 devices connected by a SPI daisy chain. Use 公式 7 to calculate the
reference resistor value.
V
1.229 V
(IREF)
R(IREF)
=
´ K(OUT)
=
´ 500 = 878 W
I(LED _FULLRANGE)
0.14A / 2
No. of parallel channels
(7)
(8)
Use 公式 8 to calculate the dot correction for each channel.
140
Dot correction =
´ 256 -1= 255, (0xFF)
140
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9 Power Supply Recommendations
The TLC6C5712-Q1 device is qualified for automotive applications. Because of voltage-level limitations, the
device requires a first-stage power supply to provide LED and device power. VCC and V(SENSE) voltages can be
provided by the same voltage supply or independent voltage supplies. The supply voltage range is specified in
Recommended Operating Conditions.
10 Layout
10.1 Layout Guidelines
To prevent thermal shutdown, the junction temperature, TJ, must be less than 150°C. If the voltage drop across
the output channels is high, the device power dissipation can be large. The TLC6C5712-Q1 device has very
good thermal performance because of the thermal pad design; however, the PCB layout is also very important to
ensure that the device has good thermal performance. Good PCB design can optimize heat transfer, which is
essential for the long-term reliability of the device.
Use the following guidelines when designing the device layout:
•
Maximize the copper coverage on the PCB to increase the thermal conductivity of the board. The major heat-
flow path from the package to the ambient is through copper on the PCB. Maximum copper density is
extremely important when no heat sinks are attached to the PCB on the other side of the package.
•
•
Add as many thermal vias as possible directly under the package ground pad to optimize the thermal
conductivity of the board.
Use either plated shut or plugged and capped vias for all the thermal vias on both sides of the board to
prevent solder voids. To ensure reliability and performance, the solder coverage should be at least 85%.
58
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ZHCSEM2A –AUGUST 2015–REVISED AUGUST 2015
10.2 Layout Example
Power ground
on top and
bottom layers
TLC6C5712-Q1
1
2
3
4
SCK
28
27
GND
VCC
SDI
LATCH
SDO
IREF
PGND
26
25
24
5
ERR
SENSE
OUT11
OUT0
6
7
8
23
22
OUT1
OUT2
OUT10
OUT9
OUT8
21
20
OUT3
OUT4
9
10
OUT7
OUT6
PWM5
19
18
OUT5
PWM0
PWM1
11
12
13
14
17
16
15
PWM4
PWM3
PWM2
图 110. TLC6C7512-Q1 Layout Diagram
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11 器件和文档支持
11.1 文档支持
11.1.1 相关文档ꢀ
相关文档如下:
《TLC6C5712-Q1 评估模块》,SLVUAE6
11.2 社区资源
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.3 商标
PowerPAD, E2E are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
11.4 静电放电警告
这些装置包含有限的内置 ESD 保护。 存储或装卸时,应将导线一起截短或将装置放置于导电泡棉中,以防止 MOS 门极遭受静电损
伤。
11.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 机械、封装和可订购信息
以下页中包括机械、封装和可订购信息。这些信息是针对指定器件可提供的最新数据。这些数据会在无通知且不对
本文档进行修订的情况下发生改变。欲获得该数据表的浏览器版本,请查阅左侧的导航栏。
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PACKAGE OPTION ADDENDUM
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10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TLC6C5712QPWPRQ1
ACTIVE
HTSSOP
PWP
28
2000 RoHS & Green
NIPDAU
Level-3-260C-168 HR
-40 to 125
6C5712
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
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Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Feb-2019
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TLC6C5712QPWPRQ1 HTSSOP PWP
28
2000
330.0
16.4
6.9
10.2
1.8
12.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Feb-2019
*All dimensions are nominal
Device
Package Type Package Drawing Pins
HTSSOP PWP 28
SPQ
Length (mm) Width (mm) Height (mm)
350.0 350.0 43.0
TLC6C5712QPWPRQ1
2000
Pack Materials-Page 2
GENERIC PACKAGE VIEW
PWP 28
4.4 x 9.7, 0.65 mm pitch
PowerPADTM TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4224765/B
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PACKAGE OUTLINE
PWP0028C
PowerPADTM TSSOP - 1.2 mm max height
S
C
A
L
E
2
.
0
0
0
SMALL OUTLINE PACKAGE
C
6.6
6.2
TYP
A
0.1 C
PIN 1 INDEX
AREA
SEATING
PLANE
26X 0.65
28
1
2X
9.8
9.6
8.45
NOTE 3
14
15
0.30
0.19
28X
4.5
4.3
B
0.1
C A B
SEE DETAIL A
(0.15) TYP
2X 0.95 MAX
NOTE 5
14
15
2X 0.2 MAX
NOTE 5
0.25
GAGE PLANE
1.2 MAX
5.18
4.48
THERMAL
PAD
0.15
0.05
0.75
0.50
0 -8
A
20
DETAIL A
TYPICAL
1
28
3.1
2.4
4223582/A 03/2017
PowerPAD is a trademark of Texas Instruments.
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. Reference JEDEC registration MO-153.
5. Features may differ or may not be present.
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EXAMPLE BOARD LAYOUT
PWP0028C
PowerPADTM TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
(3.4)
NOTE 9
(3.1)
METAL COVERED
BY SOLDER MASK
SYMM
28X (1.5)
1
28X (0.45)
28
SEE DETAILS
(R0.05) TYP
(5.18)
(0.6)
26X (0.65)
SYMM
(9.7)
NOTE 9
SOLDER MASK
DEFINED PAD
(1.2) TYP
(
0.2) TYP
VIA
14
15
(1.2) TYP
(5.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 8X
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
METAL
EXPOSED METAL
EXPOSED METAL
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
NON-SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
15.000
(PREFERRED)
SOLDER MASK DETAILS
4223582/A 03/2017
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
8. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
numbers SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004).
9. Size of metal pad may vary due to creepage requirement.
10. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled, plugged
or tented.
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EXAMPLE STENCIL DESIGN
PWP0028C
PowerPADTM TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
(3.1)
BASED ON
0.125 THICK
STENCIL
28X (1.5)
METAL COVERED
BY SOLDER MASK
1
28X (0.45)
28
(R0.05) TYP
26X (0.65)
SYMM
(5.18)
BASED ON
0.125 THICK
STENCIL
15
14
SYMM
(5.8)
SEE TABLE FOR
DIFFERENT OPENINGS
FOR OTHER STENCIL
THICKNESSES
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE: 8X
STENCIL
THICKNESS
SOLDER STENCIL
OPENING
0.1
3.47 X 5.79
3.10 X 5.18 (SHOWN)
2.83 X 4.73
0.125
0.15
0.175
2.62 X 4.38
4223582/A 03/2017
NOTES: (continued)
11. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
12. Board assembly site may have different recommendations for stencil design.
www.ti.com
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